An apparatus for improving metal contamination of an ion implanter
By designing a mobile lifting mechanism and a water gun rinsing mechanism, combined with motor drive and gear transmission, the source cavity of the ion implanter was thoroughly cleaned and dried, solving the problem of metal particle contamination in the source cavity and improving cleaning efficiency and cleanliness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HANGZHOU PARTS ELECTRONICS CO LTD
- Filing Date
- 2024-02-28
- Publication Date
- 2026-04-14
AI Technical Summary
Metal contamination generated during the operation of ion implanters leads to wafer defects, and existing technologies are unable to effectively clean the metal particles in the source cavity, resulting in the contamination gradually worsening.
A device was designed that includes a mobile lifting mechanism, a water gun rinsing mechanism, and a source cavity fixing mechanism. The water gun rinsing mechanism, consisting of a high-pressure nozzle and a hose, enters the source cavity. Combined with motor drive and gear transmission, it achieves comprehensive cleaning and angle adjustment of the source cavity, and uses a hot air blower for drying.
It achieves comprehensive cleaning of the source cavity, removes metal particles from the source cavity, reduces metal contamination, improves cleaning efficiency, and accelerates the drying process of the source cavity, ensuring the cleanliness of the ion implanter.
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Figure CN118142997B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of metal contamination improvement technology for ion implanters, and more particularly to an apparatus for improving metal contamination in ion implanters. Background Technology
[0002] Ion implanters are key equipment in the pre-processing of integrated circuit manufacturing. Ion implantation is a doping technique for areas near the surface of semiconductors, aiming to change the carrier concentration and conductivity type of the semiconductor. Ion implanters generally consist of an ion source, a magnetic analyzer, an accelerating tube, a focusing system, etc. However, the ion implantation process generates a certain amount of metal contamination, which can lead to defects in the wafer. Metal contamination is generally caused by metal particles generated by ion beam sputtering. These metal particles remain in the ion source cavity and will continue to cause metal contamination to the wafer if they are not cleaned. Moreover, the more they accumulate over time, the more serious the contamination becomes. Therefore, it is necessary to propose a device to improve the metal contamination of ion implanters. Summary of the Invention
[0003] To address the aforementioned technical problems, this invention provides an apparatus for improving metal contamination in ion implanters.
[0004] This invention is achieved using the following technical solution: a chassis, with an inner frame, a cover plate mounted inside the chassis, a flip-up source cavity fixing mechanism mounted at the bottom of the cover plate, a movable lifting mechanism mounted at the bottom of the cover plate, a water gun rinsing mechanism mounted on the movable lifting mechanism, the water gun rinsing mechanism including a frame, a high-pressure nozzle rotatably mounted on the frame, a third motor fixedly mounted on the frame, the third motor being drivenly connected to the high-pressure nozzle, a flexible hose rotatably connected to one end of the high-pressure nozzle, the source cavity fixing mechanism including two vertical plates fixedly connected to the bottom of the cover plate, a common placement frame rotatably mounted on the two vertical plates, a horizontal bar fixedly mounted on the placement frame, a locking screw threaded onto the horizontal bar, and a limiting frame provided on the placement frame.
[0005] A first motor is fixedly installed on the top of the cover plate, and a first bevel gear is fixedly installed on the output shaft of the first motor. A drive rod is rotatably installed on the corresponding vertical plate, and a second bevel gear is fixedly installed at both the top and bottom of the drive rod. The first bevel gear meshes with the corresponding second bevel gear. A third bevel gear is fixedly installed on the shaft of the placement frame, and the third bevel gear meshes with the corresponding second bevel gear.
[0006] The mobile lifting mechanism includes a second motor fixedly installed on the top of the cover plate, a screw rotatably installed on the bottom of the cover plate, a fourth bevel gear fixedly installed on the output shaft of the second motor, a fifth bevel gear fixedly installed on one end of the screw, the fourth bevel gear meshing with the fifth bevel gear, a rectangular tube threaded onto the screw, a second electric push rod fixedly installed inside the rectangular tube, and the output rod of the second electric push rod fixedly connected to the frame.
[0007] Two support blocks are fixedly installed at the bottom of the cover plate. A screw passes through the two support blocks and is rotatably connected to them. Two slide rods are fixedly installed on the two support blocks. Both slide rods pass through the rectangular tube and are slidably connected to it.
