An electronic device

Abstract

The embodiment of the present application provides an electronic device, which relates to the field of terminal technology. The electronic device includes a fireproof part; a first shell at least has a first plate close to the fireproof part, and a second shell at least has a second plate close to the fireproof part. The first plate is connected to the second plate and forms an accommodating cavity. The fireproof part is located in the accommodating cavity. The fireproof grade of the first plate and the fireproof grade of the second plate are both the highest grade; a covering layer is arranged on at least one side of the shell away from the fireproof part; the shell close to the covering layer also has a third plate, which is arranged on the side of the first plate and / or the second plate close to the covering layer. The fireproof grade of the third plate is less than the highest grade, and the third plate is used to connect the first plate and / or the second plate to the covering layer. As a result, the shell of the electronic device can meet the flame retardant requirements and the adhesion reliability of the covering at the same time.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to an electronic device. Background Art

[0002] With the development of science and technology, the application of consumer electronic products, such as laptops, is becoming more and more popular. These electronic products need to be powered by batteries before they can be used. Under the latest requirements, lithium-ion batteries in electronic devices need to be provided with fireproof enclosures by the whole device, especially for electronic devices without adapters, the fireproof level must reach the highest level.

[0003] Currently, electronic devices have a plain leather version with polyurethane (PU) leather applied to the surface of the board, which helps to enhance the user experience. However, the adhesion between the highest-grade fireproof shell of traditional plain leather electronic devices and PU leather is very poor, resulting in the inability to have both plain leather and the highest-grade fireproof shell.

[0004] Therefore, it is urgent to provide an electronic device to solve the above problems. Summary of the invention

[0005] An embodiment of the present application provides an electronic device, the side of the shell of the electronic device close to the fireproof part can meet the flame retardant requirements, and when the electronic device has a covering, the shell also has a conventional flame retardant grade board between the covering and the highest fireproof grade board. At this time, the conventional flame retardant grade board can be used as the appearance surface of the shell to meet the bonding reliability with the covering.

[0006] To achieve the above objectives, the present application embodiment adopts the following technical solutions:

[0007] In a first aspect, an electronic device is provided, which includes: a part to be fireproofed; a shell, comprising at least a first shell and a second shell, one side of the first shell having a fixed position, the part to be fireproofed is fixed at the fixed position, the second shell is arranged on a side of the part to be fireproofed away from the first shell, the first shell at least has a first plate close to the part to be fireproofed, the second shell at least has a second plate close to the part to be fireproofed, the first plate is connected to the second plate and forms an accommodating cavity, the part to be fireproofed is located in the accommodating cavity, the fire protection grade of the first plate and the fire protection grade of the second plate are both V0 grade; a covering layer, arranged on at least one side of the shell away from the part to be fireproofed; the shell on the side close to the covering layer also has a third plate, the third plate is at least arranged on a side of the first plate and / or the second plate close to the covering layer, the fire protection grade of the third plate is less than V0 grade, and the third plate is at least used to connect the first plate and / or the second plate to the covering layer.

[0008] An embodiment of the present application provides a leather-covered electronic device, wherein the shell includes a plate with the highest fire resistance grade, and the plate with the highest fire resistance grade is close to the part to be fireproofed, thereby meeting the flame retardant requirements; on this basis, when the part to be fireproofed is provided with a covering layer, the shell also includes a plate with a conventional flame retardant grade, and the plate with the conventional flame retardant grade and the plate with the highest fire resistance grade together constitute a composite plate used as the shell of the electronic device, and the plate with the conventional flame retardant grade serves as the appearance surface of the shell, meeting the bonding reliability requirements with the covering layer.

[0009] In a possible implementation of the first aspect, the component to be fireproofed is a battery, and the material of the covering layer is polyurethane.

[0010] In this implementation, the shell can not only achieve flame retardant protection for the battery, but also meet the bonding reliability requirements with polyurethane.

[0011] In a possible implementation of the first aspect, the electronic device further includes an adhesive layer, the adhesive layer is disposed between the housing and the cover layer, the cover layer is bonded to the third plate material via the adhesive layer, and the adhesive layer is a hot melt adhesive film.

[0012] This implementation is simple and easy to implement.

[0013] In a possible implementation of the first aspect, the shell includes a first shell and a second shell, and the PU skin is arranged on a side of the first shell away from the battery, and on a side of the second shell away from the battery; the first shell has a first plate with a V0 flame retardant grade and a third plate with an HB flame retardant grade, and the third plate with an HB flame retardant grade is located on a side of the first plate with a V0 flame retardant grade close to the PU skin, and the second shell has a second plate with a V0 flame retardant grade and a third plate with an HB flame retardant grade, and the third plate with an HB flame retardant grade is located on a side of the second plate with a V0 flame retardant grade close to the PU skin.

[0014] In this implementation, the flame-retardant composite glass fiber board is composed of non-phosphated HB flame-retardant grade board and phosphated V0 flame-retardant grade board. When the shell formed in this way is used in leather-covered electronic equipment, the V0 flame-retardant grade board faces the inner cavity of the whole machine to meet the flame-retardant requirements. At the same time, the conventional flame-retardant grade HB flame-retardant grade board is used as the shell appearance surface to meet the requirements of leather-covered bonding reliability. In this way, while ensuring the integrity of the whole machine, it also meets the requirements of flame retardancy and leather-covered bonding reliability.

[0015] In a possible implementation of the first aspect, the material of the first plate material may include a first glass fiber cloth and a first resin, the first glass fiber cloth having a plurality of first pores, the first resin coating the surface of the first glass fiber cloth and filling the first pores, wherein the first resin has a first resin matrix and a first flame retardant bonded to the first resin matrix, the first flame retardant includes phosphorus or nitrogen, and the first flame retardant is used to enable the first resin to achieve a flame retardant with a highest fire resistance level; and / or, the material of the second plate material may include a second glass fiber cloth and a second resin, the second glass fiber cloth having a plurality of second pores, the second resin coating the surface of the second glass fiber cloth and filling the second pores, wherein the second resin has a second resin matrix and a second flame retardant bonded to the second resin matrix, the second flame retardant includes phosphorus or nitrogen, and the second flame retardant is used to enable the second resin to achieve a flame retardant with a highest fire resistance level.

[0016] In this implementation, the first plate material or the second plate material can achieve a V0 flame retardant grade effect, and the implementation is simple and easy.

[0017] In a possible implementation of the first aspect, the first resin matrix and the second resin matrix are both epoxy resins or phenolic resins having a fire resistance level less than the highest fire resistance level; the first resin and the second resin are both phosphated resins, and the flame retardant providing the phosphorus element includes at least one of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and derivatives of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide; the phosphated resin includes a bisphenol A epoxy resin having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and / or its derivatives, a bisphenol F epoxy resin having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and / or its derivatives, and a bisphenol F epoxy resin having At least one of a polyphenol-type glycidyl ether epoxy resin of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and / or a derivative thereof, an aliphatic glycidyl ether epoxy resin having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and / or a derivative thereof, and a glycidyl ester-type epoxy resin having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and / or a derivative thereof; a derivative of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is obtained by reacting 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide with a polymer, and the polymer has at least one of an aromatic structure, a hydroxyl group, an amino group, and an imino group.

[0018] In this implementation, the first plate material or the second plate material can achieve a V0 flame retardant grade effect, and the implementation is simple and easy.

[0019] In a possible implementation of the first aspect, the material of the third plate material may include a third glass fiber cloth and a third resin, the third glass fiber cloth having a plurality of third pores, the third resin covering the surface of the third glass fiber cloth and filling the third pores, wherein the third resin is an epoxy resin or a phenolic resin having a fire resistance level lower than the highest fire resistance level.

[0020] In this implementation, the third plate material can achieve a bonding effect with the polyurethane, and the implementation is simple and easy.

