Substrate processing apparatus, control method and control device therefor

Abstract

The present disclosure relates to a substrate processing device, a control method and a control device thereof. The substrate processing device comprises a supporting table, a light reflection assembly and a light detection assembly. The light reflection assembly is connected to the supporting table and located at the edge of a placement area. The light detection assembly is located above the supporting table, and the light emission part of the light detection assembly faces the edge of the placement area. The light detection assembly is also used to sense the reflected light of the light reflection assembly. When the substrate is in an abnormal working condition, the light reflection assembly is exposed outwardly. After the detection light of the light detection assembly is incident to the light reflection assembly, the reflected light of the light reflection assembly can be sensed. In this way, the substrate can be detected in time for the abnormal phenomena such as deviation, warping and cracking, and the reaction chamber of the machine can be stopped immediately to prevent the loss from further expanding. In addition, only one light detection assembly is needed, which can avoid the excessive number of light detection assemblies affecting the performance of the machine, and can also reduce the cost of the device.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor equipment technology, and in particular to substrate processing apparatus and its control method and control device. Background Technology

[0002] With the development of semiconductor technology, the yield requirements for semiconductor products are becoming increasingly higher, and therefore the process requirements for their manufacturing are becoming increasingly stringent.

[0003] In traditional technology, substrates typically need to be ground to the required thickness using a grinding process, and the freshly ground substrates need to be transferred to a designated location. If the substrate breaks at this time and is not detected in time, it may damage the machine and make the cleaning of the broken pieces very difficult, which can seriously affect the efficiency of the entire production process.

[0004] The compact internal structure of the collection tray (CUP) in the cleaning process equipment, coupled with the vertical movement of the substrate placement platform, prevents the installation of sensors within the CUP space and limits the addition of any extra components. Furthermore, to reduce equipment cost, the number of sensors installed in the equipment is kept to a minimum. Currently, to detect whether a substrate placed on the platform is cracked, a photodetector is typically placed at the center of the substrate's placement position on the platform. This photodetector detects the center of the substrate to determine if the substrate was correctly processed. While this method can detect substrate defects such as fragmentation to some extent, instances of damage due to fragmentation have still been observed in the equipment. Summary of the Invention

[0005] Therefore, it is necessary to overcome the shortcomings of the existing technology and provide a substrate processing apparatus and its control method and control device that can detect defects such as substrate misalignment, warping, and cracking in a timely manner, and can stop the reaction chamber of the machine in an emergency to prevent further damage.

[0006] The technical solution is as follows: A substrate processing apparatus, the substrate processing apparatus comprising:

[0007] A support platform, wherein the support platform is provided with a support surface, and the support surface is provided with a placement area corresponding to the position of the substrate;

[0008] A reflective assembly, connected to the support platform and located at the edge of the placement area; and

[0009] A light detection component is located above the support platform, with its light-emitting portion facing the edge of the placement area. The light detection component is also used to sense the reflected light from the reflective component.

[0010] In one embodiment, the light emission direction of the light-emitting portion of the light detection component is set at an angle to the bearing surface.

[0011] In one embodiment, the reflective component is embedded in the support platform, and the top surface of the reflective component is on the same surface as the support surface or is lower than the support surface.

[0012] In one embodiment, the reflective component includes one or more reflective structures, and the plurality of reflective structures are arranged in an array with adjacent reflective structures in close contact with each other.

[0013] In one embodiment, the reflective structure includes a first reflector, a second reflector, and a third reflector; the first reflector is connected to the second reflector and the third reflector respectively and is set at an angle to each other, and the second reflector is connected to the third reflector and is set at an angle to each other.

[0014] In one embodiment, the first reflector, the second reflector and the third reflector enclose a space, and the reflective structure further includes a light-transmitting material filling the space.

[0015] In one embodiment, the reflective surface of the first reflector is perpendicular to the reflective surface of the second reflector and the reflective surface of the third reflector, respectively; the reflective surface of the second reflector is perpendicular to the reflective surface of the third reflector.

[0016] In one embodiment, the reflective surfaces of the first reflector, the second reflector, and the third reflector are all triangular; the hypotenuse of the reflective surface of the first reflector is defined as W1, the hypotenuse of the reflective surface of the second reflector is defined as W2, and the hypotenuse of the reflective surface of the third reflector is defined as W3, with W1, W2, and W3 each independently set to 0.5mm-20mm.

[0017] In one embodiment, the substrate processing apparatus further includes a rotating mechanism; the rotating mechanism is connected to the support platform, and the rotating mechanism drives the support platform to rotate about its central axis.

[0018] In one embodiment, multiple reflective components are provided, and the multiple reflective components are arranged sequentially at intervals around the edge of the placement area.

[0019] In one embodiment, a plurality of the reflective components are arranged at equal intervals around the edge of the placement area.

[0020] In one embodiment, the substrate processing apparatus further includes a lifting mechanism; the lifting mechanism is connected to the support platform and is used to drive the support platform to move up and down.

