Wafer identification code reading device and method and wafer inspection system formed thereby

Abstract

The application discloses a wafer identification code reading device and method and a wafer detection system formed by the same. The wafer detection system comprises a code reading assembly and a reflection assembly. The code reading assembly is arranged above or below the edge of a wafer placement position. The reflection assembly is arranged below or above the edge of the wafer placement position. The reflection assembly comprises a reflection adjusting member and a reflection surface. The reflection surface is arranged opposite to the code reading assembly. The code reading light beam emitted by the code reading assembly covers the lower surface edge of the wafer placement position and the reflection surface at the same time. The reflection adjusting member is used for adjusting the position and angle of the reflection surface relative to the wafer placement position, so that the code reading light beam emitted by the code reading assembly covers the identification code on the upper surface or the lower surface of the wafer in the wafer placement position at the same time. The application ensures that the identification code reading can be realized through the same OCR no matter the wafer identification code is located on the upper surface or the lower surface, improves the code reading efficiency, and improves the wafer transmission efficiency and the processing efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer detection, in particular to a wafer identification code reading device and method and a wafer detection system formed by the same. BACKGROUND

[0002] In the wafer transmission process, when the wafer is clamped in the clamping assembly, the identification code in the wafer needs to be read in order to facilitate the management of wafer transmission or the next step processing of the wafer according to the preset requirements. At present, the wafer clamping assembly PA and the OCR (Optical Character Recognition) are installed separately in the industry, and after adjusting the appropriate position, the wafer position is corrected by the wafer clamping assembly, and then the identification code in the wafer is read by the OCR.

[0003] When the OCR is installed on the side edge of the wafer clamping assembly, the installation position and angle of the OCR need to be adjusted constantly to ensure that the installation position and angle of the OCR meet the requirements of code reading and also ensure that the robot does not interfere with the wafer clamping assembly when picking and placing the wafer. When the OCR is installed on the upper part of the wafer, it also needs to avoid the movement range of the turnover device. When the wafer size is large, for example, 200mm, the installation range of the OCR is even smaller.

[0004] Since the wafer may be placed with the front face upward or the back face upward, and the identification codes of the same batch of wafers are basically in the same position in the wafer, the OCR needs to be installed above and below the wafer at the same time, so as to complete the identification of the identification codes of all wafers in the same batch at the same time. The installation mode of the two OCRs leads to complicated installation and large occupied area, which interferes with the normal clamping of the wafer.

[0005] In actual operation, the wafer clamping assembly needs to calibrate the notch at the edge of the wafer so that the notch is directed to the set direction. When the wafer is placed with the front face upward or the back face upward, the direction of the identification code relative to the notch is different, which leads to the fact that the wafer needs to be rotated by different angles after correction to realize the reading of the upper surface identification code or the lower surface identification code, resulting in low reading efficiency and affecting the wafer transmission and processing efficiency. SUMMARY

[0006] The present application aims to solve at least one of the problems in the related art to some extent. To this end, one of the objects of the present application is to provide a wafer identification code reading device, which adjusts the position and angle of the reflecting surface to ensure that the code reading assembly can read the identification codes on the upper surface and the lower surface of the wafer at the same time, thereby improving the code reading efficiency.

[0007] A wafer identification code reading device, comprising a code reading assembly and a reflecting assembly, the code reading assembly is arranged above or below the edge of the wafer placement position,

[0008] The reflective component is located below or above the edge of the wafer placement position. The reflective component includes a reflective adjustment element and a reflective surface. The reflective surface is positioned directly opposite the code reading component, and the code reading beam emitted by the code reading component simultaneously covers the lower surface edge of the wafer placement position and the reflective surface. The reflective adjustment element is used to adjust the position and angle of the reflective surface relative to the wafer placement position, so that the code reading beam emitted by the code reading component simultaneously covers the identification code on the upper or lower surface of the wafer in the wafer placement position.

[0009] Furthermore, the reflective surface is a mirror, and the mirror and the code reading component are respectively disposed above and below the wafer, with the mirror facing the code reading beam.

[0010] Furthermore, the wafer placement position is located in the wafer clamping assembly, and the reflective surface is fixedly connected to the wafer clamping assembly via a reflective adjustment component.

[0011] Furthermore, the reflection adjustment component includes a first bracket and a second bracket. The center of the first bracket is rotatably connected to the wafer clamping assembly, one end of the first bracket is slidably connected to the wafer clamping assembly, and the other end of the first bracket is fixedly connected to the second bracket.

