An LED lighting fixture

Abstract

The application relates to an LED lighting lamp, belonging to the technical field of LED lighting, which comprises a lampshade, an LED chip and a heat dissipation assembly are arranged in the lampshade, the heat dissipation assembly comprises a heat transfer piece, one side of the heat transfer piece is connected with the LED chip, a heat dissipation shaft is rotationally connected to the side of the heat transfer piece away from the LED chip, and the heat dissipation shaft is connected with a heat dissipation fin, and the edge of the heat dissipation fin is attached to the heat transfer piece; the heat dissipation shaft is connected with a power piece, and the power piece is used for driving the heat dissipation shaft to rotate when the temperature of the LED chip exceeds a predetermined value; a heat dissipation hole is arranged on the outer wall of the lampshade and is connected with the inner wall of the lampshade. The application has the effect that when the temperature of the LED chip exceeds the predetermined value due to long-time work, the power piece works, the power piece drives the heat dissipation fin to rotate around the axis of the heat dissipation shaft, the air flow in the lampshade is accelerated in the rotating process of the heat dissipation fin, the amount of air in contact with the heat dissipation fin is increased, and the risk of excessively high temperature of the LED chip in the working process is reduced.

Description

Technical Field

[0001] This application relates to the field of LED lighting, and in particular to an LED lighting fixture. Background Technology

[0002] LED lighting is a modern, energy-saving lighting technology that uses semiconductor devices to emit light. LED lighting has many advantages, such as long lifespan, low energy consumption, high efficiency, and environmental friendliness, and is widely used in home lighting, commercial buildings, automotive lighting, stage lighting, and even outdoor landscape lighting.

[0003] Currently, common LED lighting fixtures use LED chips, or light-emitting diodes, as the light source. When current is applied, the LED chip generates light through semiconductor materials.

[0004] Regarding the aforementioned technologies, when an LED chip carries an electric current, the movement of electrons within the semiconductor material generates heat, causing the LED chip to heat up after a period of use. When high-quality LED lights operate for extended periods at high power, the heat generated by the LED chip becomes quite noticeable. Furthermore, prolonged exposure to high temperatures can damage the LED chip material, leading to a shortened lifespan. Summary of the Invention

[0005] To reduce the risk of shortened LED chip lifespan, this application provides an LED lighting fixture.

[0006] The LED lighting fixture provided in this application adopts the following technical solution:

[0007] An LED lighting fixture includes a lampshade, in which an LED chip and a heat dissipation assembly are installed. The heat dissipation assembly includes a heat transfer element, one side of which is connected to the LED chip. A heat dissipation shaft is rotatably connected to the side of the heat transfer element away from the LED chip, and heat sinks are connected to the outer walls of the heat dissipation shaft. The edges of the heat sinks are in contact with the side of the heat transfer element away from the LED chip. A power element is connected to the end of the heat dissipation shaft away from the heat transfer element. The power element is used to drive the heat dissipation shaft and the heat sinks connected to the heat dissipation shaft to rotate around the axis of the heat dissipation shaft when the temperature of the LED chip exceeds a predetermined value. The outer wall of the lampshade has heat dissipation holes that connect to the inner wall of the lampshade.

[0008] By adopting the above technical solution, the heat generated by the LED chip during operation is transferred to the heat sink in contact with the heat transfer component through the heat transfer component. Then, the heat sink transfers the heat into the air through the heat dissipation holes, which reduces the risk of overheating during the operation of the LED chip to a certain extent. When the LED chip operates for a long time and the temperature exceeds the predetermined value, the power component is activated. The power component drives the heat sink to rotate around the axis of the heat dissipation shaft. During the rotation of the heat sink, the air flow inside the lamp cover is accelerated, thereby increasing the amount of air in contact with the heat sink, which further reduces the risk of overheating during the operation of the LED chip.

[0009] Optionally, the heat transfer element includes a heat transfer sheet with one side connected to the LED chip. The side of the heat transfer sheet away from the LED chip is connected to a heat transfer shaft, and a positioning groove is formed on the outer wall of the end of the heat transfer shaft away from the heat transfer sheet. The heat dissipation shaft passes through the positioning groove and is inserted into the heat transfer shaft, with the groove wall of the positioning groove fitting against the outer wall of the heat dissipation shaft.

