Micron-level microbubble generation chip and manufacturing method

Abstract

The present invention provides a micron-level microbubble generation chip and a manufacturing method. The chip comprises: a gas phase inlet, a liquid phase inlet and a microbubble outlet. The gas phase inlet comprises a continuous phase inlet and a continuous phase flow channel. The continuous phase flow channel comprises a direct flow channel and two side flow channels. One end of the direct flow channel is connected to the continuous phase inlet, and the other end is respectively connected to one end of the two side flow channels. The liquid phase inlet comprises a dispersed phase inlet and a dispersed phase flow channel. One end of the dispersed phase flow channel is connected to the dispersed phase inlet, and the other end is respectively connected to the other ends of the two side flow channels, forming an intersection at the connection point. The microbubble outlet comprises a microbubble outlet, a microbubble channel and a V-shaped obstacle structure. The microbubble channel comprises a microbubble observation flow channel and two branch flow channels. The V-shaped obstacle structure is arranged in the microbubble observation flow channel, one end of the microbubble observation flow channel is connected to the outlet end of the intersection, and the other end is respectively connected to one end of the two branch flow channels, and the other end of the two branch flow channels is connected to the microbubble outlet.

Description

Technical Field

[0001] The present invention relates to the field of microfluidics, and in particular to a micron-level microbubble generating chip and a manufacturing method thereof. Background Art

[0002] Microbubbles are a technique developed in recent years for manipulating tiny bubbles on microfluidic chips. The principle is to introduce two immiscible gases and liquids, one as the continuous phase and the other as the dispersed phase, into a microchannel. Under the influence of the microchannel, the dispersed phase is distributed within the continuous phase as tiny units, forming a series of dispersed microbubbles. Microbubble technology allows for the convenient manipulation of tiny bubbles and has broad application prospects in fields such as biology, chemistry, and materials science. The key is to generate microbubbles quickly and stably. Summary of the Invention

[0003] To address the aforementioned technical issues, a micron-scale microbubble generation chip and its fabrication method are provided. The V-shaped barrier structure provided by the present invention can generate more shear force, thereby easily generating microbubbles smaller than 100 μm, and can generate microbubbles within a wider range of continuous and dispersed phase flow rates.

[0004] The technical means adopted in the present invention are as follows:

[0005] A micron-scale microbubble generation chip includes: a glass slide, and a PDMS flow channel structure fixedly arranged on the glass slide, the PDMS flow channel structure including a gas phase inlet, a liquid phase inlet, and a microbubble outlet, wherein:

[0006] The gas phase inlet portion includes a continuous phase inlet and a continuous phase flow channel, wherein:

[0007] The continuous phase flow channel includes a direct flow channel, a first side flow channel and a second side flow channel, one end of the direct flow channel is connected to the continuous phase inlet, and the other end of the direct flow channel is connected to one end of the first side flow channel and one end of the second side flow channel respectively;

[0008] The liquid phase inlet portion includes a dispersed phase inlet and a dispersed phase flow channel, one end of the dispersed phase flow channel is connected to the dispersed phase inlet, and the other end of the dispersed phase flow channel is respectively connected to the other end of the first side flow channel and the other end of the second side flow channel, and the connection portion forms an intersection;

[0009] The microbubble outlet portion includes a microbubble outlet, a microbubble channel and a V-shaped obstacle structure; wherein:

[0010] The microbubble channel includes a microbubble observation channel, a first branch channel, and a second branch channel; the V-shaped obstacle structure is fixedly arranged inside the microbubble observation channel, one end of the microbubble observation channel is connected to the outlet end of the intersection, and the other end of the microbubble observation channel is respectively connected to one end of the first branch channel and the second branch channel, and the other ends of the first branch channel and the second branch channel are connected to the microbubble outlet.

[0011] Furthermore, the V-shaped obstacle structure is arranged at a downstream position of the intersection, and the open end of the V-shaped obstacle structure faces the outlet end of the intersection.

[0012] Furthermore, the opening diameter of the V-shaped obstacle structure is smaller than the inner diameter of the microbubble observation channel, so that the split microbubbles flow into the first branch channel and the second branch channel and flow out through the microbubble outlet.

[0013] Furthermore, the V-shaped obstacle structure is used to split the bubbles when they pass through, generating microbubbles with a size of less than 100 μm.

[0014] Furthermore, the V-shaped obstacle structure is a slope structure with an adjustable inclination angle.

[0015] Furthermore, the continuous phase flow channel is used to transport continuous phase liquid; the dispersed phase flow channel is used to transport dispersed phase gas; and the microbubble channel is used to transport microbubbles.