[0012] The first bracket is provided with a first waist-shaped hole, one end of the second bracket is fixed inside the first waist-shaped hole, and the other end of the second bracket is fixedly connected to the reflective surface.

[0013] Furthermore, the code reading assembly includes a code reader and a code reading adjustment component, wherein the code reader is fixedly connected to the wafer clamping assembly via the code reading adjustment component.

[0014] Furthermore, the code reading adjustment component includes a third bracket and a fourth bracket. The third bracket has a third oblong hole, one end of the fourth bracket is fixed in the third oblong hole, and the other end of the fourth bracket has a fourth oblong hole. The code reader is fixed in the fourth oblong hole, and the extension directions of the third oblong hole and the fourth oblong hole are perpendicular.

[0015] Furthermore, a cover is provided on the outside of the code reading component.

[0016] This application provides a wafer inspection system, including a wafer clamping assembly and a wafer identification code reading device as described above;

[0017] The wafer clamping assembly includes a tray and a rotary drive. The tray has a wafer placement position, and a calibration sensor is provided on the side of the wafer placement position. The rotary drive is connected to the tray and can drive the tray to rotate around its center line.

[0018] This application provides a wafer identification code reading method, including:

[0019] Adjust the position of the code reader component so that the distance between the code reader component and the upper or lower surface of the wafer is a first threshold.

[0020] The position of the reflective surface is adjusted by the reflective adjustment component so that the reading beam emitted by the reader can simultaneously cover the identification code on the upper or lower surface of the wafer in the wafer placement position.

[0021] The wafer is placed in the wafer placement position, and the code reading component reads the identification code on the upper or lower surface of the wafer.

[0022] Furthermore, the position of the reflective surface is adjusted by a reflective adjustment component so that the reading beam emitted by the reader simultaneously covers the identification code on the upper or lower surface of the wafer in the wafer placement position, specifically including:

[0023] The wafer is placed in the wafer placement position so that the identification code is located on the side away from the reading component. The position of the notch in the wafer is corrected. The position of the reflective surface is adjusted by the reflective adjustment component so that the reading beam emitted by the reader covers the identification code in the wafer through the reflective surface.

[0024] Compared with the prior art, the technical solution provided in this application has the following advantages: The wafer identification code reading device provided in this application includes a reading component and a reflecting component. The reading component is disposed above or below the edge of the wafer placement position; the reflecting component is located below or above the edge of the wafer placement position, that is, the reflecting component and the reading component are symmetrically arranged with respect to the edge of the wafer. The reflecting component includes a reflecting adjustment component and a reflecting surface. The reflecting surface is positioned facing the reading component, and the reading beam emitted by the reading component simultaneously covers the lower surface edge of the wafer placement position and the reflecting surface, ensuring that part of the reading beam is directly facing the lower surface of the wafer, and part is reflected by the reflecting surface onto the corresponding identification code position on the upper surface of the wafer. In this application, the reflecting adjustment component is used to adjust the position and angle of the reflecting surface relative to the wafer placement position, so that the reading beam emitted by the reader simultaneously covers the identification code on the upper or lower surface of the wafer in the wafer placement position, ensuring that the identification code can be read by the same OCR regardless of whether the wafer identification code is located on the upper or lower surface, thereby improving reading efficiency, wafer transmission efficiency, and processing efficiency. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Fig. 1 This is a side view of the wafer identification code reading device of this application.

[0028] Fig. 2 This is another side view of the wafer identification code reading device of this application;

[0029] Fig. 3 This is a top view of the wafer clamping assembly.

[0030] Reference numerals: 1. Wafer clamping assembly; 2. Code reading assembly; 3. Code reading beam; 4. Reflective surface; 5. Second support; 6. First support; 7. Third support; 8. Fourth support; 9. Cover; 10. Wafer. Detailed Implementation

[0031] To provide a clearer understanding of the technical features, objectives, and effects of this invention, specific embodiments are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "longitudinal," "horizontal," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," and "tail" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing this technical solution and do not indicate that the referred mechanism or element must have a specific orientation; therefore, they should not be construed as limitations on this invention.