[0021] In a possible implementation of the first aspect, the fire resistance grade of the third plate is HB grade, the third resin is an epoxy resin or a phenolic resin with a fire resistance grade of HB grade, and the HB grade epoxy resin or the phenolic resin is used to bond with the material of the adhesive layer to achieve bonding between the third plate and the adhesive layer; the epoxy resin has at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, polyphenol glycidyl ether epoxy resin, aliphatic glycidyl ether epoxy resin, and glycidyl ester epoxy resin.

[0022] In this implementation, the third plate material can achieve a bonding effect with the polyurethane, and the implementation is simple and easy.

[0023] In a possible implementation of the first aspect, the shell includes a first shell and a second shell, and the PU skin is arranged on a side of the second shell away from the battery; the first shell has a first plate material with a flame retardant grade of V0, the second shell has a second plate material with a flame retardant grade of V0 and a third plate material with a flame retardant grade of HB, and the third plate material with a flame retardant grade of HB is located on a side of the second plate material with a flame retardant grade of V0 close to the PU skin.

[0024] In this implementation, the first shell only has a first plate with a V0 flame retardant grade, which meets the flame retardant requirements, and the second shell is a composite of a non-phosphated HB flame retardant grade plate and a phosphated V0 flame retardant grade plate. In this way, when the second shell is attached to the PU leather, the V0 flame retardant grade plate faces the inner cavity of the whole machine, meeting the flame retardant requirements, and the conventional flame retardant grade HB flame retardant grade plate is used as the shell appearance surface, meeting the reliability requirements of the covering adhesion.

[0025] In a possible implementation manner of the first aspect, the first shell may further have a fourth plate, which is disposed on a side of the first plate away from the battery, and is used to enhance the strength of the first shell.

[0026] In this implementation, the fourth plate material can enhance the strength of the first shell.

[0027] In a possible implementation of the first aspect, the shell includes a first shell and a second shell, and the PU skin is arranged on the side of the first shell away from the battery; the first shell has a first plate material of V0 grade and a third plate material of HB grade, the third plate material of HB grade is located on the side of the first plate material of V0 grade close to the PU skin, and the second shell has a second plate material of V0 grade.

[0028] In this implementation, the second shell only has the first plate material with V0 flame retardant grade, which meets the flame retardant requirements, and the first shell is composited with non-phosphated HB flame retardant grade plate material and phosphated V0 flame retardant grade plate material. In this way, when the first shell is attached to the PU leather, the V0 flame retardant grade plate material faces the inner cavity of the whole machine, which meets the flame retardant requirements. At the same time, the conventional flame retardant grade HB flame retardant grade plate material is used as the shell appearance surface to meet the reliability requirements of the covering adhesion.

[0029] In a possible implementation manner of the first aspect, the second shell may further have a fourth plate, which is disposed on a side of the second shell away from the battery, and is used to enhance the strength of the second shell.

[0030] In this implementation, the fourth plate material can enhance the strength of the second shell.

[0031] In a possible implementation manner of the first aspect, along a direction perpendicular to the covering layer, a thickness of the third plate material is smaller than a thickness of the first plate material, and a thickness of the third plate material is smaller than a thickness of the second plate material.

[0032] In this implementation, the third plate plays a more adhesive role, so the thickness of the third plate is set to be relatively small, which is conducive to miniaturization, lightness, and thinness of the electronic device.

[0033] In a possible implementation of the first aspect, the forming process of the glass fiber board is as follows: Step 1. The rolled glass fiber cloth is guided by a guide root and enters a glue groove containing resin. The resin impregnates the surface of the glass fiber cloth and enters the pores of the glass fiber cloth to form a glass fiber board; Step 2. The glass fiber board coming out of the glue groove passes through a glue extrusion root, and then is dried in an oven, and cut into pieces using a cutting scissors to form a base sheet; Step 3. The base sheet is passed through a high-temperature and high-pressure pressing plate to form a substrate.

[0034] This implementation is simple and easy to implement and is conducive to industrial production.

[0035] In a possible implementation of the first aspect, the first plate includes at least one layer of a first substrate, the second plate includes at least one layer of a second substrate, and the third plate includes at least one layer of a third substrate; the first substrate and the third substrate are obtained by a high temperature and high pressure press plate, and the second substrate and the third substrate are obtained by a high temperature and high pressure press plate.

[0036] This implementation is simple and easy to implement and is conducive to industrial production.

[0037] In a possible implementation of the first aspect, the first plate material includes a plurality of layers of first substrates, the plurality of layers of first substrates are obtained by pressing plates, and the plurality of layers of first substrates and the third substrate are obtained by pressing plates at high temperature and high pressure; and / or, the second plate material includes a plurality of layers of second substrates, the plurality of layers of second substrates are obtained by pressing plates, and the plurality of layers of second substrates and the third substrate are obtained by pressing plates at high temperature and high pressure.

[0038] This implementation is simple and easy to implement and is conducive to industrial production.

[0039] In a possible implementation of the first aspect, the substrate is typically a single-layer glass fiber board with a thickness of 0.08-0.12 mm.

[0040] In this implementation, a plurality of substrates are composited, stacked, and then hot-pressed to form a flame-retardant composite board.

[0041] In a possible implementation of the first aspect, when the first shell has a thickness of 1.0 mm and has an HB board material, it can be formed by hot pressing one layer of 0.10 mm HB flame retardant substrate and nine layers of 0.10 mm V0 flame retardant substrates.

[0042] In this implementation, a flame retardant composite board can be obtained.

[0043] In a possible implementation of the first aspect, when the thickness of the first shell is 2.0 mm and has an HB plate material, it can be hot-pressed from 1 layer of 0.10 mm HB flame-retardant substrate and 19 layers of 0.10 mm V0 flame-retardant substrate; or, when the thickness of the first shell is 2.0 mm and has an HB plate material, it can be hot-pressed from 2 layers of 0.10 mm HB flame-retardant substrate and 18 layers of 0.10 mm V0 flame-retardant substrate.

[0044] In this implementation, two flame-retardant composite panels can be obtained.

[0045] In a possible implementation manner of the first aspect, when the thickness of the first shell is 1.0 mm and there is no HB board material, it can be formed by hot pressing 10 layers of 0.10 mm V0 flame retardant substrates.

[0046] In this implementation, a flame retardant composite board can be obtained.

[0047] An embodiment of the present application provides an electronic device, wherein the portion of the shell of the electronic device close to the part to be fireproof has the highest fireproof grade, thereby meeting the flame retardant requirements; and, when the electronic device is a leather-covered electronic device, the shell also has a board with a conventional flame retardant grade between the cover and the board with the highest fireproof grade. At this time, the conventional flame retardant grade board can be used as the appearance surface of the shell to meet the bonding reliability requirements with the cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 A schematic diagram of the overall structure of an electronic device provided in an embodiment of the present application;

[0049] Figure 2 for Figure 1 A schematic diagram of a disassembled structure of an electronic device;

[0050] Figure 3 A flame retardant grade schematic diagram provided in an embodiment of the present application;

[0051] Figure 4 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0052] Figure 5 for Figure 4 A schematic diagram of the structure of the electronic device after assembly;

[0053] Figure 6 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0054] Figure 7 for Figure 6 A schematic diagram of the structure of the electronic device after assembly;

[0055] Figure 8 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0056] Fig. 9 for Figure 8 A schematic diagram of the structure of the electronic device after assembly;

[0057] Fig.10 A schematic diagram of a V0 flame retardant grade sheet and a hot melt adhesive pull-out force, and a HB flame retardant grade sheet and a hot melt adhesive pull-out force provided in an embodiment of the present application;

[0058] Fig.11 A schematic diagram of a molding process of a glass fiber board provided in an embodiment of the present application;

[0059] Fig.12 A schematic diagram of a substrate composited into a glass fiber board provided in an embodiment of the present application;

[0060] Fig.13A schematic diagram of a substrate provided in an embodiment of the present application being composited into a first shell;

[0061] Fig.14 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0062] Fig.15 A schematic diagram of the structure of a laptop computer provided in an embodiment of the present application;

[0063] Fig.16 for Fig.15 A schematic structural diagram of a first housing of a notebook computer;

[0064] Fig.17 for Fig.15 A schematic diagram of the back structure of a first shell of a notebook computer;

[0065] Fig.18 A schematic diagram of a partial structure of an electronic device provided in an embodiment of the present application;

[0066] Fig.19 A schematic diagram of the partial structure of another electronic device provided in an embodiment of the present application.

