A high-purity gas delivery system and method for semiconductor chip processing

Abstract

This invention discloses a high-purity gas delivery system and method for semiconductor chip processing, comprising a base mounting mechanism for installation and a gas tank body for gas storage. A filter self-cleaning mechanism for transmission and cleaning is installed on the right side of the base mounting mechanism. The base mounting mechanism includes a working platform, and an arc-shaped mounting seat is fixedly connected to the left side of the top of the working platform, and several arc-shaped mounting seats are provided. By combining the base mounting mechanism and the filter self-cleaning mechanism, the gas tank body can be directly replaced after the gas is used up, which avoids gas mixing and improves efficiency. After the gas tank body is installed, its own weight can be used to limit and fix the support column. At the same time, when the gas flows, the clamping strip can also align with the docking slot to fix the arc-shaped clamping plate.

Description

Technical Field

[0001] This invention relates to the field of gas delivery technology, specifically to a high-purity gas delivery system and method for semiconductor chip processing. Background Technology

[0002] Whether in industrial production, medical rescue, scientific research, or daily life, large quantities of high-purity gas are needed, requiring the gas to be transported to various locations. This necessitates the use of a high-purity gas delivery mechanism. Based on existing technology, it has been found that when using existing high-purity gas delivery mechanisms, the gas needs to be discharged from the cylinder during delivery. However, this discharge process can easily leave residue inside the cylinder. When high-purity gas is then loaded and mixes with the residual high-purity gas, it affects the purity of the gas, making it inconvenient to use. Patent documents have already addressed this issue.

[0003] For example, Chinese patent CN218325128U discloses a high-purity gas conveying mechanism, relating to the field of gas conveying technology. This mechanism addresses the problem that existing high-purity gas conveying mechanisms, when used, require venting gas from the cylinder. During venting, residual gas easily remains inside the cylinder. When high-purity gas is introduced, it mixes with the residual gas, affecting the purity of the gas and making it unusable. The solution includes a main body and an auxiliary structure; the auxiliary structure is located inside the main body. When venting gas, opening the valve and rotating the control component causes the threads on the outer periphery of the control component to rotate within the threaded hole of the support component, and simultaneously within the threaded hole on the right side of the inner cavity. This causes the left end of the control component to rotate within the rotating groove, thereby pushing the auxiliary component to move. The auxiliary component then pushes the gas inside the inner cavity, allowing the gas to be vented from the connecting pipe, thus preventing residue inside the inner cavity and facilitating use.

[0004] While the aforementioned document can rotate the threaded rod to push the auxiliary component out of the internal residual gas and prevent subsequent gas mixing, thus solving some problems, it still has obvious shortcomings in actual use, such as:

[0005] Although the device can expel residual gas, it is driven by a threaded rod. During the rotation of the threaded rod, internal gas can leak out from the thread groove or external air can enter. In some important industries, such as semiconductor manufacturing, this can easily affect product quality. Furthermore, the device needs to be refilled after the gas is used up, which is more cumbersome and inconvenient than existing devices that can directly replace gas cylinders, indirectly affecting production and manufacturing.

[0006] Therefore, a high-purity gas delivery system for semiconductor chip processing is now being designed that is convenient to use and avoids gas mixing. Summary of the Invention

[0007] To address the shortcomings of existing technologies, this invention provides a high-purity gas delivery system and method for semiconductor chip processing, which solves the problems of existing high-purity gas delivery equipment easily causing gas mixing and being cumbersome and inconvenient to use.

[0008] To achieve the above objectives, the present invention is implemented through the following technical solution: a high-purity gas delivery system for semiconductor chip processing, comprising a base mounting mechanism for installation and a gas tank body for gas storage, wherein a filter self-cleaning mechanism for transmission and cleaning is installed on the right side of the base mounting mechanism.

[0009] Preferably, the basic installation mechanism includes a working platform, with an arc-shaped mounting seat fixedly connected to the left side of the top of the working platform, and several arc-shaped mounting seats are provided. The surface and rear of the arc-shaped mounting seat are provided with rotating clamps. A rotating rod is rotatably connected between the two sides of the inner cavity of the arc-shaped mounting seat through a bearing. Arc-shaped clamping plates that cooperate with the gas tank body are fixedly connected to both sides of the surface of the rotating rod. Two arc-shaped clamping plates are arranged opposite to each other, and the gas tank body is located inside the arc-shaped mounting seat. A first spring is fixedly connected between the arc-shaped clamping plate and the top of the inner cavity of the arc-shaped mounting seat, and a docking slot is provided at the bottom of the arc-shaped clamping plate.

