Ultrasonic cleaning process for semiconductor ultra-high purity products

Abstract

The application discloses a semiconductor ultrahigh-purity product ultrasonic cleaning process and relates to the technical field of ultrasonic cleaning equipment. The cleaning process comprises the following specific steps: step one: pushing the workpiece to be cleaned from a feeding trolley to the feeding port end of an ultrasonic cleaning machine, and injecting a cleaning agent into a cleaning tank in the ultrasonic cleaning machine. The application is provided with a moving mechanism, a feeding mechanism and a discharging mechanism. The motor drives the rotating frame to stop after rotating 90 degrees, and the rotating operation is intermittently performed. When the rotating frame does not rotate, the movable frame pushes the placing frame into the butt joint seat, and the butt joint seat is fixed in the inner cavity of the placing frame. When the placing frame rotates into the cleaning tank, the ultrasonic cleaning machine performs the cleaning operation on the product. When the placing frame rotates to the position close to the discharging rail, the placing frame falls into the discharging rail, so that the automatic feeding, cleaning and discharging operations on the product are facilitated, the manual operation amount is reduced, and the purpose of automatically feeding and discharging the product is achieved.

Description

Technical Field

[0001] This invention relates to the field of ultrasonic cleaning equipment technology, specifically to ultrasonic cleaning processes for ultra-high purity semiconductor products. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion, and other fields. For example, diodes are devices made of semiconductors. From both a technological and economic development perspective, semiconductors are of paramount importance. Most electronic products, such as computers, mobile phones, or digital recorders, have core components that are closely related to semiconductors. Common semiconductor materials include silicon, germanium, and gallium arsenide, with silicon being the most influential among various semiconductor materials.

[0003] Ultrasonic cleaning machines are required for cleaning ultra-high purity semiconductor products. These machines mainly consist of an ultrasonic generator (control box), transducer, cleaning tank, circulation filtration system, temperature control system, liquid level control system, and hook-type robotic conveyor system. The ultrasonic generator is the part that generates electromagnetic oscillation signals and provides energy. It can generate ultrasonic electrical signals higher than 20kHz, which are supplied to the transducer. The transducer converts the oscillating current generated by the ultrasonic generator into ultrasonic vibrations within itself, continuously generating hundreds of millions of tiny bubbles in the liquid within the tank. As these bubbles rise and contact the workpiece, they burst on the workpiece surface, instantly removing dirt and achieving a high-precision, high-efficiency cleaning effect. The cleaning tank primarily holds the cleaning solution and the components to be cleaned.

[0004] However, when using an ultrasonic cleaner, the operator needs to place the product into the placement box, then place the placement box into the cleaning tank for cleaning, then remove the placement box, remove the product, put in a new product, and repeat the above operation for cleaning. The operation is cumbersome and reduces the cleaning efficiency of the product. In order to achieve the purpose of automatic product feeding and discharging, an ultrasonic cleaning process for ultra-high purity semiconductor products is provided. Summary of the Invention

[0005] The purpose of this invention is to provide an ultrasonic cleaning process for ultra-high purity semiconductor products in order to achieve automatic product feeding and discharging.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an ultrasonic cleaning process for ultra-high purity semiconductor products, which includes the following specific steps:

[0007] Step 1: Push the workpiece to be cleaned from the loading trolley to the feed port of the ultrasonic cleaner, and inject cleaning agent or ultrapure water into the cleaning tank of the ultrasonic cleaner in advance.

[0008] Step 2: The workpiece enters through the feed port of the ultrasonic cleaner and is pulled into the pure water ultrasonic cleaning tank by the robotic arm. The cleaning tank has a single-sided overflow structure. The liquid overflowing from the overflow port flows into the main drain pipe. The liquid in the tank is pumped out and filtered by the circulation pump and then pumped into the next cleaning tank for recycling. The cleaning tank is equipped with a stainless steel float-type liquid level control structure. The circulation pump is automatically shut off and an audible and visual alarm is triggered when the liquid level is low or zero, indicating that the ultrapure water inlet flow is insufficient and cannot meet the requirements for clear overflow of the product.

