Display panel and display device

Abstract

The application discloses a display panel and a display device. The display panel comprises a display area and a non-display area arranged at the periphery of the display area. The display panel further comprises a substrate, the substrate comprising a first surface and a second surface arranged oppositely; a cover plate, the cover plate comprising a third surface and a fourth surface arranged oppositely; and an encapsulation layer, the encapsulation layer being arranged between the substrate and the cover plate, and located at the non-display area and surrounding the display area. A microstructure is arranged on the surface of the non-display area of the substrate or the cover plate, and the microstructure is used for guiding light to the encapsulation layer. The microstructure helps to improve the encapsulation strength of the encapsulation layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0002] In recent years, with the development and popularity of display technology, display panels have been applied to various electronic devices, such as mobile phones, tablet computers or other portable electronic devices. However, the market requirements for display panels are also getting higher and higher, among which, the packaging technology of the display panel is particularly critical. The packaging strength of the current packaging layer cannot meet the new market demand. SUMMARY

[0003] The present application provides a display panel and a display device, which can help to improve the packaging strength of the packaging layer.

[0004] The present application provides a display panel, which comprises a display area and a non-display area arranged at the periphery of the display area, and the display panel comprises: a substrate, the substrate comprises a first surface and a second surface, the first surface and the second surface are arranged oppositely; a cover plate, the cover plate comprises a third surface and a fourth surface, the third surface and the fourth surface are arranged oppositely, and the cover plate is arranged opposite to the substrate; a packaging layer, the packaging layer is arranged between the substrate and the cover plate, and is located in the non-display area and surrounds the display area; wherein a microstructure is arranged on the surface of the non-display area of the substrate or the cover plate, and the microstructure is used for guiding light to the packaging layer.

[0005] In an embodiment, the microstructure comprises a first microstructure, and the first microstructure is arranged on the first surface.

[0006] Preferably, the first microstructure is arranged on the first surface and the second surface.

[0007] Preferably, the material of the packaging layer comprises Frit material.

[0008] In an embodiment, the first microstructure comprises at least one first groove formed on the first surface.

[0009] Preferably, the cross section of the first groove parallel to the substrate is circular.

[0010] Preferably, the number of the first grooves is plural.

[0011] Preferably, the plural first grooves are arranged in an array on the first surface.

[0012] Preferably, the plural first grooves are uniformly distributed on the first surface.

[0013] In an embodiment, the plural first grooves are arranged around the packaging layer.

[0014] Preferably, the encapsulation layer comprises straight encapsulation portions and corner encapsulation portions, and the first grooves adjacent to the corner encapsulation portions have a higher arrangement density than the first grooves adjacent to the straight encapsulation portions.

[0015] In an embodiment, the groove walls of the first grooves are provided with a reflective coating.

[0016] Preferably, the first grooves are arc-shaped grooves.

[0017] In an embodiment, the display panel further comprises: the microstructure comprises a second microstructure, the second microstructure being disposed on the fourth surface.

[0018] Preferably, the second microstructure is identical to the first microstructure.

[0019] Preferably, the second microstructure comprises at least one second groove formed on the fourth surface.

[0020] Preferably, the second groove has a circular cross-section parallel to the substrate.

[0021] Preferably, the number of the second grooves is plural.

[0022] Preferably, the plural second grooves are arranged in an array on the fourth surface.

[0023] Preferably, the plural second grooves are uniformly distributed on the fourth surface.

[0024] Preferably, the material of the cover plate comprises glass.

[0025] In an embodiment, the microstructure comprises a third microstructure, the third microstructure being disposed on the third surface.

[0026] Preferably, the third microstructure is identical to the first microstructure.

[0027] Preferably, the third microstructure comprises at least one third groove formed on the third surface.

[0028] Preferably, the third groove has a circular cross-section parallel to the substrate.

[0029] Preferably, the number of the third grooves is plural.

[0030] Preferably, the plural third grooves are arranged in an array on the third surface.

[0031] Preferably, the plural third grooves are uniformly distributed on the third surface.