[0010] Preferably, a gas guide frame for use with the gas tank body is fixedly connected to the right side of the top of the working platform via a fixing plate, and a plurality of gas guide frames are provided. A sealing push rod is slidably installed on the right side of the gas guide frame through an opening, and an extension circular plate is fixedly connected to one end of the sealing push rod inside the gas guide frame. A second spring is sleeved on the surface of the sealing push rod, and the right end of the gas tank body extends to the inside of the gas guide frame.

[0011] Preferably, a rectangular push plate is fixedly connected to one end of the sealing push rod outside the air guide frame, and an L-shaped pull rod is fixedly connected to the bottom of the rectangular push plate. One end of the L-shaped pull rod passes through the arc-shaped mounting base and extends into the interior of the arc-shaped mounting base. A snap-fit ​​strip that mates with the docking slot is fixedly connected to the end of the L-shaped pull rod that extends into the arc-shaped mounting base. A reset pull slot that mates with the L-shaped pull rod is provided on the right side of the arc-shaped mounting base.

[0012] Preferably, the front and rear parts of both sides of the bottom of the working platform are rotatably connected to support columns via bearing components, and the bottom end of the support column is fixedly connected to a rolling wheel. A gear ring is fixedly connected to the lower surface of the support column. The front and rear parts of the bottom of the working platform are fixedly connected to a third spring, and the bottom end of the third spring is fixedly connected to a linkage base plate. The front and rear sides of both sides of the linkage base plate are fixedly connected to arc-shaped toothed plates that mesh with the gear ring.

[0013] Preferably, the inner bottom of the arc-shaped mounting base has arc-shaped receiving grooves on both sides that extend into the interior of the arc-shaped mounting base. An arc-shaped pad is provided on the inner side of the arc-shaped receiving groove. A vertical push rod is fixedly connected to the front and rear sides of the bottom of the arc-shaped pad. The bottom end of the vertical push rod passes through the arc-shaped mounting base and the working platform in sequence and is fixed to the top of the linkage base plate. A rectangular sealing slot is provided on the left side of the top of the arc-shaped mounting base. A limit baffle is slidably installed inside the rectangular sealing slot. A booster air pump is fixedly connected to the right side of the top of the working platform through a fixing plate. A first air guide pipe is connected between the booster air pump and the air guide frame.

[0014] Preferably, the self-cleaning filter mechanism includes a main air supply pipe, which is fixedly installed on the right side of the working platform by a fixing plate, and a second air guide pipe is connected between the main air supply pipe and the booster pump. A filter sealing frame is fixedly installed at the right end of the main air supply pipe.

[0015] Preferably, an annular guide frame is fixedly connected to the right side of the inner wall of the main gas pipe via a fixing block, and a rotating rod is placed inside the annular guide frame. A cleaning plate that cooperates with the filter sealing frame is fixedly connected to the right end of the rotating rod. A polygonal insert is fixedly connected to the left side of the annular guide frame, and a polygonal rod that cooperates with the polygonal insert is fixedly connected to the left side of the rotating rod surface. A fourth spring is fixedly connected between the annular guide frame and the polygonal rod, and a guide vane is fixedly connected to the left end of the rotating rod.

[0016] This invention also discloses a method for delivering high-purity gas for semiconductor chip processing, specifically including the following steps:

[0017] S1. Before use, use the rollers to push the equipment to the designated position, then open the arc-shaped clamping plate of the same group and place several gas cylinder bodies inside the arc-shaped mounting base. After the gas cylinder bodies are placed inside the arc-shaped mounting base, the arc-shaped pad will be pressed down and enter the arc-shaped receiving groove. At the same time, the vertical push slide rod will be used to push the linkage base plate down so that the arc-shaped toothed plate meshes with the gear ring to prevent the support column from rotating and fix it. Then, the limit baffle is inserted into the inside of the rectangular sealing slot to block the gas cylinder body. Then, the arc-shaped clamping plate is released and closed under the elastic force of the first spring. Then, proceed to step S3.

