A support limiting device for preventing sidewall contamination of a wafer or chip

Abstract

The application discloses a support limiting device for preventing side wall contamination of a wafer chip in the technical field of screen printing, which comprises a placing plate, the placing plate is used for placing a wafer or a chip, and supporting plates are arranged on the left and right sides of the placing plate; accommodating grooves are formed in the two supporting plates; when the two accommodating grooves are combined, they can form a pattern coinciding with the wafer or the chip; the wafer or the chip is supported and limited from below and around by the two supporting plates; when screen printing is carried out, the slurry outside the wafer or the chip is blocked by the supporting plates when passing through the screen, and the slurry cannot be squeezed onto the side wall of the wafer; the top end of the supporting plate is at the same horizontal level as the top end of the wafer or the chip; the contact surface with the screen is enlarged by the supporting plate; when the slurry squeezed in the process of moving the squeegee passes through the screen, the tension of the screen around the wafer or the chip cannot be changed, the mesh of the screen cannot move, and the printing effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of screen printing, in particular to a support limiting device for preventing side wall contamination of wafers or chips. BACKGROUND

[0002] In the chip manufacturing process, glass powder paste is spread on the chip or wafer to protect the chip and wafer. The glass powder paste is usually spread on the chip manually by knife scraping method, which results in uneven glass paste and low utilization rate of glass powder. Therefore, screen printing method can be used for coating. However, when screen printing is performed, the paste will be subjected to an inclined downward pressure and a single directional guiding force. The downward pressure is used to make the paste pass through the screen, and the guiding force is used to limit the direction. However, the coverage of the screen is much larger than the chip. When the scraper passes through the screen at an angle, the chip below will support the paste above. At this time, the paste will pass through the screen and cover the surface of the chip. However, the circumference of the side wall of the chip does not support the paste on the screen, which will easily cause the paste to adhere to the circumference of the side wall of the chip and contaminate the chip, affecting the subsequent processing of the chip.

[0003] Therefore, the present application provides a support limiting device for preventing side wall contamination of wafers or chips to solve the above problems. SUMMARY

[0004] The present application provides a support limiting device for preventing side wall contamination of wafers or chips to solve the problems in the background art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solution: a support limiting device for preventing side wall contamination of wafers or chips, comprising a placement plate, the placement plate is used for placing wafers or chips, the placement plate is provided with a receiving plate on the left and right sides, two receiving plates are provided with accommodating grooves, two accommodating grooves can become a figure coinciding with the wafer or chip when combined, two receiving plates are provided with a drive group below, the drive group is used to drive two receiving plates to limit the placement plate inside the two accommodating grooves from both sides before screen printing, and drive two receiving plates to separate from the placement plate after printing is completed, two notches are formed in the placement plate.

[0006] As a further scheme of the present application, the driving group comprises a support plate located on one side of the placing plate, the front and rear ends of the support plate are rotationally connected with support rods, the two support rods are commonly arranged at the bottom end of the receiving plate, the two support rods are used for supporting the receiving plate, the rotation shafts of the two support rods are all sleeved with first torsional springs, the two support rods are all fixedly connected with gears, the lower sides of the two gears are all provided with rack rods, the two rack rods can be engaged with the two gears respectively, a lifting group is arranged between the two support plates, the lifting group is located directly below the placing plate, and the lifting group is used for driving the gears to engage with the rack rods.

[0007] As a further scheme of the present application, the four support rods are all slidably connected at the bottom of the two receiving plates, first springs are all fixedly connected between the four support rods and the inner walls of the receiving plates, vertical sliding grooves are all formed in the side walls of the four support rods, driving pieces are all slidably connected in the sliding grooves, driving rods are all rotationally connected at the top ends of the driving pieces, and the top ends of the four driving rods are all rotationally connected with the front and rear side walls of the two receiving plates.

[0008] Second springs are all fixedly connected between the four vertical rods and the inner walls of the rack rods, the vertical rods are used for jacking up the driving pieces, the side walls of the four rack rods are all fixedly connected with extension edges, the extension edges can be in contact with the bottom of the support plate when the rack rods and the gears are engaged to the limit position, so that the rack rods cannot continue to rise.