[0032] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "linking," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0033] In the following description, specific details such as particular system structures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0034] Example 1

[0035] Please see Figs. 1-3 This application provides a wafer identification code reading device, including a reading component 2 and a reflecting component. The reading component 2 is disposed above or below the edge of the wafer placement position, and the reflecting component is located below or above the edge of the wafer placement position. The reflecting component includes a reflecting adjustment element and a reflecting surface 4. The reflecting surface 4 is disposed directly opposite to the reading component 2, and the reading beam 3 emitted by the reading component 2 simultaneously covers the lower surface edge of the wafer placement position and the reflecting surface 4. The reflecting adjustment element is used to adjust the position and angle of the reflecting surface 4 relative to the wafer placement position, so that the reading beam 3 emitted by the reader simultaneously covers the identification code on the upper or lower surface of the wafer 10 in the wafer placement position.

[0036] This application is for reading the codes of wafers 10 from the same batch. When reading the codes of wafers 10 from different batches, it is necessary to adjust the position and angle of the reflective surface 4 using a reflective adjustment component. The following explanation uses wafers 10 from the same batch as an example.

[0037] The position of the identification code in wafer 10 of the same batch is fixed and is usually located at the edge of wafer 10. In actual operation, wafer 10 has a notch, and the position of the identification code relative to the notch is fixed, and the identification code in wafer 10 is uniformly located on the front or back of wafer 10. For example, the identification code is located on the front of wafer 10, at a position 30° clockwise from the notch. However, when wafer 10 is placed in wafer clamping assembly 1, it cannot be guaranteed that wafer 10 is face up or back up. When wafer 10 is face up, the identification code is at a position 30° clockwise from the notch; when wafer 10 is back up, the identification code is at a position 30° counterclockwise from the notch. If reading assemblies 2 are installed above the upper surface and the lower surface of wafer 10 respectively, then reading assemblies 2 need to be installed at a position 30° clockwise from the notch on the upper surface and at a position 30° counterclockwise from the notch on the lower surface. The wafer clamping assembly 1 will correct the position of the wafer 10 to ensure that the notch faces the specific position. The specific correction device can be a correction device in the prior art.

[0038] The purpose of this application is to avoid installing two code reading components 2 and to read the identification code on the upper or lower surface of the wafer 10 using only one code reading component 2. This ensures that the identification code can be read by the same code reading component 2 regardless of whether the wafer 10 is placed face up or back up. When the code reading component 2 is installed below the lower surface of the wafer 10, the position of the identification code relative to the reflective surface 4 is fixed when the wafer identification code is on the upper surface. At this time, the angle of the reflective surface 4 can be adjusted by the reflective adjustment component so that the code reading beam 3 covers the position of the identification code on the upper surface of the wafer 10 through the reflective surface 4, thus enabling the reading of the identification code on the upper surface.

[0039] The wafer identification code reading device provided in this application includes a reading component 2 and a reflecting component. The reading component 2 is disposed above or below the edge of the wafer placement position; the reflecting component is located below or above the edge of the wafer placement position, that is, the reflecting component and the reading component 2 are symmetrically arranged with respect to the edge of the wafer 10. The reflecting component includes a reflecting adjustment element and a reflecting surface 4. The reflecting surface 4 is disposed facing the reading component 2, and the reading beam 3 emitted by the reading component 2 simultaneously covers the lower surface edge of the wafer placement position and the reflecting surface 4, ensuring that part of the reading beam 3 is directly facing the lower surface of the wafer 10, and part is reflected by the reflecting surface 4 onto the corresponding identification code position on the upper surface of the wafer 10. In this application, the reflecting adjustment element is used to adjust the position and angle of the reflecting surface 4 relative to the wafer placement position, so that the reading beam 3 emitted by the reader simultaneously covers the identification code on the upper or lower surface of the wafer 10 in the wafer placement position, ensuring that the identification code can be read by the same OCR regardless of whether the wafer identification code is located on the upper or lower surface, thereby improving the reading efficiency, wafer 10 transmission efficiency, and processing efficiency.

[0040] Example 2

[0041] Please see Figs. 1-3 This application provides a wafer identification code reading device, including a reading component 2 and a reflecting component. The reading component 2 is disposed above or below the edge of the wafer placement position, and the reflecting component is located below or above the edge of the wafer placement position. The reflecting component includes a reflecting adjustment element and a reflecting surface 4. The reflecting surface 4 is disposed directly opposite to the reading component 2, and the reading beam 3 emitted by the reading component 2 simultaneously covers the lower surface edge of the wafer placement position and the reflecting surface 4. The reflecting adjustment element is used to adjust the position and angle of the reflecting surface 4 relative to the wafer placement position, so that the reading beam 3 emitted by the reader simultaneously covers the identification code on the upper or lower surface of the wafer 10 in the wafer placement position.