[0016] The present invention also provides a method for manufacturing the micron-scale microbubble generating chip, comprising:

[0017] S1. Preparation of PDMS channel structure: Using photolithography technology, the PDMS channel structure is replicated onto the SU8 mold;

[0018] S2. Preparation of inlet and outlet: Based on the prepared PDMS flow channel structure, three holes with a diameter of 0.5 mm were punched at predetermined positions, serving as the continuous phase inlet, dispersed phase inlet, and microbubble outlet, respectively.

[0019] S3. Preparation of micron-scale microbubble generation chip: The PDMS channel structure with openings and a glass slide were subjected to vacuum plasma treatment for 30 seconds. The glass slide and PDMS were bonded and baked on a hot plate at 80 degrees for 30 minutes.

[0020] Furthermore, the step S1 specifically includes:

[0021] S11, baking the silicon wafer at 190° C. for 30 minutes, and spin-coating SU-8 2025 photoresist on the silicon wafer at a speed of 2000 rpm to obtain a photoresist layer with a thickness of 40-60 μm;

[0022] S12, pre-bake the coated substrate on a hot plate at 65°C for 5 minutes and at 95°C for 10 minutes;

[0023] S13, naturally cooling the substrate to 50 degrees, covering the photoresist with a mask, and baking at 65°C and 95°C for 5 minutes and 5 minutes respectively after exposure;

[0024] S14, after baking, use SU-8 developer to prepare a photoresist layer, rinse with isopropyl alcohol, and bake the SU-8 mold with the replicated PDMS flow channel structure at 150° C. for 30 minutes;

[0025] S15, mixing the PDMS precursor and the curing agent in a ratio of 10:1, and placing the mixture in a vacuum pot to remove bubbles;

[0026] S16. Pour the degassed mixture into a SU-8 mold, cure it on a hot plate at 80° C. for 0.5 h, and peel off the cured PDMS from the SU-8 mold to form a PDMS flow channel structure.

[0027] Compared with the prior art, the present invention has the following advantages:

[0028] 1. The micron-sized microbubble generating chip provided by the present invention can generate more shear force by setting a V-shaped barrier structure, thereby easily generating microbubbles below 100 μm.

[0029] 2. The micron-scale microbubble generation chip provided by the present invention can generate microbubbles within a wider range of continuous phase and dispersed phase flow rates by setting a V-shaped obstacle structure.

[0030] 3. The micron-scale microbubble generation chip provided by the present invention can produce microbubbles in large quantities and quickly, reaching 200,000 per minute.

[0031] Based on the above reasons, the present invention can be widely promoted in fields such as microfluidics. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0033] Figure 1 This is a front view of the micron-scale microbubble generating chip of the present invention.

[0034] Figure 2 This is a top view of the micron-scale microbubble generating chip of the present invention.

[0035] Figure 3 This is a left view of the micron-scale microbubble generating chip of the present invention.

[0036] Figure 4 Schematic cross-sectional view of the micron-scale microbubble generating chip of the present invention along the OO plane.

[0037] Figure 5 3D view of the micron-scale microbubble generation chip of the present invention.

[0038] Figure 6 Schematic diagram of the PDMS flow channel structure of the micron-scale microbubble generation chip of the present invention.

[0039] In the figure: 1. continuous phase inlet; 2. direct flow channel; 3. first side flow channel; 4. second side flow channel; 5. dispersed phase inlet; 6. dispersed phase flow channel; 7. intersection; 8. microbubble outlet; 9. V-shaped obstacle structure; 10. microbubble observation flow channel; 11. first branch flow channel; 12. second branch flow channel; 13. glass slide; 14. PDMS flow channel structure. DETAILED DESCRIPTION

[0040] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0041] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0042] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0043] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values ​​described in these embodiments do not limit the scope of the present invention. At the same time, it should be clear that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to ordinary technicians in the relevant fields may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0044] In the description of the present invention, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention: the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0045] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below their position devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0046] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0047] like Figure 1-3As shown, the present invention provides a micron-scale microbubble generating chip, comprising: a glass slide 13 , and also comprising: a PDMS flow channel structure 14 fixedly arranged on the glass slide 13 .

[0048] like Figure 4-6 As shown, the PDMS flow channel structure 14 includes a gas phase inlet, a liquid phase inlet and a microbubble outlet, wherein:

[0049] The gas phase inlet portion includes a continuous phase inlet 1 and a continuous phase flow channel, wherein:

[0050] The continuous phase flow channel includes a direct flow channel 2, a first bypass flow channel 3, and a second bypass flow channel 4. One end of the direct flow channel 2 is connected to the continuous phase inlet 1, and the other end of the direct flow channel 2 is connected to one end of the first bypass flow channel 3 and one end of the second bypass flow channel 4 respectively.

