Display device film removal device and display device film removal method

Abstract

This disclosure provides a film-removing device and method for a display device, belonging to the field of display technology. It solves the problem of air bubbles existing between the electrostatic conductive strip and the integrated circuit chip during existing film removal processes for display devices. The film-removing device of this disclosure includes a vacuuming structure and an adsorption component. The adsorption component includes multiple first adsorption holes and an exhaust groove. The vacuuming structure is configured to create a vacuum, causing the first adsorption holes to form an adsorption force. The adsorption component is configured to adsorb the film assembly to be removed under the adsorption force of the first adsorption holes, adhere the film assembly to the surface of the integrated circuit chip, and pre-press the film assembly. The film assembly to be removed consists of a carrier film, an integrally formed and stacked electrostatic conductive strip, and a reinforcing plate, with a portion of the electrostatic conductive strip located in the exhaust groove.

Description

TECHNICAL FIELD

[0001] The present disclosure belongs to the technical field of display, and particularly relates to a film tearing device of a display device and a film tearing method of a display device. BACKGROUND

[0002] The display device includes an integrated circuit chip (IC), and a stiffener needs to be attached to the periphery of the IC to provide force support for the IC. Meanwhile, electro-static discharge tape (ESD Tape) is needed to discharge static electricity to a grounding point to discharge harmful static electricity. The ESD Tape is usually attached above the IC, and the attachment mode of the ESD Tape includes vacuum attachment and open attachment. The vacuum attachment device has high cost and large energy waste, but the IC surface has no air bubbles after the vacuum attachment, and the ESD Tape can completely wrap the IC, without ESD risk. Although the open attachment (attachment in air) has low device cost and small energy waste, air bubbles are prone to appear above the IC, and the air bubbles cannot be completely eliminated, which affects the production yield and mobile phone assembly, and the ESD risk exists in the bubble area. SUMMARY

[0003] The present disclosure aims to at least solve one of the technical problems existing in the prior art, and provides a film tearing device of a display device and a film tearing method of a display device for eliminating air bubbles between an electro-static discharge tape and an integrated circuit chip.

[0004] In a first aspect, a film tearing device of a display device is provided, wherein the display device includes a display panel and a flexible circuit board bound to the display panel, and an integrated circuit chip is arranged on the flexible circuit board. The film tearing device includes a vacuum extraction structure and an adsorption member. The adsorption member has a first region and a second region surrounding the first region. The adsorption member includes a plurality of first adsorption holes and an exhaust groove. The exhaust groove is located in the first region, and the plurality of first adsorption holes are located in the second region. The vacuum extraction structure is configured to extract vacuum to form adsorption force in the first adsorption holes.

[0005] The vacuum extraction structure is configured to extract vacuum to form adsorption force in the first adsorption holes.

[0006] The adsorption member is configured to adsorb a film tearing assembly under the action of the adsorption force of the first adsorption holes, attach the film tearing assembly to the surface of the integrated circuit chip, and pre-press the film tearing assembly. The film tearing assembly is composed of a carrier film and an electro-static discharge tape and a stiffener which are integrally formed and stacked. Part of the electro-static discharge tape is located in the exhaust groove.

[0007] The exhaust groove is configured to exhaust gas along the gap when the adsorption member pre-presses the film-to-be-removed assembly.

[0008] In some embodiments, the film-removing device further comprises a clamping assembly configured to clamp the carrier film and move towards the exhaust groove to separate the carrier film from the integrally formed and laminated electrostatic conductive tape and reinforcing plate.

[0009] In some embodiments, the exhaust groove is further configured to exhaust gas along the gap when the carrier film is separated from the integrally formed and laminated electrostatic conductive tape and reinforcing plate.

[0010] In some embodiments, the adsorption member further comprises a first opening located in the first region and integrally arranged with the exhaust groove, and configured to avoid the position of the integrated circuit chip when the adsorption member pre-presses the film-to-be-removed assembly.

[0011] In some embodiments, the plurality of first adsorption holes are arranged in an array in the second region.

[0012] In some embodiments, the distance between two adjacent first adsorption holes is 3.2mm-3.6mm.

[0013] In some embodiments, the length of the exhaust groove is 5mm-15mm.

[0014] In some embodiments, the film-removing device further comprises a control unit configured to set a film-removing path and control the clamping assembly to clamp the carrier film and move towards the exhaust groove along the film-removing path.

[0015] In some embodiments, the material of the adsorption member is polyurethane material with a hardness of 40A-60A.

[0016] In some embodiments, the film-removing device further comprises a carrier table configured to carry the film-to-be-removed assembly.

