Adhesive, method for producing the same, and use thereof

Abstract

The application provides a glue and a preparation method and application thereof. The glue comprises nitrile rubber, epoxy resin and a coupling agent. Functional groups of the coupling agent include at least two of amino groups, epoxy groups and mercapto groups. The glue has excellent bonding performance and damping and vibration reduction performance, and is beneficial to wide application of industrialization.

Description

Technical Field

[0001] This application relates to the field of materials, specifically to adhesives, their preparation methods, and applications. Background Technology

[0002] Currently, adhesives or damping sheets are used to improve the overall vibration reduction effect between metal substrates. Epoxy resin-based adhesives are commonly used, but their bonding performance varies across different metals, especially on difficult-to-bond metals like aluminum alloys, leading to problems such as overall detachment, bonding failure, and reduced vibration reduction. Therefore, there is a need to develop an adhesive with both good bonding performance and effective vibration reduction. Summary of the Invention

[0003] In view of this, this application provides a method for preparing an adhesive and its application. The adhesive has high bonding strength and good vibration damping effect, which is beneficial to the application of the adhesive.

[0004] In a first aspect, this application provides an adhesive comprising nitrile rubber, epoxy resin, and a coupling agent, wherein the functional groups of the coupling agent include at least two of amino, epoxy, and mercapto groups.

[0005] Optionally, when the functional groups of the coupling agent include amino, epoxy, and mercapto groups, the coupling agent includes an amino coupling agent, an epoxy coupling agent, and a mercapto coupling agent, and the mass ratio of the amino coupling agent, the epoxy coupling agent, and the mercapto coupling agent is (1-4):(1-3):(4-8).

[0006] Optionally, the coupling agent has the structural formula Y-R1-R2, where Y includes -NH-R3, Or -S-R5, wherein R1 is selected from alkylene or alkoxyene, R2 is selected from siloxane or heteroarylthiol, R4 is selected from at least one of single bond, alkylene, alkenyl, alkynyl, aryl, arylalkyl, heteroaryl, heteroarylalkyl, alicyclic and imino, and R3 and R5 are independently selected from hydrogen atom, sodium atom, alkyl, alkenyl, alkynyl, aryl, arylalkyl, heteroaryl, heteroarylalkyl, alicyclic or amino.

[0007] Optionally, the adhesive may further include at least one of a plasticizer, a vulcanizing agent, a crosslinking aid, an epoxy curing agent, an epoxy accelerator, and a solvent.

[0008] Optionally, the plasticizer includes at least one of terpene resin, coumarone resin, modified phenolic resin, and modified rosin resin.

[0009] Optionally, the vulcanizing agent includes at least one of sulfur, tetramethylthiuram disulfide, tetraethylthiuram disulfide, and dicumyl peroxide.

[0010] Optionally, the crosslinking aid includes at least one of zinc oxide, stearic acid, and triallyl isocyanurate.

[0011] Optionally, the epoxy curing agent includes at least one of amine curing agents, acid anhydride curing agents, and isocyanate curing agents.

[0012] Optionally, the epoxy accelerator includes at least one of tertiary amine accelerators, imidazole accelerators, substituted urea accelerators, organic guanidine accelerators, and acetylacetone metal salt accelerators.

[0013] Optionally, the solvent includes at least one of ketones, esters, and halogenated hydrocarbons.

[0014] Optionally, the solvent in the adhesive comprises 70%-75% by mass.

[0015] Optionally, the solid content of the adhesive is 25%-30%.

[0016] Optionally, the adhesive comprises, by weight percentage, 12.5%-27% of the nitrile rubber, 2%-10.5% of the epoxy resin, 0.175%-2.1% of the coupling agent, 0.125%-1.05% of the plasticizer, 0.025%-0.3% of the vulcanizing agent, 0.025%-0.3% of the crosslinking aid, 0.125%-1.05% of the epoxy curing agent, and 0.03%-0.75% of the epoxy accelerator.

[0017] The adhesive provided in this application includes nitrile rubber, epoxy resin, and a coupling agent. The nitrile rubber and epoxy resin form a dual-curing crosslinking system, which improves the vibration damping performance of the adhesive. The coupling agent includes a variety of different functional groups, which further improves the bonding performance of the adhesive, thus making it easier to obtain an adhesive with good overall performance.

[0018] Secondly, this application provides a method for preparing an adhesive, comprising:

[0019] An adhesive is obtained by mixing nitrile rubber, epoxy resin and coupling agent; wherein the functional groups of the coupling agent include at least two of amino, epoxy and mercapto groups.

[0020] The adhesive preparation method provided in this application is novel, the preparation process is simple, and the prepared product has excellent performance.

[0021] Thirdly, this application provides a vibration damping structure, which includes at least two metal substrates and a connecting layer disposed between adjacent metal substrates. The raw material of the connecting layer includes the adhesive described in the first aspect or the adhesive prepared by the preparation method described in the second aspect.

[0022] Optionally, the thickness of the connecting layer is 50μm-80μm.

[0023] Optionally, the peel strength between the metal substrate and the connecting layer is greater than or equal to 4.5 N / mm, and the damping loss factor of the vibration reduction structure is greater than or equal to 0.26.

[0024] This application provides a vibration reduction structure with excellent damping and vibration reduction performance, light overall weight, which can meet the needs of industrial use and is conducive to the industrial application of vibration reduction structures.

[0025] Fourthly, this application provides a vehicle that includes the vibration damping structure described in the third aspect.

[0026] The vehicle provided in this application has excellent vibration reduction performance, which is conducive to its widespread use. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. The specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0028] Figure 1 This is a cross-sectional schematic diagram of a vibration reduction structure provided in one embodiment of this application.

[0029] Figure 2 This is a topographic view of the peeled surface of the vibration damping structure provided in Embodiment 1 of this application after peeling.

[0030] Figure 3 This is a topographic image of the peeled surface of the vibration damping structure provided in Comparative Example 1 of this application. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0032] This application provides an adhesive comprising nitrile rubber, epoxy resin, and a coupling agent. The coupling agent has functional groups including at least two of amino, epoxy, and mercapto groups. The nitrile rubber and epoxy resin constitute a dual-curing crosslinking system, interpenetrating each other to form a polymer network structure. This polymer network structure increases the degree of crosslinking of the adhesive, improving its damping and vibration reduction performance. The coupling agent has functional groups including at least two of amino, epoxy, and mercapto groups. These multiple functional groups can work synergistically to further improve the adhesive's bonding performance. The amino groups can undergo ring-opening addition with the epoxy groups of the epoxy resin, improving the adhesion between the epoxy resin and the metal matrix. The mercapto groups can react with the unsaturated bonds in the rubber to form chemical bonds, enhancing the bonding strength between the rubber and the metal matrix. The epoxy groups react with the epoxy resin and amino groups, enhancing the cohesive force of the adhesive, thereby improving its bonding ability. This adhesive exhibits strong bonding ability and good damping and vibration reduction performance, which is beneficial for its industrial application.