[0042] Furthermore, the wafer placement position of this application is located in the wafer clamping assembly 1. The wafer clamping assembly 1 is provided with a correction component, which can be a sensor located at the edge of the wafer placement position. The wafer placement position includes a tray and a rotation drive component. The wafer 10 is placed in the tray. The rotation drive component can drive the tray to rotate. The sensor is fixed at a specific position. The rotation drive component drives the tray and the wafer 10 in the tray to rotate until the notch at the edge of the wafer 10 coincides with the sensor, thereby correcting the position of the wafer 10 and ensuring that the notch in the wafer 10 faces a specific direction.

[0043] In this application, the code reader assembly 2 is installed on the side of the wafer clamping assembly 1, specifically, it can be fixed within the wafer clamping assembly 1. The position and angle of the reflective surface 4 can be adjusted using a reflection adjustment component, and the position of the code reader can be adjusted using a code reader adjustment component. It should be noted that the code reader only needs to have its position adjusted, i.e., the relative distance between the code reader beam 3 and the center of the wafer 10, the straight-line distance between the code reader and the lower or upper surface of the wafer 10, and the position of the code reader relative to the notch in the wafer 10. The code reader beam 3 is always perpendicularly directed towards the surface of the wafer 10. In addition to position adjustment, the reflective surface 4 also needs to have its angle adjusted, i.e., the angle between the reflective surface 4 and the plane containing the wafer 10. By adjusting this angle, different positions on the upper surface of the wafer 10 can be reflected into the code reader beam 3.

[0044] In this application, the reading beam 3 needs to cover both the surface of the wafer 10 and the reflecting surface 4. That is, the reading beam 3 partially covers the surface of the wafer 10, partially is located outside the wafer 10, and covers the reflecting surface 4, thereby covering the surface of the other side of the wafer 10 through the reflecting surface 4.

[0045] In this application, the barcode reader and the reflective surface 4 are symmetrically arranged with respect to the edge of the wafer 10. The barcode reader can be located above the upper surface or below the lower surface of the wafer 10, and the reflective surface 4 can be located on the other side of the symmetry. The accompanying drawings and the following embodiments illustrate the barcode reader located below the lower surface of the wafer 10. When the positions of the two are reversed, their structure and working principle are exactly the same.

[0046] In this application, the reflective surface 4 can be a mirror, and the mirror is positioned facing the reading beam 3. The size of the mirror can be set according to the size of the wafer 10 or the size of the identification code, so as to ensure that the reading beam 3 after the wafer 10 is reflected can completely cover the area where the identification code is located on the upper surface of the wafer 10.

[0047] The reflective adjustment component in this application includes a first bracket 6 and a second bracket 5. The center of the first bracket 6 is rotatably connected to the wafer clamping assembly 1, one end of the first bracket 6 is slidably connected to the wafer clamping assembly 1, and the other end of the first bracket 6 is fixedly connected to the second bracket 5. A first oblong hole is provided in the first bracket 6, one end of the second bracket 5 is fixed inside the first oblong hole, and the other end of the second bracket 5 is fixedly connected to the reflective surface 4.

[0048] The center of the first support 6 is fixed, while one end of the first support 6 can slide up and down relative to the wafer clamping assembly 1. This up-and-down sliding causes the second support 5 and the reflective surface 4 at the other end of the first support 6 to rotate around the center of the first support 6, thereby changing the angle between the reflective surface 4 and the plane containing the wafer 10. The second support 5 can be fixed at different positions of the first oblong aperture, thus changing the position of the second support 5 relative to the wafer 10. The extension direction of the first oblong aperture can be parallel to the plane containing the wafer 10, for example, parallel to the diameter direction of the wafer 10. This allows for adjusting the distance between the reader and the center of the wafer 10 for wafers of different sizes, adapting to different reading ranges.

[0049] In this application, the code reader assembly 2 includes a code reader and a code reader adjustment component. The code reader is fixedly connected to the wafer clamping assembly 1 via the code reader adjustment component. The code reader adjustment component is used to adjust the position of the code reader relative to the wafer 10.