[0018] S2. When transferring gas, first turn the valve on the gas tank body to open the gas outlet, then start the booster pump to extract and pressurize the high-purity gas. When the gas passes through the gas guide frame, the extended circular plate will push the sealing push rod and the rectangular push plate to the right. At the same time, the L-shaped pull rod will pull the snap-fit ​​strip to insert into the inside of the docking slot to limit and fix the two arc-shaped clamping plates to prevent the gas tank body from shaking and shifting. After being pressurized, the high-purity gas enters the interior of the main gas transmission pipe through the second gas guide pipe. Then, the high-pressure gas impacts the guide vanes, which drives the rotating rod and the cleaning plate to rotate. After the high-purity gas passes through the filter sealing frame, impurities are filtered out and then the transmission continues. The rotation of the cleaning plate cleans the surface of the filter sealing frame to avoid excessive impurities and blockage. After the gas transmission is completed, proceed to step S3.

[0019] S3. When cleaning the equipment is required, close the valve of the gas tank body. At this time, the locking strip will disengage from the docking bayonet and will no longer limit the arc-shaped clamping plate. Then, the gas tank body can be removed for replacement. At the same time, use the bolt assembly to remove the filter sealing frame. After the filter sealing frame is removed, the cleaning plate loses its limit and moves to the right under the pull of the fourth spring, causing the cleaning plate to extend out of the main gas supply pipe. At the same time, the multi-angled rod is inserted into the multi-angled cylinder to fix the rotating rod and prevent the cleaning plate from rotating. Then, clean the cleaning plate and the inside of the main gas supply pipe. After cleaning is completed, reinstall the filter sealing frame and the main gas supply pipe and push the cleaning plate back into the inside of the main gas supply pipe. At this time, the multi-angled rod and the multi-angled cylinder separate, the rotating rod can rotate, and the bolt assembly is used to fix the filter sealing frame.

[0020] This invention provides a high-purity gas delivery system and method for semiconductor chip processing. Compared with existing technologies, it has the following advantages:

[0021] (1) The high-purity gas delivery system for semiconductor chip processing combines the basic installation mechanism and the filter self-cleaning mechanism. The two mechanisms can directly replace the gas tank body after the gas is used up, which avoids gas mixing and improves efficiency. After the gas tank body is installed, it can use its own weight to limit and fix the support column. At the same time, when the gas flows, the snap-fit ​​strip can connect with the docking bayonet to fix the arc-shaped clamping plate, ensuring stability during use. The filter self-cleaning mechanism can filter the gas, indirectly improving the quality of the product.

[0022] (2) The high-purity gas delivery system for semiconductor chip processing has a docking slot at the bottom of the arc-shaped clamping plate, which is used in conjunction with the snap-fit ​​strip and the L-shaped pull rod. The structure can squeeze the expansion plate during gas transmission, drive the snap-fit ​​strip to move to the right and insert it into the docking slot to fix the two arc-shaped clamping plates, ensuring that the gas tank body can remain stable during use and will not loosen due to external factors.

[0023] (3) The high-purity gas delivery system for semiconductor chip processing has an arc-shaped receiving groove on the inner side of the arc-shaped mounting base and an arc-shaped pad on the inner side. It is connected to the linkage base plate by a vertical push slide rod. The configuration of these structures can push the linkage base plate down after the gas tank body is installed so that the arc-shaped toothed plate can engage with the gear ring and fix the support column. This can not only facilitate the movement of the equipment and improve its flexibility, but also prevent displacement during use.

[0024] (4) The high-purity gas delivery system for semiconductor chip processing has guide vanes and cleaning plates inside the main gas delivery pipe, and is used in conjunction with multi-angle plugs and multi-angle plugs. These structures can drive the cleaning plates to rotate during gas transmission to clean the filter sealing frame and avoid blockage. At the same time, the cleaning plates can be extended and fixed during maintenance to facilitate cleaning operations inside the filter sealing frame. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the present invention;

[0026] Figure 2 This is a bottom view of the basic installation mechanism structure of the present invention;

[0027] Figure 3 This is a cross-sectional view of the arc-shaped mounting base structure of the present invention;

[0028] Figure 4 This is a schematic diagram of the rectangular push plate, L-shaped pull rod, and snap-fit ​​strip structure of the present invention;

[0029] Figure 5 This is a schematic diagram of the rotating rod, the arc-shaped clamping plate, and the first spring structure of the present invention;

[0030] Figure 6 This is a schematic diagram of the docking bayonet structure of the present invention;

[0031] Figure 7 This is a schematic diagram of the arc-shaped receiving groove, rectangular sealing slot, and limiting baffle structure of the present invention;

[0032] Figure 8 This is a schematic diagram of the rolling wheel, gear ring, and third spring structure of the present invention;

[0033] Figure 9 This is a cross-sectional view of the main gas pipeline structure of the present invention;

[0034] Figure 10 This is a schematic diagram of the rotating rod, cleaning plate, and polygonal insert structure of the present invention.

