Display device and display terminal

Abstract

The application provides a display device and a display terminal, the display device comprises: a back cover with a mounting portion; a backlight module arranged on the mounting portion; a display module arranged on the light emitting side of the backlight module, the display module at least comprising an array substrate and a color film substrate arranged opposite to the array substrate, one end of the array substrate being longer than the color film substrate and forming a binding area; an electronic device fixedly arranged in the binding area of the array substrate; and a wireless module at least partially arranged in the binding area, the wireless module being used for receiving an inductive signal and a wireless signal; wherein the array substrate is arranged away from the backlight module relative to the color film substrate and covers the opening side of the back cover, the electronic device is inverted in the back cover and located at the end portion of the backlight module, and the electronic device, the back cover and the backlight module are fixed through curing glue. The technical scheme of the application can improve the technical problem that the display device is prone to abnormal sound in the related art.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display panels, and in particular to a display device and a display terminal. BACKGROUND

[0002] With the development of thin and light notebook computers, the material selection of the B cover (front frame of the screen) also tends to be light and thin, which reduces the mechanical strength of the B cover and makes it prone to deformation. When the whole machine is pressed, the B cover deforms under stress, and the adhesive between the B cover and the display module peels off, producing adhesive noise. In addition, when the whole machine is shaken or pressed, the common noise sources of the display module include FPC (flexible circuit board) material sound, Celltape (adhesive tape) material sound and adhesive sound, PCBA (circuit board) fixing adhesive tape pasting sound, etc.

[0003] In this way, during use of the device, the generation of noise reduces the user's experience, thereby failing to meet the use requirements of the device. SUMMARY

[0004] Embodiments of the present application provide a display device and a display terminal, which can improve the technical problem that the display device is prone to generating noise in the related art.

[0005] In a first aspect, embodiments of the present application provide a display device, which comprises: a back cover having a mounting portion; a backlight module arranged on the mounting portion; a display module arranged on the light-emitting side of the backlight module, the display module at least comprising an array substrate and a color film substrate arranged opposite to the array substrate, one end of the array substrate being longer than the color film substrate and forming a binding area; an electronic device fixedly arranged in the binding area of the array substrate; and a wireless module at least partially arranged in the binding area, the wireless module being configured to receive an inductive signal and a wireless signal; wherein the array substrate is arranged away from the backlight module relative to the color film substrate and covers the opening side of the back cover, the electronic device is inverted in the back cover and located at the end portion of the backlight module, and the electronic device, the back cover and the backlight module are fixed by a cured adhesive.

[0006] In an embodiment, the wireless module comprises an inductive piece and a signal receiving piece, the signal receiving piece is arranged in the binding area to receive the wireless signal, and the inductive piece is arranged below the backlight module and electrically connected to the electronic device in the binding area.

[0007] In an embodiment, the outer side wall of the cured adhesive is adapted to the side wall of the backlight module and the display module to fill the gap between the cured adhesive and the backlight module and the display module.

[0008] In an embodiment, the display module further comprises a polarizing layer, the polarizing layer is located on the side of the array substrate away from the color film substrate, and the polarizing layer forms the packaging side of the display device.

[0009] In one embodiment, the screen back cover has side walls and bottom walls that are connected sequentially and set at an angle. The bottom wall has a mounting portion. The side walls and the display module are spaced apart. The side walls, bottom wall, display module and backlight module together form a receiving area. A bonding area and curing adhesive are disposed in the receiving area.

[0010] In one embodiment, the height of the mounting portion in the second direction is less than the height of the bottom wall in the second direction.

[0011] In one embodiment, the display device further includes a buffer member, wherein a gap exists between the inner sidewall of the sidewall and the sidewall of the array substrate, and the buffer member is located between the inner sidewall of the sidewall and the sidewall of the array substrate.

[0012] In one embodiment, the buffer is specifically a silicone ring.

[0013] Secondly, embodiments of the present invention provide a display terminal, which includes the display device described above.

[0014] In one embodiment, the display terminal further includes a mainboard, on which a power coil transmitting module and a signal transmitting device are provided. The power coil transmitting module can transmit wireless inductive signals to the inductors of the display device, and the signal transmitting device can transmit wireless signals to the signal receivers of the display device.

