A micro heat sink for large electronic equipment

Abstract

The application provides a micro heat dissipator for large electronic equipment heat dissipation. The micro heat dissipator for large electronic equipment heat dissipation comprises a square liquid storage cooling box, and the upper surface of the square liquid storage cooling box is fixedly connected with a fan. The micro heat dissipator for large electronic equipment heat dissipation can effectively improve the heat dissipation performance of the cooling box by adding a wind guide pipe, a metal heat dissipation plate and a hollow fin in the square liquid storage cooling box and adding an enhanced heat dissipation device outside, which helps to more effectively dissipate heat to the surrounding environment, thereby reducing the temperature of the liquid in the cooling box. Through the enhanced heat dissipation device, the cooling box can be cooled more quickly, thereby reducing the energy and time required for liquid cooling, reducing energy consumption, improving efficiency, reducing operating costs, and the design of the enhanced heat dissipation device can enable the square liquid storage cooling box to work effectively under various environmental conditions, whether in a high-temperature environment or a high-humidity environment.

Description

Technical Field

[0001] This invention relates to the field of micro heat sink technology, specifically a micro heat sink for heat dissipation in large electronic devices. Background Technology

[0002] Miniature heatsinks are typically made of metals with high thermal conductivity, such as copper and aluminum. Copper offers superior thermal conductivity but is more expensive and heavier. Aluminum is relatively lightweight and less expensive, but its thermal conductivity is slightly lower than copper. Complex fin and channel designs are crucial, as they increase the surface area in contact with air, thereby improving heat exchange efficiency. These fins can be manufactured using precision machining or casting processes to form complex geometries. Some miniature heatsinks use small fans to force airflow across the fins, improving heat dissipation efficiency. High-end systems may employ liquid cooling technology, using a coolant to remove heat. Thermal interface materials, such as thermal paste or pads, are typically used between the heatsink and electronic components to improve thermal contact and reduce thermal resistance.

[0003] When applying for this invention, the applicant, through a search, discovered a Chinese patent disclosing a "Miniature Heatsink for Heat Dissipation of Large Electronic Devices," application number "CN202010033296.2." This patent primarily integrates the heat dissipation core, nozzle interface, and mounting interface into a compact heatsink structure through brazing. This miniature heatsink structure can achieve counter-current, cross-flow, or co-current heat dissipation, employing a pump to drive the cold and hot fluids, and optimizing pipe connections and installation methods. This miniature heatsink, installed on the cooling system modules of large aerospace electronic devices, makes the structure of these devices more compact, lightweight, and reliable, thus optimizing the overall structure of such devices. However, with the increasing power density of electronic devices, miniature heatsinks face increasing challenges in heat dissipation capacity. Traditional air cooling methods may struggle to handle high heat loads. Therefore, based on the applicant's invention, a miniature heatsink for heat dissipation of large electronic devices has been invented, solving the problem of limited heat dissipation efficiency. Summary of the Invention

[0004] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a miniature heat sink for heat dissipation in large electronic devices, solving the problem of limited heat dissipation efficiency.

[0005] (II) Technical Solution To achieve the above objectives, the present invention provides the following technical solution: a miniature heat sink for heat dissipation in large electronic devices, comprising: A square liquid storage cooling tank, wherein a fan is fixedly connected to the upper surface of the square liquid storage cooling tank, a copper conductive pipe is fixedly connected to the output end of the fan, a connecting ventilation pipe is fixedly connected to the end of the copper conductive pipe away from the fan, an air guide pipe is fixedly connected to the side surface of the connecting ventilation pipe, a first cavity is formed inside the air guide pipe, and a circular air outlet is provided on the outer surface of the air guide pipe. A water pump is fixedly connected to the inner surface of the square liquid storage cooling tank. A diverter rod is fixedly connected to the output end of the water pump. A diverter port is fixedly connected to the end of the diverter rod away from the water pump. A first metal pipe is fixedly connected to the left surface of the square liquid storage cooling tank. A second metal pipe is fixedly connected to the right surface of the square liquid storage cooling tank. A metal heat sink is fixedly connected to the end of the first metal pipe away from the square liquid storage cooling tank. Hollow fins are fixedly connected to the front surface of the metal heat sink. An air guide pipe is located inside the hollow fins. The interior of the hollow fins and the upper surface of the air guide pipe form a heat dissipation cavity. A partition plate is fixedly connected to the inner surface of the square liquid storage cooling tank. A flow port is formed between one side of the partition plate and the square liquid storage cooling tank. An enhanced heat dissipation device includes a heat-conducting pipe, an injection hopper, an injection port, and a second cavity. One end of the heat-conducting pipe is fixedly connected to the injection hopper, the injection port is located on the upper surface of the injection hopper, and the second cavity is located inside the heat-conducting pipe.

[0006] Preferably, the circular air outlet extends into the interior of the air duct, and the number of the circular air outlets is multiple and distributed in a rectangular array.

