Automobile radar circuit board processing technology and processing equipment

Abstract

The application relates to the field of circuit boards, in particular to an automobile radar circuit board processing technology and processing equipment. Technical problem: the circuit board of a non-metal material is prone to heat accumulation during drilling. Technical scheme: an automobile radar circuit board processing equipment comprises a workbench and the like. The application controls the starting of an external suction pump to suck the suction plate, the drillings generated during the punching process enter the suction plate from the suction hole I and are sucked away, meanwhile, the suction pump sucks air into the suction hole I through the suction plate, so that the air enters the punching position of the drill bit, the drilling position of the drill bit and the circuit board body is cooled during drilling, heat accumulation in the drilling position of the circuit board body is avoided, and due to the fan-shaped arrangement of the linkage plate, a gap exists between the lower side of the linkage plate and the circuit board body, so that air can be sucked into the suction hole I from the gap, and air flows around the drill bit.

Description

TECHNICAL FIELD

[0001] The application relates to the field of circuit boards, in particular to a processing technology and processing equipment for an automobile radar circuit board. BACKGROUND

[0002] The existing Chinese patent CN111251368B discloses a circuit board drilling device, which can fix the circuit board through the limiting block, drive the fixing rod to fix the circuit board, drive the opening of the separation groove, drive the rocker through the movement of the second movable block to move the movable plate, control the operation of the fan while ensuring the operation of the drill bit, and reduce the accumulation of waste materials.

[0003] However, the automobile radar circuit board is made of non-metallic insulating material, and in the process of processing the radar circuit board, drilling is needed. The non-metallic material circuit board is prone to heat accumulation during drilling, so the cooling method of drilling needs to be optimized. SUMMARY

[0004] In order to overcome the problem of heat accumulation of non-metallic material circuit board during drilling, the application provides a processing technology and processing equipment for an automobile radar circuit board.

[0005] Technical scheme: a processing equipment for an automobile radar circuit board, comprising a workbench, a clamping device and a mechanical arm; the workbench is fixedly connected with two clamping devices; the workbench is fixedly connected with a mechanical arm; further comprising a fixing frame, an electric push rod I, a mounting plate, a motor, a drill bit, a spring rod I, a spring rod II, a suction plate, a spring rod III and a linkage plate; the mechanical arm is fixedly connected with the fixing frame; the fixing frame is fixedly connected with the electric push rod I; the telescopic end of the electric push rod I is fixedly connected with the mounting plate; the mounting plate is fixedly connected with the motor; the output shaft of the motor is fixedly connected with the drill bit; the mounting plate is fixedly connected with two symmetrical spring rods I; the opposite sides of the telescopic ends of the two spring rods I are each fixedly connected with a spring rod II; the telescopic end of each spring rod II is fixedly connected with a suction plate; a plurality of suction holes I are formed on the opposite sides of the two suction plates; the mounting plate is fixedly connected with two symmetrical spring rods III; the telescopic end of each spring rod III is fixedly connected with a linkage plate, and the linkage plate cooperates with the suction plate.

[0006] As an improvement of the above-mentioned scheme, a spring ball is further included; a plurality of spring balls are fixedly connected to the lower side of each suction plate.

[0007] As an improvement of the above-mentioned scheme, a plurality of suction holes II are formed on the bottom of each suction plate; the suction holes I on the two suction plates are staggered.

[0008] As an improvement of the above-mentioned scheme, the linkage plate is arranged in a fan shape.

[0009] As the improvement of the above-mentioned scheme, the collecting assembly further comprises an electric push rod II, a collecting bucket, a connecting plate, a cooling plate and a contact plate; the electric push rod II is fixedly connected to the fixing frame and located below the electric push rod I; the electric push rod II is fixedly connected to the collecting bucket at the telescopic end thereof; two symmetrically distributed connecting plates are fixedly connected in the collecting bucket; each connecting plate is rotatably connected with a cooling plate, and a torsional spring is arranged between the rotating shaft of the cooling plate and the connecting plate; and the contact plate is fixedly connected to the upper side of the collecting bucket.