[0010] By adopting the above technical solution, after the power component is started, it drives the heat dissipation shaft and the heat dissipation fins connected to the heat dissipation shaft to rotate around the axis of the heat dissipation shaft. The heat transfer shaft positions the rotating heat dissipation shaft through the positioning groove, making the heat dissipation shaft more stable during rotation.

[0011] Optionally, the bottom of the positioning groove is provided with a rotary switch, which is used to push the heat dissipation shaft away from the heat transfer shaft when the temperature of the heat transfer shaft exceeds a predetermined value; the power component includes a motor and a proximity switch is provided on the outer wall of the side of the motor facing the heat dissipation shaft, the proximity switch is electrically connected to the motor, the output shaft of the motor is slidably connected to the heat dissipation shaft and the extension direction of the motor output shaft coincides with the axis of the heat dissipation shaft.

[0012] By adopting the above technical solution, when the LED chip's temperature exceeds a predetermined value due to prolonged operation, the rotary switch pushes the heat dissipation shaft away from the heat transfer shaft. The end of the heat dissipation shaft facing the motor is close to the proximity switch. When the distance between the end of the heat dissipation shaft and the proximity switch is less than a predetermined value, the proximity switch opens. The proximity switch controls the motor output shaft to rotate around the axis of the heat dissipation shaft, thereby driving the heat sink connected to the heat dissipation shaft to rotate around the axis of the heat dissipation shaft. At the same time, after the rotary switch pushes the heat dissipation shaft away from the heat transfer shaft, a certain gap is generated between the heat sink and the heat transfer plate, reducing the friction between the heat sink and the heat transfer plate when the heat sink rotates around the axis of the heat dissipation shaft.

[0013] Optionally, a heat transfer groove is formed on the outer wall of the heat transfer plate facing the heat sink, the edge of the heat sink is in contact with the bottom of the heat transfer groove, and a heat-conducting fluid is placed in the heat transfer groove.

[0014] By adopting the above technical solution, after a certain gap is generated between the heat sink and the heat transfer plate, the heat transfer plate comes into contact with the heat-conducting fluid. The heat transfer plate transfers heat to the heat sink through the heat-conducting fluid, thereby reducing the friction between the heat sink and the heat transfer plate when the heat sink rotates around the axis of the heat dissipation shaft, and accelerating the cooling speed of the LED chip to a certain extent.

[0015] Optionally, the outer wall of the heat transfer plate facing the heat sink is provided with a first heat dissipation hole and a second heat dissipation hole that connect to the outer wall of the other side of the heat transfer plate. The first heat dissipation hole is provided with a first heat dissipation component for sending air from the side of the heat transfer plate facing the heat sink into the side of the heat transfer plate facing the LED chip when the heat dissipation shaft rotates.

[0016] By adopting the above technical solution, during the rotation of the heat dissipation shaft, the first row of heat transfer elements sends air from the side of the heat transfer plate facing the heat sink to the side of the heat transfer plate facing the LED chip. After the air comes into contact with the LED chip, it leaves the side of the heat transfer plate facing the LED chip through the second row of heat holes. This allows the air to continuously carry away the heat generated on the LED chip through the first row of heat holes and the second row of heat holes, thereby accelerating the cooling speed of the LED chip to a certain extent.

[0017] Optionally, the first heat dissipation component includes a first heat shaft and a first heat fan blade distributed around the first heat shaft. The first heat fan blade is bent toward the side of the heat transfer plate facing the LED chip. When the heat dissipation shaft rotates, the first heat shaft drives the first heat fan blade to rotate around the axis of the first heat shaft.

[0018] By adopting the above technical solution, during the rotation of the heat dissipation shaft, the first row of heat shafts drives the first row of heat fan blades to rotate around the axis of the first row of heat shafts. During the rotation, the first row of heat fan blades sends the air from the side of the heat transfer plate facing the heat sink into the side of the heat transfer plate facing the LED chip. After the air comes into contact with the LED chip, it leaves the side of the heat transfer plate facing the LED chip through the second row of heat holes.

[0019] Optionally, an internal gear is connected to the side of the heat sink facing the heat transfer plate, and the axis of the internal gear extends in the same direction as the axis of the heat dissipation shaft; a first external gear is connected to the end of the first row of heat shafts away from the LED chip, and the axis of the first external gear extends in the same direction as the axis of the first row of heat shafts, and the internal gear meshes with the first external gear.