[0007] Preferably, the upper surface of the fan is provided with a gas inflow pipe, and the number of hollow fins is multiple and distributed vertically.

[0008] Preferably, the side surface of the square liquid storage cooling tank is fixedly connected with metal fixing feet, and the upper surface of the metal fixing feet is provided with threaded mounting holes.

[0009] Preferably, the first metal pipe is connected to the diversion port, and the second metal pipe is connected to the right surface of the square liquid storage cooling tank.

[0010] Preferably, a heat dissipation gap is formed between two adjacent hollow fins, and an inflow pipe is provided on the side surface of the water pump.

[0011] Preferably, both the fan and the water pump are electrically connected to an external power source.

[0012] Preferably, the second cavity is located inside the square liquid storage and cooling tank, the injection hopper is located outside the square liquid storage and cooling tank, and the number of partition plates is multiple and staggered to facilitate the flow of liquid.

[0013] (III) Beneficial Effects This invention provides a miniature heat sink for heat dissipation in large electronic devices. It offers the following advantages: This miniature heat sink for cooling large electronic devices effectively improves the heat dissipation performance of a square liquid storage cooling tank by adding air ducts, metal heat sinks, and hollow fins inside, as well as an external enhanced heat dissipation device. This helps to dissipate heat more effectively to the surrounding environment, thereby reducing the temperature of the liquid inside the cooling tank. Through the enhanced heat dissipation device, the cooling tank can cool down more quickly, thereby reducing the energy and time required for liquid cooling, reducing energy consumption, improving efficiency, and reducing operating costs. The design of the enhanced heat dissipation device allows the square liquid storage cooling tank to work effectively under various environmental conditions, whether in high-temperature or high-humidity environments, and can better control the liquid temperature. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the present invention; Figure 3 A schematic diagram of the structure for enhancing heat dissipation; Figure 4 This is a partial structural schematic diagram of the present invention; Figure 5 for Figure 3 Enlarged schematic diagram of the structure at point A in the middle.

[0015] The components include: 1. Square liquid storage cooling tank; 2. Metal fixing feet; 3. Threaded mounting holes; 4. First metal tube; 5. Metal heat sink; 6. Hollow fins; 7. Second metal tube; 8. Fan; 9. Gas inlet pipe; 10. Copper conductive pipe; 11. Connecting ventilation pipe; 12. Air duct; 13. First cavity; 14. Circular air outlet; 15. Heat dissipation cavity; 16. Heat dissipation gap; 17. Enhanced heat dissipation device; 18. Heat conduction pipe; 19. Injection hopper; 20. Injection port; 21. Second cavity; 22. Diverter rod; 23. Diverter port; 24. Water pump; 25. Inlet pipe; 26. Divider plate; 27. Flow port. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] like Figure 1-5As shown, this embodiment of the invention provides a miniature heat sink for heat dissipation of large electronic devices, including a square liquid storage cooling tank 1. A metal fixing foot 2 is fixedly connected to the side surface of the square liquid storage cooling tank 1. A threaded mounting hole 3 is provided on the upper surface of the metal fixing foot 2. A fan 8 is fixedly connected to the upper surface of the square liquid storage cooling tank 1. A gas inflow pipe 9 is provided on the upper surface of the fan 8. Multiple hollow fins 6 are arranged vertically. A copper conductive pipe 10 is fixedly connected to the output end of the fan 8. The fan 8 and a water pump 24 are electrically connected to an external power source. A connecting ventilation pipe 11 is fixedly connected to the end of the copper conductive pipe 10 away from the fan 8. A guide pipe 12 is fixedly connected to the side surface of the connecting ventilation pipe 11. A first cavity 13 is formed inside the guide pipe 12. A circular air outlet 14 is provided on the outer surface of the guide pipe 12, extending into the interior of the guide pipe 12. Multiple circular air outlets 14 are arranged in a rectangular array.

[0018] A water pump 24 is fixedly connected to the inner surface of a square liquid storage cooling tank 1. A diverter rod 22 is fixedly connected to the output end of the water pump 24. A diverter port 23 is fixedly connected to the end of the diverter rod 22 away from the water pump 24. A first metal pipe 4 is fixedly connected to the left surface of the square liquid storage cooling tank 1 and communicates with the diverter port 23. A second metal pipe 7 communicates with the right surface of the square liquid storage cooling tank 1 and is fixedly connected to the right surface of the square liquid storage cooling tank 1. The first metal pipe 4 is located away from the square liquid storage cooling tank. A metal heat sink 5 is fixedly connected to one end of the box 1. Hollow fins 6 are fixedly connected to the front surface of the metal heat sink 5. A heat dissipation gap 16 is formed between two adjacent hollow fins 6. An inflow pipe 25 is provided on the side surface of the water pump 24. An air guide pipe 12 is located inside the hollow fins 6. The interior of the hollow fins 6 and the upper surface of the air guide pipe 12 form a heat dissipation cavity 15. A partition plate 26 is fixedly connected to the inner surface of the square liquid storage cooling box 1. A flow port 27 is formed between one side of the partition plate 26 and the square liquid storage cooling box 1.