[0010] As the improvement of the above-mentioned scheme, the collecting assembly further comprises a temperature-reducing plate; each cooling plate is fixedly connected with a deformable temperature-reducing plate.

[0011] As the improvement of the above-mentioned scheme, the cooling plate is in a semicircular shape.

[0012] As the improvement of the above-mentioned scheme, the collecting assembly further comprises a scraping assembly; the scraping assembly comprises a support plate, a spring rod IV, a scraping strip, a linkage block and a wedge-shaped block; each cooling plate is provided with an annular groove; each connecting plate is fixedly connected with a support plate; each support plate is fixedly connected with a spring rod IV; the telescopic end of each spring rod IV is fixedly connected with a scraping strip, and the scraping strip is located in the annular groove; the telescopic part of each spring rod IV is fixedly connected with a linkage block; and each cooling plate is fixedly connected with a wedge-shaped block, and the wedge-shaped block cooperates with the linkage block.

[0013] As the improvement of the above-mentioned scheme, the lower side of the scraping strip and the edge of the annular groove are both in an arc shape.

[0014] As the improvement of the above-mentioned scheme, the process flow of the automobile radar circuit board processing equipment is as follows:

[0015] I. Cutting

[0016] Purpose: According to the requirements of engineering data MI, cut the large plate into small pieces to meet the requirements of customers;

[0017] Process: large plate → cutting according to MI requirements → plate bending → rounding and edge grinding → plate output;

[0018] II. Drilling

[0019] Purpose: According to the engineering data, drill the required hole diameter at the corresponding position on the plate with the required size;

[0020] Process: stack plate pins → plate feeding → drilling → plate unloading → inspection and repair;

[0021] III. Copper deposition

[0022] Purpose: Copper deposition is to deposit a thin layer of copper on the insulating hole wall by chemical method;

[0023] Process: Rough grinding → hanging plate → copper automatic line → plate → dip thin sulfuric acid → thick copper;

[0024] Four, graphic transfer

[0025] Purpose: graphic transfer is to produce the image on the film to the board;

[0026] Process: (blue oil process): grinding plate → printing the first side → drying → printing the second side → drying → exposure → developing → inspection; (dry film process): grinding plate → film pressing → standing → alignment → exposure → standing → developing → inspection;

[0027] Five, graphic plating

[0028] Purpose: graphic plating is to electroplate a layer of copper layer and a layer of gold, nickel or tin layer with the required thickness on the exposed copper layer of the circuit pattern or the hole wall;

[0029] Process: plate → oil removal → water washing twice → micro-etching → water washing → pickling → copper plating → water washing → acid dipping → tin plating → water washing → plate;

[0030] Six, film stripping

[0031] Purpose: use NaOH solution to strip the anti-electroplating cover film layer to expose the non-circuit copper layer;

[0032] Process: water film: insert frame → dip alkali → rinse → scrub → machine; dry film: plate → machine;

[0033] Seven, etching

[0034] Purpose: etching is to use chemical reaction method to corrode and remove the copper layer in non-circuit part;

[0035] Eight, green oil

[0036] Purpose: green oil is to transfer the pattern of green oil film to the board, which plays a protective role in the circuit and prevents tin on the circuit during solid connection;

[0037] Process: grinding plate → printing photosensitive green oil → soldering plate → exposure → developing; grinding plate → printing the first side → drying plate → printing the second side → drying plate;

[0038] Nine, character

[0039] Purpose: characters are a kind of convenient-to-identify marks;

[0040] Process: after green oil final soldering → cooling and standing → screen adjustment → printing characters → post-soldering;

[0041] Ten, gold-plated fingers

[0042] Purpose: a layer of nickel-gold layer with the required thickness is plated on the plug fingers to make them more wear-resistant and hard;

[0043] Process: plate on -> oil removal -> water washing twice -> micro-etching -> water washing twice -> pickling -> copper plating -> water washing -> nickel plating -> water washing -> gold plating;