[0020] By adopting the above technical solution, during the rotation of the heat dissipation shaft, the internal gear connected to the heat transfer plate rotates around the axis of the heat dissipation shaft. During the rotation of the internal gear, the first external gear rotates around the axis of the first row of heat shafts, thereby causing the first row of heat shafts to drive the first row of heat fan blades to rotate around the axis of the first row of heat shafts.

[0021] Optionally, a second heat-generating component is provided in the second heat-generating hole. The second heat-generating component includes a second heat-generating shaft and a second heat-generating fan blade is distributed around the second heat-generating shaft. The second heat-generating fan blade is bent toward the side of the heat transfer plate away from the LED chip. When the heat dissipation shaft rotates, the second heat-generating shaft drives the second heat-generating fan blade to rotate around the axis of the second heat-generating shaft.

[0022] By adopting the above technical solution, during the rotation of the heat dissipation shaft, the second row of heat shafts drives the first row of heat fan blades to rotate around the axis of the second row of heat shafts. During the rotation, the second row of heat fan blades sends the air from the side of the heat transfer plate facing the LED chip into the side of the heat transfer plate facing the heat sink, thereby increasing the amount of air in contact with the LED chip to a certain extent and further accelerating the cooling speed of the LED chip.

[0023] Optionally, the heat-conducting fluid is silicone oil.

[0024] By adopting the above technical solution, silicone oil has low viscosity and good thermal conductivity. When the heat sink rotates around the axis of the heat dissipation shaft, it reduces the friction between the heat sink and the heat transfer plate, and at the same time improves the heat transfer efficiency between the heat transfer plates.

[0025] Optionally, the heat sink is made of copper-aluminum composite plate.

[0026] By adopting the above technical solution, the copper-aluminum composite plate is a heat-conducting sheet made of two metal materials, copper and aluminum. It retains the thermal conductivity of copper and also has the lightweight and cost advantages of aluminum, thereby reducing the manufacturing cost of lighting fixtures to a certain extent.

[0027] In summary, this application includes at least one of the following beneficial technical effects:

[0028] 1. The heat generated by the LED chip during operation is transferred to the heat sink in contact with the heat transfer component through the heat transfer component. The heat sink then transfers the heat into the air through the heat dissipation holes, which reduces the risk of the LED chip overheating during operation to a certain extent. When the LED chip operates for a long time and the temperature exceeds the predetermined value, the power component is activated. The power component drives the heat sink to rotate around the axis of the heat dissipation shaft. During the rotation of the heat sink, the air flow inside the lamp cover is accelerated, thereby increasing the amount of air in contact with the heat sink, which further reduces the risk of the LED chip overheating during operation.

[0029] 2. When the LED chip's temperature exceeds a predetermined value due to prolonged operation, rotating the switch pushes the heat dissipation shaft away from the heat transfer shaft. The end of the heat dissipation shaft facing the motor is close to the proximity switch. When the distance between the end of the heat dissipation shaft and the proximity switch is less than a predetermined value, the proximity switch opens. The proximity switch controls the motor output shaft to rotate around the axis of the heat dissipation shaft, thereby driving the heat sink connected to the heat dissipation shaft to rotate around the axis of the heat dissipation shaft. At the same time, after rotating the switch pushes the heat dissipation shaft away from the heat transfer shaft, a certain gap is created between the heat sink and the heat transfer plate, reducing the friction between the heat sink and the heat transfer plate when the heat sink rotates around the axis of the heat dissipation shaft.

[0030] 3. During the rotation of the heat dissipation shaft, the first row of heat transfer elements sends air from the side of the heat transfer plate facing the heat sink to the side of the heat transfer plate facing the LED chip. After the air comes into contact with the LED chip, it leaves the side of the heat transfer plate facing the LED chip through the second row of heat transfer holes. This allows the air to continuously carry away the heat generated on the LED chip through the first and second rows of heat transfer holes, thereby accelerating the cooling speed of the LED chip to a certain extent. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application;

[0032] Figure 2 This is a cross-sectional structural diagram of an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of the internal structure of an embodiment of this application;

[0034] Figure 4 yes Figure 2 Enlarged structural diagram of part A.

