A brightener, its preparation method and application

By preparing a novel brightener, utilizing strongly polar functional groups and functional groups that capture cuprous ions, the problem of insufficient deep plating capability in existing electroplating products is solved, achieving a highly efficient electroplating effect.

CN117964576BActive Publication Date: 2026-06-26上海天承化学有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
上海天承化学有限公司
Filing Date
2024-02-01
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing technologies have poor deep plating capabilities with acidic copper plating brighteners, making it difficult to achieve high-efficiency brighteners for electroplated products.

Method used

A novel brightener with a specific structure containing highly polar functional groups and functional groups for capturing cuprous ions is used. An oxime precursor is generated by reacting an aldehyde compound with hydroxylamine, and then reacted with N-bromosuccinimide and sodium N,N-dimethyl-dithiocarbamate propanesulfonate to form a brightener with leveling properties.

Benefits of technology

It improves the deep plating capability of acid copper electroplating solution, which can reach 79-85%, thus improving the quality of electroplated products.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a brightener, a preparation method and application thereof. The brightener has a structure as shown in formula 1, wherein R is any one of CH3-(CH2) x -, Ph-(CH2) y - or an azacyclic group, x is 2-5, and y is 0-4. The brightener is connected with a functional group having strong polarity, has good inhibition effect on copper, and has a capturing cuprous ion at the other end of the structure, accelerates copper deposition, has certain leveling performance, can form leveling effect on the surface copper high potential, forms acceleration effect on the low point position in the hole, and can effectively improve the deep plating capacity of the acid copper plating solution, and the deep plating capacity can reach 79-85%.
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Description

Technical Field

[0001] This invention belongs to the field of electroplating solution technology, specifically relating to a brightener, its preparation method, and its application. Background Technology

[0002] With the rapid development of the information industry, printed circuit boards (PCBs) have become an indispensable and crucial support. PCBs are now used in industries such as chips, computers, mobile communications, weaponry, and aerospace. In multilayer circuit boards, metallized through-holes enable conductivity between different layers, allowing signals to communicate with each other. Acid-plated copper is one of the important methods for achieving through-hole metallization.

[0003] In the pickling and copper plating process, adding suitable acidic copper plating additives is key to obtaining a bright and smooth copper surface. Currently, the main traditional acidic copper plating brighteners are sodium polydithiopropane sulfonate (SPS), sodium 3-mercaptopropane sulfonate (MPS), sodium N,N-dimethylthiopropane sulfonate (DPS), and sodium thiazolinyl dithiopropane sulfonate (ZPS). CN102766890A discloses an acidic copper brightener, the raw materials of which are distilled water, copper plating brightener, sodium polydithiopropane sulfonate, and polyethylene glycol. The copper plating brightener is 2-thiobenzimidazole and thiourea. The weight ratio of distilled water, thiourea, 2-thiobenzimidazole, sodium polydithiopropane sulfonate, and polyethylene glycol is 20000:3.2:4.8:43:15. Adding the acidic copper brightener to the copper plating bath effectively improves the brightness of the electroplated product and enhances the product quality. However, existing leveling agents have poor deep plating capabilities.

[0004] Therefore, developing a glossing agent with leveling capabilities is an urgent problem to be solved in this field. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide a brightener, its preparation method and application, wherein the brightener has certain leveling properties and can effectively improve the deep plating capability of acid copper electroplating solution.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] In a first aspect, the present invention provides a brightening agent having a structure as shown in Formula 1:

[0008]

[0009] Where R stands for CH3-(CH2). x -、Ph-(CH2) y- or any of the nitrogen heterocyclic groups, x is 2-5 (2, 3, 4, 5), y is 0-4 (0, 1, 2, 3, 4); Ph represents phenyl.

[0010] Preferably, R is CH3-CH2-CH2-, CH3-CH2-CH2-CH2-, CH3-CH2-CH2-CH2-CH2-, CH3-CH2-CH2-CH2-CH2-, Ph-, Ph-CH2-, Ph-CH2-CH2-, Ph-CH2-CH2-CH2-, Ph-CH2-CH2-CH2-, or Ph-CH2-CH2-CH2-CH2-.

[0011] Any one of them.

