A pretreatment method for destructive physical analysis of ceramic capacitors

Abstract

A pretreatment method for destructive physical analysis of ceramic capacitors, which comprises first adhering the ceramic capacitor to a fixing mechanism and filling it with a curing solution, and then utilizing a blanking mechanism to separate the ceramic capacitor cured with the curing solution from the fixing mechanism for destructive physical analysis; the fixing mechanism comprises a fixing tube body, a fixing hole formed in the fixing tube body for fixing the ceramic capacitor and filling it with resin, and a seal detachable from the bottom of the fixing tube body; the blanking mechanism comprises a base, a mounting hole provided on a machine base for mounting the fixing tube body, a blanking rod movable up and down relative to the mounting hole, and a movable assembly provided on the machine base for driving the blanking rod to move downward; the pretreatment method defined in the present application can realize the fixing of small ceramic capacitors, and the overall operation is simple, effectively reducing manpower and material resources, improving work efficiency, and all parts of the mechanism can be recycled to reduce waste of resources.

Description

Technical Field

[0001] The invention belongs to the field of ceramic capacitor testing, and in particular relates to a preprocessing method for destructive physical analysis of ceramic capacitors. Background Art

[0002] After ceramic capacitors are manufactured, a certain proportion of defective devices will exist. These defects may be inherent in the device itself or caused by improper manufacturing process control. Ceramic capacitors often fail during the operation of the equipment. Destructive physical analysis (DPA) can be used to measure the design, structure, materials and quality of ceramic capacitor devices, especially the analysis and monitoring of key process quality. It plays an irreplaceable role in improving the reliability level of ceramic capacitors and can achieve the purpose of improving component production process control and improving product reliability. Ceramic capacitors themselves are small in size, and direct destructive physical analysis is difficult to operate. Therefore, a pretreatment method for destructive physical analysis of ceramic capacitors is urgently needed. Summary of the Invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a pretreatment method for destructive physical analysis of ceramic capacitors.

[0004] The present invention adopts the following technical solutions:

[0005] A pretreatment method for destructive physical analysis of ceramic capacitors, wherein the ceramic capacitors are first adhered to a fixing mechanism and filled with a curing solution, and then a feeding mechanism is used to separate the ceramic capacitors cured with the curing solution from the fixing mechanism for destructive physical analysis.

[0006] The fixing mechanism includes a fixing tube, a fixing hole formed in the fixing tube for fixing the ceramic capacitor and filling the resin, and a sealing member detachable from the bottom of the fixing tube;

[0007] The blanking mechanism includes a base, a mounting hole provided on the machine base for mounting a fixed tube body, a blanking rod movable up and down relative to the mounting hole, and a moving assembly provided on the machine base for driving the blanking rod to move downward;

[0008] The pretreatment method specifically includes the following steps:

[0009] Step 1: adhere the ceramic capacitor to the inner wall of the fixing hole with double-sided tape, and then seal the bottom of the fixing tube with a sealant;

[0010] Step 2: Fill the fixing hole with a curing solution so that the curing solution submerges the ceramic capacitor and then places the solution into a vacuum pressure chamber for defoaming. The curing solution is a mixture of a water-based epoxy resin and a curing agent in a volume ratio of 6.5-7.5:1.5-2.

[0011] Step 3: After the curing solution and the ceramic capacitor are cured to form a test block, the seal is removed, the fixed tube is placed in the mounting hole, and then the moving assembly is controlled to drive the feed rod downward so that its lower end enters the fixing hole and squeezes the test block downward until it is released from the fixing tube;

[0012] Step 4: Remove the fixed tube body and take the test block out of the mounting hole, place it in the corresponding test device, and conduct destructive physical analysis.

[0013] Furthermore, the water-based epoxy resin is water-based epoxy resin W52, and the curing agent is curing agent 593.

[0014] Furthermore, the sealing member includes a sealing plate and an inserting block provided on the sealing plate and capable of being embedded in the fixing hole, wherein the diameter of the sealing plate is larger than the diameter of the fixing hole.

[0015] Furthermore, the fixed tube body, the sealing plate and the insert are all made of polytetrafluoroethylene.

[0016] Furthermore, the preparation method of the curing solution is as follows: weigh the water-based epoxy resin and the curing agent according to the required ratio, pour them into a stirring cup, and stir for 80-120 seconds to obtain a curing solution.

[0017] Furthermore, the blanking mechanism also includes a mounting seat arranged on the machine base for installing the blanking rod, the mounting seat includes a connecting part connected to the base, a positioning part connected to the connecting part and located above the mounting hole, and a movable cavity arranged in the positioning part relative to the mounting hole for the blanking rod to move up and down.

