Chip cooling device

Abstract

The present disclosure relates to the field of chip heat dissipation technology, and provides a chip heat dissipation device, which includes: a chip assembly, a heat-conducting cover, a semiconductor refrigerator and a heat sink; the heat-conducting cover is arranged on the chip assembly, and is used to conduct heat for the chip assembly; the cooling surface of the semiconductor refrigerator is arranged on the side of the heat-conducting cover away from the chip assembly, and is used to cool the heat-conducting cover; the heat sink is arranged on the heating surface of the semiconductor refrigerator, and is used to dissipate heat for the semiconductor refrigerator; wherein the heat-conducting cover, the semiconductor refrigerator and the heat sink form a vertically arranged thin heat dissipation structure. The chip heat dissipation device arranges the heat-conducting cover, the semiconductor refrigerator and the heat sink structure on the chip assembly in sequence, wherein the heat-conducting cover can conduct heat to the chip, the semiconductor refrigerator actively dissipates heat for the chip, and the heat sink passively dissipates heat for the chip, thereby forming a vertically arranged ultra-thin heat dissipation structure.

Description

Technical Field

[0001] The present disclosure relates to the technical field of chip heat dissipation, and in particular to a chip heat dissipation device. Background Art

[0002] Traditional chip cooling solutions include: Air cooling: To improve cooling efficiency, air-cooled radiators often require larger sizes or higher fan speeds, resulting in increased noise; these two factors are unbalanced. Liquid cooling: To improve cooling efficiency, liquid cooling often requires sealed piping, which increases construction and maintenance costs. The use of non-conductive coolant further increases costs. Using water as a coolant is unreliable, and leaks can damage chips and other electronic components. Whether dissipating heat to air or water, liquid cooling solutions suffer from bulk, weight, and high costs. Passive cooling: To improve cooling efficiency, passive cooling solutions require increasing the heat sink area and improving the heat sink material, which increases size and cost. Compressor cooling and semiconductor cooling: Compressors and semiconductor cooling use energy to transfer heat from one end to the other. However, if not properly controlled, if the temperature at the lower end falls below the air temperature, water vapor in the air can condense into water droplets. Since the lower end often comes into direct contact with the chip, this can damage the chip.

[0003] The above-mentioned traditional chip cooling solutions have irreconcilable contradictions between cooling efficiency, volume, noise, safety and cost. Previous solutions often cannot take these issues into account.

[0004] Based on this, a technical solution for a chip heat dissipation device is urgently needed to solve the above problems. Summary of the Invention

[0005] In order to solve one or more technical problems mentioned in the background technology, the solution disclosed in the present invention provides a chip heat dissipation device.

[0006] According to one aspect of an embodiment of the present disclosure, a chip heat dissipation device is provided, comprising: a chip assembly, a heat-conducting cover, a semiconductor cooler, and a heat sink. The heat-conducting cover is disposed on the chip assembly to conduct heat to the chip assembly; the cooling surface of the semiconductor cooler is disposed on a side of the heat-conducting cover away from the chip assembly to cool the heat-conducting cover; the heat sink is disposed on the heating surface of the semiconductor cooler to dissipate heat from the semiconductor cooler; wherein the heat-conducting cover, the semiconductor cooler, and the heat sink form a thin, vertically arranged heat dissipation structure.

[0007] In some embodiments, the chip assembly includes: a PCB circuit board and a chip. The PCB circuit board is provided with a chip slot, a first interface, and a second interface; the chip is disposed in the chip slot; and the semiconductor cooler is connected to the first interface via a power supply line.

[0008] In some embodiments, the chip assembly further includes a thermal conductor, which is coated on the chip to improve the heat conduction efficiency of the chip.

[0009] In some embodiments, the heat conductive cover is a hollow plate structure, and the opening of the heat conductive cover faces the chip assembly and covers the chip.

[0010] In some embodiments, the chip heat dissipation device further includes: an elastic sealing ring, and the thermal conductive cover is tightly attached to the PCB circuit board outside the chip slot through the elastic sealing ring to seal the chip.