[0050] Specifically, the code reading adjustment component includes a third bracket 7 and a fourth bracket 8. The third bracket 7 is provided with a third oblong hole. One end of the fourth bracket 8 is fixed in the third oblong hole, and the other end of the fourth bracket 8 is provided with a fourth oblong hole. The code reader is fixed in the fourth oblong hole, and the extension directions of the third oblong hole and the fourth oblong hole are perpendicular.

[0051] When the fourth bracket 8 is fixed at different positions within the third oblong hole, the positions of the fourth bracket 8 and the barcode reader relative to the wafer 10 are different. Similarly, when the barcode reader is fixed at different positions within the fourth oblong hole, its position relative to the wafer 10 is also different. Specifically, the extension direction of either the third or fourth oblong hole can be vertical, which is used to adjust the vertical distance between the barcode reader and the lower surface of the wafer 10, ensuring that the distance between the barcode reader and the wafer 10 is the optimal scanning distance.

[0052] Another waist-shaped hole extends parallel to the diameter of wafer 10, and is used to adjust the distance between the reader and the center of wafer 10 for wafers of different sizes, so as to adapt to the reading range of different sizes.

[0053] The outer side of the code reading component 2 of this application is provided with a cover 9. The cover 9 can cover only the reflective surface 4, or it can cover both the reflective surface 4 and the code reader. When the code reading component 2 is not working, it is used to protect the code reading component 2.

[0054] This application also provides a wafer inspection system, including a wafer identification code reading device and a wafer clamping assembly 1 as shown above, wherein the wafer identification code reading device is fixed in the wafer clamping assembly 1. The wafer clamping assembly 1 includes a tray and a rotation drive. The tray has a wafer placement position, and a calibration sensor is provided on the side of the wafer placement position. The rotation drive is connected to the tray and can drive the tray to rotate around its centerline.

[0055] This application also provides a method for reading wafer identification codes, including:

[0056] S1: Adjust the position of the code reading component 2 so that the distance between the code reading component 2 and the upper or lower surface of the wafer 10 is the first threshold.

[0057] Specifically, the mounting position of the reading component 2 is determined based on the orientation of the wafer 10 after correction by the wafer clamping assembly 1 and the position of the identification code relative to the notch. The reading component 2 is installed below the lower surface of the wafer 10, ensuring that the reading beam 3 is directly facing the identification code when the identification code on the wafer 10 is placed face down. For example, when the back side of the wafer 10 is facing up, the identification code on the front side of the wafer 10 is positioned 30° counterclockwise from the notch. Therefore, the reader is installed at a position 30° counterclockwise from the corrected notch. The distance between the reader and the wafer 10 is adjusted according to the position of the identification code to ensure that the reader is directly facing the identification code.

[0058] Adjust the distance between the barcode reader and the lower surface of wafer 10 so that the vertical distance between the barcode reader and the lower surface of wafer 10 is a first threshold, such as 21 mm.

[0059] This step requires placing wafer 10 with the back side facing up to adjust the position of the code reader component 2.

[0060] S2: Adjust the position of the reflective surface 4 by means of the reflective adjustment component, so that the reading beam 3 emitted by the reader simultaneously covers the identification code on the upper or lower surface of the wafer 10 in the wafer placement position.

[0061] The function of the reflective surface 4 is to reflect the identification code on the upper surface of wafer 10 into the reader. For example, when the front side of wafer 10 is facing up, the identification code on the front side of wafer 10 is located at a position 30° clockwise from the notch. At this time, the position of the reader is fixed, and the angle and position of the reflective surface 4 need to be adjusted to ensure that the reading beam 3, reflected by the reflective surface 4, can cover the area where the identification code is located on the upper surface of wafer 10.

[0062] Specifically, wafer 10 is placed in the wafer placement position with the identification code located on the side away from the reading component 2. The notch position in wafer 10 is corrected, and the position of the reflective surface 4 is adjusted by the reflective adjustment component, so that the reading beam 3 emitted by the reader covers the identification code in wafer 10 through the reflective surface 4. Alternatively, wafer 10 can be placed face up in the wafer placement position, with the identification code located on the upper surface of wafer 10. The notch position in wafer 10 is corrected, and the position of the reflective surface 4 is adjusted by the reflective adjustment component, so that the reading beam 3 emitted by the reader covers the identification code on the upper surface of wafer 10 through the reflective surface 4.

[0063] This step requires placing wafer 10 face up and adjusting the position of reflective surface 4.

