Multilayer latent heat storage

Abstract

A latent heat reservoir for a conductor assembled in a housing has at least two latent heat storage elements and at least one heat transfer device, particularly at least two heat transfer devices electrically connected to each other, wherein the latent heat storage elements and the heat transfer devices are arranged in layers such that the latent heat storage elements are in contact with the heat transfer devices on at least one surface side in each case, so that heat from the heat transfer devices is conducted to the latent heat storage elements in contact with them, so that heat can be removed from the conductor into the latent heat reservoir.

Description

Technical Field

[0001] This invention relates to a latent heat storage device. Background Technology

[0002] Document EP 3433904 B1 shows a latent heat storage device for HV components. Summary of the Invention

[0003] In this context, the purpose of the present invention is to increase the thermal storage capacity of latent heat storage devices.

[0004] According to the present invention, this objective is achieved by a latent heat storage device having the features of claim 1.

[0005] Therefore, the following is provided:

[0006] A latent heat storage device for a conductor mounted in a housing includes at least two latent heat storage elements and at least one heat transfer device, particularly at least two heat transfer devices electrically connected to each other, wherein the latent heat storage elements and the heat transfer devices are arranged in layers such that the latent heat storage elements are in contact with the heat transfer devices on at least one surface side in each case, so that heat from the heat transfer devices is conducted to the contacting latent heat storage elements, allowing heat to dissipate from the conductor into the latent heat storage device.

[0007] In sandwich construction, materials with different properties are layered and combined to form components.

[0008] Latent heat storage devices (also known as phase change memories or PCMs) are thermal storage devices that store most of the heat energy supplied to them in the form of latent heat (e.g., a phase change from solid to liquid). The stored heat is masked because the temperature of the substance will not increase further despite the heat supply, as long as the phase transition is not fully completed. Therefore, latent heat storage devices can store very large amounts of heat over a small temperature range around the phase change. Because many substances with different melting points over a wide range are suitable as phase change materials, this technology covers a wide range of storage applications, from low-temperature to high-temperature thermal energy storage devices.

[0009] Latent heat is the thermal energy stored in a material through (partial) phase change.

[0010] A latent heat storage element comprises a phase change material. Additional material components can be added to the phase change material to ensure other properties of the latent heat storage element. A suitable example of a phase change material is paraffin wax. To prevent the latent heat storage element from losing its strength during operation and / or to improve the thermal conductivity of the phase change material, graphite can be added to the phase change material, for example. Under appropriate mixing ratios, the latent heat storage element does not liquefy but becomes a gel. Furthermore, the graphite in the paraffin wax improves the heat transfer of the phase change material having a graphite-paraffin mixture.

[0011] A gel is a dispersion system consisting of at least two components. Here, the solid component forms a sponge-like three-dimensional network whose pores are filled with liquid or gas. Thus, the liquid component is immobilized within the solid component.

[0012] The basic idea of ​​this invention is to stack at least two latent heat storage elements on top of each other in a sandwich manner, wherein each of these latent heat storage elements is in contact with a heat transfer device that dissipates heat from a conductor. Alternatively, when the heat transfer device is arranged between two latent heat storage elements and electrically connected to a conductor from which heat will be dissipated, the latent heat storage elements are in contact with the same heat transfer device.

[0013] Alternatively, at least two heat transfer devices can be provided. In this case, the first heat transfer device is electrically connected to the thermally conductive body. The second heat transfer device is electrically connected to the first heat transfer device, and thus indirectly connected to the thermally conductive body. Therefore, heat dissipates from the thermally conductive body into the heat transfer devices. The heat transfer devices then dissipate the heat into the latent heat storage element in contact.

[0014] Therefore, the thermal energy from the heat transfer device is stored in the latent heat storage element in the form of energy for phase change (e.g., melting energy).

[0015] Therefore, if a latent heat storage device has two latent heat storage elements, the heat capacity of the latent heat storage elements can be approximately doubled.

[0016] Latent heat storage elements can be arranged between multiple heat transfer devices, or alternatively, heat transfer devices can be arranged between two latent heat storage elements.

[0017] Different alternatives to latent heat storage elements are conceivable, including heat transfer devices arranged between two latent heat storage elements and designed to be connected to a conductor, the heat of which is dissipated through the latent heat storage device; or two latent heat storage elements arranged between two heat transfer devices, wherein the two heat transfer devices are designed to be electrically connected to the conductor, the heat of which is dissipated through the latent heat storage device.