[0009] As a further scheme of the present application, the lifting group comprises an H-shaped rod and a base, the four vertical rods are all fixedly connected at the four end portions of the H-shaped rod, the H-shaped rod is located directly above the base, two first air cylinders are fixedly connected between the base and the H-shaped rod, a T-shaped rod is slidably connected outside the H-shaped rod, the bottom end of the T-shaped rod is located directly below the two support plates and has a length greater than the distance between the two support plates, a third spring is fixedly connected between the H-shaped rod and the T-shaped rod, and the top end of the T-shaped rod is fixedly connected with the bottom of the placing plate.

[0010] As a further scheme of the present application, a support ring is arranged below the placing plate, a groove matched with the placing plate is formed in the support ring, the placing plate is located in the groove, a through hole is formed in the middle of the support ring, the T-shaped rod passes through the through hole, a plurality of second air cylinders are fixedly connected at the bottom of the support ring, the extension ends of the second air cylinders are all fixedly connected with baffle pieces, a plurality of rollers are rotationally connected with the inner side walls of the baffle pieces, and the support ring is fixedly connected between the two support plates.

[0011] As a further scheme of the present application, the top end of the support plate is fixedly connected with two guide plates, the middle positions of the guide plates are inclined to one side from the vertical state, the inner parts of the inclined positions of the two guide plates are each provided with a guide groove, two scraping plates are jointly and slidably connected in the two guide grooves, fourth springs are fixedly connected between the bottom of each scraping plate and the bottom of the guide groove, motors are fixedly connected on the side walls of the two guide plates, winding wheels are rotatably connected on the side walls of the two guide plates, pull ropes are fixedly connected on the output ends of the motors, and the other ends of the two pull ropes are fixedly connected with the scraping plates after passing through the winding wheels.

[0012] The side of each guide plate is provided with a baffle, the end of the baffle is provided with an inclined surface, the baffle is used for blocking the scraping plate, the bottom end of each baffle is rotatably connected on the support plate, a second torsional spring is sleeved on the rotating shaft of each baffle, a pressing plate is arranged between the two baffles, the front and rear ends of the pressing plate are slidably connected in the inner parts of the two guide plates, and fifth springs are fixedly connected between the inner walls of the two guide plates and the pressing plate.

[0013] As a further scheme of the present application, the bottom of each scraping plate is fixedly connected with a resisting rod, and the side wall of the receiving plate is provided with a groove edge.

[0014] As a further scheme of the present application, the inner wall of each accommodating groove is provided with a supporting edge.

[0015] Compared with the prior art, the present application has the following beneficial effects:

[0016] 1. The two receiving plates support and limit the wafer or chip from below and around, so that the powder slurry outside the wafer or chip is blocked by the receiving plate when passing through the screen, and the powder slurry is not squeezed onto the side wall of the wafer, the top end of the receiving plate is at the same height as the top end of the wafer or chip, the contact surface with the screen is expanded by the presence of the receiving plate, and the tension of the screen around the wafer or chip is not changed when the powder slurry squeezed in the process of moving the scraper passes through the screen, so as to avoid the movement of the screen mesh and improve the printing effect.

[0017] 2. The gap can be used to take out the wafer or chip from below, so as to avoid the fingers touching the surface of the wafer or chip and affecting the printing result.

[0018] 3. When the receiving plate rotates to the middle, the powder slurry remaining on the top of the receiving plate can be cleaned by the scraping plate, so as to avoid the powder slurry solidifying on the surface of the scraping plate for a long time and affecting the flatness of the surface of the receiving plate, and further avoiding affecting the printing efficiency of the screen. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 The overall structure of the present application is shown schematically;

[0020] Figure 2 The structure of the lifting group of the present application is shown schematically;

[0021] Figure 3 The positional relationship between the support ring and the placement plate of the present application is shown schematically;

[0022] Figure 4 The positional relationship between the driving group and the support plate of the present application is shown schematically;

[0023] Figure 5 The positional relationship between the receiving plate and the placement plate when they are attached of the present application is shown schematically;

[0024] Figure 6 The internal structure of the rack rod of the present application is shown schematically;

[0025] Figure 7 The positional relationship between the driving piece, the driving rod and the receiving plate of the present application is shown schematically;

[0026] Figure 8 The positional relationship between the extrusion plate, the baffle and the scraper of the present application is shown schematically;

[0027] Figure 9 The Figure 8 The enlarged view of part A in the figure;

[0028] Figure 10 The connection relationship between the extrusion plate and the fifth spring of the present application is shown schematically.

