Electronic device and control method thereof

Abstract

The application provides an electronic device and a control method thereof, and relates to the technical field of electronic devices, which is used for prolonging the time for a position on a shell, which is easily touched by a user, to reach a temperature threshold value, so as to prolong the time for high-load work or large-current charging of the electronic device. The electronic device comprises a shell, a battery and a semiconductor refrigerator. The shell comprises a first part. The battery is located in the shell. The semiconductor refrigerator is arranged in the shell and located between the first part and the battery. The semiconductor refrigerator comprises a first end and a second end. The first end is directed to the first part and in thermal conduction with the first part, and the second end is directed to the battery and in thermal conduction with the battery. When the semiconductor refrigerator works, the first end conducts heat to the second end.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to an electronic device and its control method. Background Technology

[0002] Currently, when electronic devices such as laptops and mobile phones are operating under high load or charging with high current, the internal system-on-a-chip (SOC), charging chip, battery, and other heat-generating components conduct a significant amount of heat to the casing. In some scenarios, this heat is conducted to areas on the casing that users frequently touch (such as the palm rest of a laptop or the bezel of a tablet), making it noticeable to the user and resulting in a poor user experience.

[0003] To improve user experience, temperature thresholds can be set for these locations to limit their temperature. When the temperature at these locations exceeds the temperature threshold, the processor's main operating frequency is limited, reducing the charging current. However, this will affect device performance and charging speed. Summary of the Invention

[0004] This application provides an electronic device and its control method, which extends the time it takes for a user-accessible location on the housing to reach a temperature threshold, thereby extending the time the electronic device can operate under high load or be charged with high current.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, an electronic device is provided, comprising a housing, a battery, and a thermoelectric cooler. The housing includes a first portion. The battery is located within the housing. The thermoelectric cooler is disposed within the housing and located between the first portion and the battery. The thermoelectric cooler includes a first end and a second end, the first end facing the first portion and being thermally connected to the first portion, and the second end facing the battery and being thermally connected to the battery. When the thermoelectric cooler is operating, heat is conducted from the first end to the second end.

[0007] In this way, by using a semiconductor cooler, the heat from the first part can be transferred to the battery for temporary heat storage. This extends the time it takes for the first part to reach the upper temperature threshold, which in turn extends the time that electronic devices can operate under high load or be charged with high current. This also extends the time that electronic devices can maintain high performance, improve the speed of short-term charging, and significantly enhance the user experience.

[0008] In one possible implementation of the first aspect, the electronic device further includes a first temperature sensor and a controller. The first temperature sensor is used to detect the temperature of the first part. The controller is electrically connected to both the first temperature sensor and the thermoelectric cooler, and is used to control the operation of the thermoelectric cooler based on the temperature of the first part detected by the first temperature sensor. Specifically, the thermoelectric cooler can be controlled to operate before the temperature of the first part reaches an upper threshold value, so as to transfer the heat of the first part to the battery. This enables intelligent control of the thermoelectric cooler's operation, saving manpower.

[0009] In one possible implementation of the first aspect, the first temperature sensor can be used to detect the temperature at the geometric center of the first part with the higher temperature rise rate among the two first parts. Furthermore, there can be only one first temperature sensor, located at the geometric center of the first part with the higher temperature rise rate. This allows detection to be achieved using a single first temperature sensor, simplifying the control logic and saving costs. It should be noted that when the temperature rise rates of the two first parts are equal, the first temperature sensor can be used to detect the temperature at the geometric center of either of the two first parts.

[0010] In one possible implementation of the first aspect, the electronic device further includes a second temperature sensor for detecting the battery temperature. A controller is also electrically connected to the second temperature sensor and is used to control the operation of the thermoelectric cooler based on the battery temperature detected by the second temperature sensor. In this way, the battery temperature can be referenced during the control of the thermoelectric cooler operation to avoid excessive heat transfer to the battery, which could cause the battery to quickly reach its upper limit, thereby preventing any impact on the battery's charging speed and safety.

[0011] In one possible implementation of the first aspect, the battery may include an NTC thermistor used for monitoring, controlling, or compensating for battery temperature, forming the aforementioned second temperature sensor. This reuses the battery's own NTC thermistor to detect battery temperature, eliminating the need for a separate temperature sensor and saving costs.

[0012] In one possible implementation of the first aspect, the electronic device further includes a third temperature sensor. The third temperature sensor is used to detect the ambient temperature surrounding the electronic device. A controller is also electrically connected to the third temperature sensor and is used to control the operation of the thermoelectric cooler based on the ambient temperature detected by the third temperature sensor. In this way, the ambient temperature can be referenced during the control of the thermoelectric cooler's operation, preventing the thermoelectric cooler from starting when the electronic device is not powered on or operating under low load, thus avoiding waste.

[0013] In one possible implementation of the first aspect, the third temperature sensor can be disposed within the housing. Specifically, the third temperature sensor can be disposed within the housing at a location away from the circuit board assembly, such as near the fourth wall panel. In this way, the third temperature sensor can be protected within the housing, and the temperature value detected by the third temperature sensor is less affected by the circuit board assembly, and is closer to the ambient temperature.

[0014] In one possible implementation of the first aspect, the electronic device is a laptop computer, which includes a host, a housing of the host, and a first part being a palm rest on the housing.

[0015] In a second aspect, a control method for an electronic device is provided, wherein the electronic device includes a housing, a battery, and a thermoelectric cooler, and the housing includes a first portion. The battery is located inside the housing. The thermoelectric cooler is disposed inside the housing and located between the first portion and the battery, and the thermoelectric cooler includes a first end and a second end, the first end facing the first portion and being thermally connected to the first portion, and the second end facing the battery and being thermally connected to the battery. The control method includes:

[0016] The temperature of the first part is detected to obtain the first temperature Ts;

[0017] When the first temperature Ts is greater than the first temperature value T1, the semiconductor cooler is activated to drive the first end to conduct heat to the second end; wherein the first temperature value T1 is less than the upper temperature threshold value Tsm of the first part.

[0018] In this way, by using a semiconductor cooler, the heat from the first part can be transferred to the battery for temporary heat storage. This extends the time it takes for the first part to reach the upper temperature threshold, which in turn extends the time that electronic devices can operate under high load or be charged with high current. This also extends the time that electronic devices can maintain high performance, improve the speed of short-term charging, and significantly enhance the user experience.

[0019] In one possible implementation of the second aspect, the control method further includes:

[0020] The ambient temperature around the electronic device is detected to obtain a third temperature Te;

[0021] Based on the third temperature Te, a first temperature value T1 is determined; wherein, the first temperature value T1 = the third temperature Te + the first preset temperature value ΔT1. The first preset temperature value ΔT1 is a pre-set value, and the first preset temperature value ΔT1 is greater than 0℃. Optionally, the first preset temperature value ΔT1 can be 2℃.

[0022] This avoids starting the thermoelectric cooler when the electronic device is not turned on or is running under low load, thus preventing waste.

[0023] In one possible implementation of the second aspect, detecting the temperature of the first part includes:

[0024] The temperature of the first part is detected at multiple different time periods to obtain multiple first temperatures Ts.

[0025] In this way, the temperature of the first part can be monitored in real time, which will help the semiconductor cooler to start accurately and in a timely manner, so as to achieve temperature control of the first part and extend the time for the first part to reach the upper temperature threshold as much as possible.