[0035] In the diagram: 1. Lampshade; 11. Heat dissipation hole; 2. LED chip; 3. Heat dissipation component; 31. Heat transfer element; 311. Heat transfer plate; 3111. Heat transfer groove; 3112. First row of heat holes; 3113. Second row of heat holes; 3114. Heat-conducting fluid; 312. Heat transfer shaft; 3121. Positioning groove; 32. Heat dissipation shaft; 321. Positioning hole; 33. Heat sink; 34. Power component; 341. Motor; 342. Proximity switch; 4. Rotary switch; 5. Heat dissipation component; 51. First heat dissipation component; 511. First row of heat shaft; 512. First row of heat fan fins; 513. First external gear; 52. Second heat dissipation component; 521. Second row of heat shaft; 522. Second row of heat fan fins; 523. Second external gear; 53. Internal gear. Detailed Implementation

[0036] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0037] This application discloses an LED lighting fixture. (Refer to...) Figure 1 and Figure 2 An LED lighting fixture includes a lampshade 1, within which an LED chip 2 and a heat dissipation assembly 3 are installed. The heat dissipation assembly 3 includes a heat transfer element 31, which includes a heat transfer plate 311. One side of the heat transfer plate 311 is connected to the LED chip 2. A heat transfer shaft 312 is connected to the side of the heat transfer plate 311 away from the LED chip 2. A positioning groove 3121 is formed on the outer wall of the end of the heat transfer shaft 312 away from the heat transfer plate 311. A heat dissipation shaft 32 passes through the positioning groove 3121, and heat dissipation fins 33 are connected to the outer walls of the heat dissipation shaft 32. A heat transfer groove 3111 is formed on the outer wall of the side of the heat sink 33 facing the heat sink 33. The edge of the heat sink 33 is in contact with the bottom of the heat transfer groove 3111. The outer wall of the heat dissipation shaft 32 is in contact with the wall of the positioning groove 3121. A power component 34 is connected to the end of the heat dissipation shaft 32 away from the heat transfer component 31. The power component 34 is used to drive the heat dissipation shaft 32 and the heat sink 33 connected to the heat dissipation shaft 32 to rotate around the axis of the heat dissipation shaft 32 when the temperature of the LED chip 2 exceeds a predetermined value. A heat dissipation hole 11 is formed on the outer wall of the lamp cover 1 to connect to the inner wall of the lamp cover 1.

[0038] The heat generated by the LED chip 2 during operation is transferred through the heat transfer plate 311 to the heat sink 33 in contact with the heat transfer plate 311. Then, the heat sink 33 transfers the heat into the air through the heat dissipation holes 11, which reduces the risk of the LED chip 2 overheating during operation to a certain extent. When the LED chip 2 operates for a long time and the temperature exceeds the predetermined value, the power component 34 is activated. The power component 34 drives the heat sink 33 to rotate around the axis of the heat dissipation shaft 32. The heat transfer shaft 312 positions the rotating heat dissipation shaft 32 through the positioning groove 3121, making the heat dissipation shaft 32 more stable during rotation. During the rotation of the heat sink 33, the air flow inside the lamp cover 1 is accelerated, thereby increasing the amount of air in contact with the heat sink 33, which further reduces the risk of the LED chip 2 overheating during operation.

[0039] Reference Figure 2 and Figure 3A rotary switch 4 is provided at the bottom of the positioning groove 3121. The rotary switch 4 is used to push the heat dissipation shaft 32 away from the heat transfer shaft 312 when the temperature of the heat transfer shaft 312 exceeds a predetermined value. In this embodiment, the rotary switch 4 is a memory metal block. One end of the memory metal block is connected to the bottom of the positioning groove 3121, and the other end of the memory metal block is connected to the end of the heat dissipation shaft 32 away from the power component 34. The power component 34 includes a motor 341, and a proximity switch 342 is provided on the outer wall of the side of the motor 341 facing the heat dissipation shaft 32. The proximity switch 342 is electrically connected to the motor 341. In this embodiment, the proximity switch 342 is a distance sensor. A positioning hole 321 is provided on the side of the heat dissipation shaft 32 facing the motor 341. The output shaft of the motor 341 is slidably connected to the heat dissipation shaft 32 through the positioning hole 321, and the extension direction of the axis of the output shaft of the motor 341 coincides with the axis of the heat dissipation shaft 32.