[0009] Step 3: The workpieces cleaned by the ultrasonic cleaner are transported by the robot to the discharge port of the ultrasonic cleaner. From the discharge port, they are conveyed by the conveyor belt to the next ultrasonic cleaner for further cleaning. There are multiple ultrasonic cleaners arranged in a line. The ultrapure water inlet is from the last cleaning tank and is equipped with an online resistivity detection instrument to detect whether the resistivity is greater than 18 megohms in real time.

[0010] Step 4: After the workpiece is cleaned, remove it from the ultrasonic cleaning device and place it on a shelf at an angle of 25-30° to remove water. Then, purge it with high-purity nitrogen to remove water stains from the surface of the workpiece. Continue to purge with high-purity nitrogen and purge with air to dry it to 120 degrees Celsius. After drying, purge with high-purity nitrogen at room temperature to cool it down to room temperature.

[0011] Step 5: After cleaning and drying, the workpieces are then automatically packaged and collected online in a single layer.

[0012] The ultrasonic cleaner has a feed rail and a discharge rail at both ends, and a first mounting plate and a second mounting plate are arranged sequentially on one side. The product enters the cleaning tank of the ultrasonic cleaner through a moving mechanism for cleaning.

[0013] The moving mechanism includes a motor mounted on the outer wall of the second mounting plate. The output end of the motor is connected to a connecting shaft. One end of the connecting shaft passes through the first mounting plate and is fixedly connected to a first spur gear. A rotating frame is provided at one end of the outer wall of the first mounting plate. A second spur gear is fixedly connected to the side of the rotating frame facing the first mounting plate. The second spur gear is rotatably connected to the first mounting plate via a rotating shaft. The first spur gear and the second spur gear are in contact. A rotatable rotating frame is provided above the cleaning tank of the ultrasonic cleaner. An mounting shaft is fixedly connected to the inner wall of the rotating frame. A third spur gear is fixedly connected to one end of the mounting shaft. The third spur gear is located in the inner cavity of the rotating frame. Four sets of tooth blocks are evenly distributed around the inner circumference of the rotating frame. An arc-shaped groove is provided between two adjacent sets of tooth blocks. The rotating frame is cross-shaped. A docking seat is fixedly connected to the four corners of the rotating frame. The product enters the inner cavity of the docking seat through a feeding mechanism.

[0014] The feeding mechanism includes a movable groove and a placement frame. The movable groove is formed on the outer wall of the first mounting plate. A movable frame extending above the feeding rail is slidably connected to the inner wall of the movable groove. A first bevel gear is fixedly connected to the outer wall of the connecting shaft between the first and second mounting plates. A rotating rod is provided between the first and second mounting plates. A second bevel gear is fixedly connected to one end of the rotating rod. The first bevel gear is in contact with the second bevel gear. The other end of the rotating rod passes through the movable frame. A slider extending below the movable frame is slidably connected to the bottom of the movable frame away from the rotating rod. A first inclined surface is provided at the bottom end of the slider. A first spring is connected between the top end of the slider and the movable frame.

[0015] The feeding mechanism also includes a top plate, which is fixedly connected to the top of one end of the feeding rail. A cavity is formed between the feeding rail and the top plate. A limiting block extending into the cavity is slidably connected inside the feeding rail. The inner wall of the cavity matches the outer wall of the placement frame. A second spring is connected between the limiting block and the feeding rail. The product is placed in the inner cavity of the placement frame. Stops are rotatably connected to both sides of the placement frame to fix the product. The placement frame is slidably connected to the inner cavity of the feeding rail. The placement frame can slide into the inner cavity of the docking seat. The placement frame moves out of the docking seat through the discharge mechanism.

[0016] The discharge mechanism includes a slot, which is opened at the top of the placement frame. An extrusion plate is fixedly connected to the outer wall of the first mounting plate near the discharge rail. A C-shaped block extending into the inner cavity of the docking seat is slidably connected inside the docking seat. A third spring is connected between the top of the C-shaped block and the docking seat. An extrusion block extending out of the docking seat is slidably connected to the inside of the docking seat on one side of the C-shaped block.

[0017] The first spur gear meshes with the second spur gear, and the third spur gear meshes with the tooth block;

[0018] The first bevel gear meshes with the second bevel gear, the outer wall of the rotating rod is provided with a reciprocating thread, the outer wall of the movable frame is provided with a connecting hole, and the inner wall of the connecting hole is provided with balls that match the reciprocating thread.

