Wafer storage container cleaning apparatus

Abstract

The present invention inhibits the entry of cleaning liquid into the interior space of the door. The wafer container cleaning apparatus of the embodiments is a wafer container cleaning apparatus that cleans the door of a wafer container, the door of the wafer container having a keyhole in one face, the keyhole being capable of switching between locking / unlocking with the main body of the wafer container by being rotated in a state in which a latch key is inserted, a protrusion hole for the latch to protrude when locked being formed in the side face, the wafer container cleaning apparatus including: a door holding portion that holds the door; a cleaning liquid nozzle that supplies cleaning liquid to the other face of the door; and a gas nozzle that generates a flow of gas that hinders the intrusion of the cleaning liquid from the protrusion hole when at least the cleaning liquid is supplied to the door from the cleaning liquid nozzle.

Description

Technical Field

[0001] The present invention relates to a wafer storage container cleaning device. Background Technology

[0002] Conventional wafer storage container cleaning apparatuses exist for cleaning wafer storage containers such as front-opening unified pods (FOUPs) or front-opening shipping boxes (FOSBs) that hold semiconductor wafers. The wafer storage container includes: a main body for storing semiconductor wafers; and a door that can be opened and closed relative to the main body. A hole is formed on the side of the door for a latch to protrude and connect to the main body. Furthermore, the latch is slidable inside the door, thus creating an internal space communicating with the hole. The door is connected to the main body by engaging the latch protruding from the door. The door is separated (disassembled) from the wafer storage container by releasing the latch from the main body.

[0003] [Existing Technical Documents]

[0004] [Patent Literature]

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-109523 Summary of the Invention

[0006] [The problem the invention aims to solve]

[0007] In a wafer storage container cleaning apparatus, cleaning fluid is sprayed onto the wafer storage container body and the door while they are separated, thereby cleaning the wafer storage container body and the door. However, sometimes the cleaning fluid may enter the internal space through holes formed on the side of the door, resulting in liquid residue.

[0008] The present invention was made to solve the aforementioned problems, and its object is to provide a chip storage container cleaning device that can prevent liquid from entering the internal space of the door.

[0009] [Technical means to solve the problem]

[0010] To address the aforementioned issues and achieve the objective, one aspect of the present invention provides a wafer storage container cleaning apparatus for cleaning the door of a wafer storage container. The door of the wafer storage container has a keyhole on one side, which can be switched between locking and unlocking with the main body of the wafer storage container by rotating it while a latch key is inserted. A protruding hole is formed on the side for the latch to protrude when locked. The wafer storage container cleaning apparatus includes: a door retainer for retaining the door; a cleaning fluid nozzle for supplying cleaning fluid to the other side of the door; and a gas nozzle that generates gas flow to prevent the cleaning fluid from entering through the protruding hole when the cleaning fluid is supplied to the door, at least from the cleaning fluid nozzle.

[0011] [The effects of the invention]

[0012] With one embodiment of the present invention, liquid can be prevented from entering the internal space of the door. Attached Figure Description

[0013] Figure 1 This is a plan view illustrating an example of the schematic structure of the wafer storage container cleaning apparatus according to the first embodiment.

[0014] Figure 2 This is a schematic diagram of the door according to the first embodiment, and is an example of the structure of the door.

[0015] Figure 3A yes Figure 2 AA cross-section (when locked).

[0016] Figure 3B yes Figure 2 AA cross-section (when unlocked).

[0017] Figure 4 This is a side perspective view that schematically shows the structure inside the cleaning tank of the first embodiment.

[0018] Figure 5 This is a diagram showing an example of the structure of the control unit in the first embodiment.

[0019] Figure 6 This is a diagram illustrating an example of the structure of the opening and closing cover in the first embodiment.

[0020] Figure 7 This is a diagram illustrating an example of the structure of the opening and closing cover in the first embodiment.

[0021] Figure 8 This is a diagram illustrating an example of the operation of the FOUP during cleaning in the wafer storage container cleaning apparatus 1 of the first embodiment.

[0022] Figure 9This diagram shows the state in which the door holding part of the wafer storage container cleaning apparatus of the second embodiment holds the door.

[0023] Figure 10 In the second embodiment, the two covers are removed from the door retainer and the gas nozzles are inserted into each of the two holes exposed in the door retainer. Figure 9 BB cross-section.

[0024] Figure 11 In a variation of the second embodiment, the two covers are removed from the door retainer and the gas nozzles are inserted into each of the two holes exposed in the door retainer. Figure 9 BB cross-section.