[0029] In the figure, the components represented by each reference numeral are listed as follows: 1, placement plate; 2, receiving plate; 3, accommodating groove; 4, notch; 5, support plate; 6, support rod; 7, first torsion spring; 8, gear; 9, rack rod; 10, first spring; 11, sliding groove; 12, driving piece; 13, driving rod; 14, vertical rod; 15, second spring; 16, H-shaped rod; 17, base; 18, first air cylinder; 19, T-shaped rod; 20, third spring; 21, support ring; 22, second air cylinder; 23, baffle piece; 24, roller; 25, guide plate; 26, scraper; 27, fourth spring; 28, motor; 29, winding wheel; 30, pull rope; 31, baffle; 32, inclined surface; 33, second torsion spring; 34, extrusion plate; 35, fifth spring; 36, resisting rod; 37, groove edge; 38, support edge. DETAILED DESCRIPTION

[0030] Please refer to Figures 1-10The application provides a technical scheme: a support limiting device for preventing side wall contamination of a wafer or a chip, which comprises a placing plate 1, the placing plate 1 is used for placing a wafer or a chip, both sides of the placing plate 1 are provided with receiving plates 2, two receiving plates 2 are provided with accommodating grooves 3, and the two accommodating grooves 3 can become a pattern coinciding with the wafer or the chip when combined, driving groups are arranged below the two receiving plates 2, the driving groups are used for driving the two receiving plates 2 to limit the placing plate 1 in the two accommodating grooves 3 from both sides before screen printing, and driving the two receiving plates 2 to separate from the placing plate 1 after printing is completed, and two notches 4 are formed in the placing plate 1.

[0031] When the above scheme is actually used, first, the chip or the wafer is placed on the placing plate 1, then the driving group is started, the driving group drives the two receiving plates 2 to move from both sides to the placing plate 1, when the receiving plates 2 move to the limit position, the placing plate 1 is in the two accommodating grooves 3, at this time, the two accommodating grooves 3 form a pattern coinciding with the placing plate 1, and the top surface of the receiving plate 2 is at the same height as the top end of the wafer or the chip, then the staff places the screen above the receiving plate 2, and then pours the glass powder slurry above the screen, at this time, the doctor blade is moved above the screen, so that the glass powder slurry is covered on the wafer or the chip.

[0032] The two receiving plates 2 support and limit the wafer or the chip from below and around, so that the slurry outside the wafer or the chip during screen printing is blocked by the receiving plate 2 when passing through the screen, and the slurry cannot be squeezed onto the side wall of the wafer, the top end of the receiving plate 2 is at the same height as the top end of the wafer or the chip, and the existence of the receiving plate 2 enlarges the contact surface with the screen, so that the tension of the screen around the wafer or the chip is not changed when the squeezed slurry passes through the screen during the movement of the doctor blade, the mesh of the screen is prevented from moving, and the printing effect is improved.

[0033] When the screen printing is completed, the screen and the doctor blade are removed, and then the group is started again, at this time, the driving group drives the two receiving plates 2 to separate from the placing plate 1 from both sides, then the wafer or the chip can be taken out from below through the notch 4, so that the wafer is not taken off from the placing plate 1, and then the fingers are prevented from touching the surface of the wafer or the chip, and the printing result is prevented from being affected.

