A two-level conversion device

Abstract

The application provides a two-level conversion device, which comprises a circuit board and three-phase conversion units arranged on the circuit board. The direct current side of each phase conversion unit is connected with a direct current source, and the alternating current side of each phase conversion unit is connected with a three-phase alternating current source. The circuit board is divided into three types of regions according to dv / dt, and the signal lines of bus capacitors, switch units, alternating current inductors and filter capacitors and other devices are divided into dynamic signals and static signals according to the types of the emitted signals, and then the signal lines are routed on the static region, the dynamic region and the dynamic-static combined region of the circuit board, so that the layout of the conversion circuit is optimized, the interlayer parasitic capacitance is reduced, and the electromagnetic radiation is optimized.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of circuit, in particular to a two-level conversion device. BACKGROUND

[0002] The development of new power systems puts forward higher requirements for conversion circuits such as inverter circuits, rectifier circuits and auxiliary source circuits, but in the related technology, the electromagnetic environment of the conversion circuit is very complex, resulting in poor electromagnetic compatibility (EMC). SUMMARY

[0003] The two-level conversion device provided by the embodiments of the present disclosure comprises a circuit board and three-phase conversion units arranged on the circuit board, the direct current side of each phase conversion unit is connected with a direct current source, and the alternating current side of each phase conversion unit is connected with a three-phase alternating current source; the conversion unit comprises a direct current branch, a switch bridge arm and an alternating current branch; the direct current branch is connected with the direct current source and is provided with a bus capacitor; the switch bridge arm comprises two first switch units and second switch units which are connected in series with each other, and the two ends of the switch bridge arm are connected with the direct current source; the alternating current branch is provided with an alternating current inductor and a filter capacitor, and the alternating current branch is connected with the midpoint of the first switch unit and the second switch unit and the corresponding phase alternating current source; the circuit board comprises a static area, a dynamic area and a dynamic-static combination area, and the circuit board comprises a plurality of layers of boards; the projection of the static area in the plurality of layers of boards in the circuit board along a first direction only comprises a static signal line for transmitting a static signal; the projection of the dynamic area in the plurality of layers of boards in the circuit board along the first direction only comprises a dynamic signal line for transmitting a dynamic signal; the dynamic-static combination area on the top layer of the circuit board is provided with the switch bridge arm, wherein the first switch unit and the second switch unit are dynamic-static signal combination devices and are arranged adjacent to the static area; wherein the static signal refers to a signal with a voltage change rate close to 0, the dynamic signal refers to a signal with a voltage change rate much greater than 0, and the first direction is perpendicular to the direction of the board surface of the circuit board.

[0004] In some embodiments, the bus capacitor is a device for generating only a static signal, and is arranged on the static area and adjacent to the first switch unit and the second switch unit.

[0005] In some embodiments, the dynamic-static combination area comprises a large partition and a small partition, the switch bridge arm is arranged on the large partition, the filter capacitor is a device for generating a static signal, the filter capacitors of the three-phase conversion units form a three-phase filter capacitor group and are arranged on the small partition, the small partition is adjacent to the dynamic area, and the large partition, the small partition and the dynamic area are arranged in a second direction, and the first direction and the second direction are perpendicular to each other.

[0006] In some embodiments, the alternating current inductor is a dynamic-static signal combination device, the dynamic region has three sub-dynamic regions corresponding to three single-phase conversion units, the three sub-dynamic regions are arranged at intervals in a third direction of the circuit board, and the alternating current inductor of each phase conversion unit is arranged in the sub-dynamic region thereof respectively, and the second direction is perpendicular to the third direction.

[0007] In some embodiments, the circuit board has three sub-static regions and three large sub-regions arranged in the third direction, the three-phase conversion unit has three bus capacitor groups, each bus capacitor group is arranged in a sub-static region, and each switch bridge arm is arranged in a large sub-region, and each large sub-region is arranged between two sub-static regions.

[0008] In some embodiments, in the dynamic-static combination region, the multi-layer board in the circuit board is divided into a static layer, a dynamic layer and a shielding layer, a static signal line for transmitting the static signal is arranged in the static layer, a dynamic signal line for transmitting the dynamic signal is arranged in the dynamic layer, and the shielding layer is arranged between the static layer and the dynamic layer.

