A silver plating structure for ceramic sheet and a method for silver plating ceramic sheet

Abstract

This invention relates to the field of electronic ceramic silver plating technology, and discloses a structure and method for silver plating ceramic sheets. The method involves placing the ceramic sheet in waterproof paper, with a center line at the symmetrical center of the paper dividing it into a first waterproof paper and a second waterproof paper. Parallel fold lines are formed on both sides of the center line in the first and second waterproof papers, with the distance between the two fold lines corresponding to the thickness of the ceramic sheet. This allows for effective control of the ceramic sheet thickness during the silver plating process. Hollow holes are formed in both the first and second waterproof papers, with the center line as the axis of symmetry. The ceramic sheet is placed on the first waterproof paper and pressed against the hollow holes. The size of the hollow holes corresponds to the area of ​​the ceramic sheet to be silvered, facilitating the adjustment of the silver plating area.

Description

Technical Field

[0001] This invention relates to the field of electronic ceramic silver plating technology, specifically to a structure for silver plating ceramic sheets and a method for silver plating ceramic sheets. Background Technology

[0002] Electronic ceramics refer to ceramics that can utilize electrical and magnetic properties in the electronics industry. They have wide applications in energy, home appliances, automobiles, and other fields. Silver plating technology for electronic ceramics is crucial for controlling their quality and improving their electrical performance. Currently, the main silver plating technologies for electronic ceramics include spraying silver, immersion silver, screen printing, electroplating, and vacuum coating. Spraying silver is the most commonly used method, producing a silver layer with high adhesion and good surface quality, but it involves significant paste waste and is cumbersome. Immersion silver involves immersing the ceramic in silver using an immersion machine, followed by a centrifugal process to ensure the silver paste adheres evenly to the substrate surface, and then firing the ceramic. This method is relatively expensive. Screen printing involves printing silver paste onto the ceramic surface and then sintering it at high temperatures, which can cause the silver layer to detach from the ceramic block, leading to product performance failure. Increasing the thickness may result in surface bubbles, affecting product stability. Electroplating can meet the requirements for appearance and adhesion, but controlling the thickness of the plating layer within the holes is difficult. Vacuum coating offers high adhesion but is also expensive. Therefore, existing ceramic silver plating technologies suffer from cumbersome procedures and high costs. Summary of the Invention

[0003] In order to overcome the defects of the prior art, the present invention aims to provide a method for silver plating a ceramic sheet structure and a method for silver plating a ceramic sheet, so as to solve the technical problems of cumbersome silver plating steps and inability to control the silver plating area and thickness of the ceramic sheet in the prior art.

[0004] This invention is achieved through the following technical solution:

[0005] A structure for silver plating ceramic sheets includes waterproof paper and a ceramic sheet silver-plated with the waterproof paper. A center line is set at the symmetrical center of the waterproof paper, which divides the waterproof paper into a first waterproof paper and a second waterproof paper. With the center line as the axis of symmetry, parallel fold lines are set on both sides of the first and second waterproof papers. Hollow holes are set on the first and second waterproof papers with the center line as the axis of symmetry. The ceramic sheet is placed on the first waterproof paper and pressed on the hollow holes. The side of the ceramic sheet closest to the fold line is aligned with the fold line.

[0006] Preferably, the waterproof paper is plastic paper, cellophane, or waxed paper.

[0007] Preferably, the distance between the folds on the first and second waterproof papers corresponds to the thickness of the ceramic sheet.

[0008] Preferably, the size of the hollow hole corresponds to the size of the silver plating area of ​​the ceramic sheet.

[0009] Preferably, the areas of both the first waterproof paper and the second waterproof paper are larger than the area of ​​the ceramic sheet.

[0010] Preferably, the area of ​​the ceramic sheet is larger than the surface area of ​​the hollow hole.

[0011] Preferably, the structure of the waterproof paper and the hollow hole includes circles, squares, rectangles and parallelograms.

[0012] A method for silver plating a ceramic sheet, based on the aforementioned structure for silver plating a ceramic sheet, includes the following steps:

[0013] Select a ceramic piece, place it on one side of the first waterproof paper, align the lower edge of one side of the ceramic piece with the fold line on the first waterproof paper, and press it onto the hollow hole of the first waterproof paper;

[0014] Fold the second waterproof paper along the center line and align the fold line on the second waterproof paper with the top edge of one side of the ceramic piece;

[0015] The second waterproof paper is pressed onto the ceramic sheet, so that the second waterproof paper overlaps with the first waterproof paper; wherein the hollow holes of the first and second waterproof papers correspond to the positions of the ceramic sheet.