[0033] In this application, nitrile rubber is a copolymer of butadiene and acrylonitrile, exhibiting strong adhesive properties. It is generally classified based on the acrylonitrile content in the copolymer. In some embodiments, the acrylonitrile content of the nitrile rubber is 25%-52%. Specifically, the acrylonitrile content of the nitrile rubber can be, but is not limited to, 25%, 30%, 35%, 40%, 45%, 50%, or 52%. In one embodiment of this application, the acrylonitrile content of the nitrile rubber is 25%-35%. In another embodiment of this application, the acrylonitrile content of the nitrile rubber is 30%-40%.

[0034] In this application, epoxy resin is an excellent adhesive material with good bonding ability. Under suitable conditions, it can form a dual-curing crosslinking system with nitrile rubber, forming an interpenetrating polymer network structure, thereby further increasing the degree of crosslinking and improving the damping and vibration reduction performance of the adhesive. Specifically, the epoxy resin can be, but is not limited to, E54 epoxy resin, E44 epoxy resin, or BE188 epoxy resin, etc. In one embodiment of this application, the epoxy resin can be E54 epoxy resin. In another embodiment of this application, the epoxy resin can be E44 epoxy resin.

[0035] In this application, the functional groups of the coupling agent include at least two of amino, epoxy, and mercapto groups. Different functional groups can enhance the adhesive ability of the adhesive and improve the adhesion between metal matrices. There are no limitations on the selection, connection order, position, or number of functional groups. That is, the same coupling agent can simultaneously include any two of the amino, epoxy, and mercapto functional groups, or it can simultaneously include all three functional groups. Furthermore, multiple different coupling agents can exist, with each coupling agent connecting only one functional group. For example, a coupling agent connecting only an amino group forms an amino coupling agent; a coupling agent connecting only an epoxy group forms an epoxy coupling agent; and a coupling agent connecting only a mercapto group forms a mercapto coupling agent. In one embodiment of this application, the coupling agent includes at least two of amino, epoxy, and mercapto coupling agents. In another embodiment of this application, the coupling agent includes an amino coupling agent, an epoxy coupling agent, and a mercapto coupling agent.

[0036] In one embodiment of this application, the coupling agent has the structural formula Y-R1-R2, where Y includes -NH-R3, Or -S-R5, where R1 includes alkylene or alkoxyene, R2 includes siloxane or heteroaryl mercapto, R4 includes at least one of a single bond, alkylene, alkenylene, alkynylene, arylene, arylalkylene, heteroarylene, heteroarylalkylene, alicyclic group, and imino group, and R3 and R5 are independently selected from hydrogen atom, sodium atom, alkyl, alkenyl, alkynyl, aryl, arylalkyl, heteroaryl, heteroarylalkyl, alicyclic group, or amino group.

[0037] In one embodiment of this application, an alkyl group is an alkane molecule with one hydrogen atom removed, including straight-chain alkyl groups and branched-chain alkyl groups. The number of carbon atoms in an alkyl group is 1-8. Specifically, the number of carbon atoms in an alkyl group can be, but is not limited to, 1, 2, 3, 4, 5, 6, 7, or 8. Exemplarily, an alkyl group can include, but is not limited to, at least one selected from methyl, ethyl, n-propyl, n-butyl, isobutyl, n-pentyl, 2-methylbutyl, 2,2-dimethylpropyl, n-hexyl, heptyl, 2-methylhexyl, 5-methylpentyl, 2-ethylbutyl, 3-ethylbutyl, nonyl, and decyl. In one embodiment of this application, the alkyl group can be methyl. In another embodiment of this application, the alkyl group can be ethyl.

[0038] In one embodiment of this application, an alkylene group is a divalent saturated group formed by removing one hydrogen atom from an alkyl group, including straight-chain alkylene groups and linear alkylene groups. The number of carbon atoms in an alkylene group is 1-8. Specifically, the number of carbon atoms in an alkylene group can be, but is not limited to, 1, 2, 3, 4, 5, 6, 7, or 8. Exemplarily, an alkylene group can include, but is not limited to, at least one of methylene, ethylene, propylene, 2-propylene, butylene, and pentylene. In one embodiment of this application, the alkylene group can be propylene. In another embodiment of this application, the alkylene group can be butylene.

[0039] In one embodiment of this application, the alkeneoxy group is a complex group formed by the linkage of an alkylene group and an oxygen atom. The number of carbon atoms in the alkeneoxy group is 1-8. Specifically, the number of carbon atoms in the alkeneoxy group may be, but is not limited to, 1, 2, 3, 4, 5, 6, 7, or 8. Exemplarily, the alkeneoxy group may include, but is not limited to, at least one of -CH2O-, -CH2CH2O-, -CH2CH2CH2O-, -CH2CH2CH2CH2O-, -CH2CH2CH2CH2CH2O-, and -CH2CH2CH2CH2CH2CH2O-. In one embodiment of this application, the alkeneoxy group may be -CH2CH2CH2O-.

[0040] In one embodiment of this application, the siloxane alkyl group has the structural formula -Si(O(CH2)). n CH3)3, where n is an integer greater than or equal to 0. Specifically, the value of n can be, but is not limited to, 0, 1, 2, 3, 4, 5, 6, 7, or 8. For example, the siloxane alkyl group can include, but is not limited to, at least one of -Si(OCH3)3, -Si(OCH2CH3)3, -Si(O(CH2)2CH3)3, -Si(O(CH2)4CH3)3, and -Si(O(CH2)6CH3)3. In one embodiment of this application, the siloxane alkyl group can be -Si(OCH3)3. In another embodiment of this application, the siloxane alkyl group can be -Si(OCH2CH3)3.

[0041] In one embodiment of this application, the alkenyl group is a divalent unsaturated hydrocarbon chain containing at least one double bond, and may include straight-chain alkenyl groups and branched alkenyl groups. Specifically, the number of carbon atoms in the alkenyl group may be, but is not limited to, 2, 3, 4, 5, 6, 7, or 8. Exemplarily, the alkenyl group may include, but is not limited to, at least one selected from vinyl, propenyl, butadienyl, pentenyl, hexadienyl, heptenyl, octenyl, nonenyl, and decenyl. In one embodiment of this application, the alkenyl group may be butadienyl.