[0034] As a further scheme of the present application, the driving group comprises a support plate 5 located on one side of the placing plate 1, the front and rear ends of the support plate 5 are rotationally connected with support rods 6, the two support rods 6 are commonly arranged at the bottom end of the receiving plate 2, the two support rods 6 are used for supporting the receiving plate 2, the rotation shafts of the two support rods 6 are all sleeved with first torsional springs 7, the two support rods 6 are all fixedly connected with gear wheels 8, the lower sides of the two gear wheels 8 are all provided with rack rods 9, the two rack rods 9 can be engaged with the two gear wheels 8 respectively, a lifting group is arranged between the two support plates 5, the lifting group is located directly below the placing plate 1, and the lifting group is used for driving the gear wheels 8 to engage with the rack rods 9.

[0035] When the above scheme driving group works, after the wafer or chip is placed on the placing plate 1, the lifting group is started first, the lifting group works to drive the rack rods 9 to linearly ascend, then engage with the gear wheels 8 and drive the gear wheels 8 to rotate, the gear wheels 8 rotate to drive the support rods 6 and the receiving plate 2 to rotate around the rotation shafts of the support rods 6 and compress the first torsional springs 7, the support plate 5 is in the state as shown in Figure 1 and Figure 4 When the receiving plate 2 and the support rods 6 rotate to the position close to the placing plate 1, the two receiving plates 2 can be attached to the placing plate 1 after the gear wheels 8 engage with the rack rods 9 to the limit position, at this time, the two containing grooves 3 can wrap the placing plate 1 and the wafer or chip inside, then the screen printing plate can be placed on the receiving plate 2 to start the printing work;

[0036] After the printing work is completed, the screen printing plate and the squeegee are moved to other positions, then the lifting group drives the rack rods 9 to linearly descend, the rack rods 9 descend to engage with the gear wheels 8 and drive the support rods 6 and the receiving plate 2 to rotate to the left and right sides, and after the rack rods 9 and the gear wheels 8 disengage, the first torsional springs 7 arranged can continue to drive the receiving plate 2 to rotate until the receiving plate 2 rotates to the limit position.

[0037] As a further scheme of the present application, the four support rods 6 are all slidingly connected at the bottom of the two receiving plates 2, the first springs 10 are all fixedly connected between the four support rods 6 and the inner walls of the receiving plates 2, the vertical sliding grooves 11 are all arranged in the side walls of the four support rods 6, the driving pieces 12 are all slidingly connected in the sliding grooves 11, the driving rods 13 are all rotationally connected at the top ends of the driving pieces 12, and the top ends of the four driving rods 13 are all rotationally connected with the front and rear side walls of the two receiving plates 2;

[0038] Each of the four rack rods 9 has a vertical rod 14 slidably connected inside. The lifting assembly can drive the four vertical rods 14 and the rack rods 9 to rise synchronously. A second spring 15 is fixedly connected between the interior of each of the four vertical rods 14 and the inner wall of the rack rod 9. The vertical rods 14 are used to lift the drive plate 12. Each of the four rack rods 9 has an extension side fixedly connected to its side wall. The extension side can contact the bottom of the support plate 5 when the rack rod 9 and the gear 8 are engaged to the limit position, thereby preventing the rack rod 9 from rising further.

[0039] In the above scheme, when the lifting assembly drives the rack 9 to rise from directly below the gear 8, the vertical rod 14 rises synchronously with the rack 9. After the rack 9 and the vertical rod 14 have risen a certain distance, the rack 9 will mesh with the gear 8 and drive the support rod 6 and the receiving plate 2 to rotate towards the placement plate 1. After the gear 8 and the rack 9 have meshed to their limit, the extended side of the rack 9 (such as...) Figure 6 As shown, the vertical rod 14 will contact the bottom wall of the support plate 5. At this time, the receiving plate 2 will also rotate to a horizontal position. However, the end of the receiving plate 2 is a short distance away from the placement plate 1. At this time, the lifting group will continue to drive the vertical rod 14 to rise. However, the vertical rod 14 is slidably connected to the rack 9. At this time, the gear 8 cannot continue to rise after being restricted by the extended side. Therefore, when the lifting group continues to drive the vertical rod 14 to rise, the vertical rod 14 will slide upward along the inside of the rack 9 and stretch the second spring 15. The vertical rod 14 is longer than the rack 9, so when the top of the vertical rod 14 passes through the rack 9, it can still continue to slide upward. At this time, the top of the vertical rod 14 will... The drive plate 12 is lifted from below, and then it slides upward along the slide groove 11. At this time, the drive plate 12 lifts the drive rod 13. The top of the drive rod 13 is rotatably connected to the receiving plate 2, while the receiving plate 2 is slidably connected to the top of the support rod 6. When the drive rod 13 pushes the receiving plate 2, the receiving plate 2 will slide along the support rod 6, so that the receiving plate 2 can move closer to the placement plate 1, and thus the receiving plate 2 will fit with the placement plate 1, so that the placement plate 1 and the wafer or chip above it can be placed inside the receiving groove 3, thereby shielding the area around the wafer and chip. At this time, the lifting group will stop working, and the first spring 10 will remain in a stretched state.

