A high-viscosity ultra-thin high-temperature resistant protective tape and preparation method thereof

Abstract

The present application relates to the field of tape technology, and specifically discloses a high-viscosity ultra-thin high-temperature resistant protective tape and a preparation method thereof. A high-viscosity ultra-thin high-temperature resistant protective tape comprises a barrier layer, a substrate layer, a primer layer and a pressure-sensitive adhesive layer connected in sequence from top to bottom. The preparation method of the high-viscosity ultra-thin high-temperature resistant protective tape comprises the following steps: S1, mixing and stirring the raw materials of the primer layer to obtain a primer and apply it on one side of the polyimide film to form a primer layer; S2, mixing and stirring the raw materials of the pressure-sensitive adhesive layer to obtain an acrylate pressure-sensitive adhesive and apply it on the primer layer to form a pressure-sensitive adhesive layer; S3, mixing and stirring the raw materials of the barrier layer to obtain a barrier agent and apply it on the other side of the polyimide film to form a barrier layer, and winding to obtain a high-viscosity ultra-thin high-temperature resistant protective tape. The high-viscosity ultra-thin high-temperature resistant protective tape has high temperature resistance and low volatility.

Description

Technical Field

[0001] The present application relates to the field of adhesive tape technology, and in particular to a high-viscosity, ultra-thin, high-temperature-resistant protective adhesive tape and a preparation method thereof. Background Art

[0002] Protective tape is a functional material widely used in the manufacturing or use of electronic and electrical equipment, microelectronics, integrated packaging, and electrical equipment to provide protection. It has properties such as high and low temperature resistance, acid and alkali resistance, solvent resistance, and electrical insulation (H grade).

[0003] Protective tape mainly consists of a base layer and an adhesive layer. After a long high-temperature process, there is a problem of poor adhesion between the pressure-sensitive adhesive in the adhesive layer and the polyimide in the base layer. In addition, after the high-temperature process, a large amount of VOC (volatile organic compounds) will overflow, and there is always a limitation on the release of volatilization of pollutants. Summary of the Invention

[0004] In order to solve at least one of the above technical problems, a protective tape with high temperature resistance and low VOC volatility is developed. The present application provides a high-viscosity ultra-thin high-temperature resistant protective tape and a preparation method thereof.

[0005] On the one hand, the present application provides a high-adhesion, ultra-thin, high-temperature-resistant protective tape, comprising a barrier layer, a substrate layer, a primer layer, and a pressure-sensitive adhesive layer connected sequentially from top to bottom;

[0006] The substrate layer is a polyimide film;

[0007] The thickness of the barrier layer is 5-8 μm, the thickness of the substrate layer is 10-15 μm, the thickness of the primer layer is 5-8 μm, and the thickness of the pressure-sensitive adhesive layer is 5-10 μm.

[0008] By adopting the above-mentioned technical solution, the present application uses a polyimide film as a base material, adopts a pressure-sensitive adhesive layer, and arranges a primer between the polyimide film and the pressure-sensitive adhesive layer, thereby effectively increasing the adhesion firmness of the tape and ensuring the use effect of the tape, thereby improving the viscosity and adhesion between the pressure-sensitive adhesive layer and the polyimide film. At the same time, a barrier layer is arranged on the other side of the polyimide film, which can effectively reduce the release of pollutants VOC at high temperatures.

[0009] Optionally, the barrier layer comprises the following components in parts by weight: 40-60 parts of aqueous epoxy resin emulsion, 3-5 parts of montmorillonite, 4-6 parts of wollastonite, and 1-3 parts of dispersant.

[0010] Optionally, the particle size of the montmorillonite is 300-400 mesh, and the particle size of the wollastonite is 200-300 mesh.

[0011] By adopting the above technical solution, by adding montmorillonite and zinc-magnesium-aluminum hydrotalcite and limiting their particle sizes, the overflow of VOC is reduced under the joint action of the two.

