A method for manufacturing LED lamp beads with enlarged light-emitting angle

Abstract

The present invention proposes a method for manufacturing an LED lamp bead with an expanded light-emitting angle, which relates to the field of LED technology. The LED lamp bead with an expanded light-emitting angle includes a single bracket, an LED chip and a packaging glue. The single bracket includes a substrate and a plastic body arranged on the substrate, the plastic body is connected to the substrate and a mounting groove is formed on the inner side; the LED chip is located in the mounting groove and is electrically connected to the substrate; the packaging glue includes a first glue layer and a second glue layer, the first glue layer is filled in the mounting groove; the second glue layer is located on the first glue layer, and is formed by fusing a prefabricated glue drop with an uncured first glue layer, the top of the second glue layer forms a lens-shaped structure, and the outer side forms a concave shape. The present invention forms a second glue layer by fusing a prefabricated glue drop with an uncured first glue layer, and the first glue layer and the second glue layer together constitute a packaging glue with a lens shape, which effectively expands the light-emitting angle of the LED lamp bead. The entire production process does not require the use of a customized mold, and the production cost is low and the research and development cycle is short.

Description

Technical Field

[0001] The invention relates to the technical field of LEDs, and in particular to a method for manufacturing an LED lamp bead with an enlarged light-emitting angle. Background Art

[0002] At present, bracket-type or flat-cut LED lamp beads are commonly used in the backlight and lighting fields. The luminous angle of the above LED lamp beads generally does not exceed 150 degrees. In order to increase the luminous angle of the lamp beads, the LED lamp beads are generally first mounted on the PCB board, and then the lens after injection molding is mounted on the PCB board directly above the LED lamp beads through SMT, and the lens is fixed to the PCB board through low-temperature or UV adhesive. In the prior art, a reflective lens is installed on the LED lamp bead. Although it can increase the luminous angle of the LED lamp bead, the reflective lens needs to be injection molded by a customized mold. The required customized mold requires high precision, resulting in high production and processing costs.

[0003] In some related prior arts, there are some solutions, one of which is to directly cover the LED chip with a packaging glue layer with a surface in the shape of an optical lens. This method requires a molding method to form a packaging glue layer with a lens shape, and the molding process also requires the use of a customized mold. The mold has high precision requirements and needs to be repeatedly modified to achieve a good light output effect. The LED product development cycle is long. Another solution is to realize the lens structure through a secondary dispensing process, that is, after the first dispensing and curing in the LED bracket, a secondary dispensing is performed. This method does not require a separate reflective lens or a customized mold, which reduces the production cost and product development cycle to a certain extent. However, the lens shape achieved by the secondary dispensing method is only an arc-shaped ball head structure, and the lens structure is single, which cannot meet the large-angle light output requirements in different scenarios. Summary of the invention

[0004] In view of this, the present invention proposes a method for manufacturing LED lamp beads with enlarged light-emitting angles, which is used to solve the problem of how to achieve enlarged light-emitting angles while reducing production costs and product development cycles during the LED lamp bead manufacturing process.

[0005] The technical solution of the present invention is achieved in this way:

[0006] In a first aspect, the present invention provides an LED lamp bead with an enlarged light-emitting angle, comprising a single bracket, an LED chip and a packaging adhesive, wherein:

[0007] The single-body bracket includes a base plate and a plastic body disposed on the base plate, wherein the plastic body is connected to the base plate and a mounting groove is formed inside the plastic body;

[0008] The LED chip is located in the mounting groove, and the LED chip is electrically connected to the substrate;

[0009] The packaging glue includes a first glue layer and a second glue layer. The first glue layer is filled in the mounting groove and covers the LED chip so that the LED chip emits a predetermined light after stimulating the first glue layer. The second glue layer is located on the first glue layer and is formed by fusing a prefabricated glue drop with the uncured first glue layer. A lens-like structure is formed on the top of the second glue layer, and a concave shape is formed on the outer side.

[0010] Based on the above technical solution, preferably, the first adhesive layer and the second adhesive layer are the same colloid, the first adhesive layer is a colloid containing phosphor, and the second adhesive layer is a colloid not containing phosphor; or the first adhesive layer and the second adhesive layer are both colloids containing phosphor.