[0044] Eleven, tin-plated sheet

[0045] Purpose: tin spraying is to spray a layer of lead tin on the bare copper surface without covering the solder resist oil, so as to protect the copper surface from oxidation and ensure good soldering performance;

[0046] Process: micro-etching -> air drying -> preheating -> rosin coating -> solder coating -> hot air leveling -> air cooling -> washing and air drying;

[0047] Twelve, forming

[0048] The forming method of stamping or numerical control drilling machine drilling out the shape required by the customer has organic drilling, plate drilling, hand drilling and hand cutting;

[0049] Thirteen, testing

[0050] Through electronic testing, the open circuit, short circuit and other defects affecting the functionality that cannot be easily found by visual inspection are detected;

[0051] Fourteen, final inspection

[0052] Through visual inspection of the appearance defects of the plate, slight defects are repaired, and defective plate is prevented from flowing out.

[0053] Beneficial effects: the present application controls the starting of the external suction pump to suck the plate, and the debris generated in the punching process enters the suction hole I and is sucked away after the suction plate, at the same time, the suction pump sucks air from the suction hole I through the suction plate, so that the air enters the punching position of the drill bit, and the drilling position of the drill bit and the circuit board body is cooled during drilling, avoiding heat accumulation in the drilling position of the circuit board body, since the linkage plate is arranged in a fan shape, there is a gap between the lower side of the linkage plate and the circuit board body, so that air can be sucked into the suction hole I from the gap, and air flows around the drill bit.

[0054] The present application drives the components connected by the electric push rod II and the collecting hopper to move upward until the contact plate contacts the lower side of the circuit board body, and the cooling plate and the cooling plate are tightly attached to the lower side of the punching position of the circuit board body under the action of the torsion spring, so that the lower side of the punching area on the circuit board body is supported by the contact plate during drilling, the vibration generated during drilling is reduced, the circuit board body is prevented from being cracked, and the lower side of the punching position on the circuit board body is cooled by the cooling plate, so that heat accumulation is avoided.

[0055] The present application is characterized in that the scraping strip is disengaged from the limit of the annular groove after the cooling plate is turned downward, and the wedge-shaped block is turned when the cooling plate is turned downward, the linkage block is disengaged from the limit of the wedge-shaped block, so that the spring rod IV moves the scraping strip to the side close to the center of the circular hole under the action of the spring rod IV, the two ends of the scraping strip of elastic material are popped into the inside of the circular hole under the action of the spring rod IV, so that the contact area of the scraping strip and the lower edge of the circular hole is increased, so that the scraping strip scrapes the burrs remaining on the lower edge of the circular hole. BRIEF DESCRIPTION OF DRAWINGS

[0056] Figure 1 The structure schematic view of the automobile radar circuit board processing equipment disclosed by the present application is disclosed.

[0057] Figure 2 The partial structure schematic view of the automobile radar circuit board processing equipment disclosed by the present application is disclosed.

[0058] Figure 3 The combined partial structure schematic view of the electric push rod I, the mounting plate, the motor, the drill bit, the spring rod I of the automobile radar circuit board processing equipment disclosed by the present application is disclosed.

[0059] Figure 4 The combined partial structure schematic view of the drill bit, the spring rod I, the spring rod II, the suction plate, the spring rod III and the collection assembly of the automobile radar circuit board processing equipment disclosed by the present application is disclosed.

[0060] Figure 5 The combined partial structure schematic view of the drill bit, the spring rod I, the spring rod II, the suction plate, the spring rod III, the linkage plate and the spring ball of the automobile radar circuit board processing equipment disclosed by the present application is disclosed.

[0061] Figure 6 The combined partial structure schematic view of the drill bit and the collection assembly of the automobile radar circuit board processing equipment disclosed by the present application is disclosed.

[0062] Figure 7 The partial structure schematic view of the collection assembly of the automobile radar circuit board processing equipment disclosed by the present application is disclosed.

[0063] Figure 8 The combined partial structure schematic view of the collection assembly and the scraping assembly of the automobile radar circuit board processing equipment disclosed by the present application is disclosed.