[0012] Optionally, the primer layer comprises the following components in parts by weight: 10-20 parts of methyl orthosilicate, 45-60 parts of aminopropyltrimethoxysilane, 40-50 parts of methanol, and 2-5 parts of triethylamine.

[0013] Optionally, the weight ratio of methyl orthosilicate to aminopropyltrimethoxysilane is (0.8-1.2):(3-4).

[0014] By adopting the above technical solution, the present application uses methyl orthosilicate and aminopropyltrimethoxysilane and limits the usage ratio of the two, which can effectively enhance the adhesion between the pressure-sensitive adhesive layer and the substrate layer.

[0015] Optionally, the pressure-sensitive adhesive layer comprises the following components in parts by weight: 50-60 parts of modified acrylate adhesive, 10-20 parts of isocyanate, and 10-15 parts of epoxy system two-component curing agent.

[0016] Optionally, the modified acrylic adhesive comprises the following components in parts by weight: 15-30 parts of ethyl acrylate, 25-40 parts of butyl acrylate, 20-30 parts of styrene, 5-10 parts of hydroxypropyl acrylate, 0.8-1.5 parts of dibenzoyl peroxide, 0.2-1.5 parts of sodium octylbenzenesulfonate, and 30-40 parts of water.

[0017] Optionally, the weight ratio of ethyl acrylate, butyl acrylate, styrene and hydroxypropyl acrylate is (4-6):(5-7):(4-5):(1-2).

[0018] By adopting the above technical solution, this application uses ethyl acrylate and butyl acrylate as mixed soft monomers, styrene as a hard monomer, and hydroxypropyl acrylate as a cross-linking monomer. The prepared modified acrylate adhesive has excellent bonding strength and welding resistance.

[0019] Optionally, the modified acrylic adhesive has a glass transition temperature (Tg) of -30°C, a rheological modulus G' at 23°C of 105-6Pa, and rheological moduli G' and G" at 120°C of 104-5Pa.

[0020] Optionally, the epoxy system two-component curing agent is ethylenediamine and xylidine.

[0021] In a second aspect, the present application provides a method for preparing the above-mentioned high-viscosity ultra-thin high-temperature resistant protective tape, comprising the following steps: S1, adding aminopropyltrimethoxysilane and methyl orthosilicate to methanol, then adding triethylamine, mixing and stirring to obtain a primer, and applying the primer to one side of a polyimide film to form a primer layer;

[0022] S2, mixing and stirring a modified acrylate adhesive and an isocyanate, and then adding an epoxy system two-component curing agent and mixing and stirring to obtain an acrylate pressure-sensitive adhesive, and applying the acrylate pressure-sensitive adhesive on the primer layer to form a pressure-sensitive adhesive layer;

[0023] S3. Mix and stir the water-based epoxy resin emulsion, montmorillonite, wollastonite and dispersant to obtain a barrier agent, apply the barrier agent to the other side of the polyimide film to form a barrier layer, and then roll it up after curing and drying to obtain the high-viscosity ultra-thin high-temperature resistant protective tape.

[0024] Optionally, in step S3, a three-stage drying process is adopted for drying, the first stage drying temperature is 60-70℃, the drying time is 1-2min, the second stage drying temperature is 100-120℃, the drying time is 5-6min, the third stage drying temperature is 160-180℃, the drying time is 2-3min, and the fourth stage drying temperature is 90-100℃, and the drying time is 5-6min.

[0025] By adopting the above technical solution, the protective tape prepared in the present application has good high temperature resistance, low volatility and high adhesion, and the preparation method is simple, which is suitable for large-scale production.

[0026] Optionally, in step S2, the modified acrylate adhesive is prepared by mixing water and sodium octylbenzenesulfonate, adding ethyl acrylate, butyl acrylate, styrene and hydroxypropyl acrylate, and mixing, and then adding dibenzoyl peroxide and mixing to obtain the modified acrylate adhesive.