[0011] As an implementation manner, a surface of the second adhesive layer away from the first adhesive layer is horizontal.

[0012] As an implementation manner, a surface of the second adhesive layer away from the first adhesive layer has a convex shape.

[0013] As an implementation manner, a surface of the second adhesive layer away from the first adhesive layer is concave.

[0014] On the basis of the above technical solution, preferably, a white glue layer is further provided on a side of the second glue layer away from the first glue layer.

[0015] In a second aspect, the present invention provides a method for manufacturing an LED lamp bead with an expanded light-emitting angle, which is used to manufacture the LED lamp bead with an expanded light-emitting angle as described in the first aspect, comprising the following steps:

[0016] Step 1: Take a whole LED bracket, set the LED chip die in a plurality of single brackets corresponding to the whole LED bracket, and electrically connect the positive and negative electrodes of the LED chip to the positive and negative terminals on the single brackets respectively;

[0017] Step 2: Add packaging glue into the mounting groove of the single-body bracket, so that the packaging glue fills the mounting groove and wraps the LED chip to form a first glue layer, and at the same time, the first glue layer is higher than the top surface of the mounting groove to form an arc-shaped convex shape;

[0018] Step 3: Take a thin plate that matches the area of ​​the entire LED bracket, and arrange multiple arc-shaped convex glue drops in an array on the surface of the thin plate by dispensing glue, and the center distance between the glue drops is matched with the center distance between the single brackets;

[0019] Step 4: Flip the glue-dispensed thin plate 180° and place it directly above the entire LED bracket, and fuse the glue droplets on the bottom surface of the thin plate with the first glue layer in the single bracket to form a second glue layer between the top surface of the single bracket and the bottom surface of the thin plate;

[0020] Step 5: Keep the relative position between the thin plate and the whole LED bracket unchanged, bake the thin plate and the whole LED bracket as a whole, and after the first adhesive layer and the second adhesive layer are completely cured, remove the thin plate to obtain the whole LED bracket with packaging glue;

[0021] Step 6: Separate the entire LED bracket to obtain an LED lamp bead with an enlarged light-emitting angle.

[0022] On the basis of the above technical solution, preferably, the following step is further included between step five and step six: applying white glue on the top surface of the cured second glue layer, and forming a white glue layer after baking and hardening.

[0023] On the basis of the above technical solution, preferably, a shaping structure for shaping the top surface shape of the second glue layer is provided at the glue spot on the upper surface of the thin plate.

[0024] On the basis of the above technical solution, preferably, a release agent is provided on the modeling structure.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] (1) The LED lamp bead with enlarged light-emitting angle and the manufacturing method disclosed in the present invention use a prefabricated glue drop and an uncured first glue layer to fuse to form a second glue layer. The first glue layer and the second glue layer together constitute a lens-shaped packaging glue, which effectively enlarges the light-emitting angle of the LED lamp bead and improves the coverage of the lighting effect. The entire production process does not require the use of customized molds, avoiding the expensive customized molds and long research and development cycles required by traditional molding processes. Compared with traditional molding processes, this manufacturing method does not require high-precision customized molds, saving production costs. At the same time, it reduces production steps and research and development cycles, further reducing production costs and product research and development cycles.

[0027] (2) By prefabricating glue droplets of different shapes to meet the structural form of the second glue layer that needs to be formed, compared with the lens solution formed by the secondary dispensing method in the prior art, the LED lamp beads disclosed in the present invention can be designed with lens structures of different shapes, thereby meeting the optical applications of different scenes and having a wider range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 A schematic diagram of the structure of the LED lamp bead disclosed in the present invention;

[0030] Figure 2 A schematic diagram of the structure of the LED lamp bead disclosed in the present invention;

[0031] Figure 3 A schematic diagram of the structure of the LED lamp bead disclosed in the present invention;

[0032] Figure 4 A schematic diagram of the structure of the LED lamp bead disclosed in the present invention;