[0018] Since the gel state of the latent heat storage element cannot reach any height (during the required operating time), the increase in heat storage capacity can be ensured primarily by increasing the surface area of ​​the latent heat storage element in contact with the heat transfer device.

[0019] Any fixed sleeve defining the latent heat storage device at its operating temperature is suitable as a housing. The latent heat storage device can be inserted into the housing of a more advanced component, and the latent heat storage device can be surrounded by a separate housing or overmolded with a suitable material having sufficient heat resistance and strength.

[0020] Advantageous configurations and improvements arise from the additional dependent claims and the description with reference to the accompanying drawings.

[0021] According to a preferred improvement of the invention, the latent heat storage device has two heat transfer devices, wherein the two latent heat storage elements are arranged between the two heat transfer devices.

[0022] This results in the following layered structure: heat transfer device - latent heat storage element - latent heat storage element - heat transfer device.

[0023] In this configuration, it is advantageous if the first heat transfer device forms an input interface to the thermally conductive material and the second heat transfer device has an output interface to the thermally conductive material (e.g., a stylus).

[0024] Therefore, the thermally conductive conductor is interrupted or bridged by the latent heat storage device and has at least two components: a section extending to the input interface and another section away from the output interface.

[0025] Although a conductor may have several sections or components, such as busbars and pins, this patent application still relates to conductors.

[0026] As an alternative, it is conceivable that a second heat transfer device is arranged between the latent heat storage elements. In this case, the following structure is obtained: heat transfer device - latent heat storage element - heat transfer device - latent heat storage element.

[0027] In this case, the heat transfer device arranged between the latent heat storage elements can be electrically connected to the thermally conductive body in other ways.

[0028] According to a preferred improvement of the invention, the latent heat storage device includes a compressible layer designed to secure these layers within a housing and / or between heat transfer devices, wherein the compressible layer is compressed due to the thermal expansion of the latent heat storage elements when the temperature of the latent heat storage elements rises, and expands due to its elasticity when the temperature of the latent heat storage elements decreases.

[0029] Therefore, the dimensions of the compressible layer are determined such that the latent heat storage element is pressed from the compressible layer onto the heat transfer device at a temperature below the operating temperature of the latent heat storage device. If the latent heat storage element expands during operation of the latent heat storage device, the compressible layer is compressed due to the thermal expansion of the latent heat storage element.

[0030] Therefore, even at temperatures below the operating temperature of the latent heat storage device, the latent heat storage element is prevented from sliding within the housing. Furthermore, the compressible layer dampens vibrations due to its elasticity.

[0031] According to a preferred embodiment of the invention, the heat transfer device comprises a metal-containing heat transfer device, preferably a metallic heat transfer device. The heat transfer device may be formed as a metal plate, a metal vapor deposition, or another metallic component. It is conceivable that the metal-containing heat transfer device is formed over the entire surface, rather than over a contoured surface that is flat and / or curved relative to at least one surface of the latent heat storage element.

[0032] It is conceivable that the surface of the metal plate corresponds to the surface of the latent heat storage element.

[0033] It should be understood that, as an alternative, heat can also be introduced into the latent heat storage element not in a planar manner but locally or selectively. A planar manner means that, in a cuboid latent heat storage element, heat is introduced across the entire surface of one side of the element.

[0034] In this case, it is also convenient for the heat transfer device to have a thermally conductive layer, which is applied to the metal heat transfer device and designed to fill air inclusions. The thermally conductive layer can be formed, for example, a flexible or cured paste, such as a silicone paste, which may have added components.

[0035] A thermally conductive layer is understood to be a material with better thermal conductivity than air, whose main function is to transfer heat between substances or components, and this thermally conductive layer is particularly applied to the entire surface of latent heat storage elements or metal heat transfer devices.

[0036] According to a preferred embodiment of the invention, the heat transfer devices are electrically connected to and abutted against each other by at least one conductive support. Therefore, the supports ensure the transfer of heat and electricity between the heat transfer devices and ensure or improve their mechanical stability. In particular, connecting the heat transfer devices by three supports ensures the mechanical stability of both heat transfer devices. It should be understood that three conductive supports are advantageous in terms of thermal and electrical conductivity, but mechanical stability can also be established using conductive supports and two other non-conductive supports.