[0011] In some embodiments, the chip heat dissipation device further includes: a temperature sensor, which is disposed on the inner side of the heat conductive cover and connected to the second interface, and is used to measure the real-time temperature of the chip and feed back the temperature signal to the PCB circuit board.

[0012] In some embodiments, the thermally conductive cover further includes a groove structure formed at the bottom of the inner side of the thermally conductive cover to accommodate condensed water formed in the thermally conductive cover when the temperature sensor fails.

[0013] In some embodiments, the semiconductor cooler is placed under the chip to prevent condensed water from flowing onto the chip or PCB circuit board when the temperature sensor fails.

[0014] In some embodiments, the heat sink is larger than the semiconductor cooler and is in close contact with the heating surface of the semiconductor cooler, so as to improve the heat dissipation efficiency by increasing the temperature of the heat sink.

[0015] In some embodiments, the thermally conductive cover can wrap the PCB circuit board.

[0016] The chip heat dissipation device provided by the embodiments of the present disclosure can achieve the following technical effects:

[0017] This application fully considers the heat dissipation efficiency, volume, noise, safety and cost, and arranges the thermal cover, semiconductor cooler and heat sink structure on the chip assembly in sequence, wherein the thermal cover can conduct heat to the chip, the semiconductor cooler actively dissipates heat for the chip, and the heat sink passively dissipates heat for the chip, thereby forming a vertically arranged ultra-thin heat dissipation structure.

[0018] A temperature sensor located on the inner surface of the heat conductive cover is used to control the semiconductor cooler to avoid overcooling problems.

[0019] The heat conductive cover seals the chip through an elastic sealing ring, forming a relatively sealed space when the heat conductive cover is a hollow structure, so as to prevent water vapor from being infinitely introduced and forming excessive condensed water when the temperature sensor fails.

[0020] A groove structure is set inside the thermal cover to accommodate a small amount of condensed water when the temperature sensor fails, providing additional safety redundancy.

[0021] The semiconductor cooler is placed under the chip to prevent condensed water from flowing onto the chip or PCB circuit board when the temperature sensor fails.

[0022] For passive heat dissipation, the heat dissipation efficiency is improved by increasing the temperature of the heat sink to achieve a more efficient passive heat dissipation solution.

[0023] The thermal cover can be designed to completely wrap the PCB circuit board to prevent the possibility of condensation water forming on the other side of the PCB circuit board (the side without the chip to be cooled) in the event of a temperature sensor failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an illustrative and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0025] Figure 1 is an exploded view showing a chip heat dissipation device according to one embodiment of the present disclosure;

[0026] Figure 2 is a side view showing a chip heat dissipation device according to one embodiment of the present disclosure;

[0027] Figure 3 is a cross-sectional view illustrating a thermally conductive cover according to an embodiment of the present disclosure.

[0028] Reference numerals:

[0029] 1. Chip assembly; 11. PCB circuit board; 111. Chip slot; 112. First interface; 113. Second interface; 12. Chip; 13. Thermal conductor;

[0030] 2. Thermal conductive cover; 21. Groove structure;

[0031] 3. Semiconductor refrigerator;

[0032] 4. Heat sink;

[0033] 5. Elastic sealing ring;

[0034] 6. Temperature sensor; DETAILED DESCRIPTION

[0035] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0036] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present application belongs.

[0037] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0038] Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of this application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of layers and regions is exaggerated, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0039] Figure 1 FIG. 1 is an exploded view illustrating a chip heat dissipation device according to an embodiment of the present disclosure. Figure 2 FIG. 1 is a side view showing a chip heat dissipation device according to an embodiment of the present disclosure.