[0012] Preferably, the brightening agent has the structure shown in Formula 2-3:

[0013]

[0014] In this invention, the brightener, by incorporating highly polar functional groups, exhibits excellent copper-suppressing properties. Simultaneously, the other end of the structure captures cuprous ions, accelerating copper deposition. Depending on the application scenario, different functional groups will compete, thereby improving the depth of plating.

[0015] In a second aspect, the present invention provides a method for preparing a brightening agent as described in the first aspect, the method comprising:

[0016] (1) Aldehyde compounds When mixed with hydroxylamine, the reaction proceeds to obtain the oxime precursor.

[0017] (2) Take the oxime precursor obtained in step (1) The mixture was mixed with N-bromosuccinimide and reacted to obtain a polymer.

[0018] (3) The polymer obtained in step (2) The brightener is obtained by mixing it with sodium N,N-dimethyl-dithiocarbamate and reacting it.

[0019] Where R stands for CH3-(CH2). x -、Ph-(CH2) y - or any one of the nitrogen heterocyclic groups, where x is 2-5 and y is 0-4.

[0020] Preferably, the aldehyde compound in step (1) The molar ratio of hydroxylamine to hydroxylamine is 1:(0.8-2), for example, it can be 1:0.8, 1:1, 1:1.2, 1:1.4, 1:1.6, 1:1.8, 1:2, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0021] Preferably, the reaction in step (1) is carried out in the presence of a catalyst and a solvent.

[0022] Preferably, the catalyst comprises an aqueous solution of sodium hydroxide.

[0023] Preferably, the concentration of sodium hydroxide in the aqueous solution is 45-55%, for example, it can be 45%, 47%, 49%, 50%, 52%, 54%, 55%, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0024] Preferably, the solvent includes ethanol and / or water.

[0025] Preferably, the reaction time in step (1) is 10-30h, for example, it can be 10h, 15h, 20h, 21h, 22h, 23h, 24h, 25h, 26h, 30h, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0026] Preferably, the reaction temperature in step (1) is 20-30°C, for example, it can be 20°C, 22°C, 24°C, 26°C, 28°C, 30°C, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0027] Preferably, the reaction in step (1) is followed by distillation.

[0028] Preferably, the distillation temperature is 40-80℃, for example, it can be 40℃, 50℃, 60℃, 70℃, 80℃, and specific values ​​between the above points. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0029] Preferably, the oxime precursor described in step (2) The molar ratio of N-bromosuccinimide to N-bromosuccinimide is 1:(0.8-2), for example, it can be 1:0.8, 1:1, 1:1.2, 1:1.4, 1:1.6, 1:1.8, 1:2, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0030] Preferably, the reaction in step (2) is carried out in the presence of a solvent.

[0031] Preferably, the solvent includes diethyl ether and / or N,N-dimethylformamide.

[0032] Preferably, the reaction time in step (2) is 10-30h, for example, it can be 10h, 15h, 20h, 21h, 22h, 23h, 24h, 25h, 26h, 30h, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0033] Preferably, the reaction temperature in step (2) is 20-30°C, for example, it can be 20°C, 22°C, 24°C, 26°C, 28°C, 30°C, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0034] The polymer in step (3) The molar ratio of N,N-dimethyl-dithiocarbamate to sodium propanesulfonate is 1:(0.8-2), for example, it can be 1:0.8, 1:1, 1:1.2, 1:1.4, 1:1.6, 1:1.8, 1:2, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0035] Preferably, the reaction in step (3) is carried out in the presence of a solvent.

[0036] Preferably, the solvent comprises triethylamine.

[0037] Preferably, the reaction time in step (3) is 5-100 min, for example, it can be 5 min, 6 min, 7 min, 8 min, 9 min, 10 min, 20 min, 30 min, 50 min, 80 min, 90 min, 100 min, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0038] Preferably, the reaction temperature in step (3) is 30-100℃, for example, it can be 30℃, 40℃, 50℃, 60℃, 80℃, 90℃, 100℃, and specific values ​​between the above points. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0039] Preferably, the reaction in step (3) is followed by distillation.