[0019] As a further embodiment of the present invention: the top of the limiting block is provided with a semi-circular surface, and the two sides of the placement frame are provided with rotating grooves for the stop block to rotate, and the rotating grooves are in close contact with the stop block.

[0020] As a further embodiment of the present invention: the inner wall of the docking seat is in contact with the outer wall of the placement frame, and one end of the outer wall of the C-shaped block is in contact with the inner wall of the slot.

[0021] As a further embodiment of the present invention: a second inclined surface is provided at one end of the C-shaped block located in the inner cavity of the docking seat, and a third inclined surface is provided at the other end of the C-shaped block. The third inclined surface is in contact with the extrusion block, and a semi-circular surface is provided at one end of the extrusion block located outside the docking seat.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] 1. By setting up a moving mechanism, a feeding mechanism, and a discharging mechanism, the motor drives the rotating frame to rotate 90 degrees and then stops, performing intermittent rotation operations. When the rotating frame is not rotating, the movable frame pushes the placement frame into the docking seat, fixing the docking seat in the inner cavity of the placement frame. When the placement frame rotates into the cleaning tank, the ultrasonic cleaner performs a cleaning operation on the product. When the placement frame rotates to a position close to the discharge rail, the placement frame falls into the discharge rail, facilitating automatic product loading, cleaning, and unloading operations, reducing manual operation, and achieving the purpose of automatic product loading and unloading.

[0024] 2. The cleaning tank is equipped with a filtration and circulation system, which can filter impurities in the cleaning solution at any time and maintain the cleanliness of the cleaning agent for a long time. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the installation of the rotating frame of the present invention;

[0027] Figure 3 This is a cross-sectional view of the rotating frame of the present invention;

[0028] Figure 4 This is a schematic diagram of the feed rail structure of the present invention;

[0029] Figure 5 This is a cross-sectional view of the feed rail of the present invention;

[0030] Figure 6 This is a schematic diagram of the rotating frame of the present invention;

[0031] Figure 7 This is a cross-sectional view of the docking seat of the present invention.

[0032] In the diagram: 1. Ultrasonic cleaner; 2. Feed rail; 3. Discharge rail; 4. First mounting plate; 5. Second mounting plate; 6. Moving mechanism; 601. Motor; 602. Connecting shaft; 603. First spur gear; 604. Rotating frame; 605. Second spur gear; 606. Rotating bracket; 607. Mounting shaft; 608. Third spur gear; 609. Gear block; 610. Arc groove; 611. Connecting seat; 7. Feeding mechanism; 701. Movable groove; 702. Movable frame; 703. First bevel gear; 704. Second bevel gear; 705. Rotating rod; 706. Slider; 707. First spring; 708. Top plate; 709. Limiting block; 710. Second spring; 711. Placement frame; 712. Stop block; 8. Discharge mechanism; 801. Slot; 802. Extrusion plate; 803. C-shaped block; 804. Third spring; 805. Extrusion block. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] In this embodiment of the invention, an ultrasonic cleaning process for ultra-high purity semiconductor products includes the following specific steps:

[0035] Step 1: Push the workpiece to be cleaned from the loading trolley to the feed port of the ultrasonic cleaner, and inject cleaning agent or ultrapure water into the cleaning tank of the ultrasonic cleaner in advance.

[0036] Step 2: The workpiece enters through the feed port of the ultrasonic cleaner and is pulled into the pure water ultrasonic cleaning tank by the robotic arm. The cleaning tank has a single-sided overflow structure. The liquid overflowing from the overflow port flows into the main drain pipe. The liquid in the tank is pumped out and filtered by the circulation pump and then pumped into the next cleaning tank for recycling. The cleaning tank is equipped with a stainless steel float-type liquid level control structure. The circulation pump is automatically shut off and an audible and visual alarm is triggered when the liquid level is low or zero, indicating that the ultrapure water inlet flow is insufficient and cannot meet the requirements for clear overflow of the product.