[0027] In summary, the present invention includes at least one of the following beneficial technical effects:

[0028] 1. This application uses polyimide film as the base material, adopts pressure-sensitive adhesive, and sets a primer between the polyimide film and the pressure-sensitive adhesive, which effectively increases the adhesion firmness of the tape, ensures the use effect of the tape, thereby improving the viscosity and adhesion of the tape. At the same time, a barrier layer is set on the other side of the polyimide film, which can effectively reduce the release of pollutants at high temperatures.

[0029] 2. This application uses methyl orthosilicate and aminopropyltrimethoxysilane, and limits the usage ratio of the two, which can effectively enhance the adhesion between the pressure-sensitive adhesive layer and the substrate layer; this application uses ethyl acrylate and butyl acrylate as mixed soft monomers, styrene as a hard monomer, and hydroxypropyl acrylate as a cross-linking monomer. The modified acrylate adhesive obtained has excellent bonding strength and solder resistance.

[0030] 3. The protective tape prepared in this application has good high temperature resistance, low volatility and high viscosity, and the preparation method is simple, which is suitable for large-scale production. DETAILED DESCRIPTION

[0031] The present application is further described in detail below with reference to the embodiments.

[0032] The present application designs a high-adhesion, ultra-thin, high-temperature-resistant protective tape, comprising a barrier layer, a substrate layer, a primer layer, and a pressure-sensitive adhesive layer connected sequentially from top to bottom;

[0033] The substrate layer is a polyimide film;

[0034] The thickness of the barrier layer is 5-8 μm, the thickness of the substrate layer is 10-15 μm, the thickness of the primer layer is 5-8 μm, and the thickness of the pressure-sensitive adhesive layer is 5-10 μm.

[0035] The high-viscosity ultra-thin high-temperature resistant protective tape of the present application is prepared by the following method, comprising the following steps:

[0036] S1. Add aminopropyltrimethoxysilane and methyl orthosilicate to methanol, then add triethylamine, mix and stir to obtain a primer, apply the primer to one side of the polyimide film, and form a primer layer after curing and drying;

[0037] S2, mixing and stirring a modified acrylate adhesive and an isocyanate, and then adding an epoxy system two-component curing agent and mixing and stirring to obtain an acrylate pressure-sensitive adhesive, applying the acrylate pressure-sensitive adhesive on the primer layer, and curing to form a pressure-sensitive adhesive layer;

[0038] S3. Mix and stir the water-based epoxy resin emulsion, montmorillonite, wollastonite and dispersant to obtain a barrier agent, apply the barrier agent to the other side of the polyimide film to form a barrier layer, and then roll it up after curing and drying to obtain the high-viscosity ultra-thin high-temperature resistant protective tape.

[0039] This application uses polyimide film as the base material, adopts pressure-sensitive adhesive, and sets a primer between the polyimide film and the pressure-sensitive adhesive, which effectively increases the adhesion firmness of the tape, ensures the use effect of the tape, and thus improves the viscosity and adhesion of the tape. At the same time, a barrier layer is set on the other side of the polyimide film, which can effectively reduce the release of pollutants at high temperatures.

[0040] The protective tape prepared in the present application has good high temperature resistance, low volatility and high viscosity, and the preparation method is simple, which is suitable for large-scale production. Specific embodiments

[0042] The raw materials used in this application are as follows. Unless otherwise specified, all raw materials used in this application are commercially available:

[0043] Water-based epoxy resin emulsion: Sanmu SM828 epoxy resin;

[0044] The dispersant is BYK-2155, brand: BYK;

[0045] Methyl orthosilicate: CAS: 681-84-5, Zhangjiagang Xinya Chemical Co., Ltd.

[0046] Aminopropyltrimethoxysilane: CAS: 13822-56-5, Nanjing Quanxi New Materials Co., Ltd.

