A wire bonding transfer structure for a chip

Abstract

The present application relates to a chip welding wire adapter structure, which includes a shell, the shell is used to install the chip, the shell is provided with a plurality of tube shell pins, the distance between two adjacent tube shell pins is greater than the distance between two adjacent chip pins, one end of the tube shell pin is located in the shell, the other end of the tube shell pin is located outside the shell and is used to be electrically connected to the welding wire, an adapter plate is provided in the shell, a plurality of connection channels are provided in the adapter plate, a conductive member is provided in the connection channel, one end of the tube shell pin located in the shell is inserted into one end of the connection channel and is electrically connected to the conductive member, the other end of the connection channel is used to accommodate one end of the chip pin, and the conductive member is used to be electrically connected to one end of the chip pin. The present application has the following effects: it can avoid wire contact as much as possible when the chip is connected to the welding wire.

Description

Technical Field

[0001] This application relates to the field of electronic packaging technology, and in particular, to a wire bonding transfer structure for a chip. Background Art

[0002] Currently, chip packaging refers to the process of packaging a bare chip to protect the chip, provide pin connections, and enhance heat dissipation performance. Chip packaging places the chip in an external package and connects the pins of the chip to an external circuit. The main purpose of chip packaging is to protect the chip from physical damage, provide electrical connections, and reduce heat. Packaging can also provide the mechanical strength of the chip and environmental protection such as moisture and dust prevention.

[0003] With the development of technology, the requirements for the functional integration of chip packaging structures are getting higher and higher. Therefore, many large-sized chips and chip packaging structures have emerged, and accordingly, it is also required that the wire bonds in the packaging structure can meet the requirements of large-sized packaging structures. As a result, the length of the wire bonds is getting longer and longer. However, due to the lack of support, the structure strength of the overly long wire bonds is low, and the manufacturing process of long wire bonds is also more difficult. It is extremely easy to have problems such as unstable wire bonding and wire touching caused by long wire arcs, resulting in the failure of the packaging structure. Summary of the Invention

[0004] In order to avoid wire touching as much as possible when connecting the chip and the wire bond, this application provides a wire bonding transfer structure for a chip.

[0005] A wire bonding transfer structure for a chip provided by this application adopts the following technical solutions:

[0006] A wire bonding transfer structure for a chip includes a housing for installing a chip. The housing is provided with a plurality of header pins. The distance between adjacent header pins is greater than the distance between adjacent chip pins. One end of the header pin is located inside the housing, and the other end of the header pin is located outside the housing and is used for electrically connecting with a wire bond. A transfer board is arranged inside the housing. A plurality of connection channels are formed in the transfer board. Conductive members are arranged in the connection channels. One end of the header pin located inside the housing penetrates into one end of the connection channel and is electrically connected with the conductive member. The other end of the connection channel is used to accommodate one end of a chip pin. The conductive member is used for electrically connecting with one end of the chip pin.

[0007] By adopting the above technical solution, after the chip is installed in the shell, the operator installs the adapter board in the shell, and makes one end of the chip pin pass through one end of the connecting channel, and the end of the tube shell pin located in the shell passes through the other end of the connecting channel, so that the chip pin can be electrically connected to the tube shell pin through the conductive member, and then one end of the welding wire is connected to the end of the tube shell pin located outside the shell. The welding wire is connected to the chip through the tube shell pin and the adapter board, which can realize the transition effect in the jumper process, and can avoid the wire collision caused by the long wire arc crossing as much as possible, improve the wire arc stability, and reduce the difficulty of jumper processing.

[0008] Preferably, the connecting channel includes a first vertical section, a turning section and a second vertical section, the two ends of the turning section are respectively connected to the first vertical section and the second vertical section, one end of the tube shell pin located in the shell body penetrates into the first vertical section, and the second vertical section is used to accommodate one end of the chip pin, and the spacing between each first vertical section is greater than the spacing between each second vertical section.

[0009] By adopting the above technical solution, one end of each pin of the chip is inserted into each second vertical segment, and one end of each tube shell pin is inserted into each first vertical segment, so that the connectable spacing of each chip pin can be expanded, so as to avoid short circuit of the welding wire when connecting the chip pin through the tube shell pin, and facilitate welding wire connection.