[0037] Step 3: The workpieces cleaned by the ultrasonic cleaner are transported by the robot to the discharge port of the ultrasonic cleaner. From the discharge port, they are conveyed by the conveyor belt to the next ultrasonic cleaner for further cleaning. There are multiple ultrasonic cleaners arranged in a line. The ultrapure water inlet is from the last cleaning tank and is equipped with an online resistivity detection instrument to detect whether the resistivity is greater than 18 megohms in real time.

[0038] Step 4: After the workpiece is cleaned, remove it from the ultrasonic cleaning device and place it on a shelf at an angle of 25-30° to remove water. Then, purge it with high-purity nitrogen to remove water stains from the surface of the workpiece. Continue to purge with high-purity nitrogen and purge with air to dry it to 120 degrees Celsius. After drying, purge with high-purity nitrogen at room temperature to cool it down to room temperature.

[0039] Step 5: After cleaning and drying, the workpieces are then automatically packaged and collected online in a single layer.

[0040] In this embodiment: the feeding cart is manually propelled and conveyed to complete the feeding. The pure water ultrasonic rinsing tank is equipped with one 12KW stainless steel heating tube inside. A drain outlet is located at the lowest point of the tank bottom, fitted with a removable stainless steel mesh to prevent the workpiece or other debris from entering the pipe. The outer surface of the tank is lined with 10mm thick insulation cotton. The ultrasonic system uses an immersion-type vibrating plate, placed at the bottom of the tank and bolted to the side, sealed with a Teflon sheet in the middle. The bottom vibrating plate is equipped with one 30-vibrator unit, made of SUS316 stainless steel plate, 2.0mm thick, chrome-plated, L360×W720×H90 (mm), with a total ultrasonic power of 15000W (power continuously adjustable), a frequency (fine-tuning) of 68KHz, and a sound intensity of 4.65W / cm. There are 15 units per tank. An external control box is provided, with 15 generators per tank, centrally located.

[0041] In step four, the nitrogen and air-blowing tanks are separate drying tanks with a sloping bottom. After the cleaning basket is placed inside, nitrogen is used to blow-dry the interior, and a vacuum is used to draw water to one side. The tank is equipped with a stainless steel float-type liquid level control; the circulation pump automatically shuts off and an audible and visual alarm is triggered when the liquid level is low or zero. The outer surface of the tank is lined with insulation cotton. The nitrogen equipment uses heat to heat the nitrogen. The stainless steel float-type liquid level control is simple to install and easy to replace if damaged. The circulation pump automatically shuts off and an audible and visual alarm is triggered when the liquid level is low or zero.

[0042] The entire machine has a closed structure with a stainless steel frame and an A3 steel chassis. The rear of the cleaning section has two exhaust ports that connect to the user's workshop ventilation system to promptly remove moisture and odors from the equipment, ensuring a clean environment.

[0043] Process flow chart:

[0044]

[0045]

[0046] Please refer to this carefully. Figures 2-5 The ultrasonic cleaner 1 has a feed rail 2 and a discharge rail 3 at both ends. A first mounting plate 4 and a second mounting plate 5 are sequentially arranged on one side of the ultrasonic cleaner 1. The product enters the cleaning tank of the ultrasonic cleaner 1 through a moving mechanism 6 for cleaning. The moving mechanism 6 includes a motor 601, which is mounted on the outer wall of the second mounting plate 5. The output end of the motor 601 is connected to a connecting shaft 602. One end of the connecting shaft 602 passes through the first mounting plate 4 and is fixedly connected to a first spur gear 603. A rotating frame 604 is provided at one end of the outer wall of the first mounting plate 4. A second spur gear 605 is fixedly connected to the side of the rotating frame 604 facing the first mounting plate 4. The second spur gear 605... The rotating shaft is rotatably connected to the first mounting plate 4. The first spur gear 603 is in contact with the second spur gear 605. A rotatable rotating frame 606 is provided above the cleaning tank of the ultrasonic cleaner 1. The inner wall of the rotating frame 606 is fixedly connected to the mounting shaft 607. One end of the mounting shaft 607 is fixedly connected to the third spur gear 608. The third spur gear 608 is located in the inner cavity of the rotating frame 604. Four sets of tooth blocks 609 are evenly distributed around the inner circumference of the rotating frame 604. An arc groove 610 is provided between two adjacent sets of tooth blocks 609. The rotating frame 606 is cross-shaped. The four corners of the rotating frame 606 are fixedly connected to docking seats 611. The product enters the inner cavity of the docking seat 611 through the feeding mechanism 7.