[0047] Ethyl Acrylate, Hydroxypropyl Acrylate, Styrene, Dibenzoyl Peroxide: Aladdin;

[0048] Sodium octylbenzenesulfonate: Beijing Bailingwei Technology Co., Ltd.;

[0049] Ethylenediamine: CAS: 6780-13-8, Aladdin;

[0050] Xylidine: CAS: 552-82-9, Jinan Zi'an Chemical Co., Ltd.

[0051] Isocyanate: CAS: 75-13-8, Nanjing Weiao Chemical Co., Ltd.

[0052] Preparation Example 1-3 Preparation of barrier agent

[0053] Preparation Example 1

[0054] 40 parts of waterborne epoxy resin emulsion, 3 parts of montmorillonite, 4 parts of wollastonite and 1 part of dispersant were mixed, and stirred and dispersed at a stirring speed of 700 rpm for 3 minutes to obtain a barrier agent; the particle size of montmorillonite was 300 mesh, and the particle size of wollastonite was 200 mesh.

[0055] Preparation Example 2

[0056] Take 50 parts of water-based epoxy resin emulsion, 4 parts of montmorillonite, 5 parts of wollastonite and 2 parts of dispersant, mix them, and stir and disperse them at a stirring speed of 700 rpm for 3 minutes to obtain a barrier agent; the particle size of montmorillonite is 300 mesh, and the particle size of wollastonite is 200 mesh.

[0057] Preparation Example 3

[0058] 60 parts of waterborne epoxy resin emulsion, 5 parts of montmorillonite, 6 parts of wollastonite and 3 parts of dispersant were mixed, and stirred and dispersed at a stirring speed of 700 rpm for 3 minutes to obtain a barrier agent; the particle size of montmorillonite was 300 mesh and the particle size of wollastonite was 200 mesh.

[0059] Preparation Example 4-6 Preparation of Primer

[0060] Preparation Example 4

[0061] 45 parts of aminopropyltrimethoxysilane and 10 parts of methyl orthosilicate were added to 40 parts of methanol, and then 2 parts of triethylamine were added. The mixture was stirred at a stirring speed of 500 rpm for 10 minutes and allowed to stand for 1 hour to obtain a primer.

[0062] Preparation Example 5

[0063] 52 parts of aminopropyltrimethoxysilane and 16 parts of methyl orthosilicate were added to 45 parts of methanol, and then 3 parts of triethylamine were added. The mixture was stirred at a stirring speed of 500 rpm for 10 minutes and allowed to stand for 1 hour to obtain a primer.

[0064] Preparation Example 6

[0065] 60 parts of aminopropyltrimethoxysilane and 20 parts of methyl orthosilicate were added to 50 parts of methanol, and then 5 parts of triethylamine were added. The mixture was stirred at a stirring speed of 500 rpm for 10 minutes and allowed to stand for 1 hour to obtain a primer.

[0066] Preparation Example 7-9 Preparation of modified acrylic adhesive

[0067] Preparation Example 7

[0068] Take 30 parts of water and 0.2 parts of sodium octylbenzenesulfonate, mix and stir at a stirring speed of 1000 rpm for 15 minutes, then add 15 parts of ethyl acrylate, 25 parts of butyl acrylate, 20 parts of styrene and 5 parts of hydroxypropyl acrylate and mix and stir for 30 minutes, and then add 0.8 parts of dibenzoyl peroxide and mix and stir for 30 minutes to obtain a modified acrylic adhesive.

[0069] Preparation Example 8

[0070] Take 35 parts of water and 1 part of sodium octylbenzenesulfonate, mix and stir at a stirring speed of 1000 rpm for 15 minutes, then add 23 parts of ethyl acrylate, 30 parts of butyl acrylate, 25 parts of styrene and 8 parts of hydroxypropyl acrylate, mix and stir, and then add 1 part of dibenzoyl peroxide and mix and stir to obtain a modified acrylic adhesive.