[0010] Preferably, the conductive member is a wire, the length direction of the wire is consistent with the length direction of the connection channel, the wire is fixed to the inner wall of the connection channel, and two ends of the wire are respectively connected to one end of the tube shell pin and one end of the chip pin.

[0011] By adopting the above technical solution, the chip pins and the tube shell pins are inserted into the connection channel and then electrically connected through the wire. The connection method is simple and stable, and the chip pins and the tube shell pins can be energized through the wire.

[0012] Preferably, the conductive member includes a first conductive sheet and a second conductive sheet, the first conductive sheet and the second conductive sheet are both located in the connecting channel and their length directions are consistent with the length direction of the connecting channel, the first conductive sheet is located at the bottom of the connecting channel, the second conductive sheet is located at the top of the connecting channel, a support member for supporting the first conductive sheet and the second conductive sheet is provided in the connecting channel, one end of the first conductive sheet and one end of the second conductive sheet are both connected to one end of the tube shell pin, and the other end of the first conductive sheet and the other end of the second conductive sheet are both used to connect to one end of the chip pin.

[0013] By adopting the above technical solution, the support member can support the first conductive sheet and the second conductive sheet, so that the first conductive sheet and the second conductive sheet can be spaced apart, which is convenient for the chip pins and the package pins to be inserted into the connection channel. The connection method is simple and convenient. After the chip pins and the package pins are inserted into the connection channel, both the chip pins and the package pins are located between the first conductive sheet and the second conductive sheet and are connected to the first conductive sheet and the second conductive sheet. The chip pins and the package pins can be energized through the first conductive sheet and the second conductive sheet.

[0014] Preferably, the support member is a support spring, the support spring is provided with an insulating layer, the support spring is located between the first conductive sheet and the second conductive sheet, and two ends of the support spring are respectively connected to the middle of the first conductive sheet and the middle of the second conductive sheet.

[0015] By adopting the above technical solution, the support spring has elasticity. After the chip pins and the package pins are inserted between the first conductive sheet and the second conductive sheet, the first conductive sheet and the second conductive sheet can be pressed on the chip pins and the package pins through the support spring, which can improve the connection convenience between the chip pins, the package pins and the first conductive sheet and the second conductive sheet, and is also convenient for the chip pins and the package pins to be pulled out and separated from between the first conductive sheet and the second conductive sheet.

[0016] Preferably, a plurality of positioning holes are formed in the top of the adapter board, and each of the positioning holes communicates with the top of each connection channel. The housing is covered with a cover body. A plurality of pressing columns are arranged on one side of the cover body facing the adapter board. After passing through the positioning holes, the pressing columns enter the connection channels and press the second conductive sheet towards the first conductive sheet.

[0017] By adopting the above technical solution, after the chip pins and the package pins are inserted between the first conductive sheet and the second conductive sheet, the cover body is covered on the housing, the pressing columns pass through the positioning holes and enter the connection channels, and the pressing columns can press down the second conductive sheet, so that the second conductive sheet can be pressed on the chip pins and the package pins, thereby improving the connection stability between the chip pins, the package pins and the first conductive sheet and the second conductive sheet.

[0018] Preferably, a sliding hole is formed in the housing, a sliding block is arranged in the sliding hole, one side of the adapter board where the connection channel is formed is located on one side of the sliding block, the sliding block is slidably connected to the housing to approach or depart from the adapter board and is locked by a locking member, and the package pins pass through the sliding block and are connected to the sliding block.

[0019] By adopting the above technical solution, after the operator installs the adapter plate in the shell, the sliding block can be slidably installed through the sliding hole. After the sliding block is installed, the tube shell pin is inserted into the connecting channel and connected to the conductive member, and the sliding block is locked by the locking member, thereby improving the stability of the adapter plate and the sliding block after installation, and avoiding the tube shell pin and chip pin from separating from the connecting channel as much as possible.

[0020] Preferably, a limit block is arranged in the shell, the limit block is located on the side of the adapter plate away from the tube shell pin, and a limit groove for limiting the adapter plate is opened on the side of the limit block close to the adapter plate, and the end of the adapter plate is slidably installed in the limit groove.