[0026] In one possible implementation of the second aspect, the control method further includes:

[0027] The temperature of the battery is detected at multiple different time periods to obtain multiple second temperatures Tb; wherein, the multiple different time periods include a first time period t1 and a second time period t2, and the second time period t2 is located after the first time period t1; in some embodiments, the first time period t1 can be the time period when the detected temperature of the first part first exceeds the first temperature value T1, or the first time period t1 can be the time period after the time period when the detected temperature of the first part first exceeds the first temperature value T1, and no specific limitation is made here.

[0028] Calculate the first coefficient K1, K1=(Tsm-Ts1) / (Tbm-Tb1); where Tbm is the upper temperature threshold of the battery, Ts1 represents the first temperature Ts obtained in the first time period t1, and Tb1 represents the second temperature Tb obtained in the first time period t1.

[0029] Calculate the second coefficient K2, K2=(Tsm-Ts2 / (Tbm-Tb2); where Ts2 represents the first temperature Ts obtained in the second time period t2, and Tb2 represents the second temperature Tb obtained in the second time period t2;

[0030] The operation of the semiconductor cooler is controlled based on the first coefficient K1 and the second coefficient K2.

[0031] In this way, the battery temperature can be referenced during the control process to avoid the battery reaching its upper limit quickly due to excessive heat being transferred to it, thereby avoiding affecting the battery's charging speed and safety.

[0032] In one possible implementation of the second aspect, controlling the operation of the semiconductor cooler according to a first coefficient K1 and a second coefficient K2 includes:

[0033] Calculate the difference between the second coefficient K2 and the first coefficient K1 based on the first coefficient K1 and the second coefficient K2;

[0034] The driving voltage or driving current of the semiconductor cooler is determined based on the difference between the second coefficient K2 and the first coefficient K1.

[0035] The operation of the thermoelectric cooler is controlled based on the driving voltage or driving current of the thermoelectric cooler.

[0036] In this way, after the thermoelectric cooler is started, the driving voltage or driving current of the thermoelectric cooler can be adjusted according to the difference between the second coefficient K2 and the first coefficient K1, so as to prolong the time for the first part to reach the upper temperature threshold as much as possible.

[0037] In one possible implementation of the second aspect, determining the driving voltage or driving current of the semiconductor cooler based on the difference between the second coefficient K2 and the first coefficient K1 may include:

[0038] When the difference between the second coefficient K2 and the first coefficient K1 is less than 0, that is, K2-K1<0, the driving voltage or driving current of the thermoelectric cooler is increased, and the increase in the driving voltage or driving current of the thermoelectric cooler is positively correlated with the absolute value of (K2-K1). That is, the larger the absolute value of (K2-K1), the larger the increase in the driving voltage or driving current of the thermoelectric cooler; the smaller the absolute value of (K2-K1), the smaller the increase in the driving voltage or driving current of the thermoelectric cooler.

[0039] When the difference between the second coefficient K2 and the first coefficient K1 is greater than 0, that is, K2-K1>0, the driving voltage or driving current of the thermoelectric cooler is reduced, and the reduction of the driving voltage or driving current of the thermoelectric cooler is positively correlated with (K2-K1). That is, the larger (K2-K1) is, the greater the reduction of the driving voltage or driving current of the thermoelectric cooler, and the smaller (K2-K1) is, the smaller the reduction of the driving voltage or driving current of the thermoelectric cooler.

[0040] When the difference between the second coefficient K2 and the first coefficient K1 is equal to 0, that is, K2 = K1, the current driving voltage or current driving current of the semiconductor cooler remains unchanged.

[0041] In this way, after the semiconductor cooler is started, K2 can be adjusted to be equal to K1, so that the first part and the battery can reach their respective temperature thresholds at the same time, thereby extending the time for the first part to reach the temperature threshold as much as possible.

[0042] In one possible implementation of the second aspect, the control method further includes:

[0043] When the first temperature Ts is greater than the second temperature value T2, the thermoelectric cooler is turned off.

[0044] Wherein, the second temperature value T2 = the upper temperature threshold value Tsm of the first part - the second preset temperature value △T2.

[0045] In this way, the first part has a certain temperature rise margin when the thermoelectric cooler is turned off, which prevents the heat from the thermoelectric cooler from flowing back to the first part after the thermoelectric cooler is turned off, causing the temperature of the first part to reach the upper threshold value Tsm or more.

[0046] In one possible implementation of the second aspect, the control method further includes:

[0047] When the first temperature Ts is less than or equal to the third temperature value T3, the semiconductor cooler is activated to drive the first end to conduct heat to the second end;

[0048] Among them, the third temperature value T3 is greater than the first temperature value T1, and the third temperature value T3 = the upper temperature threshold value Tsm of the first part - the third preset temperature value △T3, and the third preset temperature value △T3 is greater than the second preset temperature value △T2.

[0049] In this way, when the temperature of the first part 21a reaches the upper temperature threshold Tsm, the load of the electronic device decreases or the charging current decreases, and the temperature of the first part 21a gradually decreases. When it decreases to below the third temperature value T3, the start-up conditions of the thermoelectric cooler are met, and the thermoelectric cooler starts to achieve temperature control. During this temperature control process, the aforementioned K1 value can continue to be referenced to control Ts and Tb to gradually decrease. Moreover, the second temperature value T2 is the temperature threshold for shutting down the thermoelectric cooler from a low temperature to a high temperature, and the third temperature value T3 is the temperature threshold for starting the thermoelectric cooler from a high temperature to a low temperature. Since the third temperature value T3 is lower than the second temperature value T2, there is a hysteresis between the third temperature value T3 and the second temperature value T2, which can avoid placing the two temperature thresholds at the same temperature point and causing frequent switching.

[0050] In one possible implementation of the second aspect, the control method further includes:

[0051] When the first temperature Ts is less than the third temperature Te, the semiconductor cooler is turned off.

[0052] In this way, when the electronic device is operating with the thermoelectric cooler on for temperature control, but the user is no longer running it under high load or charging with high current, the first temperature Ts will gradually decrease. When the first temperature Ts drops below the third temperature Te, the thermoelectric cooler will be turned off. Since (third temperature Te + first preset temperature value △T1) is the temperature threshold for turning on the thermoelectric cooler from low temperature to high temperature, and the third temperature Te is the temperature threshold for turning off the thermoelectric cooler from high temperature to low temperature, and since the third temperature Te is less than (third temperature Te + first preset temperature value △T1), there is a hysteresis between the third temperature Te and (third temperature Te + first preset temperature value △T1) to avoid placing the two temperature thresholds at the same temperature point, which would lead to frequent switching.

[0053] In one possible implementation of the second aspect, the battery is in a charging state, and the control method further includes:

[0054] When the first temperature Ts is greater than or equal to the upper temperature threshold Tsm of the first part, the charging current of the battery is reduced. This avoids the first temperature Ts being too high and affecting the user experience.

[0055] In one possible implementation of the second aspect, the electronic device further includes a central processing unit (CPU), which is in an operational state, and the control method further includes:

[0056] When the first temperature Ts is greater than or equal to the temperature threshold Tsm of the first part, the operating frequency of the central processing unit is reduced. This reduces the power consumption of the central processing unit and avoids the first temperature Ts being too high, which could negatively impact the user experience.