[0015] By applying the technical solution of this invention, some electronic devices in the bonding area are connected to the array substrate, and a curing adhesive is provided on the outer periphery of the bonding area. This can prevent other components from affecting the operation of the electronic devices in the bonding area. At the same time, integrating multiple electronic devices in the same area and setting a wireless module in the bonding area can reduce the use of excessive tape and electrical connection wires in the traditional layout mode. This can reduce the thickness of the bezel, and one side of the display module can be used as the packaging side, thereby eliminating the need for the B cover. This not only reduces the production cost of the device, but also effectively reduces the overall noise of the device. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a cross-sectional schematic diagram of a display device provided in an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram showing the connection between the mainboard area and the display device area provided in an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention.

[0020] The above figures include the following reference numerals:

[0021] 10. Screen back cover; 101. Mounting part; 11. Side wall; 12. Bottom wall;

[0022] 20. Backlight module;

[0023] 30. Display module; 31. Array substrate; 32. Color filter substrate; 33. Polarizing layer;

[0024] 40. Binding area;

[0025] 50. Curing adhesive;

[0026] 60. Buffer components;

[0027] A. Mainboard area; B. Display device area; 70. Mainboard; 80. Signal transmitter; 90. Power management module; 100. Power coil transmitter module; 110. Inductor; 120. Driver IC; 130. Backlight driver module; 140. Signal receiver; 150. Fixing tape. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] like Figure 1As shown, in a first aspect, embodiments of the present invention provide a display device, the display device comprising: a screen back cover 10 having a mounting portion 101; a backlight module 20 disposed on the mounting portion 101; a display module 30 disposed on the light-emitting side of the backlight module 20, the display module 30 including at least an array substrate 31 and a color filter substrate 32 disposed opposite to the array substrate 31, one end of the array substrate 31 being longer than the color filter substrate 32 and forming a bonding region 40; and electronic devices including at least a power management module 90 and a backlight driving module 130, the electronic device comprising at least a power management module 90 and a backlight driving module 130, the electronic device comprising at least a power management module 90 and a backlight driving module 130, the backlight module 90 comprising at least a power management module 90 and a backlight driving module 130, the electronic device ... The sub-device is fixedly disposed within the bonding area 40 of the array substrate 31. The wireless module is at least partially disposed within the bonding area 40. The wireless module located within the bonding area is electrically connected to the electronic device. The wireless module is used to receive inductive signals and wireless signals. The array substrate 31 is disposed away from the backlight module 20 relative to the color filter substrate 32 and covers the opening side of the screen back cover 10. The electronic device is placed upside down inside the screen back cover 10 and located at the end of the backlight module 20. The electronic device, the screen back cover 10, and the backlight module 20 are fixed together by a curing adhesive 50.

[0030] Specifically, the wireless module includes an inductor 110 and a signal receiver 140. The signal receiver 140 is disposed in the bonding area 40 to receive wireless signals. The inductor 110 is disposed below the backlight module 20 and is electrically connected to the electronic devices in the bonding area 40.

[0031] In this application, the display module 30 also includes a polarizing layer 33, which serves as the outermost layer and acts as an encapsulation layer.

[0032] By applying the technical solution of the present invention, some electronic devices in the bonding area 40 are connected to the driver IC 120, and a curing adhesive 50 is provided on the outer periphery of the bonding area 40. This can prevent other components from affecting the operation of the electronic devices in the bonding area 40. At the same time, integrating multiple electronic devices in the same area can reduce the use of excessive tape in the traditional layout mode, thereby effectively reducing the overall noise of the device.

[0033] The backlight module 20 features both direct-lit and side-lit backlighting options. It includes a backplate and a light source. The backplate comprises a base plate and side plates, with the side plates perpendicular to the base plate. The backlight module 20 also includes an optical film, a light guide plate, and a reflective sheet, stacked sequentially from top to bottom on the base plate. The light source can be fixed to the backplate as a light strip or in an array. The fixing method can be adhesive bonding or other methods, which are not specifically limited in this application. The light-emitting unit 220 can be a light-emitting diode (LED) or other types of LEDs, such as a mini LED or a micro LED, which are not specifically limited in this application. In this application, the appropriate type can be selected based on actual usage requirements, thus improving the applicability and scope of the device.

[0034] Specifically, the outer wall of the curing adhesive 50 is adapted to the side walls of the backlight module 20 and the display module 30 to fill the gap between the curing adhesive 50 and the backlight module 20 and the display module 30. In this application, the curing adhesive 50 is specifically an insulating and light-shielding adhesive. This design not only reduces light leakage in the device but also prevents interference from external components to the electronic components within the bonding area 40, thereby ensuring stable operation of the device.