[0040] When the LED chip 2 operates for a long time and the temperature exceeds a predetermined value, the rotary switch 4 pushes the heat dissipation shaft 32 away from the heat transfer shaft 312. The end of the heat dissipation shaft 32 facing the motor 341 is close to the distance sensor on the motor 341. After the distance between the end of the heat dissipation shaft 32 and the distance sensor reaches a certain predetermined value, the proximity switch 342 opens. Then, the proximity switch 342 controls the output shaft of the motor 341 to rotate around the axis of the heat dissipation shaft 32, thereby driving the heat sink 33 connected to the heat dissipation shaft 32 to rotate around the axis of the heat dissipation shaft 32. At the same time, after the rotary switch 4 pushes the heat dissipation shaft 32 away from the heat transfer shaft 312, a certain gap is generated between the heat sink 33 and the heat transfer plate 311, reducing the friction between the heat sink 33 and the heat transfer plate 311 when the heat sink 33 rotates around the axis of the heat dissipation shaft 32.

[0041] Reference Figure 2 and Figure 3 A heat transfer fluid 3114 is placed inside the heat transfer groove 3111. In this embodiment, the heat transfer fluid 3114 is silicone oil. After a certain gap is formed between the heat sink 33 and the heat transfer plate 311, the heat transfer plate 311 comes into contact with the silicone oil. The silicone oil has low viscosity and good thermal conductivity. The heat transfer plate 311 transfers heat to the heat sink 33 through the silicone oil. This reduces the friction between the heat sink 33 and the heat transfer plate 311 when the heat sink 33 rotates around the axis of the heat dissipation shaft 32, while improving the heat transfer efficiency between the heat transfer plate 311 and the heat sink 33. This, to a certain extent, accelerates the cooling speed of the LED chip 2.

[0042] Reference Figure 2 and Figure 4The heat transfer plate 311 has a first heat dissipation hole 3112 and a second heat dissipation hole 3113 on the outer wall of the side facing the heat sink 33. The first heat dissipation hole 3112 is provided with a first heat dissipation component 51 for sending air from the side of the heat transfer plate 311 facing the heat sink 33 into the side of the heat transfer plate 311 facing the LED chip 2 when the heat dissipation shaft 32 rotates. The second heat dissipation hole 3113 is provided with a second heat dissipation component 52 for sending air from the side of the heat transfer plate 311 facing the LED chip 2 into the side of the heat transfer plate 311 facing the heat sink 33 when the heat dissipation shaft 32 rotates. The first heat dissipation component 51 includes a first heat dissipation shaft 511 and the first heat dissipation shaft 511... A first row of heat exchange fins 512 are distributed around the perimeter of the heat transfer plate 311. The first row of heat exchange fins 512 bends toward the side of the heat transfer plate 311 facing the LED chip 2. When the heat dissipation shaft 32 rotates, the first row of heat exchange shafts 511 drives the first row of heat exchange fins 512 to rotate around the axis of the first row of heat exchange shafts 511. A second row of heat exchange components 52 are provided in the second row of heat exchange holes 3113. The second row of heat exchange components 52 includes a second row of heat exchange shafts 521 and a second row of heat exchange fins 522 are distributed around the second row of heat exchange shafts 521. The second row of heat exchange fins 522 bends toward the side of the heat transfer plate 311 away from the LED chip 2. When the heat dissipation shaft 32 rotates, the second row of heat exchange shafts 521 drives the second row of heat exchange fins 522 to rotate around the axis of the second row of heat exchange shafts 521.

[0043] During the rotation of the heat dissipation shaft 32, the first row of heat dissipation shafts 511 drives the first row of heat dissipation fan blades 512 to rotate around the axis of the first row of heat dissipation shafts 511. This causes the first row of heat dissipation fan blades 512 to deliver air from the side of the heat transfer plate 311 facing the heat sink 33 to the side of the heat transfer plate 311 facing the LED chip 2 during rotation. Simultaneously, the second row of heat dissipation shafts 521 drives the first row of heat dissipation fan blades 512 to rotate around the axis of the second row of heat dissipation shafts 521. This causes the second row of heat dissipation fan blades 522 to deliver air from the side of the heat transfer plate 311 facing the LED chip 2 during rotation. On the side of heat transfer plate 311 facing heat sink 33, air reaches the vicinity of LED chip 2 through the first row of heat holes 3112 and the first row of heat elements 51 and comes into contact with LED chip 2. Then, it leaves the side of heat transfer plate 311 facing LED chip 2 through the second row of heat holes 3113 and the second row of heat elements 52. This increases the amount of air in contact with LED chip 2, allowing air to continuously carry away the heat generated on LED chip 2 through the first row of heat holes 3112 and the second row of heat holes 3113, thereby accelerating the cooling speed of LED chip 2 to a certain extent.