[0035] In the diagram: 1. Basic installation mechanism; 2. Filter self-cleaning mechanism; 3. Gas tank body; 101. Working platform; 102. Arc-shaped mounting base; 103. Rotating clamp; 104. Rotating rod; 105. Arc-shaped clamping plate; 106. First spring; 107. Docking bayonet; 108. Air guide frame; 109. Sealing push rod; 110. Extending circular plate; 111. Second spring; 112. Rectangular push plate; 113. L-shaped pull rod; 114. Snap-fit ​​strip; 115. Reset pull port; 116. Support column; 117. Rolling wheel; 118. Gear 119. Third Spring; 120. Linkage Base Plate; 121. Arc-shaped Toothed Plate; 122. Vertical Push Slide Rod; 123. Arc-shaped Receiving Groove; 124. Arc-shaped Pad; 125. Rectangular Sealing Slot; 126. Limiting Baffle; 127. Booster Air Pump; 128. First Air Guide Pipe; 201. Main Air Supply Pipe; 202. Filter Sealing Frame; 203. Annular Guide Slide Frame; 204. Rotating Rod; 205. Cleaning Plate; 206. Multi-angle Insert; 207. Multi-angle Insert Rod; 208. Air Guide Blade; 209. Fourth Spring; 210. Second Air Guide Pipe. Detailed Implementation

[0036] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0037] Please see Figure 1-10 This invention provides two technical solutions: Example

[0038] A high-purity gas delivery system for semiconductor chip processing includes a base mounting mechanism 1 for installation and a gas tank body 3 for gas storage. A filter self-cleaning mechanism 2 for transmission cleaning is installed on the right side of the base mounting mechanism 1.

[0039] The basic installation mechanism 1 includes a working platform 101. An arc-shaped mounting base 102 is fixedly connected to the left side of the top of the working platform 101. Several arc-shaped mounting bases 102 are provided. Rotating clamps 103 are provided on both the surface and rear of the arc-shaped mounting base 102. A rotating rod 104 is rotatably connected between the two sides of the inner cavity of the arc-shaped mounting base 102 via bearing components. Arc-shaped clamping plates 105, which cooperate with the gas tank body 3, are fixedly connected to both sides of the surface of the rotating rod 104. Two arc-shaped clamping plates 105 are arranged opposite each other, and the gas tank body 3 is located inside the arc-shaped mounting base 102. A first spring 106 is fixedly connected between the arc-shaped clamping plate 105 and the top of the inner cavity of the arc-shaped mounting base 102. A docking slot is provided at the bottom of the arc-shaped clamping plate 105. 107. On the right side of the top of the work platform 101, a gas guide frame 108 for use with the gas tank body 3 is fixedly connected via a fixing plate. Several gas guide frames 108 are provided. A sealing push rod 109 is slidably installed on the right side of the gas guide frame 108 through an opening. An extension circular plate 110 is fixedly connected to one end of the sealing push rod 109 inside the gas guide frame 108. A second spring 111 is sleeved on the surface of the sealing push rod 109. The right end of the gas tank body 3 extends to the inside of the gas guide frame 108. A rectangular push plate 112 is fixedly connected to one end of the sealing push rod 109 outside the gas guide frame 108. An L-shaped pull rod 113 is fixedly connected to the bottom of the rectangular push plate 112. One end of the L-shaped pull rod 113 passes through the arc-shaped mounting base 102 and extends... Inside the arc-shaped mounting base 102, one end of the L-shaped pull rod 113 extending into the arc-shaped mounting base 102 is fixedly connected to a snap-fit ​​strip 114 that mates with the docking slot 107. A reset pull slot 115 mates with the L-shaped pull rod 113 is provided on the right side of the arc-shaped mounting base 102. Support columns 116 are rotatably connected to the front and rear sides of the bottom of the work platform 101 via bearing components. Rolling wheels 117 are fixedly connected to the bottom ends of the support columns 116. Gear rings 118 are fixedly connected to the lower surface of the support columns 116. Third springs 119 are fixedly connected to the front and rear sides of the bottom of the work platform 101. A linkage base plate 120 is fixedly connected to the bottom end of the third spring 119. The front and rear sides of the linkage base plate 120 are connected to… Each of the following components is fixedly connected to an arc-shaped toothed plate 121 that meshes with the gear ring 118. Arc-shaped receiving grooves 123 extending through the bottom of the inner side of the arc-shaped mounting base 102 are provided on both sides. An arc-shaped pad 124 is provided inside the arc-shaped receiving groove 123. Vertical push rods 122 are fixedly connected to the front and rear sides of the bottom of the arc-shaped pad 124. The bottom end of the vertical push rod 122 passes through the arc-shaped mounting base 102 and the working platform 101 and is fixed to the top of the linkage base plate 120. A rectangular sealing slot 125 is provided on the left side of the top of the arc-shaped mounting base 102, and a limit baffle 126 is slidably installed inside the rectangular sealing slot 125. A booster air pump 127 is fixedly connected to the right side of the top of the working platform 101 via a fixing plate.Furthermore, a first air guide pipe 128 connects the booster pump 127 to the air guide frame 108. Example