[0071] Preparation Example 9

[0072] Take 40 parts of water and 1.5 parts of sodium octylbenzenesulfonate, mix and stir at a stirring speed of 1000 rpm for 15 minutes, then add 30 parts of ethyl acrylate, 40 parts of butyl acrylate, 30 parts of styrene and 10 parts of hydroxypropyl acrylate and mix and stir for 30 minutes, and then add 1.5 parts of dibenzoyl peroxide and mix and stir for 30 minutes to obtain a modified acrylic adhesive.

[0073] Examples 1-3

[0074] Example 1

[0075] A method for preparing a high-viscosity ultra-thin high-temperature resistant protective tape comprises the following steps:

[0076] S1, applying the primer obtained in Preparation Example 4 on one side of a 10 μm thick polyimide film, and curing and drying to form a 5 μm thick primer coating;

[0077] S2. 50 parts of the modified acrylate adhesive prepared in Preparation Example 7 and 10 parts of isocyanate were mixed and stirred, and then 10 parts of an epoxy system two-component curing agent were added and mixed and stirred to obtain an acrylate pressure-sensitive adhesive. The acrylate pressure-sensitive adhesive was applied on the primer layer to form a 5 μm thick pressure-sensitive adhesive layer; the epoxy system two-component curing agent was ethylenediamine and xylidine in a weight ratio of 1:1;

[0078] S3. Coat the barrier agent prepared in Preparation Example 1 on the other side of the polyimide film to form a 5 μm thick barrier layer, and then roll it up after curing and drying to obtain the high-viscosity ultra-thin high-temperature resistant protective tape.

[0079] In step S3, a three-stage drying process is adopted for drying. The first stage is dried at a temperature of 60°C and a drying time of 2 minutes. The second stage is dried at a temperature of 100°C and a drying time of 6 minutes. The third stage is dried at a temperature of 160°C and a drying time of 3 minutes. The fourth stage is dried at a temperature of 90°C and a drying time of 6 minutes.

[0080] Example 2

[0081] A method for preparing a high-viscosity ultra-thin high-temperature resistant protective tape comprises the following steps:

[0082] S1, applying the primer obtained in Preparation Example 5 on one side of a 13 μm thick polyimide film to form a 7 μm thick primer layer;

[0083] S2. 55 parts of the modified acrylate adhesive prepared in Preparation Example 8 and 15 parts of isocyanate were mixed and stirred, and then 13 parts of an epoxy system two-component curing agent were added and mixed and stirred to obtain an acrylate pressure-sensitive adhesive. The acrylate pressure-sensitive adhesive was applied on the primer layer to form an 8 μm thick pressure-sensitive adhesive layer; the epoxy system two-component curing agent was ethylenediamine and xylidine in a weight ratio of 1:1;

[0084] S3. Coating the barrier agent prepared in Preparation Example 2 on the other side of the polyimide film to form a 6 μm thick barrier layer, curing and drying the film, and then rolling the film to obtain the high-viscosity ultra-thin high-temperature resistant protective tape.

[0085] In step S3, a three-stage drying process is adopted for drying. The first stage is dried at a temperature of 65°C and a drying time of 2 minutes. The second stage is dried at a temperature of 110°C and a drying time of 5 minutes. The third stage is dried at a temperature of 170°C and a drying time of 2 minutes. The fourth stage is dried at a temperature of 95°C and a drying time of 6 minutes.