[0040] like Figures 1 to 2As shown, an embodiment of the present disclosure provides a chip heat dissipation device, which includes a chip assembly 1, a heat-conducting cover 2, a semiconductor cooler 3, and a heat sink 4. The heat-conducting cover 2 is disposed over the chip assembly 1 to conduct heat to the chip assembly 1; the cooling surface of the semiconductor cooler 3 is disposed on the side of the heat-conducting cover 2 away from the chip assembly 1 to cool the heat-conducting cover 2; the heat sink 4 is disposed on the heating surface of the semiconductor cooler 3 to dissipate heat from the semiconductor cooler 3; the heat-conducting cover 2, the semiconductor cooler 3, and the heat sink 4 form a vertically arranged thin heat dissipation structure.

[0041] According to this technical solution, the heat-conducting cover 2 is a hood-type heat-conducting cover that can efficiently conduct the heat from the chip assembly 1. The use of the semiconductor cooler 3 can realize active heat dissipation of heat conducted from the chip assembly 1 to the heat-conducting cover 2. The heat sink 4 uses passive heat dissipation to dissipate heat. The heat-conducting cover 2, the semiconductor cooler 3 and the heat sink 4 can be arranged vertically on the chip assembly 1, or other arrangements can be adopted. The thin heat dissipation structure or the ultra-thin heat dissipation structure is relative to traditional heat dissipation structures such as air cooling, liquid cooling, passive cooling, compressor cooling and semiconductor cooling.

[0042] like Figures 1 to 2 As shown, in a preferred embodiment, the chip assembly 1 includes: a PCB circuit board 11 and a chip 12, the PCB circuit board 11 is provided with a chip slot 111, a first interface 112 and a second interface 113; the chip 12 is arranged in the chip slot 111; wherein, the semiconductor cooler 3 is connected to the first interface 112 through a power supply line.

[0043] In this embodiment, the PCB 11 is a conventional printed circuit board. A chip slot 111 is located in the center of the PCB 11. This slot can be rectangular or rectangular to accommodate the shape of the chip 12. A first interface 112 is provided on one side of the slot 111. The power cable of the semiconductor cooler 3 is plugged into the first interface 112 to electrically connect to the PCB 11. The semiconductor cooler 3 actively increases the temperature difference, thereby improving the efficiency of heat dissipation to the air, reducing the size, and reducing noise.

[0044] like Figures 1 to 2 As shown, in a preferred embodiment, the chip assembly 1 further includes: a thermal conductor 13 , which is coated on the chip 12 to improve the heat conduction efficiency of the chip 12 .

[0045] According to this embodiment, the thermal conductive agent 13 can be a conventional thermal conductive agent. The thermal conductive agent 13 is evenly coated on the surface of the chip 12, mainly used to accelerate the heat conduction of the chip 12 and improve the heat conduction efficiency.

[0046] like Figures 1 to 2As shown, in a preferred embodiment, the heat conductive cover 2 is a hollow plate structure, with its opening facing the chip assembly 1 and covering the chip 12 .

[0047] According to this embodiment, the heat-conducting cover 2 is preferably a housing with a rectangular parallelepiped structure. The heat-conducting cover 2 has an opening, which is exactly opposite to the chip 12 to cover the chip 12 to form a sealed space.

[0048] like Figures 1 to 2 As shown, in a preferred embodiment, the chip heat dissipation device further includes: an elastic sealing ring 5 , and the heat conductive cover 2 is tightly attached to the PCB circuit board 11 outside the chip slot 111 through the elastic sealing ring 5 to seal the chip 12 .

[0049] According to this embodiment, the elastic sealing ring 5 is located outside the chip slot 111 and pressed against the PCB circuit board 11. The thermal cover 2 is pressed against the outside of the chip slot 111 by the elastic sealing ring 5, so that the chip 12 is sealed in the space of the thermal cover 2.

[0050] like Figures 1 to 2 As shown, in a preferred embodiment, the chip heat dissipation device further includes: a temperature sensor 6, which is arranged on the inner side of the heat conductive cover 2 and connected to the second interface 113, for measuring the real-time temperature of the chip 12 and feeding back the temperature signal to the PCB circuit board 11.