[0040] A high-purity gas delivery system for semiconductor chip processing includes a base mounting mechanism 1 for installation and a gas tank body 3 for gas storage. A filter self-cleaning mechanism 2 for transmission cleaning is installed on the right side of the base mounting mechanism 1.

[0041] Please refer to Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8The diagram illustrates the overall structure of the basic installation mechanism 1. The basic installation mechanism 1 includes a working platform 101. An arc-shaped mounting base 102 is fixedly connected to the top left side of the working platform 101. Several arc-shaped mounting bases 102 are provided. Rotating clamping slots 103 are provided on both the surface and rear of the arc-shaped mounting base 102. A rotating rod 104 is rotatably connected between the two sides of the inner cavity of the arc-shaped mounting base 102 via bearing components. Arc-shaped clamping plates 105, which cooperate with the gas tank body 3, are fixedly connected to both sides of the surface of the rotating rod 104. Two arc-shaped clamping plates 105 are arranged opposite each other, and the gas tank body 3 is located inside the arc-shaped mounting base 102. A first spring 106 is fixedly connected between the arc-shaped clamping plate 105 and the top of the inner cavity of the arc-shaped mounting base 102. The bottom of the holding plate 105 has a docking slot 107. A gas guide frame 108, which works with the gas tank body 3, is fixedly connected to the right side of the top of the working platform 101 via a fixing plate. The insertion interface of the gas guide frame 108 has a rubber layer to improve sealing. Several gas guide frames 108 are provided. A sealing push rod 109 is slidably installed on the right side of the gas guide frame 108 through an opening. An extension circular plate 110 is fixedly connected to one end of the sealing push rod 109 inside the gas guide frame 108. The extension circular plate 110 can withstand the maximum gas impact area. A second spring 111 is sleeved on the surface of the sealing push rod 109. The right end of the gas tank body 3 extends to the inside of the gas guide frame 108. The end of the sealing push rod 109 outside the gas guide frame 108 is fixedly connected to... A rectangular push plate 112 is provided, and an L-shaped pull rod 113 is fixedly connected to the bottom of the rectangular push plate 112. One end of the L-shaped pull rod 113 passes through the arc-shaped mounting base 102 and extends into the interior of the arc-shaped mounting base 102. The end of the L-shaped pull rod 113 extending into the interior of the arc-shaped mounting base 102 is fixedly connected to a snap-fit ​​strip 114 that mates with the docking slot 107. A reset pull slot 115 that mates with the L-shaped pull rod 113 is provided on the right side of the arc-shaped mounting base 102. Support columns 116 are rotatably connected to the front and rear parts of both sides of the bottom of the work platform 101 via bearing components. Roller wheels 117 are fixedly connected to the bottom end of the support columns 116. A gear ring 118 is fixedly connected to the lower surface of the support column 116. The bottom of the work platform 101... A third spring 119 is fixedly connected to both the front and rear of the device, and a linkage base plate 120 is fixedly connected to the bottom of the third spring 119. Arc-shaped toothed plates 121 that mesh with the gear ring 118 are fixedly connected to the front and rear sides of both sides of the linkage base plate 120. Arc-shaped receiving grooves 123 penetrating into the interior of the arc-shaped mounting base 102 are provided on both sides of the bottom inner side of the arc-shaped mounting base 102. An arc-shaped pad 124 is provided inside the arc-shaped receiving groove 123. A vertical push rod 122 is fixedly connected to the front and rear sides of the bottom of the arc-shaped pad 124, and the bottom end of the vertical push rod 122 passes through the arc-shaped mounting base 102 and the working platform 101 sequentially and is fixed to the top of the linkage base plate 120. A rectangular sealing slot 125 is provided on the left side of the top of the arc-shaped mounting base 102.Furthermore, a limit baffle 126 is slidably installed inside the rectangular sealing slot 125, and a booster air pump 127 is fixedly connected to the top right side of the work platform 101 via a fixing plate, with a first air guide pipe 128 connecting the booster air pump 127 and the air guide frame 108.