[0009] In some embodiments, the circuit board is a six-layer board structure, and from bottom to top in a first direction, the circuit board has two static layers, one shielding layer and three dynamic layers.

[0010] In some embodiments, the two static layers are a BUS+ layer at the lower layer and a BUS- layer at the upper layer respectively, and the shielding layer is an internal signal N layer.

[0011] In some embodiments, the input signal lines of the first switch unit and the second switch unit are static signal lines, the output signal lines thereof are dynamic signal lines, the static signal lines are connected with the bus capacitors of the static region through the static layer, and the dynamic signal lines are connected with the alternating current inductor through the dynamic layer.

[0012] From the above description of the present application and its preferred embodiments, compared with the prior art, the technical scheme of the present application and its preferred embodiments have the following beneficial effects due to the following technical means:

[0013] In the first technical scheme, the circuit board is divided into three types of regions according to dv / dt, and each device is arranged according to the type of the transmitted signal, so as to reduce the interlayer parasitic capacitance and optimize the electromagnetic compatibility.

[0014] In the second technical scheme, the three-phase filter capacitor module is arranged between the large sub-region and the dynamic region, so as to reduce the Loop2 loop and the intermediate frequency current loop, thereby optimizing the electromagnetic compatibility. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a three-type current loop schematic diagram of the embodiments of the present disclosure.

[0016] Figure 2 A dynamic and static signal sub-region diagram is provided for the embodiments of the present disclosure. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings in the embodiments of the present disclosure. It can be understood that the specific embodiments described herein are only for the purpose of explaining the related application, and not for limiting the present disclosure. In addition, it should be noted that only the parts related to the application are shown in the drawings for the convenience of description.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. The terms used herein are only for the purpose of describing the embodiments of the present disclosure, and are not intended to limit the present disclosure.

[0019] In the following description, “some embodiments” are related to a subset of all possible embodiments, but it can be understood that “some embodiments” can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0020] It should be noted that the terms “first\second\third” involved in the embodiments of the present disclosure are only to distinguish similar objects, and do not represent a specific order of the objects. It can be understood that “first\second\third” can be interchanged in a specific order or sequence as allowed, so that the embodiments of the present disclosure described herein can be implemented in an order other than that illustrated or described herein.

[0021] In the inverter formed by the conversion circuit, EMC needs to meet the FCC Class A standard related to the industry. In the high power level, radiation is often a large number of test items exceeding the standard. In the related art, EMC is often exceeded, and electromagnetic radiation can reach 70 decibels (dB).

[0022] Referring to Figure 1 , a three-type current circuit schematic diagram provided by the related art is shown. In the present embodiment, the direct current end of the two-level circuit is directly connected to an external battery, and the alternating current end is connected to a load in grid-connected or off-grid mode. In addition, the two-level circuit system is a N-free system, and the other two phases during operation are omitted in Figure 1 , as shown in Figure 1 , the present embodiment provides a two-level conversion device, which includes a plurality of circuit boards and a three-phase conversion unit. The direct current side of each phase of the conversion unit is connected to a direct current source, and the alternating current side is respectively connected to a three-phase alternating current source.

[0023] The conversion unit includes a direct current branch, a switch bridge arm, and an alternating current branch.

[0024] The DC branch is connected to the DC source and is provided with a bus capacitor; the switch bridge arm comprises two first switch units 121 and second switch units 122 connected in series with each other, and two ends of the switch bridge arm are connected to the DC source; the AC branch is provided with an AC inductor 141 and a filter capacitor 151, and is connected to the midpoint of the first switch unit 121 and the second switch unit 122 and the corresponding phase AC source.

[0025] During the entire conversion process of the conversion unit, each bus capacitor 111, first switch unit 121 and second switch unit 122 are adapted to pass through the commutation current, and each bus capacitor 111, first switch unit 121, second switch unit 122, AC inductor 141 and filter capacitor 151 are adapted to pass through the ripple current.