[0017] In some embodiments, the film-removing device further comprises a base configured to place the adsorption member.

[0018] In a second aspect, the embodiments of the present disclosure further provide a film-removing method of a display device, wherein the display device comprises a display panel and a flexible circuit board bound to the display panel, the flexible circuit board is provided with an integrated circuit chip, and the film-removing method comprises:

[0019] The static electricity conducting belt is attached to the reinforcing plate to form an integrated and stacked static electricity conducting belt and reinforcing plate;

[0020] The carrier film is attached to the surface of the integrated and stacked static electricity conducting belt and reinforcing plate to form a film to be torn assembly;

[0021] The film to be torn assembly is adsorbed through the first adsorption hole by the adsorption member, and is attached to the surface of the integrated circuit chip, and the film to be torn assembly is pre-pressed by the adsorption member, wherein part of the static electricity conducting belt is located in the exhaust groove of the film tearing device, and when the adsorption member attaches the film to be torn assembly to the surface of the integrated circuit chip, the static electricity conducting belt has a gap with the display panel, so that when the adsorption member pre-presses the film to be torn assembly, the gas is discharged along the gap;

[0022] The adsorption member is removed, the carrier film is clamped by the clamping assembly, and the carrier film is moved towards the exhaust groove to separate the carrier film from the integrated and stacked static electricity conducting belt and reinforcing plate, and the gas is discharged from the exhaust groove.

[0023] In some embodiments, the carrier film is clamped by the clamping assembly and moved towards the exhaust groove, specifically including:

[0024] The film tearing path is set;

[0025] The carrier film is clamped by the clamping assembly in the first direction, the second direction and the third direction, and is moved towards the exhaust groove along the film tearing path, so that the carrier film is separated from the integrated and stacked static electricity conducting belt and reinforcing plate by adopting an S-shaped self-force.

[0026] In some embodiments, during the separation of the carrier film from the integrated and stacked static electricity conducting belt and reinforcing plate, the angle between the torn carrier film and the integrated and stacked static electricity conducting belt and reinforcing plate which is not torn is greater than 0° and less than or equal to 60°. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 A film tearing device based on a display device is provided for the embodiments of the present disclosure;

[0028] Figure 2 A schematic diagram of an adsorption member is provided for the embodiments of the present disclosure;

[0029] Figure 3 A top view of a film to be torn assembly is provided for the embodiments of the present disclosure;

[0030] Figure 4 A side view of a film to be torn assembly is provided for the embodiments of the present disclosure;

[0031] Figure 5 A side view of a tear-off carrier film provided for an embodiment of the present disclosure;

[0032] Figure 6 A top view of a tear-off carrier film provided for an embodiment of the present disclosure;

[0033] Figure 7 An assembled perspective view of an adsorption member and a base provided for an embodiment of the present disclosure;

[0034] Figure 8 A sectional view of an adsorption member and a base provided for an embodiment of the present disclosure;

[0035] Figure 9 A flow chart of a film tearing method of a display device provided for an embodiment of the present disclosure. DETAILED DESCRIPTION

[0036] In order for those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0037] Unless otherwise defined, technical or scientific terms used in the present disclosure should have the meanings commonly understood by one of ordinary skill in the art to which the present disclosure belongs. The terms "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. Similarly, the terms "one", "a", or "the" and similar terms do not denote a quantity restriction, but mean that at least one exists. The terms "include", "comprise", and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like are only used to indicate relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships may also change accordingly.

[0038] In the related art, the electrostatic discharge tape (ESD Tape) is attached in front of the integrated circuit chip (IC), and is attached together with the carrier film. The carrier film needs to be adsorbed by the pressure head buffer material to realize the grabbing of the ESD Tape. During the attachment, the pressure head buffer material needs to avoid the IC to prevent the IC from being pressed by the pressure head buffer material, and a venting position is reserved to ensure the gas discharge at the attachment position. After the attachment, the carrier film needs to be torn off by the clamp, and secondary pressing is performed, and finally the complete attachment of the ESD Tape is realized. In the open attachment process, the single ESD Tape will generate different degrees of gas residues between the IC and the ESD Tape, and finally form bubbles. The main reason for this phenomenon is that the adhesion between the ESD Tape and the screen is poor during the attachment, causing part of the ESD Tape to be lifted when the film is torn, and due to incomplete venting, bubbles are generated after secondary pressing. So far, the open attachment cannot completely eliminate the bubbles above the IC.