[0044] Reference Figure 2 and Figure 3The heat sink 33 is connected to an internal gear 53 on the side facing the heat transfer plate 311, and the axis of the internal gear 53 extends in the same direction as the axis of the heat dissipation shaft 32; the end of the first row of heat shafts 511 away from the LED chip 2 is connected to a first external gear 513, and the axis of the first external gear 513 extends in the same direction as the axis of the first row of heat shafts 511, and the internal gear 53 meshes with the first external gear 513; the end of the second row of heat shafts 521 away from the LED chip 2 is connected to a second external gear 523, and the axis of the second external gear 523 extends in the same direction as the axis of the second row of heat shafts 521, and the internal gear 53 meshes with the second external gear 523.

[0045] During the rotation of the heat dissipation shaft 32, the internal gear 53 connected to the heat transfer plate 311 rotates around the axis of the heat dissipation shaft 32. During the rotation of the internal gear 53, the first external gear 513 rotates around the axis of the first row of heat shafts 511, and at the same time, the second external gear 523 rotates around the axis of the second row of heat shafts 521. This causes the first row of heat shafts 511 to drive the first row of heat fan blades 512 to rotate around the axis of the first row of heat shafts 511, and the second row of heat shafts 521 to drive the second row of heat fan blades 522 to rotate around the axis of the second row of heat shafts 521.

[0046] Reference Figure 2 and Figure 3 The heat sink 33, heat dissipation shaft 32 and heat transfer component 31 are made of copper-aluminum composite plate. The copper-aluminum composite plate is a heat-conducting plate made of copper and aluminum. It retains the thermal conductivity of copper and has the lightweight and cost advantages of aluminum, thereby reducing the manufacturing cost of lighting fixtures to a certain extent.

[0047] The implementation principle of an LED lighting fixture according to an embodiment of this application is as follows: The heat generated by the LED chip 2 during operation is transferred through the heat transfer sheet 311 to the heat sink 33 in contact with the pre-transfer sheet. The heat sink 33 then transfers the heat to the air through the heat dissipation holes 11, reducing the risk of overheating of the LED chip 2 during operation to a certain extent. When the LED chip 2 exceeds a predetermined temperature due to prolonged operation, the power component 34 operates, driving the heat sink 33 to rotate around the axis of the heat dissipation shaft 32. The heat transfer shaft 312 positions the rotating heat dissipation shaft 32 through the positioning groove 3121, making the heat dissipation shaft 32 more stable during rotation. The rotation of the heat sink 33 accelerates the lamp's operation. The airflow inside the cover 1 increases the amount of air in contact with the heat sink 33, thereby further reducing the risk of overheating of the LED chip 2 during operation. During the rotation of the heat dissipation shaft 32, the first row of heat transfer elements 51 sends air from the side of the heat transfer element 311 facing the heat sink 33 into the side of the heat transfer element 311 facing the LED chip 2. After the air comes into contact with the LED chip 2, it leaves the side of the heat transfer element 311 facing the LED chip 2 through the second row of heat holes 3113 and the second row of heat shaft 521. This allows the air to continuously carry away the heat generated on the LED chip 2 through the first row of heat holes 3112 and the second row of heat holes 3113, thereby accelerating the cooling speed of the LED chip 2 to a certain extent.

[0048] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be included within the scope of protection of this application.