[0035] In this application, a fixing tape 150 is provided between the backlight module 20 and the display module 30, and a fixing tape 150 is provided between the backlight module 20 and the mounting part 101. This arrangement can fix the backlight module 20 and the display module 30 to prevent displacement during the use of the device, thereby facilitating the normal operation of the device.

[0036] Meanwhile, the display module 30 also includes a substrate (Glass), a buffer layer, a gate insulating layer (GI), an interlayer dielectric layer (ILD), a planarization layer (PLN), and a pixel definition layer (PDL). The TFT may include a source metal, a semiconductor layer, a gate metal, and a drain metal. The substrate material may include insulating materials such as glass, quartz, ceramic, plastic, or polyimide. A buffer layer may be formed on the substrate. The buffer layer material may include silicon nitride, silicon oxide, etc. The buffer layer can be used to prevent unwanted components such as impurities or moisture from penetrating the substrate and to form a planar surface; the semiconductor layer of the TFT may be formed on the buffer layer. A gate insulating layer may be formed on the semiconductor layer and the buffer layer; the gate insulating layer material may include silicon nitride, etc. The gate insulating layer may be photolithographically and etched to form two first vias penetrating the gate insulating layer, each first via potentially facing the semiconductor layer. A gate may be formed on the gate insulating layer. An interlayer dielectric layer (an example of a target layer) may be formed on the gate insulating layer and the gate. The interlayer dielectric layer can be photolithographically and etched to form two second vias penetrating the interlayer dielectric layer, each second via facing a first via. A metal layer can be deposited on the interlayer dielectric layer; during the metal layer formation process, the metal material can also be deposited in each of the first and second vias to form conductive contact holes. The metal layer can be photolithographically and etched to form the source and drain metals of the TFT. Next, a conductive material layer can be deposited on the source and drain metals, and the conductive material layer can be photolithographically and etched to form a third electrode. The third electrode can be electrically connected to the drain metal (or, the third electrode can be electrically connected to the source metal). The source and drain metals can be separated on the interlayer dielectric layer, and the source and drain metals can be electrically connected to the semiconductor layer through conductive contact holes, respectively. Generally, each pixel unit includes three color resist blocks: a red color resist block, a green color resist block, and a blue color resist block.

[0037] The semiconductor layer may include polysilicon and heavily doped regions. The semiconductor layer is divided into a channel region and source and drain regions formed on either side of the channel region. The channel region of the semiconductor is undoped polysilicon, i.e., an intrinsic semiconductor. The source and drain regions are polysilicon doped with conductive impurities, i.e., impurity semiconductors. The impurities doped in the source and drain regions can be either P-type or N-type impurities.

[0038] Specifically, the screen back cover 10 has a side wall 11 and a bottom wall 12 connected sequentially and arranged at an angle. The bottom wall 12 has a mounting portion 101. The side wall 11 is spaced from the display module 30. The side wall 11, bottom wall 12, display module 30, and backlight module 20 together form a receiving area. The bonding area 40 and curing adhesive 50 are disposed within the receiving area. This arrangement simplifies the overall structure of the device, thus facilitating assembly and improving assembly efficiency.

[0039] In this application, the included angle between the side wall 11 and the bottom wall 12 is 90°. Of course, in other embodiments of this application, the angle can also be set to 80°, 110° or other angles. The specific setting should be selected according to the usage environment of the device, as long as it can meet the usage requirements of the device.

[0040] Specifically, the height of the mounting section in the second direction is less than the height of the bottom wall 12 in the second direction. This arrangement reduces the overall height of the display module 30 and the backlight module 20, thereby minimizing the thickness of the display device and enabling lightweight design.

[0041] Furthermore, the sidewall 11 and the bottom wall 12 are integrally formed. This structure is not only easy to process, but also improves the structural strength of the device, reducing the possibility of breakage when the sidewall 11 and the bottom wall 12 collide with the outside world, thus extending the service life of the device.

[0042] Specifically, the display device also includes a buffer 60, with a gap between the sidewall 11 and the sidewall of the array substrate 31, and the buffer 60 is located between the sidewall 11 and the sidewall of the array substrate 31. This arrangement can prevent the buffer layer from colliding with the sidewall 11, thereby protecting the display module 30, and also preventing foreign objects from entering the receiving cavity, thereby further ensuring the stable operation of the device.

[0043] In this application, the buffer 60 is specifically a silicone ring.