[0016] Apply silver paste evenly to the ceramic sheet inside the hollow holes of the first and second waterproof papers using a brush to form a silver-plated surface.

[0017] After applying silver paste to both sides of the ceramic sheet, the waterproof sheet with the silver paste is dried at a certain temperature. Once the silver-plated surface of the ceramic is dry, the ceramic sheet is removed from the waterproof sheet and then placed in a high-temperature furnace. After the furnace is complete, the ceramic sheet cools naturally, thus completing the silver plating process.

[0018] Preferably, the waterproof sheet 1 with silver paste ceramic sheet is dried at 60-80°C for 6-12 hours.

[0019] Preferably, the ceramic sheet is calcined at 700-800℃ for 2-4 hours.

[0020] Compared with the prior art, the present invention has the following beneficial technical effects:

[0021] This invention provides a structure for silver plating ceramic sheets. The ceramic sheet is placed within waterproof paper, which has a center line at its symmetrical center, dividing it into a first waterproof paper and a second waterproof paper. Parallel fold lines are formed on both sides of the center line in the first and second waterproof papers, with the distance between the two fold lines corresponding to the thickness of the ceramic sheet. This allows for effective control of the ceramic sheet thickness during the silver plating process. Hollow holes are formed in both the first and second waterproof papers, with the center line as the axis of symmetry. The ceramic sheet is placed on the first waterproof paper and pressed against the hollow holes. The size of the hollow holes corresponds to the area of ​​the ceramic sheet to be silvered, facilitating the adjustment of the silver plating area.

[0022] Furthermore, the waterproof paper, made of plastic, glassine, or waxed paper, provides support for the silver plating of the ceramic sheet and effectively prevents uneven plating caused by silver and liquid penetrating into the paper.

[0023] Furthermore, the distance between the folds on the first and second waterproof papers corresponds to the thickness of the ceramic sheet, which allows for effective control of the ceramic sheet thickness during the silver plating process, improving the efficiency and quality of silver plating.

[0024] Furthermore, the size of the hollow hole corresponds to the size of the silver plating area of ​​the ceramic sheet, which facilitates the control of the silver plating area of ​​the ceramic sheet.

[0025] Furthermore, the areas of both the first and second waterproof papers are larger than the area of ​​the ceramic sheet, allowing the first and second waterproof papers to completely cover the ceramic sheet, which facilitates silver plating.

[0026] Furthermore, the area of ​​the ceramic sheet is larger than the surface area of ​​the hollow hole, which facilitates silver plating on the ceramic sheet through the hollow hole. At the same time, multiple hollow holes can be set on the first and second waterproof paper. The coverage area of ​​the multiple hollow holes is smaller than that of the ceramic sheet, which facilitates multiple silver plating operations on the ceramic sheet and improves the silver plating efficiency.

[0027] Furthermore, the waterproof paper and hollow hole structures include circular, square, rectangular, and parallelogram shapes, allowing for more flexible use and improving practicality.

[0028] A method for silver plating ceramic sheets uses low-cost materials such as plastic paper, glass paper, and wax paper as raw materials. It utilizes a geometric symmetry method and a hollow structure with controllable size cutout design to match the silver plating area of ​​the ceramic sheet with the hollow structure. It eliminates the need for silver spraying, silver immersion, printing, electroplating, and film coating. Silver plating is completed simply by applying the silver and firing it in an air atmosphere. The silver plating area is adjustable and applicable to various specifications and types of ceramics, thus achieving the goal of simple and low-cost silver plating of ceramic sheets. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure used for silver plating of ceramic sheets in this invention;

[0030] Figure 2 This is a front view of the ceramic sheet in the silver-plated structure of the present invention;

[0031] Figure 3 This is a schematic diagram of the structure of the ceramic sheet wrapped in waterproof paper after being folded in half in this invention;

[0032] Figure 4 This is a side view of the ceramic sheet wrapped in waterproof paper after being folded in half, as described in this invention.