[0026] Among them, each conversion unit forms a commutation current, a ripple current and a load current during the conversion process, and forms three types of current loops, such as a corresponding commutation current loop, a load current loop and a ripple current loop. Specifically, in the discharge state of the conversion device, during the positive half cycle: the commutation current flows through the first switch unit 121, the second switch unit 122 and the bus capacitor 111. The ripple current flows through the first switch unit 121, the AC inductor 141, the filter capacitor 151 and the bus capacitor 111. The load current flows through the first switch unit 121, the AC inductor 141 and the load.

[0027] In addition, the above embodiment only takes the current flow of the positive half axis in the discharge state as an example, and those skilled in the art can uniquely and unambiguously derive the current flow direction in other conversion processes, such as the negative half cycle current flow direction in the discharge state, and the positive and negative half cycle current flow direction in the charging state, in combination with the above disclosure. In order to save space, no further description is made.

[0028] In summary, during the entire conversion process of the conversion unit, each bus capacitor 111, first switch unit 121 and second switch unit 122 are adapted to pass through the commutation current, and each bus capacitor 111, first switch unit 121, second switch unit 122, AC inductor 141 and filter capacitor 151 are adapted to pass through the ripple current.

[0029] The present inventor has found through a large number of experiments that among the above three types of current loops:

[0030] Loop1, formed by the battery DC, bus electrolytic capacitor fundamental component, load current loop; the current main wave component is a sine wave, the frequency is 50 Hz and its multiple frequency, in addition, there is a power topology and a small amount of ripple after LC filter of parallel machine inductance, the radiation signal received in the space of the wiring in the machine; the signal is an input and output signal, and the characteristic is that the loop is exposed outside the machine and can be directly monitored by the line impedance stabilization network (LISN) circuit. Among them, the leakage of switching ripple has a greater impact on the conducted test, the frequency is 16.2 kHz and its multiple frequency, therefore, the differential mode filter needs to be done for the AC outlet; the emission signal and the leakage ripple signal received in the space of the loop wiring will be emitted outside the machine.

[0031] Loop2, the current main wave component is a triangular wave, flowing through the inductance and the grid side filter capacitor; the signal is the largest power in the machine, the frequency is 16.2 kHz and its multiple frequency. In addition, as shown in Figure 1 Loop2, the current main wave component is a triangular wave, flowing through the inductance and the grid side filter capacitor; the signal is the largest power in the machine, the frequency is 16.2 kHz and its multiple frequency. In addition, as shown in

[0032] Loop3, the current main wave component is a sharp impulse waveform, mainly through the vertical pipe and the horizontal pipe to form a frequency of 1-10 MHz and its multiple frequency, which depends on the opening and closing speed of the tube; the signal characteristic is the highest frequency, and the frequency content is very rich.

[0033] Considering Figure 1The load current loop Loop1 shown is interfered more, and the signal transmission amount and propagation path of the ripple current loop Loop2 and the commutation current loop Loop3 are more. Therefore, the embodiment adopts the technical means of reducing the loop to improve electromagnetic compatibility, and the specific means is that each of the conversion units forms a commutation current, a ripple current and a load current in the conversion process; in the entire conversion process of the conversion unit, each of the bus capacitors 111, the first switch unit 121 and the second switch unit 122 is adapted to pass through the commutation current, and each of the bus capacitors 111, the first switch unit 121, the second switch unit 122, the alternating current inductor 141 and the filter capacitor 151 is adapted to pass through the ripple current; each device adapted to pass through the commutation current is configured to be located on the same first circuit board; each device adapted to pass through the ripple current is configured to be located on the same first circuit board. It should be noted that in the embodiment, each device passing through the ripple current and the commutation current is integrated on the same first circuit board, but in fact, the two-level conversion device is not composed of only one circuit board. Such a setting is mainly considering that the main influencing factor of the middle and high frequency current loop is the current change rate (di / dt), the higher the current change rate, the higher the frequency, and the easier the emission, so by reducing the area of the middle and high frequency current loop, the electromagnetic wave emitted to the outside once can be reduced, thereby reducing electromagnetic interference and optimizing electromagnetic compatibility.