[0039] Based on the problems in the related art, the present embodiment provides a film tearing device and a film tearing method which can eliminate the bubbles between the electrostatic discharge tape (ESD Tape) and the integrated circuit chip (IC).

[0040] Figure 1 A film tearing device based on a display device is provided for the present embodiment. Figure 2 A schematic diagram of an adsorption member is provided for the present embodiment. Figure 3 A top view of a film-to-be-torn assembly is provided for the present embodiment. Figure 4 A side view of a film-to-be-torn assembly is provided for the present embodiment. Figure 5 A side view of a carrier film tearing is provided for the present embodiment. Figure 6 A top view of a carrier film tearing is provided for the present embodiment. The display device includes a display panel and a flexible circuit board bound to the display panel, and an integrated circuit chip (IC) is arranged on the flexible circuit board. As shown in Figures 1-6As shown, the film tearing device comprises a vacuum extraction structure 200 and an adsorption member 100, the adsorption member 200 has a first area 1 and a second area 2 surrounding the first area 1, the adsorption member 100 comprises a plurality of first adsorption holes 21 and an exhaust groove 12, the exhaust groove 12 is located in the first area 1, and the plurality of first adsorption holes 21 are located in the second area 2, wherein the vacuum extraction structure 200 is configured to extract vacuum to form adsorption force in the first adsorption holes 21; the adsorption member 100 is configured to adsorb the film-to-be- torn assembly 3 under the action of the adsorption force of the first adsorption holes, and to adhere the film-to-be-torn assembly 3 to the surface of the integrated circuit chip 4, and to pre-press the film-to-be-torn assembly 3, wherein the film-to-be-torn assembly 3 is composed of a carrier film 31 and an electrostatically conductive tape 32 and a reinforcing plate 33 which are integrally formed and stacked, and part of the electrostatically conductive tape 32 is located in the exhaust groove 12; the exhaust groove 12 is configured to have a gap between the electrostatically conductive tape 32 and the display panel when the adsorption member 100 adheres the film-to-be-torn assembly 3 to the surface of the integrated circuit chip 4, so as to discharge gas along the gap when the adsorption member 100 pre-presses the film-to-be-torn assembly 3.

[0041] Specifically, referring to the third layer of the top view in Figure 3 The reinforcing plate 33 adheres to three sides of the integrated circuit chip 4 and is in the same plane as the integrated circuit chip 4, thereby providing force support for the integrated circuit chip 4. The electrostatically conductive tape 32 is usually adhered to the surface of the integrated circuit chip 4 and the reinforcing plate 33 by means of glue or other adhesives, and covers the reinforcing plate 33. The function of the electrostatically conductive tape 32 is to conduct static electricity out of the electrostatically conductive tape 32 to a grounding point, thereby discharging harmful static electricity.

[0042] Since the reinforcing plate 33 and the electrostatically conductive tape 32 are generally soft and prone to wrinkling, the reinforcing plate 33 and the electrostatically conductive tape 32 need to be adhered to the carrier film 31 before being adhered to the integrated circuit chip 4. The carrier film 31, the reinforcing plate 33 and the electrostatically conductive tape 32 together constitute the film-to-be-torn assembly 3. After the film-to-be-torn assembly 3 is adsorbed and adhered to the integrated circuit chip 4, the carrier film 31 is torn off, thereby achieving the adhesion of the reinforcing plate 33 and the electrostatically conductive tape 32 to the integrated circuit chip 4. Specifically, before the electrostatically conductive tape 32 is adhered to the integrated circuit chip 4, the electrostatically conductive tape 32 is adhered to the carrier film 31 by means of glue on one side of the carrier film 31. Then, the carrier film 31 (i.e. the entire film-to-be-torn assembly 3) is adsorbed by the adsorption member 100 under the action of the adsorption force of the first adsorption holes 21, so as to achieve the grasping of the electrostatically conductive tape 32, and then the carrier film 31 is adhered to the corresponding position of the integrated circuit chip 4. Finally, the carrier film 31 is torn off.

[0043] In the related art, in the open bonding process, the carrier film 31 is torn off, and the static conduction band 32 is bonded to the integrated circuit chip 4. However, the adhesion between the static conduction band 32 and the screen of the integrated circuit chip 4 is poor, which causes part of the static conduction band 32 to be lifted when the film is torn, and further causes different degrees of gas residue between the integrated circuit chip 4 and the static conduction band 32, and finally forms a bubble. Compared with the related art, the reinforcing plate 33 and the static conduction band 32 are integrated into a one-piece structure in the embodiment of the present disclosure, which can prevent part of the static conduction band 32 from being lifted when the film is torn, and further cause different degrees of gas residue between the integrated circuit chip 4 and the static conduction band 32. The problem can be eliminated, and the bubble between the static conduction band 32 and the integrated circuit chip 4 can be eliminated.