[0033] Figure 5 This is a schematic diagram of the design of the square ceramic silver plating device in Embodiment 1 of the present invention, which is used for silver plating of circular ceramics;

[0034] Figure 6 This is a schematic diagram of the design of the square ceramic silver plating device in Embodiment 2 of the present invention, used for silver plating of square ceramics;

[0035] Figure 7 This is a schematic diagram of the design of the circular ceramic silver plating device in Embodiment 3 of the present invention, used for silver plating of circular ceramics;

[0036] Figure 8 This is a schematic diagram of the design of the circular ceramic silver plating device in Embodiment 4 of the present invention, which is used for silver plating of square ceramics.

[0037] In the diagram: 1-Waterproof paper; 2-Center line; 3-Hollow hole; 4-Fold line; 5-Ceramic sheet; 11-First waterproof paper; 12-Second waterproof paper. Detailed Implementation

[0038] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0039] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0040] The present invention will now be described in further detail with reference to the accompanying drawings:

[0041] The purpose of this invention is to provide a method for silver plating ceramic sheets and a structure for silver plating ceramic sheets, so as to solve the technical problems of cumbersome silver plating steps and inability to control the silver plating area and thickness of ceramic sheets in the prior art.

[0042] Specifically, according to Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the present invention provides a structure for silver plating ceramic sheets, including waterproof paper 1 and a ceramic sheet 5 silver-plated with waterproof paper 1; a center line 2 is set at the symmetrical center position of waterproof paper 1, the center line 2 divides waterproof paper 1 into a first waterproof paper 11 and a second waterproof paper 12, and with the center line 2 as the axis of symmetry, the first waterproof paper 11 and the second waterproof paper 12 are respectively provided with parallel fold lines 4 on both sides of the center line 2, and the first waterproof paper 11 and the second waterproof paper 12 are respectively provided with hollow holes 3 with the center line 2 as the axis of symmetry; the ceramic sheet 5 is placed on the first waterproof paper 11 and pressed on the hollow holes 3, and the side of the ceramic sheet 5 near the fold line 4 is aligned with the fold line 4.

[0043] Specifically, waterproof paper 1 is made of plastic paper, glass paper, or wax paper, and is used as a support material for ceramic silver plating. Waterproof paper can effectively prevent silver and liquid from penetrating into the paper and causing uneven plating.

[0044] Specifically, the distance between the fold lines 4 on the first waterproof paper 11 and the second waterproof paper 12 corresponds to the thickness of the ceramic sheet 5.

[0045] Specifically, the size of the hollow hole 3 corresponds to the size of the silver plating area of ​​the ceramic sheet 5.

[0046] Specifically, the areas of the first waterproof paper 11 and the second waterproof paper 12 are both larger than the area of ​​the ceramic sheet 5.

[0047] Specifically, the area of ​​ceramic sheet 5 is larger than the surface area of ​​hollow hole 3.

[0048] Specifically, the structures of the waterproof paper 1 and the hollow hole 3 include circles, squares, rectangles and parallelograms.

[0049] In this invention, the center line is located at the axis of symmetry of the waterproof paper 1, and is used for positioning the hollow structure and the fold line;

[0050] The hollow hole is a hollow part with a fixed and adjustable size, located inside the main body. The shape of the hollow hole 3 can be adjusted according to the area of ​​ceramic silver plating. The hollow hole 3 divides the waterproof paper 1 into two symmetrical parts with the center line 2 as the axis of symmetry, namely the first waterproof paper 11 and the second waterproof paper 12. The hollow holes 3 are symmetrically distributed in the first waterproof paper 11 and the second waterproof paper 12. The hollow holes 3 appear in pairs with the center line 2 as the axis of symmetry, and are used to expose the ceramic silver plating area. The exposed ceramic area is used for silver plating.

[0051] Fold line 4 is the baseline of the waterproof paper 1 folded with the center line 2 as the axis of symmetry. Fold line 4 is located on the surface of the waterproof paper 1. Fold lines appear in pairs with the center line 2 as the axis of symmetry. The distance between fold line 4 and the center line 2 is half the thickness of the ceramic sheet 5. The distance between the paired fold lines 4 is equal to the thickness of the ceramic sheet 5.