[0008] As a further improvement to the above solution, two first electric push rods are fixedly installed on the bottom inner wall of the chassis, and the output rods of the two first electric push rods are fixedly connected to the bottom of the cover plate.
[0009] As a further improvement to the above solution, four rectangularly distributed sleeves are fixedly installed on the bottom inner wall of the chassis. Each of the four sleeves has a telescopic rod slidably installed inside it, and the top of each of the four telescopic rods is fixedly connected to the cover plate.
[0010] As a further improvement to the above solution, a hot air blower is fixedly installed on the top of the cover plate, and a blower pipe is fixedly installed on the air outlet of the hot air blower. The other end of the blower pipe passes through the cover plate and is fixedly connected to the cover plate.
[0011] As a further improvement to the above solution, a booster pump is fixedly installed inside the chassis, the other end of the hose is fixedly connected to the outlet of the booster pump, and the inlet of the booster pump extends to the outside of the chassis.
[0012] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0013] This invention utilizes a movable lifting mechanism composed of a second motor, a screw, and a second electric push rod. This mechanism can drive the water gun rinsing mechanism to adjust its displacement and height. By translating the water gun rinsing mechanism, it allows the mechanism to enter the source cavity for rinsing. Its movable nature also ensures that the water gun rinsing mechanism does not restrict or interfere with the rotation or fixation of the source cavity when not in use. Furthermore, by adjusting the height of the water gun rinsing mechanism, after the source cavity is adjusted, the water gun rinsing mechanism can still enter the source cavity through other through-holes to rinse it, thus ensuring a more thorough rinsing of the source cavity.
[0014] The water gun flushing mechanism is composed of a high-pressure nozzle, hose, third motor, and gear. It can enter the source cavity and spray high-pressure water to flush the metal particles attached to the source cavity. Its rotation feature allows for flushing of the source cavity without dead angles.
[0015] The source cavity fixing mechanism, composed of vertical plates, placement racks, horizontal bars, and tightening screws, along with the first motor and drive rod, not only fixes the source cavity to be cleaned, but also allows the source cavity to be adjusted at an angle according to cleaning needs. This ensures that the negative pressure source cavity structure can achieve better cleaning results. After cleaning, the source cavity can be flipped over to accelerate the removal of residual water stains. Combined with a hot air blower, the drying of the source cavity can be accelerated, allowing the source cavity to be reassembled more quickly. Attached Figure Description
[0016] Figure 1 This is an overall view of the device of the present invention for improving metal contamination in ion implanters;
[0017] Figure 2 This is a cross-sectional view of the device for improving metal contamination in an ion implanter according to the present invention;
[0018] Figure 3 This is a cross-sectional view of the apparatus of the present invention for improving metal contamination in an ion implanter;
[0019] Figure 4 This is a schematic diagram illustrating the internal structure of the device for improving metal contamination in an ion implanter according to the present invention.
[0020] Figure 5 This is a diagram illustrating the source cavity fixing mechanism in this invention;
[0021] Figure 6 This is a first illustration of the movable lifting mechanism and the water gun rinsing mechanism in this invention;
[0022] Figure 7 This is a second illustration of the movable lifting mechanism and the water gun rinsing mechanism in this invention;
[0023] Figure 8 This is a partial cross-sectional view of the movable lifting mechanism and the water gun rinsing mechanism in this invention.
[0024] Explanation of key symbols:
[0025] 1. Chassis; 2. Enclosure; 3. First electric actuator; 4. Cover plate; 5. Sleeve; 6. Telescopic rod; 7. First motor; 8. First bevel gear; 9. Vertical plate; 10. Placement rack; 11. Drive rod; 12. Second bevel gear; 13. Third bevel gear; 14. Horizontal bar; 15. Tightening screw; 16. Limiting frame; 17. Booster pump; 18. Second motor; 19. Fourth bevel gear; 20. Screw; 21. Fifth bevel gear; 22. Rectangular cylinder; 23. Second electric actuator; 24. Frame; 25. High-pressure nozzle; 26. Hose; 27. Third motor; 28. Circular gear; 29. Gear ring; 30. Hot air blower; 31. Air duct; 32. Filter cover. Detailed Implementation
[0026] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments.