[0021] By adopting the above technical solution, when installing the adapter plate, the operator can install the adapter plate into the limiting groove, and the adapter plate can be limited by the limiting block, which can improve the stability of the adapter plate after installation.

[0022] Preferably, the locking member includes a connecting piece and a connecting column, one end of the connecting piece is connected to the sliding block, the other end of the connecting piece is provided with a connecting hole, the top of the limit block is provided with a clearance groove, one end of the clearance groove passes through one end of the limit block, one end of the connecting piece with the connecting hole is located in the clearance groove, one end of the connecting column is connected to the side of the cover body facing the chip, and the other end of the connecting column is plugged into the connecting piece through the connecting hole.

[0023] By adopting the above technical solution, when the operator slides and installs the sliding block, the sliding block drives one end of the connecting piece with the connecting hole to slide into the yield groove, so that the sliding block can be limited. After the cover body is covered on the shell, one end of the connecting column is inserted into the connecting hole, so that the connecting piece can be limited. Then, the sliding block can be locked by the connecting piece, which can improve the stability of the sliding block after installation.

[0024] Preferably, a base is provided in the shell, and the base is provided with an installation groove for installing the chip, the cover body is connected with an abutment spring on the side facing the chip, one end of the abutment spring is connected with an abutment plate, the limit block is provided with a sliding groove, one end of the sliding groove passes through the top of the limit block, one end of the abutment plate is located in the sliding groove and is slidably connected to the limit block through the sliding groove, and the abutment plate abuts against the top of the chip through the abutment spring.

[0025] By adopting the above technical solution, when installing the chip, the chip can be placed in the installation groove to position the chip, and then the adapter plate and the sliding block are installed to complete the connection between the chip pins and the tube shell pins. When the cover body is covered on the shell, the abutment sheet slides close to the top of the chip through the sliding groove until it abuts against the top of the chip through the abutment spring, thereby limiting the chip and improving the stability of the chip on the base.

[0026] In summary, the present application includes at least one of the following beneficial technical effects:

[0027] 1. After the chip is installed in the housing, the operator installs the adapter board in the housing, and one end of the chip pin penetrates into one end of the connection channel, and one end of the package pin located inside the housing penetrates into the other end of the connection channel. In this way, the chip pin can be electrically connected to the package pin through the conductive member. Then, one end of the bonding wire is connected to the end of the package pin located outside the housing. The bonding wire is connected to the chip through the package pin and the adapter board, which can play a transitional role in the jumper process, can avoid the wire touch caused by the long wire arc as much as possible, can improve the stability of the wire arc, and reduce the difficulty of jumper processing;

[0028] 2. One end of each pin of the chip is respectively inserted into each second vertical section, and one end of each package pin is respectively inserted into each first vertical section. In this way, the distance that each pin of the chip can be connected can be expanded, which can avoid the short circuit of the bonding wire when connecting the package pin and the chip pin as much as possible, and is convenient for the bonding wire connection;

[0029] 3. After the chip pin and the package pin are inserted between the first conductive sheet and the second conductive sheet, the cover body is covered on the housing, and the pressing column passes through the positioning hole and enters the connection channel, and the pressing column can press down the second conductive sheet, and the second conductive sheet can be pressed on the chip pin and the package pin. In this way, the connection stability of the chip pin, the package pin and the first conductive sheet and the second conductive sheet can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is the overall structural schematic diagram of Embodiment 1 of the present application.

[0031] Figure 2 is the exploded structural schematic diagram of Embodiment 1 of the present application.

[0032] Figure 3 is the exploded structural schematic diagram of another perspective of Embodiment 1 of the present application, which is used to show the abutting piece and the connecting column.

[0033] Figure 4 is the sectional view of Embodiment 1 of the present application, which is used to show the abutting spring.

[0034] Figure 5 is the sectional view of Embodiment 1 of the present application, which is used to show the package pin.

[0035] Figure 6 is Figure 5 the partial enlarged schematic diagram of A in

[0036] Figure 7 is the exploded structural schematic diagram of Embodiment 2 of the present application.

[0037] Figure 8 is Figure 7 The partial enlarged schematic view at position B in

[0038] Figure 9 is the exploded structure schematic view from another perspective of Embodiment 2 of the present application, used to show the pressing column.