[0021] In one embodiment, the distance between the light-emitting portion of the photodetector and the central axis of the substrate is defined as L; the angle between the light-emitting direction of the light-emitting portion and the bearing surface is defined as α; the distance between the light-emitting portion and the bearing surface when the lifting mechanism drives the substrate to the lower limit position is defined as H1; the distance between the light-emitting portion and the bearing surface when the lifting mechanism drives the substrate to the upper limit position is defined as H2; the distance between the side of the reflector component away from the central axis of the substrate and the central axis of the substrate is defined as L1; the distance between the side of the reflector component close to the central axis of the substrate and the central axis of the substrate is defined as L2; ​​L1 and L2 satisfy the following relationship:

[0022] In one embodiment, the substrate processing apparatus further includes a controller and an alarm; the controller is electrically connected to the light detection component and the alarm, respectively; the controller controls the alarm to perform an alarm action when the light detection component senses the reflected light from the reflective component.

[0023] A method for controlling a substrate processing apparatus, the method comprising the following steps:

[0024] The light detection component senses the reflected light from the reflector component. The reflector component is connected to the support platform and is located at the edge of the placement area on the support platform for placing the substrate. The light detection component is located above the support platform, and the light emitting part of the light detection component faces the edge of the placement area.

[0025] The substrate processing device is controlled to stop operating.

[0026] In one embodiment, the control method further includes the step of: providing an alarm and / or displaying an alarm indicating that the substrate has an abnormal condition.

[0027] In one embodiment, controlling the substrate processing apparatus to stop operating includes:

[0028] When the number of times reflected light is acquired within a preset time exceeds a preset number, the substrate processing device is controlled to stop operating; and / or,

[0029] When it is determined that the intensity of the acquired reflected light is greater than a preset intensity, the substrate processing device is controlled to stop working.

[0030] A control device for a substrate processing apparatus, the control device comprising the following steps:

[0031] The acquisition module is used to acquire the reflected light sensed by the photodetector component from the reflector component. The reflector component is connected to the support platform and is located at the edge of the placement area on the support platform for placing the substrate. The photodetector component is located above the support platform, and the light-emitting part of the photodetector component faces the edge of the placement area.

[0032] A control module is provided to control the substrate processing apparatus to stop operating.

[0033] In one embodiment, the control device further includes:

[0034] An alarm notification module is used to provide an alarm notification when the substrate is in an abnormal condition; and / or,

[0035] The display module is used to display any abnormal conditions found on the substrate.

[0036] In one embodiment, the control module includes:

[0037] A first control module is configured to control the substrate processing device to stop operating when it determines that the number of times reflected light is acquired within a preset time exceeds a preset number; and / or,

[0038] The second control module is used to control the substrate processing device to stop working when the intensity of the acquired reflected light is determined to be a preset intensity.

[0039] The aforementioned substrate processing apparatus and its control method and control device place the substrate in a placement area during substrate processing. When the substrate is in normal working condition without any abnormalities such as shifting, warping, or cracking, the substrate blocks the reflective component located at the edge of the placement area. This prevents the detection light from the photodetector from reaching the reflective component and thus preventing the detection of reflected light. Conversely, when the substrate is in abnormal working condition, the reflective component at the edge of the placement area is exposed, allowing the photodetector to detect reflected light. This allows for timely detection of substrate shifting, warping, cracking, and other defects, and enables emergency shutdown of the machine's reaction chamber, preventing further damage. Furthermore, only one photodetector is required, avoiding the impact of an excessive number of photodetectors on machine performance and reducing equipment costs. Attached Figure Description

[0040] The accompanying drawings, which form part of this application, are used to provide a further understanding of this disclosure. The illustrative embodiments of this disclosure and their descriptions are used to explain this disclosure and do not constitute an undue limitation of this disclosure.

[0041] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of the structure of a substrate in normal working condition according to an embodiment of the present disclosure;

[0043] Figure 2 This is a schematic diagram of the structure when the substrate is shifted according to an embodiment of the present disclosure;

[0044] Figure 3 This is a schematic diagram of the structure when the substrate of an embodiment of the present disclosure warps;

[0045] Figure 4 This is a top view of a substrate arranged on the bearing surface of a support platform according to an embodiment of the present disclosure;

[0046] Figure 5 This is a schematic diagram of the structure of a reflective component according to an embodiment of the present disclosure;

[0047] Figure 6 This is a schematic diagram of the structure of a reflective component according to another embodiment of the present disclosure;

[0048] Figure 7 This is a schematic diagram of the reflective structure according to an embodiment of the present disclosure;

[0049] Figure 8 This is a schematic diagram of a reflective structure according to an embodiment of the present disclosure, which reflects the probe light outward.

[0050] Figure 9 This is a schematic diagram showing the different states of the support platform in the lower limit position and the upper limit position according to an embodiment of the present disclosure;

[0051] Figure 10 This is a schematic diagram illustrating the change in the operating status of a substrate as of operating time according to an embodiment of the present disclosure.

[0052] 10. Support platform; 11. Support surface; 111. Placement area; 12. Support column; 20. Reflective assembly; 201. Group; 21. Reflective structure; 211. First reflector; 212. Second reflector; 213. Third reflector; 214. Space; 30. Light detection assembly; 40. Substrate. Detailed Implementation

[0053] To make the above-described objects, features, and advantages of this disclosure more apparent and understandable, specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this disclosure. However, this disclosure can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this disclosure. Therefore, this disclosure is not limited to the specific embodiments disclosed below.