[0057] Thirdly, some embodiments of this application provide a computer storage medium including computer instructions that, when executed on an electronic device, cause the electronic device to perform the control method described in any of the above technical solutions.

[0058] Fourthly, some embodiments of this application also provide a computer program product that, when run on a computer, causes the computer to execute the control method described in any of the above technical solutions. The computer storage medium or computer program product provided in the embodiments of this application is used to execute the control method described in any of the above technical solutions; therefore, the beneficial effects it can achieve can be referred to the beneficial effects in the corresponding control methods provided above, and will not be repeated here. Attached Figure Description

[0059] Figure 1 Schematic diagrams of the structure of electronic devices provided in some embodiments of this application;

[0060] Figure 2 for Figure 1 An exploded view of the host unit in the electronic device shown.

[0061] Figure 3 for Figure 2 The diagram shows a cross-sectional structure of the host computer at line AA.

[0062] Figure 4a for Figure 2 The diagram shows a cross-sectional structure of the host computer at line AA.

[0063] Figure 4b for Figure 4a An enlarged view of region I in the cross-sectional structure shown;

[0064] Figure 5 for Figure 4a The circuit block diagram of the host shown is shown.

[0065] Figure 6 Flowcharts of control methods for electronic devices provided in some embodiments of this application;

[0066] Figure 7 A flowchart of a control method for an electronic device provided in some embodiments of this application;

[0067] Figure 8 Flowcharts of control methods for electronic devices provided in some embodiments of this application;

[0068] Figure 9 For simulation Figure 3 The graph shows the temperature Ts of the first part and the temperature Tb of the battery in an electronic device without a semiconductor cooler as a function of time.

[0069] Figure 10 For simulation Figure 4a The graph shows the temperature Ts of the first part of an electronic device equipped with a semiconductor cooler and the temperature Tb of the battery as a function of time.

[0070] Figure 11 for Figure 3 and Figure 4a The graph shows a comparison of the changes in the CPU's main operating frequency or the battery's charging current over time within the electronic device. Detailed Implementation

[0071] In the embodiments of this application, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature.

[0072] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0073] This application provides an electronic device that may include communication functions. For example, the electronic device may include at least one of the following: a smartphone, a tablet PC, a mobile phone, a video phone, an e-book reader, a desktop PC, a laptop PC, an internet-connected computer, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, and wearable devices (e.g., head-mounted devices such as electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic accessories, electronic tattoos, or smartwatches).

[0074] Electronic devices can also be smart home appliances with communication capabilities, such as televisions, digital multi-disc (DVD) players, stereos, refrigerators, air conditioners, vacuum cleaners, ovens, microwave ovens, washing machines, air purifiers, set-top boxes, TV boxes (e.g., Samsung HomeSync™, Apple TV™, or Google TV™), game consoles, electronic dictionaries, electronic keys, recorders, and electronic photo frames.

[0075] Electronic equipment may also include at least one of the following: various medical instruments (e.g., magnetic resonance imaging (MRA) machines, magnetic resonance imaging (MRI) machines, computed tomography (CT) machines, and ultrasound machines), navigation equipment, global positioning system (GPS) receivers, event data recorders (EDR), flight data recorders (FDR), in-vehicle infotainment equipment, marine electronic equipment (e.g., marine navigation equipment and gyrocompasses), avionics equipment, security equipment, vehicle head units, industrial or household robots, automated teller machines (ATMs), and point-of-sale (POS) equipment.

[0076] Electronic devices may also include at least one of the following: furniture or part of a building / structure, electronic board, electronic signature receiving device, projector, and various measuring instruments (e.g., water meter, electricity meter, gas meter, and radio wave meter). Furthermore, electronic devices may be flexible devices.

[0077] The electronic device may also be a combination of one or more of the various devices described above. Furthermore, it will be apparent to those skilled in the art that the electronic device according to this disclosure is not limited to the devices described above.

[0078] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device 100 provided in some embodiments of this application. This embodiment and the following embodiments are illustrated using a laptop computer as an example, and should not be considered as a special limitation on the electronic device 100. Specifically, the laptop computer can be a regular laptop computer or a gaming laptop computer. The laptop computer includes a display 10, a host 20, a keyboard 30, and a touchpad 40.

[0079] The display 10 is used to display images, videos, etc. The keyboard 30 and touchpad 40 are used to input commands or data; the keyboard 30 and touchpad 40 are mounted on the host unit 20. The host unit 20 serves as the control center of the laptop computer 100, performing functions such as data storage, computation, control, and signal conversion. The host unit 20 is rotatably connected to the display 10. The laptop computer 100 can switch between an open and closed state. When the laptop computer 100 is in the open state, please refer to... Figure 1 , Figure 1 The laptop 100 shown is in the open state, with the display 10 open at a certain angle relative to the host 20. This angle can be greater than 0° and less than 180°. When the laptop 100 is in the closed state, the display 10 covers the surface of the keyboard 30 of the host 20.

[0080] The following section mainly introduces the host 20.

[0081] Please continue reading Figure 1 The host 20 is roughly rectangular flat. Based on this, for the convenience of the following descriptions of the embodiments, an XYZ coordinate system is established, defining the length direction of the host 20 as the X-axis, the width direction as the Y-axis, and the thickness direction as the Z-axis. It is understood that the coordinate system setting of the host 20 can be flexibly set according to actual needs and is not specifically limited here. In other embodiments, the shape of the host 20 may also be a square flat plate, a circular flat plate, an elliptical flat plate, etc.

[0082] Please see Figure 2 , Figure 2 for Figure 1 An exploded view of the host unit 20 in the electronic device 100 shown. The host unit 20 includes a housing 21, a circuit board assembly 22, and a battery 23.

[0083] Understandable, Figure 2 The schematic illustration shows some components included in the host 20, the actual shape, size, location, and construction of which are not affected by the actual shape, size, location, and construction of the components. Figure 2 The limitations. In other embodiments, the host 20 may include other components besides these, such as fans and heat pipes.

[0084] The housing 21 is used to protect internal electronic components. The housing 21 includes opposing first and second wall panels 211 and 212, opposing third and fourth wall panels 213 and 214, and opposing fifth and sixth wall panels 215 and 216. See some embodiments for details. Figure 2 The first wall panel 211 and the second wall panel 212 are arranged along the Z-axis; the first wall panel 211 is the top wall panel of the housing 21, and the keyboard 30 is mounted on the first wall panel 211; the second wall panel 212 is the bottom wall panel of the housing 21. The third wall panel 213 and the fourth wall panel 214 are arranged along the Y-axis; the third wall panel 213 is the rear wall panel of the housing 21, and the fourth wall panel 214 is the front wall panel of the housing 21, with the third wall panel 213 facing away from the user and the fourth wall panel 214 facing the user. The fifth wall panel 215 and the sixth wall panel 216 are arranged along the X-axis; the fifth wall panel 215 is the left wall panel of the housing 21, and the sixth wall panel 216 is the right wall panel of the housing 21.

[0085] The housing 21 can be a single structural component or assembled from multiple parts; no specific limitation is made herein. In some embodiments, please refer to... Figure 2 The first wall panel 211, the third wall panel 213, the fourth wall panel 214, the fifth wall panel 215, and the sixth wall panel 216 are integrated into a single structural component to form a C-shell. The second wall panel 212 forms a D-shell. The C-shell and the D-shell are assembled to form a housing 21. This simplifies the structural composition of the housing 21 and reduces assembly difficulty, while also facilitating the assembly of internal electronic components.