[0027] Please combine Figures 1 to 8 The device for improving metal contamination in an ion implanter according to this embodiment includes: a housing 1, which consists of a frame and two side plates installed on both sides of the frame. One side of the housing 1 has a placement opening, which can be sealed with a door for placing and removing the source chamber. A filter cover 32 is installed on the top of the housing 1, allowing the airflow entering the housing 1 from the hot air blower 30 to be filtered through the filter cover 32, ensuring the purity of the drying hot air. A surrounding frame 2 is provided inside the housing 1, primarily serving as a water tank to prevent water splashing during source chamber rinsing. A drain pipe is provided on one side of the surrounding frame 2, with one end extending outside the housing 1. A cover plate 4 is installed inside the housing 1, serving not only as a support for various mechanisms but also as a sealing structure for the surrounding frame 2 to prevent water splashing. A flip-up source chamber is installed at the bottom of the cover plate 4. The cavity fixing mechanism has a movable lifting mechanism installed at the bottom of the cover plate 4. The movable lifting mechanism is equipped with a water gun rinsing mechanism. The water gun rinsing mechanism includes a frame 24, which consists of a frame body and a sleeve. The frame body is used to install a third motor 27, and the sleeve is used to install a high-pressure nozzle 25. The high-pressure nozzle 25 is rotatably mounted on the frame 24, and the third motor 27 is fixedly mounted on the frame 24. The third motor 27 is connected to the high-pressure nozzle 25 through a transmission. A spur gear 28 is fixedly mounted on the output shaft of the third motor 27. A gear ring 29 is fixedly sleeved on the high-pressure nozzle 25. The spur gear 28 meshes with the gear ring 29. One end of the high-pressure nozzle 25 is rotatably connected to a hose 26. The hose 26 is rotatably connected to the high-pressure nozzle 25, which allows the two to maintain communication without restricting the rotation of the high-pressure nozzle 25.
[0028] Two first electric push rods 3 are fixedly installed on the bottom inner wall of the chassis 1, and the output rods of the two first electric push rods 3 are fixedly connected to the bottom of the cover plate 4.
[0029] Through the above technical solution, the first electric push rod 3 can drive the cover plate 4 to rise and fall, so that the source cavity can be lowered into the enclosure 2 when rinsing, and the cover plate 4 can also cover the enclosure 2 to prevent water from splashing out.
[0030] Four rectangular sleeves 5 are fixedly installed on the bottom inner wall of the chassis 1. Each of the four sleeves 5 has a telescopic rod 6 slidably installed inside it, and the top of each of the four telescopic rods 6 is fixedly connected to the cover plate 4.
[0031] Through the above technical solution, the sleeve 5, together with the telescopic rod 6, can improve the stability of the cover plate 4 without affecting its normal lifting and lowering.
[0032] The source cavity fixing mechanism includes two vertical plates 9 fixedly connected to the bottom of the cover plate 4. The same placement frame 10 is rotatably mounted on the two vertical plates 9. A horizontal bar 14 is fixedly mounted on the placement frame 10. A locking screw 15 is threaded on the horizontal bar 14. The locking screw 15 consists of two parts: a threaded rod and a torsion wheel. It is more convenient to rotate the threaded rod by the torsion wheel. A limiting frame 16 is provided on the placement frame 10. The limiting frame 16 is adapted to the source cavity.
[0033] Through the above technical solution, the tightening screw 15, together with the limiting frame 16, can limit the source cavity on the placement frame 10, so that the placement frame 10 can stably drive the source cavity to rotate.
[0034] A first motor 7 is fixedly installed on the top of the cover plate 4. A first bevel gear 8 is fixedly installed on the output shaft of the first motor 7. A drive rod 11 is rotatably installed on the corresponding vertical plate 9. A second bevel gear 12 is fixedly installed at both the top and bottom of the drive rod 11. The first bevel gear 8 meshes with the corresponding second bevel gear 12. A third bevel gear 13 is fixedly installed on the shaft of the placement frame 10. The third bevel gear 13 meshes with the corresponding second bevel gear 12.