[0064] Figure 9 The combined partial structure schematic view of the collection assembly, the scraping assembly and the drill bit of the automobile radar circuit board processing equipment disclosed by the present application is disclosed.

[0065] The figure label name: 1-Workbench, 2-Clamp, 3-Mechanical arm, 4-Fixed frame, 5-Circuit board body, 101-Electric push rod I, 102-Mounting plate, 103-Motor, 104-Drill bit, 105-Spring rod I, 106-Spring rod II, 107-Suction plate, 108-Spring rod III, 109-Linkage plate, 1010-Spring ball, 201-Electric push rod II, 202-Collecting hopper, 203-Connecting plate, 204-Cooling plate, 205-Cooling plate, 206-Contact plate, 301-Support plate, 302-Spring rod IV, 303-Scraping strip, 305-Linkage block, 306-Wedge block, 5a-Circular hole, 107a-Suction hole I, 107b-Suction hole II, 204a-Ring groove. DETAILED DESCRIPTION

[0066] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0067] Embodiment 1

[0068] A kind of automobile radar circuit board processing equipment, as shown in Figures 1-9 It includes workbench 1, clamp 2 and mechanical arm 3;Workbench 1 is bolted with two clamps 2;Workbench 1 is bolted with mechanical arm 3;

[0069] It further includes fixed frame 4, electric push rod I 101, mounting plate 102, motor 103, drill bit 104, spring rod I 105, spring rod II 106, suction plate 107, spring rod III 108 and linkage plate 109;Mechanical arm 3 is fixedly connected with fixed frame 4;Fixed frame 4 is bolted with electric push rod I 101;The telescopic end of electric push rod I 101 is fixedly connected with mounting plate 102;Mounting plate 102 is bolted with motor 103;The output shaft of motor 103 is fixedly connected with drill bit 104;Mounting plate 102 is fixedly connected with two symmetrical spring rods I 105;The opposite sides of the telescopic ends of the two spring rods I 105 are each fixedly connected with a spring rod II 106;The telescopic end of each spring rod II 106 is each fixedly connected with a semicircular suction plate 107;The opposite sides of the two suction plates 107 are each provided with a plurality of suction holes I 107a;Mounting plate 102 is fixedly connected with two symmetrical spring rods III 108;The telescopic end of each spring rod III 108 is each fixedly connected with a linkage plate 109, and the linkage plate 109 cooperates with the suction plate 107.

[0070] It further includes spring ball 1010;The lower side of each suction plate 107 is each fixedly connected with a plurality of spring balls 1010.

[0071] The bottom of each suction plate 107 is provided with a plurality of suction holes II 107b; the suction holes I 107a on the two suction plates 107 are staggered with each other.

[0072] The linkage plate 109 is arranged in a fan shape.

[0073] The working steps of the above embodiment are as follows: in use, first, the external suction pump is connected to the suction plates 107, then, the circuit board body 5 to be punched is manually placed into the two clamps 2, the circuit board body 5 is fixed by the two clamps 2, then, the control arm 3 moves the fixing frame 4 and the components connected thereto to the area of the circuit board body 5 until the drill bit 104 is aligned with the position to be punched on the circuit board body 5, then, the electric push rod I 101 is controlled to move the mounting plate 102 and the components connected thereto downward, when the two semi-circular suction plates 107 contact the position to be punched on the circuit board body 5, the mounting plate 102 continues to move downward, the spring rod II 105 is compressed, the mounting plate 102 moves downward to move the drill bit 104, the spring rod III 108 and the linkage plate 109 downward, the linkage plate 109 contacts the suction plate 107 earlier than the drill bit 104, the linkage plate 109 is inserted into the gap between the two suction plates 107, the two suction plates 107 are squeezed to move away from each other, and the spring rod II 106 is compressed, so that the linkage plate 109 pries open the two suction plates 107.