[0044] In addition, the adsorption member 100 needs to reserve an exhaust position when bonding the film-to-be-torn assembly 3 to the integrated circuit chip 4 to ensure that the gas in the bonding position is exhausted. Among them, the first area 1 in the adsorption member 100 is mainly used for adsorbing the film-to-be-torn assembly 3, and the second area 2 is mainly used for bonding the film-to-be-torn assembly 3 to the integrated circuit chip 4 and tearing off the carrier film 31. Specifically, part of the static conduction band 32 is located in the exhaust groove 12 of the adsorption member 100. When the adsorption member 100 bonds the film-to-be-torn assembly 3 to the integrated circuit chip 4, the part corresponding to the exhaust groove 12 does not press the static conduction band 32 to the display panel, so there is a gap between the static conduction band 32 and the underlying display panel, which is used for exhausting gas. The process of bonding the film-to-be-torn assembly 3 to the integrated circuit chip 4 includes pre-pressing and secondary pressing. The pre-pressing refers to that after the adsorption member 100 adsorbs the film-to-be-torn assembly 3 to the integrated circuit chip 4, and the adsorption member 100 pre-presses the film-to-be-torn assembly 3 by its own mass. The secondary pressing refers to that after the film-to-be-torn assembly 3 is bonded to the integrated circuit chip 4, the adsorption member 100 is removed, and the carrier film 31 is torn off. The static conduction band 32 is further pressed. The gap is used to exhaust gas when the adsorption member 100 pre-presses the film-to-be-torn assembly 3.

[0045] In the embodiments of the present disclosure, the reinforcing plate 33 and the electrostatic conductive tape 32 of the integrated circuit chip 4 are integrated into an integrated structure before the display module (OLED MDL) factory, so as to prevent the electrostatic conductive tape 32 from being lifted when the carrier film 31 is torn off, and eliminate the bubble defect of the electrostatic conductive tape 32; no need to set up a bubble manual repair station of the electrostatic conductive tape 32, thereby reducing the labor, tool, cost, and maintenance material cost; meanwhile, when the film-to-be-torn assembly 3 is attached to the integrated circuit chip 4, the exhaust position is reserved by the exhaust groove 12 of the adsorption member 100, so that the gas is exhausted when the adsorption member 100 pre-presses the film-to-be-torn assembly 3. Further, the reinforcing plate 33 and the electrostatic conductive tape 32 of the integrated circuit chip 4 are integrated into an integrated structure, the film tearing is faster, the film tearing cycle is reduced by 0.4s, the film tearing unit is no longer a bottleneck, and the production capacity is indirectly improved; from a macro perspective, in the related art, the reinforcing plate 33 and the electrostatic conductive tape 32 are two separate structures, so two film tearing devices are needed to tear the film after the reinforcing plate 33 and the electrostatic conductive tape 32 are attached to the integrated circuit chip 4, respectively; in the embodiments of the present disclosure, the reinforcing plate 33 and the electrostatic conductive tape 32 are integrated into an integrated structure, thereby reducing one film tearing device, and because the film tearing device is reduced, the shelf rate of the film tearing device is improved by 1.5%, and the electric energy is saved.

[0046] In some embodiments, as shown in FIG. 1, the adsorption member 100 includes a grounding structure 22 located in the second area 2, and the exhaust groove 12 is arranged on one side of the grounding structure 22. Specifically, the grounding structure 22 can be arranged at the middle position of the adsorption member 100, or arranged at the peripheral position of the adsorption member 100, and generally corresponds to the grounding part of the film-to-be-torn assembly 3. For example, corresponding to the grounding part of the electrostatic conductive tape 32, so that the adsorption member 100 can better compact the electrostatic conductive tape 32 when the electrostatic conductive tape 32 is attached to the integrated circuit chip 4 for pre-pressing, and avoid generating bubbles. However, the grounding part of the film-to-be-torn assembly 3 is generally determined by the customer and cannot be changed at will. Figure 2

[0047] In some embodiments, the length of the exhaust groove 12 is 5mm-15mm. Specifically, the size of the exhaust groove 12 generally needs to consider the exhaust and appearance quality. If the length of the exhaust groove 12 is too small, it may cause that the gas cannot be well exhausted during the pre-pressing and film tearing process; if the length of the exhaust groove 12 is too large, the film-to-be-torn assembly 3 (specifically, the electrostatic conductive tape 32) may be wrinkled under the action of the adsorption force when the adsorption member 100 adsorbs the film-to-be-torn assembly 3. Therefore, the size of the exhaust groove 12 generally needs to consider the exhaust capacity and the requirement of appearance quality, and is flexibly set, and the length of the exhaust groove 12 is generally 5mm-15mm, of course, in specific application scenarios, the length of the exhaust groove 12 can be less than 5mm or greater than 15mm, which is not limited in the present disclosure.