[0051] According to this embodiment, the temperature sensor 6 can be fixed to the inner wall of the cavity of the heat-conductive cover 2 and electrically connected to the second interface 113. The PCB circuit board 11 can stop supplying power to the semiconductor cooler 3 via the power supply line when the temperature signal generated by the temperature sensor 6 is lower than room temperature, and can start supplying power to the semiconductor cooler 3 via the power supply line when the temperature signal generated by the temperature sensor 6 is higher than room temperature.

[0052] Figure 3 is a cross-sectional view illustrating a heat-conductive cover 2 according to an embodiment of the present disclosure.

[0053] like Figure 3 As shown, in a preferred embodiment, the heat-conducting cover 2 further includes a groove structure 21 formed at the bottom of the inner side of the heat-conducting cover 2 to accommodate condensed water formed in the heat-conducting cover 2 when the temperature sensor 6 fails.

[0054] According to this embodiment, groove structures 21 are arranged in rows at the bottom of the inner side of thermal cover 2. If temperature sensor 6 fails, water vapor in the air inside thermal cover 2 condenses on the inner surface of thermal cover 2, forming condensed water that flows into groove structures 21 and is temporarily stored there. This groove structure 21 can accommodate a small amount of condensed water, providing a protective design in the event of temperature sensor 6 failure.

[0055] like Figures 1 to 2As shown, in a preferred embodiment, the semiconductor cooler 3 is placed under the chip 12 to prevent condensed water from flowing onto the chip 12 or the PCB circuit board 11 when the temperature sensor 6 fails.

[0056] According to this embodiment, the top of the semiconductor cooler 3 is positioned lower than the chip 12 and the thermal conductor 13, ensuring that the condensed water that may form on the inner surface of the thermal cover 2 when the temperature sensor 6 fails and the water vapor in the air inside the thermal cover 2 will not flow onto the chip 12 and other devices.

[0057] like Figures 1 to 2 As shown, in a preferred embodiment, the heat sink 4 is larger than the semiconductor refrigerator 3 and is in close contact with the heating surface of the semiconductor refrigerator 3 to improve the heat dissipation efficiency by increasing the temperature of the heat sink 4.

[0058] According to this embodiment, the heat sink 4 is a passive heat dissipation method. Based on the passive heat dissipation solution, by bringing more heat to the heat sink 4, the heat transfer to the air is accelerated by increasing the temperature difference between the heat sink 4 and the air, which is more efficient than a purely passive heat dissipation solution.

[0059] like Figures 1 to 2 As shown, in a preferred embodiment, the heat conductive cover 2 can wrap the PCB circuit board 11 .

[0060] According to this embodiment, the heat conductive cover 2 can be designed to completely wrap the PCB circuit board 11, eliminating the possibility of condensation water forming on the other side of the PCB circuit board 11 (the side without the chip to be cooled) when the temperature sensor 6 fails.