[0051] The liquid phase inlet portion includes a dispersed phase inlet 5 and a dispersed phase flow channel 6. One end of the dispersed phase flow channel 6 is connected to the dispersed phase inlet 5, and the other end of the dispersed phase flow channel 6 is respectively connected to the other end of the first bypass flow channel 3 and the other end of the second bypass flow channel 4, forming a junction 7 at the connection point.

[0052] The microbubble outlet portion includes a microbubble outlet 8, a microbubble channel and a V-shaped obstacle structure 9; wherein:

[0053] The microbubble channel includes a microbubble observation channel 10, a first branch channel 11, and a second branch channel 12; the V-shaped obstacle structure 9 is fixedly arranged inside the microbubble observation channel 10, one end of the microbubble observation channel 10 is connected to the outlet end of the intersection 7, and the other end of the microbubble observation channel 10 is respectively connected to one end of the first branch channel 11 and the second branch channel 12, and the other end of the first branch channel 11 and the second branch channel 12 is connected to the microbubble outlet 8.

[0054] In a specific implementation, as a preferred embodiment of the present invention, the V-shaped obstacle structure 9 is arranged at a downstream position of the intersection 7 , and the open end of the V-shaped obstacle structure 9 faces the outlet end of the intersection 7 .

[0055] In specific implementation, as a preferred embodiment of the present invention, the opening diameter of the V-shaped obstacle structure 9 is smaller than the inner diameter of the microbubble observation channel 10, so that the split microbubbles flow into the first branch channel 11 and the second branch channel 12, and flow out through the microbubble outlet 8.

[0056] In specific implementation, as a preferred embodiment of the present invention, the V-shaped barrier structure 9 is used to split the bubbles when they pass through, generating microbubbles with a size of less than 100 μm.

[0057] In specific implementation, as a preferred embodiment of the present invention, the V-shaped obstacle structure 9 is a slope structure with an adjustable inclination angle.

[0058] In specific implementation, as a preferred embodiment of the present invention, the continuous phase flow channel is used to transport the continuous phase liquid; the dispersed phase flow channel is used to transport the dispersed phase gas; and the microbubble channel is used to transport microbubbles.

[0059] The present invention also provides a method for manufacturing the micron-scale microbubble generating chip, comprising:

[0060] S1. Preparation of PDMS channel structure 14: Using photolithography technology, the PDMS channel structure 14 is replicated onto the SU8 mold;

[0061] S2. Preparation of inlets and outlets: Based on the prepared PDMS flow channel structure 14, three holes with a diameter of 0.5 mm were punched at predetermined positions, serving as the continuous phase inlet 1, the dispersed phase inlet 5, and the microbubble outlet 8, respectively.

[0062] S3. Preparation of micron-scale microbubble generation chip: The opened PDMS channel structure 14 and the glass slide were subjected to vacuum plasma treatment for 30 seconds. The glass slide and PDMS were bonded and baked on a hot plate at 80 degrees for 30 minutes.

[0063] In specific implementation, as a preferred embodiment of the present invention, step S1 specifically includes:

[0064] S11, baking the silicon wafer at 190° C. for 30 minutes, and spin-coating SU-8 2025 photoresist on the silicon wafer at a speed of 2000 rpm to obtain a photoresist layer with a thickness of 40-60 μm;

[0065] S12, pre-bake the coated substrate on a hot plate at 65°C for 5 minutes and at 95°C for 10 minutes;

[0066] S13, naturally cooling the substrate to 50 degrees, covering the photoresist with a mask (thickness 50 μm, resolution 25400 dpi), and baking at 65°C and 95°C for 5 minutes and 5 minutes respectively after exposure;

[0067] S14, after baking, a photoresist layer is prepared using SU-8 developer, and rinsed with isopropyl alcohol, and the SU-8 mold with the PDMS channel structure 14 replicated thereon is baked at 150° C. for 30 minutes;

[0068] S15, mixing the PDMS precursor and the curing agent in a ratio of 10:1, and placing the mixture in a vacuum pot to remove bubbles;