[0035] The above technical solution can drive the source cavity fixing mechanism to change angle and flip. Changing the angle of the source cavity allows the water gun rinsing mechanism to clean its interior more thoroughly, while flipping the source cavity can remove residual water stains and allow the hot air blower 30 to dry it more thoroughly.
[0036] The movable lifting mechanism includes a second motor 18 fixedly installed on the top of the cover plate 4, a screw 20 rotatably installed on the bottom of the cover plate 4, a fourth bevel gear 19 fixedly installed on the output shaft of the second motor 18, a fifth bevel gear 21 fixedly installed on one end of the screw 20, the fourth bevel gear 19 meshing with the fifth bevel gear 21, a rectangular tube 22 threaded onto the screw 20, a second electric push rod 23 fixedly installed inside the rectangular tube 22, and the output rod of the second electric push rod 23 fixedly connected to the frame 24.
[0037] The above technical solution can drive the water gun rinsing mechanism to adjust its displacement and height. By driving the water gun rinsing mechanism to move horizontally, it can enter the source cavity to rinse the source cavity. At the same time, its movable characteristic also ensures that the water gun rinsing mechanism will not restrict or interfere with the rotation and fixation of the source cavity when it is not in use.
[0038] Two support blocks are fixedly installed at the bottom of the cover plate 4. The screw 20 passes through the two support blocks and is rotatably connected to the two support blocks. Two slide rods are fixedly installed on the two support blocks. Both slide rods pass through the rectangular tube 22 and are slidably connected to the rectangular tube 22.
[0039] Through the above technical solution, the two sliding rods can improve the stability of the rectangular tube 22 without affecting its normal movement.
[0040] A hot air blower 30 is fixedly installed on the top of the cover plate 4. A blower pipe 31 is fixedly installed on the air outlet of the hot air blower 30. The other end of the blower pipe 31 passes through the cover plate 4 and is fixedly connected to the cover plate 4.
[0041] Through the above technical solution, the hot air blower 30, together with the air pipe 31, can dry the cleaned source cavity, so that the source cavity can be reassembled more quickly.
[0042] A booster pump 17 is fixedly installed inside the casing 1. The other end of the hose 26 is fixedly connected to the outlet of the booster pump 17, and the inlet of the booster pump 17 extends to the outside of the casing 1.
[0043] Through the above technical solution, the booster pump 17 can increase the water pressure supplied to the high-pressure nozzle 25, thereby making the water jet sprayed by the high-pressure nozzle 25 have a greater impact force, thus improving the cleaning effect on the source cavity.
[0044] The implementation principle of a device for improving metal contamination in an ion implanter according to an embodiment of this application is as follows:
[0045] First step: In order to improve the metal contamination of the wafer caused by the ion implanter, the ion source cavity that is prone to depositing metal particles needs to be removed, and then the removed source cavity is placed on the placement frame 10. Then, the tightening screw 15 is turned to fix the source cavity on the placement frame 10. Then, the external water pipe is connected to the water inlet of the booster pump 17.
[0046] Second step: Start the two first electric push rods 3. The two first electric push rods 3 drive the cover plate 4 to descend through the output rod. The cover plate 4 drives the source cavity fixing mechanism, the fixed source cavity and the water gun rinsing mechanism to descend until all mechanisms enter the enclosure 2.
[0047] The third step: Start the second motor 18. The second motor 18 drives the fifth bevel gear 21 to rotate through the fourth bevel gear 19. The fifth bevel gear 21 drives the screw 20 to rotate. The screw 20 drives the rectangular cylinder 22, the second electric push rod 23, and the water gun flushing mechanism, so that the high-pressure nozzle 25 continuously penetrates into the source cavity. During this process, the external water source is turned on and the booster pump 17 is started, so that pure water is delivered to the high-pressure nozzle 25 through the hose 26 and sprayed out. At the same time, start the third motor 27. The third motor 27 drives the spur gear 28 to rotate through the output shaft. The spur gear 28 drives the high-pressure nozzle 25 to rotate through the gear ring 29, so that the high-pressure nozzle 25 can thoroughly flush the inside of the source cavity.