[0054] It should be noted that the substrate in this embodiment can be a semiconductor wafer at any stage of the process of forming semiconductor elements, such as integrated circuits or discrete devices, on a substrate. In one embodiment, the substrate comprises a dielectric layer with an extremely low dielectric constant and a metal layer on the semiconductor substrate. The substrate can be a photomask, a semiconductor wafer, or other workpiece known to those skilled in the art of electronic component manufacturing. In at least some embodiments, the substrate comprises any material used to manufacture any integrated circuit, passive (e.g., capacitor, inductor), and active (e.g., transistor, photodetector, laser, diode) microelectronic components. The substrate may comprise an insulating material (e.g., a dielectric material) separating such active and passive microelectronic components from one or more conductive layers formed on top of them. In one embodiment, the substrate is a semiconductor substrate comprising one or more dielectric layers, such as silicon dioxide, silicon nitride, sapphire, and other dielectric materials. In one embodiment, the substrate comprises a stack of one or more wafers. The one or more wafers may comprise conductive layers, semiconductor layers, insulating layers, or any combination of the foregoing layers.

[0055] As described in the background section, existing machines suffer damage due to debris. Research has revealed that this problem arises because conventional machines cannot detect slight or significant substrate misalignment, thus failing to stop the process. Furthermore, if the process is not stopped within one and a half minutes of a slight substrate misalignment, it will sequentially escalate into a significant misalignment and then a complete misalignment. Given the compact internal structure of the chamber and the substrate's vertical movement and high-speed rotation, a complete misalignment could lead to a collision with the nozzle, potentially causing the substrate to break within the chamber and severely damaging various components.

[0056] Based on the above reasons, this disclosure provides a substrate processing apparatus and its control method and control device scheme. When the substrate is deviated, lifted or cracked during the process rotation, the apparatus can detect the defective phenomena such as substrate deviation, lifting or cracking in time and stop the process in time, thereby avoiding serious damage to various components inside the cavity due to substrate breakage and preventing further expansion of losses.

[0057] See Figures 1 to 4 , Figure 1 This diagram shows a schematic representation of a substrate 40 in normal operating condition according to an embodiment of the present disclosure. Figure 2 This diagram illustrates the structure of a substrate 40 when it is offset according to an embodiment of the present disclosure. Figure 3 This diagram illustrates the structure of a substrate 40 in an embodiment of the present disclosure when it warps. Figure 4 A top view of a substrate 40 arranged on a support surface 11 of a support stage 10 according to an embodiment of the present disclosure is shown. An embodiment of the present disclosure provides a substrate processing apparatus, which includes a support stage 10, a reflective assembly 20, and a photodetector assembly 30. The support stage 10 has a support surface 11, and the support surface 11 has a placement area 111 corresponding to the position of the substrate 40. The reflective assembly 20 is connected to the support stage 10 and is located at the edge of the placement area 111. The photodetector assembly 30 is located above the support stage 10, with its light-emitting portion facing the edge of the placement area 111. The photodetector assembly 30 is also used to sense the reflected light from the reflective assembly 20.

[0058] In the aforementioned substrate processing apparatus, the substrate 40 is placed in the placement area 111 during processing. When the substrate 40 is not experiencing any abnormalities such as displacement, warping, or cracking (i.e., the substrate 40 is in normal working condition), the substrate 40 blocks the reflective component 20 located at the edge of the placement area 111. Therefore, the detection light from the photodetector 30 cannot reach the reflective component 20, and thus cannot detect the reflected light. Conversely, when the substrate 40 experiences abnormalities such as displacement, warping, or cracking (i.e., the substrate 40 is in abnormal working condition), the reflective component 20 located at the edge of the placement area 111 is exposed. The detection light from the photodetector 30 then reaches the reflective component 20 and can detect the reflected light. In this way, defects such as substrate displacement, warping, and cracking can be detected promptly, and the reaction chamber of the machine can be stopped immediately to prevent further damage. In addition, only one photodetector 30 needs to be set up, which can avoid the impact on machine performance caused by too many photodetector 30s, and at the same time reduce the cost of the device.

[0059] It should be noted that the bearing surface 11 refers to the upper surface of the bearing platform 10. The upper surface of the bearing surface 11 can completely cover the substrate 40. In other words, the area of ​​the bearing surface 11 is greater than or equal to the surface area of ​​the substrate 40. Optionally, the shape of the substrate 40 may include, but is not limited to, regular and irregular shapes such as circles, ellipses, and polygons, which can be flexibly adjusted and set according to actual needs. In addition, the bearing surface 11 may be specifically adapted to the shape of the substrate 40, or it may be different from the substrate 40, as long as it can completely cover the substrate 40.

[0060] As a specific example, the substrate 40 is a circular plate, and the bearing surface 11 is a circular surface with a radius greater than or equal to that of the substrate 40.

[0061] As an example, the placement area 111 is adapted to the shape of the substrate 40 and is located at the center of the bearing surface 11. In other words, the distance between the outline of the placement area 111 and the outline of the bearing surface 11 is consistent, thereby ensuring that the bearing platform 10 can stably support the substrate 40. In addition, the substrate 40 can be placed directly on the placement area 111, or a support post 12 can be provided on the bearing surface 11, with the substrate 40 disposed on the support post 12 and spaced from the bearing surface 11 of the substrate 40. The projection of the substrate 40 on the substrate corresponds to the placement area 111.