[0039] Figure 10 is the cross-sectional view of Embodiment 2 of the present application, used to show the pins of the package.

[0040] Figure 11 is Figure 10 the partial enlarged schematic view at position C in

[0041] Explanation of reference numerals:

[0042] 100, chip;

[0043] 200, housing; 201, sliding hole; 202, limiting block; 203, limiting groove; 204, relief groove; 205, sliding groove;

[0044] 300, sliding block; 301, package pins; 302, connecting piece; 303, connecting hole;

[0045] 400, adapter board; 401, positioning hole;

[0046] 500, connection channel; 501, first vertical section; 502, turning section; 503, second vertical section; 504, support member;

[0047] 600, conductive member; 601, first conductive sheet; 602, second conductive sheet;

[0048] 700, cover body; 701, pressing column; 702, abutting spring; 703, abutting piece; 704, connecting column;

[0049] 800, screw;

[0050] 900, base; 901, mounting groove. Detailed implementation manners

[0051] The present application will be further described in detail below with reference to all the drawings.

[0052] Embodiment 1 of the present application discloses a wire bonding adapter structure for a chip.

[0053] Embodiment 1:

[0054] Referring to Figure 1 and Figure 2The chip welding wire transfer structure includes a shell 200 and a cover body 700. The chip 100 is installed in the shell 200. The cover body 700 is covered on the shell 200. An adapter board 400 is arranged in the shell 200. The shell 200 is penetrated by tube shell pins 301. The pins of the chip 100 are electrically connected to the tube shell pins 301 through the adapter board 400. The tube shell pins 301 are connected to the welding wires, which can realize the transition effect in the jumper process, can avoid the wire collision caused by the long wire arc crossing as much as possible, can improve the wire arc stability, and reduce the difficulty of jumper processing.

[0055] Reference Figure 3 and Figure 4 A base 900 is fixed to the bottom of the housing 200. The base 900 is in a sheet shape and is arranged horizontally. A rectangular mounting groove 901 is provided on the top of the base 900. Glue is applied to the bottom of the chip 100. The bottom of the chip 100 is placed in the mounting groove 901, so that the chip 100 can be glued in the mounting groove 901 and the chip 100 can be positioned. There are two rows of chip 100 pins, both of which are higher than the base 900. The pins of each chip 100 in each row are spaced apart, and the two rows of chip 100 pins face the two side walls of the housing 200 along the width direction. A contact spring 702 is connected to the side of the cover body 700 facing the chip 100, one end of the contact spring 702 is connected to the cover body 700, and the other end of the contact spring 702 is connected to a contact sheet 703. After the cover body 700 is covered on the shell 200, the cover body 700 is detachably connected to the shell 200 by a screw 800, and the contact sheet 703 is tightly pressed against the top of the chip 100 through the contact spring 702.

[0056] Reference Figure 2 and Figure 3 , both side walls of the housing 200 along the width direction are provided with sliding holes 201, and the length direction of the sliding holes 201 is consistent with the length direction of the housing 200. The adapter plate 400 is in a long strip shape and its length direction is consistent with the length direction of the sliding holes 201. The adapter plate 400 is provided with a plurality of connecting channels 500, which pass through from one side of the adapter plate 400 to the other side, and the number of connecting channels 500 is the same as the number of pins of each row of the chip 100. The adapter plate 400 is installed in the housing 200 through the sliding holes 201 and is limited by the limit block 202.

[0057] The limit block 202 is located in the housing 200. There are four limit blocks 202, which are respectively distributed at the four corners of the chip 100. The bottom of the limit block 202 is fixed to the bottom of the housing 200. The limit block 202 is provided with a limit slot 203. After the adapter plate 400 is installed in the housing 200 through the sliding hole 201, the two ends of the adapter plate 400 along the length direction enter the two limit slots 203 respectively, and the pins of each chip 100 in a row are respectively inserted into one end of each connection channel 500.