[0034] Referring to Figure 2 It shows a dynamic and static signal sub-area diagram provided by an embodiment of the present disclosure. As shown in Figure 2 The first circuit board includes a static area 31, a dynamic area 32 and a dynamic and static combination area 33, and the first circuit board includes a multi-layer board (for example, a PCB including 6 layers of boards). Figure 2 Only the labels 31, 32 and 33 are marked, and the remaining static area, dynamic area and dynamic and static combination area are not marked, for example, the PCB includes 6 layers of boards, and the static area is projected on the 6 layers of the PCB without other signals; the solid line box area is the static area 31, and the static signal can include BUS+ and BUS- signals which are directly connected to the battery outside the machine; the dashed line box is the dynamic area 32, and the dynamic signal can include INVA, INVB and INVC signals before the inverter inductor; the dot-dash line box is the dynamic and static combination area 33, i.e. an area where the dynamic and static cannot be separated, and the signals of the dynamic and static combination area are mainly various signals connected with the switch unit.

[0035] In some embodiments, in the dynamic and static combination area 33, the multi-layer board in the first circuit board includes a static layer, a dynamic layer and a shielding layer; the static layer includes a static signal line for transmitting a static signal, and the dynamic layer includes a dynamic signal line for transmitting a dynamic signal; and the shielding layer is distributed between the static layer and the dynamic layer.

[0036] Exemplarily, the first circuit board includes a 6-layer board, and in the dynamic-static combination area, the 6-layer board is divided into a top 3-layer and a bottom 2-layer. The top 3-layer is a dynamic layer for transmitting dynamic signals, and the bottom 2-layer is a static layer for transmitting static signals such as BUS+ and BUS-. The middle layer is a shielding layer, which is separated by an internal signal N layer. Specifically, the 1st layer (Top layer) can be a dynamic layer and a driving layer such as INVA, INVB, and INVC, the 2nd layer (Midlayer 1) can be a dynamic layer such as INVA, INVB, and INVC, the 3rd layer (Midlayer 2) can be a dynamic layer such as INVA, INVB, and INVC, the 4th layer (Midlayer 3) can be an internal virtual N layer, the 5th layer (Midlayer 4) can be a main BUS- layer, and the 6th layer (Bottom layer) can be a main BUS+ layer.

[0037] Referring to Figure 2 On the first circuit board, three sub-static areas are arranged along the third direction, which are a first sub-static area 311, a second sub-static area 312, and a third sub-static area 313. On the first circuit board, three large areas are arranged along the third direction, which are a first large area 331, a second large area 332, and a third large area 333. On the first circuit board, three sub-dynamic areas are arranged along the third direction, which are a first sub-dynamic area 321, a second sub-dynamic area 322, and a third sub-dynamic area 323. The large areas and the sub-dynamic areas are arranged along the second direction on the first circuit board, and the second direction is perpendicular to the third direction.

[0038] The switch bridge arms of the three-phase conversion unit are an A-phase switch bridge arm 2111, a B-phase switch bridge arm 2112, and a C-phase switch bridge arm 2113, which are dispersedly arranged along the first direction. The bus capacitors of the three-phase conversion unit are an A-phase bus capacitor group 2121, a B-phase bus capacitor group 2122, and a C-phase bus capacitor group 2123, which are arranged along the first direction. The filter capacitors of the three-phase conversion unit constitute a three-phase filter capacitor module 213, which is arranged on one side of the switch bridge arms and adjacent to the switch bridge arms along the second direction. The AC inductors 214 of the three-phase conversion unit are arranged on one side of the three-phase filter capacitor module 213 along the first direction and adjacent to the three-phase filter capacitor module 213 along the second direction, and the first direction is perpendicular to the second direction.

[0039] The AC inductor is a dynamic-static signal combination device, and the dynamic area has three sub-dynamic areas corresponding to the single-phase conversion unit. The three sub-dynamic areas are arranged along the third direction on the first circuit board, and the A-phase AC inductor is arranged around the first sub-dynamic area 321, the B-phase AC inductor is arranged around the second sub-dynamic area 322, and the C-phase AC inductor is arranged around the third sub-dynamic area 323. The dynamic signal lines connected to the AC inductor are arranged in each sub-dynamic area.