[0074] Then, the electric push rod I 101 is controlled to continue to move the mounting plate 102 downward until the drill bit 104 contacts the position to be punched on the circuit board body 5 after passing through the gap between the two suction plates 107, then, the motor 103 is started to drive the drill bit 104 to rotate through the output shaft of the motor 103, at the same time, the electric push rod I 101 is controlled to move the mounting plate 102 and the rotating drill bit 104 downward, so that the drill bit 104 punches the circuit board body 5, and the spring rod III 108 is compressed.

[0075] During the punching process, the external suction pump is controlled to be started to suck the suction plates 107, the debris generated during the punching process enters the suction plates 107 through the suction holes I 107a and is sucked away, at the same time, the suction pump sucks air into the suction holes I 107a through the suction plates 107, so that the air enters the punching position of the drill bit 104, with the continuous suction of the air, the air keeps flowing at the punching position of the drill bit 104, so that the drilling position of the drill bit 104 and the circuit board body 5 is cooled to avoid heat accumulation at the drilling position of the circuit board body 5, since the linkage plate 109 is arranged in a fan shape, there is a gap between the lower side of the linkage plate 109 and the circuit board body 5, so that the air can be sucked into the suction holes I 107a from the gap, and the air flows around the drill bit 104.

[0076] After the drilling is completed, the electric push rod 101 is controlled to move the mounting plate 102 upward with the drill bit 104, the spring rod 108 and the linkage plate 109, and the linkage plate 109 is separated from the suction plate 107. The two suction plates 107 move towards each other under the elastic force of the spring rod 106, and the lower side of the suction plate 107 scrapes the upper edge of the circular hole 5a when moving towards each other, so as to remove the burrs remaining on the edge of the circular hole 5a. Since the burrs will stand on the edge of the circular hole 5a during drilling, the burrs standing on the edge of the circular hole 5a will be scraped flat when the suction plate 107 scrapes the burrs, but the burrs will not be removed from the edge of the circular hole 5a, and the scraping effect is not good. At this time, the spring ball 1010 moves when the suction plate 107 moves, and the spring ball 1010 pops into the circular hole 5a after the burrs on the edge of the circular hole 5a are scraped flat, so that the spring ball 1010 pushes the scraped burrs in the circular hole 5a downward to improve the flatness of the edge of the circular hole 5a.

[0077] After the two suction plates 107 contact each other, the suction holes 107a on the two suction plates 107 are staggered, so that after the two suction plates 107 contact each other, the suction plate 107 corresponding to the suction hole 107a is blocked and closed, and the suction hole 107b is located above the circular hole 5a. At this time, the suction hole 107b is in communication with the circular hole 5a, and the external pump is controlled to start to suck the air of the suction plate 107, so that the debris remaining on the inner wall of the circular hole 5a is sucked away through the suction hole 107b.

[0078] Embodiment 2

[0079] Based on the embodiment 1, as shown in Figure 2 , Figure 4 and Figures 6-9 , it further comprises a collection assembly; the collection assembly comprises an electric push rod 201, a collection bucket 202, a connecting plate 203, a cooling plate 204 and a contact plate 206; the electric push rod 201 is bolted to the fixed frame 4 and located below the electric push rod 101; the telescopic end of the electric push rod 201 is fixedly connected with the collection bucket 202; the collection bucket 202 is fixedly connected with two symmetrical connecting plates 203; each connecting plate 203 is rotatably connected with a cooling plate 204, and a torsional spring is arranged between the rotating shaft of the cooling plate 204 and the connecting plate 203; the upper side of the collection bucket 202 is fixedly connected with a contact plate 206 made of rubber.

[0080] The collection assembly further comprises a cooling plate 205; each cooling plate 204 is fixedly connected with a deformable cooling plate 205.

[0081] The cooling plate 204 is arranged in a semicircular shape, so that the two cooling plates 204 are circular after being contacted, better fit the lower side of the circular hole 5a, and improve the cooling efficiency.