[0047] In this embodiment: the motor 601 is started, the motor 601 drives the connecting shaft 602 to rotate, the connecting shaft 602 rotates and drives the first spur gear 603 to rotate, the first spur gear 603 rotates and drives the second spur gear 605 to rotate, the second spur gear 605 rotates and drives the rotating frame 604 to rotate, the rotating frame 604 rotates and drives the tooth block 609 to move in a circle;

[0048] When the tooth block 609 moves and contacts the third spur gear 608, it drives the third spur gear 608 to rotate. The rotation of the third spur gear 608 drives the mounting shaft 607 to rotate, and the rotation of the mounting shaft 607 drives the rotating frame 606 to rotate.

[0049] When the tooth block 609 separates from the third spur gear 608, the rotating frame 604 continues to rotate, while the rotating bracket 606 stops rotating, thus causing the rotating bracket 606 to stop after rotating 90 degrees, and perform intermittent rotation operations.

[0050] Please refer to this carefully. Figures 2-5 The feeding mechanism 7 includes a movable groove 701 and a placement frame 711. The movable groove 701 is located on the outer wall of the first mounting plate 4. A movable frame 702 extending above the feeding rail 2 is slidably connected to the inner wall of the movable groove 701. A first bevel gear 703 is fixedly connected to the outer wall of the connecting shaft 602 between the first mounting plate 4 and the second mounting plate 5. A rotating rod 705 is provided between the first mounting plate 4 and the second mounting plate 5. A second bevel gear 704 is fixedly connected to one end of the rotating rod 705. The first bevel gear 703 contacts the second bevel gear 704. The other end of the rotating rod 705 passes through the movable frame 702. A slider 706 extending below the movable frame 702 is slidably connected to the bottom of the movable frame 702 away from the rotating rod 705. A first inclined surface is provided at the bottom end of the slider 706. A first spring 707 is connected between the top of block 706 and movable frame 702. The feeding mechanism 7 also includes a top plate 708, which is fixedly connected to the top of one end of the feeding rail 2. A cavity is formed between the feeding rail 2 and the top plate 708. A limiting block 709 extending into the cavity is slidably connected inside the feeding rail 2. The inner wall of the cavity matches the outer wall of the placement frame 711. A second spring 710 is connected between the limiting block 709 and the feeding rail 2. The product is placed in the inner cavity of the placement frame 711. Stop blocks 712 are rotatably connected to both sides of the placement frame 711. The stop blocks 712 are used to fix the product. The placement frame 711 is slidably connected to the inner cavity of the feeding rail 2. The placement frame 711 can slide into the inner cavity of the docking seat 611. The placement frame 711 moves out of the docking seat 611 through the discharge mechanism 8.

[0051] In this embodiment: when the connecting shaft 602 rotates, the rotation of the connecting shaft 602 drives the first bevel gear 703 to rotate, the rotation of the first bevel gear 703 drives the second bevel gear 704 to rotate, the rotation of the second bevel gear 704 drives the rotating rod 705 to rotate, the rotation of the rotating rod 705 drives the movable frame 702 to reciprocate, and at the same time the placement frame 711 slides in the inner cavity of the feeding rail 2 and enters between the top plate 708 and the feeding rail 2. The placement frame 711 contacts the limiting block 709, and the limiting block 709 blocks the placement frame 711 from moving.

[0052] When the tooth block 609 separates from the third spur gear 608, the rotating frame 606 stops rotating. At this time, the movable frame 702 moves toward the docking seat 611. The movement of the movable frame 702 drives the slider 706 to move. The slider 706 pushes the placement frame 711 to move. The placement frame 711 moves into the docking seat 611.

[0053] When the toothed block 609 contacts the third spur gear 608, the rotating frame 606 continues to rotate, and the movable frame 702 moves away from the docking seat 611. The subsequent placement frame 711 on the feed rail 2 slides to the limiting block 709. At this time, the slider 706 contacts the placement frame 711. The first inclined surface is also subjected to force, which causes the slider 706 to move upward without affecting the movement of the placement frame 711. Until it slides to the other end of the placement frame 711, the slider 706 is reset by the elastic force of the first spring 707 and contacts the outer wall of one end of the placement frame 711, which facilitates the next pushing operation.