[0086] Please continue reading Figure 2 The first panel 211 includes a first portion 21a, which is a part of the housing 21 that is easily touched by a user. Here, the term "user" refers to a person who uses the electronic device.

[0087] exist Figure 2In the illustrated embodiment, the first part 21a is a palm rest. Specifically, the palm rest refers to the portion of the housing 21 used to support the user's palm. When the electronic device 100 has other structures, the first part 21a may also be a frame, back cover, or other parts. This embodiment and the embodiments described below use the first part 21a as a palm rest as an example, which should not be considered as a special limitation on the structural form of the first part 21a. Based on this, please continue to refer to... Figure 2 The number of first parts 21a can be two, and the two first parts 21a are located on both sides of the touchpad 40 respectively.

[0088] The circuit board assembly 22 and the battery 23 are disposed within the housing 21. The circuit board assembly 22 and the battery 23 are arranged along the Y-axis, and the battery 23 is located between the circuit board assembly 22 and the fourth wall panel 214.

[0089] Please see Figure 3 , Figure 3 for Figure 2 The diagram shows a cross-sectional view of the host 20 at line AA. The host 20 also includes a support frame 24. The support frame 24 is disposed on the inner surface of the C-shell to enhance its structural strength. Specifically, the support frame 24 and the C-shell can be fixed together by processes such as hot pressing or adhesive bonding. The support frame 24 can be a single structural component or assembled from multiple parts; no specific limitation is made here. The circuit board assembly 22 and the battery 23 are both fixed to the support frame 24. In other embodiments, the host 20 may not have a support frame 24, and the circuit board assembly 22 and the battery 23 may be directly fixed to the first wall panel 211. The following embodiments are described based on the inclusion of a support frame 24 within the host 20, and this should not be considered a special limitation of this application.

[0090] exist Figure 3 In the illustrated embodiment, the circuit board assembly 22 overlaps between the orthographic projection of the first wall panel 211 and the first portion 21a, and the battery 23 overlaps between the orthographic projection of the first wall panel 211 and the first portion 21a. In other embodiments, the circuit board assembly 22 may not overlap between the orthographic projection of the first wall panel 211 and the first portion 21a, and the battery 23 may not overlap between the orthographic projection of the first wall panel 211 and the first portion 21a; this is not specifically limited here.

[0091] The circuit board assembly 22 includes a circuit board 221 and a heat-generating device 222 disposed on the circuit board 221. The heat-generating device 222 is an electronic component that generates significant heat during operation. Specifically, the heat-generating device 222 may include at least one of the following: a system-on-chip (SOC), a central processing unit (CPU), a graphics processing unit (GPU), video random access memory (VRAM), a CPU power supply inductor, a GPU power supply inductor, a CPU MOSFET, a GPU MOSFET, a charging chip, a charging MOSFET, and a charging inductor.

[0092] When electronic devices operate under high load or are charged with high current, at least some of the heat-generating components 222 generate a large amount of heat. This heat is conducted to the circuit board 221 and further conducted to the first part 21a via the plastic frame 24, causing the temperature of the first part 21a to rise rapidly, which is noticeable to the user and results in a poor user experience. Of course, the battery 23 also generates a certain amount of heat during operation, which is also conducted to the first part 21a via the plastic frame 24, causing the temperature of the first part 21a to rise.

[0093] Based on the above, to improve the user experience, a temperature threshold can be set for the first part 21a to limit its maximum temperature. When the temperature of the first part 21a exceeds the temperature threshold, the CPU's main operating frequency is limited, and the charging current is reduced. However, this will affect the performance and charging speed of the electronic device.

[0094] To solve the above-mentioned technical problems, this application transfers the heat of the first part 21a to the battery 23 for temporary storage, thereby extending the time for the first part 21a to reach the upper temperature threshold. This is beneficial for extending the time for electronic devices to operate under high load or be charged with high current, thus extending the time for electronic devices to maintain high performance, improving the speed of short-time charging, and significantly enhancing the user experience.

[0095] Furthermore, since the temperature threshold of the first part 21a is determined based on user experience, generally, a temperature exceeding 35°C results in a poor user experience. Therefore, the temperature threshold of the first part 21a can be 35°C. Battery 23, on the other hand, is generally a rechargeable battery. Specifically, battery 23 can be a lithium-ion battery or a lithium polymer battery. The temperature threshold of battery 23 is determined based on its own characteristics, and this temperature threshold can be 45°C. Therefore, the temperature threshold of battery 23 is greater than that of the first part 21a. Battery 23 has thermal margin and the ability to temporarily store heat.

[0096] For details, please refer to Figure 4a and Figure 4b , Figure 4a for Figure 2 The diagram shows a cross-sectional view of the host 20 at line AA. Figure 4b for Figure 4a The image shows an enlarged view of region I in the cross-sectional structure. In this embodiment, the host 20 also includes a thermoelectric cooler (TEC) 25. A thermoelectric cooler 25 is a device that uses the thermoelectric effect of semiconductors to conduct heat; it is also called a thermoelectric cooler. The material of the thermoelectric cooler 25 includes, but is not limited to, bismuth telluride. By applying an appropriate DC voltage across the two ends of the thermoelectric cooler 25, heat is transferred from one end of the element to the other. At this time, one end of the thermoelectric cooler 25 absorbs heat and its temperature decreases, while the temperature of the other end rises simultaneously.

[0097] Based on the above, the semiconductor cooler 25 is disposed within the housing 21 and located between the first portion 21a and the battery 23. Specifically, the semiconductor cooler 25 may be disposed between the plastic frame 24 and the battery 23. In other embodiments, the semiconductor cooler 25 may also be disposed between the plastic frame 24 and the first portion 21a. Figure 4a and Figure 4b The illustrated embodiment is provided by way of example, with a semiconductor cooler 25 disposed between the plastic frame 24 and the battery 23, and should not be considered as constituting a special limitation of this application.

[0098] In some embodiments, the thermoelectric cooler 25 is in the form of a plate. This results in a smaller height occupied by the thermoelectric cooler 25 within the host 20, which is beneficial for the thinning of the host 20. In other embodiments, the thermoelectric cooler 25 may also be in the form of a plate, a block, or a column; no specific limitation is made here.

[0099] The semiconductor cooler 25 includes a first terminal D1 and a second terminal D2. The first terminal D1 faces and is thermally connected to the first portion 21a, and the second terminal D2 faces and is thermally connected to the battery 23. In some embodiments, please refer to... Figure 4a and Figure 4b The first end D1 is thermally connected to the first part 21a via the plastic bone 24.

[0100] Based on this, in order to reduce the thermal resistance between the first end D1 and the first part 21a, a thermal interface material can be provided between the first end D1 and the molded frame 24, and between the molded frame 24 and the first part 21a. This thermal interface material includes, but is not limited to, liquid metal, thermal pads, thermal gels, thermal grease, and graphite.

[0101] Similarly, in order to reduce the thermal resistance between the second terminal D2 and the battery 23, a thermal interface material can also be provided between the second terminal D2 and the battery 23.

[0102] When the thermoelectric cooler 25 is working, heat is conducted from the first terminal D1 to the second terminal D2. That is, when the thermoelectric cooler 25 is working, it transfers heat from the first terminal D1 to the second terminal D2.