[0082] The working steps of the above embodiment are as follows: During drilling, the electric push rod II 201 and the collecting hopper 202 are controlled to move the connected components upward until the contact plate 206 contacts the lower side of the circuit board body 5. The cooling plate 204 and the cooling plate 205 are pressed tightly against the lower side of the drilling position on the circuit board body 5 under the action of the torsion spring. During drilling, the contact plate 206 supports the lower side of the drilling area on the circuit board body 5 to reduce the vibration generated during drilling and prevent cracks from forming in the circuit board body 5. Drilling begins before the drill bit 104 has penetrated the circuit board body 5. The generated heat accumulates at the bottom of the circular hole 5a and is transferred to the lower side of the drilling position on the circuit board body 5. At this time, the cooling plate 204 cools the lower side of the drilling position on the circuit board body 5 to prevent heat accumulation. After the drill bit 104 drills through the circuit board body 5, the drill bit 104 passes through the circular hole 5a. At this time, the control motor 103 stops the drill bit 104. The drill bit 104 presses downward against the cooling plate 204 and the cooling plate 205. The cooling plate 204 and the cooling plate 205 rotate downward under the action of the torsion spring. The cooling plate 204 is in an inclined state, such as... Figure 9 As shown, the debris generated during drilling falls into the collection hopper 202 under the guidance of the inclined cooling plate 204. After the tip of the drill bit 104 is squeezed against the cooling plate 205, the cooling plate 205 undergoes adaptive deformation, thereby rapidly cooling the tip of the drill bit 104, making it easier for the drill bit 104 to drill through the next round hole 5a.

[0083] Example 3

[0084] Based on Example 2, such as Figures 8-9 As shown, it also includes a scraping assembly; the scraping assembly includes a support plate 301, a spring rod IV 302, a scraper 303, a linkage block 305, and a wedge block 306; each cooling plate 204 has an annular groove 204a; each connecting plate 203 is fixedly connected to a support plate 301; each support plate 301 is fixedly connected to a spring rod IV 302; each spring rod IV 302 has a scraper 303 of elastic material fixedly connected to its telescopic end, and the scraper 303 is located in the annular groove 204a; each spring rod IV 302 has a linkage block 305 fixedly connected to its telescopic part; each cooling plate 204 has a wedge block 306 fixedly connected to it, and the wedge block 306 and the linkage block 305 cooperate with each other.

[0085] The lower side of the scraper 303 and the edge of the annular groove 204a are both arc-shaped to reduce resistance, thereby making it easier for the scraper 303 to enter and exit the annular groove 204a.

[0086] The scraper 303 is arc-shaped, so that the scraper 303 fits the edge of the round hole 5a, increasing the contact area between the scraper 303 and the lower side of the round hole 5a, and improving the scraping efficiency.

[0087] The working steps of the above embodiment are as follows: after the cooling plate 204 is turned downward, the scraping strip 303 is disengaged from the limit of the annular groove 204a, and the wedge-shaped block 306 is turned under the driving of the cooling plate 204 when the cooling plate 204 is turned downward, the linkage block 305 is disengaged from the limit of the wedge-shaped block 306, so that the spring rod IV 302 drives the scraping strip 303 to move a short distance to the side close to the center of the circular hole 5a under the action of the spring force of the spring rod IV 302, when the scraping strip 303 is disengaged from the annular groove 204a, the two ends of the scraping strip 303 made of elastic material are popped out to the inside of the circular hole 5a under the action of the spring force of the spring rod IV 302, so as to increase the contact area between the scraping strip 303 and the lower edge of the circular hole 5a, so that the scraping strip 303 scrapes off the burrs remaining on the lower edge of the circular hole 5a.

[0088] Subsequently, the electric push rod I 101 is controlled to drive the mounting plate 102 and the components connected thereto to move upward to the initial position, the drill bit 104 is disengaged from the circular hole 5a, and the cooling plate 204 is turned upward under the action of the elastic force of the torsional spring, so that the wedge-shaped block 306 contacts the linkage block 305 to drive the linkage block 305 to drive the spring rod IV 302 to compress, the spring rod IV 302 drives the scraping strip 303 to move to the initial position away from the center of the circular hole 5a, and the scraping strip 303 contacts the cooling plate 204, so that the scraping strip 303 is clamped into the annular groove 204a again, and since the lower side of the scraping strip 303 is arranged in an arc shape, the resistance of the scraping strip 303 clamped into the annular groove 204a is reduced.