[0054] Please refer to this carefully. Figure 2 , Figure 6 and Figure 7 The discharge mechanism 8 includes a slot 801, which is located at the top of the placement frame 711. An extrusion plate 802 is fixedly connected to the outer wall of the first mounting plate 4 near the discharge rail 3. A C-shaped block 803 extending into the inner cavity of the docking seat 611 is slidably connected inside the docking seat 611. A third spring 804 is connected between the top of the C-shaped block 803 and the docking seat 611. An extrusion block 805 extending out of the docking seat 611 is slidably connected to the inner side of the C-shaped block 803 inside the docking seat 611.

[0055] In this embodiment: when the placement frame 711 slides into the inner cavity of the docking seat 611, the C-shaped block 803 is engaged into the slot 801 by the elastic force of the third spring 804, thereby fixing the docking seat 611 in the inner cavity of the placement frame 711.

[0056] When the placement frame 711 rotates into the cleaning tank of the ultrasonic cleaner 1, the ultrasonic cleaner 1 performs a cleaning operation on the product. When the placement frame 711 rotates to a position close to the discharge rail 3, the extrusion block 805 contacts the extrusion plate 802, pushing the extrusion block 805 to move. The movement of the extrusion block 805 pushes the C-shaped block 803 to move. The C-shaped block 803 moves out of the slot 801, releasing the fixation of the placement frame 711. At this time, the opening of the docking seat 611 is tilted downward and facing the discharge rail 3. The placement frame 711 slides out of the docking seat 611 under the action of gravity and falls into the discharge rail 3 for discharge operation. This facilitates automatic product loading, cleaning and unloading operations, reduces manual operation, and achieves the purpose of automatic product feeding and unloading.

[0057] Please refer to this carefully. Figure 2 and Figure 3 The first spur gear 603 meshes with the second spur gear 605, and the third spur gear 608 meshes with the tooth block 609.

[0058] In this embodiment: the rotating frame 604 rotates, causing the toothed block 609 to move in a circular motion; when the toothed block 609 moves and contacts the third spur gear 608, it drives the third spur gear 608 to rotate, the rotation of the third spur gear 608 drives the mounting shaft 607 to rotate, and the rotation of the mounting shaft 607 drives the rotating frame 606 to rotate; when the toothed block 609 separates from the third spur gear 608, the rotating frame 604 continues to rotate, and the rotating frame 606 stops rotating, so that the rotating frame 606 stops after rotating 90 degrees, and the rotation operation is performed intermittently.

[0059] Please refer to this carefully. Figure 2 The first bevel gear 703 meshes with the second bevel gear 704. The outer wall of the rotating rod 705 is provided with a reciprocating thread. The outer wall of the movable frame 702 is provided with a connecting hole. The inner wall of the connecting hole is provided with balls that match the reciprocating thread.

[0060] In this embodiment: when the connecting shaft 602 rotates, the rotation of the connecting shaft 602 drives the first bevel gear 703 to rotate, the rotation of the first bevel gear 703 drives the second bevel gear 704 to rotate, the rotation of the second bevel gear 704 drives the rotating rod 705 to rotate, and the rotation of the rotating rod 705 drives the movable frame 702 to reciprocate.

[0061] Please refer to this carefully. Figure 5 The top of the limiting block 709 is provided with a semi-circular surface, and the two sides of the placement frame 711 are provided with rotating grooves for the stop block 712 to rotate. The rotating grooves are in close contact with the stop block 712.

[0062] In this embodiment: when placing the product, the product is placed into the inner cavity of the placement frame 711, and then the stop block 712 is rotated. The stop block 712 rotates in the rotation and positions the product. At this time, the stop block 712 is tightly fitted with the rotation groove, thereby fixing the product in the placement frame 711.