[0040] After the rack and pinion 9 meshes with the gear 8 to the limit position, the receiving plate 2 rotates to a horizontal position but does not contact the placement plate 1. This avoids the receiving plate 2 touching the wafer or chip and causing damage to the wafer or chip. Then, the lifting group continues to drive the vertical rod 14 to rise, so that the top of the vertical rod 14 pushes the drive plate 12 to rise. Then, the drive rod 13 pushes the receiving plate 2 to move, so that the receiving plate 2 moves horizontally towards the placement plate 1 from the left and right sides, thereby avoiding the problem of the receiving plate 2 touching the wafer when it rotates directly to the sides of the placement plate 1.

[0041] After the printing is completed, the lifting group is lifted and then the receiving plate 2 is reset by the first spring 10, and then the vertical rod 14 slides down along the rack rod 9, and the rack rod 9 descends along with the vertical rod 14 until the second spring 15 is reset.

[0042] As a further scheme of the present application, the lifting group comprises an H-shaped rod 16 and a base 17, four vertical rods 14 are respectively fixedly connected to four end portions of the H-shaped rod 16, the H-shaped rod 16 is located directly above the base 17, two first air cylinders 18 are fixedly connected between the base 17 and the H-shaped rod 16, a T-shaped rod 19 is slidably connected to the outside of the H-shaped rod 16, the bottom end of the T-shaped rod 19 is located directly below the two support plates 5 and the length of the bottom end of the T-shaped rod 19 is greater than the distance between the two support plates 5, a third spring 20 is fixedly connected between the H-shaped rod 16 and the T-shaped rod 19, and the top end of the T-shaped rod 19 is fixedly connected to the bottom of the placing plate 1.

[0043] As a further scheme of the present application, the placing plate 1 is provided below with a support ring 21, the support ring 21 is provided with a groove matched with the placing plate 1, the placing plate 1 is located inside the groove, a through hole is formed in the middle of the support ring 21, the T-shaped rod 19 passes through the through hole, a plurality of second air cylinders 22 are fixedly connected to the bottom of the support ring 21, a baffle 23 is fixedly connected to the extension end of each second air cylinder 22, a plurality of rollers 24 are rotatably connected to the inner side wall of each baffle 23, and the support ring 21 is fixedly connected between the two support plates 5.

[0044] In the above scheme, when working, the wafer to be printed is placed on the placing plate 1, and then the second air cylinder 22 is started, the second air cylinder 22 is shortened, the baffle 23 and the roller 24 are brought close to the placing plate 1 when the second air cylinder 22 is shortened, and the roller 24 contacts the side wall of the wafer or chip not placed on the placing plate 1, so that the wafer or chip can be moved to the middle, but it should be noted that if the rectangular chip needs to be printed, the second air cylinder 22 needs to be arranged in the front, rear, left and right directions of the placing plate 1, and then the second air cylinder 22 is reset after the second air cylinder 22 is shortened to the limit position.