[0033] Figure 5 A schematic diagram of the structure of the LED lamp bead disclosed in the present invention;

[0034] Figure 6 A schematic diagram of the structure of the LED lamp bead disclosed in the present invention;

[0035] Figure 7 A schematic diagram of the structure of the LED lamp bead disclosed in the present invention;

[0036] Figure 8 A schematic diagram of the structure of the LED lamp bead disclosed in the present invention;

[0037] Fig. 9 This is a schematic diagram of the glue dispensing state of the whole LED bracket disclosed in the present invention;

[0038] Fig.10 It is a schematic diagram of the dispensing state of a thin plate disclosed in the present invention;

[0039] Fig.11 It is a schematic diagram of the contact state between the thin plate after glue application and the whole LED bracket after glue application disclosed in the present invention;

[0040] Fig.12 It is a schematic diagram of the fusion state of the glue drop on the thin plate disclosed in the present invention and the first glue layer on the whole LED bracket;

[0041] Fig.13 It is a schematic diagram of the state in which the thin plate is removed after the glue droplets on the thin plate disclosed in the present invention are fused with the first glue layer on the entire LED bracket;

[0042] Fig.14This is an implementation method of the modeling structure on the thin plate disclosed in the present invention;

[0043] Fig.15 This is an implementation method of the modeling structure on the thin plate disclosed in the present invention;

[0044] Fig.16 This is an implementation method of the modeling structure on the thin plate disclosed in the present invention;

[0045] Fig.17 This is an implementation method of the modeling structure on the thin plate disclosed in the present invention;

[0046] Fig.18 This is an implementation method of the modeling structure on the thin plate disclosed in the present invention;

[0047] Fig.19 This is an implementation method of the modeling structure on the thin plate disclosed in the present invention;

[0048] Reference numerals:

[0049] 1. Single bracket; 2. LED chip; 3. Packaging glue; 11. Substrate; 12. Plastic body; 10. Mounting groove; 31. First glue layer; 32. Second glue layer; 100. Whole LED bracket; 200. Thin plate; 210. Glue drop; 33. White glue layer; 220. Modeling structure. DETAILED DESCRIPTION

[0050] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0051] like Figure 1 As shown, combined Figure 2-8 The embodiment of the present invention provides an LED lamp bead with an enlarged light-emitting angle, which includes a single bracket 1, an LED chip 2 and a packaging glue 3.

[0052] The single bracket 1 includes a base plate 11 and a plastic body 12 disposed on the base plate 11 . The plastic body 12 is connected to the base plate 11 and a mounting groove 10 is formed inside the plastic body 12 .

[0053] The plastic body 12 in this embodiment is composed of a high molecular polymer, which is any one or more combinations of PPA (Polyphthalamide), PCT (Poly 1,4-cyclohexylenedimethyleneterephthalate), EMC (Epoxy Molding Compound), and SMC (Sheet molding compound). The substrate 11 is an epoxy resin substrate, a ceramic substrate, or a copper foil substrate.

[0054] The manufacturing process of the single bracket 1 adopts the existing technology, and can be realized by using the plastic body 12 and the base plate 11 through injection molding or molding process.

[0055] The LED chip 2 is located in the mounting groove 10, and the LED chip 2 is electrically connected to the substrate 11. The mounting groove 10 is a bowl-shaped groove. In one embodiment, the depth of the mounting groove 10 is 0.55 mm. In one embodiment, the LED chip 2 is a front-mounted chip, and the LED chip 2 is fixed on the substrate 11 by a die-bonding insulating adhesive, and the surface of the LED chip 2 away from the substrate 11 is electrically connected to the substrate 11 through a wire; in another embodiment, the LED chip 2 is a flip-chip, and the LED chip 2 is fixed on the substrate 11 by a conductive adhesive such as silver glue or solder paste and is electrically connected to the substrate 11.