[0025] [Explanation of Symbols]

[0026] 1: Chip storage container cleaning device

[0027] 1a: Enclosure

[0028] 1b, 1c, 5c: Openings

[0029] 2: Loading port

[0030] 2a, 7a: baffles

[0031] 2b, 5p, 5s, 5t, 7b, 20l: Arrows

[0032] 3: Robot

[0033] 3a: Robotic arm

[0034] 3b: Robotic Hand

[0035] 4: Disassemble / Connect Platform

[0036] 4a, 5n1: Latch key

[0037] 5: Cleaning tank

[0038] 5a: Opening and closing the cover (lid part)

[0039] 5b: Cover

[0040] 5d: Incision

[0041] 5e: Door retaining section

[0042] 5f: Inner surface

[0043] 5g: Adsorption pad

[0044] 5h, 5i, 5j, 5k: Padding

[0045] 5L: Hole (Purification Hole)

[0046] 5m: Dispersion plate

[0047] 5n: Gas nozzle

[0048] 5n2: Through hole

[0049] 5r: Rotating part

[0050] 5x: Face (opposing face)

[0051] 6: Vacuum bath

[0052] 7: Unloading port

[0053] 8: Control Department

[0054] 8a: CPU

[0055] 8b: ROM

[0056] 8c: RAM

[0057] 8d: HDD

[0058] 8e: Communication Interface

[0059] 20: FOUP

[0060] 20a: FOUP main body (shell)

[0061] 20b: Door (cover)

[0062] 20c: Flange

[0063] 20d: Outer surface

[0064] 20e: Keyhole

[0065] 20f: Side view

[0066] 20g: Hole (for protrusion)

[0067] 20h: Lock cylinder

[0068] 20i: Latch

[0069] 20j: Latch mechanism

[0070] 20k: Space (latch sliding space)

[0071] 20m: Surface (inner surface)

[0072] 20n: Space

[0073] 20p: Gap

[0074] 20s: Through hole (latch mechanism hole)

[0075] 20t: Connecting part

[0076] 50: Main body of the cleaning tank

[0077] 52: Cleaning fluid nozzle

[0078] 53: Rotating part Detailed Implementation

[0079] Hereinafter, embodiments of the wafer storage container cleaning apparatus disclosed in this application will be described in detail with reference to the accompanying drawings. Furthermore, the wafer storage container cleaning apparatus disclosed in this application is not limited to the embodiments described below. Additionally, various embodiments and modifications can be appropriately combined without causing contradictions. Furthermore, in the following embodiments, the case where the wafer storage container to be cleaned is a FOUP is described, but the wafer storage container to be cleaned is not limited to this. For example, the wafer storage container to be cleaned may also be a FOSB.

[0080] (First Implementation)

[0081] Figure 1 This is a plan view illustrating an example of the schematic structure of the wafer storage container cleaning apparatus 1 according to the first embodiment. The wafer storage container cleaning apparatus 1 is installed, for example, in a semiconductor wafer manufacturing plant to clean wafer storage containers. Figure 1 As shown, the wafer storage container cleaning device 1 includes a loading port 2, a robot 3, a disassembly / connection platform 4, a cleaning tank 5, a vacuum tank 6, an unloading port 7, and a control unit 8.

[0082] Robot 3, disassembly / connection table 4, cleaning tank 5, vacuum tank 6, and control unit 8 are disposed inside the housing 1a of the wafer storage container cleaning apparatus 1. On the other hand, loading port 2 and unloading port 7 are disposed across the inside and outside of the housing 1a of the wafer storage container cleaning apparatus 1.

[0083] Loading port 2 moves the FOUP 20, which is to be cleaned and is placed on the outer part of the housing 1a of loading port 2, into the interior of housing 1a. FOUP 20 includes FOUP body (housing) 20a and door (cover) 20b. FOUP body 20a has an opening (FOUP body opening) and a storage space for storing semiconductor wafers. The storage space exists further inward than the FOUP body opening and communicates with the FOUP body opening. FOUP body 20a is an example of a wafer storage container body, and FOUP body opening is an example of a container opening. Door 20b can be disassembled / connected to FOUP body 20a, and is installed in the FOUP body opening in an openable / closable state when connected to FOUP body 20a. In addition, a flange 20c is provided on FOUP body 20a. Flange 20c is the part of FOUP 20 that is held (held) when it is transported by an overhead hoist transport (OHT) or robot 3.

[0084] For example, on the portion outside the housing 1a of the loading port 2, a FOUP 20 is placed and conveyed while being held by the OHT flange 20c. For example, as Figure 1 As shown, the FOUP 20 is placed with its door 20b facing the housing 1a. When the FOUP 20 is placed in the loading port 2 in this manner, the baffle 2a provided at the opening 1b of the housing 1a rises. This allows the FOUP 20 to be moved from the opening 1b into the interior of the housing 1a. That is, the FOUP 20 can be moved into the interior of the wafer storage container cleaning apparatus 1. Furthermore, the FOUP 20 slides along the direction of arrow 2b via the sliding device of the loading port 2. Thus, the FOUP 20 is moved into the interior of the housing 1a. The sliding using the sliding device will be explained. For example, by inserting a pin provided with the sliding device into a hole provided at the bottom (placement surface) of the FOUP 20, the placement surface of the FOUP 20 is fixed to the sliding device. In this state, by sliding the sliding device along the direction of arrow 2b, the FOUP 20 also slides. Thus, FOUP 20 is placed on a designated portion inside the housing 1a of the loading port 2. If FOUP 20 is moved into the housing 1a in the manner described, the baffle 2a descends, and the opening 1b of the housing 1a closes. The sliding device, together with the pin, descends to a position lower than the lower end of the baffle 2a (the mounting surface of FOUP 20), and returns to its original position outside the housing 1a.