[0061] In a preferred embodiment of the present disclosure, a rectangular frame is secured to the upper region of a cuboid, thin-walled PCB circuit board 11, forming a chip slot 111. A chip 12 is positioned in the middle region of chip slot 111. One side of chip 12 is secured against chip slot 111, while the opposite side is coated with a thermal conductive agent 13 to enhance thermal conductivity. A first interface 112 is provided below and to the side of chip 12 within chip slot 111 for electrically connecting temperature sensor 6 to PCB circuit board 11. Four threaded holes are symmetrically drilled at the four corners of PCB circuit board 11. A second interface 113 is provided at the lower left corner of PCB circuit board 11 for electrically connecting semiconductor cooler 3 to PCB circuit board 11. The thermal conductive cover 2 is also a cuboid, thin-walled plate. The front portion of the thermal conductive cover 2 has a raised portion that aligns with and snaps onto the elastic sealing ring 5. The thermal conductive cover 2 is hollow and has a groove structure 21 within it. After the raised portion of the thermal cover 2 is buckled onto the elastic sealing ring 5, it is tightly attached to the PCB 11 via the elastic sealing ring 5, forming a sealed space. This ensures that the interior of the thermal cover 2 remains relatively sealed despite the thermal expansion and contraction of different materials. The thermal cover 2 is sized to match the PCB 11, and four through holes are symmetrically provided at its four corners, the positions of which correspond to the positions of the four threaded holes. This allows four screws to pass through the four through holes and screw into the four threaded holes, thereby joining the thermal cover 2 and the PCB 11 together. A temperature sensor 6 is provided within the interior space of the thermal cover 2 and is connected to the first interface 112 via an electrical wire. The rear surface of the thermal cover 2 is in close contact with the cooling surface of the semiconductor cooler 3 to enhance the cooling effect. The top of the semiconductor cooler 3 is lower than the bottom of the chip 12. The semiconductor cooler 3 is connected to the second interface 113 via an electrical wire. The temperature sensor 6 detects the temperature of the chip 12 in real time and establishes a connection with the PCB circuit board 11. When the PCB circuit board 11 receives a temperature signal lower than room temperature transmitted by the temperature sensor 6, it controls the semiconductor cooler 3 to stop working. Similarly, the PCB circuit board 11 starts the semiconductor cooler 3 after receiving a temperature signal higher than room temperature transmitted by the temperature sensor 6. When the temperature sensor 6 fails, the condensed water can be collected in the groove structure 21 in a short time to protect the chip 12. The heating surface of the semiconductor cooler 3 is in close contact with the heat sink 4. The heat sink 4 provides passive heat dissipation. In addition, the PCB circuit board 11, the heat-conducting cover 2, the semiconductor cooler 3 and the heat sink 4 form a vertically arranged ultra-thin heat dissipation structure.

[0062] Air cooling of the chip 12 is stable and reliable, but it is bulky and noisy. To keep the chip 12 cool, a larger size or noise level is required. The air cooling solution uses heat transfer to the air. The present disclosure utilizes a semiconductor cooler 3 to actively increase the temperature difference, thereby improving the efficiency of heat dissipation to the air, reducing size, and reducing noise.

[0063] Liquid cooling solutions for the chip 12 are expensive or unreliable. Low-cost liquid cooling solutions can damage electronic devices such as the chip 12 when leaking. The present invention does not use cooling liquid and has the advantages of small size, light weight, and low cost.

[0064] The passive heat dissipation solution for chip 12 has low heat dissipation efficiency and cannot guarantee effective cooling of chip 12. The present disclosure can accelerate the conduction of heat to the air by bringing more heat to the heat sink 4 based on the passive heat dissipation solution, thereby increasing the temperature difference between the heat sink 4 and the air. This is more efficient than a purely passive heat dissipation solution.

[0065] Compressor refrigeration and semiconductor refrigeration pose temperature control risks. The present invention utilizes temperature sensor 6 for temperature control, a sealing structure formed by a sealing ring and a hood-like heat-conducting cover 2, a staggered arrangement where the cooling end is lower than the chip 12, and a recessed design within the heat-conducting cover 2. These methods ensure the safety of the chip 12 and other devices, eliminating the need for costly airtightness-enhancing processing techniques and resulting in a safe, reliable, ultra-thin, and efficient heat dissipation device.

[0066] This application fully considers the heat dissipation efficiency, volume, noise, safety and cost, and arranges the thermal cover 2, semiconductor cooler 3 and heat sink 4 structures on the chip assembly 1 in sequence, wherein the thermal cover 2 can conduct heat to the chip 12, the semiconductor cooler 3 actively dissipates heat for the chip 12 and the heat sink 4 passively dissipates heat for the chip 12, thereby forming a vertically arranged ultra-thin heat dissipation structure.

[0067] A temperature sensor 6 located on the inner surface of the heat-conducting cover 2 is used to control the semiconductor refrigerator 3 to avoid overcooling problems.