[0067] Reference numerals:

[0068] 01-mobile phone; 100-display screen; 101-middle frame; 102-back cover; 103-circuit board assembly; 1031-main circuit board; 1032-electronic components; 104-battery;

[0069] 02-electronic equipment; 1-part to be fireproofed; 2-shell; 21-first shell; 22-second shell; 211-first plate; 221-second plate; 230-third plate; 3-accommodating cavity; 4-covering layer; 5-adhesive layer; 6-adhesive layer; 7-fourth plate; b1-first surface of the wall panel; F-pulling force; L-dashed line. DETAILED DESCRIPTION

[0070] Unless otherwise defined, the technical and scientific terms used herein have the same meanings as those commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and their variations in the specification, claims and drawings of this application are intended to cover non-exclusive inclusions.

[0071] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.

[0072] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments.

[0073] In the embodiment of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone.

[0074] In addition, the character “ / ” in this article generally indicates that the previous and next associated objects are in an “or” relationship.

[0075] In the embodiments of the present application, "multiple" means more than two (including two). Similarly, "multiple groups" means more than two groups (including two groups), and "multi-layer" means more than two layers (including two layers), unless otherwise clearly specified and limited.

[0076] In the embodiments of the present application, "at least one" means one or more than one.

[0077] In the embodiments of the present application, the orientations or positional relationships indicated by the technical terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, etc., and should not be understood as a limitation on the embodiments of the present application.

[0078] In the embodiments of the present application, the technical terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction between two elements. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application according to the specific circumstances.

[0079] Some of the terms in the embodiments of the present application are explained below so that those skilled in the art can better understand them.

[0080] 1. Flame retardant grade

[0081] Flame retardant grade refers to the property of the material itself or after treatment to significantly delay the spread of flame, and the grade system is divided based on this.

[0082] 2. Glass fiber

[0083] Glass fiber refers to an inorganic non-metallic material with excellent performance, which has the advantages of good insulation, strong heat resistance, good corrosion resistance and high mechanical strength.

[0084] Glass fibers are commonly used as reinforcing materials in composite materials, electrical insulation materials, thermal insulation materials, and many other fields.

[0085] 3. Fiberglass board

[0086] Fiberglass board, also known as fiberglass board, refers to a board made of glass fiber material and high heat-resistant composite material. It has the advantages of high mechanical properties, high dielectric properties, good heat resistance, good moisture resistance and good processability.

[0087] Fiberglass boards can generally be used for soft-pack base layers, and then covered with cloth, leather, etc. The finished products have the characteristics of sound absorption, sound insulation, heat insulation, environmental protection and flame retardancy.

[0088] 4. Fiberglass cloth

[0089] Glass refers to inorganic materials melted at high temperatures (above 800°, daily glass is generally melted at 1100°). Glass will not undergo chemical changes below its softening point, and will only soften, melt or decompose above its softening point, but will not burn.

[0090] Glass fiber cloth refers to glass drawn into extremely fine glass filaments, which have excellent softness. The glass filaments are then spun into yarns and woven into glass fiber cloth using a loom.

[0091] 5. DOPO

[0092] DOPO refers to 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and its molecular formula is C 12 H9O2P.

[0093] 6. Plain leather version

[0094] The plain leather version means that the back of the electronic device is not made of glass, but the entire back cover is made of leather, that is, plain leather. Compared with glass, leather feels more comfortable, silky and handy, the weight of the back cover will also be reduced, and there is no need to worry about the back cover breaking if it falls to the ground. Among them, plain leather refers to the material between leather and genuine leather. For example, a kind of plain leather used in mobile phones is a soft material with a leather feel and appearance. It has the advantages of warmth, skin-friendly, anti-fingerprint, softness, durability, dustproof, waterproof, more wear-resistant than genuine leather, and does not contain any animal ingredients. It is a specially customized artificial leather.

[0095] The above is a brief introduction to the nouns involved in the embodiments of the present application, which will not be repeated below.

[0096] In modern life, electronic devices such as laptops and mobile phones play an increasingly important role and are becoming one of the necessities of people's lives.

[0097] The present application provides an electronic device, and no limitation is imposed on the specific type of the electronic device. In some embodiments, the electronic device may include consumer electronic terminal products, household electronic products, vehicle-mounted electronic products, financial terminal electronic products, and communication electronic products.

[0098] Among them, consumer electronic terminal products may include laptops, tablets (pad), laptops, handheld computers, personal computers (PC), mobile phones, e-readers, desktop displays, cellular phones, drones, personal digital assistants (PDA), smart wearable devices (e.g., smart bracelets, smart watches, headphones, etc.), ultra-mobile personal computers (UMPC), augmented reality (AR) / virtual reality (VR) devices and other Internet of Things (IOT) devices. Home electronic products may include televisions, smart door locks, remote controls, refrigerators, rechargeable small household appliances (e.g., soybean milk machines, sweeping robots, etc.), printers, projectors, etc. Car-mounted electronic products may include car-mounted navigators, car-mounted high-density digital video discs (DVD), etc. Financial terminal electronic products may include automated teller machines (ATMs), self-service terminals, etc. Communication electronic products may include communication equipment such as servers, storage devices, and base stations.

[0099] The embodiments of the present application do not limit the specific form of the electronic device. For the convenience of description, the following description will first be given by taking the electronic device as a mobile phone as an example.

[0100] Please refer to Figure 1 and Figure 2 , Figure 1 is an overall schematic diagram of an electronic device applicable to some embodiments of the present application, Figure 2 for Figure 1 Schematic diagram of the disassembled electronic device shown.

[0101] in, Figure 1 and Figure 2The electronic devices shown are all described by taking a tablet phone as an example. In other embodiments, the electronic device may also be other types of mobile phones, such as a foldable mobile phone.

[0102] exist Figure 1 and Figure 2 In the example of FIG. 1 , the electronic device may include a display screen 100, a middle frame 101, a rear housing 102, a circuit board assembly 103, and a battery 104. It is understood that Figure 1 and Figure 2 The following figures and the related drawings only schematically illustrate some components of the electronic device, and the actual shape, size, position and structure of these components are not subject to Figure 1 and Figure 2 and the limitations of the accompanying drawings below.

[0103] The specific structure of the electronic device to which the embodiments of the present application are applicable is further described below.

[0104] Please refer to Figure 1 and Figure 2 Taking the electronic device as a mobile phone 01 as an example, the mobile phone 01 may include a display screen 100 and a middle frame 101 , and the display screen 100 is located on one side of the middle frame 101 .

[0105] In applications, the display screen 100 can be used to display images, videos, etc.

[0106] It should be noted that the display screen 100 can be any one of a liquid crystal display (LCD), an organic light emitting diode (OLED) display screen, a sub-millimeter light emitting diode (Mini LED) display screen, a micro light emitting diode (Micro LED) display screen, etc.

[0107] exist Figure 1 In the embodiment shown, the shape of the electronic device can be a rectangular flat plate. Of course, the shape of the electronic device can also be any other shape, which depends on the actual application.

[0108] like Figure 2 As shown, the mobile phone 01 may also include structures such as a rear shell 102 , a circuit board assembly 103 and a battery 104 .

[0109] Among them, the back shell 102 can be set on the side of the middle frame 101 away from the display screen 100, and the back shell 102 and the middle frame 101 can enclose an internal storage space of the mobile phone 01, and the internal storage space can accommodate structures such as the circuit board assembly 103 and the battery 104.