[0064] S3: Place wafer 10 in the wafer placement position, and read the identification code on the upper or lower surface of wafer 10.

[0065] After adjusting the barcode reader and reflective surface 4 as described above, their positions are fixed to ensure that the positions of the barcode reader and reflective surface 4 remain unchanged when reading codes for the same batch of wafers 10. For the same batch of wafers 10, regardless of whether the front or back of the wafer 10 is facing up, the identification code can be read by the barcode reader, improving reading efficiency, wafer 10 transmission efficiency, and processing efficiency.

[0066] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A wafer identification code reading device, characterized in that, It includes a code reader component (2) and a reflection component, wherein the code reader component (2) is disposed below the edge of the wafer placement position. The reflective component is located above the edge of the wafer placement position. The reflective component includes a reflective adjustment element and a reflective surface (4). The reflective surface (4) is positioned directly opposite the reading component (2). The reading beam (3) emitted by the reading component (2) simultaneously covers the lower edge of the wafer placement position and the reflective surface (4). The reflective adjustment element is used to adjust the position and angle of the reflective surface (4) relative to the wafer placement position, so that the reading beam (3) emitted by the reading component (2) simultaneously covers the identification codes on the upper and lower surfaces of the wafer (10) in the wafer placement position, thereby ensuring that the reading component can read the identification codes on the upper and lower surfaces of the wafer simultaneously. The reading component (2) includes a reader and a reading adjustment component. The reader is fixedly connected to the wafer clamping component (1) through the reading adjustment component. The reading adjustment component includes a third bracket (7) and a fourth bracket (8). The third bracket (7) is provided with a third oblong hole. One end of the fourth bracket (8) is fixed in the third oblong hole. The other end of the fourth bracket (8) is provided with a fourth oblong hole. The reader is fixed in the fourth oblong hole. The extension directions of the third oblong hole and the fourth oblong hole are perpendicular. The wafer placement position is set in the wafer clamping assembly (1), and the reflective surface (4) is fixedly connected to the wafer clamping assembly (1) through a reflective adjustment component; the reflective adjustment component includes a first bracket (6) and a second bracket (5), the center of the first bracket (6) is rotatably connected to the wafer clamping assembly (1), one end of the first bracket (6) is slidably connected to the wafer clamping assembly (1), and the other end of the first bracket (6) is fixedly connected to the second bracket (5); The first bracket (6) is provided with a first waist-shaped hole, one end of the second bracket (5) is fixed inside the first waist-shaped hole, and the other end of the second bracket (5) is fixedly connected to the reflective surface (4).

2. The wafer identification code reading device according to claim 1, characterized in that, The reflective surface (4) is a mirror, and the mirror and the code reading component (2) are respectively positioned above and below the wafer (10), with the mirror facing the code reading beam (3).

3. The wafer identification code reading device according to claim 1, characterized in that, The outer side of the code reading component (2) is provided with a cover (9).

4. A wafer inspection system, characterized in that, It includes a wafer clamping assembly (1) and a wafer identification code reading device according to any one of claims 1-3; The wafer clamping assembly (1) includes a tray and a rotation drive. The tray has a wafer placement position and a calibration sensor is provided on the side of the wafer placement position. The rotation drive is connected to the tray and can drive the tray to rotate around its center line.

5. A method for reading wafer identification codes, characterized in that, Based on the wafer identification code reading device according to any one of claims 1-3, including: Adjust the position of the code reading component (2) so that the distance between the code reading component (2) and the lower surface of the wafer (10) is the first threshold. The position of the reflective surface (4) is adjusted by the reflective adjustment component so that the reading beam (3) emitted by the reader simultaneously covers the identification code on the upper and lower surfaces of the wafer (10) in the wafer placement position. The wafer (10) is placed in the wafer placement position, and the code reading component (2) reads the identification codes on the upper and lower surfaces of the wafer (10).

6. The wafer identification code reading method according to claim 5, characterized in that, The position of the reflective surface (4) is adjusted by the reflective adjustment component so that the reading beam (3) emitted by the reader simultaneously covers the identification code on the upper and lower surfaces of the wafer (10) in the wafer placement position. Specifically, the wafer (10) is placed in the wafer placement position so that the identification code is located on the side away from the reading component (2), the notch position in the wafer (10) is corrected, and the position of the reflective surface (4) is adjusted by the reflective adjustment component so that the reading beam (3) emitted by the reader covers the identification code in the wafer (10) through the reflective surface (4).

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