[0048] ​In some embodiments, the height of the exhaust groove 12 is consistent with the height of the adsorption member 100, that is, the exhaust groove 12 is a hollow structure.

[0049] In some embodiments, the adsorption member 100 not only includes the first adsorption hole 21 and the exhaust groove 22, but also includes a first opening 11 located in the first area 1 and integrally arranged with the exhaust groove 12. The first opening 11 is configured to avoid the position of the integrated circuit chip 4 when the adsorption member 100 pre-presses the film-to-be-removed assembly 3.

[0050] Specifically, the first area 1 in the adsorption member 100 is mainly used for adsorbing the film-to-be-removed assembly 3 through the first adsorption hole 21, while the second area 2 is mainly used in the process of attaching the film-to-be-removed assembly 3 to the integrated circuit chip 4 and the process of removing the carrier film 31. Specifically, as described above, the exhaust groove located in the first area 1 is used to make the electrostatic conductive strip 32 and the display panel have a gap when the adsorption member 100 attaches the film-to-be-removed assembly 3 to the surface of the integrated circuit chip 4, so as to discharge the gas along the gap when the adsorption member 100 pre-presses the film-to-be-removed assembly 3. At the same time, the exhaust groove 12 is also used to discharge the gas along the gap when the carrier film 31 is separated from the integrally formed and stacked electrostatic conductive strip 32 and the reinforcing plate 33. The first opening 11 located in the first area 1 is used to expose the integrated circuit chip 4 to avoid being pressed when the adsorption member 100 pre-presses the film-to-be-removed assembly 3.

[0051] In some embodiments, the film-removing device not only includes the vacuum extraction structure 200 and the adsorption member 100, but also includes a clamping assembly 500 configured to clamp the carrier film 31 and move towards the exhaust groove 12 to separate the carrier film 31 from the integrally formed and stacked electrostatic conductive strip 32 and the reinforcing plate 33. Specifically, the clamping assembly 500 can be a clamp, and can also be other, which is not limited in the present disclosure.

[0052] In some embodiments, the exhaust groove 12 is also configured to discharge the gas along the gap when the carrier film 31 is separated from the integrally formed and stacked electrostatic conductive strip 32 and the reinforcing plate 33. Specifically, after the adsorption member 100 attaches the film-to-be-removed assembly 3 to the integrated circuit chip 4, the adsorption member 100 is removed, the clamping assembly 500 clamps the carrier film 31 and moves towards the exhaust groove 12 to start film-removing. In the process of film-removing, the gas is still discharged through the gap between the electrostatic conductive strip 32 and the display panel.

[0053] In some embodiments, the film-tearing device includes not only a vacuum structure 200, an adsorption member 100, and a clamping assembly 500, but also a control unit 400. The control unit 400 is configured to set a film-tearing path and control the clamping assembly 500 to clamp the carrier film 31 and move it along the film-tearing path toward the exhaust groove 12.

[0054] Specifically, the control unit 400 can be a programmable logic controller (PLC) in the display device, used to set the film-tearing path as needed, so as to control the clamping assembly 500 to clamp the carrier film 31 and move along the film-tearing path towards the exhaust groove 12 to tear the film.

[0055] In some embodiments, a tearing path is established by linking the X, Y, and Z axes during film tearing and employing an S-shaped self-pressure tearing method to expel all gas. In some embodiments, during the separation of the carrier film 31 from the integrally formed and stacked electrostatic conductive strip 32 and reinforcing plate 33, the included angle between the torn carrier film 31 and the untorn integrally formed and stacked electrostatic conductive strip 32 and reinforcing plate 33 is greater than 0° and less than or equal to 60°, oriented towards the exhaust groove 12, to facilitate gas discharge. Table 1 is a configuration diagram of a tearing path provided by an embodiment of this disclosure.

[0056] Table 1

[0057]

[0058] In some embodiments, the adsorption component 100 is made of polyurethane with a hardness of 40A to 60A.

[0059] In some embodiments, the thickness of the adsorption member 100 is generally 2 mm to 3 mm.