[0045] Support the lifting group through the base 17, the first cylinder 18 will be extended when the lifting group works, the first cylinder 18 will drive the H-shaped rod 16 to rise when it is extended, the H-shaped rod 16 will drive the T-shaped rod 19 to rise through the third spring 20 when it rises, the T-shaped rod 19 drives the placing plate 1 to rise when it rises, at this time the placing plate 1 will be in contact with the supporting ring 21, after the bottom end of the T-shaped rod 19 is in contact with the bottom of the two supporting plates 5, the T-shaped rod 19 will not be able to rise, at this time the placing plate 1 and the wafer are also raised to the limit position, but the first cylinder 18 is continuously rising, so at this time the third spring 20 will be stretched, then the rack bar 9 is engaged with the gear 8, so that the receiving plate 2 and the supporting rod 6 can rotate towards the placing plate 1 and approach, after the rack bar 9 is engaged with the gear 8 to the limit, the receiving plate 2 will be in a horizontal state, but there is a small distance from the placing plate 1, then the first cylinder 18 continues to extend, and then the vertical rod 14 lifts the driving piece 12, and the driving rod 13 pushes the rod receiving plate 2 to approach the placing plate 1 and contact the placing plate 1, and then the printing work can be carried out.

[0046] After the printing is completed, the first cylinder 18 is directly shortened, at this time the receiving plate 2 will be linearly separated from the middle to both sides, and then rotated to reset.

[0047] As a further scheme of the application, the top end of the supporting plate 5 is fixedly connected with two guide plates 25, the middle positions of the guide plates 25 are inclined to one side from the vertical state, the inner parts of the inclined parts of the two guide plates 25 are provided with guide grooves, the two guide grooves are commonly and slidably connected with scrapers 26, the bottoms of the scrapers 26 and the bottoms of the guide grooves are fixedly connected with fourth springs 27, the side walls of the two guide plates 25 are fixedly connected with motors 28, the side walls of the two guide plates 25 are rotatably connected with winding wheels 29, the output ends of the motors 28 are fixedly connected with pull ropes 30, the other ends of the two pull ropes 30 are fixedly connected with the scrapers 26 through the winding wheels 29.

[0048] The side of the two guide plates 25 is provided with a baffle 31, the end of the baffle 31 is provided with an inclined surface 32, the baffle 31 is used for blocking the scraper 26, the bottom end of the baffle 31 is rotatably connected to the supporting plate 5, the rotating shafts of the two baffles 31 are sleeved with second torsional springs 33, the two baffles 31 are provided with a pressing plate 34, the front and rear ends of the pressing plate 34 are slidably connected in the two guide plates 25, the fifth springs 35 are fixedly connected between the inner walls of the two guide plates 25 and the pressing plate 34.

[0049] As a further scheme of the application, the bottom of the scraper 26 is fixedly connected with a resisting rod 36, and the side wall of the receiving plate 2 is provided with a groove edge 37.

[0050] The above scheme in work, because after each printing will have a certain amount of slurry residue in the receiving plate 2, if not cleaned that the slurry may be solidified on the receiving plate 2, which will make the receiving plate 2 surface flatness is damaged, or in the still not solidified to the receiving plate 2 when the next use directly under the screen when attached to the screen, causing the screen dirty situation, and these two cases are will affect the printing effect of the screen;

[0051] But when not printing work, two receiving plate 2 are located on both sides and in the state of inclined, when the first cylinder 18 elongation to a certain extent rack bar 9 and gear 8 meshing drive support rod 6 and receiving plate 2 to the middle rotation, and the scraper 26 is located on one side of the receiving plate 2, and is continuously by the fourth spring 27 tension, and the bottom end of the resistance rod 36 is in contact with the slot edge 37, but is blocked by the receiving plate 2 and the slot edge 37 and cannot slide along the guide plate 25, so the scraper 26 is not in contact with the receiving plate 2, but the contact between the resistance rod 36 and the slot edge 37 makes the end face of the scraping end of the scraper 26 on the extension line of the top wall of the receiving plate 2;

[0052] When the rack bar 9 and the gear 8 meshing, the receiving plate 2 will rotate around the rotation axis of the support rod 6 to the middle, and when the receiving plate 2 rotates, the scraper 26 will slide down along the guide plate 25 under the pull of the fourth spring 27, and the guide plate 25 will pull the pull rope 30 on the output shaft of the motor 28 to continuously unreel, that is, the output shaft of the motor 28 will rotate with the unreeling of the pull rope 30, and the winding wheel 29 supports and reduces the friction of the pull rope 30. When the scraper 26 slides down along the guide plate 25, it will scrape the top wall of the receiving plate 2. When the receiving plate 2 is about to rotate to the horizontal position, the scraper 26 will also slide to the limit position. At this time, the side wall of the receiving plate 2 will temporarily lift the scraper 26 to slide a small distance along the guide plate 25, and then the receiving plate 2 will be out of contact with the scraper 26. At this time, the receiving plate 2 will rotate to the horizontal position, and then the printing work can be carried out;