[0037] According to a preferred improvement of the invention, at least two heat transfer devices of the latent heat storage device are designed to be connected to a conductor, the heat of which will be dissipated from the latent heat storage device.

[0038] Therefore, it can be provided that the heat transfer device has a recess (e.g., an aperture) to receive the conductor from which heat is to be dissipated. This ensures particularly efficient dissipation of heat through the heat transfer device.

[0039] According to a preferred improvement of the invention, the latent heat storage device includes a plurality of pairs of latent heat storage elements, each of which is arranged between two heat transfer devices.

[0040] This article may also provide the provision of forming an additional latent heat storage element between the housing and the heat transfer device.

[0041] According to a preferred improvement of the invention, the latent heat storage element comprises at least two material components, the proportion of which is adjusted such that the latent heat storage element is in a gel state at the operating temperature.

[0042] It should be understood that the following is advantageous: the connector, particularly the charging socket, has at least one conductor that can be connected to a latent heat storage device as described in any of the preceding claims, such that heat is dissipated from the conductor to the latent heat storage device, wherein the input and / or output interfaces are designed to have a crimped and / or threaded connection between the conductor connected at the interface and each heat transfer device.

[0043] It should be understood that the following is advantageous: the conductor, in particular the busbar or electrical contact element, has a latent heat storage device as described above, wherein heat can be dissipated from the conductor to the latent heat storage device and can be stored in the latent heat storage device, in particular as latent heat.

[0044] A busbar is a power supply line made of rigid conductive material used to transmit electrical energy.

[0045] This patent application specifically describes a conductor for transferring electrical energy between two components, and this conductor is connected to or can be connected to a latent heat storage device. This means that heat lost in the conductor due to high current or high voltage can be dissipated into the latent heat storage device. This ensures that the conductor's permissible operating temperature is not exceeded, as the heat can be stored as latent heat in the latent heat storage device. In particular, the latent heat storage device and the conductor can be configured as separate components.

[0046] It should be understood that the following is advantageous: the kit for installing the latent heat storage device as described above has a housing for accommodating a predetermined number of pairs of latent heat storage elements and a corresponding number of heat transfer devices, such that there are so many heat transfer devices that the pairs of latent heat storage elements can be arranged between two heat transfer devices.

[0047] Therefore, it can be provided that each latent heat storage element is associated with a heat transfer device, or advantageously the number of heat transfer devices is derived from the following formula:

[0048]

[0049] Therefore, the kit used for the described latent heat storage device can be sized for any number of latent heat storage elements. This means that, when installation space is available, the heat storage capacity of the latent heat storage device can be adjusted almost as needed.

[0050] It goes without saying that, without departing from the scope of protection of this invention, the above features and the features to be described below can be used not only in their respective specified combinations, but also in other combinations or individually.

[0051] Wherever meaningful, the above configurations and improvements can be combined with each other as needed. Further possible configurations, improvements, and implementations of the invention include combinations of features of the invention not explicitly mentioned above or below with respect to exemplary embodiments. In particular, those skilled in the art will also add individual aspects herein as improvements or supplements to the basic form of the invention. Attached Figure Description

[0052] The invention will now be described in more detail with reference to exemplary embodiments specified in the accompanying drawings. In this case:

[0053] Figure 1 A perspective view of one embodiment of the present invention is shown;

[0054] Figure 2 A schematic perspective cross-sectional view according to an embodiment of the present invention is shown;

[0055] Figure 3 A schematic perspective view according to an embodiment of the present invention is shown;

[0056] Figure 4 A schematic perspective view of one embodiment of the present invention is shown;

[0057] Figure 5 A schematic perspective view of components according to an embodiment of the present invention is shown;

[0058] Figure 6A schematic cross-sectional view of an electrical component according to an embodiment of the present invention is shown.

[0059] The accompanying drawings are intended to provide a further understanding of embodiments of the invention. These drawings illustrate embodiments and are used to explain the principles and concepts of the invention in conjunction with the description. Other embodiments and numerous advantages mentioned arise with respect to the drawings. Elements in the drawings are not necessarily shown in true proportion to each other.