[0019] The enhanced heat dissipation device 17 includes a heat-conducting pipe 18, an injection hopper 19, an injection port 20, and a second cavity 21. One end of the heat-conducting pipe 18 is fixedly connected to the injection hopper 19. The injection port 20 is located on the upper surface of the injection hopper 19. The second cavity 21 is located inside the heat-conducting pipe 18 and inside the square liquid storage cooling tank 1. The injection hopper 19 is located outside the square liquid storage cooling tank 1. There are multiple partition plates 26 that are staggered to facilitate the flow of liquid.

[0020] Working principle: The hollow fins 6 are brought into contact with the device that needs to be cooled, with only one side in contact with the device. During the cooling process, the fan 8 and water pump 24 are turned on respectively. The liquid flows inside the square liquid storage cooling tank 1, and the gas flows between the ventilation pipe 11 and the first cavity 13, which can perform normal cooling of the device. When the temperature needs to be temporarily adjusted, liquid nitrogen can be placed inside the second cavity 21 through the injection port 20 to quickly absorb heat.

[0021] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A miniature heat sink for heat dissipation in large electronic devices, characterized in that, include: A square liquid storage cooling tank (1) is provided with a fan (8) fixedly connected to its upper surface. A copper conductive pipe (10) is fixedly connected to the output end of the fan (8). A connecting ventilation pipe (11) is fixedly connected to the end of the copper conductive pipe (10) away from the fan (8). A guide pipe (12) is fixedly connected to the side surface of the connecting ventilation pipe (11). A first cavity (13) is formed inside the guide pipe (12). A circular air outlet (14) is provided on the outer surface of the guide pipe (12). A water pump (24) is fixedly connected to the inner surface of the square liquid storage cooling tank (1). A diverter rod (22) is fixedly connected to the output end of the water pump (24). A diverter port (23) is fixedly connected to the end of the diverter rod (22) away from the water pump (24). A first metal pipe (4) is fixedly connected to the left surface of the square liquid storage cooling tank (1). A second metal pipe (7) is fixedly connected to the right surface of the square liquid storage cooling tank (1). The first metal pipe (4) is located away from the square liquid storage cooling tank. 1) One end is fixedly connected to a metal heat sink plate (5), and a hollow fin (6) is fixedly connected to the front surface of the metal heat sink plate (5). The air guide pipe (12) is located inside the hollow fin (6). The interior of the hollow fin (6) and the upper surface of the air guide pipe (12) form a heat dissipation cavity (15). A partition plate (26) is fixedly connected to the inner surface of the square liquid storage cooling tank (1). A flow port (27) is formed between one side of the partition plate (26) and the square liquid storage cooling tank (1). Enhanced heat dissipation device (17) includes heat pipe (18), injection hopper (19), injection port (20) and second cavity (21). One end of the heat pipe (18) is fixedly connected to the injection hopper (19). The injection port (20) is located on the upper surface of the injection hopper (19). The second cavity (21) is located inside the heat pipe (18). The circular air outlet (14) extends into the interior of the air duct (12). The number of circular air outlets (14) is multiple and they are distributed in a rectangular array.

2. A miniature heat sink for heat dissipation in large electronic devices according to claim 1, characterized in that: The upper surface of the fan (8) is provided with a gas inflow pipe (9), and the number of hollow fins (6) is multiple and distributed vertically.

3. A miniature heat sink for heat dissipation in large electronic devices according to claim 1, characterized in that: The side surface of the square liquid storage cooling tank (1) is fixedly connected with a metal fixing foot (2), and the upper surface of the metal fixing foot (2) is provided with a threaded mounting hole (3).

4. A miniature heat sink for heat dissipation in large electronic devices according to claim 1, characterized in that: The first metal tube (4) is connected to the diversion port (23), and the second metal tube (7) is connected to the right surface of the square liquid storage cooling tank (1).

5. A miniature heat sink for heat dissipation in large electronic devices according to claim 1, characterized in that: A heat dissipation gap (16) is formed between two adjacent hollow fins (6), and an inflow pipe (25) is provided on the side surface of the water pump (24).

6. A miniature heat sink for heat dissipation in large electronic devices according to claim 1, characterized in that: The fan (8) and water pump (24) are both electrically connected to an external power source.

7. A miniature heat sink for heat dissipation in large electronic devices according to claim 1, characterized in that: The second cavity (21) is located inside the square liquid storage cooling tank (1), the injection hopper (19) is located outside the square liquid storage cooling tank (1), and the number of partition plates (26) is multiple and staggered to facilitate the flow of liquid.

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