[0110] The circuit board assembly 103 may include a main circuit board 1031 and electronic components 1032 , etc. The main circuit board 1031 may be used to carry the electronic components 1032 and perform signal interaction with the electronic components 1032 . Figure 2 The circuit board assembly 103 includes two electronic components 1032 as an example for explanation. Of course, the number of electronic components 1032 may not be limited to two, and the specific number is subject to the actual application. In the application, the main circuit board 1031 may include printed circuit boards (PCB), flexible printed circuits (FPC), etc. In the application, the electronic components 1032 may include but are not limited to chips, resistors, capacitors, inductors, potentiometers, electron tubes, heat sinks, electromechanical components, connectors, semiconductor discretes, sensors, power supplies, switches, micro motors, electronic transformers, relays, subscriber identity modules (SIM) cards, etc.

[0111] The battery 104 mentioned above can be used to provide power to structures in the mobile phone 01 such as the display screen 100 and the circuit board assembly 103 .

[0112] In application, the surface of the middle frame 101 facing the rear shell 102 may be provided with a battery installation slot ( Figure 2 The battery 104 can be installed in the battery installation slot, and a battery cover ( Figure 2 ), so as to protect the battery 104.

[0113] The current battery 104 is generally a chemical battery, which can be divided into: primary battery (primary battery), secondary battery (rechargeable battery) and lead-acid battery according to the working properties. Among them, the primary battery can include paste-type zinc-manganese battery, paper-like zinc-manganese battery, alkaline zinc-manganese battery, button-type zinc-silver battery, button-type manganese-lithium battery, zinc-air battery and primary lithium-manganese battery, etc.; the secondary battery can include cadmium nickel battery, nickel-hydrogen battery, lithium-ion battery and secondary alkaline zinc-manganese battery, etc.; the lead-acid battery can include open lead-acid battery and fully sealed lead-acid battery, etc.

[0114] Of course, the mobile phone 01 may also include other structures such as a microphone, a speaker, a camera assembly, etc. Here, only the contents related to the invention point are introduced, and the rest are not described in detail.

[0115] The fire protection scheme of the above-mentioned battery 104 provided in the related art is introduced in detail below.

[0116] When traditional electronic devices contain lithium-ion batteries, aluminum-plastic film is usually used as the fireproof enclosure of lithium-ion batteries. However, in 2023, in response to the fireproof enclosure issues in Article 6.4.8 and M.4.3 of GB 4943.1-2022 "Audio, video, information technology and communication technology equipment Part 1: Safety requirements", the Secretariat of the National Technical Committee for Safety Standardization of Electronic Products (SAC / TC 588) organized a technical expert committee to discuss and, in accordance with the provisions of the Articles of Association of the Standardization Committee, performed the voting procedures and formed the "National Technical Committee for Safety Standardization of Electronic Products Resolution No. 009" [Fireproof enclosure (secondary lithium battery pack)] resolution, which stipulates that products containing lithium-ion batteries / battery packs do not accept aluminum-plastic film as the fireproof enclosure of the battery, and the fireproof enclosure must be provided by the whole machine.

[0117] Especially for products sold without adapters (for example, some leather keyboard products containing lithium-ion batteries, etc.), methods for controlling the spread of flames should be adopted. Since users may use PS3 power supply, the fire protection level of electronic equipment must reach the highest level.

[0118] Currently, many electronic devices include a plain leather version, which is PU leather applied to the surface of the board.

[0119] As an example, fiberglass board is a commonly used shell material in electronic devices, and its main components are glass fiber cloth and resin. Since glass fiber cloth is usually silicon dioxide (SiO2), it has good flame retardancy itself, so the main factor affecting the fire resistance of fiberglass board is the flame retardant properties of resin. Usually, the highest level of fire protection is achieved through phosphating reaction. However, when phosphating flame retardant sheet is used as shell material, due to the extremely poor phosphating resin molecules, it will seriously deteriorate the bonding performance between the sheet and PU skin, which limits the application of phosphating flame retardant sheet in electronic equipment.

[0120] As another example, when an electronic device includes a plain leather, the fire protection level of the commonly used shell material cannot reach the highest level, and a low-level fire-proof shell material is used, which results in insufficient fire protection ability of the shell material.

[0121] Then, through the above examples, it can be seen that the related technology cannot achieve the highest fire protection level for electronic equipment with plain leather, that is, having plain leather and having the highest fire protection level are not compatible.

[0122] In view of this, an embodiment of the present application provides an electronic device, the shell of which includes a plate with a fire resistance grade of V0, the V0 plate being close to the part to be fireproofed, thereby meeting the flame retardant requirements; and, when the part to be fireproofed is provided with a covering layer, the shell also includes a plate with a conventional flame retardant grade, the conventional flame retardant grade plate and the V0 plate together constitute a composite plate used as the shell of the electronic device, the conventional flame retardant grade plate serving as the appearance surface of the shell, meeting the bonding reliability requirements with the covering layer, thereby effectively improving the performance of the electronic device.

[0123] Combine the following Figures 3 to 19 , the electronic device 02 provided in the embodiment of the present application is introduced in detail.

[0124] like Figures 4 to 19 As shown, the electronic device 02 provided in the embodiment of the present application includes: a fireproof component 1; a housing 2, including at least a first housing 21 and a second housing 22, and one side of the first housing 21 has a fixed position ( Figures 4 to 19 The fireproof member 1 is fixed in the fixed position, the second shell 22 is arranged on the side of the fireproof member 1 away from the first shell 21, the first shell 21 has at least a first plate 211 close to the fireproof member 1, the second shell 22 has at least a second plate 221 close to the fireproof member 1, the first plate 211 is connected to the second plate 221 and forms an accommodating cavity 3, the fireproof member 1 is located in the accommodating cavity 3, the fireproof grade of the first plate 211 and the fireproof grade of the second plate 221 are both the highest grade (V0 grade); the covering layer 4 is arranged on at least one side of the shell 2 away from the fireproof member 1.

[0125] Among them, the shell 2 on the side close to the covering layer 4 also has a third plate 230, and the third plate 230 is at least arranged on the side of the first plate 211 and / or the second plate 221 close to the covering layer 4. The fire protection level of the third plate 230 is less than the highest level (V0 level), and the third plate 230 is at least used to connect the first plate 211 and / or the second plate 221 to the covering layer 4.

[0126] In one or more embodiments, there is no specific limitation on the type of the aforementioned fireproof parts, and the fireproof parts may refer to structures in electronic equipment that can catch fire and burn, such as batteries.

[0127] In one or more embodiments, there is no specific limitation on the type, material, etc. of the shell. For example, the shell can be a fiberglass board, which includes a fiberglass cloth having multiple pores and a resin, wherein the resin covers the surface of the fiberglass cloth and fills the pores.

[0128] It should be understood that the shell includes at least the first shell and the second shell means that: the shell can include only the first shell and the second shell; or, the shell may include other shells in addition to the first shell and the second shell. For example, when the fireproof part is a battery, the first shell can be arranged on the lower surface of the battery, and the second shell can be arranged on the upper surface of the battery. In addition, the shell may also include a third shell and a fourth shell, the third shell is arranged on the left side of the battery, and the fourth shell is arranged on the right side of the battery. Therefore, when the battery is fixed in a fixed position on the first shell, the second shell can be buckled above the battery, the third shell can be buckled on the left side of the battery, and the fourth shell can be buckled on the right side of the battery, and all the shells are connected.

[0129] The above-mentioned one side of the first shell has a fixing position and the fire-proofing component to be fixed at the fixing position may mean that: a groove that does not penetrate the first shell is provided on one surface of the first shell, and the fire-proofing component to be fixed in the groove.

[0130] It should be understood that the first shell having at least a first plate close to the part to be fireproof means that the first shell may only have the first plate close to the part to be fireproof; or, in addition to the first plate close to the part to be fireproof, the first shell may also have other plates, for example, a third plate.

[0131] The structure of the first shell can be determined based on whether a coating layer is provided on the side of the first shell away from the part to be fireproofed. Specifically, when a coating layer is provided on the side of the first shell away from the part to be fireproofed, the first shell has a first plate and a third plate, and the third plate is provided on the side of the first plate away from the part to be fireproofed; when a coating layer is not provided on the side of the first shell away from the part to be fireproofed, the first shell may only have the first plate, and the electronic device can be made thinner and lighter. Of course, when a coating layer is not provided on the side of the first shell away from the part to be fireproofed, the first shell may also have a third plate, which is not specifically limited here.