[0052] Hollow holes 3 are cut out on the first waterproof paper 11 and the second waterproof paper 12 according to the silver plating area using devices such as paper cutters, scissors, and hole punches. Hollow holes 3 appear in pairs on the main body with the center line 2 as the axis of symmetry.

[0053] The hollow hole 3 can be circular, square, rectangular, or parallelogram in shape, and its area is equal to the area of ​​the ceramic silver plating, with an area range of 1 mm. 2 ~314mm 2 .

[0054] The distance between the fold line 4 and the center line 2 is determined based on the thickness of the ceramic sheet 5. The distance between the fold line 4 and the center line 2 is half the thickness of the ceramic sheet 5. The distance between paired fold lines 4 is equal to the thickness of the ceramic sheet 5. The thickness of the ceramic sheet 5 ranges from 0.1 mm to 1.0 mm.

[0055] The present invention also provides a method for silver plating of ceramic sheets, based on the above-described structure for silver plating of ceramic sheets, comprising the following steps:

[0056] Select ceramic sheet 5, place ceramic sheet 5 on one side of the first waterproof paper 11 of waterproof paper 1, align the lower edge of one side of ceramic sheet 5 with the fold line 4 on the first waterproof paper 11, and press it on the hollow hole 3 of the first waterproof paper 11.

[0057] Fold the second waterproof paper 12 along the center line 2 and align the fold line 4 on the second waterproof paper 12 with the upper edge of one side of the ceramic piece 5;

[0058] The second waterproof paper 12 is pressed onto the ceramic sheet 5, so that the second waterproof paper 12 overlaps with the first waterproof paper 11; wherein the hollow holes 3 of the first waterproof paper 11 and the second waterproof paper 12 correspond to the positions of the ceramic sheet 5.

[0059] Apply silver paste evenly to the ceramic sheet 5 inside the hollow hole 3 of the first waterproof paper 11 and the second waterproof paper 12 to form a silver-plated surface.

[0060] After applying silver paste to both sides of the ceramic sheet 5, the waterproof sheet 1 with the silver paste on the ceramic sheet 5 is dried at a certain temperature. After the silver-plated surface of the ceramic is dry, the ceramic sheet 5 is removed from the waterproof sheet 1 and then placed in a high temperature for calcination. After calcination is completed, the ceramic sheet 5 cools naturally to complete the silver plating.

[0061] Specifically, the waterproof sheet 1 with silver paste ceramic sheet 5 is dried at 60-80℃ for 6-12 hours.

[0062] Specifically, the ceramic sheet is calcined at 700–800℃ for 2–4 hours.

[0063] Example

[0064] This invention provides several embodiments to further explain and illustrate the ceramic silver plating apparatus and method described herein, as well as the beneficial effects they bring.

[0065] The embodiments use the ceramic silver plating device of the present invention as the material basis. Lead-containing ceramic PbTiO3, lead-free ceramic BaTiO3, pressure-resistant ceramic Al2O3, and pressure-sensitive ceramic ZnO were tested at 20°C. All ceramics were in the shape of discs, with a thickness of 0.8 mm and an area of ​​314 mm². 2 A square ceramic silver plating device was used for silver plating of circular ceramics, with a silver plating area of ​​12.56 mm². 2 The silver plating thickness is 0.1 mm, indicating that the present invention can achieve the predetermined goal, ensuring the adhesion and thickness consistency of the silver plating layer. At the same time, the breakdown field strength (BDS) of the sample was tested, corresponding to Examples 1 to 4.

[0066] Example 1

[0067] Silver plating was performed using a lead-containing ceramic PbTiO3 sample, such as... Figure 5 The design schematic diagram of the square ceramic silver plating device is used for silver plating of circular ceramics; the ceramic sheet 5 is placed on one side of the first waterproof paper 11 of the waterproof paper 1, and the lower edge of one side of the ceramic sheet 5 is aligned with the fold line 4 on the first waterproof paper 11 and pressed on the hollow hole 3 of the first waterproof paper 11.

[0068] Fold the second waterproof paper 12 along the center line 2 and align the fold line 4 on the second waterproof paper 12 with the upper edge of one side of the ceramic piece 5;

[0069] The second waterproof paper 12 is pressed onto the ceramic sheet 5, so that the second waterproof paper 12 overlaps with the first waterproof paper 11; wherein the hollow holes 3 of the first waterproof paper 11 and the second waterproof paper 12 correspond to the positions of the ceramic sheet 5.