[0062] It should be noted that since the reflective component 20 is located at the edge of the placement area 111, the reflective component 20 located at the edge of the placement area 111 can be exposed when the substrate 40 is slightly displaced, slightly warped or cracked, so that it can be detected and sensed by the photodetector component 30.

[0063] It should be noted that the light emission direction of the photodetector 30 can be either perpendicular to the bearing surface 11 or inclined relative to the bearing surface 11, as long as the light emission part of the photodetector 30 faces the edge of the placement area 111. In this way, when the substrate 40 is in an abnormal state, the detection light from the light emission part can be incident on the reflector 20 and thus sense the reflector 20.

[0064] When the light emission direction of the photodetector 30 is perpendicular to the bearing surface 11, when the detection light of the photodetector 30 is incident on the substrate 40, the liquid on the substrate 40 or the reflector 20, the substrate 40, the liquid on the substrate 40 or the reflector 20 can reflect the detection light back to the photodetector 30, so that the photodetector 30 senses the reflected light signal. This light signal can easily cause the machine to misjudge that the substrate 40 has an abnormal state.

[0065] Optionally, after the photodetector 30 senses the reflected light, the intensity of the light signal received by the photodetector 30 is further analyzed. When the light signal intensity is the same as a preset range, it indicates that the substrate 40 is in an abnormal state, thus reducing the machine's false judgment rate. In addition, the preset range can be set according to the intensity of the reflected light sensed by the photodetector 30 from the reflector 20 when the same intensity of detection light is incident on the reflector 20.

[0066] In one embodiment, the light-emitting direction of the light-emitting portion of the photodetector 30 is set at an angle to the bearing surface 11. Thus, when the substrate 40 is in normal operation, the substrate 40 blocks the reflector 20. In other words, the detection light emitted by the light-emitting portion of the photodetector 30 is blocked by the substrate 40, preventing it from incident on the reflector 20, and instead, for example, incident on the substrate 40 or the liquid on the substrate 40. Furthermore, because the light-emitting direction of the light-emitting portion is tilted relative to the bearing surface 11, the substrate 40 or the liquid on the substrate 40 cannot return the detection light to the photodetector 30. That is, the photodetector 30 will not sense reflected light at this time, thereby reducing the machine's false judgment rate.

[0067] Optionally, the light-emitting part is located at one end of the photodetector assembly 30, and the light-emitting direction of the light-emitting part is also the central axis of the photodetector assembly 30. The central axis of the photodetector assembly 30 is set at an angle to the bearing surface 11, that is, it is inclined relative to the bearing surface 11. Optionally, the angle formed by the central axis of the photodetector assembly 30 and the bearing surface 11 is α, and this angle α is an acute angle. Optionally, α is 30° to 75°, specifically, for example, 30°, 45°, 60°, 75°, etc.

[0068] It should be noted that the photodetector 30 can be disposed inside the cavity and above the substrate 40, or it can be disposed outside the cavity; no specific limitation is made here.

[0069] Specifically, when the space of the substrate processing apparatus chamber is sufficient, the photodetector 30 is disposed inside the chamber and located above the substrate 40. Conversely, when the space of the substrate processing apparatus chamber is small and insufficient to accommodate the photodetector 30 above the substrate 40, the photodetector 30 is disposed outside the chamber, for example. Meanwhile, in order to allow the detection light from the photodetector 30 to smoothly enter the chamber and incident on the reflector 20, and to sense the reflected light from the reflector 20, optionally, the top of the chamber is appropriately designed with a clearance or a light-transmitting part, which allows the detection light and reflected light to pass through smoothly.

[0070] As examples, the light detection component 30 includes, but is not limited to, a laser detector, a fluorescence detector, an infrared light detector, etc. In this embodiment, the light detection component 30 employs a laser detector and specifically includes a laser emitting component and a laser sensing component. The laser emitting component is used to emit laser light, causing the laser light to be emitted outward through the light-emitting part; the laser sensing component is used to sense the reflected light from the reflective component 20.

[0071] The photodetector component 30 is located in an environment containing HF, HNO3, and SC1, therefore it is required to be resistant to acids and alkalis or kept away from chemicals.

[0072] Please see Figure 9 , Figure 9 The diagram illustrates different states of the support platform 10 in the lower and upper limit positions according to an embodiment of the present disclosure. In one embodiment, the reflective component 20 is embedded in the support platform 10, and the top surface of the reflective component 20 is on the same surface as the support surface 11 or is lower than the support surface 11. In this way, the reflective component 20 mounted on the support platform 10 will not interfere with the placement of the substrate 40 in the placement area 111.

[0073] In a specific implementation, when assembling the reflective component 20 onto the support platform 10, a mounting groove adapted to the reflective component 20 is reserved on the support platform 10, or a mounting groove adapted to the reflective component 20 is opened on the support platform 10, and the reflective component 20 is fixed in the mounting groove by means of adhesive, snap-fit, or by using mounting parts such as bolts, pins, rivets, etc.