[0132] It should be noted that the structure of the second shell can refer to the structure of the first shell and will not be repeated here.

[0133] The first plate and the second plate are connected to form the accommodating cavity, which may mean that an edge of the first plate and an edge of the second plate are connected to form the accommodating cavity, which is subject to actual application.

[0134] In one or more embodiments, the covering layer is arranged on at least one side of the shell away from the fireproof component, which means: the covering layer is arranged on one side of the fireproof component; or, the covering layer is arranged on multiple sides of the fireproof component, which depends on the actual application.

[0135] As an example, Figure 4 and Figure 5 As shown, the covering layer 4 is arranged on the upper and lower sides of the fireproof member 1. It should be noted that Figure 4 This is a schematic diagram of the structures not being combined together. Figure 5 Yes Figure 4 A schematic diagram showing the structures in FIG. Figure 5 As shown, when the first plate 211 and the second plate 221 are connected, they can be bonded together using the adhesive layer 6. Of course, it is not limited thereto, the first plate 211 and the second plate 221 can also be connected by a mortise and tenon structure, a snap-fit ​​structure, etc., which is subject to actual application.

[0136] As another example, Figure 6 and Figure 7 As shown, the covering layer 4 is arranged on the upper side of the fireproof member 1. It should be noted that, Figure 6 This is a schematic diagram of the structures not being combined together. Figure 7 Yes Figure 4 Schematic diagram of the structures combined together.

[0137] As another example, Figure 8 and Fig. 9 As shown, the covering layer 4 is arranged on the lower side of the fireproof member 1. It should be noted that, Figure 8 This is a schematic diagram of the structures not being combined together. Fig. 9 Yes Figure 4 Schematic diagram of the structures combined together.

[0138] The material of the covering layer is not specifically limited. For example, the material of the covering layer may be polyurethane (PU) or the like.

[0139] The third plate material is at least arranged on a side of the first plate material and / or the second plate material close to the covering layer, which means that: when the shell only includes the first shell and the second shell, the third plate material can be arranged only on a side of the first plate material and / or the second plate material close to the covering layer; or, when the shell also includes other shells, in addition to being arranged on a side of the first plate material and / or the second plate material close to the covering layer, the third plate material can also be arranged on a side of the other shell material close to the covering layer, which is not specifically limited here.

[0140] In one or more embodiments, Figures 4 to 19 As shown, the electronic device further includes an adhesive layer 5 , which is disposed between the housing 2 and the cover layer 4 , and the cover layer 4 is bonded to the third plate material 230 via the adhesive layer 5 .

[0141] In the application, the type of the adhesive layer is not specifically limited. For example, the adhesive layer may include a hot melt adhesive film. Further, the hot melt adhesive in the hot melt adhesive film may be a thermosetting hot melt adhesive HT165, a thermosetting hot melt adhesive 5804, a thermoplastic hot melt adhesive 508, a thermoplastic hot melt adhesive 6602, a thermoplastic hot melt adhesive BW2, etc.

[0142] In one or more embodiments, the embodiments of the present application are applied to leather-covered electronic devices, such as plain leather mobile phones, leather case keyboards, plain leather tablets, etc.

[0143] The fire protection grade (also known as flame retardant grade) is introduced in detail below.

[0144] like Figure 3 As shown, the fire protection level increases step by step from HB level, V2 level, V1 level to V0 level.

[0145] The above HB grade is the lowest fire rating in the UL94 standard, requiring that for samples with a thickness of 3mm-13mm, the burning speed is less than 40mm / min, and for samples with a thickness of less than 3mm, the burning speed is less than 70mm / min, or, it is extinguished before the 100mm mark. The V2 grade means that after the sample is subjected to two 10s combustion tests, the flame is extinguished within 60s, and burning materials can fall off. The V1 grade means that after the sample is subjected to two 10s combustion tests, the flame is extinguished within 60s, and no burning materials can fall off. The V0 grade is the highest grade, which means that after the sample is subjected to two 10s combustion tests, the flame is extinguished within 30s after the sample is exposed to the flame for 10s, and no burning materials can fall off and cannot catch fire.

[0146] The fire resistance level of the third board material is lower than the highest level, which means that the fire resistance level of the third board material can be any one of HB level, V2 level and V1 level.

[0147] In the past, flame retardant glass fiber boards made of halogen-containing resin and glass fiber cloth were often used in related technologies. However, halogen-containing resins are not environmentally friendly, so halogen-free resins came into being. Halogen-free resins can reach V0 level through phosphating reactions. For example, P atoms can be introduced through phosphorus-hydrogen (PH) bonds to improve the flame retardant properties of glass fiber boards.

[0148] However, the polarity of the resin molecular chain of the glass fiber board deteriorates after phosphating. When the electronic device has a plain leather version, that is, the plain leather is applied to the surface of the glass fiber board through a hot melt adhesive film for bonding, the bonding performance between the glass fiber board and the plain leather will be seriously deteriorated due to the poor polarity of the phosphated resin molecules. As a result, the conventional coating process is far from meeting the reliability test requirements of the bonding monomer, limiting the application of phosphated flame-retardant glass fiber boards in electronic equipment.

[0149] Based on this, an embodiment of the present application provides an electronic device, the shell of the electronic device includes a plate with the highest fire resistance grade, and the plate with the highest fire resistance grade is close to the part to be fireproofed, so as to meet the flame retardant requirements; on this basis, when the part to be fireproofed is provided with a covering layer, the shell also includes a plate with a conventional flame retardant grade, and the plate with the conventional flame retardant grade and the plate with the highest fire resistance grade together constitute a composite plate used as the shell of the electronic device, and the plate with the conventional flame retardant grade serves as the appearance surface of the shell, meeting the bonding reliability requirements with the covering layer.

[0150] Alternatively, as an implementable approach, such as Figure 4 and Figure 5 As shown, the shell includes a first shell 21 and a second shell 22, and the PU skin is arranged on the side of the first shell 21 away from the battery, and on the side of the second shell 22 away from the battery; the first shell 21 has a first plate 211 with a V0 flame retardant grade and a third plate 230 with a HB flame retardant grade, and the third plate 230 with a HB flame retardant grade is located on the side of the first plate 211 with a V0 flame retardant grade close to the PU skin, and the second shell 22 has a second plate 221 with a V0 flame retardant grade and a third plate 230 with a HB flame retardant grade, and the third plate 230 with a HB flame retardant grade is located on the side of the second plate 211 with a V0 flame retardant grade close to the PU skin.

[0151] In one or more embodiments, the material of the first plate is not specifically limited. For example, the material of the first plate may include a first glass fiber cloth and a first resin, wherein the first resin may be a phosphating resin, for example, a phosphating epoxy resin, a phosphating phenolic resin, etc. Considering factors such as environmental protection, the first resin is a phosphating epoxy resin.

[0152] In the application, the phosphated resin may refer to a resin obtained by reacting a conventional resin with an organic phosphorus flame retardant intermediate and its derivatives. The organic phosphorus flame retardant intermediate and its derivatives may be, for example, DOPO (molecular formula: ) and its derivatives.

[0153] Taking phosphating epoxy resin as an example, the epoxy resin in the phosphating epoxy resin may include bisphenol A type epoxy resin (molecular formula is ), bisphenol F type epoxy resin, polyphenol type glycidyl ether epoxy resin, aliphatic glycidyl ether epoxy resin, glycidyl ester type epoxy resin, etc.