[0060] In the accompanying drawings, unless otherwise stated, identical, functionally identical, and identical elements, features, and parts are each given the same reference numerals. The drawings are described coherently and comprehensively below. Detailed Implementation

[0061] Figure 1 A schematic perspective view of a pair of latent heat storage devices 10 is shown. For simplicity, reference numerals are simply used to indicate one side of the conductors in the conductor pair 12 in the figure.

[0062] The latent heat storage device 10 is connected to multiple segments 12.1, 12.2, 12.3, and 12.4 of a pair of conductors 12. The pair of conductors 12 includes a first conductor having segments 12.1 and 12.2 and a second conductor also having two segments. The latent heat storage device 10 has the same design for both conductors in the pair of conductors 12.

[0063] The first segment 12.1 of the conductor is connected to a heat transfer device, which is formed as a metal plate 14, via a pressure connection. Therefore, current and heat are transferred from the first segment 12.1 to the metal plate 14. The interface (i.e., the pressure connection) between the first segment 12.1 of the conductor and the metal plate 14 forms an input interface. The metal plate 14 has four holes, one of which is occupied by the hole in the first segment 12.1 of the conductor. The remaining three holes are occupied by supports 34, 35, and 36. Figure 1 (Not shown) occupy the space because these supports extend between metal plate 14 and metal plate 15.

[0064] A thermally conductive paste 22, filling the air inclusions between the metal plate 14 and the latent heat storage element 26, is applied to the underside of the metal plate 14, i.e., the side facing the latent heat storage element. The thermally conductive paste 22 is more thermally conductive than air, resulting in improved thermal conductivity between the metal plate 14 and the latent heat storage element 26. Another latent heat storage element 27 is disposed between the two metal plates 14 and 15. A compressible layer 24 is disposed between the latent heat storage elements 26 and 27, pressing the latent heat storage elements 26 and 27 against the metal plates 14 and 15, particularly against the housing 18. Figure 1(Not shown in the image). If the components of the latent heat storage device 10 expand due to thermal expansion, the compressible layer 24 is compressed accordingly. Another layer of thermally conductive paste 23 is applied between the metal plate 15 and the latent heat storage element 27.

[0065] Figure 2 It shows something similar to Figure 1 A perspective cross-sectional view of a pair of latent heat storage devices 10. Figure 2 A support member 36 extending between metal plates 14 and 15 is also shown. In each case, the support member 36 is connected to the metal plates 14 and 15 by a pressure connection.

[0066] Figure 3 Another schematic perspective view of a pair of latent heat storage devices 10.1 is shown. The latent heat storage device 10.1 includes four latent heat storage elements 26, 27, 32, and 33 for each conductor in the conductor pair 12. According to... Figure 3 The latent heat storage device accordingly has eight latent heat storage elements.

[0067] From the formula It is concluded that the latent heat storage device 10.1 has three metal plates 14, 15, and 30.

[0068] To better illustrate, the basis is hidden. Figures 1-3 The housing 18 in the latent heat storage devices 10 and 10.1.

[0069] Figure 4 It shows that according to Figure 1 A cross-sectional perspective view of the latent heat storage device 10. Figure 4 The housing 18 surrounding the components of the latent heat storage device is also shown. From Figure 4 It is clear that the conductive segments 12.1, 12.2, 12.3, and 12.4 do not need to pass through the common plane. Depending on the application, the input interface segments 12.1 and 12.3 can occupy one of the holes in the metal plate 14. Therefore, the output interface segments 12.2 and 12.4 can occupy any hole in the metal plate 15, meaning that the conductive segments of the input and / or output interfaces do not need to be inserted into the opposite holes.

[0070] Figure 5 A perspective view of several components of the latent heat storage device is shown. Figure 5 Only the cross-sections of conductors 12.1 and 12.2, metal plates 14 and 15, and three supports 34, 35, and 36 are shown. To show the supports 34-36 between metal plates 14 and 15, [the following is omitted as it is not part of the main text]. Figure 5 Latent heat storage elements 26 and 27 are not shown.

[0071] Figure 6An electronic component 50 having a latent heat storage device 10 as described above is shown. The electronic component 50 includes a pair of conductors 12 having a first section 12.1 forming an input interface to the latent heat storage device 10 and a second section 12.2 forming an output interface to the latent heat storage device 10. The first section of the conductor is designed as a busbar. The second section 12.2 of the conductor is designed as a pair of male connector pins 38. The male connector 38 forms a so-called charging socket, which can be connected to a female connector to charge the battery.