[0040] The filter capacitor is a device for generating a static signal, and the dynamic-static combination area further has a small partition 334. The filter capacitors of the three-phase conversion units form a three-phase filter capacitor module and are arranged on the small partition 334. The small partition 334 is adjacent to the dynamic area, and the large partition and the small partition are arranged at intervals in the second direction with the dynamic area. In this embodiment, the three-phase filter capacitor module is arranged between the large partition and the dynamic area, so as to reduce the Loop2 loop, reduce the intermediate frequency current loop, and thus optimize the electromagnetic compatibility.

[0041] Taking the A-phase switch bridge arm as an example, the first switch unit 121 and the second switch unit 122 are dynamic-static signal combination devices, and the first switch unit 121 and the second switch unit 122 are arranged close to the first static partition 311. The specific signal line arrangement is described below taking the first switch unit 121 as an example. The static signal line of the first switch unit 121 is connected to the bus capacitor module 2121 through the static layer of the first large partition 331 where the first switch unit 121 is located. The dynamic signal line of the first switch unit 121 is connected to the second switch unit 122 through the dynamic layer of the first large partition 331 where the first switch unit 121 is located. The dynamic signal line of the first switch unit 121 is further connected to the A-phase alternating current inductor through the dynamic layer of the first large partition 331 where the first switch unit 121 is located and the dynamic layer of the small partition 334.

[0042] It should be noted that the static signal refers to a signal with constant or almost constant voltage, and the dynamic signal refers to a signal with large voltage variation. The specific values of the voltage variation rates of the static signal and the dynamic signal are not specifically limited, but the voltage variation rate of the dynamic signal is greater than that of the static signal.

[0043] It should be noted that the specific number of the multiple layers included in the first circuit board, and the specific number of the static layers and the dynamic layers are not specifically limited, but the multiple static layers are arranged adjacent to each other, and the multiple dynamic layers are arranged adjacent to each other.

[0044] It should be further noted that the dynamic layer, the shielding layer and the static layer can be arranged on the first circuit board from top to bottom along the third direction, or can be arranged on the first circuit board from bottom to top along the third direction, which can be selected according to actual conditions.

[0045] Further, in some embodiments, when the projection of the signal line transmitting the static signal in the multiple layers of the first circuit board along the third direction does not overlap with the projection of the signal line transmitting the dynamic signal in the multiple layers of the first circuit board along the third direction, the multiple layers of the first circuit board include the static layer and the dynamic layer;

[0046] When the projection of the signal line transmitting the static signal along the third direction in the multi-layer board in the first circuit board overlaps the projection of the signal line transmitting the dynamic signal along the third direction in the multi-layer board in the first circuit board, the multi-layer board in the first circuit board comprises a static layer, a dynamic layer and a shielding layer, and the shielding layer is distributed between the static layer and the dynamic layer.

[0047] That is, in the pure static area and the pure dynamic area, the first circuit board is also a multi-layer board, but because the same kind of signal is transmitted respectively, no shielding layer is needed in the middle; and in the dynamic-static combination area, because the static signal and the dynamic signal need to be transmitted, the shielding layer needs to be added in the middle to shield, so as to realize the separation of the dynamic signal and the static signal.

[0048] In summary, the embodiment of the present disclosure provides a two-level conversion device, by dividing the first circuit board into three types of areas according to dv / dt, and dividing the signal lines of each device into dynamic signal and static signal areas (i.e. static area, dynamic area and dynamic-static combination area) and layers (i.e. static layer, dynamic layer and shielding layer) according to the type of transmitted signal; so as to optimize the layout of the conversion circuit, and optimize the electromagnetic radiation.

[0049] The above merely describes preferred embodiments of the present disclosure and is not intended to limit the protection scope of the present disclosure.

[0050] It should be noted that in the present disclosure, the terms "comprising", "containing" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or device including the element.

[0051] The above-mentioned sequence numbers of the embodiments of the present disclosure are only for description, and do not represent the advantages and disadvantages of the embodiments.