[0040] Preferably, the distillation temperature is 30-100℃, for example, it can be 30℃, 40℃, 50℃, 60℃, 80℃, 90℃, 100℃, and specific values ​​between the above points. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0041] The preparation method of the brightener includes the following steps:

[0042] S1. First, aldehyde compound a and hydroxylamine are added to ethanol and an aqueous solution. Using NaOH as a catalyst, the aldehyde and hydroxylamine are coupled to form oxime precursor b. The product is then separated by distillation. The structural formula of R is -(CH2). x -CH3, or -(CH2) x -Ph, where Ph is a benzene ring, and x = 0-4.

[0043]

[0044] S2. The distilled product is then added to a solution of diethyl ether and N,N-dimethylformamide, and intermediate b reacts with N-bromosuccinimide (NBS) to generate polymer c.

[0045]

[0046] S3. Dissolve the polymer c obtained in step S2 in triethylamine, then add a certain amount of DPS and react with polymer c, and then remove the solvent by distillation to obtain brightener d.

[0047]

[0048] Thirdly, the present invention provides the application of the brightener as described in the first aspect in an electroplating solution, a printed electroplating plate, or a carrier plate.

[0049] Fourthly, the present invention provides an electroplating solution, wherein the components of the electroplating solution, by weight, include: 0.0001-0.1 g / L of the brightener as described in the first aspect, 50-280 g / L of copper sulfate pentahydrate, 30-260 g / L of sulfuric acid and 30-90 g / L of chloride ions.

[0050] The brightener is present in a weight ratio of 0.0001-0.1 g / L, for example, 0.0001 g / L, 0.0005 g / L, 0.05 g / L, 0.1 g / L, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0051] The weight percentage of the copper sulfate pentahydrate is 50-280 g / L, for example, it can be 50 g / L, 60 g / L, 80 g / L, 100 g / L, 120 g / L, 150 g / L, 180 g / L, 200 g / L, 250 g / L, 280 g / L, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0052] The sulfuric acid has a weight ratio of 30-260 g / L, for example, it can be 30 g / L, 50 g / L, 80 g / L, 100 g / L, 120 g / L, 150 g / L, 180 g / L, 200 g / L, 220 g / L, 250 g / L, 260 g / L, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0053] The chloride ion concentration is 30-90 g / L, for example, it can be 30 g / L, 40 g / L, 50 g / L, 60 g / L, 70 g / L, 80 g / L, 90 g / L, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0054] Preferably, the electroplating solution further comprises, by weight, 0.0001-0.1 g / L of leveling agent and 0.0001-0.1 g / L of carrier agent.

[0055] The leveling agent has a weight ratio of 0.0001-0.1 g / L, for example, it can be 0.0001 g / L, 0.0005 g / L, 0.05 g / L, 0.1 g / L, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0056] The carrier has a weight fraction of 0.0001-0.1 g / L, for example, it can be 0.0001 g / L, 0.0005 g / L, 0.05 g / L, 0.1 g / L, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0057] Preferably, the carrier comprises polyethylene glycol and / or polyoxyethylene ether.

[0058] Preferably, the leveling agent comprises any one or a combination of at least two of poly(2-mercaptobenzimidazole), basic yellow, Janus green, or methyl orange.

[0059] The method for preparing the electroplating solution includes:

[0060] The electroplating solution is obtained by mixing brightener, copper sulfate pentahydrate, sulfuric acid, and chloride ions.

[0061] Compared with the prior art, the present invention has the following beneficial effects:

[0062] This invention provides a brightener with highly polar functional groups attached, which effectively inhibits copper deposition. Simultaneously, the other end of the structure captures cuprous ions, accelerating copper deposition. The brightener also possesses leveling properties, creating a leveling effect on high-potential copper surfaces and accelerating the deposition of low-potential areas within holes. This effectively enhances the deep plating capability of acid copper plating solutions, achieving a deep plating capability of 79-85%. Attached Figure Description

[0063] Figure 1 This is a diagram showing the electroplating effect of a through-hole in Application Example 1 of the present invention;

[0064] Figure 2 This is a diagram showing the electroplating effect of through-holes in Application Example 2 of the present invention;

[0065] Figure 3 This is a diagram showing the electroplating effect of through-holes in Application Example 3 of the present invention;

[0066] Figure 4 This is a diagram showing the electroplating effect of through-holes in Application Example 4 of the present invention;

[0067] Figure 5 This is a diagram showing the electroplating effect of through-holes in Comparative Application Example 1 of the present invention;