[0085] Robot 3, while holding the flange 20c of FOUP 20, transports FOUP 20 to various parts. Robot 3 includes a robot arm 3a and a robot hand 3b. Robot 3, while the robot hand 3b holds the flange 20c, moves the robot arm 3a by extending, retracting, or rotating, thereby transporting FOUP 20 to various parts.

[0086] The disassembly / connection platform 4 disassembles FOUP 20 into FOUP body 20a and door 20b, or connects FOUP body 20a and door 20b. A latch key 4a is provided on the disassembly / connection platform 4. By rotating the latch key 4a while it is inserted into the keyhole formed on the door 20b of FOUP 20, FOUP 20 is disassembled (separated) into FOUP body 20a and door 20b, or connected to door 20b. For example, at the disassembly / connection platform 4, FOUP 20, which has been moved into the interior of housing 1a, is transported by robot 3. In this case, the disassembly / connection platform 4 disassembles FOUP 20 into FOUP body 20a and door 20b. Furthermore, disassembly can be interpreted as unlocking, and connection can be interpreted as locking.

[0087] Figure 2 This is a schematic diagram of the door 20b according to the first embodiment, and is a diagram showing an example of the structure of the door 20b. Figure 3A and Figure 3B yes Figure 2 AA cross-section view. Figure 3A When locked, Figure 3B Indicates when unlocked. For example... Figure 2 , Figure 3A and Figure 3B As shown, two keyholes 20e are formed at a predetermined interval on the outer surface 20d of the door 20b. That is, the keyholes 20e are formed on the outer surface 20d, and these keyholes 20e can be rotated while the latch key 4a is inserted to switch the locking / unlocking of the FOUP body 20a and the door 20b. Additionally, a hole (protrusion hole) 20g is formed on the side 20f of the door 20b for the latch 20i (described later) to protrude. No hole is formed on the inner surface 20m of the door 20b, opposite to the outer surface 20d. Therefore, there is no opening on the inner surface 20m for communication with the internal space of the door 20b. Furthermore, the positions of the two keyholes 20e are determined by specifications.

[0088] Furthermore, a space (latch sliding space) 20k is formed inside the door 20b, and a latching mechanism 20j including a lock cylinder 20h, a latch 20i, and a connecting part 20t is provided in the space (latch sliding space) 20k. The latch sliding space 20k is the internal space of the door 20b. The latch sliding space 20k communicates with the keyhole 20e and the protruding hole 20g. The lock cylinder 20h is provided at a position corresponding to the keyhole 20e. Specifically, the lock cylinder 20h is provided in the latch sliding space 20k of the door 20b so that the latch key 4a can be inserted into the lock cylinder 20h through the keyhole 20e.

[0089] By rotating the latch key 4a inserted into the lock cylinder 20h in a predetermined direction, the lock cylinder 20h rotates, and the connecting part 20t connected to the lock cylinder 20h pushes out the latch 20i, thereby causing the latch 20i to protrude from the protruding hole 20g of the latch mechanism 20j in the direction of arrow 20l (see reference). Figure 3A Thus, the protruding latch 20i engages with the FOUP body 20a, thereby connecting and locking the FOUP body 20a to the door 20b. A recess is provided at the end of the opening of the FOUP body 20a, from... Figure 3A The latch 20i, protruding from the hole 20g shown, is inserted into the recess. Thus, the latch 20i is a component for connection with the FOUP body 20a. Furthermore, when the FOUP body 20a is connected to the door 20b, the latch key 4a inserted into the lock cylinder 20h rotates in the opposite direction to its original position, thereby returning the connecting portion 20t of the latch 20i to its original position, and the latch 20i inserted into the recess retracts into the latch sliding space 20k of the door 20b (see reference). Figure 3B Thus, the FOUP body 20a and the door 20b are separated and unlocked. That is, a latch mechanism 20j is provided inside the door 20b, which can switch the locking / unlocking of the FOUP body 20a and the door 20b by rotating it with the latch key 4a inserted through the keyhole 20e.