[0070] Apply silver paste evenly to the ceramic sheet 5 inside the hollow hole 3 of the first waterproof paper 11 and the second waterproof paper 12 to form a silver-plated surface.

[0071] After applying silver paste to both sides of the ceramic sheet 5, the waterproof sheet 1 with the silver paste on the ceramic sheet 5 is dried at a certain temperature. After the silver-plated surface of the ceramic is dry, the ceramic sheet 5 is removed from the waterproof sheet 1 and then placed in a high temperature for calcination. After calcination is completed, the ceramic sheet 5 cools naturally to complete the silver plating.

[0072] The adhesion, thickness consistency, and BDS of the silver plating layer were evaluated on lead-containing ceramic PbTiO3 samples.

[0073] The test results are shown in Tables 1 to 3.

[0074] Example 2

[0075] The difference between this embodiment and Embodiment 1 is that a lead-free ceramic BaTiO3 sample is used for silver plating, such as... Figure 6 The diagram shows a design schematic of a square ceramic silver plating apparatus used for silver plating of square ceramics; and evaluates the adhesion, thickness consistency, and BDS of the silver plating layer.

[0076] The test results are shown in Tables 1 to 3.

[0077] Example 3

[0078] The difference between this embodiment and Embodiment 1 is that a pressure-resistant ceramic Al2O3 sample is used for silver plating, such as... Figure 7 The diagram shows a design schematic of a circular ceramic silver plating apparatus for silver plating circular ceramics; and the adhesion, thickness consistency, and BDS of the silver plating layer are evaluated.

[0079] The test results are shown in Tables 1 to 3.

[0080] Example 4

[0081] The difference between this embodiment and Embodiment 1 is that silver plating is performed using a pressure-sensitive ceramic ZnO sample, such as... Figure 8 The diagram shows a design schematic of a circular ceramic silver plating apparatus used for silver plating of square ceramics. The adhesion, thickness consistency, and BDS of the silver plating layer were evaluated.

[0082] The test results are shown in Tables 1 to 3.

[0083] Table 1 Results of silver plating adhesion test

[0084]

[0085]

[0086] Note: 1. After the ceramic is silver-plated, wait ten days for a bonding test. The bonding is judged by whether the silver plating layer peels off. If the silver plating layer peels off, the bonding is poor; if the silver plating layer does not peel off, the bonding is good.

[0087] 2. "No peeling" means that the area and thickness of the silver plating layer have not changed. In Examples 1-4, this means that the silver plating area remains at 12.56 mm. 2 And the silver plating thickness is kept at 0.1mm.

[0088] Table 2 Results of silver plating thickness test

[0089] index Example 1 Example 2 Example 3 Example 4 Silver plating thickness 1 0.10 0.10 0.09 0.10 Silver plating thickness 2 0.10 0.10 0.10 0.10 Silver plating thickness 3 0.11 0.10 0.10 0.10 Silver plating thickness 4 0.09 0.11 0.10 0.11 Silver plating thickness 5 0.10 0.10 0.10 0.11 Average silver plating thickness 0.10 0.10 0.10 0.10 Standard deviation 0.0063 0.0040 0.0040 0.0049 Relative standard deviation 0.063 0.039 0.041 0.047

[0090] Note: 1. After the ceramic is silver-plated, immediately use a vernier caliper to measure the silver plating thickness.

[0091] Table 3 BDS Detection Results

[0092] index Example 1 Example 2 Example 3 Example 4 BDS Result 1 215 99 1021 432 BDS Result 2 212 101 1019 430 BDS Result 3 210 102 1025 433 BDS Result 4 216 102 1017 429 BDS Result 5 217 101 1022 436 Average BDS results 214 102 1021 432 Standard deviation 2.61 1.96 2.71 2.45 Relative standard deviation 0.012 0.019 0.0026 0.0057

[0093] Note: After the thickness of the silver plating on the ceramic is measured, the ceramic BDS should be measured immediately using a ferroelectric tester.