[0032] In an embodiment, a normal projection of the second microstructure on the substrate covers a normal projection of the first microstructure on the substrate; and / or, a normal projection of the third microstructure on the substrate covers a normal projection of the first microstructure on the substrate.

[0033] In an embodiment, a farthest distance between a positive projection of the microstructure on the substrate and a positive projection of the encapsulation layer on the substrate is less than or equal to a distance threshold.

[0034] Preferably, the distance threshold ranges from 500 μm to 1000 μm.

[0035] Preferably, the material of the substrate comprises glass.

[0036] The present application also provides a display device comprising the display panel of any of the above embodiments.

[0037] The beneficial effect is that the present application is provided with the microstructure on the surface of the non-display area of the substrate or the cover plate, and the light of the laser on both sides of the encapsulation layer is guided into the encapsulation layer by refraction or reflection through the microstructure, which can improve the sintering effect of the laser on the encapsulation layer, improve the utilization rate of the laser, and further improve the packaging strength of the encapsulation layer. BRIEF DESCRIPTION OF DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0039] Figure 1 is a schematic diagram of a laser sintering display panel of the prior art;

[0040] Figure 2 is a top view schematic diagram of Figure 1 ;

[0041] Figure 3 is a structural schematic diagram of an embodiment of the display panel of the present application;

[0042] Figure 4 is a top view structural schematic diagram of another embodiment of the display panel of the present application;

[0043] Figure 5 is a top view structural schematic diagram of still another embodiment of the display panel of the present application;

[0044] Figure 6 is a structural schematic diagram of an embodiment of the display device. DETAILED DESCRIPTION

[0045] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts are within the scope of the present application.

[0046] It should be noted that the terms "first", "second" in the present application are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0047] In the prior art, referring to Figure 1 and Figure 2 , the display panel includes a substrate 110, an encapsulation layer 120, a light emitting unit 130 and a cover plate 140, the encapsulation layer 120 is located between the substrate 110 and the cover plate 140 and in the non-display area NA, the light emitting unit 130 is located between the substrate 110 and the cover plate 140 and in the display area AA, and in the preparation of the encapsulation layer 120, the encapsulation layer 120 is sintered by irradiation from the cover plate 140 side to the encapsulation layer 120 by a laser L, but the diameter R of the light spot LB of the laser L is greater than the width of the encapsulation layer d, only the middle region of the light spot LB hits the encapsulation layer 120, and the laser on both sides directly passes through the side of the encapsulation layer 120 and transmits the substrate 110.

[0048] Please refer to Figure 3 , the present application provides a display panel 10, the display panel 10 includes a display area AA and a non-display area NA arranged at the periphery of the display area AA, and the display panel further includes a substrate 110, a cover plate 140 and an encapsulation layer 120. The substrate 110 includes a first surface A and a second surface B, the first surface A and the second surface B are oppositely arranged; the cover plate includes a third surface C and a fourth surface D, the cover plate 120 and the substrate 110 are oppositely arranged; the encapsulation layer 120 is arranged between the substrate 110 and the cover plate 120, and is located in the non-display area NA and surrounds the display area AA; wherein a microstructure 100 is arranged on the surface of the non-display area NA of the substrate 110 or the cover plate 120, and the microstructure 100 is used for guiding light to the encapsulation layer 120.

[0049] Specifically, the display panel 10 comprises a display area AA and a non-display area NA, a light emitting unit 130 is arranged between the first surface A of the substrate 110 and the third surface C of the cover plate 140 in the display area AA, and an encapsulation layer 120 is arranged between the first surface A of the substrate 110 and the third surface C of the cover plate 140 in the non-display area NA surrounding the display area AA, the encapsulation layer 120 is arranged in the non-display area NA for isolation and protection of the light emitting unit 130 in the display area AA, to avoid external water vapor invading the light emitting unit 130. The surface of the substrate 110 and the cover plate 120 in the non-display area NA is provided with a microstructure 100, the microstructure 100 is used for adjusting the light path of the laser, and the light of the laser beside the encapsulation layer 120 can be guided to the encapsulation layer 120 by reflection or refraction, which helps to improve the utilization rate of the laser, improve the sintering effect of the laser on the encapsulation layer 120, and further improve the packaging strength of the encapsulation layer 120.