[0103] In this way, with the help of the semiconductor cooler 25, the heat of the first part 21a can be transferred to the battery 23 to temporarily store the heat. This can extend the time for the first part 21a to reach the upper temperature threshold, thereby extending the time for the electronic device to work under high load or charge with high current. This can extend the time for the electronic device to maintain high performance, improve the charging speed in a short time, and greatly improve the user experience.

[0104] Based on the above, in order to achieve intelligent control of the operation of the semiconductor cooler 25, please refer to some embodiments as well. Figure 4a and Figure 5 , Figure 5 for Figure 4a The circuit block diagram of the host 20 is shown. The host 20 also includes a first temperature sensor 26 and a controller 27.

[0105] The first temperature sensor 26 is used to detect the temperature of the first part 21a. The first temperature sensor 26 includes, but is not limited to, contact temperature sensors and non-contact temperature sensors. The structural forms of the first temperature sensor 26 include, but are not limited to, thermistors and thermocouples. The following embodiments are described based on the premise that the first temperature sensor 26 is a contact temperature sensor.

[0106] Specifically, the first temperature sensor 26 can be used to detect the temperature at the geometric center of the first part 21a with the higher temperature rise rate among the two first parts 21a. Based on this, there can be only one first temperature sensor 25, which is located at the geometric center of the first part 21a with the higher temperature rise rate among the two first parts 21a. This allows detection to be achieved using only one first temperature sensor 25, simplifying the control logic and saving costs. It should be noted that when the temperature rise rates of the two first parts 21a are the same, the first temperature sensor 26 can be used to detect the temperature at the geometric center of either of the two first parts 21a.

[0107] In some other embodiments, the first temperature sensor 26 may be used to detect the maximum temperature of the first portion 21a, or the average temperature of the first portion 21a may be measured by means of multiple first temperature sensors 26, without specific limitation.

[0108] The controller 27 can be an embedded controller (EC) or a microcontroller (MCU). The controller 27 is electrically connected to both the first temperature sensor 26 and the thermoelectric cooler 25. The controller 27 controls the operation of the thermoelectric cooler 25 based on the temperature of the first portion 21a detected by the first temperature sensor 26. Specifically, when the temperature of the first portion 21a is below a certain upper temperature threshold, the controller can operate the thermoelectric cooler 25 to transfer heat from the first portion 21a to the battery 23. This enables intelligent control of the thermoelectric cooler 25's operation, saving manpower.

[0109] In some embodiments, please continue reading Figure 4a and Figure 5 The host unit 20 also includes a second temperature sensor 28. The second temperature sensor 28 is used to detect the temperature of the battery 23. In some embodiments, the battery 23 may include a negative temperature coefficient (NTC) thermistor, which is used to monitor, control, or compensate for the battery temperature, and this NTC thermistor forms the aforementioned second temperature sensor 28. In this way, the battery 23's own NTC thermistor is reused to detect the battery 23's temperature, eliminating the need for a separate temperature sensor and saving costs. In other embodiments, a temperature sensor may also be provided on the surface or inside the battery 23; no specific limitations are made here.

[0110] Based on the above, please refer to the following: Figure 5 The controller 27 is also electrically connected to the second temperature sensor 28. The controller 27 is also used to control the operation of the thermoelectric cooler 25 based on the battery temperature detected by the second temperature sensor 28. In this way, the temperature of the battery 23 can be referenced during the control of the thermoelectric cooler 25 operation to avoid excessive heat being transferred to the battery 23, which could cause the battery 23 to quickly reach its upper limit, thus avoiding affecting the charging speed and safety of the battery 23.

[0111] In some embodiments, please continue reading Figure 4a and Figure 5 The host 20 also includes a third temperature sensor 29. The third temperature sensor 29 is used to detect the ambient temperature of the electronic device 100. The third temperature sensor 29 includes, but is not limited to, contact temperature sensors and non-contact temperature sensors. The structural forms of the third temperature sensor 29 include, but are not limited to, thermistors and thermocouples. The following embodiments are described based on the premise that the third temperature sensor 29 is a contact temperature sensor.

[0112] In some embodiments, the third temperature sensor 29 may be disposed within the housing 21. Specifically, the third temperature sensor 29 may be disposed within the housing 21 at a location away from the circuit board assembly 22, such as near the fourth wall panel 214 within the housing 21. In this way, the third temperature sensor 29 can be protected within the housing 21, and the temperature value detected by the third temperature sensor 29 is less affected by the circuit board assembly 22, and is closer to the ambient temperature. In other embodiments, the third temperature sensor 29 may also be disposed at the display 10, the rotating connection between the display 10 and the host 20, the outer surface of the housing 21, etc., without specific limitations.

[0113] Based on the above embodiment, the controller 27 is also electrically connected to the third temperature sensor 29. The controller 27 is also used to control the operation of the thermoelectric cooler 25 according to the ambient temperature detected by the third temperature sensor 29. In this way, the ambient temperature can be referenced when controlling the operation of the thermoelectric cooler 25, which can avoid starting the thermoelectric cooler 25 when the electronic device is not turned on or is running under low load, thereby avoiding waste.

[0114] In some other embodiments, the ambient temperature of the electronic device 100 can also be calculated using algorithms, eliminating the need for a third temperature sensor 29. This saves costs.

[0115] The structure of the electronic device 100 provided in some embodiments of this application has been described above. This application also provides a control method for the electronic device 100; please refer to [link to relevant documentation]. Figure 6 , Figure 6 This is a flowchart illustrating a control method for an electronic device 100 provided in some embodiments of this application. This control method is used to control the electronic device 100 described in any of the above embodiments. The control method can be initiated when the electronic device 100 is powered on and terminated when it is powered off. In other embodiments, the control method can also be initiated after the electronic device 100 is powered on for a first preset time and terminated after the electronic device 100 is powered off for a second preset time. It can also be controlled by keyboard keys, desktop shortcut commands, preset gestures received by the touch panel, etc., and is not specifically limited here. The first preset time and the second preset time can be equal or unequal.

[0116] For details, please refer to Figure 6 The control method includes the following steps S10 and S20.

[0117] Step S10: Detect the temperature of the first part 21a to obtain the first temperature Ts.

[0118] The temperature of the first part 21a can be the temperature at the geometric center of the first part 21a with the higher rate of temperature rise, or it can be the average temperature of the first part 21a obtained by multi-point measurement; no specific limitation is made here.

[0119] Step S20: When the first temperature Ts is greater than the first temperature value T1, the semiconductor cooler 25 is activated to drive the first terminal D1 to conduct heat to the second terminal D2. The first temperature value T1 is less than the upper temperature threshold Tsm of the first part.

[0120] In this way, with the help of the semiconductor cooler 25, the heat of the first part 21a can be transferred to the battery 23 to temporarily store the heat. This can extend the time for the first part 21a to reach the upper temperature threshold, thereby extending the time for the electronic device to work under high load or charge with high current. This can extend the time for the electronic device to maintain high performance, improve the charging speed in a short time, and greatly improve the user experience.

[0121] In step S10 above, the temperature of the first part 21a can be detected once or multiple times within multiple different time periods.