[0018] Furthermore, the moving assembly includes a positioning rod extending upwardly on the base, a rotating pressure rod rotatably arranged on the upper end of the positioning rod to press down the blanking rod, and a connecting piece arranged between the positioning rod and the rotating pressure rod.

[0019] Furthermore, the connecting member includes a first connecting hole arranged at the upper end of the positioning rod, a second connecting hole arranged on the rotating pressure rod opposite to the first connecting hole, a connecting bolt passing through the first connecting hole and the second connecting hole, and a butterfly nut cooperating with the connecting bolt.

[0020] Furthermore, the blanking rod includes a blanking rod body, a pressure-bearing portion arranged at the top of the blanking rod body, and an extrusion portion arranged at the bottom of the blanking rod body, and the diameter of the extrusion portion is smaller than the diameter of the fixing hole.

[0021] Furthermore, the base includes a base body, a raising block detachably arranged on the base body, and a limiting plate arranged on the base body for limiting the installation position of the raising block. A clearance hole opposite to the installation hole is formed on the raising block, and the shape of the limiting plate is consistent with the shape of the raising block.

[0022] From the above description of the present invention, it can be seen that compared with the prior art, the beneficial effects of the present invention are: this application limits the specific operation of the pretreatment method and cooperates with the fixing mechanism to achieve the fixation of small-sized ceramic capacitors, and further improves the structure of the blanking mechanism to squeeze out the test block after solidification with the ceramic capacitor in the fixed tube body. Without destroying the structure of the fixed tube body, the test block after solidification with the ceramic capacitor can be taken out for destructive physical analysis. The overall operation is simple, effectively reduces manpower and material resources, improves work efficiency, and each part of the mechanism can be recycled to reduce waste of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The structure of the present invention is schematically shown Figure 1 ;

[0024] Figure 2 The structure of the present invention is schematically shown Figure 2 ;

[0025] Figure 3 The structure of the present invention is schematically shown Figure 3 ;

[0026] Figure 4 The structure of the present invention is schematically shown Figure 4 ;

[0027] In the figure, 1-fixing mechanism, 2-unloading mechanism, 11-fixed tube body, 12-fixing hole, 13-seal, 131-sealing plate, 132-insert block, 21-base, 211-base body, 212-heightening block, 213-limiting plate, 214-clearance hole, 22-mounting hole, 23-unloading rod, 231-unloading rod body, 232-pressure-bearing part, 233-extrusion part, 24-mounting seat, 241-connecting part, 242-positioning part, 243-moving cavity, 25-moving assembly, 251-positioning rod, 252-rotating pressure rod, 253-connecting part, 254-fixing part, 255-connecting bolt, 256-butterfly nut, 257-fixing bolt, 258-fixing nut. DETAILED DESCRIPTION

[0028] The present invention is further described below through specific embodiments.

[0029] A pretreatment method for destructive physical analysis of ceramic capacitors includes: first adhering the ceramic capacitor to a fixing mechanism 1 and filling it with a curing solution, and then using a feeding mechanism 2 to separate the ceramic capacitor, which has been cured with the curing solution, from the fixing mechanism 1 for destructive physical analysis. Specifically, the ceramic capacitors subjected to destructive physical analysis include multilayer ceramic capacitors, molded ceramic capacitors, ceramic capacitors without an encapsulated metal bracket, or single-layer chip ceramic capacitors.

[0030] Reference Figures 1 to 4 As shown, the fixing mechanism 1 is used to fix the ceramic capacitor, including a fixing tube body 11, a fixing hole 12 formed in the fixing tube body 11 for fixing the ceramic capacitor and filling resin, and a sealing member 13 detachably arranged at the bottom of the fixing tube body 11. Specifically, the sealing member 13 includes a sealing plate 131 and an insert 32 provided on the sealing plate 131 and capable of being embedded in the fixing hole 121. The diameter of the sealing plate 131 is larger than the diameter of the fixing hole 12. The bottom of the fixing tube body 11 is sealed by the sealing member 13 to facilitate the filling of the resin. Furthermore, the sealing plate 131 and the insert 132 are integrally formed, and the fixing tube body 11, the sealing plate 131 and the insert 132 are all made of polytetrafluoroethylene.

[0031] The blanking mechanism 2 separates the ceramic capacitor formed by resin curing in the fixing hole 12 from the fixed tube body 11, and includes a base 21, a mounting hole 22 provided on the base 21 for mounting the fixed tube body 11, a blanking rod 23 that can move up and down relative to the mounting hole 22, a mounting seat 24 provided on the base 21 for mounting the blanking rod 23, and a moving component 25 provided on the base 21 for driving the blanking rod 23 to move downward; specifically, the base 21 includes a base body 211, a raising block 212 detachably provided on the base body 211, and a limiting plate 213 provided on the base body 211 for limiting the installation position of the raising block 212; further, a clearance hole 214 opposite to the mounting hole 22 is formed on the raising block 212, and the shape of the limiting plate 213 is consistent with the shape of the raising block 212.