[0050] In an embodiment, please refer to Figure 3 The microstructure 100 comprises a first microstructure 111, and the first microstructure 111 is arranged on the first surface A.

[0051] Specifically, the first microstructure 111 is arranged on the first surface A, and the light of the laser transmitted from the cover plate 140 is guided to the encapsulation layer 120 by the first microstructure 111 in a reflective manner, so as to improve the sintering effect of the laser on the encapsulation layer 120, and further improve the packaging strength of the encapsulation layer 120.

[0052] In an embodiment, the first microstructure 111 is arranged on the first surface A and the second surface B. By arranging the first microstructure 111 on both surfaces of the substrate, the utilization of the light of the laser on both sides of the encapsulation layer 120 can be further enhanced, and the sintering effect of the laser on the encapsulation layer 120 is further improved.

[0053] Of course, in some other embodiments, the first microstructure 111 can also be selected not to be arranged on the second surface B.

[0054] In an embodiment, the first microstructure 111 is arranged on the side of the encapsulation layer 120 away from the display area AA, which can reduce the influence of the light guide of the first microstructure 111 on the display area AA, and at the same time, when water vapor invades from the outside, the water vapor needs to pass through the encapsulation layer 120 to erode the light-emitting unit 130, and the sintering effect of the laser on the side of the encapsulation layer 120 away from the display area AA can be improved through the first microstructure 111, thereby improving the encapsulation strength of the side of the encapsulation layer 120 away from the display area AA. In an embodiment, the first microstructure 111 is further arranged on the side of the encapsulation layer 120 close to the display area AA, that is, the first microstructure 111 is arranged on the side of the encapsulation layer 120 away from the display area AA and on the side of the encapsulation layer 120 close to the display area AA. Specifically, since the spot diameter of the laser is larger than the width of the encapsulation layer 120, when the laser sintering the encapsulation layer 120, part of the laser will be transmitted from both sides of the encapsulation layer 120 in addition to sintering the encapsulation layer 120, so the first microstructure 111 can also be arranged on the side of the encapsulation layer 120 close to the display area AA, and the laser on the side close to the display area AA is also utilized, and the laser is guided to the encapsulation layer 120 through reflection, thereby improving the encapsulation strength.

[0055] Of course, in some other embodiments, the first microstructure 111 is not arranged on the side of the encapsulation layer 120 close to the display area AA, and the first microstructure 111 is only arranged on the side of the encapsulation layer 120 away from the display area AA, and the laser can be offset to the side away from the display area AA, reducing the irradiation of the laser on the region between the encapsulation layer 120 and the light-emitting unit 130, which can reduce the display frame.

[0056] In an embodiment, the material of the encapsulation layer 120 includes Frit (glass powder) material. It should be noted that the material of the encapsulation layer 120 is not limited in the present application, and in other embodiments, the material of the encapsulation layer 120 can also be other materials, which are not limited herein.

[0057] In an embodiment, referring to Figure 3 , the first microstructure 111 includes at least one first groove G1 formed on the first surface A.

[0058] Specifically, the inner concave surface of the first groove G1 can reflect and guide the light of the laser to the encapsulation layer 120, and the number of the first grooves G1 can be 1, 5, or 10, etc. The first grooves G1 can be formed by etching or cold carving, etc.

[0059] In an embodiment, the groove wall of the first groove G1 is provided with a reflective coating. The material of the reflective coating can be a metal material, and the reflective coating can enhance the reflection effect of the first groove G1 and reduce the light transmitted from the first groove G1.

[0060] In an embodiment, asFigure 3 As shown, the first groove G1 is an arc-shaped groove. Of course, the first groove G1 can also be a groove of other shapes, for example, the groove wall of the first groove G1 is a plane.