[0044] like Figure 2 and Figure 3As shown, in a second aspect, embodiments of the present invention provide a display terminal, which includes the aforementioned display device. In this application, the display terminal includes a mainboard 70 area and a display device area. The inductor 110 is specifically an induction coil, and the signal receiver 140 is a BCM4331. The mainboard 70 is equipped with a power coil transmitter module 100, a power management module 90 (models SC9610 and SC8329), and a signal transmitter 80 (an L-PAMID module). The electronics area also includes an induction coil receiver module (model SW5208), a driver IC 120 (model NT36532), and a backlight driver module 130 (model NT50577). The mainboard 70 area includes the mainboard 70, the signal transmitter 80, the power management module 90, the power coil transmitter module 100, and the display device area. The display area includes a power management module 90, an inductor 110, a driver IC 120, a backlight driver module 130, and a signal receiver 140. The power management module 90 and the signal transmitter 80 are electrically connected to the mainboard 70. The power management module 90 controls the operating state of the power coil transmitter module 100. The inductor 110 can receive the inductance signal from the power coil transmitter module 100 and then transmit the signal to the power management module 90. The power management module 90 is electrically connected to the driver IC 120 and the backlight driver module 130 to provide them with power. The signal receiver 140 receives the signal from the signal transmitter 80 and transmits it to the driver IC 120 to output the display electrical signal. The backlight driver module 130 is used to output the electrical signal.

[0045] By applying the technical solution of the present invention, some electronic devices in the bonding area 40 are connected to the driver IC 120, and a curing adhesive 50 is provided on the outer periphery of the bonding area 40. This can prevent other components from affecting the operation of the electronic devices in the bonding area 40. At the same time, integrating multiple electronic devices in the same area can reduce the use of excessive tape in the traditional layout mode, thereby effectively reducing the overall noise of the device.

[0046] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0047] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0048] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0049] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0050] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0051] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A display device, characterized in that, The display device comprises: a back cover having a mounting portion; a backlight module arranged on the mounting portion; a display module arranged on a light-emitting side of the backlight module, the display module comprising at least an array substrate and a color film substrate arranged opposite to the array substrate, one end of the array substrate being longer than the color film substrate and forming a binding area; electronic devices comprising at least a power management module and a backlight driving module, the electronic devices being fixedly arranged in the binding area of the array substrate; a wireless module arranged at least partially in the binding area, the wireless module in the binding area being electrically connected to the electronic devices, and the wireless module being used for receiving an inductive signal and a wireless signal; wherein the array substrate is arranged away from the backlight module relative to the color film substrate and covers an opening side of the back cover, the electronic devices are inverted in the back cover and located at an end portion of the backlight module, and the electronic devices, the back cover and the backlight module are fixed by a cured adhesive.

2. The display device according to claim 1, wherein The wireless module comprises an inductive component and a signal receiving component, the signal receiving component is arranged in the binding area to receive the wireless signal, and the inductive component is arranged below the backlight module and electrically connected to the electronic devices in the binding area.

3. The display device according to claim 1, wherein An outer side wall of the cured adhesive is adapted to side walls of the backlight module and the display module to fill a gap between the cured adhesive and the backlight module and the display module.

4. The display device according to claim 1, wherein The display module further comprises a polarizing layer located on a side of the array substrate away from the color film substrate, and the polarizing layer forms a packaging side of the display device.

5. The display device according to any one of claims 1 to 4, wherein The back cover has a side wall and a bottom wall connected in sequence and arranged at an included angle, the bottom wall has the mounting portion, the side wall has a spacing with the display module, the side wall, the bottom wall, the display module and the backlight module jointly form an accommodation area, and the binding area and the cured adhesive are arranged in the accommodation area.

6. The display device according to claim 5, wherein A height of the mounting portion in a second direction is less than a height of the bottom wall in the second direction.

7. The display device according to claim 5, wherein The display device further comprises a buffer component, the side wall has a spacing with a side wall of the array substrate, and the buffer component is located between the side wall and the side wall of the array substrate.

8. The display device according to claim 7, wherein The buffer component is specifically a silica gel ring.

9. A display terminal, characterized by The display terminal comprises the display device according to any one of claims 1-8.

10. The display terminal according to claim 9, characterized by The display terminal further comprises a main board, the main board is provided with a power coil transmitting module and a signal transmitting component, the power coil transmitting module can transmit a wireless inductive signal to the inductive component of the display device, and the signal transmitting component can transmit a wireless signal to the signal receiving component of the display device.

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