[0058] A sliding block 300 is provided on one side of the adapter board 400 away from the chip 100. The sliding block 300 is strip-shaped and its length direction is the same as that of the adapter board 400. There are two groups of package pins 301, which are respectively connected to the two sliding blocks 300. The number of package pins 301 in each group is the same as the number of pins of the chips 100 in each row. Each of the package pins 301 in each group is evenly spaced along the length direction of the sliding block 300, and the distance between two adjacent package pins 301 is greater than the distance between two adjacent pins of the chips 100. The middle part of the package pin 301 passes through the top of the sliding block 300, and both ends of the package pin 301 are located on both sides of the sliding block 300. The sliding block 300 is installed on the housing 200 through the sliding hole 201 and locked by the locking member. At the same time, one end of the package pin 301 is inserted into one end of the connection channel 500, and the other end of the package pin 301 is located outside the housing 200 and is electrically connected to the bonding wire.

[0059] A relief groove 204 is formed on one side of the limiting block 202 close to the sliding block 300. The relief groove 204 penetrates through the top of the limiting block 202. A sliding groove 205 is formed on the side of the limiting block 202 away from the relief groove 204, and the sliding groove 205 penetrates through the top of the limiting block 202. After the cover body 700 covers the housing 200, the end of the abutting piece 703 along the length direction enters the sliding groove 205, and the abutting spring 702 pushes the end of the abutting piece 703 to slide to the bottom of the sliding groove 205.

[0060] The locking member includes a connecting piece 302 and a connecting column 704. One end of the connecting piece 302 is connected to the top of the sliding block 300. The other end of the connecting piece 302 faces the limiting block 202 and is provided with a connecting hole 303. The sliding block 300 slides until the end of the connecting piece 302 is inserted into the relief groove 204. The connecting column 704 is connected to the side of the cover body 700 facing the chip 100. The connecting column 704 is vertically arranged. One end of the connecting column 704 is connected to the cover body 700, and the other end of the connecting column 704 passes through the connecting hole 303, so that the connecting column 704 is inserted into the connecting piece 302.

[0061] Refer to Figure 5 And Figure 6, the connection channel 500 includes a first vertical section 501, a turning section 502, and a second vertical section 503. The first vertical section 501 is disposed close to the sliding block 300, and the second vertical section 503 is disposed close to the chip 100. The length directions of both the first vertical section 501 and the second vertical section 503 are consistent with the width direction of the adapter plate 400, and the length direction of the turning section 502 is consistent with the length direction of the adapter plate 400. The two ends of the turning section 502 are respectively communicated with the first vertical section 501 and the second vertical section 503. A conductive member 600 is disposed in the connection channel 500. The conductive member 600 is a wire. The wire extends from the first vertical section 501 through the turning section 502 to the second vertical section 503. The wire is fixed to the inner wall of the connection channel 500. The pin of the chip 100 is inserted into the second vertical section 503 and electrically connected to one end of the wire, and the pin 301 of the package is inserted into the first vertical section 501 and electrically connected to the other end of the wire.

[0062] The implementation principle of Embodiment 1 is as follows: After the operator installs the chip 100 on the base 900, the adapter plate 400 is slidably installed through the sliding hole 201. When the adapter plate 400 moves to the limit groove 203 of the limit block 202, the pin of the chip 100 can be inserted into one end of the connection channel 500 and connected to the wire. By slidably installing the sliding block 300 to the adapter plate 400 through the sliding hole 201, the pin 301 of the package can be inserted into the other end of the connection channel 500 and connected to the wire, so that the pin of the chip 100 and the pin of the package can be electrically connected. After the operator covers the cover body 700 on the housing 200, the abutting piece 703 abuts tightly against the top of the chip 100 through the abutting spring 702. The connecting column 704 is inserted into the connecting piece 302 to lock the sliding block 300, and then the cover body 700 and the housing 200 are connected by screws 800. One end of the bonding wire is connected to the end of the pin 301 of the package outside the housing 200, which can play a transitional role during the jumper process, can avoid the wire touch caused by the long wire arc spanning as much as possible, can improve the stability of the wire arc, and reduce the difficulty of jumper processing.

[0063] Embodiment 2: The difference from Embodiment 1 lies in the different conductive members 600.

[0064] Refer to Figure 7 And Figure 8 , the chip wire transfer structure includes an adapter plate 400. The adapter plate 400 is provided with a connection channel 500. A conductive member 600 is disposed in the connection channel 500. The conductive member 600 includes a first conductive sheet 601 and a second conductive sheet 602. Both the first conductive sheet 601 and the second conductive sheet 602 are made of copper sheets. The first conductive sheet 601 is located at the bottom of the connection channel 500, and the second conductive sheet 602 is located at the top of the connection channel 500.