[0068] Figure 6 This is a diagram showing the electroplating effect of through-holes in Comparative Application Example 2 of the present invention;

[0069] Figure 7 This is a diagram showing the electroplating effect of through-holes in Comparative Application Example 3 of the present invention;

[0070] Figure 8 This is a schematic diagram of the method for calculating the deep plating capability in this invention. Detailed Implementation

[0071] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0072] Example 1

[0073] This embodiment provides a brightening agent, which has the following structure:

[0074]

[0075] This embodiment also provides a method for preparing the brightening agent, the method comprising:

[0076] S1. Take 100 mmol Dissolve the acetaldehyde oxime in a 100 mL mixture of water and ethanol (1:1 volume ratio), then slowly add 200 mmol of hydroxylamine to the solution. After stirring at room temperature for 24 h, react the acetaldehyde oxime with ethyl acetate. It is obtained by extraction and removal of solvent by distillation.

[0077] S2: 10 mmol of the oxime precursor obtained in S1 was added to a solution of diethyl ether and N,N-dimethylformamide. Then, 200 mmol of N-bromosuccinimide (NBS) was added to the solution. After reacting at room temperature for 24 h, the solvent was removed by distillation to obtain the liquid product.

[0078] S3 dissolves 50 mmol of the product from S2 in triethylamine, then adds 50 mmol of sodium N,N-dimethyl-dithiocarbamate propanesulfonate (DPS) and reacts for 10 min. The solvent is then removed by distillation to obtain the brightener.

[0079] Example 2

[0080] This embodiment provides a brightening agent, which has the following structure:

[0081]

[0082] This embodiment also provides a method for preparing the brightening agent, the method comprising:

[0083] S1. Take 100 mmol Dissolve the acetaldehyde oxime in a 100 mL mixture of water and ethanol (1:1 volume ratio), then slowly add 200 mmol of hydroxylamine to the solution. After stirring at room temperature for 24 h, react the acetaldehyde oxime with ethyl acetate. It is obtained by extraction and removal of solvent by distillation.

[0084] S2 added 10 mmol of benzaldehyde oxime to a solution of diethyl ether and N,N-dimethylformamide, then added 200 mmol of N-bromosuccinimide (NBS) to the solution. After reacting at room temperature for 24 h, the solvent was removed by distillation to obtain the liquid product.

[0085] S3 dissolves 50 mmol of the product from S2 in triethylamine, then adds 50 mmol of DPS and reacts for 10 min. The solvent is then removed by distillation to obtain the brightener.

[0086] Example 3

[0087] This embodiment provides a brightening agent, which has the following structure:

[0088]

[0089] This embodiment also provides a method for preparing the brightening agent, the method comprising:

[0090] S1 will 100 mmol Dissolve the acetaldehyde oxime in a 100 mL mixture of water and ethanol (1:1 volume ratio), then slowly add 200 mmol of hydroxylamine to the solution. After stirring at room temperature for 24 h, react the acetaldehyde oxime with ethyl acetate. It is obtained by extraction and removal of solvent by distillation.

[0091] S2: 100 mmol of the product from S1 was added to a solution of diethyl ether and N,N-dimethylformamide. Then, 200 mmol of N-bromosuccinimide (NBS) was added to the solution. After reacting at room temperature for 24 h, the solvent was removed by distillation to obtain the liquid product.

[0092] S3 dissolves 50 mmol of the product from S2 in triethylamine, then adds 50 mmol of DPS and reacts for 10 min. The solvent is then removed by distillation to obtain the brightener.

[0093] Example 4

[0094] This embodiment provides a brightening agent, which has the following structure:

[0095]

[0096] This embodiment also provides a method for preparing the brightening agent, the method comprising:

[0097] S1 was taken at 100 mmol. Dissolve it in a 100 mL mixture of water and ethanol (water to ethanol volume ratio 1:1), then slowly add 200 mmol of hydroxylamine to the solution. After stirring at room temperature for 24 h, use ethyl acetate to separate the reaction product. It is obtained by extraction and removal of solvent by distillation.

[0098] S2: 100 mmol of the product obtained in S1 was added to a solution of diethyl ether and N,N-dimethylformamide. Then, 200 mmol of N-bromosuccinimide (NBS) was added to the solution. After reacting at room temperature for 24 h, the solvent was removed by distillation to obtain the liquid product.