[0042] In one embodiment of this application, the alkynyl group is a divalent unsaturated hydrocarbon chain containing at least one triple bond, and may include straight-chain alkynyl groups and branched-chain alkynyl groups. Specifically, the number of carbon atoms in the alkynyl group may be, but is not limited to, 2, 3, 4, 5, 6, 7, or 8. Exemplarily, the alkynyl group may include, but is not limited to, at least one of ethynyl, propynyl, butynyl, pentyynyl, and hexynyl. In one embodiment of this application, the alkynyl group may be propynyl.

[0043] In one embodiment of this application, the aryl group is an aromatic group. The aryl group has 6-30 carbon atoms. Specifically, the aryl group may have, but is not limited to, 6, 10, 12, 14, 18, 22, 24, 26, or 30 carbon atoms. Specifically, the aryl group may include, but is not limited to, at least one of phenyl, naphthyl, anthraceneyl, tetraphenyl, pentaphenyl, and tetrahydronaphthyl.

[0044] In one embodiment of this application, the heteroarylalkyl group is a complex group formed by linking a heteroaryl group and an alkylene group. The heteroarylalkyl group has 2-40 carbon atoms. Specifically, the number of carbon atoms in the heteroarylalkyl group can be, but is not limited to, 5, 6, 10, 13, 18, 22, 27, 30, 33, or 39. Specifically, the heteroarylalkyl group can include, but is not limited to, […]. At least one of them. In one embodiment of this application, the heteroarylalkyl group can be...

[0045] In one embodiment of this application, the heteroaryl thiol is a complex group formed by linking a heteroaryl group and a thiol group, and the heteroaryl thiol has 2-40 carbon atoms. Specifically, the number of carbon atoms in the heteroaryl thiol can be, but is not limited to, 5, 6, 10, 13, 18, 22, 27, 30, 33, or 39. Exemplarily, the heteroaryl thiol can include, but is not limited to, […]. In one embodiment of this application, the heteroaryl mercapto group can be...

[0046] In one embodiment of this application, when Y is -NH-R3 and R2 is a siloxane group in the coupling agent's structural formula, the coupling agent is an aminosilane coupling agent. In aminosilane coupling agents, the siloxane group contains -O(CH2). n CH3 readily hydrolyzes to form silanols. The siloxane groups can undergo hydrolytic condensation reactions with water molecules on the metal matrix surface to form siloxanes, resulting in chemical cross-linking. The amino groups undergo ring-opening addition with the epoxy groups of the epoxy resin, thereby connecting the metal matrix and the epoxy resin polymer through the aminosilane coupling agent, achieving coupling at the anisotropic interface and improving adhesion. Specifically, the aminosilane coupling agent may include, but is not limited to, at least one of γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, anilinemethyltriethoxysilane, and N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane. In one embodiment of this application, the amino coupling agent may be γ-aminopropyltriethoxysilane.

[0047] In one embodiment of this application, in the coupling agent structural formula, Y is... When R2 is a siloxane, the coupling agent is an epoxy silane coupling agent. The epoxy silane coupling agent bonds with the metal matrix and reacts with the amino coupling agent, enhancing the cohesive force of the adhesive and further improving its bonding ability. Specifically, the epoxy silane coupling agent may include, but is not limited to, at least one of γ-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane. In one embodiment of this application, the epoxy silane coupling agent may be γ-glycidoxypropyltrimethoxysilane.

[0048] In one embodiment of this application, in the coupling agent structural formula, Y is -S-R5, in which case the coupling agent is a mercapto coupling agent. In the mercapto coupling agent, the mercapto group can undergo an addition reaction with the unsaturated bonds in the nitrile rubber to form a chemical bond, thereby enhancing the adhesion between the nitrile rubber and the metal matrix. Specifically, the mercapto coupling agent may include, but is not limited to, at least one of 3-mercaptopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, and monosodium trithiocyanate. In one embodiment of this application, the mercapto coupling agent can be monosodium trithiocyanate. The mercapto group can undergo an addition reaction with the unsaturated bonds in the nitrile rubber to form a chemical bond, while the inorganic metal salt group can form a coordination bond with the surface of the metal matrix, further improving the adhesion of the adhesive. In another embodiment of this application, the mercapto coupling agent can be 3-mercaptopropyltriethoxysilane.

[0049] In one embodiment of this application, when the coupling agent includes at least two of amino coupling agents, epoxy coupling agents, and mercapto coupling agents, the mass ratio of any two coupling agents can be 1:(0.67-5). Specifically, the mass ratio of any two coupling agents can be, but is not limited to, 1:0.67, 1:1, 1:1.5, 1:2, 1:2.5, 1:3, 1:4, or 1:5. In one embodiment of this application, the mass ratio of amino coupling agent to epoxy coupling agent can be 1:(1-2). In another embodiment of this application, the mass ratio of amino coupling agent to mercapto coupling agent can be 1:(1.5-3). In yet another embodiment of this application, the mass ratio of mercapto coupling agent to epoxy coupling agent can be 1:(2.5-5).

[0050] In one embodiment of this application, when the coupling agent includes an amino coupling agent, an epoxy coupling agent, and a mercapto coupling agent, the mass ratio of the amino coupling agent, the epoxy coupling agent, and the mercapto coupling agent can be (1-4):(1-3):(4-8). The amino coupling agent can react with the epoxy resin to promote the adhesion between the epoxy resin and the metal matrix. The mercapto coupling agent with a higher content can react with nitrile rubber to promote the curing of the epoxy coupling agent and improve the adhesion between the nitrile rubber and the metal matrix. The epoxy coupling agent can react with the amino coupling agent and the epoxy resin to improve the cohesive force of the adhesive, which is beneficial to further improve the adhesion of the adhesive. Specifically, the mass ratio of the amino coupling agent, epoxy coupling agent, and mercapto coupling agent can be, but is not limited to, 1:1:4, 1:1.5:4, 1.5:1:4.5, 2:1:4.5, 2:2.5:5, 2.5:3:4.5, 3:2.5:5, 3:2.5:6, 3.5:2.5:7, 4:3:7.5, or 4:3:8, etc. In one embodiment of this application, the mass ratio of the amino coupling agent, epoxy coupling agent, and mercapto coupling agent can be (1-1.5):(1-2):(4-6). In another embodiment of this application, the mass ratio of the amino coupling agent, epoxy coupling agent, and mercapto coupling agent can be (2.5-4):(1.5-3):(5-8).