[0060] Specifically, to ensure that the adsorption component 100 can better adsorb the film assembly 3 to be peeled off without wrinkling, the adsorption component 100 is generally made of medium-hardness polyurethane, which has a certain strength and wear resistance. In some embodiments, the hardness of the adsorption component 100 is 50A. Of course, the hardness and thickness of the adsorption component 100 can be adjusted according to specific application requirements.

[0061] In some embodiments, a plurality of first adsorption pores 21 are arranged in an array in the second region 2.

[0062] Specifically, the first adsorption holes 21 are evenly arranged in the second region 2, which can ensure that when the adsorption component 100 adsorbs the film assembly 3 to be torn, a uniform adsorption force is generated, making the adsorption component 100 adsorb the film assembly 3 to be torn more stably. Of course, the multiple first adsorption holes 21 can also be distributed on the adsorption component 100 according to actual needs, based on the different adsorption forces required at different positions of the film assembly 3 to be torn, and this disclosure does not limit this.

[0063] In some embodiments, the distance between two adjacent first adsorption holes 21 is 3.2 mm to 3.6 mm.

[0064] Specifically, the spacing between two adjacent first adsorption holes 21 is generally related to the adsorption force required by the adsorption member 100. For example, when the adsorption member 100 adsorbs the film assembly 3 to be peeled, the adsorption force required is generally between 40 and 70 MPa. In this case, the spacing between two adjacent first adsorption holes 21 in the adsorption member 100 can be set to 3.2 mm to 3.6 mm. In some embodiments, the spacing between two adjacent first adsorption holes 21 is generally 3.4 mm, and the diameter of the first adsorption hole 21 is 0.6 mm.

[0065] The adsorption force of the first adsorption hole 21 can be adjusted by adjusting the vacuum level inside it; thus, the adsorption force of the adsorption component 100 on the film assembly 3 to be peeled can be adjusted by adjusting the vacuum level of the multiple first adsorption holes 21, thereby avoiding the problem of not being able to pick up the film assembly 21 to be peeled.

[0066] It should be noted that the size of the adsorption component 180 and the number of the plurality of first adsorption holes 21 can be adjusted according to the size and dimensions of the film assembly 3 to be peeled off; in addition, the density and distribution of the plurality of first adsorption holes 21 can be adjusted according to the required adsorption force and the vacuum degree that the vacuum equipment can achieve, and this disclosure does not impose any restrictions on this.

[0067] In some embodiments, the shape of the adsorption member 100 can be square, generally similar to the shape of the film assembly 3 to be torn. It should be noted that the shape of the adsorption member 100 in this embodiment is not limited to this, and can be adjusted according to the shape of the film assembly 3 to be torn. For example, the shape of the adsorption member 180 can also be an elliptical cylinder or a regular polyhedron, etc. This embodiment uses a cylinder as an example for description.

[0068] In some embodiments, the film-tearing device includes not only a vacuum structure 200, an adsorption member 100, a control unit 400, and a clamping assembly 500, but also a support platform 300 and a base 600. The support platform 300 is configured to support the film assembly 3 to be peeled; the base 600 is configured to hold the adsorption member 100. Figure 7 This is a perspective view of an adsorption component 100 and a base 600 provided in an embodiment of the present disclosure. Figure 8 A cross-sectional view of an adsorption member 100 and a base 600 provided in an embodiment of this disclosure.

[0069] In some embodiments, the material of the carrier film 31 may be polyethylene terephthalate (PET), also known as polyethylene terephthalate or polyester resin.

[0070] In some embodiments, the size of the carrier film 31 is not smaller than the size of the adsorption member 100, so as to ensure that the adsorption member 100 can better adsorb the film assembly 3 to be torn.

[0071] The film-removing device provided in this embodiment is applied in a display device. The film-removable assembly 3 in the display device consists of a carrier film 31 and an integrally formed and stacked electrostatic conductive strip 32 and reinforcing plate 33. Through material integration, the electrostatic conductive strip 32 and reinforcing plate 33 are integrated into an integrated structure before the OLED MDL factory, preventing the electrostatic conductive strip 32 from being lifted when the carrier film 31 is removed. At the same time, the adsorption component 100 of the film-removing device is provided with an exhaust groove 12, which is hollowed out at a fixed position, so that an exhaust position is reserved when the adsorption component 100 adsorbs the film-removable assembly 3 for bonding and when the carrier film 31 is removed. In addition, the adsorption component 100 has a first opening 11 that avoids the integrated circuit chip 4, preventing the adsorption component 100 from pressing the integrated circuit chip 4 when the film-removable assembly 3 is pre-pressed. Furthermore, when the clamping assembly 500 clamps the carrier film 31 and performs film tearing, the film tearing is linked to the X, Y, and Z axes. The carrier film adopts an S-shaped self-forced pressure tearing method to completely expel the gas between the electrostatic conductive strip 32 and the integrated circuit chip 4. This method is an open bonding method, which reduces the film tearing cycle by 0.4s and eliminates air bubbles between the electrostatic conductive strip 32 and the integrated circuit chip 4.