[0090] Cleaning tank 5 is used to clean FOUP 20. Figure 4 This is a side perspective view that schematically shows the structure within the cleaning tank 5 of the first embodiment. For example, as shown... Figure 4As shown, the cleaning tank 5 includes a cleaning tank body 50 and an opening / closing cover (cover) 5a. The cleaning tank body 50 has an opening at the top (cleaning tank opening) and a processing space for holding a FOUP body 20a. The processing space is located further inward than the cleaning tank opening and communicates with it. The FOUP body 20a is moved from the cleaning tank opening into the processing space of the cleaning tank body 50. Furthermore, a FOUP body holding part is provided in the processing space of the cleaning tank body 50 to hold the moved-in FOUP body 20a. Thus, the FOUP body 20a is held by the FOUP body holding part and housed in the processing space of the cleaning tank body 50. In addition, the opening / closing cover 5a is provided at the top of the cleaning tank body 50. Specifically, it is provided to be openable and closable relative to the cleaning tank opening of the cleaning tank body 50. The opening / closing cover 5a is opened and closed relative to the cleaning tank opening of the cleaning tank body 50 by a cylinder. A door retaining part 5e is provided on the inner side of the opening and closing cover 5a, which can retain the door 20b (see reference). Figure 7 The structure of the opening and closing cover 5a will be described later.

[0091] Furthermore, a cleaning fluid nozzle 52 is provided inside the cleaning tank body 50 to supply cleaning fluid (liquid) used for cleaning the FOUP body 20a and door 20b. Additionally, a rotating part 53 is provided inside the cleaning tank body 50 to rotate the FOUP body 20a held by the FOUP body holding part. Furthermore, a rotating part 5r (see reference) is provided on the opening / closing cover 5a of the cleaning tank body 50 to rotate the door 20b held by the door holding part 5e. Figure 7 The FOUP 20 is cleaned by spraying cleaning fluid from the cleaning fluid nozzle 52 onto the FOUP body 20a and door 20b, which are rotated by the rotating part 53 and the rotating part 5r. Specifically, with the door 20b held by the door holding part 5e and the opening / closing cover closed relative to the cleaning tank opening of the cleaning tank body 50, the cleaning fluid nozzle 52 sprays cleaning fluid onto the inner surfaces (inner surfaces) of the FOUP body 20a and door 20b (see...). Figure 2 , Figure 3A and Figure 3B The cleaning fluid is sprayed out from a distance of 20m. The temperature of the sprayed cleaning fluid is set to approximately 60 to 90 degrees Celsius, which is a relatively high temperature.

[0092] Additionally, an air nozzle (not shown) for injecting gas is installed inside the cleaning tank body 50. After cleaning with liquid, gas from the air nozzle is injected into the FOUP body 20a and door 20b, thereby drying the FOUP body 20a and door 20b. Furthermore, during drying with gas from the air nozzle, the FOUP body 20a and door 20b also rotate via the rotating parts 53 and 5r. Alternatively, the liquid adhering to the FOUP body 20a and door 20b can be dried by rotating the rotating parts 53 and 5r without injecting gas from the air nozzle. The temperature of the gas injected from the air nozzle is, for example, set to approximately 90 to 120 degrees Celsius.

[0093] In this embodiment, when cleaning the FOUP 20 in the cleaning tank 5, the robot 3 transports the FOUP body 20a and the door 20b from the disassembly / connection table 4 to the cleaning tank 5. For example, with the opening of the FOUP body 20a facing downwards, the robot 3 transports the FOUP body 20a from the cleaning tank opening of the cleaning tank body 50 into the interior of the cleaning tank body 50. Then, the FOUP body holding part holds the FOUP body 20a with the opening facing downwards. In addition, the robot 3 transports the door 20b to the door holding part 5e, so that the outer surface 20d of the door 20b is held by the door holding part 5e with the opening and closing cover. If the opening and closing cover is closed, the inner surface (inner surface) of the door 20b (see reference) Figure 2 and Figure 3A and Figure 3B )20m facing downwards. Then, the cleaning fluid nozzle 52 sprays liquid onto the inner surface 20m of the door 20b.

[0094] In addition, after cleaning the FOUP 20 in the cleaning tank 5, the robot 3 will transfer the FOUP body 20a and the door 20b in the cleaning tank 5 to the vacuum tank 6 respectively.

[0095] Vacuum tank 6 is a tank for vacuum drying FOUP 20. Inside vacuum tank 6 are: a holding unit for holding the FOUP body 20a and door 20b, which are transported into vacuum tank 6; a halogen lamp; and a turbine pump for evacuating the interior of vacuum tank 6. While the FOUP body 20a and door 20b are held by the holding unit, vacuum tank 6 is evacuated using the turbine pump while being heated using the halogen lamp, thereby vacuum drying the FOUP body 20a and door 20b.

[0096] Furthermore, once the vacuum drying of FOUP 20 in vacuum tank 6 is complete, robot 3 will transfer the FOUP body 20a and door 20b from vacuum tank 6 to the disassembly / connection stage 4. Then, disassembly / connection stage 4 will connect the FOUP body 20a and door 20b.

[0097] The unloading port 7 will remove the cleaned and vacuum-dried FOUP 20, which was placed inside the housing 1a by the robot 3, to the outside of the housing 1a.