[0122] In some embodiments, step S10 may include detecting the temperature of the first portion 21a at multiple different time periods to obtain multiple first temperatures Ts. This allows for real-time monitoring of the temperature of the first portion 21a, facilitating accurate and timely activation of the thermoelectric cooler 25 to achieve temperature control of the first portion 21a, thereby extending the time it takes for the first portion 21a to reach the upper temperature threshold as much as possible.

[0123] In the above embodiments, the multiple different time periods can be multiple consecutive time periods on a timeline. The durations of these multiple different time periods can be equal or unequal. No specific limitation is made here.

[0124] In step S20 above, the first temperature value T1 can be a preset value or it can be determined based on the ambient temperature of the electronic device.

[0125] In some embodiments, the control method further includes the following steps one and two.

[0126] Step 1: Detect the ambient temperature around the electronic device 100 to obtain the third temperature Te.

[0127] The ambient temperature of the electronic device 100 can be detected using the aforementioned third temperature sensor 29, or other devices; no specific limitation is made here. In other embodiments, the ambient temperature of the electronic device 100 can also be calculated using an algorithm, eliminating the need for a sensor. This saves costs.

[0128] Step 2: Determine the first temperature value T1 based on the third temperature Te.

[0129] Wherein, the first temperature value T1 = the third temperature Te + the first preset temperature value ΔT1. The first preset temperature value ΔT1 is a pre-set value, and the first preset temperature value ΔT1 is greater than 0℃. Optionally, the first preset temperature value ΔT1 can be greater than or equal to 1.5℃ and less than or equal to 3℃. Specifically, the first preset temperature value ΔT1 can be 1.5℃, 1.6℃, 1.7℃, 1.8℃, 1.9℃, 2.0℃, 2.2℃, 2.4℃, 2.6℃, 2.8℃, or 3℃.

[0130] This avoids starting the thermoelectric cooler 25 when the electronic device is not turned on or is running at low load, thus preventing waste.

[0131] In step one above, the ambient temperature of the electronic device 100 can be detected once or multiple times over several different time periods.

[0132] In some embodiments, step one above may include: detecting the ambient temperature of the electronic device 100 at multiple different time periods to obtain multiple third temperatures Te. In some embodiments, the multiple different time periods may be multiple different time periods for detecting the temperature of the first part 21a. Based on this, step two above may include: determining multiple first temperature values ​​T1 corresponding to the multiple third temperatures Te. Wherein, each first temperature value T1 = the corresponding third temperature Te + a first preset temperature value ΔT1.

[0133] Based on the above embodiments, step S20 may include: when the first temperature Ts obtained in the nth time period is greater than the first temperature value T1 corresponding to the third temperature Te obtained in the nth time period, activating the semiconductor cooler 25 to drive the first terminal D1 to conduct heat to the second terminal D2. Here, the nth time period is one of the aforementioned multiple different time periods.

[0134] In this way, the ambient temperature around the electronic device 100 can be monitored in real time to accurately determine the first temperature value T1, thereby enabling the semiconductor cooler 25 to start accurately and in a timely manner, so as to extend the time for the first part 21a to reach the upper temperature threshold as much as possible.

[0135] In some embodiments, please continue reading Figure 7 The control method of the electronic device 100 may also include the following steps S30-S60.

[0136] Step S30: Detect the temperature of battery 23 at multiple different time periods to obtain multiple second temperatures Tb.

[0137] These multiple different time periods can be multiple different time periods for detecting the temperature of the first part 21a mentioned above.

[0138] Furthermore, the multiple different time periods include a first time period t1 and a second time period t2, with the second time period t2 following the first time period t1. In some embodiments, the first time period t1 can be the time period when the detected temperature of the first portion 21a first exceeds the first temperature value T1, or it can be the time period following the time period when the detected temperature of the first portion 21a first exceeds the first temperature value T1; no specific limitation is made here. This application and the following embodiments are described based on the first time period t1 being the time period when the detected temperature of the first portion 21a first exceeds the first temperature value T1, and this should not be considered as a special limitation on this application.

[0139] Step S40: Calculate the first coefficient K1, K1 = (Tsm - Ts1) / (Tbm - Tb1).

[0140] Wherein, Tbm is the upper temperature threshold of battery 23, Ts1 represents the first temperature Ts obtained in the first time period t1, and Tb1 represents the second temperature Tb obtained in the first time period t1.

[0141] Step S50: Calculate the second coefficient K2, K2 = (Tsm - Ts2 / (Tbm - Tb2).

[0142] Wherein, Ts2 represents the first temperature Ts obtained in the second time period t2, and Tb2 represents the second temperature Tb obtained in the second time period t2.

[0143] Step S60: Control the operation of the semiconductor cooler 25 according to the first coefficient K1 and the second coefficient K2.

[0144] In this way, the temperature of battery 23 can be referenced during the control process to avoid excessive heat being transferred to battery 23, which could cause battery 23 to reach the upper limit value quickly, thereby avoiding affecting the charging speed and safety of battery 23.

[0145] In some embodiments, step S60 may include: calculating the difference between the second coefficient K2 and the first coefficient K1 based on the first coefficient K1 and the second coefficient K2; determining the driving voltage or driving current of the thermoelectric cooler based on the difference between the second coefficient K2 and the first coefficient K1; and controlling the operation of the thermoelectric cooler 25 based on the driving voltage or driving current of the thermoelectric cooler 25. In this way, after the thermoelectric cooler 25 is started, the driving voltage or driving current of the thermoelectric cooler 25 can be adjusted based on the difference between the second coefficient K2 and the first coefficient K1 to extend the time for the first part 21a to reach the upper temperature threshold as much as possible.

[0146] In the above embodiments, determining the driving voltage or driving current of the semiconductor cooler 25 based on the difference between the second coefficient K2 and the first coefficient K1 may include:

[0147] When the difference between the second coefficient K2 and the first coefficient K1 is less than 0, that is, K2-K1<0, the driving voltage or driving current of the semiconductor cooler 25 is increased, and the increase in the driving voltage or driving current of the semiconductor cooler 25 is positively correlated with the absolute value of (K2-K1). That is, the larger the absolute value of (K2-K1), the larger the increase in the driving voltage or driving current of the semiconductor cooler 25, and the smaller the absolute value of (K2-K1), the smaller the increase in the driving voltage or driving current of the semiconductor cooler 25.

[0148] When the difference between the second coefficient K2 and the first coefficient K1 is greater than 0, that is, K2-K1>0, the driving voltage or driving current of the semiconductor cooler 25 is reduced, and the reduction of the driving voltage or driving current of the semiconductor cooler 25 is positively correlated with (K2-K1). That is, the larger (K2-K1) is, the greater the reduction of the driving voltage or driving current of the semiconductor cooler 25, and the smaller the value of (K2-K1) is, the smaller the reduction of the driving voltage or driving current of the semiconductor cooler 25.

[0149] When the difference between the second coefficient K2 and the first coefficient K1 is equal to 0, that is, K2 = K1, the current driving voltage or current driving current of the semiconductor cooler 25 remains unchanged.

[0150] In this way, after the semiconductor cooler 25 is started, K2 can be adjusted to be equal to K1, so that the first part 21a and the battery 23 can reach their respective temperature thresholds at the same time, thereby extending the time for the first part 21a to reach the temperature threshold as much as possible.

[0151] In some embodiments, please continue reading Figure 7 The control method also includes the following step S70.