[0154] Taking bisphenol A epoxy resin as an example, bisphenol A epoxy resin contains polar groups such as epoxy groups, ether bonds and hydrogen bonds, which help to improve the reactivity, wettability and adhesion of the resin. The PH bond in DOPO is very active and can react with epoxy groups (-C3H5O), ether bonds (RO-R'), hydroxyl groups (-OH) and the like in epoxy resin. Therefore, by introducing DOPO and its derivatives, the p element can be introduced into bisphenol A epoxy resin to obtain phosphated bisphenol A epoxy resin. If the battery unfortunately burns, phosphoric acid and the like can be formed during the combustion process. Phosphoric acid is volatile and can form a film that isolates oxygen, so that the first board achieves the effect of V0 flame retardant grade.

[0155] In addition, the PH bond in DOPO is very active and can react with many groups to generate many derivatives. For example, DOPO can be reacted with polymers containing aromatic structures, hydroxyl groups, amino groups (-NH2), imino groups (-NH-), etc.

[0156] For example, There are many more examples, of course, and I won’t list them all here.

[0157] It should be noted that the second plate can be set with reference to the first plate, which will not be repeated here.

[0158] In one or more embodiments, the material of the third plate is not specifically limited. For example, the material of the third plate may include a third glass fiber cloth and a third resin, and the third resin may be an epoxy resin, a phenolic resin, etc. Considering factors such as environmental protection, the third resin is epoxy resin.

[0159] Further, the third resin may include bisphenol A type epoxy resin, bisphenol F type epoxy resin, polyphenol type glycidyl ether epoxy resin, aliphatic glycidyl ether epoxy resin, glycidyl ester type epoxy resin, and the like.

[0160] It should be understood that the bisphenol A epoxy resin has polar groups such as epoxy groups, ether bonds and hydrogen bonds, which help to improve the reactivity, wettability and adhesion of the third resin.

[0161] Fig.10 The results of pull-out force tests between the film layers composed of thermosetting hot melt adhesive HT165 (thermosetting HT165), thermosetting hot melt adhesive 5804 (thermosetting 5804), thermoplastic hot melt adhesive 508 (thermoplastic 508), thermoplastic hot melt adhesive 6602 (thermoplastic 6602), and thermoplastic hot melt adhesive BW2 (thermoplastic BW2) and the V0 flame retardant grade plate and HB flame retardant grade plate in the embodiments of the present application are shown in Table 1 below.

[0162] in, Fig.10The horizontal axis represents the pull-out force, and the unit is Newton (N).

[0163] Table 1

[0164]

[0165] Depend on Fig.10 Combined with Table 1, it can be seen that the pull-out force between V0 flame retardant grade sheet and all hot melt adhesive films is small, almost less than 3N, and most of them are less than 2N; while the pull-out force between HB flame retardant grade sheet and thermoplastic hot melt adhesive film is large, generally greater than 20N.

[0166] This is because: although the introduction of P element through phosphating reaction can improve the flame retardant properties of the board, the polarity of the resin molecules after phosphating becomes worse, and the resin molecules after phosphating no longer contain epoxy groups, ether bonds and other reactive groups, which makes it impossible to react with hot melt adhesive, affecting the pull-out force between the board and the hot melt adhesive film. The pull-out force is generally less than 2N, resulting in a very small force to pull up the V0 flame retardant grade board. Therefore, the V0 flame retardant grade board cannot achieve good bonding with the hot melt adhesive. The epoxy groups, ether bonds and other groups in the resin molecules of the HB flame retardant grade board can react with the hot melt adhesive, so that the pull-out force between the board and the hot melt adhesive film is usually greater than 20N. Therefore, the HB flame retardant grade board can achieve good bonding with the hot melt adhesive.

[0167] It should be noted that the reference standard is assumed to be 20N, but it is certainly not limited to 20N.

[0168] And by Fig.10 It can also be found that the skin adhesion pull-out force of the flame-retardant composite board provided in the embodiment of the present application is significantly improved compared with the conventional V0 flame-retardant board (all > 20N).

[0169] It should be noted that, first, the glass fiber board monomer flame retardant certification S.1 / S.2 test of the embodiment of the present application has passed.

[0170] Second, the tensile strength test of the glass fiber board in the embodiment of the present application is carried out using a universal testing machine. Fig.18 As shown, the covering layer 4 is cut open along the dotted line L, and then pulled upward by a universal testing machine, and the universal testing machine obtains the value of the pulling force F.

[0171] in addition, Fig.19 A schematic diagram of the partial structure of another electronic device provided in an embodiment of the present application.

[0172] It should be noted that Fig.18 and Fig.19The outermost dotted frame is because the entire structure of the electronic device is not drawn, but only a part of the structure is drawn exemplarily. The part within the dotted frame is a local structure diagram of the electronic device, and the boundary is represented by a dotted frame.

[0173] In the electronic device provided in the embodiment of the present application, the flame-retardant composite glass fiber board is composited by a non-phosphated HB flame-retardant grade board and a phosphated V0 flame-retardant grade board. When the shell formed in this way is applied to a leather-covered electronic device, the V0 flame-retardant grade board faces the inner cavity of the whole device to meet the flame-retardant requirements. At the same time, the conventional flame-retardant grade HB flame-retardant grade board is used as the outer surface of the shell to meet the requirements of the reliability of the leather-covering bonding. Therefore, while ensuring the integrity of the whole device, the flame-retardant and leather-covering bonding reliability requirements are also met.

[0174] Alternatively, as an implementable approach, Figure 6 and Figure 7 As shown, the shell includes a first shell 21 and a second shell 22, and the PU skin is arranged on the side of the second shell 22 away from the battery; the first shell 21 has a first plate 211 with a V0 flame retardant grade, and the second shell 22 has a second plate 221 with a V0 flame retardant grade and a third plate 230 with a HB flame retardant grade, and the third plate 230 with a HB flame retardant grade is located on the side of the second plate 211 with a V0 flame retardant grade close to the PU skin.

[0175] Refer to Figure 6 and Figure 7 The first shell 21 may further include a fourth plate 7 , which is disposed on a side of the first plate 211 away from the battery. The fourth plate 7 is used to enhance the strength of the first shell 211 .

[0176] In the application, the type of the fourth plate is not specifically limited. For example, the fourth plate can be a plastic plate, a metal plate, etc. In this case, the first plate can be attached to the fourth plate. The method of attaching the first plate to the fourth plate is not specifically limited. For example, the first plate can be attached to the fourth plate by an adhesive.

[0177] In the electronic device provided in the embodiment of the present application, the first shell only has the first plate material with V0 flame retardant grade, which meets the flame retardant requirements, and the second shell is composed of a composite of a non-phosphated HB flame retardant grade plate material and a phosphated V0 flame retardant grade plate material. In this way, when the second shell is attached to the PU leather, the V0 flame retardant grade plate material faces the inner cavity of the whole machine, which meets the flame retardant requirements, and the conventional flame retardant grade HB flame retardant grade plate material is used as the shell appearance surface, which meets the reliability requirements of the covering adhesion.

[0178] Alternatively, as an implementable approach, Figure 8 and Fig. 9As shown, the shell includes a first shell 21 and a second shell 22, and the PU skin is arranged on the side of the first shell 21 away from the battery; the first shell 21 has a first plate 211 of V0 grade and a third plate 230 of HB grade, and the third plate 230 of HB grade is located on the side of the first plate 211 of V0 grade close to the PU skin, and the second shell 22 has a second plate 221 of V0 grade.

[0179] Refer to Figure 8 and Fig. 9 The second shell 22 may further include a fourth plate 7 , which is disposed on a side of the second shell 22 away from the battery. The fourth plate 7 is used to enhance the strength of the second shell 22 .

[0180] In the application, the type of the fourth plate is not specifically limited. For example, the fourth plate can be a plastic plate, a metal plate, etc. In this case, the second plate can be attached to the fourth plate. The method of attaching the second plate to the fourth plate is not specifically limited. For example, the second plate can be attached to the fourth plate by an adhesive.

[0181] In the electronic device provided in the embodiment of the present application, the second shell only has the first plate material with a flame retardant grade of V0, which meets the flame retardant requirements, and the first shell is composited with a non-phosphated HB flame retardant grade plate material and a phosphated V0 flame retardant grade plate material. In this way, when the first shell is attached to the PU leather, the V0 flame retardant grade plate material faces the inner cavity of the whole machine, which meets the flame retardant requirements. At the same time, the conventional flame retardant grade HB flame retardant grade plate material is used as the shell appearance surface, which meets the reliability requirements of the covering adhesion.