[0099] S3 dissolves 50 mmol of the product from S2 in triethylamine, then adds 50 mmol of DPS and reacts for 10 min. The solvent is then removed by distillation to obtain the brightener.

[0100] Application Example 1

[0101] This application example provides an electroplating solution and its preparation method. The components of the electroplating solution, by weight, include: 0.0001 g / L of brightener obtained in Example 1, 50 g / L of copper sulfate, 30 g / L of sulfuric acid, 30 g / L of sodium chloride, 0.0001 g / L of leveling agent, and 0.0001 g / L of carrier agent.

[0102] The method for preparing the electroplating solution includes:

[0103] A mixture of brightener, copper sulfate, sulfuric acid, sodium chloride, leveling agent, and carrier was used for electroplating. The electroplating was performed at a current density of 2 amperes per square decimeter (ASD), a time of 60 minutes, and a temperature of 24 degrees Celsius.

[0104] Test board: 2mm thick, 200um aperture, through-hole electroplating effect diagram as shown. Figure 1 As shown.

[0105] Application Example 2

[0106] This application example provides an electroplating solution and its preparation method, which differs from Application Example 1 only in that the brightener is provided in Example 2. The electroplating effect of through-holes is shown in the figure below. Figure 2 As shown.

[0107] Application Example 3

[0108] This application example provides an electroplating solution and its preparation method, which differs from Application Example 1 only in that the brightener is provided in Example 3. The electroplating effect of through-holes is shown in the figure below. Figure 3 As shown.

[0109] Application Example 4

[0110] This application example provides an electroplating solution and its preparation method, which differs from Application Example 1 only in that the brightener is provided in Example 4. The electroplating effect of through-holes is shown in the figure below. Figure 4 As shown.

[0111] Comparative Application Example 1

[0112] This comparative application example provides an electroplating solution comprising: a mixed solution of copper sulfate, sulfuric acid, and sodium chloride as the copper plating VMS, including a copper sulfate concentration of 150 g / L, a pure sulfuric acid concentration of 50 g / L, and a chloride ion concentration of 60 ppm. The brightener used is sodium polydithiopropane sulfonate at 2 ppm, the carrier is polyethylene glycol PEG8000 at 400 ppm, and the leveling agent is poly(2-mercaptobenzimidazole) at 10 ppm. The electroplating effect of through-holes is shown in the figure below. Figure 5 As shown.

[0113] Comparative Application Example 2

[0114] This comparative application example provides an electroplating solution that differs from Comparative Application Example 1 only in that the brightener is sodium 3-mercapto-1-propanesulfonate. The effect diagram of blind holes and through holes is shown below. Figure 6 As shown.

[0115] Comparative Application Example 3

[0116] This comparative application example provides an electroplating solution that differs from Comparative Application Example 1 only in that the brightener is sodium N,N-dimethyl-dithiocarbonylpropanesulfonate. The electroplating effect of through-holes is shown in the figure below. Figure 7 As shown.

[0117] For use cases 1-4, compare the performance of the electroplating solution provided in application example 1-3 with that of the use case 1-4. The specific method is as follows:

[0118] Deep plating capability: Using 2ASD, electroplating for 60 minutes at 24℃, the deep plating capability (TP value) of the through-hole was measured using a metallographic microscope. The calculation method for TP value is as follows: Figure 8 As shown, Min represents the minimum value.

[0119] Performance tests were conducted on the electroplating solutions provided in Application Example 1-3, corresponding to Use Case 1-4. The test results are shown in Table 1.

[0120] Table 1

[0121] Deep plating capability Application Example 1 85% Application Example 2 79% Application Example 3 83% Application Example 4 79% Comparative Application Example 1 63% Comparative Application Example 2 61% Comparative Application Example 3 60%

[0122] As shown in Table 1, the synthesized brightener with leveling ability can change the resistance and current distribution inside the hole, increase the copper thickness of the electroplated copper hole, and improve the deep plating capability.

[0123] The applicant declares that the present invention is illustrated by the above embodiments to demonstrate a brightening agent, its preparation method, and its application. However, the present invention is not limited to the above embodiments, that is, it does not mean that the present invention must rely on the above embodiments to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A brightening agent, characterized in that, The brightener has the structure shown in Formula 1: Formula 1 Wherein, R is CH3-CH2-CH2-CH2-CH2-CH2-, Ph-CH2-CH2-CH2-CH2-, or Any one of them.