[0074] Please see Figures 5 to 8 , Figure 5 A schematic diagram of the structure of a reflective component 20 according to an embodiment of the present disclosure is shown. Figure 6 A schematic diagram of the structure of a reflective component 20 according to another embodiment of this disclosure is shown. Figure 7 A schematic diagram of the reflective structure 21 according to an embodiment of the present disclosure is shown. Figure 8 A schematic diagram of a reflective structure 21 reflecting detection light outward is shown according to an embodiment of the present disclosure. In one embodiment, the reflective assembly 20 includes one or more reflective structures 21. Multiple reflective structures 21 are arranged in an array, with adjacent reflective structures 21 in close contact with each other. Thus, each reflective structure 21 serves as a reflection point, and the detection light from the photodetector 30 can sense the reflective structure 21 when it is incident on that reflection point. The more reflective structures 21 there are, the more reflection points there are, increasing the probability of being sensed by the photodetector 30, thereby improving performance. Furthermore, when the reflective assembly 20 formed by multiple reflective structures 21 is installed as a whole on the support platform 10, the installation efficiency is higher compared to a single reflective structure 21.

[0075] The array arrangement of the multiple reflective structures 21 includes, but is not limited to, m×n, where m and n are both natural numbers.

[0076] As an example, such as Figure 5 As shown, the top surface of the reflective structure 21 is, for example, an equilateral triangle. Two reflective structures 21 are arranged adjacently to form a group 201. The top surface of this group 201 forms a parallelogram, and this group 201 is arranged in a 2×2 subarray. Furthermore, as another example, such as... Figure 6 As shown, using group 201 as a subarray, it can also be arranged, for example, in a 4×10 configuration, relative to... Figure 5As shown in the arrangement, the increased number of subarrays results in a larger size for the reflective component 20, which increases the probability of it being detected by the photodetector component 30.

[0077] Of course, as some optional solutions, the multiple reflective structures 21 of the reflective component 20 do not need to be arranged in an array as described in the above embodiment. They can also be flexibly adjusted to other arrangements according to actual needs. Specifically, they can be arranged in a regular shape or an irregular shape. For example, gaps can be provided between each reflective structure 21 or between some reflective structures 21, and the reflective structures 21 can be combined together to form a whole by a carrier.

[0078] Please see Figures 5 to 8 In one embodiment, the reflective structure 21 includes a first reflector 211, a second reflector 212, and a third reflector 213. The first reflector 211 is connected to the second reflector 212 and the third reflector 213 respectively and is set at an angle. The second reflector 212 is connected to the third reflector 213 and is set at an angle. Thus, when the substrate 40 is deviated from the placement area 111, the reflective component 20 will no longer be completely blocked by the substrate 40, but at least part of its structure will be exposed. In this way, the detection light emitted by the light-emitting part of the photodetector 30 will be incident on the reflective component 20. Since the first reflector 211, the second reflector 212, and the third reflector 213 are connected to each other and set at an angle, the reflective component 20 can reflect the detection light to the photodetector 30. The photodetector 30 can then sense the reflected light from the reflective component 20 and thus determine the abnormal signal.

[0079] In one embodiment, the first reflector 211, the second reflector 212, and the third reflector 213 enclose a space 214. The reflective structure 21 also includes a light-transmitting material filling the space 214. Thus, the light-transmitting material does not obstruct the detection light or the reflected light, while simultaneously protecting the first reflector 211, the second reflector 212, and the third reflector 213 from exposure and potential damage. Furthermore, the first reflector 211, the second reflector 212, and the third reflector 213 are formed as a single unit through the light-transmitting material, increasing the overall structural strength and making them less prone to damage.

[0080] Of course, as an alternative, the light-transmitting material can be omitted from the reflective structure 21.

[0081] Please see Figures 5 to 8In one embodiment, the reflective surface of the first reflector 211 is perpendicular to the reflective surfaces of the second reflector 212 and the third reflector 213, respectively. The reflective surface of the second reflector 212 is perpendicular to the reflective surface of the third reflector 213. Thus, when the reflective component 20 receives the detection light, it can reflect the reflected light parallel to the detection light back to the photodetector 30, ensuring that the photodetector 30 can normally sense the reflected light and thus determine that the substrate 40 is in an abnormal condition. Furthermore, since the reflected light and the detection light are parallel and relatively concentrated, the light-emitting part and the light-sensing part of the photodetector 30 can be, for example, combined into one component, simplifying the size of the photodetector 30 and facilitating its installation in a machine tool, avoiding excessive size that could affect the machine's performance.

[0082] In addition, as some optional solutions, the included angle between any two of the reflective surfaces of the first reflector 211, the second reflector 212, and the third reflector 213 is not limited to a right angle. For example, it can also be an acute angle or an obtuse angle. The specific angle can be flexibly adjusted and set according to actual needs.

[0083] In one embodiment, the reflective surfaces of the first reflector 211, the second reflector 212, and the third reflector 213 are all triangular. The hypotenuse of the reflective surface of the first reflector 211 is defined as W1, the hypotenuse of the reflective surface of the second reflector 212 is defined as W2, and the hypotenuse of the reflective surface of the third reflector 213 is defined as W3. W1, W2, and W3 are each independently set to 0.5mm-20mm. Thus, the inclined sides of the reflective surfaces of the first reflector 211, the second reflector 212, and the third reflector 213 respectively constitute the three sides of the top surface of the reflective structure 21. Furthermore, since W1, W2, and W3 are each independently set to 0.5mm-20mm, the size of the reflective surface of the reflective structure 21 is designed to be small enough to ensure that the detection light incident on the reflective structure 21 and the reflected light from the reflective structure 21 are relatively concentrated. This makes it easier for the photodetector component 30 to sense the reflected light, thereby improving the performance of the device.