[0032] The blanking rod 23 includes a blanking rod body 231, a pressure-bearing part 232 arranged at the top of the blanking rod body 231, and an extrusion part 233 arranged at the bottom of the blanking rod body 231. By moving the blanking rod 23 downward, the extrusion part 233 at its front end squeezes the solidified resin in the fixed tube body 11 downward and separates it from the fixed tube body 11 for destructive physical analysis.

[0033] The mounting seat 24 includes a connecting portion 241 connected to the base body 211, a positioning portion 242 connected to the connecting portion 241 and located above the mounting hole 22, and a movable cavity 243 arranged in the positioning portion 242 and relative to the mounting hole 22 for the unloading rod 23 to move up and down. Specifically, the diameter of the pressure-bearing portion 232 is larger than the diameter of the movable cavity 243; further, the connecting portion 241 is arranged in an arc shape.

[0034] The movable assembly 25 is detachably arranged on the mounting seat 24, and includes two positioning rods 251 extending upwardly relative to each other on both sides of the connecting portion 241, a rotating pressure rod 252 rotatably arranged on the upper end of the positioning rod 251 to press down the blanking rod 23, a connecting member 253 arranged between the positioning rod 251 and the rotating pressure rod 252, and a fixing member 254 arranged between the two positioning rods 251 and the connecting portion 241. Specifically, the connecting member 253 includes a first connecting hole arranged at the upper end of the positioning rod 251, a second connecting hole arranged on the rotating pressure rod 252 opposite to the first connecting hole, a connecting bolt 255 passing through the first connecting hole and the second connecting hole, and a fixing member 254 cooperating with the connecting bolt 255. The butterfly nut 256 cooperates with the connecting bolt 255, so that the rotating pressure rod 252 can be rotated downward in the use state to drive the discharge rod 23 to move downward, and will not rotate downward when it is not under force; further, the fixing part 254 includes a fixing bolt 257 that can pass through the two positioning rods 251 and the connecting part 241 and a fixing nut 258 that cooperates with the fixing bolt 257. Through the cooperation of the fixing bolt 257 and the fixing nut 258, while the two positioning rods 251 are fixed, the angle between the connecting part 241 and the two positioning rods 251 can also be adjusted to ensure that the rotating pressure rod 252 can drive the discharge rod 23 to move downward when it is rotated downward.

[0035] The pretreatment method specifically includes the following steps:

[0036] Step 1: adhere the ceramic capacitor to the inner wall of the fixing hole 12 with double-sided tape, and then seal the bottom of the fixing tube 11 with the sealing member 13;

[0037] Step 2: Fill the fixing hole 12 with a curing solution so that the curing solution submerges the ceramic capacitor and then puts the solution into a vacuum pressure box for defoaming, wherein the curing solution is a mixture of a water-based epoxy resin and a curing agent in a volume ratio of 6.5-7.5:1.5-2;

[0038] Step 3: After the solidified solution and the ceramic capacitor solidify to form a test block, remove the seal 13, place the fixed tube 11 in the mounting hole 22, and then control the rotary pressure rod 252 to rotate downward to drive the discharge rod 23 to move downward so that its lower end enters the fixing hole 12 and squeezes the test block downward until it is separated from the fixed tube 11;

[0039] Step 4: evacuate the fixed tube body 11 and take the test block out of the mounting hole 22, and put it into the corresponding testing device for destructive physical analysis.

[0040] Specifically, in step 2, the water-based epoxy resin is epoxy resin W52, and the curing agent is curing agent 593; and the preparation method of the curing solution is as follows: the water-based epoxy resin and the curing agent are weighed according to the required ratio and poured into a stirring cup, and stirred for 80-120 seconds to obtain a curing solution; by limiting the composition of the curing solution and limiting the model of the raw materials, the prepared curing solution does not require heating and curing, and has good flowability and few bubbles.

[0041] The present application limits the specific operation of the pretreatment method and cooperates with the fixing mechanism 1 to achieve the fixation of small-sized ceramic capacitors, and further improves the structure of the blanking mechanism 2 to squeeze out the test block after the ceramic capacitor is solidified in the fixed tube body 11. Without destroying the structure of the fixed tube body 11, the test block after the ceramic capacitor is solidified can be taken out for destructive physical analysis. The overall operation is simple, effectively reducing manpower and material resources, improving work efficiency, and all parts of the mechanism can be recycled to reduce waste of resources.