[0152] Step S70: When the first temperature Ts is greater than the second temperature value T2, the second temperature Tb > Tbm - ΔT2 / K1, and the semiconductor cooler 25 is turned off. Wherein, the second temperature value T2 = the upper temperature threshold value Tsm of the first part 21a - the second preset temperature value ΔT2. The second preset temperature value ΔT2 is a pre-set value, and the second preset temperature value ΔT2 is greater than 0℃. Optionally, the second preset temperature value ΔT2 can be greater than or equal to 0.3℃ and less than or equal to 0.8℃. Specifically, the second preset temperature value ΔT2 can be 0.3℃, 0.4℃, 0.5℃, 0.6℃, 0.7℃, or 0.8℃.

[0153] In this way, the first part 21a has a certain temperature rise margin when the semiconductor cooler 25 is turned off, so as to avoid the heat of the semiconductor cooler 25 flowing back to the first part 21a after the semiconductor cooler 25 is turned off, causing the temperature of the first part 21a to reach the upper threshold value Tsm or more.

[0154] In some embodiments, the control method further includes: when the first temperature Ts is less than or equal to the third temperature value T3, activating the semiconductor cooler 25 to drive the first terminal D1 to conduct heat to the second terminal D2. Wherein, the third temperature value T3 is greater than the first temperature value T1, and the third temperature value T3 = the first part's upper temperature threshold value Tsm - the third preset temperature value ΔT3, where the third preset temperature value ΔT3 is a pre-set value and is greater than 0℃. The third preset temperature value ΔT3 is greater than the second preset temperature value ΔT2. The third preset temperature value ΔT3 can be greater than or equal to 0.8℃ and less than or equal to 1.5℃. Specifically, the third preset temperature value ΔT3 can be 0.8℃, 0.9℃, 1.0℃, 1.1℃, 1.2℃, 1.3℃, 1.4℃, or 1.5℃.

[0155] In this way, when the temperature of the first part 21a reaches the upper temperature threshold Tsm, the load of the electronic device decreases or the charging current decreases, and the temperature of the first part 21a gradually decreases. When it decreases to below the third temperature value T3, the start-up conditions of the thermoelectric cooler 25 are met, and the thermoelectric cooler 25 starts to achieve temperature control. During this temperature control process, the aforementioned K1 value can continue to be referenced to control Ts and Tb to gradually decrease. Moreover, the second temperature value T2 is the temperature threshold for shutting down the thermoelectric cooler 25 from low temperature to high temperature, and the third temperature value T3 is the temperature threshold for starting the thermoelectric cooler 25 from high temperature to low temperature. Since the third temperature value T3 is lower than the second temperature value T2, there is a hysteresis between the third temperature value T3 and the second temperature value T2, which can avoid placing the two temperature thresholds at the same temperature point and causing frequent switching.

[0156] Similarly, the control method also includes: when the first temperature Ts is less than the third temperature Te, the semiconductor cooler 25 is turned off.

[0157] In this way, when the electronic device is operating under temperature control with the thermoelectric cooler 25 turned on, but the user is no longer running it under high load or charging it with high current, the first temperature Ts will gradually decrease. When the first temperature Ts drops below the third temperature Te, the thermoelectric cooler 25 will be turned off. Since (third temperature Te + first preset temperature value △T1) is the temperature threshold for turning on the thermoelectric cooler 25 from low temperature to high temperature, and the third temperature Te is the temperature threshold for turning off the thermoelectric cooler 25 from high temperature to low temperature, and since the third temperature Te is less than (third temperature Te + first preset temperature value △T1), there is a hysteresis between the third temperature Te and (third temperature Te + first preset temperature value △T1) to avoid placing the two temperature thresholds at the same temperature point, which would lead to frequent switching.

[0158] In some embodiments, the battery is in a charging state, and the control method further includes: reducing the battery charging current when the first temperature Ts is greater than or equal to the temperature upper threshold Tsm of the first portion. This avoids the first temperature Ts being too high and affecting the user experience.

[0159] In some other embodiments, the electronic device further includes the aforementioned CPU, which is in an operational state. The control method further includes: reducing the CPU's main operating frequency when the first temperature Ts is greater than or equal to the first temperature threshold Tsm. This reduces the CPU's power consumption and prevents the first temperature Ts from being too high, which could negatively impact the user experience.

[0160] For ease of understanding, the control method of the electronic device provided in this application will be illustrated below using the (n+1)th time period as an example. The (n+1)th time period can be one of the multiple different time periods for detecting the temperature of the first part 21a.

[0161] For details, please refer to Figure 8 , Figure 8 This is a flowchart illustrating a control method for an electronic device provided in some embodiments of this application. The control method for the electronic device includes the following steps S100-S900.

[0162] Step S100: In the (n+1)th time period, the temperature of the first part 21a is detected to obtain the first temperature Ts(n+1); the temperature of the battery 23 is detected to obtain the second temperature Tb(n+1); the ambient temperature of the electronic device 100 is detected to obtain the third temperature Te(n+1).

[0163] Step S200: Determine whether the thermoelectric cooler (TEC) 25 has been activated.

[0164] Step S300: When the semiconductor cooler 25 is not started, determine whether Ts(n+1) is greater than Te(n+1)+△T1 and less than or equal to Tsm-△T3.

[0165] Step S400: When Ts(n+1) is greater than Te(n+1)+△T1 and less than or equal to Tsm-△T3, control the semiconductor cooler 25 to start and calculate the control coefficient K1, K1=[Tsm-Ts(n+1)] / [Tbm-Tb(n+1)].

[0166] After step S400, proceed to step S900.

[0167] When Ts(n+1) is less than or equal to Te(n+1)+△T1, or greater than Tsm-△T3, execute the following step S900.

[0168] Step S500: When the semiconductor cooler 25 has been started, determine whether Ts(n+1) is greater than Tsm-ΔT2 or less than Te(n+1);

[0169] Step S600: When Ts(n+1) is greater than Tsm-ΔT2 or less than Te(n+1), turn off the semiconductor cooler 25.

[0170] After step S600, proceed to step S900.

[0171] Step S700: When Ts(n+1) is less than or equal to Tsm-ΔT2 and greater than or equal to Te(n+1), calculate K(n+1), K(n+1)=[Tsm-Ts(n+1)] / [Tbm-Tb(n+1)], and set the operating parameters (including driving voltage or driving current) of the semiconductor cooler 25 according to the difference between K(n+1) and K1 above.

[0172] Step S800: Drive the semiconductor cooler 25 to work according to the operating parameters of the semiconductor cooler 25.

[0173] After step S800, there is a delay time Td, and the process returns to step S100 to proceed to the next time period.

[0174] Step S900: Control according to normal thermal control strategy. Specifically, step S900 includes: when the battery is in a charging state, and Ts(n+1) is greater than or equal to Tsm, reduce the battery charging current. Alternatively, the electronic device also includes the aforementioned CPU, which is in an operating state, and when Ts(n+1) is greater than or equal to Tsm, reduce the CPU's main operating frequency.

[0175] After step S900, there is a delay time Td, and the process returns to step S100 to proceed to the next time period.