[0061] Of course, in some other embodiments, the first microstructure 111 can also be a convex microstructure formed on the first surface A.

[0062] In an embodiment, referring to Figure 4 , the cross section of the first groove G1 parallel to the substrate 110 is circular. The circular groove has a good light guiding effect and can improve the utilization rate of the laser.

[0063] Of course, in some other embodiments, the cross section of the first groove G1 parallel to the substrate 110 can also be of other shapes, for example, rectangular, triangular, trapezoidal, etc.

[0064] In an embodiment, referring to Figure 3 , the number of the first grooves G1 is multiple. The multiple first grooves G1 extend from the vicinity of the packaging layer 120 to the direction away from the packaging layer 120 within the coverage range of the laser spot. The more the number of the first grooves G1, the higher the utilization rate of the light. The number of the first grooves G1 can be 2, 4, or 10, etc., which is not limited in the present application.

[0065] In an embodiment, referring to Figure 4 , the multiple first grooves G1 are arranged in an array on the first surface A. The array-arranged first grooves G1 can make the adjustment of the laser light easier than the non-array-arranged first grooves G1.

[0066] In an embodiment, referring to Figure 4 , the multiple first grooves G1 are uniformly distributed on the first surface A. The uniformly distributed first grooves G1 can make the sintering effect of the laser on the packaging layer 120 the same, ensuring the overall uniformity of the packaging effect of the packaging layer 120.

[0067] Of course, in some other embodiments, the multiple first grooves G1 are randomly arranged on the first surface A. Compared with the above-mentioned array distribution and uniform distribution, the preparation of the randomly arranged first grooves G1 is simpler, and the packaging strength can also be improved.

[0068] In an embodiment, referring to Figure 5 , the multiple first grooves G1 are arranged around the packaging layer 120.

[0069] Specifically, the encapsulation layer 120 is arranged around the display area AA for sealing the entire display area AA, and the plurality of first grooves G1 are also arranged around the encapsulation layer 120 to ensure that the entire encapsulation layer 120 is subjected to the light guiding effect of the first microstructure 111, thereby improving the encapsulation strength of the entire encapsulation layer 120. It should be noted that Figure 5 The first grooves G1 are only shown in the non-display area NA on the side of the encapsulation layer 120 away from the display area AA, but the first grooves G1 can also be located in the non-display area NA between the encapsulation layer 120 and the display area AA, which is not limited in the present application.

[0070] Of course, in some other embodiments, the plurality of first grooves G1 can also be arranged only in part of the encapsulation layer 120, for example, to strengthen the encapsulation effect in the area where the encapsulation effect is weak.

[0071] In an embodiment, referring to Figure 5 The encapsulation layer 120 includes a straight encapsulation part 121 and a corner encapsulation part 122, and the arrangement density of the first grooves G1 adjacent to the corner encapsulation part 122 is greater than that of the first grooves G1 adjacent to the straight encapsulation part 121.

[0072] Specifically, the corner encapsulation part 122 is located in the transition area between two adjacent straight encapsulation parts 121, and since the straight encapsulation part 121 is linear, the corner encapsulation part 122 is arc-shaped. Compared with the straight encapsulation part 121, the corner encapsulation part 122 has a higher requirement for encapsulation strength, and therefore, arranging more first grooves G1 in the corner encapsulation part 122 can improve the encapsulation strength of the corner encapsulation part 122.

[0073] In an embodiment, referring to Figure 3 The maximum distance between the orthographic projection of the microstructure 100 on the substrate 110 and the orthographic projection of the encapsulation layer 120 on the substrate 110 is less than or equal to a distance threshold.

[0074] Specifically, the spot diameter of the laser is generally 0.8 mm, 1 mm, etc., and therefore, the maximum distance (i.e., W in the figure) between the microstructure 100 and the encapsulation layer 120 can exceed the area covered by the laser spot, so the distance threshold is related to the size of the spot of the laser used.