[0051] In one embodiment of this application, the adhesive further includes at least one of a plasticizer, a vulcanizing agent, a crosslinking aid, an epoxy curing agent, an epoxy accelerator, and a solvent, which can improve the damping and vibration resistance performance and bonding ability of the adhesive.

[0052] In one embodiment of this application, the solvent includes at least one of ketones, esters, or chlorinated hydrocarbons. Specifically, the solvent may include, but is not limited to, at least one of acetone, methyl ethyl ketone, acetone, chloroform, dichloroethylene, trichloroethylene, ethyl acetate, nitromethane, nitrobenzene, propyltrichloromethane, ethyl acetate, dioxane, butyl acetate, and propylene glycol methyl ether acetate. In one embodiment of this application, the solvent may be ethyl acetate.

[0053] In one embodiment of this application, the solvent mass percentage in the adhesive is 70%-75%, which yields an adhesive with good flow properties and suitable viscosity, thereby improving the adhesive's coating ability. Specifically, the solvent mass percentage can be, but is not limited to, 70%, 71%, 72%, 73%, 74%, or 75%. In one embodiment of this application, the solvent mass percentage in the adhesive can be 70%-72.5%. In another embodiment of this application, the solvent mass percentage in the adhesive can be 71%-75%.

[0054] In one embodiment of this application, the solid content of the adhesive is 25%-30%. Specifically, the solid content of the adhesive can be, but is not limited to, 25%, 26%, 27%, 28%, 29%, or 30%. In one embodiment of this application, the solid content of the adhesive can be 25%-27%. In another embodiment of this application, the solid content of the adhesive can be 26%-30%.

[0055] In one embodiment of this application, the mass percentage of nitrile rubber in the adhesive is 12.5%-27%. Nitrile rubber can improve the adhesive's bonding ability and damping vibration resistance. Specifically, the mass percentage of nitrile rubber can be, but is not limited to, 12.5%, 15%, 17%, 20%, 22%, 25%, 26%, or 27%. In one embodiment of this application, the mass percentage of nitrile rubber can be 12.5%-20%. In another embodiment of this application, the mass percentage of nitrile rubber can be 15%-27%.

[0056] In one embodiment of this application, the epoxy resin in the adhesive comprises 2%-10.5% by mass. The epoxy resin and nitrile rubber form a dual-curing crosslinking system, which can improve the damping and vibration reduction performance of the adhesive. Specifically, the mass percentage of epoxy resin can be, but is not limited to, 2%, 3%, 5%, 6%, 7%, 8%, 9%, or 10.5%. In one embodiment of this application, the epoxy resin can be 2%-5%. In another embodiment of this application, the epoxy resin can be 3%-10.5%.

[0057] In one embodiment of this application, the mass percentage of the coupling agent in the adhesive is 0.175%-2.1%. The use of multiple coupling agents creates a synergistic effect, and an appropriate coupling agent content can further improve the adhesion performance of the adhesive to the metal matrix. Specifically, the mass percentage of the coupling agent can be, but is not limited to, 0.175%, 0.18%, 0.2%, 0.5%, 1%, 1.5%, 1.8%, 2%, or 2.1%. In one embodiment of this application, the mass percentage of the coupling agent can be 0.175%-1.5%. In another embodiment of this application, the mass percentage of the coupling agent can be 1%-2.1%.

[0058] In this application, plasticizers enhance the plasticity and flexibility of adhesives, which is beneficial for their widespread application. Specifically, plasticizers may include, but are not limited to, at least one of terpene resins, coumarone resins, modified phenolic resins, and modified rosin resins. In one embodiment of this application, the plasticizer may be a modified phenolic resin. In another embodiment of this application, the plasticizer may be a terpene resin.

[0059] In one embodiment of this application, the mass percentage of the plasticizer in the adhesive is 0.125%-1.05%. Specifically, the mass percentage of the plasticizer can be, but is not limited to, 0.125%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, or 1.05%. In one embodiment of this application, the mass percentage of the plasticizer can be 0.125%-0.3%. In another embodiment of this application, the mass percentage of the plasticizer can be 0.2%-1.05%.

[0060] In this application, the vulcanizing agent promotes the crosslinking degree of nitrile rubber, enhances its structural stability and durability, and extends the service life of the adhesive. Specifically, the vulcanizing agent may include, but is not limited to, at least one of sulfur, tetramethylthiuram disulfide, tetraethylthiuram disulfide, and dicumyl peroxide. In one embodiment of this application, the vulcanizing agent may be sulfur. In another embodiment of this application, the vulcanizing agent may be dicumyl peroxide.

[0061] In one embodiment of this application, the mass percentage of the vulcanizing agent in the adhesive is 0.025%-0.3%. Specifically, the mass percentage of the vulcanizing agent can be, but is not limited to, 0.025%, 0.08%, 0.1%, 0.15%, 0.2%, 0.25%, or 0.3%. In one embodiment of this application, the mass percentage of the vulcanizing agent can be 0.025%-0.15%. In another embodiment of this application, the mass percentage of the vulcanizing agent can be 0.1%-0.3%.

[0062] In this application, the crosslinking aid can improve the degree of crosslinking of epoxy resin and nitrile rubber, thereby improving the vibration damping performance of the adhesive. Specifically, the crosslinking aid may include, but is not limited to, at least one of zinc oxide, stearic acid, and triallyl isocyanurate. In one embodiment of this application, the crosslinking aid may be zinc oxide. In another embodiment of this application, the crosslinking aid may be triallyl isocyanurate.

[0063] In one embodiment of this application, the mass percentage of the crosslinking aid in the adhesive is 0.025%-0.3%. The specific mass percentage of the crosslinking aid can be, but is not limited to, 0.025%, 0.08%, 0.1%, 0.15%, 0.2%, 0.25%, or 0.3%. In one embodiment of this application, the mass percentage of the crosslinking aid can be 0.025%-0.15%. In another embodiment of this application, the mass percentage of the crosslinking aid can be 0.1%-0.3%.

[0064] In this application, the epoxy curing agent reacts chemically with the epoxy resin to form a network structure. Specifically, the epoxy curing agent may include, but is not limited to, at least one of amine curing agents, acid anhydride curing agents, and isocyanate curing agents. For example, amine curing agents may include, but are not limited to, at least one of dicyandiamide, ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, diethylaminopropylamine, and phenylenediamine; acid anhydride curing agents may include, but are not limited to, at least one of maleic anhydride and phthalic anhydride; and isocyanate curing agents may include, but are not limited to, at least one of toluene diisocyanate and diphenylmethane diisocyanate. In one embodiment of this application, when the epoxy curing agent is an amine curing agent, the amine curing agent is a latent curing agent, exhibiting high long-term stability at room temperature but capable of curing under specific conditions. An example epoxy curing agent may be ethylenediamine. In another embodiment of this application, when the epoxy curing agent is an isocyanate curing agent, the isocyanate curing agent may be toluene diisocyanate.