[0084] Specifically, the reflective surface of the first reflector 211 is an isosceles right triangle, the reflective surface of the second reflector 212 is an isosceles right triangle, and the reflective surface of the third reflector 213 is an isosceles right triangle. Thus, W1, W2, and W3 maintain the same size, making the top surface of the reflective structure 21 an equilateral triangle. Furthermore, this ensures that all incident probe light on the reflective structure 21 is reflected outwards by it, resulting in good product performance.

[0085] In one embodiment, the substrate processing apparatus further includes a rotating mechanism. The rotating mechanism is connected to the support stage 10 and drives the support stage 10 to rotate around its central axis. Thus, on the one hand, the rotating mechanism drives the support stage 10 to rotate the substrate 40 to perform various processing on the substrate 40 according to process requirements; on the other hand, during the various processing of the substrate 40, if the substrate 40 experiences slight displacement, warping, cracking, or other abnormalities, exposing the reflective component 20 underneath, the rotation of the rotating mechanism ensures that the reflective component 20 exposed below the substrate 40 rotates to a position opposite to the photodetector component 30, thereby ensuring that it can be successfully detected by the photodetector component 30. This allows the machine to be stopped and maintenance performed promptly, preventing further damage.

[0086] Please refer to the following: Figure 4 In one embodiment, multiple reflective components 20 are provided, and the multiple reflective components 20 are arranged sequentially and at intervals around the edge of the placement area 111. In this way, when the substrate 40 is slightly shifted or tilted in any direction, the corresponding reflective component 20 will be exposed, so that it can be detected by the photodetector component 30 in a timely manner.

[0087] In one embodiment, a plurality of reflective components 20 are arranged at equal intervals around the edge of the placement area 111.

[0088] As an example, the reflective components 20 may be 3, 6, 8, 12, 20 or other numbers, and may be arranged sequentially around the edge of the placement area 111 at equal or unequal intervals.

[0089] In one embodiment, the substrate processing apparatus further includes a lifting mechanism. The lifting mechanism is connected to the support table 10 and is used to drive the support table 10 to move up and down. In this way, the lifting mechanism drives the support table 10 to move up and down, thereby causing the substrate 40 to move up and down to adjust its height position, so as to perform various processing on the substrate 40 according to process requirements.

[0090] In one specific embodiment, when the substrate processing apparatus has both a rotating mechanism and a lifting mechanism, the rotating mechanism is directly connected to the support platform 10, and the lifting mechanism is connected to the rotating mechanism. That is, the rotating mechanism drives the support platform 10 to rotate, thereby causing the substrate 40 to rotate. In addition, the lifting mechanism drives the rotating mechanism to lift, thereby causing the support platform 10 and the substrate 40 to lift. In this way, both the rotation and lifting of the substrate 40 can be achieved, thus meeting various requirements of the substrate processing process. Alternatively, the lifting mechanism is directly connected to the support platform 10, and the rotating mechanism is connected to the lifting mechanism. That is, the lifting mechanism drives the support platform 10 to lift the substrate 40, and the rotating mechanism drives the lifting mechanism to rotate, thereby causing the support platform 10 and the substrate 40 to rotate. In this way, both the lifting and rotating of the substrate 40 can be achieved, similarly meeting various requirements of the substrate processing process.

[0091] It should be noted that the lifting mechanism includes, but is not limited to, various lifting forms such as motor-driven screw lifting, motor-driven belt lifting, pneumatic cylinder lifting, hydraulic cylinder lifting, and so on. Specific types are not limited here, as long as they can achieve the lifting action. Furthermore, the rotating mechanism includes, but is not limited to, a motor.

[0092] Please see Figure 9 In one embodiment, the distance between the light-emitting portion of the photodetector 30 and the central axis of the substrate 40 is defined as L; the angle between the light-emitting direction of the light-emitting portion and the bearing surface 11 is defined as α; the distance between the light-emitting portion and the bearing surface 11 when the lifting mechanism drives the substrate 40 to the lower limit position is defined as H1; and the distance between the light-emitting portion and the bearing surface 11 when the lifting mechanism drives the substrate 40 to the upper limit position is defined as H2. The distance between the side of the reflector 20 away from the central axis of the substrate 40 and the central axis of the substrate 40 is defined as L1; and the distance between the side of the reflector 20 close to the central axis of the substrate 40 and the central axis of the substrate 40 is defined as L2. L1 and L2 satisfy the following relationship: Thus, the width of the reflective component 20 is large enough that when the substrate 40 is in an abnormal condition, the detection light of the photodetector 30 can be incident on the reflective component 20 and sense the reflective component 20 being exposed outward when the substrate 40 moves up and down with the lifting mechanism to any height position between the upper limit position and the lower limit position, thereby enabling the substrate 40 to be judged to be in an abnormal condition.

[0093] In one embodiment, the substrate processing apparatus further includes a controller and an alarm. The controller is electrically connected to the light detection component 30 and the alarm, respectively. When the light detection component 30 senses reflected light from the reflector component 20, the controller controls the alarm to activate an alarm action. Thus, when the light detection component 30 senses reflected light from the reflector component 20, it indicates that the substrate 40 is in an abnormal operating condition. At this time, the alarm action can promptly remind the staff to take appropriate action and prevent further damage.