[0075] In an embodiment, the distance threshold is in the range of 500 μm to 1000 μm. The distance threshold can be 500 μm, 800 μm, or 1000 μm, etc., which can ensure that the current laser irradiation can meet the light adjustment needs of the microstructure 100.

[0076] In an embodiment, the material of the substrate 110 includes glass. Of course, the material of the substrate 110 can also be a flexible substrate, such as polyimide, etc.

[0077] In an embodiment, referring to Figure 3 The microstructure 100 comprises a second microstructure 141 disposed on the fourth surface D.

[0078] Specifically, the second microstructure 141 disposed on the fourth surface D can directly guide the light of the laser, and the second microstructure 141 can refract part of the light directly onto the packaging layer 120, or first refract the light onto the first microstructure 111 and then guide the light to the packaging layer 120 through the first microstructure 111. The second microstructure 141 can be disposed on the side of the packaging layer 120 close to the light-emitting unit 130, or on the side of the packaging layer 120 away from the light-emitting unit 130, or partially on the side of the packaging layer 120 close to the light-emitting unit 130 and partially on the side of the packaging layer 120 away from the light-emitting unit 130, which is not limited herein.

[0079] Of course, in some other embodiments, the second microstructure 141 can not be disposed.

[0080] In an embodiment, the second microstructure 141 is the same as the first microstructure 111, which can facilitate the preparation and improve the preparation efficiency. Of course, in other embodiments, the second microstructure 141 can be different from the first microstructure 111.

[0081] In an embodiment, referring to Figure 3 The second microstructure 141 comprises at least one second groove G2 formed on the fourth surface D.

[0082] Specifically, the concave surface of the second groove G2 can refract and guide the light of the laser to the packaging layer 120, and the number of the second groove G2 can be 1, 5, or 10, etc. The second groove G2 can be formed by etching or cold carving, etc.

[0083] In an embodiment, the second groove G2 is an arc-shaped groove. Of course, the second groove G2 can also be a groove with other shapes, for example, the groove wall of the second groove G2 is a plane.

[0084] Of course, in some other embodiments, the second microstructure 141 can also be a convex microstructure formed on the fourth surface D.

[0085] In an embodiment, the cross section of the second groove G2 parallel to the substrate 110 is circular. The circular groove has good light guiding effect and can improve the utilization rate of the laser.

[0086] Of course, in some other embodiments, the cross section of the second groove G2 parallel to the substrate 110 can also be other shapes, for example, it can be rectangular, triangular, trapezoidal, etc.

[0087] In an embodiment, the second grooves G2 are multiple in number. The multiple second grooves G2 are arranged in an array on the fourth surface D. The arrayed second grooves G2 can make it easier to adjust the laser light.

[0088] In an embodiment, the multiple second grooves G2 are arranged in an array on the fourth surface D. The arrayed second grooves G2 can make it easier to adjust the laser light.

[0089] In an embodiment, the multiple second grooves G2 are arranged in an array on the fourth surface D. The arrayed second grooves G2 can make it easier to adjust the laser light.

[0090] In some other embodiments, the multiple second grooves G2 are arranged randomly on the fourth surface D. Compared with the above-mentioned arrayed and uniformly distributed second grooves G2, the randomly arranged second grooves G2 are easier to prepare and can improve the packaging strength.

[0091] In an embodiment, the material of the cover plate 140 includes glass.

[0092] In an embodiment, referring to Figure 3 , the microstructure 100 includes a third microstructure 142 arranged on the third surface C.

[0093] Specifically, the third microstructure 142 receives the light transmitted from the fourth surface D of the cover plate 140 and further guides the light. The third microstructure 142 can refract part of the light directly onto the packaging layer 120, or first refract the light onto the first microstructure 111 and then guide the light to the packaging layer 120 through the first microstructure 111. The third microstructure 142 can be arranged on the side of the packaging layer 120 close to the light-emitting unit 130, or on the side of the packaging layer 120 away from the light-emitting unit 130, or partially on the side of the packaging layer 120 close to the light-emitting unit 130 and partially on the side of the packaging layer 120 away from the light-emitting unit 130, which is not limited herein.