[0065] Refer to Figure 9 , Figure 10 And Figure 11The connection channel 500 includes a first vertical section 501, a turning section 502, and a second vertical section 503. The first conductive sheet 601 and the second conductive sheet 602 extend from the first vertical section 501 to the second vertical section 503 through the turning section 502. The turning section 502 is provided with a support member 504. The support member 504 adopts a support spring. An insulating layer is provided on the outer surface of the support spring. The support spring is vertically arranged and its two ends are respectively connected to the middle of the first conductive sheet 601 and the middle of the second conductive sheet 602. One end of the tube shell pin 301 that penetrates the first vertical section 501 is located between the first conductive sheet 601 and the second conductive sheet 602 and is connected to the ends of the first conductive sheet 601 and the second conductive sheet 602. One end of the chip 100 pin that penetrates the second vertical section 503 is located between the first conductive sheet 601 and the second conductive sheet 602 and is connected to the ends of the first conductive sheet 601 and the second conductive sheet 602.

[0066] The top walls of the first vertical section 501 and the second vertical section 503 are both provided with positioning holes 401, and the positioning holes 401 penetrate the top of the adapter board 400. A plurality of pressing posts 701 are distributed on the side of the cover body 700 facing the chip 100, and the distribution of each pressing post 701 is consistent with the distribution of each positioning hole 401 and corresponds one to one. The pressing post 701 is vertically arranged, and one end of the pressing post 701 is connected to the cover body 700. After the cover body 700 is covered on the housing 200, the other end of the pressing post 701 is inserted into the connecting channel 500 through the positioning hole 401, and the end of the pressing post 701 presses down the second conductive sheet 602 to the tube shell pin 301 and the chip 100 pin, which can improve the connection stability of the first conductive sheet 601, the second conductive sheet 602 and the tube shell pin 301 and the connection stability of the first conductive sheet 601, the second conductive sheet 602 and the chip 100 pin.

[0067] The implementation principle of Example 2 is as follows: after the pins of the chip 100 are inserted into the second vertical section 503 and the pins of the tube shell 301 are inserted into the first vertical section 501, the cover body 700 is covered on the shell body 200, and the pressing column 701 can press down the second conductive sheet 602, the pins of the chip 100, the first conductive sheet 601 and the second conductive sheet 602, the tube shell pin 301, and the first conductive sheet 601. The two ends of the second conductive sheet 602 can be bent, which can improve the connection stability of the pins of the chip 100, the tube shell pin 301 and the adapter board 400, and can avoid the separation of the pins of the chip 100, the tube shell pin 301 and the adapter board 400 as much as possible. After removing the cover body 700, the pins of the chip 100, the tube shell pin 301 and the adapter board 400 can be easily separated.

[0068] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A chip bonding wire transfer structure, characterized in that: The invention comprises a shell (200), wherein the shell (200) is used to install a chip (100), wherein the shell (200) is provided with a plurality of tube shell pins (301), wherein the distance between two adjacent tube shell pins (301) is greater than the distance between two adjacent chip pins, wherein one end of the tube shell pin (301) is located inside the shell (200), and the other end of the tube shell pin (301) is located outside the shell (200) and is used to be electrically connected to a welding wire, and wherein an adapter plate (400) is provided inside the shell (200). , a plurality of connection channels (500) are provided in the adapter board (400), a conductive member (600) is provided in the connection channel (500), one end of the tube shell pin (301) located in the shell (200) penetrates one end of the connection channel (500) and is electrically connected to the conductive member (600), the other end of the connection channel (500) is used to accommodate one end of the chip (100) pin, and the conductive member (600) is used to be electrically connected to one end of the chip (100) pin; The connecting channel (500) comprises a first vertical section (501), a turning section (502) and a second vertical section (503); two ends of the turning section (502) are respectively connected to the first vertical section (501) and the second vertical section (503); one end of the tube shell pin (301) located in the shell (200) penetrates into the first vertical section (501); the second vertical section (503) is used to accommodate one end of the chip (100) pin; and the spacing between the first vertical sections (501) is greater than the spacing between the second vertical sections (503).