[0056] The encapsulation glue 3 disclosed in this embodiment includes a first glue layer 31 and a second glue layer 32. The first glue layer 31 is filled in the mounting groove 10 and covers the LED chip 2, so that the LED chip 2 emits a predetermined light after exciting the first glue layer 31. By setting different types of LED chips 2 and matching the first glue layer 31, it can be achieved that the light emitted by the LED chip 2 emits light that meets the design after exciting the first glue layer 31. As an embodiment, the LED chip 2 adopts a blue light chip, and the first glue layer 31 is an encapsulation glue 3 containing yellow phosphor, so that the blue light chip excites the yellow phosphor to emit white light.

[0057] The first adhesive layer 31 in the mounting groove 10 mainly functions to protect the LED chip 2 from physical damage and chemical corrosion. At the same time, its material and structural design play a preliminary optical processing role on the light emitted by the LED.

[0058] Normally, the top surface of the first glue layer 31 will be flush with the top surface of the opening of the mounting groove 10, which is often referred to as a "flat cup" in the industry. Of course, due to the influence of some dispensing processes, the top surface of the first glue layer 31 will protrude from the top surface of the opening of the mounting groove 10, which is referred to as a "convex cup" in the industry. Although the "convex cup" structure will increase the final light-emitting angle of the LED lamp bead compared to the "flat cup" structure, the increased angle is limited, and the "convex cup" structure cannot be called a lens structure. If the degree of protrusion of the first glue layer 31 on the top surface of the mounting groove 10 is artificially increased during the dispensing process, this will cause the first glue layer 31 to overflow out of the outside of the bracket and cannot maintain a larger glue layer protrusion state.

[0059] Under the current structure of LED SMD lamp beads, in order to meet the large-angle luminous requirements of the application market, it is usually necessary to mount a reflective lens on the LED lamp bead. Since the structure of the LED SMD lamp bead has been formed, in the subsequent lens adaptation process, it is necessary to repeatedly debug different lenses, and at the same time, a customized mold is required to form the lens. In this process, although optical simulation can be used to improve the optical matching of the final formed lens and the LED lamp bead, in actual use, due to precision problems, there will still be poor optical matching and the luminous emission does not meet the requirements. Therefore, in the product development stage, the mold needs to be repeatedly modified or re-opened according to the LED lamp bead, the R&D cycle is long and the cost is high.

[0060] To this end, the present invention adopts a method of directly molding a lens structure on an LED lamp bead to solve the problems of long R&D cycle and high cost caused by subsequent lens development.

[0061] Specifically, the encapsulation glue 3 of the embodiment of the present invention further includes a second glue layer 32, which is located on the first glue layer 31 and is formed by fusing the prefabricated glue drop 210 with the uncured first glue layer 31. The top of the second glue layer 32 forms a lens-shaped structure, and the outer side forms a concave shape. In some embodiments, by pre-setting a glue drop 210 of a certain shape, the glue drop 210 is placed directly above the first glue layer 31 and the position is kept fixed, so that the glue drop 210 and the uncured first glue layer 31 are fused by liquid adsorption force, and after fusion, a lens structure protruding from the top surface of the bracket can be formed. Since the glue drop 210 is in a drop-shaped structure and the relative position with the monomer is kept fixed, the glue drop 210 and the first glue layer 31 in the monomer bracket 1 are fused in the process. Due to the liquid adsorption force, the glue layer formed after the two are fused is similar to the structure of a lens. After baking and hardening, a second glue layer 32 with a lens shape is formed. At the same time, under the action of the liquid adsorption force, the outer peripheral side of the second glue layer 32 will be concave, which is more in line with the structural morphology of the lens periphery. This design can more effectively control the propagation and scattering of light, thereby expanding the light-emitting angle of the LED lamp beads and meeting the lighting needs in different scenarios.

[0062] In this embodiment, the formation of the second glue layer 32 is achieved by fusing the prefabricated glue drop 210 with the uncured first glue layer 31, without the need for a custom mold, thus avoiding the expensive custom molds and long R&D cycles required for the traditional molding process. Compared with the traditional molding process, this manufacturing method does not require a high-precision custom mold, saving production costs. At the same time, the production steps and R&D cycle are reduced, further reducing production costs and product R&D cycles. At the same time, glue drops 210 of different shapes can be prefabricated to meet the structural form of the second glue layer 32 that needs to be formed. Compared with the lens solution formed by the secondary dispensing method in the prior art, the LED lamp beads disclosed in this embodiment can be designed with lens structures of different forms, thereby meeting optical applications in different scenarios and having a wider range of applications.