[0068] The heat conductive cover 2 seals the chip 12 through the elastic sealing ring 5, forming a relatively sealed space when the heat conductive cover 2 is a hollow structure, so as to prevent water vapor from being infinitely introduced and forming excessive condensed water when the temperature sensor 6 fails.

[0069] A groove structure 21 is provided inside the heat-conducting cover 2 to accommodate a small amount of condensed water when the temperature sensor 6 fails, thereby providing additional safety redundancy.

[0070] The semiconductor cooler 3 is placed under the chip 12 so that condensed water will not flow onto the chip 12 or the PCB circuit board 11 when the temperature sensor 6 fails.

[0071] For passive heat dissipation, the heat dissipation efficiency is improved by increasing the temperature of the heat sink 4 to achieve a more efficient passive heat dissipation solution.

[0072] The present application ensures the safety of the chip 12 and other equipment by controlling the temperature with a temperature sensor 6, forming a sealing structure with an elastic sealing ring 5 and a heat-conducting cover 2, staggering the cooling end below the chip 12, and designing a groove structure 12 below the inside of the heat-conducting cover 2. A safe, reliable, ultra-thin, and efficient heat dissipation device can be formed without using a high-cost processing technology to ensure airtightness.

[0073] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0074] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned steps / processes does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. In addition, the serial numbers of the embodiments of the present application mentioned above are only for description and do not represent the advantages and disadvantages of the embodiments.

[0075] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0076] The foregoing description is merely a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present disclosure shall be included within the scope of protection of the present disclosure.

Claims

1. A chip heat dissipation device, characterized in that: include: Chip components; A heat-conducting cover, which is disposed on the chip assembly and is used to conduct heat to the chip assembly; A semiconductor refrigerator, wherein a cooling surface of the semiconductor refrigerator is arranged on a side of the heat-conducting cover away from the chip assembly, and is used to cool the heat-conducting cover; A heat sink, which is arranged on the heating surface of the semiconductor refrigerator and is used to dissipate heat for the semiconductor refrigerator; Wherein, the heat-conducting cover, the semiconductor refrigerator and the heat sink form a thin heat dissipation structure arranged vertically; The chip assembly further includes: a heat conductor, which is coated on the chip to improve the heat conduction efficiency of the chip; The heat-conducting cover is a hollow plate structure; A temperature sensor, which is disposed inside the heat-conducting cover and is used to measure the real-time temperature of the chip; The heat conductive cover further comprises a groove structure formed at the bottom of the inner side of the heat conductive cover, wherein the groove structure is arranged in a row at the bottom of the inner side of the heat conductive cover to accommodate condensed water formed in the heat conductive cover when the temperature sensor fails.

2. The chip heat dissipation device according to claim 1, characterized in that: The chip assembly comprises: A PCB circuit board, wherein the PCB circuit board is provided with a chip slot, a first interface and a second interface; A chip, wherein the chip is disposed in the chip slot; Wherein, the semiconductor refrigerator is connected to the first interface via a power supply line.

3. The chip heat dissipation device according to claim 2, characterized in that: The opening of the heat conductive cover faces the chip assembly and covers the chip.

4. The chip heat dissipation device according to claim 3, characterized in that: Also includes: An elastic sealing ring is used to tightly adhere the heat-conducting cover to the PCB circuit board outside the chip slot to seal the chip.

5. The chip heat dissipation device according to claim 3, characterized in that: The temperature sensor is connected to the second interface and feeds back a temperature signal to the PCB circuit board.

6. The chip heat dissipation device according to claim 5, characterized in that: The semiconductor refrigerator is placed under the chip to prevent condensed water from flowing onto the chip or the PCB circuit board when the temperature sensor fails.

7. The chip heat dissipation device according to claim 1, characterized in that: The heat sink is larger in volume than the semiconductor refrigerator and is in close contact with the heating surface of the semiconductor refrigerator, so as to improve the heat dissipation efficiency by increasing the temperature of the heat sink.

8. The chip heat dissipation device according to any one of claims 2 to 6, characterized in that: The heat conductive cover can wrap the PCB circuit board.

Images