[0098] For example, after vacuum drying, the FOUP 20, formed by connecting the FOUP body 20a and the door 20b in the decomposition / connection stage 4, is transported by the robot 3 and placed inside the housing 1a of the unloading port 7. Thus, when the FOUP 20 is placed in the unloading port 7, the baffle 7a provided in the opening 1c of the housing 1a rises. This allows the FOUP 20 to be moved out of the housing 1a from the opening 1c. That is, the FOUP 20 can be moved out of the wafer storage container cleaning apparatus 1. Furthermore, the FOUP 20 is moved out of the housing 1a by sliding the unloading port 7 in the direction of arrow 7b using the sliding mechanism of the unloading port 7 (which has the same mechanism as the sliding mechanism of the loading port 2). Thus, when the FOUP 20 is moved out of the housing 1a, the baffle 7a descends, and the opening 1c of the housing 1a closes.

[0099] The control unit 8 controls the overall operation of the wafer storage container cleaning apparatus 1. For example, the control unit 8 controls the loading port 2, robot 3, disassembly / connection stage 4, cleaning tank 5, vacuum tank 6, and unloading port 7 to operate as described above.

[0100] Figure 5 This is a diagram illustrating an example of the structure of the control unit 8 in the first embodiment. (See diagram below.) Figure 5 As shown, the control unit 8 includes a central processing unit (CPU) 8a, a read-only memory (ROM) 8b, a random access memory (RAM) 8c, a hard disk drive (HDD) 8d, and a communication interface 8e. These are connected via an internal bus.

[0101] CPU 8a performs various processes while using the storage area of ​​RAM 8c as a temporary storage area for data used in various processes. The processes performed by CPU 8a will be described later. ROM 8b and HDD 8d store programs for performing various processes, various databases or tables used during the execution of these processes, etc.

[0102] Communication interface 8e is an interface used for communicating with the various parts of the wafer storage container cleaning apparatus 1 and with external devices connected to the wafer storage container cleaning apparatus 1 via a network. For example, communication interface 8e is a network interface card.

[0103] Next, the structure of the opening and closing cover of the cleaning tank 5 will be explained. Figure 6 and Figure 7 This is a diagram illustrating an example of the structure of the opening and closing cover 5a according to the first embodiment. Figure 6 The diagram shows the state in which the door retaining part 5e, included in the opening / closing cover 5a, holds the door 20b. (As shown...) Figure 6 As shown, a cover 5b is installed on the door retaining part 5e to cover the outer side of the door 20b. The cover 5b is configured to rotate together with the door retaining part 5e via the rotating part 5r. To prevent interference with the opening / closing cover 5a or the wall of the washing tank body 50 located outside the cover 5b during rotation, gaps are formed between these components and the cover 5b. The cover 5b is a hollow cylindrical component. Figure 6 An opening 5c ​​is formed by cutting off a portion of the paper surface and the bottom surface on the front side, in which the inner surface 20m of the door 20b, which is the surface to be cleaned, is kept exposed. Therefore, the opening 5c ​​is formed to conform to the shape of the door 20b and has a cut 5d to ensure the space required for the door 20b to be held by the robot 3. In addition, the lower end of the cover 5b (the end on the side of the cleaning tank body 50 when the cover 5a is closed) protrudes further downward than the lower end of the cover 5a (the end on the side of the cleaning tank body 50 when the cover 5a is closed). This prevents the cleaning fluid adhering to the cover 5a from adhering to the door 20b due to gravity flow when the cover 5a is opened.

[0104] Figure 7 This is a diagram showing the cover 5b and door retaining part 5e as viewed from the side of the open / closed cover 5a, and it is a diagram showing the cover 5a with the open / closed cover 5a omitted. Furthermore, in Figure 7 The image shows the state where door 20b is not held by door retaining part 5e. Door retaining part 5e is provided on the inner surface 5f of the opening / closing cover 5a (see reference). Figure 6 ).like Figure 7As shown, the door holding part 5e includes two adsorption pads 5g for vacuum adsorption of the door 20b. By using these adsorption pads 5g to vacuum adsorb the outer surface 20d of the door 20b, the door 20b is held by the door holding part 5e.

[0105] Additionally, the door retaining part 5e includes four pads 5h, 5i, 5j, and 5k. Positioning pins are formed on two of these pads 5i and 5j. The door 20b is positioned by the door retaining part 5e by engaging the positioning pins with positioning holes formed on the outer surface 20d of the door 20b. The adsorption pad 5g is also the same as the four pads 5h, 5i, 5j, and 5k, except that it has adsorption holes that impart adsorption force from a suction source (not shown).

[0106] In addition, such as Figure 7 As shown, multiple holes (purification holes) 5l are formed in a circumferential shape in the cover 5b. From the gas nozzle 5n (refer to...) Figure 8 Gas (e.g., N2) is supplied through multiple orifices 5l.

[0107] Additionally, a dispersion plate 5m is provided at a position opposite to the door retaining part 5e on the opening / closing cover 5a. The dispersion plate 5m is, for example, a plate-shaped member bent into an L-shape. When gas supplied from the gas nozzle 5n comes into contact with the dispersion plate 5m, the flow direction of the gas is dispersed by the dispersion plate 5m.