[0042] The above description is merely a preferred embodiment of the present invention and therefore cannot be used to limit the scope of the present invention. In other words, equivalent changes and modifications made according to the scope of the present invention and the contents of the specification should still fall within the scope of the present invention.

Claims

1. A pretreatment method for destructive physical analysis of ceramic capacitors, characterized by: First, the ceramic capacitor is adhered to the fixing mechanism and filled with a curing solution. Then, the ceramic capacitor cured with the curing solution is separated from the fixing mechanism by a feeding mechanism for destructive physical analysis. The fixing mechanism includes a fixing tube, a fixing hole formed in the fixing tube for fixing the ceramic capacitor and filling the resin, and a sealing member detachable from the bottom of the fixing tube; The blanking mechanism includes a base, a mounting hole provided on the machine base for mounting a fixed tube body, a blanking rod movable up and down relative to the mounting hole, and a moving assembly provided on the machine base for driving the blanking rod to move downward; The pretreatment method specifically includes the following steps: Step 1: adhere the ceramic capacitor to the inner wall of the fixing hole with double-sided tape, and then seal the bottom of the fixing tube with a sealant; Step 2: Fill the fixing hole with a curing solution so that the curing solution submerges the ceramic capacitor and then places the solution into a vacuum pressure chamber for defoaming. The curing solution is a mixture of a water-based epoxy resin and a curing agent in a volume ratio of 6.5-7.5:1.5-2. Step 3: After the curing solution and the ceramic capacitor are cured to form a test block, the seal is removed, the fixed tube is placed in the mounting hole, and then the moving assembly is controlled to drive the feed rod downward so that its lower end enters the fixing hole and squeezes the test block downward until it is released from the fixing tube; Step 4: Remove the fixed tube body and take the test block out of the mounting hole, place it in the corresponding test device, and conduct destructive physical analysis.

2. The pretreatment method for destructive physical analysis of ceramic capacitors according to claim 1, characterized in that: The waterborne epoxy resin is waterborne epoxy resin W52, and the curing agent is curing agent 593.

3. The pretreatment method for destructive physical analysis of ceramic capacitors according to claim 1, characterized in that: The sealing member comprises a sealing plate and an inserting block which is arranged on the sealing plate and can be embedded in the fixing hole. The diameter of the sealing plate is larger than the diameter of the fixing hole.

4. The pretreatment method for destructive physical analysis of ceramic capacitors according to claim 3, characterized in that: The fixed tube body, the sealing plate and the inserting block are all made of polytetrafluoroethylene.

5. The pretreatment method for destructive physical analysis of ceramic capacitors according to claim 1, characterized in that: The preparation method of the curing solution is as follows: weigh the water-based epoxy resin and the curing agent according to the required ratio, pour them into a stirring cup, and stir for 80-120 seconds to obtain the curing solution.

6. The pretreatment method for destructive physical analysis of ceramic capacitors according to claim 1, characterized in that: The blanking mechanism also includes a mounting seat arranged on the machine base for mounting a blanking rod, the mounting seat includes a connecting part connected to the base, a positioning part connected to the connecting part and located above the mounting hole, and a movable cavity arranged in the positioning part relative to the mounting hole for the blanking rod to move up and down.

7. The pretreatment method for destructive physical analysis of ceramic capacitors according to claim 1, characterized in that: The moving assembly includes a positioning rod arranged on the base and extending upward, a rotating pressure rod rotatably arranged on the upper end of the positioning rod and capable of pressing the blanking rod downward, and a connecting piece arranged between the positioning rod and the rotating pressure rod.

8. The pretreatment method for destructive physical analysis of ceramic capacitors according to claim 7, characterized in that: The connecting member includes a first connecting hole arranged at the upper end of the positioning rod, a second connecting hole arranged on the rotating pressure rod opposite to the first connecting hole, a connecting bolt passing through the first connecting hole and the second connecting hole, and a butterfly nut matched with the connecting bolt.

9. The pretreatment method for destructive physical analysis of ceramic capacitors according to claim 1, characterized in that: The blanking rod comprises a blanking rod body, a pressure-bearing portion arranged at the top of the blanking rod body, and an extrusion portion arranged at the bottom of the blanking rod body. The diameter of the extrusion portion is smaller than the diameter of the fixing hole.

10. The pretreatment method for destructive physical analysis of ceramic capacitors according to claim 1, characterized in that: The base includes a base body, a padding block detachably arranged on the base body, and a limiting plate arranged on the base body for limiting the installation position of the padding block. A clearance hole opposite to the installation hole is formed on the padding block, and the shape of the limiting plate is consistent with the shape of the padding block.

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