[0065] In one embodiment of this application, the mass percentage of epoxy curing agent in the adhesive is 0.125%-1.05%. Specifically, the mass percentage of epoxy curing agent can be, but is not limited to, 0.125%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, or 1.05%. In one embodiment of this application, the mass percentage of epoxy curing agent can be 0.125%-0.5%. In another embodiment of this application, the mass percentage of epoxy curing agent can be 0.2%-1.05%.

[0066] In this application, the epoxy accelerator accelerates the reaction rate of epoxy resin and epoxy curing agent, reduces the reaction temperature, and shortens the reaction time. Specifically, the epoxy accelerator may include, but is not limited to, at least one of tertiary amine accelerators, imidazole accelerators, substituted urea accelerators, organic guanidine accelerators, and acetylacetone metal salt accelerators. For example, tertiary amine accelerators may include, but are not limited to, at least one of 2,4,6-tris(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol, triethylamine, triethanolamine, and o-hydroxybenzyl dimethylamine; imidazole accelerators may include, but are not limited to, at least one of phenol, resorcinol, o-cresol, nonylphenol, and bisphenol A; substituted urea accelerators may include, but are not limited to, at least one of N,N'-(4-methyl-m-phenylene)bis(N',N'-dimethylurea), N-(2-hydroxyphenyl)-N',N'-dimethylurea, N-(2-hydroxy-4-nitrobenzene)-N',N'-dimethylurea, N-(5-chloro-2-hydroxybenzene)-N',N'-dimethylurea, N-(4-chlorophenyl)-N',N'-dimethylurea, and N-(4-chloro-2-hydroxybenzene)-N',N'-dimethylurea. In one embodiment of this application, when the epoxy accelerator is a tertiary amine accelerator, the epoxy accelerator can be 2,4,6-tris(dimethylaminomethyl)phenol. In another embodiment of this application, when the epoxy accelerator is a substituted urea accelerator, the epoxy accelerator can be N-(2-hydroxyphenyl)-N',N'-dimethylurea.

[0067] In one embodiment of this application, the mass percentage of the epoxy accelerator in the adhesive is 0.03%-0.75%. Specifically, the mass percentage of the epoxy accelerator can be, but is not limited to, 0.03%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, or 0.75%. In one embodiment of this application, the mass percentage of the epoxy accelerator can be 0.03%-0.4%. In another embodiment of this application, the mass percentage of the epoxy accelerator can be 0.3%-0.75%.

[0068] In one embodiment of this application, the mass ratio of nitrile rubber to epoxy resin is (1.9-6.1):1, which is beneficial for further improving the adhesive's bonding performance. Specifically, the mass ratio of nitrile rubber to epoxy resin can be, but is not limited to, 1.9:1, 2.5:1, 3:1, 4:1, 5:1, or 6.1:1. In one embodiment of this application, the mass ratio of nitrile rubber to epoxy resin is (1.9-4):1. In another embodiment of this application, the mass ratio of nitrile rubber to epoxy resin is (3-6.1):1.

[0069] In one embodiment of this application, the mass ratio of nitrile rubber to coupling agent is (12-18.7):1, which is beneficial for further improving the vibration damping performance of the adhesive after curing. Specifically, the mass ratio of nitrile rubber to coupling agent can be, but is not limited to, 12:1, 13:1, 14:1, 15:1, 16:1, 17:1, or 18:1. In one embodiment of this application, the mass ratio of nitrile rubber to coupling agent can be (12-15):1. In another embodiment of this application, the mass ratio of nitrile rubber to coupling agent can be (14-18.7):1.

[0070] In one embodiment of this application, the mass ratio of nitrile rubber, epoxy resin, and coupling agent is (12-18.7):5.3:1, which is beneficial for further improving the adhesive's bonding performance and vibration damping performance after curing. Specifically, the mass ratio of nitrile rubber, epoxy resin, and coupling agent can be, but is not limited to, 12:5.3:1, 13:5.3:1, 14:5.3:1, 15:5.3:1, 16:5.3:1, 17:5.3:1, or 18.7:5.3:1, etc. In one embodiment of this application, the mass ratio of nitrile rubber, epoxy resin, and coupling agent can be (12-15):5.3:1. In another embodiment of this application, the mass ratio of nitrile rubber, epoxy resin, and coupling agent can be (14-18.7):5.3:1.

[0071] In one embodiment of this application, the mass ratio of nitrile rubber, epoxy resin, coupling agent, plasticizer, vulcanizing agent, crosslinking aid, epoxy curing agent and epoxy accelerator is (50-90):(8-35):(0.7-7):(0.5-3.5):(0.1-1):(0.1-1):(0.5-3.5):(0.1-2.5). Specifically, the mass ratio of nitrile rubber, epoxy resin, coupling agent, plasticizer, vulcanizing agent, crosslinking aid, epoxy curing agent, and epoxy accelerator can be, but is not limited to, 50:8:0.7:0.5:0.1:0.1:0.5:0.1, 55:15:2:1:0.2:0.2:1:0.3, 60:18:4:1.5:0.3:0.4:0.8:0.5, 70:20:4:2:0.5:0.5:2:1, 75:25:5:2:0.8:0.7:2.5:1.2, 80:30:6:2.5:0.8:0.8:2.8:1.9, or 90:35:7:3.5:1:1:3.5:2.5, etc. In one embodiment of this application, the mass ratio of nitrile rubber, epoxy resin, coupling agent, plasticizer, vulcanizing agent, crosslinking aid, epoxy curing agent, and epoxy accelerator can be (50-65):(8-20):(0.7-5):(0.5-1.5):(0.1-0.4):(0.1-0.5):(0.5-1.8):(0.1-1.4). In another embodiment of this application, the mass ratio of nitrile rubber, epoxy resin, coupling agent, plasticizer, vulcanizing agent, crosslinking aid, epoxy curing agent, and epoxy accelerator can be (60-90):(15-35):(2-7):(1-3.5):(0.35-1):(0.45-1):(1.5-3.5):(1-2.5).

[0072] This application also provides a method for preparing an adhesive, comprising mixing nitrile rubber, epoxy resin, and a coupling agent to obtain the adhesive, wherein the functional groups of the coupling agent include at least two of amino, epoxy, and mercapto groups. The preparation method provided in this application is simple, novel, has a short process, and low cost, which is beneficial for the industrial-scale preparation of adhesives.