[0048] Fourth step: After the initial cleaning is completed, the high-pressure nozzle 25 is withdrawn from the source cavity. Then, the first motor 7 is started. The first motor 7 drives the placement frame 10 and the source cavity to rotate through the first bevel gear 8, drive rod 11, second bevel gear 12 and third bevel gear 13, so that the placement frame 10 and the source cavity rotate 90 degrees clockwise. At this time, the second electric push rod 23 is started. The second electric push rod 23 drives the high-pressure nozzle 25 to rise until the high-pressure nozzle 25 corresponds to another through hole in the source cavity. Then, the high-pressure nozzle 25 is driven into the source cavity by the moving lifting mechanism to rinse another area inside the source cavity.
[0049] Fourth step: When the source cavity is cleaned, the high-pressure nozzle 25 is withdrawn. At this time, the first motor 7 is restarted to drive the placement rack 10 and the source cavity to rotate continuously, thereby removing water stains from the source cavity. Then, the hot air blower 30 is started, and the hot air blower 30 begins to dry the source cavity through the air pipe 31. By cleaning the source cavity, the metal contamination caused to the wafer during the ion implantation process can be improved.
[0050] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.
Claims
1. An apparatus for improving metal contamination in an ion implanter, characterized in that, The system includes: a chassis with an internal frame; a cover plate that is lifted and installed within the chassis; a reversible source cavity fixing mechanism at the bottom of the cover plate; a movable lifting mechanism at the bottom of the cover plate; a water gun rinsing mechanism mounted on the movable lifting mechanism; the water gun rinsing mechanism includes a frame; a high-pressure nozzle is rotatably mounted on the frame; a third motor is fixedly mounted on the frame and is drivenly connected to the high-pressure nozzle; one end of the high-pressure nozzle is rotatably connected to a flexible hose; the source cavity fixing mechanism includes two vertical plates fixedly connected to the bottom of the cover plate; a common placement frame is rotatably mounted on the two vertical plates; a horizontal bar is fixedly mounted on the placement frame; a locking screw is threaded onto the horizontal bar; a limiting frame is provided on the placement frame; a first motor is fixedly mounted on the top of the cover plate; a first bevel gear is fixedly mounted on the output shaft of the first motor; a drive rod is rotatably mounted on the corresponding vertical plate; and the top of the drive rod... The first and second bevel gears are fixedly installed at the bottom and the first bevel gear meshes with the corresponding second bevel gear. A third bevel gear is fixedly installed on the shaft of the placement frame, and the third bevel gear meshes with the corresponding second bevel gear. The moving lifting mechanism includes a second motor fixedly installed on the top of the cover plate. A screw is rotatably installed on the bottom of the cover plate. A fourth bevel gear is fixedly installed on the output shaft of the second motor. A fifth bevel gear is fixedly installed at one end of the screw, and the fourth bevel gear meshes with the fifth bevel gear. A rectangular tube is threaded onto the screw. A second electric push rod is fixedly installed inside the rectangular tube. The output rod of the second electric push rod is fixedly connected to the frame. Two support blocks are fixedly installed at the bottom of the cover plate. The screw passes through the two support blocks and is rotatably connected to the two support blocks. Two sliding rods are fixedly installed on the two support blocks. Both sliding rods pass through the rectangular tube and are slidably connected to the rectangular tube.
2. The apparatus for improving metal contamination in an ion implanter as described in claim 1, characterized in that, Two first electric push rods are fixedly installed on the bottom inner wall of the chassis, and the output rods of the two first electric push rods are fixedly connected to the bottom of the cover plate.
3. The apparatus for improving metal contamination in an ion implanter as described in claim 1, characterized in that, The bottom inner wall of the chassis is fixedly installed with four rectangular sleeves, each sleeve having a telescopic rod slidably installed inside, and the top of each telescopic rod being fixedly connected to the cover plate.
4. The apparatus for improving metal contamination in an ion implanter as described in claim 1, characterized in that, A hot air blower is fixedly installed on the top of the cover plate, and a blower pipe is fixedly installed on the air outlet of the hot air blower. The other end of the blower pipe passes through the cover plate and is fixedly connected to the cover plate.
5. The apparatus for improving metal contamination in an ion implanter as described in claim 1, characterized in that, A booster pump is fixedly installed inside the chassis. The other end of the hose is fixedly connected to the outlet of the booster pump, and the inlet of the booster pump extends outside the chassis.
Citation Information
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