[0069] S16, pouring the degassed mixture into a SU-8 mold, curing it on a hot plate at 80° C. for 0.5 h, and peeling the cured PDMS from the SU-8 mold to form a PDMS flow channel structure 14.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A micron-scale microbubble generating chip, comprising: The glass slide (13) is characterized in that it further comprises: a PDMS flow channel structure (14) fixedly arranged on the glass slide (13), the PDMS flow channel structure (14) comprising a gas phase inlet portion, a liquid phase inlet portion and a microbubble outlet portion, wherein: The gas phase inlet portion includes a continuous phase inlet (1) and a continuous phase flow channel, wherein: The continuous phase flow channel comprises a direct flow channel (2), a first side flow channel (3) and a second side flow channel (4), one end of the direct flow channel (2) is connected to the continuous phase inlet (1), and the other end of the direct flow channel (2) is respectively connected to one end of the first side flow channel (3) and one end of the second side flow channel (4); The liquid phase inlet portion comprises a dispersed phase inlet (5) and a dispersed phase flow channel (6), one end of the dispersed phase flow channel (6) is connected to the dispersed phase inlet (5), and the other end of the dispersed phase flow channel (6) is respectively connected to the other end of the first side flow channel (3) and the other end of the second side flow channel (4), and the connection portion forms a junction portion (7); The microbubble outlet portion comprises a microbubble outlet (8), a microbubble channel and a V-shaped obstacle structure (9); wherein: The microbubble channel comprises a microbubble observation channel (10), a first branch channel (11), and a second branch channel (12); a V-shaped obstacle structure (9) is fixedly arranged inside the microbubble observation channel (10); one end of the microbubble observation channel (10) is connected to the outlet end of the intersection (7); the other end of the microbubble observation channel (10) is connected to one end of the first branch channel (11) and the second branch channel (12), respectively; and the other ends of the first branch channel (11) and the second branch channel (12) are connected to the microbubble outlet (8); The V-shaped obstacle structure (9) is arranged at a downstream position of the intersection (7), and the open end of the V-shaped obstacle structure (9) faces the outlet end of the intersection (7); The opening diameter of the V-shaped obstacle structure (9) is smaller than the inner diameter of the microbubble observation channel (10), and is used for the split microbubbles to flow into the first branch channel (11) and the second branch channel (12), and then flow out through the microbubble outlet (8).

2. The micron-sized microbubble generating chip according to claim 1, characterized in that: The V-shaped obstacle structure (9) is used to split the bubbles when they pass through, generating microbubbles with a size of less than 100 μm.

3. The micron-scale microbubble generating chip according to claim 1, characterized in that: The V-shaped obstacle structure (9) is a slope structure with an adjustable inclination angle.

4. The micron-scale microbubble generating chip according to claim 1, characterized in that: The continuous phase flow channel is used to transport the continuous phase liquid; the dispersed phase flow channel is used to transport the dispersed phase gas; and the microbubble channel is used to transport microbubbles.

5. A method for manufacturing a micron-scale microbubble generating chip according to any one of claims 1 to 4, characterized in that: include: S1. Preparation of PDMS flow channel structure (14): Using photolithography technology, the PDMS flow channel structure (14) is copied onto the SU8 mold; S2. Preparation of inlet and outlet: Based on the prepared PDMS flow channel structure (14), three holes with a diameter of 0.5 mm were punched at predetermined positions, serving as the continuous phase inlet (1), the dispersed phase inlet (5), and the microbubble outlet (8). S3. Preparation of micron-scale microbubble generation chip: The opened PDMS channel structure (14) and the glass slide were subjected to vacuum plasma treatment for 30 s. The glass slide was bonded to the PDMS and baked on a hot plate at 80 degrees for 30 minutes.

6. The method for manufacturing a micron-sized microbubble generating chip according to claim 5, characterized in that: The step S1 specifically includes: S11, baking the silicon wafer at 190° C. for 30 minutes, and spin-coating SU-8 2025 photoresist on the silicon wafer at a speed of 2000 rpm to obtain a photoresist layer with a thickness of 40-60 μm; S12, pre-bake the coated substrate on a hot plate at 65°C for 5 minutes and at 95°C for 10 minutes; S13, naturally cooling the substrate to 50 degrees, covering the photoresist with a mask, and baking at 65°C and 95°C for 5 minutes and 5 minutes respectively after exposure; S14, after baking, a photoresist layer is prepared using SU-8 developer and rinsed with isopropyl alcohol, and the SU-8 mold with the replicated PDMS flow channel structure (14) is baked at 150°C for 30 minutes; S15, mixing the PDMS precursor and the curing agent in a ratio of 10:1, and placing the mixture in a vacuum pot to remove bubbles; S16. Pour the degassed mixture into a SU-8 mold and cure it on a hot plate at 80°C for 0.5 h. Peel the cured PDMS from the SU-8 mold to form a PDMS flow channel structure (14).

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