[0073] In one embodiment of this application, the method for preparing the adhesive further includes: dissolving nitrile rubber in a solvent, heating and stirring to obtain a first solution; adding epoxy resin, coupling agent, plasticizer, vulcanizing agent, crosslinking aid, epoxy curing agent, and epoxy accelerator to the solvent to obtain a second solution; and mixing the first solution and the second solution to obtain the adhesive. In some embodiments, the mixing of the second solution can be performed in an ultrasonic machine. In some embodiments, the mixing of the first solution and the second solution can be performed in a reaction vessel.

[0074] In one embodiment of this application, the heating and stirring temperature is 40℃-70℃ to promote the dissolution of nitrile rubber and prevent excessive evaporation of the solvent. Specifically, the heating and stirring temperature can be, but is not limited to, 40℃, 45℃, 50℃, 55℃, 60℃, 65℃, or 70℃. In one embodiment of this application, the heating and stirring temperature can be 40℃-60℃. In another embodiment of this application, the heating and stirring temperature can be 55℃-70℃.

[0075] In one embodiment of this application, the heating and stirring speed is 300 rpm-500 rpm to accelerate the dissolution of nitrile rubber. Specific heating and stirring speeds can be, but are not limited to, 300 rpm, 320 rpm, 350 rpm, 400 rpm, 420 rpm, 450 rpm, or 800 rpm. In one embodiment of this application, the heating and stirring speed can be 300 rpm-400 rpm. In another embodiment of this application, the heating and stirring speed can be 350 rpm-500 rpm.

[0076] Please see Figure 1 This is a cross-sectional schematic diagram of a vibration damping structure provided in one embodiment of this application. The vibration damping structure 100 includes at least two metal substrates 10 and a connecting layer 20 disposed between adjacent metal substrates 10. The material of the connecting layer 20 includes the adhesive used in any of the above embodiments. This vibration damping structure has excellent damping performance, strong bonding reliability, and light overall weight, meeting the needs of industrial use and facilitating the industrial application of vibration damping structures. In this application, the use of adhesives in the metal substrates can improve the bonding ability between the metal substrates. In one embodiment of this application, the material of the metal substrate includes at least one of aluminum, copper, iron, zinc, nickel, cobalt, magnesium, and their alloys. Specifically, the metal substrate can be, but is not limited to, steel or difficult-to-bond metals, such as aluminum alloys (1-series aluminum, 2-series aluminum, 3-series aluminum, 5-series aluminum, or 6-series aluminum). In one embodiment of this application, the metal substrate can be 5-series aluminum, and the adhesive has excellent bonding ability to 5-series aluminum.

[0077] In this application, the vibration damping structure has at least two metal substrates. Specifically, the number of metal substrates can be, but is not limited to, 2, 3, 4, 5, 6, 10, 15, or 18. In one embodiment of this application, the number of metal substrates can be 2, in which case a connecting layer is provided between adjacent metal substrate layers, forming a "sandwich" structure, further improving the bonding ability between the metal substrates and the vibration damping performance. In another embodiment of this application, the number of metal substrates can be 5, and a connecting layer is provided between any two adjacent metal substrate layers, further improving the bonding ability between the metal substrates and the vibration damping performance.

[0078] In one embodiment of this application, the thickness of the connecting layer is 50μm-80μm, which can further improve the vibration reduction capability and bonding performance of the vibration damping structure. Specifically, the thickness of the connecting layer can be, but is not limited to, 50μm, 55μm, 60μm, 65μm, 70μm, 75μm, or 80μm. In one embodiment of this application, the thickness of the connecting layer can be 50μm-65μm. In another embodiment of this application, the thickness of the connecting layer can be 60μm-80μm.

[0079] In one embodiment of this application, the peel strength between the metal substrate and the connecting layer in the vibration damping structure is greater than or equal to 4.5 N / mm, indicating strong bonding strength between the metal substrate and the connecting layer, and high structural reliability and stability of the vibration damping structure. The peel strength testing method involves placing a 60 μm thick connecting layer between two adjacent 0.8 mm thick metal substrates, and performing peel strength tests according to GB / T2791-1995 standard, recording the peel strength and the failure state. This peel strength is a T-type peel strength. Specifically, the peel strength between the metal substrate and the connecting layer can be, but is not limited to, greater than or equal to 4.5 N / mm, greater than or equal to 5 N / mm, greater than or equal to 5.2 N / mm, greater than or equal to 5.5 N / mm, greater than or equal to 6 N / mm, or greater than or equal to 7 N / mm. In one embodiment of this application, the peel strength between the metal substrate and the connecting layer can be greater than or equal to 5 N / mm. In another embodiment of this application, the peel strength between the metal substrate and the connecting layer can be 4.5 N / mm to 7 N / mm.

[0080] In one embodiment of this application, the damping loss factor of the vibration damping structure is greater than or equal to 0.26, indicating that the greater the viscosity of the vibration damping structure, the higher the bonding effect of the adhesive. Specifically, the damping loss factor of the vibration damping structure can be, but is not limited to, greater than or equal to 0.26, greater than or equal to 0.27, greater than or equal to 0.28, greater than or equal to 0.3, greater than or equal to 0.35, or greater than or equal to 0.5. In one embodiment of this application, the damping loss factor of the vibration damping structure is greater than or equal to 0.3. In another embodiment of this application, the damping loss factor of the vibration damping structure can be between 0.26 and 0.5.

[0081] The vibration damping structure in this application maintains high bonding reliability even under prolonged high-temperature conditions. In one embodiment of this application, after drying at 150°C for 15 hours, the peel strength between the metal substrate and the connecting layer in the vibration damping structure is greater than or equal to 4.0 N / mm, and the damping loss factor of the vibration damping structure is greater than or equal to 0.32.

[0082] In one embodiment of this application, a method for preparing a vibration damping structure is provided, comprising: coating an adhesive onto the surface of a metal substrate, and attaching another metal substrate to the adhesive surface, followed by curing to obtain the vibration damping structure. The method for preparing the vibration damping structure is simple to operate and can solve the problems of slippage and cracking during use, which is beneficial for industrial applications. In some embodiments, the metal substrate may be cleaned with ethanol before coating.

[0083] In one embodiment of this application, a solvent removal treatment is included before curing. The solvent removal treatment temperature is 90℃-110℃, which can remove excess solvent from the adhesive and improve the bonding strength. Specifically, the solvent removal treatment temperature can be, but is not limited to, 90℃, 95℃, 100℃, 102℃, 105℃, or 110℃. In one embodiment of this application, the solvent removal treatment temperature can be 90℃-100℃. In another embodiment of this application, the solvent removal treatment temperature can be 95℃-110℃.