[0053] At this time, the motor 28 is started, and the motor 28 rotates to wind the pull rope 30, and the winding wheel 29 supports the position close to the upper end of the pull rope 30. At this time, the upper end of the pull rope 30 will pull the scraper 26 to slide up along the guide plate 25, and the scraper 26 will pull the fourth spring 27 to gradually stretch. When the pull rope 30 pulls the scraper 26 to the highest position, the end of the scraper 26 will contact the inclined surface of the baffle 31 and push the baffle 31 to rotate to one side around the rotation axis, and compress the second torsional spring 33. When the scraper 26 rises to the limit position, the scraper 26 will rise above the baffle 31. At this time, the second torsional spring 33 will drive the baffle 31 to reset. At this time, the baffle 31 will clamp the scraper 26 from below, so that the scraper 26 stays at this position;

[0054] After the printing work is completed, the lifting group and the driving group will start to work, so that the receiving plate 2 rotates from the middle to both sides, and after the receiving plate 2 rotates to the initial position, the bottom end of the receiving plate 2 will press the extrusion plate 34, so that the extrusion plate 34 slides down along the guide plate 25 and stretches the fifth spring 35, and when the extrusion plate 34 slides down, it will push the two baffles 31 from the middle to both sides to rotate around the rotating shaft, so that the top end of the baffle 31 can be separated from the scraper 26, so that the scraper 26 can not be blocked, and be stretched by the fourth spring 27, and when the receiving plate 2 rotates to the middle, the surface of the receiving plate 2 can be cleaned;

[0055] When the receiving plate 2 rotates to the middle, the scraper 26 can clean the residual slurry on the top of the receiving plate 2, so as to avoid the slurry from solidifying on the surface of the scraper 26 for a long time, which affects the flatness of the surface of the receiving plate 2, and further affects the printing efficiency of the screen.

[0056] As a further scheme of the present application, the inner wall of each of the two accommodating grooves 3 is provided with a supporting edge 38. The above scheme can stably support the placing plate 1 when the two receiving plates 2 move to the position in contact with the placing plate 1.