[0063] Please refer to this carefully. Figure 6 and Figure 7 The inner wall of the docking seat 611 is in contact with the outer wall of the placement frame 711. One end of the outer wall of the C-shaped block 803 is in contact with the inner wall of the slot 801. A second inclined surface is provided at one end of the C-shaped block 803 located in the inner cavity of the docking seat 611, and a third inclined surface is provided at the other end of the C-shaped block 803. The third inclined surface is in contact with the pressing block 805. A semi-circular surface is provided at one end of the pressing block 805 located outside the docking seat 611.

[0064] In this embodiment: when the placement frame 711 slides into the inner cavity of the docking seat 611, the C-shaped block 803 is engaged into the slot 801 by the elastic force of the third spring 804, thereby fixing the docking seat 611 in the inner cavity of the placement frame 711; when the placement frame 711 rotates into the cleaning tank of the ultrasonic cleaner 1, the ultrasonic cleaner 1 performs a cleaning operation on the product; when the placement frame 711 rotates to a position close to the discharge rail 3, the extrusion block 805 contacts the extrusion plate 802, pushing the extrusion block 805 to move, and the movement of the extrusion block 805 pushes the C-shaped block 803 to move, and the C-shaped block 803 moves out of the slot 801, releasing the fixation of the placement frame 711. At this time, the docking seat 611 is in an inclined state, and the placement frame 711 slides out of the docking seat 611 under the action of gravity and falls into the discharge rail 3 for discharge operation.