[0182] Optionally, as a feasible manner, along a direction perpendicular to the covering layer, the thickness of the third plate material is smaller than the thickness of the first plate material, and the thickness of the third plate material is smaller than the thickness of the second plate material.

[0183] In the electronic device provided in the embodiment of the present application, since the third plate has a greater role of bonding, the thickness of the third plate is set to be relatively small, which is conducive to miniaturization, lightness, etc. of the electronic device.

[0184] Combine the following Figures 11 to 14 , the molding process of the glass fiber board in the electronic device 02 provided in the embodiment of the present application is introduced in detail.

[0185] Please combine Fig.11 and Fig.12 , the molding process of glass fiber board is as follows:

[0186] S1. Fig.11 As shown, the rolled glass fiber cloth is guided by the guide root and enters the glue groove containing resin. The resin impregnates the surface of the glass fiber cloth and enters the pores of the glass fiber cloth to form a glass fiber board.

[0187] S2. Fig.11 As shown, the fiberglass board coming out of the glue tank is squeezed out of the glue root, then dried in an oven, and cut into pieces using a cutting pair to form a base sheet.

[0188] It should be noted that when the resin in the glue tank is a phosphating resin, the formed substrate is a V0 flame retardant grade substrate.

[0189] When the resin in the glue tank is conventional epoxy resin, the formed substrate is an HB flame retardant grade substrate.

[0190] S3. Fig.12 As shown, the substrate is passed through a high temperature and high pressure press plate to form a base material.

[0191] The embodiment of the present application provides a molding process for a glass fiber board, which is simple, easy to implement, and conducive to industrial production.

[0192] Optionally, as a feasible method, the first plate includes at least one layer of the first substrate, the second plate includes at least one layer of the second substrate, and the third plate includes at least one layer of the third substrate; the first substrate and the third substrate are obtained by a high temperature and high pressure press plate, and the second substrate and the third substrate are obtained by a high temperature and high pressure press plate.

[0193] Furthermore, the first plate material includes a plurality of first substrates, the plurality of first substrates are pressed together by a pressing plate, and the plurality of first substrates and the third substrate are pressed together by a pressing plate under high temperature and high pressure.

[0194] Furthermore, the second plate material includes a plurality of second substrates, the plurality of second substrates are pressed together by a press plate, and the plurality of second substrates and the third substrate are pressed together by a press plate under high temperature and high pressure.

[0195] In applications, the substrate is usually a single-layer glass fiber board of 0.08-0.12 mm. The thickness of the substrate in a direction perpendicular to the covering layer is not specifically limited. For example, the thickness of the substrate can be 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm or 0.12 mm.

[0196] It should be noted that the covering layer in the embodiment of the present application is actually a three-dimensional structure. Here, the covering layer is regarded as a two-dimensional structure only for the convenience of explaining the thickness of the substrate.

[0197] Therefore, the flame-retardant composite board in the above embodiment can be obtained by compounding and stacking a plurality of such single-layer glass fiber boards and then subjecting them to hot pressing molding.

[0198] In applications, the number of substrate layers of the glass fiber board can be designed according to the size of the shell.

[0199] As an example, Fig.13As shown, when the thickness of the first shell 21 is 1.0 mm and the HB plate material is used, it can be formed by hot pressing one layer of 0.10 mm HB flame retardant substrate and nine layers of 0.10 mm V0 flame retardant substrate.

[0200] As another example, when the thickness of the first shell is 2.0 mm and has an HB board material, it can be hot-pressed with 1 layer of 0.10 mm HB flame-retardant substrate and 19 layers of 0.10 mm V0 flame-retardant substrate; or, when the thickness of the first shell is 2.0 mm and has an HB board material, it can be hot-pressed with 2 layers of 0.10 mm HB flame-retardant substrate and 18 layers of 0.10 mm V0 flame-retardant substrate.

[0201] As another example, when the thickness of the first shell is 1.0 mm and there is no HB board material, it can be formed by hot pressing 10 layers of 0.10 mm V0 flame retardant substrates.

[0202] It should be noted that the thickness of the first shell is generally 0.6 mm or 0.8 mm. The second shell can be configured with reference to the first shell, which will not be described in detail here.

[0203] Fig.14 The figure shows a schematic diagram of a composite sheet material that has been hot pressed and laminated for use in a complete machine housing. Fig.14 As shown, the V0 flame-retardant sheet faces the battery compartment side and has a flame-retardant effect, and the HB flame-retardant sheet faces the product appearance surface and is used for covering bonding.

[0204] In the electronic device provided in the embodiment of the present application, the substrate is made by a high-temperature and high-pressure pressing plate, has high strength, and is simple and easy to manufacture.

[0205] The specific application scenarios of the glass fiber board in the embodiment of the present application are introduced in detail below.

[0206] The fiberglass board of the embodiment of the present application can be specifically applied to a leather-covered middle frame, a leather-covered outer shell, a leather-covered wire filler, a leather-covered mobile phone battery cover, a leather-covered leather case keyboard shell, and the like.

[0207] Optionally, as an implementable approach, Fig.15 A schematic diagram showing an electronic device which is a laptop computer is shown. The laptop computer may be a common laptop computer or a gaming laptop computer.

[0208] like Fig.15As shown in FIG. 1 , a laptop computer may include a display screen, a host computer, a keyboard, and a touch component. The keyboard and the touch component are used to input instructions or data, and are arranged on the host computer. The host computer is used as the control center of the laptop computer, and is used to realize functions such as data storage, calculation, control, and signal conversion. The host computer and the display screen are rotatably connected, so that the laptop computer can switch between an open state and a closed state. When the laptop computer is in an open state, please refer to Fig.15 , Fig.15 The laptop computer shown is in an open state, and the display is opened at a certain angle relative to the host, and the angle can be greater than 0° and less than 180°. When the laptop computer is in a closed state, the display covers the surface of the host on which the keyboard and the touch component are arranged.

[0209] The following mainly introduces the host.

[0210] Please continue reading Fig.15 , the host is roughly in the shape of a rectangular flat plate. On this basis, in order to facilitate the description of each embodiment below, an XYZ coordinate system is established, and the length direction of the host is defined as the X-axis direction, the width direction of the host is defined as the Y-axis direction, and the thickness direction of the host is defined as the Z-axis direction. It can be understood that the coordinate system setting of the host can be flexibly set according to actual needs, and no specific limitation is made here. In some other embodiments, the shape of the host can also be a square flat plate, a circular flat plate, an elliptical flat plate, etc.

[0211] Please continue reading Fig.15 The host comprises a housing 2, the housing 2 comprises a first housing 21 (also referred to as a C part) and a second housing 22 (also referred to as a D part) connected to the first housing 21, a receiving cavity is formed between the first housing 21 and the second housing 22, and the receiving cavity can be used to receive components such as a battery, a circuit board, and a fan. The keyboard and the touch assembly are arranged on the first housing 21, and specifically, the first housing 21 comprises a wall panel, and the keyboard and the touch assembly are arranged on the wall panel.

[0212] The touch assembly and the first housing 21 constitute a housing assembly, and the specific structure of the housing assembly will be described in detail below.

[0213] Fig.16 for Fig.15 In this embodiment, the wall plate includes a first surface b1 and a second surface ( Fig.16 (not shown) When the first housing 21 is applied to Fig.15 In the electronic device shown, the first surface b1 forms a partial area of ​​the outer surface of the housing 2, and the second surface is opposite to the first surface b1. Specifically, the second surface faces the accommodating cavity inside the housing 2. In other words, the first surface b1 is the outer surface of the wall panel, and the second surface is the inner surface of the wall panel.

[0214] In some embodiments, see Fig.16 , the surface of the wall plate close to the battery can have PU skin ( Fig.16 not shown).