[0094] In some other embodiments, the third microstructure 142 can also not be arranged.

[0095] In an embodiment, the third microstructure 142 is the same as the first microstructure 111, which can facilitate the preparation and improve the preparation efficiency. In other embodiments, the third microstructure 142 can also be different from the first microstructure 111.

[0096] In an embodiment, referring to Figure 3 , the third microstructure 142 comprises at least one third groove G3 formed on the third surface C.

[0097] Specifically, the concave surface of the third groove G3 can refract and guide the laser light to the packaging layer 120, and the number of the third groove G3 can be 1, 5, or 10, etc. The third groove G3 can be formed by etching or cold carving, etc.

[0098] In an embodiment, the third groove G3 is an arc-shaped groove. Of course, the third groove G3 can also be a groove with other shapes, for example, the groove wall of the third groove G3 is a plane.

[0099] Of course, in some other embodiments, the third microstructure 142 can also be a convex microstructure formed on the third surface C.

[0100] In an embodiment, the cross section of the third groove G3 parallel to the substrate 110 is circular. The circular groove has good light guiding effect and can improve the utilization rate of the laser.

[0101] Of course, in some other embodiments, the cross section of the third groove G3 parallel to the substrate 110 can also be other shapes, for example, it can be rectangular, triangular, trapezoidal, etc.

[0102] In an embodiment, the number of the third groove G3 is multiple. The multiple third grooves G3 extend from the vicinity of the packaging layer 120 to the direction away from the packaging layer 120, and are within the coverage range of the laser spot. The more the number of the third grooves G3, the higher the utilization rate of the light. The number of the third grooves G3 can be 2, 4, or 10, etc., which is not limited in the present application.

[0103] In an embodiment, the multiple third grooves G3 are arranged in an array on the third surface C. The third grooves G3 arranged in an array can make the adjustment of the laser light easier than the third grooves G3 not arranged in an array.

[0104] In an embodiment, the multiple third grooves G3 are uniformly distributed on the third surface C. The uniformly distributed second grooves G2 can make the sintering effect of the laser on the packaging layer 120 the same, ensuring the overall uniformity of the packaging effect of the packaging layer 120.

[0105] Of course, in some other embodiments, the multiple third grooves G3 are randomly arranged on the third surface C. Compared with the above-mentioned array distribution and uniform distribution, the third grooves G3 arranged randomly are simpler to prepare and can also improve the packaging strength to a certain extent.

[0106] In an embodiment, in combination withFigure 3 The normal projection of the second microstructure 141 on the substrate 110 covers the normal projection of the first microstructure 111 on the substrate 110, i.e. the width of the second microstructure 141 is greater than the width of the first microstructure 111. In this way, it can be ensured that each position of the first microstructure 111 can receive the light refracted from the second microstructure 141.

[0107] In an embodiment, continuing to refer to Figure 3 The normal projection of the third microstructure 142 on the substrate 110 covers the normal projection of the first microstructure 111 on the substrate 110, i.e. the width of the third microstructure 142 is greater than the width of the first microstructure 111. In this way, it can be ensured that each position of the first microstructure 111 can receive the light refracted from the third microstructure 142.

[0108] Of course, in some other embodiments, the normal projection of the second microstructure 141 on the substrate 110 partially overlaps the normal projection of the first microstructure 111 on the substrate 110, and / or the normal projection of the third microstructure 142 on the substrate 110 partially overlaps the normal projection of the first microstructure 111 on the substrate 110.

[0109] Please refer to Figure 6 The application also provides a display device 20, which comprises the display panel 10 according to any one of the above embodiments.

[0110] Specifically, the display device 20 can be any one of a notebook, a desktop computer, a tablet computer, a mobile phone, a smart watch, a virtual display terminal, etc., and is not limited herein.

[0111] The above is only an embodiment of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the application.