[0052] The methods disclosed in the several method embodiments provided by the present disclosure can be combined arbitrarily without conflict to obtain new method embodiments.

[0053] The features disclosed in the several product embodiments provided by the present disclosure can be combined arbitrarily without conflict to obtain new product embodiments.

[0054] The features disclosed in the several method or device embodiments provided by the present disclosure can be combined arbitrarily without conflict to obtain new method embodiments or device embodiments.

[0055] The above merely provides the specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto, any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A two-level conversion device, characterized in that... The circuit board and three-phase conversion units arranged on the circuit board, the direct current side of each phase conversion unit is connected with a direct current source, and the alternating current side is connected with a three-phase alternating current source respectively; The conversion unit comprises a direct current branch, a switch bridge arm and an alternating current branch; The direct current branch is connected with the direct current source and provided with a bus capacitor; the switch bridge arm comprises two first and second switch units connected in series with each other, and the two ends of the switch bridge arm are connected with the direct current source respectively; the alternating current branch is provided with an alternating current inductor and a filter capacitor, and the alternating current inductor and the filter capacitor are connected with the midpoint of the first and second switch units and the corresponding phase alternating current source; The circuit board comprises a static area, a dynamic area and a dynamic-static combination area, and the circuit board comprises a plurality of layers; The projection of the static area on the plurality of layers in the circuit board along a first direction only comprises static signal lines for transmitting static signals; the projection of the dynamic area on the plurality of layers in the circuit board along the first direction only comprises dynamic signal lines for transmitting dynamic signals; the dynamic-static combination area on the top layer of the circuit board is provided with a switch bridge arm, wherein the first and second switch units are dynamic-static signal combination devices and are arranged adjacent to the static area; The static signal refers to a signal with a voltage change rate close to 0, the dynamic signal refers to a signal with a voltage change rate far greater than 0, and the first direction is perpendicular to the direction of the circuit board surface.

2. The conversion device of claim 1, wherein: The bus capacitor is a device for generating only static signals, and is arranged on the static area and adjacent to the first and second switch units.

3. The conversion device of claim 2, wherein: The dynamic-static combination area comprises a large partition and a small partition, the switch bridge arm is arranged on the large partition, the filter capacitor is a device for generating static signals, the filter capacitors of the three-phase conversion units form a three-phase filter capacitor group and are arranged on the small partition, the small partition is adjacent to the dynamic area, and the large partition, the small partition and the dynamic area are arranged in a second direction, and the first direction and the second direction are perpendicular to each other.

4. The conversion device of claim 3, wherein: The alternating current inductor is a dynamic-static signal combination device, and the dynamic area has three sub-dynamic areas corresponding to the single-phase conversion units, the three sub-dynamic areas are arranged in a third direction of the circuit board, and the alternating current inductor of each phase conversion unit is arranged in the sub-dynamic area thereof, and the second direction and the third direction are perpendicular to each other.

5. The conversion device of claim 4, wherein: The circuit board has three sub-static areas arranged in the third direction, three large partitions, the three-phase conversion units have three bus capacitor groups, each bus capacitor group is arranged in a sub-static area, and each switch bridge arm is arranged in a large partition, and each large partition is sandwiched between two sub-static areas.

6. The conversion device according to claim 4, wherein: in the dynamic-static combination area, the plurality of layers in the circuit board are divided into static layers, dynamic layers and shielding layers; the static signal lines for transmitting the static signals are arranged in the static layers; and, the dynamic signal lines for transmitting the dynamic signals are arranged in the dynamic layers; and, the shielding layers are arranged between the static layers and the dynamic layers.

7. The conversion device of claim 6, wherein The circuit board is a six-layer structure, and from bottom to top in a first direction, there are two static layers, one shielding layer and three dynamic layers.

8. The conversion device of claim 7, wherein The two static layers are a BUS+ layer located at the lower layer and a BUS- layer located at the upper layer respectively.

9. The conversion device of claim 6, wherein The input signal lines of the first and second switch units are static signal lines, and the output signal lines are dynamic signal lines, the static signal lines are connected with the bus capacitor of the static area through the static layer, and the dynamic signal lines are connected with the alternating current inductor through the dynamic layer.

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