[0176] To verify the effectiveness of the electronic device control method provided in the embodiments of this application, please refer to the following comparative embodiment. Figure 9 , Figure 9 For simulation Figure 3 The graph shows the temperature Ts of the first part 21a and the temperature Tb of the battery 23 in an electronic device 100 without a semiconductor cooler 25, changing over time. Figure 9 It can be seen that the temperature Ts of the first part 21a reaches the upper temperature threshold Tsm of the first part 21a at time m1. After time m1, the temperature Ts of the first part 21a stops rising due to the temperature limit. At time m1, the temperature Tb of the battery 23 is far from reaching the upper temperature threshold Tbm of the battery 23. Moreover, at the subsequent time m2, the temperature Tb of the battery 23 rises to its maximum, but this maximum temperature value does not reach the upper temperature threshold Tbm. Therefore, the battery 23 has a large thermal margin and the ability to temporarily store heat. In this embodiment, the CPU's main operating frequency or the charging current is reduced at time m1.

[0177] Please see Figure 10 , Figure 10 For simulation Figure 4a The graph shows the temperature Ts of the first part 21a and the temperature Tb of the battery 23 in the electronic device 100 equipped with a semiconductor cooler 25, changing over time. This electronic device 100 is controlled using the control method provided in the embodiments of this application. Figure 10 It can be seen that, by using the semiconductor cooler 25 and the control method described in this embodiment, the temperatures Ts of the first part 21a and Tb of the battery 23 can reach their respective upper temperature thresholds at time m4. That is, at time m4, the temperature Ts of the first part 21a reaches the upper temperature threshold Tsm, and the temperature Tb of the battery 23 reaches the upper temperature threshold Tbm. Here, time m4 is after time m1 and before time m2. In this embodiment, the CPU's main operating frequency or the charging current is reduced at time m4.

[0178] Please see Figure 10At time m3, the first temperature Ts is greater than the second temperature T2 mentioned above. At this time, the second temperature Tb > Tbm - ΔT2 / K1, and the semiconductor cooler 25 is turned off. Time m3 is between time m1 and time m4.

[0179] Please see Figure 11 , Figure 11 for Figure 3 and Figure 4a A comparison graph showing the changes in the CPU's main operating frequency or the battery's charging current over time in the electronic device 100 shown. Figure 11 The middle dashed line indicates Figure 3 The curves showing the change in the operating frequency of the central processing unit or the charging current of the battery over time in the electronic device 100 (without the semiconductor cooler 25) are shown in solid line. Figure 4a The curve showing the performance release or charging current variation over time of the electronic device 100 (equipped with a semiconductor cooler 25). Figure 11 It can be seen that, Figure 3 The electronic device 100 shown begins to reduce the CPU's main operating frequency or decrease the charging current at time m1. Figure 4a The electronic device 100 shown starts to reduce the CPU's main operating frequency or reduce the charging current at time m4. Figure 4a The electronic device 100 shown can extend the system's high-performance time or high-current charging time from the 0-m1 period to the 0-m4 period, and can extend the CPU's high-performance operation time or the battery's fast charging time.

[0180] Some embodiments of this application also provide a computer storage medium, which includes, but is not limited to, various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk. The computer storage medium includes computer instructions, which, when executed on the electronic device 100, cause the electronic device 100 to perform the control method described in any of the above embodiments.

[0181] Some embodiments of this application also provide a computer program product that, when run on a computer, causes the computer to execute the control method described in any of the above embodiments.

[0182] In this application, the computer storage medium or computer program product provided in the embodiments are used to execute the control method as described in any of the above embodiments. Therefore, the beneficial effects that can be achieved can be referred to the beneficial effects in the corresponding control methods provided above, and will not be repeated here.

[0183] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0184] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A control method for an electronic device, characterized in that, The electronic device includes a housing, a battery, and a thermoelectric cooler. The housing includes a first portion; the battery is located within the housing; the thermoelectric cooler is disposed within the housing and located between the first portion and the battery. The thermoelectric cooler includes a first end and a second end, the first end facing the first portion and thermally connected to the first portion, and the second end facing the battery and thermally connected to the battery. The control method includes: The temperature of the first part is detected to obtain the first temperature Ts; When the first temperature Ts is greater than the first temperature value T1, the semiconductor cooler is activated to drive the first end to conduct heat to the second end; Wherein, the first temperature value T1 is less than the upper temperature threshold value Tsm of the first part; The temperature of the first part is detected at multiple different time periods to obtain multiple first temperatures Ts, and the temperature of the battery is detected at multiple different time periods to obtain multiple second temperatures Tb; wherein, the multiple different time periods include a first time period t1 and a second time period t2, and the second time period t2 is located after the first time period t1; Calculate the first coefficient K1, K1=(Tsm-Ts1) / (Tbm-Tb1); where Tbm is the upper temperature threshold of the battery, Ts1 represents the first temperature Ts obtained in the first time period t1, and Tb1 represents the second temperature Tb obtained in the first time period t1. Calculate the second coefficient K2, K2 = (Tsm - Ts2 / (Tbm - Tb2); where Ts2 represents the first temperature Ts obtained in the second time period t2, and Tb2 represents the second temperature Tb obtained in the second time period t2; The operation of the semiconductor cooler is controlled according to the first coefficient K1 and the second coefficient K2.

2. The control method according to claim 1, characterized in that, Controlling the operation of the semiconductor cooler based on the first coefficient K1 and the second coefficient K2 includes: Based on the first coefficient K1 and the second coefficient K2, calculate the difference between the second coefficient K2 and the first coefficient K1; The driving voltage or driving current of the semiconductor cooler is determined based on the difference between the second coefficient K2 and the first coefficient K1. The operation of the semiconductor cooler is controlled according to the driving voltage or driving current of the semiconductor cooler.

3. The control method according to claim 1 or 2, characterized in that, The control method further includes: The ambient temperature around the electronic device is detected to obtain a third temperature Te; The first temperature value T1 is determined based on the third temperature Te; wherein, the first temperature value T1 = the third temperature Te + the first preset temperature value △T1.

4. The control method according to claim 1 or 2, characterized in that, The control method further includes: When the first temperature Ts is greater than the second temperature value T2, the semiconductor cooler is turned off; Wherein, the second temperature value T2 = the upper temperature threshold value Tsm of the first part - the second preset temperature value △T2.

5. The control method according to claim 4, characterized in that, The control method further includes: When the first temperature Ts is less than or equal to the third temperature value T3, the semiconductor cooler is activated to drive the first end to conduct heat to the second end; Wherein, the third temperature value T3 is greater than the first temperature value T1, and the third temperature value T3 = the temperature upper threshold value Tsm of the first part - the third preset temperature value △T3, and the third preset temperature value △T3 is greater than the second preset temperature value △T2.

6. The control method according to claim 1 or 2, characterized in that, The battery is in a charging state, and the control method further includes: When the first temperature Ts is greater than or equal to the upper temperature threshold Tsm of the first part, the charging current of the battery is reduced.

7. The control method according to claim 3, characterized in that, The electronic device further includes a central processing unit, which is in an operational state, and the control method further includes: When the first temperature Ts is greater than or equal to the temperature threshold Tsm of the first part, the operating frequency of the central processing unit is reduced.

8. The control method according to claim 7, characterized in that, The control method further includes: When the first temperature Ts is less than the third temperature Te, the thermoelectric cooler is turned off.

9. A computer storage medium, characterized in that, Includes computer instructions that, when executed on an electronic device, cause the electronic device to perform the control method as described in any one of claims 1-8.

10. A computer program product, characterized in that, When the computer program product is run on a computer, it causes the computer to perform the control method as described in any one of claims 1-8.

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