Claims

1. An LED lighting fixture, characterized in that: The lamp includes a lampshade (1), in which an LED chip (2) and a heat dissipation assembly (3) are installed. The heat dissipation assembly (3) includes a heat transfer element (31), one side of which is connected to the LED chip (2). A heat dissipation shaft (32) is rotatably connected to the side of the heat transfer element (31) away from the LED chip (2), and heat sinks (33) are connected to the outer walls of the heat dissipation shaft (32). The edge of the heat sink (33) is in contact with the side of the heat transfer element (31) away from the LED chip (2). A power element (34) is connected to the end of the heat dissipation shaft (32) away from the heat transfer element (31). The power element (34) is used to drive the heat dissipation shaft (32) and the heat sinks (33) connected to the heat dissipation shaft (32) to rotate around the axis of the heat dissipation shaft (32) when the temperature of the LED chip (2) exceeds a predetermined value. A heat dissipation hole (11) is opened on the outer wall of the lampshade (1) to connect to the inner wall of the lampshade (1). The heat transfer element (31) includes a heat transfer plate (311) and one side of the heat transfer plate (311) is connected to the LED chip (2). The side of the heat transfer plate (311) away from the LED chip (2) is connected to a heat transfer shaft (312), and a positioning groove (3121) is provided on the outer wall of the end of the heat transfer shaft (312) away from the heat transfer plate (311). The heat dissipation shaft (32) passes through the positioning groove (3121) and is inserted into the heat transfer shaft (312), and the groove wall of the positioning groove (3121) is in contact with the outer wall of the heat dissipation shaft (32). The bottom of the positioning groove (3121) is provided with a rotary switch (4). The rotary switch (4) is used to push the heat dissipation shaft (32) away from the heat transfer shaft (312) when the temperature of the heat transfer shaft (312) exceeds a predetermined value. The power component (34) includes a motor (341) and a proximity switch (342) is provided on the outer wall of the side of the motor (341) facing the heat dissipation shaft (32). The proximity switch (342) is electrically connected to the motor (341). The output shaft of the motor (341) is slidably connected to the heat dissipation shaft (32) and the extension direction of the output shaft of the motor (341) coincides with the axis of the heat dissipation shaft (32). The rotary switch (4) is a memory metal block.

2. The LED lighting fixture according to claim 1, characterized in that: The heat transfer plate (311) has a heat transfer groove (3111) on the outer wall of one side facing the heat sink (33). The edge of the heat sink (33) is in contact with the bottom of the heat transfer groove (3111). A heat-conducting fluid (3114) is placed in the heat transfer groove (3111).

3. The LED lighting fixture according to claim 1, characterized in that: The heat transfer plate (311) has a first heat dissipation hole (3112) and a second heat dissipation hole (3113) on the outer wall of one side facing the heat sink (33). The first heat dissipation hole (3112) is provided with a first heat dissipation component (51) for sending air from the side of the heat transfer plate (311) facing the heat sink (33) into the side of the heat transfer plate (311) facing the LED chip (2) when the heat dissipation shaft (32) rotates.

4. The LED lighting fixture according to claim 3, characterized in that: The first heat dissipation component (51) includes a first heat shaft (511) and a first heat fan blade (512) is distributed around the first heat shaft (511). The first heat fan blade (512) bends toward the side of the heat transfer plate (311) facing the LED chip (2). When the heat dissipation shaft (32) rotates, the first heat shaft (511) drives the first heat fan blade (512) to rotate around the axis of the first heat shaft (511).

5. An LED lighting fixture according to claim 4, characterized in that: The heat sink (33) is connected to an internal gear (53) on the side facing the heat transfer plate (311), and the axis of the internal gear (53) extends in the same direction as the axis of the heat dissipation shaft (32); the end of the first row of heat shafts (511) away from the LED chip (2) is connected to a first external gear (513), and the axis of the first external gear (513) extends in the same direction as the axis of the first row of heat shafts (511), and the internal gear (53) meshes with the first external gear (513).

6. An LED lighting fixture according to claim 3, characterized in that: The second heat-generating hole (3113) is provided with a second heat-generating component (52). The second heat-generating component (52) includes a second heat-generating shaft (521) and second heat-generating fan blades (522) are distributed around the second heat-generating shaft (521). The second heat-generating fan blades (522) bend toward the side of the heat transfer plate (311) away from the LED chip (2). When the heat dissipation shaft (32) rotates, the second heat-generating shaft (521) drives the second heat-generating fan blades (522) to rotate around the axis of the second heat-generating shaft (521).

7. An LED lighting fixture according to claim 2, characterized in that: The heat-conducting fluid (3114) is silicone oil.

8. An LED lighting fixture according to claim 1, characterized in that: The heat sink (33) is made of copper-aluminum composite plate.

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