[0063] As some preferred embodiments, the first adhesive layer 31 and the second adhesive layer 32 are the same colloid. By using the same colloid, the first adhesive layer 31 and the second adhesive layer 32 can be fused and cured to enhance the overall mechanical strength of the LED package, and improve its impact resistance and durability. The same colloid can make the light distribution uniform.

[0064] In some embodiments, the first glue layer 31 is a colloid containing phosphors, and the second glue layer 32 is a colloid without phosphors. This configuration allows the first glue layer 31 to convert the color or wavelength of the light emitted by the LED (e.g., from blue light to white light) while protecting the LED chip 2, while the second glue layer 32 focuses on optimizing the diffusion and propagation of light through its lens structure, enhancing the application flexibility and market applicability of the lamp beads.

[0065] As some other embodiments, both the first adhesive layer 31 and the second adhesive layer 32 contain phosphors. Such a configuration allows the entire three layers of encapsulation adhesive to participate in the wavelength conversion of light, thereby enhancing the overall light effect and light quality, while the stability and uniformity of a specific light color are enhanced through the two layers of phosphors, reducing the problems of light spots and color unevenness.

[0066] In the above embodiment, the second adhesive layer 32 without phosphors focuses on effectively focusing and diffusing light through the lens structure, which helps to further expand the light-emitting angle of the LED lamp bead and adapt to a wider range of lighting needs. Even if the second adhesive layer 32 does not contain phosphors, it can effectively control the scattering of light through its concave and lens-shaped design, thereby improving the coverage area and uniformity of the lighting effect.

[0067] As some embodiments, refer to the attached Figure 1As shown, the second adhesive layer 32 has a horizontal surface away from the first adhesive layer 31. The horizontal surface of the second adhesive layer 32 can more effectively control the propagation and distribution of light. When the light passes through the second adhesive layer 32, the horizontal surface can make the light more evenly scattered and diffused, thereby increasing the coverage and uniformity of the light. Through the design of the horizontal surface, the glare and light spot phenomenon caused by the reflection or refraction of light can be reduced, and the lighting comfort and visual effect of the LED lamp beads can be improved. In addition, the horizontal surface helps to more accurately control the diffusion direction and angle of the light, thereby further optimizing the light-emitting angle and lighting effect of the LED lamp beads.

[0068] As other embodiments, refer to the attached Figure 3-5 As shown, the second adhesive layer 32 has a convex shape on one side away from the first adhesive layer 31. The convex shape may be hemispherical, elliptical or other shapes suitable for optical diffusion, so as to change and control the propagation path of the light passing through the adhesive layer.

[0069] The convex design enables light to be scattered over a wider range when passing through the second adhesive layer 32, thereby expanding the light-emitting angle of the LED lamp bead. This convex shape disperses light more effectively than a flat surface and is suitable for applications that require a wide-angle light source. The convex surface design helps to achieve uniform light distribution, reduce bright spots caused by light concentrated in a small area, make light output more uniform, and improve lighting quality.

[0070] In some combination embodiments, refer to the attached Figure 3 As shown, the top surface of the second adhesive layer 32 is a horizontal plane, and a small protrusion is arranged on the horizontal plane. Specifically, the small protrusion can act as a micro lens to focus the light passing through it. This local focusing can enhance the light intensity of the LED lamp bead in a specific direction and improve the light output efficiency. More specifically, the horizontal plane provides a basic uniform light diffusion platform, and the small protrusion increases the directionality and concentration of the light on the basis of this uniform distribution. This combined effect allows the light to be evenly diffused in most areas, while achieving a longer distance or more focused lighting effect at the small protrusion.

[0071] As some derivatives, one or more small protrusions can be provided on the top horizontal plane of the second adhesive layer 32 to create a variety of optical effects to meet different lighting requirements. For example, in some applications, it is necessary to strengthen the central light while maintaining uniform lighting of the surrounding area.