[0065] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An ultrasonic cleaning process for ultra-high purity semiconductor products, characterized in that, The cleaning process includes the following specific steps: Step 1: Push the workpiece to be cleaned from the loading trolley to the feed port of the ultrasonic cleaner, and inject cleaning agent or ultrapure water into the cleaning tank of the ultrasonic cleaner in advance. Step 2: The workpiece enters through the feed port of the ultrasonic cleaner and is pulled into the pure water ultrasonic cleaning tank by the robotic arm. The cleaning tank has a single-sided overflow structure. The liquid overflowing from the overflow port flows into the main drain pipe. The liquid in the tank is pumped out and filtered by the circulation pump and then pumped into the next cleaning tank for recycling. The cleaning tank is equipped with a stainless steel float-type liquid level control structure. The circulation pump is automatically shut off and an audible and visual alarm is triggered when the liquid level is low or zero, indicating that the ultrapure water inlet flow is insufficient and cannot meet the requirements for clear overflow of the product. Step 3: The workpieces cleaned by the ultrasonic cleaner are transported by the robot to the discharge port of the ultrasonic cleaner. From the discharge port, they are conveyed by the conveyor belt to the next ultrasonic cleaner for further cleaning. There are multiple ultrasonic cleaners arranged in a line. The ultrapure water inlet is from the last cleaning tank and is equipped with an online resistivity detection instrument to detect whether the resistivity is greater than 18 megohms in real time. Step 4: After the workpiece is cleaned, remove it from the ultrasonic cleaning device and place it on a shelf at an angle of 25-30° to remove water. Then, purge it with high-purity nitrogen to remove water stains from the surface of the workpiece. Continue to purge with high-purity nitrogen and purge with air to dry it to 120 degrees Celsius. After drying, purge with high-purity nitrogen at room temperature to cool it down to room temperature. Step 5: After cleaning and drying, the workpieces are then automatically packaged and collected online in a single layer. The ultrasonic cleaner (1) is provided with a feed rail (2) and a discharge rail (3) at both ends respectively. The ultrasonic cleaner (1) is provided with a first mounting plate (4) and a second mounting plate (5) in sequence on one side. The product enters the cleaning tank of the ultrasonic cleaner (1) through the moving mechanism (6) for cleaning. The moving mechanism (6) includes a motor (601), which is mounted on the outer wall of the second mounting plate (5). The output end of the motor (601) is connected to a connecting shaft (602). One end of the connecting shaft (602) passes through the first mounting plate (4) and is fixedly connected to a first spur gear (603). A rotating frame (604) is provided on one end of the outer wall of the first mounting plate (4). A second spur gear (605) is fixedly connected to the side of the rotating frame (604) facing the first mounting plate (4). The second spur gear (605) is rotatably connected to the first mounting plate (4) through a rotating shaft. The first spur gear (603) is in contact with the second spur gear (605). The ultrasonic cleaner (1) has a rotatable rotating frame (606) above the cleaning tank. The inner wall of the rotating frame (606) is fixedly connected to an installation shaft (607). One end of the installation shaft (607) is fixedly connected to a third spur gear (608). The third spur gear (608) is located in the inner cavity of the rotating frame (604). The inner wall of the rotating frame (604) has four sets of tooth blocks (609) evenly distributed around its circumference. An arc groove (610) is provided between two adjacent sets of tooth blocks (609). The rotating frame (606) is cross-shaped. The four corners of the rotating frame (606) are fixedly connected to docking seats (611). The product enters the inner cavity of the docking seat (611) through the feeding mechanism (7). The feeding mechanism (7) includes a movable groove (701) and a placement frame (711). The movable groove (701) is opened on the outer wall of the first mounting plate (4). The inner wall of the movable groove (701) is slidably connected to a movable frame (702) extending above the feeding rail (2). The outer wall of the connecting shaft (602) is fixedly connected to a first bevel gear (703) between the first mounting plate (4) and the second mounting plate (5). A rotating rod (705) is provided between the first mounting plate (4) and the second mounting plate (5). One end of the rotating rod (705) is fixedly connected to a second bevel gear (704). The first bevel gear (703) is in contact with the second bevel gear (704). The other end of the rotating rod (705) passes through the movable frame (702). The movable frame (702) has a slider (706) that extends to the bottom of the end away from the rotating rod (705) slidably connected to the bottom of the movable frame (702). The bottom end of the slider (706) is provided with a first inclined surface, and the top end of the slider (706) is connected to the movable frame (702) by a first spring (707). The feeding mechanism (7) also includes a top plate (708), which is fixedly connected to the top of one end of the feeding rail (2). A cavity is formed between the feeding rail (2) and the top plate (708). A limiting block (709) extending into the cavity is slidably connected inside the feeding rail (2). The inner wall of the cavity matches the outer wall of the placement frame (711). A second spring is connected between the limiting block (709) and the feeding rail (2). Spring (710), the product is placed in the inner cavity of the placement frame (711), the two sides of the placement frame (711) are rotatably connected with a stop (712), the stop (712) is used to fix the product, the placement frame (711) is slidably connected to the inner cavity of the feed rail (2), the placement frame (711) can slide into the inner cavity of the docking seat (611), and the placement frame (711) moves out of the docking seat (611) through the discharge mechanism (8); The discharge mechanism (8) includes a slot (801), which is located at the top of the placement frame (711). An extrusion plate (802) is fixedly connected to the outer wall of the first mounting plate (4) on the side near the discharge rail (3). The docking seat (611) is slidably connected to a C-shaped block (803) extending into the inner cavity of the docking seat (611). A third spring (804) is connected between the top of the C-shaped block (803) and the docking seat (611). The docking seat (611) is slidably connected to a pressing block (805) extending out of the docking seat (611) on one side of the C-shaped block (803). The first spur gear (603) meshes with the second spur gear (605), and the third spur gear (608) meshes with the tooth block (609); The first bevel gear (703) meshes with the second bevel gear (704), the outer wall of the rotating rod (705) is provided with a reciprocating thread, the outer wall of the movable frame (702) is provided with a connecting hole, and the inner wall of the connecting hole is provided with balls that match the reciprocating thread.

2. The ultrasonic cleaning process for ultra-high purity semiconductor products according to claim 1, characterized in that, The top of the limiting block (709) is provided with a semi-circular surface, and the two sides of the placement frame (711) are provided with rotating grooves for the stop block (712) to rotate, and the rotating grooves are in close contact with the stop block (712).

3. The ultrasonic cleaning process for ultra-high purity semiconductor products according to claim 2, characterized in that, The inner wall of the docking seat (611) is in contact with the outer wall of the placement frame (711), and the outer wall of one end of the C-shaped block (803) is in contact with the inner wall of the slot (801).

4. The ultrasonic cleaning process for ultra-high purity semiconductor products according to claim 3, characterized in that, The C-shaped block (803) has a second inclined surface at one end of the inner cavity of the docking seat (611), and a third inclined surface at the other end of the C-shaped block (803). The third inclined surface is in contact with the extrusion block (805), and a semi-circular surface is provided at one end of the extrusion block (805) outside the docking seat (611).

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