[0094] It should be noted that warning devices include, but are not limited to, sound warning devices, vibration warning devices, light warning devices, etc.

[0095] As an example, the controller is also electrically connected to the lifting mechanism and the rotating mechanism, respectively. The controller is also used to stop the lifting mechanism and the rotating mechanism when the light detection component 30 senses the reflected light from the reflector component 20.

[0096] In one embodiment, a method for controlling a substrate processing apparatus includes the following steps:

[0097] Step S100: The light detection component 30 senses the reflected light of the reflector component 20. The reflector component 20 is connected to the support stage 10 and is located at the edge of the placement area 111 on the support stage 10 for placing the substrate 40. The light detection component 30 is located above the support stage 10, and the light emitting part of the light detection component 30 faces the edge of the placement area 111.

[0098] Step S200: Control the substrate processing device to stop working.

[0099] The control method of the substrate processing apparatus described above controls the substrate processing apparatus to stop working when the photodetector 30 senses the reflected light from the reflector 20. This allows for timely detection of defects such as substrate 40 shifting, warping, or cracking, and enables emergency shutdown of the machine's reaction chamber to prevent further damage.

[0100] In one embodiment, the control method further includes the step of: providing an alarm and / or displaying an alarm indicating that an abnormal condition exists on the substrate 40.

[0101] Please see Figure 10 , Figure 10The diagram illustrates the change in the operating status of the substrate 40 over time according to an embodiment of the present disclosure. The horizontal axis represents the operating time of the substrate 40, and the vertical axis represents the operating status of the alarm. The operating status of the alarm is divided into an alarm state (ON) when the substrate 40 is detected to be in an abnormal state, and an off state (OFF) when the substrate 40 is detected to be in a normal state. During the time interval 0-t1, the alarm is in the off state, which means that the substrate 40 is in a normal state. During the time interval t1-t6, the alarm is in the three-alarm state, which means that the substrate 40 has an abnormality.

[0102] In one embodiment, controlling the substrate processing apparatus to stop operation includes: controlling the substrate processing apparatus to stop operation when it is determined that the number of times reflected light is acquired within a preset time period is greater than a preset number. This reduces the probability of machine misjudgment.

[0103] The preset time and preset number of times can be flexibly adjusted and set according to actual needs, and are not limited here.

[0104] In one embodiment, controlling the substrate processing apparatus to stop operation includes: controlling the substrate processing apparatus to stop operation when it is determined that the intensity of the acquired reflected light is greater than a preset intensity. This reduces the probability of machine misjudgment.

[0105] The preset intensity can be flexibly adjusted and set according to actual needs, and is not limited here.

[0106] In one embodiment, a control device for a substrate processing apparatus includes the following steps: an acquisition module and a control module. The acquisition module acquires the reflected light from the reflector component 20 sensed by the photodetector component 30. The reflector component 20 is connected to the support stage 10 and located at the edge of the placement area 111 on the support stage 10 for placing the substrate 40. The photodetector component 30 is located above the support stage 10, with its light-emitting portion facing the edge of the placement area 111. The control module controls the substrate processing apparatus to stop operation.

[0107] When the photodetector 30 senses the reflected light from the reflector 20, the control device of the aforementioned substrate processing apparatus controls the substrate processing apparatus to stop working accordingly. This allows for timely detection of defects such as substrate 40 shifting, warping, or cracking, and enables emergency shutdown of the machine's reaction chamber to prevent further damage.

[0108] Specific limitations regarding the control device of the substrate processing apparatus can be found in the above-described limitations on the control method of the substrate processing apparatus, and will not be repeated here. Each module in the control device of the aforementioned substrate processing apparatus can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device in hardware form, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module. It should be noted that the module division in this embodiment is illustrative and only represents a logical functional division; other division methods may be used in actual implementation.

[0109] In one embodiment, the control device further includes an alarm notification module. The alarm notification module is used to provide an alarm notification when an abnormal condition exists on the substrate 40.

[0110] In one embodiment, the control device further includes a display module. The display module is used to display an abnormal condition of the substrate 40.

[0111] In one embodiment, the control module includes a first control module. The first control module is used to control the substrate processing apparatus to stop working when it is determined that the number of times reflected light is acquired within a preset time period is greater than a preset number.

[0112] In one embodiment, the control module includes a second control module. The second control module is used to control the substrate processing apparatus to stop operating when the intensity of the acquired reflected light is determined to be a preset intensity.

[0113] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0114] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

[0115] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0116] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0117] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0118] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0119] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

Claims

1. A substrate processing apparatus, characterized in that, The substrate processing apparatus includes: A support platform, wherein the support platform is provided with a support surface, and the support surface is provided with a placement area corresponding to the position of the substrate; A reflective assembly, connected to the support platform and located at the edge of the placement area; and A light detection component is located above the support platform, with the light-emitting part of the light detection component facing the edge of the placement area. The light detection component is also used to sense the reflected light from the reflective component. The reflective component includes one or more reflective structures, and the multiple reflective structures are arranged in an array with adjacent reflective structures in close contact with each other. The reflective structure includes a first reflector, a second reflector, and a third reflector; the first reflector is connected to the second reflector and the third reflector respectively and is set at an angle to each other, and the second reflector is connected to the third reflector and is set at an angle to each other.