[0108] Next, the operation of the FOUP 20 in the wafer storage container cleaning apparatus 1 of the first embodiment during cleaning will be described. Figure 8 This diagram illustrates an example of the operation during the cleaning process of the FOUP 20 in the wafer storage container cleaning apparatus 1 of the first embodiment. Furthermore, Figure 8 It is a schematic diagram of the opening and closing cover 5a, the door retainer 5e, the cover 5b, the gas nozzle 5n, the door 20b, etc.

[0109] like Figure 8 As shown, a gas nozzle 5n is provided on the opening / closing cover 5a, and the gas nozzle 5n and the opening / closing cover 5a are sealed together by a sealing element or the like. Furthermore, during the cleaning of the FOUP body 20a and door 20b by the cleaning tank 5 with the opening / closing cover 5a closed, gas is supplied to the hole 5l by the gas nozzle 5n. As a result, the gas supplied by the gas nozzle 5n flows in the direction of the dashed arrow 5p.

[0110] That is, gas nozzle 5n supplies gas into a tiny space 20n formed between the door retaining part 5e and the outer surface 20d of the door 20b. Gas from gas nozzle 5n is also supplied to a gap 20p communicating with space 20n. Gap 20p is the gap between the side surface 20f of the door 20b and the inner wall surface of the cover 5b, and the facing surface 5x of the side surface 20f. Furthermore, gap 20p also communicates with the processing space of the cleaning tank body 50. Space 20n and gap 20p are examples of gas supply spaces.

[0111] Therefore, the space 20n and the gap 20p are maintained at positive pressure by the gas supplied by the gas nozzle 5n. Furthermore, an airflow towards the cleaning tank body 50 is formed in the gap 20p around the protruding hole 20g of the door 20b. Therefore, the wafer storage container cleaning apparatus 1 of the first embodiment can prevent cleaning fluid from adhering to the side surface 20f and outer surface 20d of the door 20b, and can also prevent cleaning fluid from entering the latch sliding space 20k of the door 20b. That is, the flow of gas from the gas nozzle 5n can prevent cleaning fluid from the cleaning fluid nozzle 52 from intruding through the protruding hole 20g. In addition, by having a cover 5b, a space 20n and a gap 20p (which minimize the space to be supplied with gas) can be formed as a gas supply space, thereby effectively preventing cleaning fluid from intruding through the protruding hole 20g. Ideally, the lower end of the cover 5b (the end on the side of the cleaning tank body 50 when the cover 5a is closed) should be as follows... Figure 8 The diagram shows an extension portion extending toward the inside of the cleaning tank 5. This narrows the portion from which gas from the gas nozzle 5n is discharged through the gap 20p, thereby increasing the gas flow rate and better maintaining a positive pressure state at a position above the lower end of the cover 5b.

[0112] Furthermore, as described above, the door 20b is cleaned while rotating via the rotating part 5r, thus preventing uneven cleaning caused by supplying gas from the gas nozzle 5n only to specific areas. Additionally, the rotation of the door 20b supplies gas from the gas nozzle 5n to the entire space 20n and gap 20p, thereby preventing cleaning fluid from adhering to the side surface 20f or outer surface 20d of the door 20b.

[0113] Furthermore, in the first embodiment, after cleaning the FOUP 20 in the cleaning tank 5, the FOUP 20 is vacuum dried in the vacuum tank 6. Here, assuming that after cleaning in the cleaning tank 5, the cleaning fluid adheres to the side surface 20f and outer surface 20d of the door 20b, or that the cleaning fluid enters the latch sliding space 20k, the time required to reduce the pressure to the target pressure in the vacuum tank 6 becomes longer due to the presence of this cleaning fluid. However, according to the wafer storage container cleaning apparatus 1 of the first embodiment, since the adhesion of the cleaning fluid to the side surface 20f and outer surface 20d of the door 20b is suppressed, or the entry of the cleaning fluid into the latch sliding space 20k of the door 20b is suppressed, the longer time required to reduce the pressure to the target pressure in the vacuum tank 6 can be suppressed.

[0114] In addition, by setting a dispersion plate 5m on the opening and closing cover 5a, the gas can easily spread throughout the space 20n and the gap 20p, thereby better maintaining a positive pressure state.

[0115] (Second Implementation)

[0116] Next, the wafer storage container cleaning apparatus 1 of the second embodiment will be described. In the second embodiment, the gas nozzle 5n supplies gas to the inside of the door 20b in a different manner than the wafer storage container cleaning apparatus 1 of the first embodiment.

[0117] Figure 9 This is a diagram showing the state in which the door holding part 5e of the wafer storage container cleaning apparatus 1 of the second embodiment holds the door 20b, and is shown after omitting the cover 5b or the opening and closing cover 5a, etc.