[0086] Example 3

[0087] A method for preparing a high-viscosity ultra-thin high-temperature resistant protective tape comprises the following steps:

[0088] S1, applying the primer obtained in Preparation Example 5 on one side of a 15 μm thick polyimide film to form an 8 μm thick primer layer;

[0089] S2, 60 parts of the modified acrylate adhesive prepared in Preparation Example 8 and 20 parts of isocyanate were mixed and stirred, and then 15 parts of an epoxy system two-component curing agent were added and mixed and stirred to obtain an acrylate pressure-sensitive adhesive, and the acrylate pressure-sensitive adhesive was applied on the primer layer to form a 10 μm thick pressure-sensitive adhesive layer; the epoxy system two-component curing agent was ethylenediamine and xylidine in a weight ratio of 1:1;

[0090] S3. Coating the barrier agent prepared in Preparation Example 3 on the other side of the polyimide film to form an 8 μm thick barrier layer, curing and drying the film, and then rolling the film to obtain the high-viscosity ultra-thin high-temperature resistant protective tape.

[0091] In step S3, a three-stage drying process is adopted for drying. The first stage is dried at a temperature of 70°C and a drying time of 1 minute. The second stage is dried at a temperature of 120°C and a drying time of 5 minutes. The third stage is dried at a temperature of 180°C and a drying time of 2 minutes. The fourth stage is dried at a temperature of 100°C and a drying time of 5 minutes.

[0092] Comparative Example 1

[0093] Based on Example 2, the difference between this comparative example and Example 2 is that no barrier layer is provided in this comparative example.

[0094] Comparative Example 2

[0095] Based on Example 2, the difference between this comparative example and Example 2 is that this comparative example does not provide a primer layer.

[0096] Example 4

[0097] Based on Example 2, the difference between this example and Example 2 is that the particle size of the montmorillonite is 350 mesh.

[0098] Example 5

[0099] Based on Example 2, the difference between this example and Example 2 is that the particle size of the montmorillonite is 400 mesh.

[0100] Example 6

[0101] Based on Example 4, the difference between this example and Example 4 is that the particle size of wollastonite is 250 mesh.

[0102] Example 7

[0103] Based on Example 4, the difference between this example and Example 4 is that the particle size of the montmorillonite is 300 mesh.

[0104] Example 8

[0105] Based on Example 6, the difference between this example and Example 6 is that the weight ratio of ethyl acrylate, butyl acrylate, styrene and hydroxypropyl acrylate is 4:5:4:1.

[0106] Example 9

[0107] Based on Example 6, the difference between this example and Example 6 is that the weight ratio of ethyl acrylate, butyl acrylate, styrene and hydroxypropyl acrylate is 6:7:5:2.

[0108] Example 10

[0109] Based on Example 6, the difference between this example and Example 6 is that the weight ratio of methyl orthosilicate to aminopropyltrimethoxysilane is 0.8:3.

[0110] Example 11

[0111] Based on Example 6, the difference between this example and Example 6 is that the weight ratio of methyl orthosilicate to aminopropyltrimethoxysilane is 1.2:4.

[0112] Experimental testing

[0113] Please refer to Table 1 below for test items and methods.

[0114] Table 1

[0115]

[0116] Long-term heat resistance: The special process temperature is higher than 260℃ and the time is more than 4 hours. The product is required not to have aging, decreased adhesion, or precipitation of polluting organic matter.

[0117] Experimental tests were performed on Examples 1-11 and Comparative Examples 1-2. The experimental results are shown in Table 2.

[0118] Table 2.

[0119]

[0120] Results analysis combined with Examples 1-3, Comparative Examples 1-2 and Table 2 shows that the protective tape prepared according to the present application has excellent adhesion, solder resistance and high temperature resistance, and can significantly reduce VOC overflow in high temperature scenarios.

[0121] Combining Examples 4-7 and Table 2, it can be seen that when the particle size of montmorillonite is 300-400 mesh and the particle size of wollastonite is 200-300 mesh, the comprehensive performance of the prepared high-viscosity ultra-thin high-temperature resistant protective tape is better.

[0122] Combining Examples 8-9 and Table 2, it can be seen that when the weight ratio of ethyl acrylate, butyl acrylate, styrene, and hydroxypropyl acrylate is (4-6):(5-7):(4-5):(1-2), the obtained high-viscosity ultra-thin high-temperature resistant protective tape has better comprehensive performance.