2. The substrate processing apparatus according to claim 1, characterized in that, The light emission direction of the light-emitting part of the optical detection component is set at an angle to the bearing surface.

3. The substrate processing apparatus according to claim 1, characterized in that, The reflective component is embedded in the support platform, and the top surface of the reflective component is on the same surface as the support surface or is lower than the support surface.

4. The substrate processing apparatus according to claim 1, characterized in that, The first reflector, the second reflector and the third reflector enclose a space, and the reflective structure also includes a light-transmitting material filling the space.

5. The substrate processing apparatus according to claim 1, characterized in that, The reflective surface of the first reflector is perpendicular to the reflective surface of the second reflector and the reflective surface of the third reflector, respectively; the reflective surface of the second reflector is perpendicular to the reflective surface of the third reflector.

6. The substrate processing apparatus according to claim 5, characterized in that, The reflective surfaces of the first reflector, the second reflector, and the third reflector are all triangular. The hypotenuse of the reflective surface of the first reflector is defined as W1, the hypotenuse of the reflective surface of the second reflector is defined as W2, and the hypotenuse of the reflective surface of the third reflector is defined as W3. W1, W2, and W3 are each independently set to 0.5mm-20mm.

7. The substrate processing apparatus according to any one of claims 1-6, characterized in that, The substrate processing apparatus further includes a rotating mechanism; the rotating mechanism is connected to the support platform, and the rotating mechanism drives the support platform to rotate around its central axis.

8. The substrate processing apparatus according to any one of claims 1-6, characterized in that, The reflective components are provided in multiple ways, and the multiple reflective components are arranged sequentially at intervals around the edge of the placement area.

9. The substrate processing apparatus according to claim 8, characterized in that, Multiple reflective components are arranged at equal intervals around the edge of the placement area.

10. The substrate processing apparatus according to any one of claims 1-6, characterized in that, The substrate processing apparatus further includes a lifting mechanism; the lifting mechanism is connected to the support platform and is used to drive the support platform to lift.

11. The substrate processing apparatus according to claim 10, characterized in that, The distance from the light-emitting part of the photodetector to the central axis of the substrate is defined as L; the angle between the light-emitting direction of the light-emitting part and the bearing surface is defined as α; and the distance between the light-emitting part and the bearing surface when the lifting mechanism drives the substrate to the lower limit position is defined as... The distance between the light-emitting part and the supporting surface when the lifting mechanism drives the substrate to the upper limit position is defined as... The distance between the side of the reflective component, which is away from the central axis of the substrate, and the central axis of the substrate is defined as... The distance between the side of the reflective component closest to the central axis of the substrate and the central axis of the substrate is defined as... ; and Satisfying the following relation: +L, +L.

12. The substrate processing apparatus according to any one of claims 1-6, characterized in that, The substrate processing apparatus further includes a controller and an alarm; the controller is electrically connected to the light detection component and the alarm respectively; the controller controls the alarm to perform an alarm action when the light detection component senses the reflected light from the reflective component.

13. A control method for a substrate processing apparatus, characterized in that, The substrate processing apparatus is the substrate processing apparatus according to any one of claims 1-12, and the control method of the substrate processing apparatus includes the following steps: The light detection component senses the reflected light from the reflector component. The reflector component is connected to the support platform and is located at the edge of the placement area on the support platform for placing the substrate. The light detection component is located above the support platform, and the light emitting part of the light detection component faces the edge of the placement area. The substrate processing device is controlled to stop operating.

14. The control method according to claim 13, characterized in that, The control method further includes the step of: providing an alarm and / or displaying an alarm indicating an abnormal condition of the substrate.

15. The control method according to claim 13 or 14, characterized in that, The step of stopping the substrate processing device includes: When the number of times reflected light is acquired within a preset time exceeds a preset number, the substrate processing device is controlled to stop operating; and / or, When it is determined that the intensity of the acquired reflected light is greater than a preset intensity, the substrate processing device is controlled to stop working.

16. A control device for a substrate processing apparatus, characterized in that, The substrate processing apparatus is the substrate processing apparatus according to any one of claims 1-12, and the control device of the substrate processing apparatus includes the following steps: The acquisition module is used to acquire the reflected light sensed by the photodetector component and the reflector component. The reflector component is connected to the support platform and is located at the edge of the placement area on the support platform for placing the substrate. The photodetector component is located above the support platform and the light emitting part of the photodetector component faces the edge of the placement area. A control module is provided to control the substrate processing apparatus to stop operating.

17. The control device for the substrate processing apparatus according to claim 16, characterized in that, The control device further includes: An alarm notification module is used to provide an alarm notification when the substrate is in an abnormal condition; and / or, The display module is used to display any abnormal conditions found on the substrate.

18. The control device for the substrate processing apparatus according to claim 16 or 17, characterized in that, The control module includes: A first control module is configured to control the substrate processing device to stop operating when it determines that the number of times reflected light is acquired within a preset time exceeds a preset number; and / or, The second control module is used to control the substrate processing device to stop working when the intensity of the acquired reflected light is determined to be a preset intensity.

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