2. The brightening agent according to claim 1, characterized in that, The brightener has the structure shown in Formula 2-3: 。 3. A method for preparing the brightening agent as described in claim 1 or 2, characterized in that, The preparation method includes: (1) Aldehyde compounds When mixed with hydroxylamine (NH₂OH), the reaction proceeds to obtain the oxime precursor. ; (2) Take the oxime precursor obtained in step (1) When mixed with N-bromosuccinimide, the reaction proceeds to obtain... ; (3) The result obtained in step (2) The brightener is obtained by mixing it with sodium N,N-dimethyl-dithiocarbamate and reacting it. Wherein, R is CH3-CH2-CH2-CH2-CH2-CH2-, Ph-CH2-CH2-CH2-CH2-, or Any one of them.

4. The preparation method according to claim 3, characterized in that, The aldehyde compound in step (1) The molar ratio of hydroxylamine to hydroxylamine is 1:(0.8-2).

5. The preparation method according to claim 3, characterized in that, The reaction described in step (1) is carried out in the presence of a catalyst and a solvent.

6. The preparation method according to claim 5, characterized in that, The catalyst comprises an aqueous solution of sodium hydroxide.

7. The preparation method according to claim 6, characterized in that, The concentration of sodium hydroxide in the aqueous solution is 45-55%.

8. The preparation method according to claim 5, characterized in that, The solvent includes ethanol and / or water.

9. The preparation method according to claim 3, characterized in that, The reaction time in step (1) is 10-30 h.

10. The preparation method according to claim 3, characterized in that, The reaction temperature in step (1) is 20-30℃.

11. The preparation method according to claim 3, characterized in that, The reaction described in step (1) is followed by distillation.

12. The preparation method according to claim 11, characterized in that, The distillation temperature is 40-80 ℃.

13. The preparation method according to claim 3, characterized in that, The oxime precursor described in step (2) The molar ratio with N-bromosuccinimide is 1:(0.8-2).

14. The preparation method according to claim 3, characterized in that, The reaction described in step (2) is carried out in the presence of a solvent.

15. The preparation method according to claim 14, characterized in that, The solvent includes diethyl ether and / or N,N-dimethylformamide.

16. The preparation method according to claim 3, characterized in that, The reaction time in step (2) is 10-30 h.

17. The preparation method according to claim 3, characterized in that, The reaction temperature in step (2) is 20-30℃.

18. The preparation method according to claim 3, characterized in that, Step (3) The molar ratio of sodium N,N-dimethyl-dithiocarbamate to sodium propanesulfonate is 1:(0.8-2).

19. The preparation method according to claim 3, characterized in that, The reaction described in step (3) is carried out in the presence of a solvent.

20. The preparation method according to claim 19, characterized in that, The solvent includes triethylamine.

21. The preparation method according to claim 3, characterized in that, The reaction time in step (3) is 5-100 min.

22. The preparation method according to claim 3, characterized in that, The reaction temperature in step (3) is 30-100℃.

23. The preparation method according to claim 3, characterized in that, The reaction described in step (3) also includes distillation.

24. The preparation method according to claim 23, characterized in that, The distillation temperature is 30-100 ℃.

25. The use of a brightener as described in claim 1 or 2 in an electroplating solution, a printed electroplating plate, or a carrier plate.

26. An electroplating solution, characterized in that, The electroplating solution comprises: 0.0001-0.1 g / L of the brightener as described in claim 1 or 2, 50-280 g / L of copper sulfate pentahydrate, 30-260 g / L of sulfuric acid, and 30-90 g / L of sodium chloride.

27. The electroplating solution according to claim 26, characterized in that, The electroplating solution also includes: 0.0001-0.1 g / L leveling agent and 0.0001-0.1 g / L carrier agent.

28. The electroplating solution according to claim 27, characterized in that, The carrier includes polyethylene glycol.

29. The electroplating solution according to claim 27, characterized in that, The leveling agent includes any one or a combination of at least two of 2-mercaptobenzimidazole, basic yellow, Janus green, or methyl orange.