[0042] Please refer to Figure 9 and Figure 10 The diagram illustrates the overall structure of the self-cleaning filter mechanism 2. The self-cleaning filter mechanism 2 includes a main air supply pipe 201, which is fixedly mounted on the right side of the working platform 101 via a fixing plate. A second air guide pipe 210 connects the main air supply pipe 201 and the booster pump 127. A filter sealing frame 202 is fixedly mounted on the right end of the main air supply pipe 201. An annular guide frame 203 is fixedly connected to the right side of the inner wall of the main air supply pipe 201 via a fixing block. A rotating rod 204 is placed inside the annular guide frame 203. A cleaning plate 205, which is used in conjunction with the filter sealing frame 202, is fixedly connected to the right end of the rotating rod 204. A brush is provided on one side of the cleaning plate 205. A polygonal insert 206 is fixedly connected to the left side of the annular guide frame 203. A polygonal rod 207, which is used in conjunction with the polygonal insert 206, is fixedly connected to the left side of the rotating rod 204. One end of the polygonal rod 207 is arc-shaped for easy insertion. A fourth spring 209 is fixedly connected between the annular guide frame 203 and the polygonal rod 207. A guide vane 208 is fixedly connected to the left end of the rotating rod 204.

[0043] The advantage of Embodiment 2 over Embodiment 1 is that by setting a guide vane 208 and a cleaning plate 205 inside the main gas pipe 201, and using it in conjunction with a polygonal insert 207 and a polygonal insert 206, the arrangement of these structures can drive the cleaning plate 205 to rotate during gas transmission to clean the filter sealing frame 202 and prevent blockage. At the same time, during maintenance, the cleaning plate 205 can be extended and fixed to facilitate the cleaning operation inside the filter sealing frame 202.

[0044] This invention also discloses a method for delivering high-purity gas for semiconductor chip processing, specifically including the following steps:

[0045] S1. Before use, use the roller 117 to push the equipment to the designated position, then open the arc-shaped clamping plate 105 of the same group and place several gas cylinder bodies 3 inside the arc-shaped mounting base 102. After the gas cylinder bodies 3 are placed inside the arc-shaped mounting base 102, the arc-shaped pad 124 will be pressed down and enter the arc-shaped receiving groove 123. At the same time, the vertical push slide rod 122 will be used to push the linkage base plate 120 down so that the arc-shaped toothed plate 121 and the gear ring 118 will mesh to prevent the support column 116 from rotating and thus fix it. Then, the limit baffle 126 will be inserted into the inside of the rectangular sealing slot 125 to block the gas cylinder bodies 3. Then, the arc-shaped clamping plate 105 will be released and closed under the elastic force of the first spring 106. Then, proceed to step S3.

[0046] S2. When transmitting gas, first turn the valve of the gas tank body 3 to open the gas outlet, then start the booster pump 127 to extract and pressurize the high-purity gas. When the gas passes through the gas guide frame 108, the extended circular plate 110 will push the sealing push rod 109 and the rectangular push plate 112 to the right. At the same time, the L-shaped pull rod 113 will pull the snap-fit ​​strip 114 to insert into the docking slot 107 to limit and fix the two arc-shaped clamping plates 105 to prevent the gas tank body 3 from shaking and shifting. After being pressurized, the high-purity gas enters the main gas transmission pipe 201 through the second gas guide pipe 210. Then, the high-pressure gas impacts the guide vane 208 to drive the rotating rod 204 and the cleaning plate 205 to rotate. After passing through the filter sealing frame 202, the high-purity gas is filtered of impurities and then continues to be transmitted. The rotation of the cleaning plate 205 cleans the surface of the filter sealing frame 202 to avoid excessive impurities and blockage. After the gas transmission is completed, proceed to step S3.