Claims

1. A display panel, the display panel comprising a display area and a non-display area disposed around the periphery of the display area, characterized in that, The display panel also includes: A substrate, the substrate including a first surface and a second surface, wherein the first surface and the second surface are disposed opposite to each other; A cover plate, the cover plate including a third surface and a fourth surface, the third surface and the fourth surface being disposed opposite to each other, and the cover plate being disposed opposite to the substrate; An encapsulation layer is disposed between the substrate and the cover plate, and is located in the non-display area and surrounds the display area; The non-display area of ​​the substrate or cover plate has a microstructure on its surface, which is used to guide light to the encapsulation layer; the microstructure includes a first microstructure disposed on the first surface, and a second microstructure disposed on the fourth surface.

2. The display panel according to claim 1, characterized in that, The first microstructure is disposed on the first surface and the second surface.

3. The display panel according to claim 1, characterized in that, The encapsulation layer is made of Frit material.

4. The display panel according to claim 1, characterized in that, The first microstructure includes at least one first groove formed on the first surface.

5. The display panel according to claim 4, characterized in that, The first groove has a circular cross-section parallel to the substrate.

6. The display panel according to claim 4, characterized in that, The number of the first grooves is multiple.

7. The display panel according to claim 6, characterized in that, Multiple first grooves are arranged in an array on the first surface.

8. The display panel according to claim 6, characterized in that, Multiple first grooves are evenly distributed on the first surface.

9. The display panel according to claim 4, characterized in that, Multiple first grooves are disposed around the encapsulation layer.

10. The display panel according to claim 9, characterized in that, The encapsulation layer includes a straight encapsulation portion and a corner encapsulation portion, and the arrangement density of the first groove adjacent to the corner encapsulation portion is greater than the arrangement density of the first groove adjacent to the straight encapsulation portion.

11. The display panel according to claim 4, characterized in that, The groove wall of the first groove is provided with a reflective coating.

12. The display panel according to claim 11, characterized in that, The first groove is an arc-shaped groove.

13. The display panel according to claim 1, characterized in that, The second microstructure is the same as the first microstructure.

14. The display panel according to claim 1, characterized in that, The second microstructure includes at least one second groove formed on the fourth surface.

15. The display panel according to claim 14, characterized in that, The second groove has a circular cross-section parallel to the substrate.

16. The display panel according to claim 14, characterized in that, The number of the second groove is multiple.

17. The display panel according to claim 16, characterized in that, Multiple second grooves are arranged in an array on the fourth surface.

18. The display panel according to claim 16, characterized in that, The second grooves are evenly distributed on the fourth surface.

19. The display panel according to claim 14, characterized in that, The cover plate is made of glass.

20. The display panel according to claim 13, characterized in that, The microstructure includes a third microstructure disposed on the third surface.

21. The display panel according to claim 20, characterized in that, The third microstructure is the same as the first microstructure.

22. The display panel according to claim 20, characterized in that, The third microstructure includes at least one third groove formed on the third surface.

23. The display panel according to claim 22, characterized in that, The cross-section of the third groove, which is parallel to the substrate, is circular.

24. The display panel according to claim 22, characterized in that, The number of the third grooves is multiple.

25. The display panel according to claim 24, characterized in that, The plurality of the third grooves are arranged in an array on the third surface.

26. The display panel according to claim 24, characterized in that, The plurality of the third grooves are evenly distributed on the third surface.

27. The display panel according to claim 20, characterized in that, The orthographic projection of the second microstructure onto the substrate overlaps the orthographic projection of the first microstructure onto the substrate; And / or, the orthographic projection of the third microstructure onto the substrate overlaps the orthographic projection of the first microstructure onto the substrate.

28. The display panel according to claim 1, characterized in that, The furthest distance between the orthographic projection of the microstructure on the substrate and the orthographic projection of the encapsulation layer on the substrate is less than or equal to a distance threshold.

29. The display panel according to claim 28, characterized in that, The distance threshold ranges from 500μm to 1000μm.

30. The display panel according to claim 1, characterized in that, The substrate is made of glass.

31. A display device, characterized in that, Includes the display panel as described in any one of claims 1-30.

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