[0118] In the first embodiment, in relation to Figure 7 The keyhole 20e is formed at the position of the outer surface 20d of the door 20b where the two gaskets 5h and 5k of the door retaining part 5e face each other. In the second embodiment, the two gaskets 5h and 5k are removed from the door retaining part 5e, thereby, as Figure 9 As shown, the gas nozzle 5n is inserted into each of the two holes exposed in the door retainer 5e. The gas nozzle 5n is connected to a gas supply pipe located outside the opening / closing cover 5a for supplying gas from a gas supply source. One end of the gas supply pipe is connected to the gas nozzle 5n, and the other end is connected to an external gas supply source via a rotary joint.

[0119] Figure 10 In the second embodiment, the two gaskets 5h and 5k are removed from the door retainer 5e, and the gas nozzle 5n is inserted into each of the two holes exposed in the door retainer 5e. Figure 9 BB cross-section. Figure 10 This is a schematic diagram of the door retainer 5e, the gas nozzle 5n, the door 20b, etc.

[0120] like Figure 10 As shown, the gas nozzle 5n is positioned opposite the keyhole 20e and supplies gas to the keyhole 20e. Consequently, the gas supplied by the gas nozzle 5n flows in the direction of the dashed arrow 5s.

[0121] That is, the gas supplied to the keyhole 20e is supplied to the gap 20p (refer to) via the latch sliding space 20k from the protruding hole 20g. Figure 8 As a result, the wafer storage container cleaning apparatus 1 of the second embodiment can achieve the same effect as the wafer storage container cleaning apparatus 1 of the first embodiment. Furthermore, since gas is directly supplied to the latch sliding space 20k, the entry of cleaning fluid into the latch sliding space 20k can be further suppressed compared to the first embodiment. In addition, during the cleaning of FOUP 20, since the door 20b rotates, the gas supplied to the keyhole 20e is supplied from the protruding hole 20g to the space between the cover 5b and the door 20b. As a result, the gas supplied by the gas nozzle 5n forms a swirling flow, and the cleaning fluid is less likely to enter the area of ​​the door 20b that is higher than the inner surface 20m.

[0122] Furthermore, in this embodiment, gas is supplied to the keyhole 20e from the gas nozzle 5n. However, similarly, in the first embodiment, the gas nozzle 5n can also be further provided for the keyhole 20e, thereby more reliably preventing cleaning fluid from entering the protruding hole 20g of the door 20b and the outer surface 20d side of the door 20b.

[0123] (A variation of the second embodiment)

[0124] Next, use Figure 11 The wafer storage container cleaning apparatus 1 of the second embodiment will be described. In the second embodiment, gas is supplied to the interior of the door 20b through a gas nozzle 5n into a through hole 5n2 formed in the latch key 5n1, which differs from the wafer storage container cleaning apparatus 1 of the second embodiment. The latch key 5n1 is a latch key with the same structure as the latch key 4a provided on the disassembly / connection table 4. In this embodiment, the latch key 5n1 is held in the door holding part 5e when it is inserted into the lock cylinder 20h of the door 20b. The latch key 5n1 can be pre-installed in the door holding part 5e or installed when transporting the wafer to the cleaning tank 5. When pre-installed in the door holding part 5e, the latch key 5n1 can be used to hold the door 20b in the door holding part 5e instead of the suction pad 5g.

[0125] Figure 11 In a variation of the second embodiment, the two gaskets 5h and 5k are removed from the door retainer 5e, and the gas nozzle 5n is inserted into each of the two holes exposed in the door retainer 5e. Figure 9 The BB cross-section. However, Figure 11 and Figure 10 Similarly, there are schematic diagrams of the door retainer 5e, the gas nozzle 5n, the door 20b, etc.

[0126] like Figure 11 As shown, in a modified example of the second embodiment, the door 20b is cleaned with the latch key 5n1 inserted into the lock cylinder 20h. Furthermore, a through hole 5n2 is formed in the latch key 5n1. Additionally, a through hole 20s (latch mechanism hole) is also formed in the lock cylinder 20h. The through hole 20s communicates with the latch sliding space 20k. Furthermore, with the latch key 5n1 inserted into the lock cylinder 20h, as... Figure 11 As shown, the through hole 20s is connected to the through hole 5n2. The gas nozzle 5n is positioned opposite the through hole 5n2 of the latch key 5n1, supplying gas to the through hole 5n2. Thus, the gas supplied by the gas nozzle 5n flows in the direction of the dashed arrow 5t.

[0127] That is, the gas supplied to the through hole 5n2 formed in the latch key 5n1 is supplied to the gap 20p (refer to) through the through hole 20s of the lock cylinder 20h and the latch sliding space 20k from the protruding hole 20g. Figure 8 Furthermore, during the cleaning of FOUP 20, due to the rotation of door 20b, the gas supplied to keyhole 20e, as in the second embodiment, becomes a swirling flow. As a result, the wafer storage container cleaning apparatus 1 of the modified example of the second embodiment can achieve the same effect as the wafer storage container cleaning apparatus 1 of the second embodiment. Moreover, since gas is directly supplied to latch sliding space 20k, the entry of cleaning fluid into latch sliding space 20k can be further suppressed compared to the first embodiment.