[0089] The process flow of the automobile radar circuit board processing equipment is as follows:

[0090] I. Cutting

[0091] Purpose: According to the requirements of engineering data MI, cut the large plate into small pieces to meet the requirements of customers;

[0092] Process: large plate material→cutting plate according to MI requirements→plate bonding→rounding and edge grinding→plate output;

[0093] II. Drilling

[0094] Purpose: According to the engineering data, drill the required hole diameter at the corresponding position on the plate material with the required size;

[0095] Process: stack plate pins→plate feeding→drilling→plate unloading→inspection and repair;

[0096] III. Copper plating

[0097] Purpose: Copper plating is to deposit a thin layer of copper on the insulating hole wall by chemical method;

[0098] Process: rough grinding→plate hanging→copper plating automatic line→plate unloading→immersion in dilute sulfuric acid→thick copper plating;

[0099] IV. Pattern transfer

[0100] Purpose: The pattern transfer is to transfer the image on the film to the board.

[0101] Process: (blue oil process): grinding plate→ printing the first side→ drying→ printing the second side→ drying→ exposure→ developing→ inspection; (dry film process): grinding plate→ pressing film→ standing→ alignment→ exposure→ standing→ developing→ inspection;

[0102] Five, pattern plating

[0103] Purpose: Pattern plating is to electroplate a layer of copper layer and a layer of gold, nickel or tin layer with required thickness on the exposed copper layer of the circuit pattern or the hole wall.

[0104] Process: plate→ oil removal→ water washing twice→ micro-etching→ water washing→ pickling→ copper plating→ water washing→ acid immersion→ tin plating→ water washing→ plate removal;

[0105] Six, film stripping

[0106] Purpose: Film stripping is to strip the anti-plating cover film layer with NaOH solution to expose the non-circuit copper layer.

[0107] Process: water film: inserting frame→ alkali immersion→ rinsing→ scrubbing→ machine passing; dry film: plate placement→ machine passing;

[0108] Seven, etching

[0109] Purpose: Etching is to corrode and remove the copper layer at non-circuit parts by chemical reaction.

[0110] Eight, green oil

[0111] Purpose: Green oil is to transfer the pattern of green oil film to the board, which plays a role in protecting the circuit and preventing tin on the circuit during soldering.

[0112] Process: grinding plate→ printing photosensitive green oil→ plate soldering→ exposure→ developing; grinding plate→ printing the first side→ plate drying→ printing the second side→ plate drying;

[0113] Nine, character

[0114] Purpose: Characters are a kind of convenient-to-identify marks provided.

[0115] Process: after green oil final soldering→ cooling and standing→ screen adjustment→ character printing→ post-soldering;

[0116] Ten, gold-plated fingers

[0117] Purpose: A layer of nickel-gold layer with required thickness is plated on the plug fingers to make them more wear-resistant and hard.

[0118] Process: plate→ oil removal→ water washing twice→ micro-etching→ water washing twice→ pickling→ copper plating→ water washing→ nickel plating→ water washing→ gold plating;

[0119] Eleven, tin-plated plate

[0120] Objective: tin spray is a layer of lead tin on the bare copper surface without covering solder resist oil, to protect the copper surface from oxidation, to ensure good soldering performance;

[0121] Process: micro-etching → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and air drying;

[0122] Twelfth, forming

[0123] The forming method by stamping or numerical control milling machine milling out the shape required by the customer includes organic milling, milling plate, hand milling and hand cutting;

[0124] Thirteen, testing

[0125] Through electronic testing, defects affecting functionality such as open circuit and short circuit which are not easily found by visual inspection are detected;

[0126] Fourteen, final inspection

[0127] Through visual inspection of the appearance defects of the board, minor defects are repaired to avoid the problem and defect boards from flowing out.