[0215] In some embodiments, see Fig.17 The surface of the first housing 21 close to the battery may have a PU leather ( Fig.17 not shown).

[0216] In the laptop computer provided in the embodiment of the present application, the PU leather and the hot-melt adhesive film are compounded together by a hot press, and the hot-melt adhesive film is hot-pressed on one side of the HB flame-retardant grade plate of the composite glass fiber board, and the V0 flame-retardant grade plate faces the battery compartment inside the electronic device, providing fire protection for the entire machine. At the same time, the HB flame-retardant grade plate serves as a transition layer, which can achieve the effect of skinning together with the V0 flame-retardant grade plate inside, and can also achieve a flame-retardant effect after the battery of the entire machine catches fire, and the entire machine is light and thin.

[0217] The above only introduces the contents related to the invention. The rest of the contents can be obtained by referring to the relevant technology and will not be described in detail here.

[0218] It should be understood that the above is only to help those skilled in the art better understand the embodiments of the present application, and is not intended to limit the scope of the embodiments of the present application. Based on the above examples given, those skilled in the art can obviously make various equivalent modifications or changes, for example, some steps in each embodiment of the method may be non-essential, or some new steps may be added, etc.; or a combination of any two / multiple embodiments described above. Such modified, changed or combined solutions also fall within the scope of the embodiments of the present application.

[0219] It should also be understood that the above description of the embodiments of the present application focuses on emphasizing the differences between the various embodiments. The same or similar points that are not mentioned can be referenced to each other. For the sake of brevity, they will not be repeated here.

[0220] It should also be understood that the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0221] It should also be understood that the division of the methods, situations, categories and embodiments in the embodiments of the present application is only for the convenience of description and should not constitute a special limitation. The features of various methods, categories, situations and embodiments can be combined without contradiction.

[0222] It should also be understood that in the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other, and the technical features in different embodiments can be combined to form new embodiments according to their internal logical relationships.

[0223] Finally, it should be noted that the above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: Fireproof parts to be prepared; A shell, comprising at least a first shell and a second shell, wherein one surface of the first shell has a fixed position, the fireproof member is fixed at the fixed position, the second shell is arranged on a side of the fireproof member away from the first shell, the first shell has at least a first plate close to the fireproof member, the second shell has at least a second plate close to the fireproof member, the first plate is connected to the second plate and forms an accommodating cavity, the fireproof member is located in the accommodating cavity, and the fireproof grade of the first plate and the fireproof grade of the second plate are both the highest grade; A covering layer is arranged on at least one side of the shell away from the fireproof part; The shell near the covering layer also has a third plate material, which is arranged on the side of the first plate material and / or the second plate material near the covering layer. The fire protection level of the third plate material is lower than the highest level, and the third plate material is used to connect the first plate material and / or the second plate material to the covering layer.

2. The electronic device according to claim 1, characterized in that: The housing comprises the first housing and the second housing; The covering layer is arranged on a side of the first shell away from the part to be fireproofed, and is arranged on a side of the second shell away from the part to be fireproofed; the first shell has the first plate material and the third plate material, the third plate material is arranged on a side of the first plate material close to the covering layer, and the second shell has the second plate material and the third plate material, the third plate material is arranged on a side of the second plate material close to the covering layer.

3. The electronic device according to claim 1, characterized in that: The housing comprises the first housing and the second housing; The covering layer is arranged on the side of the first shell away from the fireproof part; the first shell has the first plate and the third plate, the third plate is arranged on the side of the first plate close to the covering layer, and the second shell has at least the second plate.

4. The electronic device according to claim 1, characterized in that: The housing comprises the first housing and the second housing; The covering layer is arranged on a side of the second shell away from the fireproof part; the first shell has at least the first plate; the second shell has the second plate and the third plate, and the third plate is arranged on a side of the second plate close to the covering layer.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The first plate includes at least one first substrate, the second plate includes at least one second substrate, and the third plate includes at least one third substrate; All of the first substrates and all of the third substrates are obtained by pressing a plate; and / or all of the second substrates and all of the third substrates are obtained by pressing a plate.

6. The electronic device according to any one of claims 1 to 4, characterized in that: Along a direction perpendicular to the covering layer, the thickness of the third plate material is smaller than the thickness of the first plate material and the thickness of the second plate material.

7. The electronic device according to claim 5, characterized in that: Along a direction perpendicular to the cover layer, the thickness range of the first substrate, the thickness range of the second substrate and the thickness range of the third substrate are all 0.08 mm-0.12 mm.

8. The electronic device according to claim 7, characterized in that: Along a direction perpendicular to the covering layer, the thickness range of the first shell and / or the thickness range of the second shell is 0.9 mm-1.1 mm, and the first shell and / or the second shell has nine layers of first plate materials and one layer of third plate material.

9. The electronic device according to any one of claims 1 to 4, characterized in that: The electronic device further comprises an adhesive layer, which is disposed between the cover layer and the housing and is used to bond the cover layer to the third plate material; The first plate material is a first glass fiber board, the first glass fiber board includes a first glass fiber cloth and a first resin, the first glass fiber cloth has a plurality of first pores, the first resin covers the surface of the first glass fiber cloth and fills the first pores, the pulling force between the first glass fiber board and the adhesive layer is less than a preset pulling force, and the preset pulling force is used to separate the glass fiber board from the adhesive layer; and / or, The second plate material is a second glass fiber board, which includes a second glass fiber cloth and a second resin. The second glass fiber cloth has a plurality of second pores. The second resin covers the surface of the second glass fiber cloth and fills the second pores. The pulling force between the second glass fiber board and the adhesive layer is less than the preset pulling force.

10. The electronic device according to claim 9, characterized in that: The first resin comprises a first resin matrix and a first flame retardant bonded to the first resin matrix, the first flame retardant comprises phosphorus or nitrogen, and the first flame retardant is used to enable the first resin to achieve a flame retardant with a highest fireproof grade; and / or, The second resin comprises a second resin matrix and a second flame retardant bonded to the second resin matrix, the second flame retardant comprises phosphorus element or nitrogen element, and the second flame retardant is used to enable the second resin to achieve the highest fireproof grade of flame retardancy.

11. The electronic device according to claim 10, characterized in that: The first resin matrix and the second resin matrix are both epoxy resin or phenolic resin with a fire retardancy rating lower than the highest fire retardancy rating; The first resin and the second resin are both phosphated resins, and the flame retardant providing phosphorus element includes at least one of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and a derivative of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.

12. The electronic device according to claim 11, characterized in that: The phosphating resin comprises at least one of a bisphenol A epoxy resin having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and / or derivatives thereof, a bisphenol F epoxy resin having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and / or derivatives thereof, a polyphenol glycidyl ether epoxy resin having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and / or derivatives thereof, an aliphatic glycidyl ether epoxy resin having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and / or derivatives thereof, and a glycidyl ester epoxy resin having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and / or derivatives thereof; The derivative of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is obtained by reacting 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide with a polymer, and the polymer has at least one of an aromatic structure, a hydroxyl group, an amino group, and an imino group.

13. The electronic device according to any one of claims 1 to 4, characterized in that: The fire protection grade of the third board is HB grade; The third plate material is a third glass fiber board, and the third glass fiber board includes a third glass fiber cloth and a third resin. The third glass fiber cloth has a plurality of third pores, and the third resin covers the surface of the third glass fiber cloth and fills the third pores. The pulling force between the third glass fiber board and the adhesive layer is greater than a preset pulling force, and the preset pulling force is used to separate the glass fiber board from the adhesive layer.

14. The electronic device according to claim 13, characterized in that: The third resin is an epoxy resin or a phenolic resin having a fireproofing grade lower than the highest fireproofing grade. The third resin is used to bond with the material of the adhesive layer to achieve bonding between the third plate and the adhesive layer.

15. The electronic device according to claim 9, characterized in that: The covering layer is a polyurethane layer; The bonding layer is a hot melt adhesive layer.

16. The electronic device according to any one of claims 1 to 4, characterized in that: The fireproof component is a battery.

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