[0072] Based on the same inventive concept, this disclosure also provides a method for peeling off a film from a display device. The display device includes a display panel and a flexible circuit board bonded to the display panel, wherein an integrated circuit chip is disposed on the flexible circuit board. Figure 9 A flowchart illustrating a method for peeling a film off a display device according to an embodiment of this disclosure. Figure 9 As shown, the film-peeling method includes:

[0073] 901. The electrostatic conductive strip 32 is attached to the reinforcing plate 33 to form an integrally formed and stacked electrostatic conductive strip 32 and reinforcing plate 33.

[0074] 902. The carrier film 31 is attached to the surface of the integrally formed and stacked electrostatic conductive strip 32 and reinforcing plate 33 to form the film assembly to be peeled off 3.

[0075] 903. The adsorption component 100 adsorbs the film assembly 3 to be peeled through the first adsorption hole 21 and attaches the film assembly 3 to the surface of the integrated circuit chip 4. The adsorption component 100 pre-presses the film assembly 3 to be peeled. Part of the electrostatic conductive strip 32 is located in the exhaust groove 12 of the film peeling device. When the adsorption component 100 attaches the film assembly 3 to the surface of the integrated circuit chip 4, there is a gap between the electrostatic conductive strip 32 and the display panel so that when the adsorption component 100 pre-presses the film assembly 3 to be peeled, the gas is discharged along the gap.

[0076] 904. Remove the adsorption component 100 and use the clamping assembly 500 to clamp the carrier film 31 and move it towards the exhaust groove 12 so that the carrier film 31 is separated from the integrally formed and stacked electrostatic conductive strip 32 and reinforcing plate 33, and the gas is discharged from the exhaust groove 12.

[0077] In some embodiments, step 904 involves using the clamping assembly 500 to clamp the carrier film 31 and move it toward the venting groove 12. Specifically, this includes: setting a film-tearing path; using the clamping assembly 500 in conjunction with the first direction, the second direction, and the third direction to clamp the carrier film 31 and move it along the film-tearing path toward the venting groove 12, so that the carrier film 31 can be separated from the integrally formed and stacked electrostatic conductive strip 32 and reinforcing plate 33 by adopting an S-shaped self-force.

[0078] In some embodiments, during the separation process of the carrier film 31 from the integrally formed and stacked electrostatic conductive strip 32 and reinforcing plate 33, the included angle between the torn carrier film 31 and the integrally formed and stacked electrostatic conductive strip 32 and reinforcing plate 33 that have not been torn is greater than 0° and less than or equal to 60°.

[0079] Other specific details of the film-tearing method provided in this embodiment are similar to those of the film-tearing device described above, and will not be repeated here.

[0080] In this embodiment, the provided film-removing method integrates the electrostatic conductive strip 32 and the reinforcing plate 33 into a single structure before the OLED MDL factory is installed, preventing the electrostatic conductive strip 32 from being lifted when the carrier film 31 is removed. Simultaneously, the exhaust groove 12 of the adsorption member 100 discharges gas during pre-pressing of the film-to-be-removed assembly 3 and during the removal of the carrier film 31. Furthermore, the first opening 11 of the adsorption member 100 avoids the integrated circuit chip 4 during pre-pressing of the film-to-be-removed assembly 3, preventing pressure on the integrated circuit chip 4. Further, when the carrier film 31 is held by the clamping member 500 for film removal, the film removal is linked along the X, Y, and Z axes, employing an S-shaped self-forced pressure-type film removal method to completely discharge the gas between the electrostatic conductive strip 32 and the integrated circuit chip 4. This open-type bonding method reduces the film removal cycle time by 0.4 seconds, eliminating air bubbles between the electrostatic conductive strip 32 and the integrated circuit chip 4.