[0072] Although the present invention has been fully described above based on preferred exemplary embodiments, the present invention is not limited thereto and can be modified in various ways.

[0073] List of reference numerals

[0074] 10 Latent heat storage device

[0075] 10.1 Latent heat storage device

[0076] 12 conductor pairs

[0077] 12.1 First Section

[0078] 12.2 Second Section

[0079] 14 Metal Plates

[0080] 15 Metal Plates

[0081] 18. Shell

[0082] 20 holes

[0083] 22 Thermally conductive paste

[0084] 23 Thermally conductive paste

[0085] 24 compressible layers

[0086] 26 Latent heat storage elements

[0087] 27 Latent heat storage element

[0088] 28 Thermally conductive paste

[0089] 29 Thermally conductive paste

[0090] 30 Metal Plate

[0091] 32 Latent heat storage element

[0092] 33 Latent heat storage element

[0093] 34 Support components

[0094] 35 Support components

[0095] 36 Support components

[0096] 38 connectors

[0097] 50 Electrical components

Claims

1. A latent heat accumulator (10; 10.1) for a conductor (12) to be installed in a housing (18), the latent heat accumulator having: -At least two latent heat storage elements (26, 27; 32, 33), - At least two heat transfer devices, wherein the at least two heat transfer devices are electrically connected to each other. in, The latent heat storage elements (26, 27; 32, 33) and the heat transfer device are arranged in layers such that the latent heat storage elements are in contact with the heat transfer device on at least one surface side in each case, so that heat from the heat transfer device is conducted to the contacting latent heat storage elements. Wherein, at least two heat transfer devices of the latent heat accumulator (10; 10.1) are configured to be electrically connected to a conductor (12, 12.1, 12.2), and the heat of the conductor is dissipated through the latent heat accumulator; The conductor has a section extending to the input interface and another section away from the output interface; the at least two heat transfer devices are electrically connected to and abutted against each other by at least one conductive support to ensure the transfer of heat and electricity between the at least two heat transfer devices, wherein the at least one conductive support extends through the latent heat storage element.

2. The latent heat accumulator according to claim 1, The latent heat accumulator has two heat transfer devices, wherein... The two latent heat storage elements (26, 27) are arranged between the two heat transfer devices.

3. The latent heat accumulator according to claim 1 or 2, in, The latent heat accumulator has a compressible layer (24; 25) configured to secure the latent heat accumulator elements (26, 27; 32, 33) within a housing and / or between at least two heat transfer devices, wherein the compressible layer (24; 25) is compressed due to the thermal expansion of the latent heat accumulator elements as the temperature of the latent heat accumulator elements increases, and expands due to the elasticity of the compressible layer as the temperature of the latent heat accumulator elements decreases.

4. The latent heat accumulator according to claim 1 or 2, in, The heat transfer device has metal plates (14, 15, 30).

5. The latent heat accumulator according to claim 4, in, The heat transfer device has a thermally conductive layer (22, 23; 28, 29) which is applied to the metal plate (14, 15, 30) and configured to fill the air inclusions between the metal plate and the latent heat accumulator element.

6. The latent heat accumulator according to claim 1 or 2, in, The heat transfer devices are electrically connected to each other and supported against each other by at least one conductive support.

7. The latent heat accumulator according to claim 1 or 2, The latent heat accumulator has multiple pairs of latent heat accumulator elements (26, 27; 32, 33), each of which is arranged between two heat transfer devices.

8. The latent heat accumulator according to claim 1 or 2, in, The latent heat storage element (26, 27; 32, 33) has at least two material components, the proportions of which are set such that the latent heat storage element has a gel state at the operating temperature.

9. The latent heat accumulator according to claim 1 or 2, in, The heat transfer device is electrically connected to each other and supported against each other by three conductive supports (34, 35, 36).

10. A plug connector (38), particularly a charging socket, having at least one conductor (12) connected at an input interface and an output interface to a latent heat accumulator according to any one of the preceding claims, such that heat is dissipated from the conductor (12) to the latent heat accumulator (10). In 10.1), among which, The input interface and / or the output interface are designed to be crimped or threaded between the conductor at the input interface and the heat transfer device.

Images