[0128] Although the present application is described in detail with reference to the above examples, it is apparent to those skilled in the art from this disclosure that various changes or modifications can be made to the present application without departing from the principles and spirit of the application defined in the claims. Therefore, the detailed description of the present disclosure is only used to explain, but not to limit the present application, and the scope of protection is defined by the content of the claims.

Claims

1. A processing equipment for automotive radar circuit boards, comprising a worktable (1), grippers (2), and a robotic arm (3); the worktable (1) is fixedly connected to two grippers (2); the worktable (1) is fixedly connected to the robotic arm (3); characterized in that: It also includes a fixed frame (4), an electric push rod I (101), a mounting plate (102), a motor (103), a drill bit (104), a spring rod I (105), a spring rod II (106), a suction plate (107), a spring rod III (108), and a linkage plate (109); the mechanical arm (3) is fixedly connected to the fixed frame (4); the fixed frame (4) is fixedly connected to the electric push rod I (101); the telescopic end of the electric push rod I (101) is fixedly connected to the mounting plate (102); the mounting plate (102) is fixedly connected to the motor (103); the output shaft of the motor (103) is fixedly connected to the drill bit (104); the mounting plate (102) is fixedly connected to two symmetrically distributed spring rods I (105); the two spring rods... A spring rod II (106) is fixedly connected to each of the telescopic ends of rod I (105); a suction plate (107) is fixedly connected to each telescopic end of spring rod II (106); several suction holes I (107a) are opened on the opposite sides of the two suction plates (107); two symmetrically distributed spring rods III (108) are fixedly connected to the mounting plate (102); a linkage plate (109) is fixedly connected to each telescopic end of spring rod III (108), and the linkage plate (109) cooperates with the suction plate (107); several suction holes II (107b) are opened at the bottom of each suction plate (107); the suction holes I (107a) on the two suction plates (107) are staggered.

2. The automotive radar circuit board processing equipment according to claim 1, characterized in that: It also includes spring balls (1010); several spring balls (1010) are fixed to the underside of each suction plate (107).

3. The automotive radar circuit board processing equipment according to claim 1, characterized in that: The linkage plate (109) is arranged in a fan shape.

4. An automotive radar circuit board processing equipment according to any one of claims 1-3, characterized in that: It also includes a collection assembly; the collection assembly includes an electric push rod II (201), a collection hopper (202), a connecting plate (203), a cooling plate (204), and a contact plate (206); the fixed frame (4) is fixedly connected to the electric push rod II (201), and the electric push rod II (201) is located below the electric push rod I (101); the telescopic end of the electric push rod II (201) is fixedly connected to the collection hopper (202); two symmetrically distributed connecting plates (203) are fixedly connected inside the collection hopper (202); each connecting plate (203) is rotatably connected to a cooling plate (204), and a torsion spring is provided between the rotating shaft of the cooling plate (204) and the connecting plate (203); the upper side of the collection hopper (202) is fixedly connected to the contact plate (206).

5. The automotive radar circuit board processing equipment according to claim 4, characterized in that: The collection assembly also includes a cooling plate (205); each cooling plate (204) is fixed with a deformable cooling plate (205).

6. The automotive radar circuit board processing equipment according to claim 4, characterized in that: The cooling plate (204) is arranged in a semi-circular shape.

7. The automotive radar circuit board processing equipment according to claim 4, characterized in that: It also includes a scraping assembly; the scraping assembly includes a support plate (301), a spring rod IV (302), a scraper (303), a linkage block (305), and a wedge block (306); each cooling plate (204) has an annular groove (204a); each connecting plate (203) is fixedly connected to a support plate (301); each support plate (301) is fixedly connected to a spring rod IV (302); each extension end of each spring rod IV (302) is fixedly connected to a scraper (303), and the scraper (303) is located in the annular groove (204a); each extension part of each spring rod IV (302) is fixedly connected to a linkage block (305); each cooling plate (204) is fixedly connected to a wedge block (306), and the wedge block (306) and the linkage block (305) cooperate with each other.

8. The automotive radar circuit board processing equipment according to claim 7, characterized in that: The scraper (303) is curved on the lower side and the edge of the annular groove (204a).

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