[0084] In one embodiment of this application, the solvent removal treatment time is 8-12 minutes to avoid excessive solvent evaporation, which would cause the adhesive to lose its fluidity and bonding ability. Specifically, the solvent removal treatment time can be, but is not limited to, 8 minutes, 9 minutes, 10 minutes, 11 minutes, or 12 minutes. In one embodiment of this application, the solvent removal treatment time can be 8-10 minutes.

[0085] In one embodiment of this application, the curing temperature is 130℃-180℃, which improves the bonding strength and vibration damping capacity of the vibration-damping structure. Specifically, the curing temperature can be, but is not limited to, 130℃, 135℃, 140℃, 150℃, 155℃, 160℃, 170℃, or 180℃. In one embodiment of this application, the curing temperature can be 130℃-160℃. In another embodiment of this application, the curing temperature can be 150℃-180℃. In one embodiment of this application, the curing time is 1h-3h. Specifically, the curing time can be, but is not limited to, 1h, 1.5h, 1.8h, 2h, 2.5h, 2.7h, or 3h. In one embodiment of this application, the curing time can be 1h-2h. In another embodiment of this application, the curing time can be 1.5h-3h.

[0086] The vibration damping structure provided in this application can be used in any component structure that requires vibration damping, such as in the fields of aviation, aerospace, and military, to achieve the purpose of vibration reduction and energy dissipation. For example, the vibration damping structure can be used in vehicle shock absorbers.

[0087] This application also provides a vehicle that includes the vibration damping structure in any of the above embodiments, which enhances the vehicle's vibration damping performance and helps to improve the vehicle's overall performance.

[0088] The effects of the technical solution in this application will be further illustrated below with specific examples.

[0089] Example 1

[0090] 19.3 g of nitrile rubber was dissolved in a solvent (ethyl acetate), heated at 60 °C and mechanically stirred at 400 rpm to obtain the first solution. 5.3 g of epoxy resin, 0.7 g of plasticizer (modified phenolic resin), 0.039 g of vulcanizing agent (dicumyl peroxide), 0.2 g of crosslinking aid (tracelyl isocyanurate), 0.59 g of epoxy curing agent (dicyandiamide), 0.15 g of epoxy accelerator (N,N'-(4-methyl-m-phenylene)bis(N',N'-dimethylurea)), and coupling agents (0.2 g of γ-glycidoxypropyltrimethoxysilane, 0.2 g of γ-aminopropyltriethoxysilane, and 0.8 g of monosodium trithiocyanate) were added to the solvent (ethyl acetate) and ultrasonically stirred to obtain the second solution.

[0091] The first and second solutions are added to a reaction vessel and mixed evenly to obtain an adhesive; wherein the solid content of the adhesive is 25% and the solvent content is 75%.

[0092] Example 2

[0093] The difference from Example 1 is that the coupling agent includes 0.032 g of γ-glycidoxypropyltrimethoxysilane, 0.032 g of γ-aminopropyltriethoxysilane and 0.13 g of monosodium trithiocyanate.

[0094] Example 3

[0095] The difference from Example 1 is that the coupling agent includes 0.84 g of γ-glycidoxypropyltrimethoxysilane, 0.63 g of γ-aminopropyltriethoxysilane and 0.84 g of monosodium trithiocyanate.

[0096] Example 4

[0097] The difference from Example 1 is that the adhesive includes 10g of nitrile rubber, 0.02g of vulcanizing agent and 0.1g of crosslinking agent.

[0098] Example 5

[0099] The difference from Example 1 is that the adhesive includes 55g of nitrile rubber, 0.11g of vulcanizing agent and 0.55g of crosslinking agent.

[0100] Example 6

[0101] The difference from Example 1 is that the adhesive includes 14g of epoxy resin, 1.56g of epoxy curing agent and 0.4g of epoxy accelerator.

[0102] Example 7

[0103] The difference from Example 1 is that the coupling agent composition in the adhesive is adjusted, wherein the coupling agent in the adhesive includes 0.7g of γ-glycidoxypropyltrimethoxysilane and 0.7g of γ-aminopropyltriethoxysilane.

[0104] Example 8

[0105] The difference from Example 1 is that the coupling agent composition in the adhesive is adjusted, wherein the coupling agent in the adhesive includes 0.28 g of γ-glycidoxypropyltrimethoxysilane and 1.12 g of monosodium trithiocyanate.

[0106] Example 9

[0107] The difference from Example 1 is that the coupling agent composition in the adhesive is adjusted, wherein the coupling agent in the adhesive includes 0.28 g of monosodium trithiocyanate and 1.12 g of γ-aminopropyltriethoxysilane.

[0108] Comparative Example 1

[0109] The difference from Example 1 is that it does not include a coupling agent.

[0110] Comparative Example 2

[0111] The difference from Example 1 is that the coupling agent component in the adhesive is adjusted, wherein the coupling agent in the adhesive is 1.4g of γ-glycidoxypropyltrimethoxysilane.

[0112] Comparative Example 3

[0113] The difference from Example 1 is that the coupling agent component in the adhesive is adjusted, wherein the coupling agent in the adhesive is 1.4g of γ-aminopropyltriethoxysilane.

[0114] Comparative Example 4

[0115] The difference from Example 1 is that the coupling agent component in the adhesive is adjusted, wherein the coupling agent in the adhesive is 1.4g of sodium trithiocyanate.

[0116] Comparative Example 5

[0117] The difference from Example 1 is that it does not contain nitrile rubber, vulcanizing agent and crosslinking agent, and the mass of epoxy resin in the adhesive is adjusted to 24.6g, the mass of epoxy curing agent is adjusted to 2.74g and the mass of epoxy accelerator is adjusted to 0.7g.

[0118] Comparative Example 6

[0119] The difference from Example 1 is that it does not contain epoxy resin, epoxy curing agent and epoxy accelerator, and the mass of nitrile rubber in the adhesive is adjusted to 24.6g, the mass of vulcanizing agent is adjusted to 0.049g and the mass of crosslinking aid is adjusted to 0.246g.

[0120] Performance testing

[0121] Oil stains on the surface of a 0.8 mm thick 5-series aluminum plate were cleaned with ethanol. The adhesives prepared in the examples or comparative examples were then coated onto the surface of the 5-series aluminum plate using a coating machine. The coated aluminum plate was baked at 100°C for 10 minutes to remove the solvent from the adhesive. Another 5-series aluminum plate was then bonded to the adhesive surface. The bonded composite structure was cured at 150°C for 2 hours to prepare a vibration-damping structure with a connecting layer thickness of 60 μm. The peel strength and loss factor of the vibration-damping structure were tested according to GB / T 2791-199 and GB / T16406-1996, and the results are shown in Table 1.