[0094] Examples 1-4 demonstrate that the ceramic silver plating apparatus described in this invention achieves high accuracy and low deviation in its application to ceramic silver plating, as well as in the detection of its adhesion, silver plating thickness, and BDS (Body Displacement Detection System). None of the four typical ceramic samples exhibited flaking after silver plating, indicating that the apparatus and method provide good adhesion for the silver plating. The silver plating thickness detection results show that the standard deviation and relative standard deviation are less than 0.010 and 0.10, respectively, indicating that the apparatus and method produce uniform silver plating thickness, meeting the requirement for uniform silver plating thickness. The standard deviation and relative standard deviation of the BDS detection results are less than 3 and 0.05, respectively, indicating that the apparatus and method, after silver plating, effectively improve the accuracy of the ceramic BDS detection results and reduce the deviation of the results.

[0095] The comparison of the above embodiments and test results shows that the ceramic silver plating device and method provided by the present invention can achieve adjustable silver plating area, are applicable to a variety of ceramics, and achieve simple and low-cost silver plating of ceramics. It can also improve the accuracy of ceramic BDS test results and reduce the degree of result deviation.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A structure for silver plating ceramic sheets, characterized in that, The device includes waterproof paper (1) and a ceramic sheet (5) plated with silver on the waterproof paper (1). A center line (2) is set at the center of symmetry of the waterproof paper (1), which divides the waterproof paper (1) into a first waterproof paper (11) and a second waterproof paper (12). With the center line (2) as the axis of symmetry, fold lines (4) are set parallel to each other on the first waterproof paper (11) and the second waterproof paper (12) on both sides of the center line (2). Hollow holes (3) are set on the first waterproof paper (11) and the second waterproof paper (12) with the center line (2) as the axis of symmetry. The ceramic sheet (5) is placed on the first waterproof paper (11) and pressed on the hollow hole (3). The side of the ceramic sheet (5) close to the fold line (4) is aligned with the fold line (4). The distance between the fold lines (4) on the first waterproof paper (11) and the second waterproof paper (12) corresponds to the thickness of the ceramic sheet (5); The size of the hollow hole (3) corresponds to the size of the silver plating area of ​​the ceramic sheet (5); The areas of the first waterproof paper (11) and the second waterproof paper (12) are both larger than the area of ​​the ceramic sheet (5); The area of ​​the ceramic sheet (5) is larger than the surface area of ​​the hollow hole (3).

2. The structure for silver plating ceramic sheets according to claim 1, characterized in that, The waterproof paper (1) is plastic paper, glassine paper or wax paper.

3. The structure for silver plating ceramic sheets according to claim 1, characterized in that, The waterproof paper (1) and the hollow hole (3) have structures including circles, squares, rectangles and parallelograms.

4. A method for silver plating ceramic sheets, based on a structure for silver plating ceramic sheets as described in any one of claims 1-3, characterized in that, Includes the following steps: Select a ceramic piece (5), place the ceramic piece (5) on one side of the first waterproof paper (11) of the waterproof paper (1), align the lower edge of one side of the ceramic piece (5) with the fold line (4) on the first waterproof paper (11), and press it on the hollow hole (3) of the first waterproof paper (11). Fold the second waterproof paper (12) along the center line (2) and align the fold line (4) on the second waterproof paper (12) with the upper edge of one side of the ceramic piece (5); Press the second waterproof paper (12) onto the ceramic sheet (5) so that the second waterproof paper (12) overlaps with the first waterproof paper (11); wherein the hollow holes (3) of the first waterproof paper (11) and the second waterproof paper (12) correspond to the positions of the ceramic sheet (5); Apply silver paste evenly to the ceramic sheet (5) inside the hollow hole (3) of the first waterproof paper (11) and the second waterproof paper (12) to form a silver-plated surface; After the silver paste is applied to both sides of the ceramic sheet (5), the waterproof paper (1) with the silver paste ceramic sheet (5) is dried at a certain temperature. After the silver-plated surface of the ceramic is dried, the ceramic sheet (5) is taken out from the waterproof paper (1) and then the ceramic sheet (5) is placed in a high temperature for calcination. After the calcination is completed, the ceramic sheet (5) is cooled naturally to complete the silver plating.

5. A method for silver plating a ceramic sheet according to claim 4, characterized in that, Waterproof paper (1) with silver paste ceramic sheets (5) is dried at 60~80℃ for 6~12 h.

6. A method for silver plating a ceramic sheet according to claim 4, characterized in that, The ceramic sheet (5) was calcined at 700~800℃ for 2~4 h.

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