[0047] S3. When cleaning the equipment is required, close the valve of the gas tank body 3. At this time, the locking strip 114 exits the docking bayonet 107 and no longer limits and fixes the arc-shaped clamping plate 105. Then the gas tank body 3 can be taken out for replacement. At the same time, use the bolt assembly to remove the filter sealing frame 202. After the filter sealing frame 202 is removed, the cleaning plate 205 loses its limit and moves to the right under the pull of the fourth spring 209, causing the cleaning plate 205 to extend out of the main air supply pipe 201. At the same time, the multi-angle insert rod... Insert the polygonal insert 207 into the polygonal insert 206 to fix the rotating rod 204 and prevent the cleaning plate 205 from rotating. At this time, clean the inside of the cleaning plate 205 and the main air supply pipe 201. After cleaning is completed, reinstall the filter sealing frame 202 and the main air supply pipe 201 and push the cleaning plate 205 back into the inside of the main air supply pipe 201. At this time, the polygonal insert 207 and the polygonal insert 206 are separated, the rotating rod 204 can rotate, and the filter sealing frame 202 is fixed with bolt assembly.

[0048] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A high-purity gas delivery system for semiconductor chip processing, comprising a base mounting mechanism (1) for installation and a gas tank body (3) for gas storage, characterized in that: A filter self-cleaning mechanism (2) for transmission cleaning is installed on the right side of the basic installation mechanism (1). The basic installation mechanism (1) includes a working platform (101), and a booster air pump (127) is fixedly connected to the right side of the top of the working platform (101) via a fixing plate. The filter self-cleaning mechanism (2) includes a main air supply pipe (201), and the main air supply pipe (201) is fixedly installed on the right side of the working platform (101) by a fixing plate. A second air guide pipe (210) is connected between the main air supply pipe (201) and the booster air pump (127). A filter sealing frame (202) is fixedly installed at the right end of the main air supply pipe (201). An annular guide frame (203) is fixedly connected to the right side of the inner wall of the main air supply pipe (201) by a fixing block. A rotating rod (204) is placed inside the annular guide frame (203). A cleaning plate (205) that works with the filter sealing frame (202) is fixedly connected to the right end of the rotating rod (204). A polygonal insert (206) is fixedly connected to the left side of the annular guide frame (203). A polygonal rod (207) that works with the polygonal insert (206) is fixedly connected to the left side of the surface of the rotating rod (204). A fourth spring (209) is fixedly connected between the annular guide frame (203) and the polygonal rod (207). A guide vane (208) is fixedly connected to the left end of the rotating rod (204).

2. The high-purity gas delivery system for semiconductor chip processing according to claim 1, characterized in that: An arc-shaped mounting base (102) is fixedly connected to the left side of the top of the working platform (101), and several arc-shaped mounting bases (102) are provided. Rotating clamps (103) are provided on the surface and rear of the arc-shaped mounting base (102). A rotating rod (104) is rotatably connected between the two sides of the inner cavity of the arc-shaped mounting base (102) through a bearing. An arc-shaped clamping plate (105) for use with the gas tank body (3) is fixedly connected to both sides of the surface of the rotating rod (104). Two arc-shaped clamping plates (105) are arranged opposite to each other, and the gas tank body (3) is located inside the arc-shaped mounting base (102). A first spring (106) is fixedly connected between the arc-shaped clamping plate (105) and the top of the inner cavity of the arc-shaped mounting base (102), and a docking slot (107) is provided at the bottom of the arc-shaped clamping plate (105).

3. The high-purity gas delivery system for semiconductor chip processing according to claim 2, characterized in that: The right side of the top of the working platform (101) is fixedly connected to a gas guide frame (108) that works in conjunction with the gas tank body (3) by a fixing plate, and there are several gas guide frames (108). A sealing push rod (109) is slidably installed on the right side of the gas guide frame (108) through an opening, and an extension circular plate (110) is fixedly connected to one end of the sealing push rod (109) inside the gas guide frame (108). A second spring (111) is sleeved on the surface of the sealing push rod (109), and the right end of the gas tank body (3) extends to the inside of the gas guide frame (108).

4. The high-purity gas delivery system for semiconductor chip processing according to claim 3, characterized in that: The sealing push rod (109) is fixedly connected to a rectangular push plate (112) at one end outside the air guide frame (108), and an L-shaped pull rod (113) is fixedly connected to the bottom of the rectangular push plate (112). One end of the L-shaped pull rod (113) passes through the arc-shaped mounting base (102) and extends into the interior of the arc-shaped mounting base (102). The end of the L-shaped pull rod (113) extending into the interior of the arc-shaped mounting base (102) is fixedly connected to a snap-fit ​​strip (114) that mates with the docking slot (107). A reset pull slot (115) that mates with the L-shaped pull rod (113) is provided on the right side of the arc-shaped mounting base (102).