[0122] Figure 2 This is a topographic image of the peeled surface of the vibration damping structure provided in Example 1 after peeling. Figure 3 This is a topographic image of the peeled surface of the vibration-damping structure provided in Comparative Example 1. From... Figure 2 It can be seen that the vibration damping structure provided in Example 1 exhibits cohesive failure after peeling, with adhesive residue remaining on both sides of the metal substrate, indicating strong bonding ability of the vibration damping structure; from Figure 3 It can be seen that there is adhesive residue on one side of the metal substrate on both sides, while there is no adhesive residue on the other side, indicating that the bonding ability of the vibration damping structure is relatively poor.

[0123] Table 1 Performance Test Results

[0124] Average peel force (N) Peel strength (N / mm) Loss factor Example 1 122.13 4.89 0.3251 Example 2 89.2 3.57 0.3324 Example 3 99.4 3.92 0.3015 Example 4 160.43 5.89 0.2805 Example 5 98.6 3.86 0.3972 Example 6 182.3 6.69 0.2436 Example 7 95.2 3.67 0.3135 Example 8 96.3 3.74 0.3127 Example 9 91.2 3.46 0.3129 Comparative Example 1 23.56 0.92 / Comparative Example 2 66.39 2.57 0.3124 Comparative Example 3 73.96 2.72 0.3096 Comparative Example 4 84.95 3.24 0.3135 Comparative Example 5 79.65 2.97 0.1044 Comparative Example 6 / / /

[0125] As can be seen from Examples 1-9 and Comparative Example 1, the addition of an appropriate amount of coupling agent to the adhesive greatly improves the adhesive's bonding ability, which is beneficial for improving the damping and vibration resistance performance of the vibration reduction structure. As can be seen from Examples 1-9 and Comparative Examples 2-4, when the coupling agent includes at least two of amino, epoxy, and mercapto groups, the adhesive's bonding ability can be improved. The product prepared in Comparative Example 6 has no bonding performance because there are no corresponding test results in Table 1. As can be seen from Examples 1-9 and Comparative Examples 5-6, nitrile rubber and epoxy resin are indispensable components in the adhesive, which can improve the adhesive's bonding ability. As can be seen from Examples 1, Comparative Examples 1 and 6, the coupling agent and epoxy resin play a decisive role in the adhesive's bonding ability, which is beneficial for improving the adhesive's bonding ability and loss factor. Therefore, the adhesive provided in this application has good bonding ability, a high loss factor, and excellent damping and vibration resistance performance, which is beneficial for the widespread application of the adhesive.

[0126] The above description represents the preferred embodiments of this application, but should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. An adhesive, characterized in that, The adhesive comprises nitrile rubber, epoxy resin, coupling agent, plasticizer, vulcanizing agent, crosslinking aid, epoxy curing agent, epoxy accelerator, and solvent. The coupling agent comprises amino coupling agent, epoxy coupling agent, and mercapto coupling agent. The mass ratio of the amino coupling agent, the epoxy coupling agent, and the mercapto coupling agent is (1-4):(1-3):(4-8). The mass ratio of the nitrile rubber, the epoxy resin, the coupling agent, the plasticizer, the vulcanizing agent, the crosslinking aid, the epoxy curing agent, and the epoxy accelerator is (50-90):(8-35):(0.7-7):(0.5-3.5):(0.1-1):(0.1-1):(0.5-3.5):(0.1-2.5).

2. The adhesive as described in claim 1, characterized in that, The coupling agent has the structural formula Y-R1-R2, where Y includes -NH-R3, Or -S-R5, wherein R1 is selected from alkylene or alkoxyene, R2 is selected from siloxane or heteroarylthiol, R4 is selected from at least one of single bond, alkylene, alkenyl, alkynyl, aryl, arylalkyl, heteroaryl, heteroarylalkyl, alicyclic and imino, and R3 and R5 are independently selected from hydrogen atom, sodium atom, alkyl, alkenyl, alkynyl, aryl, arylalkyl, heteroaryl, heteroarylalkyl, alicyclic or amino.

3. The adhesive as described in claim 1, characterized in that, The plasticizer includes at least one of terpene resin, coumarone resin, modified phenolic resin, and modified rosin resin. The vulcanizing agent includes at least one of sulfur, tetramethylthiuram disulfide, tetraethylthiuram disulfide, and dicumyl peroxide; The crosslinking aid includes at least one of zinc oxide, stearic acid, and triallyl isocyanurate; The epoxy curing agent includes at least one of amine curing agents, acid anhydride curing agents, and isocyanate curing agents; The epoxy accelerator includes at least one of tertiary amine accelerators, imidazole accelerators, substituted urea accelerators, organic guanidine accelerators, and acetylacetone metal salt accelerators; The solvent includes at least one of ketones, esters, and halogenated hydrocarbons.

4. The adhesive as described in claim 1, characterized in that, In the adhesive, the solvent accounts for 70%-75% by mass. The solid content of the adhesive is 25%-30%; The adhesive comprises, by weight percentage, 12.5%-27% of the nitrile rubber, 2%-10.5% of the epoxy resin, 0.5%-2.1% of the coupling agent, 0.125%-1.05% of the plasticizer, 0.025%-0.3% of the vulcanizing agent, 0.025%-0.3% of the crosslinking aid, 0.125%-1.05% of the epoxy curing agent, and 0.03%-0.75% of the epoxy accelerator.

5. A method for preparing the adhesive according to any one of claims 1-4, characterized in that, include: An adhesive is obtained by mixing nitrile rubber, epoxy resin, coupling agent, plasticizer, vulcanizing agent, crosslinking aid, epoxy curing agent, epoxy accelerator and solvent.

6. A vibration damping structure, characterized in that, The vibration damping structure includes at least two metal substrates and a connecting layer disposed between adjacent metal substrates. The raw material of the connecting layer includes the adhesive according to any one of claims 1-4 or the adhesive prepared by the preparation method of claim 5. The peel strength between the metal substrate and the connecting layer is greater than or equal to 4.5 N / mm, and the damping loss factor of the vibration damping structure is greater than or equal to 0.

26.

7. The vibration reduction structure as described in claim 6, characterized in that, The thickness of the connecting layer is 50μm-80μm.

8. A vehicle, characterized in that, The vehicle includes the vibration damping structure according to any one of claims 6-7.

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