[0081] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A film peeling apparatus of a display apparatus, wherein, The display device comprises a display panel and a flexible circuit board bonded with the display panel, and an integrated circuit chip is arranged on the flexible circuit board. The film tearing device comprises a vacuum extraction structure and an adsorption member. The adsorption member has a first region and a second region surrounding the first region. The adsorption member comprises a plurality of first adsorption holes and an exhaust groove. The exhaust groove is located in the first region, and the plurality of first adsorption holes are located in the second region. The vacuum extraction structure is configured to extract vacuum to form adsorption force in the first adsorption holes. The adsorption member is configured to adsorb a film-to-be-torn assembly under the action of the adsorption force of the first adsorption holes, and to adhere the film-to-be-torn assembly to the surface of the integrated circuit chip and to pre-press the film-to-be-torn assembly. The film-to-be-torn assembly is composed of a carrier film and an integrally formed and stacked electrostatic conductive tape and reinforcing plate, and part of the electrostatic conductive tape is located in the exhaust groove. The exhaust groove is configured to have a gap between the electrostatic conductive tape and the display panel when the adsorption member adheres the film-to-be-torn assembly to the surface of the integrated circuit chip, so as to exhaust gas along the gap when the adsorption member pre-presses the film-to-be-torn assembly. The film tearing device further comprises a clamping assembly configured to clamp the carrier film and move in the direction of the exhaust groove so as to separate the carrier film from the integrally formed and stacked electrostatic conductive tape and reinforcing plate. The exhaust groove is further configured to exhaust gas along the gap when the carrier film is separated from the integrally formed and stacked electrostatic conductive tape and reinforcing plate.

2. The film tearing device of claim 1, wherein, The adsorption member further comprises a first opening located in the first region and integrally arranged with the exhaust groove, and configured to avoid the position of the integrated circuit chip when the adsorption member pre-presses the film-to-be-torn assembly.

3. The film tearing device of claim 1, wherein, The plurality of first adsorption holes are arranged in an array in the second region.

4. The film tearing device of claim 1, wherein, The distance between adjacent two first adsorption holes is 3.2mm-3.6mm.

5. The film tearing device of claim 4, wherein, The length of the exhaust groove is 5mm-15mm.

6. The film tearing device of claim 1, wherein, The film tearing device further comprises a control unit configured to set a film tearing path and control the clamping assembly to clamp the carrier film and move in the direction of the exhaust groove along the film tearing path.

7. The film tearing device of claim 1, wherein, The material of the adsorption member is polyurethane material with a hardness of 40A-60A.

8. The film tearing device of claim 1, wherein, The film tearing device further comprises a carrier table configured to carry the film-to-be-torn assembly.

9. The film tearing device of claim 1, wherein, The film tearing device further comprises a base configured to place the adsorption member.

10. The film tearing device of claim 1, wherein, The display device comprises a display panel and a flexible circuit board bonded with the display panel, and an integrated circuit chip is arranged on the flexible circuit board. The film tearing method comprises:

11. A method of peeling off a film of a display device, wherein adhering an electrostatic conductive tape to a reinforcing plate to form an integrally formed and stacked electrostatic conductive tape and reinforcing plate; adhering a carrier film to the surface of the integrally formed and stacked electrostatic conductive tape and reinforcing plate to form a film-to-be-torn assembly; ​ The film assembly to be torn is adsorbed by the adsorption member through the first adsorption hole, and is attached to the surface of the integrated circuit chip, and the film assembly to be torn is pre-pressed by the adsorption member, wherein part of the electrostatic conductive band is located in the exhaust groove of the film tearing device, and when the adsorption member attaches the film assembly to be torn to the surface of the integrated circuit chip, the electrostatic conductive band has a gap with the display panel, so that when the adsorption member pre-presses the film assembly to be torn, the gas is discharged along the gap. The adsorption member is removed, and the clamping assembly is used to clamp the carrier film and move towards the exhaust groove, so that the carrier film is separated from the integrally formed and stacked electrostatic conductive band and reinforcing plate, and the gas is discharged from the exhaust groove.

12. The film tearing method of claim 11, wherein, The clamping assembly is used to clamp the carrier film and move towards the exhaust groove, specifically comprising: Setting a film tearing path; The clamping assembly is used to clamp the carrier film and move towards the exhaust groove along the first direction, the second direction and the third direction, so that the carrier film is separated from the integrally formed and stacked electrostatic conductive band and reinforcing plate by adopting S-type self-force.

13. The film tearing method of claim 12, wherein, During the separation of the carrier film from the integrally formed and stacked electrostatic conductive band and reinforcing plate, the included angle between the torn carrier film and the integrally formed and stacked electrostatic conductive band and reinforcing plate which is not torn is greater than 0° and less than or equal to 60°.

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