5. A high-purity gas delivery system for semiconductor chip processing according to claim 4, characterized in that: The front and rear sides of the bottom of the working platform (101) are rotatably connected to support columns (116) via bearing components, and the bottom end of the support column (116) is fixedly connected to a rolling wheel (117). A gear ring (118) is fixedly connected to the lower surface of the support column (116). The front and rear sides of the bottom of the working platform (101) are fixedly connected to a third spring (119), and the bottom end of the third spring (119) is fixedly connected to a linkage base plate (120). The front and rear sides of the linkage base plate (120) are fixedly connected to arc-shaped toothed plates (121) that mesh with the gear ring (118).

6. A high-purity gas delivery system for semiconductor chip processing according to claim 5, characterized in that: Both sides of the bottom inner side of the arc-shaped mounting base (102) are provided with arc-shaped receiving grooves (123) that penetrate into the interior of the arc-shaped mounting base (102). An arc-shaped pad (124) is provided on the inner side of the arc-shaped receiving groove (123). A vertical push slide rod (122) is fixedly connected to the front and rear sides of the bottom of the arc-shaped pad (124). The bottom end of the vertical push slide rod (122) passes through the arc-shaped mounting base (102) and the working platform (101) in sequence and is fixed to the top of the linkage base plate (120). A rectangular sealing slot (125) is provided on the left side of the top of the arc-shaped mounting base (102). A limit baffle (126) is slidably installed inside the rectangular sealing slot (125). A first air guide pipe (128) is connected between the booster air pump (127) and the air guide frame (108).

7. A method for conveying high-purity gas for semiconductor chip processing, employing the conveying system as described in claim 6, characterized in that: Specifically, the following steps are included: S1. Before use, use the roller (117) to push the equipment to the designated position, then open the arc-shaped clamping plate (105) of the same group and place several gas cylinder bodies (3) inside the arc-shaped mounting base (102). After the gas cylinder body (3) is placed inside the arc-shaped mounting base (102), the arc-shaped pad (124) will be pressed down and enter the arc-shaped receiving groove (123). At the same time, the vertical push slide rod (122) will be used to push the linkage base plate (120) down so that the arc-shaped toothed plate (121) meshes with the gear ring (118) to prevent the support column (116) from rotating and fix it. Then, the limit baffle (126) is inserted into the inside of the rectangular sealing slot (125) to block the gas cylinder body (3). Then, the arc-shaped clamping plate (105) is released and closed under the elastic force of the first spring (106). Then, proceed to step S2. S2. When transferring gas, first turn the valve on the gas tank body (3) to open the gas outlet, then start the booster pump (127) to extract and pressurize the high-purity gas. When the gas passes through the gas guide frame (108), it will use the extended circular plate (110) to push the sealing push rod (109) and the rectangular push plate (112) to the right. At the same time, the L-shaped pull rod (113) will pull the snap-fit ​​strip (114) to insert into the docking slot (107) to limit and fix the two arc-shaped clamping plates (105) to prevent the gas tank body (3) from being blocked. The high-purity gas is displaced by shaking. After being pressurized, the high-purity gas enters the interior of the main gas pipe (201) through the second gas guide pipe (210). Then, the high-pressure gas impacts the guide vane (208), which drives the rotating rod (204) and the cleaning plate (205) to rotate. After the high-purity gas passes through the filter sealing frame (202), impurities are filtered out and then the transmission continues. The rotation of the cleaning plate (205) cleans the surface of the filter sealing frame (202) to avoid excessive impurities and blockage. After the gas transmission is completed, the process proceeds to step S3. S3. When the equipment needs to be cleaned, close the valve of the gas tank body (3). At this time, the clamping strip (114) exits the docking bayonet (107) and no longer limits and fixes the arc-shaped clamping plate (105). Then the gas tank body (3) can be taken out for replacement. At the same time, the filter sealing frame (202) is removed using the bolt assembly. After the filter sealing frame (202) is removed, the cleaning plate (205) loses its limit and moves to the right under the pull of the fourth spring (209), so that the cleaning plate (205) extends out of the main gas pipe (201). At the same time, the multi-angle insert rod (209) moves to the right. 7) Insert the polygonal insert (206) to fix the rotating rod (204) and prevent the cleaning plate (205) from rotating. At this time, clean the inside of the cleaning plate (205) and the main air supply pipe (201). After cleaning, reinstall the filter sealing frame (202) and the main air supply pipe (201) and push the cleaning plate (205) back into the inside of the main air supply pipe (201). At this time, the polygonal insert (207) and the polygonal insert (206) are separated, the rotating rod (204) can rotate, and the filter sealing frame (202) is fixed with bolt assembly.

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