[0128] (Other variations)

[0129] In the various embodiments or modifications described above, the gas supply from the gas nozzle 5n during the cleaning of the FOUP 20 was explained. However, in the various embodiments or modifications described above, gas can also be supplied from the gas nozzle 5n not only during cleaning, but also during the process of removing the door 20b from the door retaining part 5e of the cleaning tank 5 after cleaning is completed.

[0130] The cleaning tank 5 is a high-temperature area due to the use of a relatively high-temperature cleaning fluid. If the opening and closing cover 5a of the cleaning tank 5 is opened, the temperature inside the cleaning tank 5 will drop. As a result, the fine mist of cleaning fluid will liquefy, and the liquefied cleaning fluid will easily flow into the protruding hole 20g formed on the side 20f of the door 20b or the outer surface 20d of the door 20b.

[0131] When removing the door 20b (at least when opening the cover 5a), gas is supplied through the gas nozzle 5n to prevent the liquefied cleaning fluid from flowing into the protruding hole 20g or the outer surface 20d of the door 20b. This also prevents the fine mist of cleaning fluid from entering through the protruding hole 20g. Furthermore, by supplying gas from the gas nozzle 5n, gas is also sprayed onto the cover 5b, thus preventing cleaning fluid from adhering to the protruding hole 20g or the outer surface 20d of the door 20b even if cleaning fluid remains on the cover 5b after cleaning.

[0132] Alternatively, gas can be supplied from the gas nozzle 5n during the cleaning of FOUP 20 until the operation of opening and closing cover 5a to remove door 20b.

[0133] Furthermore, in the various embodiments or modifications described above, the FOUP body 20a and door 20b are shown to be cleaned and dried in the same cleaning tank, but this is not a limitation; cleaning can also be performed at different times. A dedicated cleaning tank for door 20b may also be provided.

[0134] Furthermore, in the various embodiments or modifications described, a cleaning tank 5 is illustrated with a cleaning fluid nozzle 52 and an air supply nozzle, but it is not limited to this. The same nozzle supply source can also be switched to supply cleaning fluid and gas.

[0135] Furthermore, in the various embodiments or variations described, the case where the cover 5b includes multiple holes 5l is illustrated, but it is not limited to this. It is acceptable as long as the structure is such that the door retaining part 5e is connected to the cover 5b, and gas from the gas nozzle 5n passes from the upper side to the lower side of the cover 5b, reaching the space 20n and the gap 20p. For example, the connection portion of the cover 5b to the door retaining part 5e does not need to be a surface covering the entire outer peripheral surface of the door retaining part 5e; it can be a shape where only a portion of the cover 5b is connected to the four corners of the door retaining part 5e. In this case, the surface of the cover 5b on the opening / closing cover 5a side is shaped as if it has four beams. The connection portion does not need to be four parts; as long as the door retaining part 5e is connected to the cover 5b, it can be two or three parts.

Claims

1. A wafer container cleaning apparatus for cleaning a door of a wafer container, the door having a keyhole on one side thereof, the keyhole being capable of switching between locking and unlocking with a main body of the wafer container by being rotated in a state where a latch key is inserted, a protrusion hole being formed on a side surface for the latch to protrude when locked, the wafer container cleaning apparatus characterized by comprising: a door holding portion that holds the door; a cleaning liquid nozzle that supplies a cleaning liquid to the other side of the door; a gas nozzle that generates a flow of gas that hinders intrusion of the cleaning liquid from the protrusion hole when at least the cleaning liquid is supplied to the door from the cleaning liquid nozzle; an openable and closable cover that is provided openably and closably with respect to a cleaning tank opening portion, and that includes the door holding portion; and a cleaning tank main body that forms a processing space by the openable and closable cover closing the cleaning tank opening portion, wherein the gas nozzle supplies the gas to a gas supply space formed between the openable and closable cover and the door including the side surface from the side of the one side of the door in a state where the door is held by the door holding portion.

2. The wafer container cleaning apparatus according to claim 1, wherein the wafer container main body is placed in the processing space of the cleaning tank main body, and further comprising: a cover that is provided to the door holding portion and covers the door, a gap being formed between the side surface and an opposite surface of an inner wall surface of the cover that faces the side surface, the gap communicating with the gas supply space, and the gas nozzle supplying the gas to the gas supply space.

4. The wafer container cleaning apparatus according to any one of claims 1 to 3, wherein the gas nozzle supplies the gas to the keyhole.

5. The wafer container cleaning apparatus according to any one of claims 1 to 3, wherein the latch key and the keyhole have a through hole, and the gas nozzle supplies the gas to the through hole from the gas nozzle in a state where the latch key is inserted to the door.

6. The wafer container cleaning apparatus according to claim 2 or 3, wherein the gas nozzle further supplies the gas when the openable and closable cover is opened after a cleaning process of the wafer container. ​ ​ ​ ​ ​ 3. The wafer boat cleaning apparatus of claim 2, wherein ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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