Claims

1. A support and positioning device for preventing sidewall contamination of wafers or chips, comprising a placement plate (1) for placing wafers or chips, characterized in that: The placement plate (1) is provided with a receiving plate (2) on both the left and right sides. Each of the two receiving plates (2) has a receiving groove (3). When the two receiving grooves (3) are combined, they can form a pattern that overlaps with the wafer or chip. Each of the two receiving plates (2) is provided with a driving group below. The driving group is used to drive the two receiving plates (2) to restrict the placement plate (1) inside the two receiving grooves (3) from both sides before screen printing, and to drive the two receiving plates (2) to separate from the placement plate (1) after printing. The placement plate (1) has two notches (4). When the two receiving plates (2) restrict the placement plate (1) inside the two receiving slots (3) from both sides, the top of the receiving plate (2) is at the same level as the top of the wafer or chip; The drive assembly includes a support plate (5) located on one side of the placement plate (1). The front and rear ends of the support plate (5) are rotatably connected to support rods (6). The two support rods (6) are jointly arranged at the bottom of the receiving plate (2). The two support rods (6) are used to support the receiving plate (2). The rotation shafts of the two support rods (6) are fitted with first torsion springs (7). The two support rods (6) are fixedly connected to gears (8). The rack rods (9) are arranged below the two gears (8). The two rack rods (9) can mesh with the two gears (8) respectively. A lifting assembly is arranged between the two support plates (5). The lifting assembly is located directly below the placement plate (1). The lifting assembly is used to drive the rack rods (9) to mesh with the gears (8). The four support rods (6) are slidably connected to the bottom of the two support plates (2). The four support rods (6) are fixedly connected to the inner wall of the support plate (2) with a first spring (10). The side walls of the four support rods (6) are provided with vertical sliding grooves (11). The sliding grooves (11) are slidably connected with driving plates (12). The top of the driving plates (12) is rotatably connected with driving rods (13). The tops of the four driving rods (13) are rotatably connected to the front and rear side walls of the two support plates (2). Each of the four rack rods (9) has a vertical rod (14) slidably connected inside. The lifting assembly can drive the four vertical rods (14) and the rack rods (9) to rise synchronously. Each of the four vertical rods (14) has a second spring (15) fixedly connected between its interior and the inner wall of the rack rod (9). The vertical rods (14) are used to lift the drive plate (12). Each of the four rack rods (9) has an extension side fixedly connected to its side wall. The extension side can contact the bottom of the support plate (5) when the rack rod (9) and the gear (8) are engaged to the limit position, thereby preventing the rack rod (9) from rising further. The lifting assembly includes an H-shaped rod (16) and a base (17). Four vertical rods (14) are fixedly connected to the four ends of the H-shaped rod (16). The H-shaped rod (16) is located directly above the base (17). Two first cylinders (18) are fixedly connected between the base (17) and the H-shaped rod (16). A T-shaped rod (19) is slidably connected to the outside of the H-shaped rod (16). The bottom end of the T-shaped rod (19) is directly below the two support plates (5), and the length of the bottom end of the T-shaped rod (19) is greater than the distance between the two support plates (5). A third spring (20) is fixedly connected between the H-shaped rod (16) and the T-shaped rod (19). The top end of the T-shaped rod (19) is fixedly connected to the bottom of the placement plate (1).

2. The support and positioning device for preventing sidewall contamination of wafers or chips according to claim 1, characterized in that: A support ring (21) is provided below the placement plate (1). The support ring (21) has a groove that matches the placement plate (1). The placement plate (1) is located inside the groove. A through hole is provided in the middle of the support ring (21). The T-shaped rod (19) passes through the through hole. Several second cylinders (22) are fixedly connected to the bottom of the support ring (21). The extension and retraction ends of the second cylinders (22) are all fixedly connected to baffles (23). Several rollers (24) are rotatably connected to the inner sidewall of the baffles (23). The support ring (21) is fixedly connected between the two support plates (5).

3. The support and limiting device for preventing sidewall contamination of wafers or chips according to claim 2, characterized in that: The top of the support plate (5) is fixedly connected to two guide plates (25). The middle position of the guide plates (25) is tilted to one side from a vertical state. The interior of the tilted part of the two guide plates (25) is provided with guide grooves. The two guide grooves are slidably connected to a scraper (26). The bottom of the scraper (26) and the bottom of the guide groove are fixedly connected to a fourth spring (27). The side walls of the two guide plates (25) are fixedly connected to a motor (28). The side walls of the two guide plates (25) are rotatably connected to a winding wheel (29). The output end of the motor (28) is fixedly connected to a pull rope (30). The other end of the two pull ropes (30) passes around the winding wheel (29) and is fixedly connected to the scraper (26). Each of the two guide plates (25) is provided with a baffle (31) on one side. The baffle (31) is provided with an inclined surface (32) at the end. The baffle (31) is used to block the scraper (26). The bottom ends of the two baffles (31) are rotatably connected to the support plate (5). A second torsion spring (33) is sleeved on the rotation shaft of the two baffles (31). A pressing plate (34) is provided between the two baffles (31). The front and rear ends of the pressing plate (34) are slidably connected to the inside of the two guide plates (25). A fifth spring (35) is fixedly connected between the inner wall of the two guide plates (25) and the pressing plate (34).

4. The support and limiting device for preventing sidewall contamination of wafers or chips according to claim 3, characterized in that: Each scraper (26) has a resisting rod (36) fixedly connected to its bottom, and the receiving plate (2) has a groove (37) on its side wall.

5. The support and positioning device for preventing sidewall contamination of wafers or chips according to claim 1, characterized in that: Both of the receiving grooves (3) have supporting edges (38) on their inner walls.

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