2. The chip bonding wire transfer structure according to claim 1, characterized in that: The conductive member (600) is a wire, the length direction of the wire is consistent with the length direction of the connection channel (500), the wire is fixed to the inner wall of the connection channel (500), and two ends of the wire are respectively connected to one end of the tube shell pin (301) and one end of the chip (100) pin.

3. The chip bonding wire transfer structure according to claim 1, characterized in that: The conductive member (600) comprises a first conductive sheet (601) and a second conductive sheet (602); the first conductive sheet (601) and the second conductive sheet (602) are both located in the connection channel (500) and their length directions are consistent with the length direction of the connection channel (500); the first conductive sheet (601) is located at the bottom of the connection channel (500) and the second conductive sheet (602) is located at the top of the connection channel (500); a support member (504) for supporting the first conductive sheet (601) and the second conductive sheet (602) is provided in the connection channel (500); one end of the first conductive sheet (601) and one end of the second conductive sheet (602) are both connected to one end of the tube shell pin (301); the other end of the first conductive sheet (601) and the other end of the second conductive sheet (602) are both used to connect to one end of the chip (100) pin.

4. The chip bonding wire transfer structure according to claim 3, characterized in that: The support member (504) adopts a support spring, the support spring is provided with an insulating layer, the support spring is located between the first conductive sheet (601) and the second conductive sheet (602), and two ends of the support spring are respectively connected to the middle of the first conductive sheet (601) and the middle of the second conductive sheet (602).

5. The chip bonding wire transfer structure according to claim 3, characterized in that: The adapter plate (400) is provided with a plurality of positioning holes (401) at the top, each of the positioning holes (401) being communicated with the top of each of the connecting channels (500), the shell (200) being covered with a cover body (700), and a plurality of pressing posts (701) being provided on a side of the cover body (700) facing the adapter plate (400), each of the pressing posts (701) passing through the positioning hole (401) and entering into the connecting channel (500) to press the second conductive sheet (602) towards the first conductive sheet (601).

6. The chip bonding wire transfer structure according to claim 5, characterized in that: The housing (200) is provided with a sliding hole (201), a sliding block (300) is arranged in the sliding hole (201), a side of the adapter plate (400) provided with the connecting channel (500) is located on a side of the sliding block (300), the sliding block (300) is slidingly connected to the housing (200) to move closer to or farther away from the adapter plate (400) and is locked by a locking member, and the tube shell pin (301) is penetrated by the sliding block (300) and connected to the sliding block (300).

7. The chip bonding wire transfer structure according to claim 6, characterized in that: A limit block (202) is arranged in the shell (200), and the limit block (202) is located on a side of the adapter plate (400) away from the tube shell pin (301). A limit groove (203) for limiting the adapter plate (400) is provided on a side of the limit block (202) close to the adapter plate (400), and an end of the adapter plate (400) is slidably installed in the limit groove (203).

8. The chip bonding wire transfer structure according to claim 7, characterized in that: The locking member comprises a connecting piece (302) and a connecting column (704), one end of the connecting piece (302) is connected to the sliding block (300), the other end of the connecting piece (302) is provided with a connecting hole (303), a top of the limiting block (202) is provided with a giving way groove (204), one end of the giving way groove (204) passes through one end of the limiting block (202), one end of the connecting piece (302) provided with the connecting hole (303) is located in the giving way groove (204), one end of the connecting column (704) is connected to a side of the cover body (700) facing the chip (100), and the other end of the connecting column (704) is plugged into the connecting piece (302) through the connecting hole (303).

9. The chip bonding wire transfer structure according to claim 7, characterized in that: A base (900) is arranged in the shell (200), and a mounting groove (901) for mounting the chip (100) is provided on the base (900); a contact spring (702) is connected to the side of the cover (700) facing the chip (100), and one end of the contact spring (702) is connected to a contact sheet (703); the limit block (202) is provided with a sliding groove (205), and one end of the sliding groove (205) passes through the top of the limit block (202); one end of the contact sheet (703) is located in the sliding groove (205) and is slidably connected to the limit block (202) through the sliding groove (205); and the contact sheet (703) contacts the top of the chip (100) through the contact spring (702).

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