[0123] Combining Examples 10-11 and Table 2, it can be seen that when the weight ratio of methyl orthosilicate to aminopropyltrimethoxysilane is (0.8-1.2):(3-4), the obtained high-viscosity ultra-thin high-temperature resistant protective tape has better comprehensive performance.

[0124] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A high-viscosity ultra-thin high-temperature resistant protective tape, characterized in that: It includes a barrier layer, a substrate layer, a primer layer and a pressure-sensitive adhesive layer which are connected in sequence from top to bottom; The substrate layer is a polyimide film; The thickness of the barrier layer is 5-8 μm, the thickness of the substrate layer is 10-15 μm, the thickness of the primer layer is 5-8 μm, and the thickness of the pressure-sensitive adhesive layer is 5-10 μm; The barrier layer comprises the following components in parts by weight: 40-60 parts of waterborne epoxy resin emulsion, 3-5 parts of montmorillonite, 4-6 parts of wollastonite, and 1-3 parts of dispersant; The primer layer comprises the following components in parts by weight: 10-20 parts of methyl orthosilicate, 45-60 parts of aminopropyltrimethoxysilane, 40-50 parts of methanol, and 2-5 parts of triethylamine; The pressure-sensitive adhesive layer comprises the following components in parts by weight: 50-60 parts of modified acrylate adhesive, 10-20 parts of isocyanate, and 10-15 parts of epoxy system two-component curing agent; The modified acrylic adhesive comprises the following components in parts by weight: 15-30 parts of ethyl acrylate, 25-40 parts of butyl acrylate, 20-30 parts of styrene, 5-10 parts of hydroxypropyl acrylate, 0.8-1.5 parts of dibenzoyl peroxide, 0.2-1.5 parts of sodium octylbenzene sulfonate, and 30-40 parts of water.

2. The high-viscosity ultra-thin high-temperature resistant protective tape according to claim 1, characterized in that: The particle size of the montmorillonite is 300-400 meshes, and the particle size of the wollastonite is 200-300 meshes.

3. The high-viscosity ultra-thin high-temperature resistant protective tape according to claim 1, characterized in that: The modified acrylic adhesive has a glass transition temperature (Tg) of -30°C and a rheological modulus G′ of 10 5-6 Pa, 120℃ rheological modulus G′ and G′′ at 10 4-5 Pa.

4. The high-viscosity ultra-thin high-temperature resistant protective tape according to claim 1, characterized in that: The epoxy system two-component curing agent is ethylenediamine and xylidine.

5. A method for preparing the high-viscosity ultra-thin high-temperature resistant protective tape according to any one of claims 1 to 4, characterized in that: The following steps are involved: S1, adding aminopropyltrimethoxysilane and methyl orthosilicate into methanol, and then adding triethylamine, mixing and stirring to obtain a primer, and applying the primer on one side of the polyimide film to form a primer layer; S2, mixing and stirring the modified acrylate adhesive and isocyanate, and then adding the epoxy system two-component curing agent and mixing and stirring to obtain an acrylate pressure-sensitive adhesive, and applying the acrylate pressure-sensitive adhesive on the primer layer to form a pressure-sensitive adhesive layer; S3. Mix and stir the water-based epoxy resin emulsion, montmorillonite, wollastonite and dispersant to obtain a barrier agent, apply the barrier agent on the other side of the polyimide film to form a barrier layer, and roll it up after curing and drying to obtain the high-viscosity ultra-thin high-temperature resistant protective tape.

6. The method for preparing the high-viscosity ultra-thin high-temperature resistant protective tape according to claim 5, characterized in that: In step S2, the preparation method of the modified acrylic adhesive is: after mixing water and sodium octylbenzene sulfonate, ethyl acrylate, butyl acrylate, styrene and hydroxypropyl acrylate are added and mixed, and then dibenzoyl peroxide is added and mixed to obtain the modified acrylic adhesive.

Images