[0072] As other embodiments, refer to the attached Figure 5-8As shown, the second adhesive layer 32 has a concave shape on one side away from the first adhesive layer 31. This setting makes the surface of the second adhesive layer 32 no longer flat, but forms one or more concave areas. The concave surface can more effectively control the propagation and scattering of light. When light passes through the second adhesive layer 32, the concave area will change the propagation direction and path of the light, thereby achieving a wider light diffusion and increasing the light-emitting angle of the LED lamp bead. The concave setting helps to reduce the concentration of light in a specific area, thereby reducing the generation of light spots and making the light output of the LED lamp bead more uniform.

[0073] In addition, through the concave design, the light will undergo more reflections and refractions when passing through the second adhesive layer 32, thereby increasing the interaction between the light and the material, optimizing the light scattering effect, and improving the visual quality of the LED lamp beads.

[0074] In some combination embodiments, refer to the attached Figure 8 As shown, the top surface of the second adhesive layer 32 is an arc-shaped convex surface, and a small depression is arranged on the arc-shaped convex surface. The arc-shaped convex surface provides a basic uniform light diffusion platform, and the small depression improves the uniform distribution of light by increasing the reflection and refraction of light on this basis. After passing through the small depression, the light is further scattered, reducing the bright spots and uneven lighting problems caused by concentrated light.

[0075] As some embodiments, refer to the attached Figure 2 As shown, a white glue layer 33 is further provided on one side of the second glue layer 32 away from the first glue layer 31. The white glue layer 33 has a very high light reflectivity and can effectively reflect the light penetrating the second glue layer 32 to suppress the light emitted from the front of the LED, thereby expanding the light emitting angle of the LED by 160° to 180°, and meeting the needs of different customers for different DHRs. In addition, the reflection of the white glue layer 33 can reduce the loss of light energy and increase the overall luminous efficiency of the lamp beads. The white glue layer 33 reflects back the light that may escape, so that more light is utilized, thereby increasing the light output efficiency of the LED. In this embodiment, preferably, the white glue layer 33 is made of silicone resin.

[0076] The present invention discloses a method for manufacturing an LED lamp bead with an enlarged light-emitting angle, which is used to manufacture the LED lamp bead with an enlarged light-emitting angle as described in the first aspect. Figure 9-13 As shown, the following steps are included;

[0077] Step 1: Take the whole LED bracket 100 , and set the LED chips 2 in the corresponding single brackets 1 of the whole LED bracket 100 , and the positive and negative electrodes of the LED chips 2 are electrically connected to the positive and negative terminals on the single brackets 1 respectively.

[0078] This step is implemented by a conventional die-bonding process in the LED packaging industry. In some implementations, when the LED chip 2 is a face-up chip, the LED chip 2 is fixed on the substrate 11 by a die-bonding insulating adhesive, and the surface of the LED chip 2 away from the substrate 11 is electrically connected to the substrate 11 through a wire; in another embodiment, the LED chip 2 is a flip-chip, and the LED chip 2 is fixed on the substrate 11 by a conductive adhesive such as silver glue or solder paste and is electrically connected to the substrate 11.

[0079] Step 2: Pour the packaging glue 3 into the mounting groove 10 of the single bracket 1, so that the packaging glue 3 fills the mounting groove 10 and wraps the LED chip 2 to form a first glue layer 31, and at the same time, the first glue layer 31 is higher than the top surface of the mounting groove 10 to form an arc-shaped convex shape.

[0080] This step is implemented using the conventional dispensing process in the LED packaging industry. It is worth noting that the first glue layer 31 is higher than the top surface of the mounting groove 10 and is in the shape of an arc-shaped protrusion. This step ensures that the LED chip 2 is effectively packaged and protected, and forms an arc-shaped protruding first glue layer 31, laying the foundation for the subsequent formation of the second glue layer 32.

[0081] Step 3: Take a thin plate 200 that matches the area of ​​the entire LED bracket 100, and arrange multiple arc-shaped convex glue drops 210 in an array on the upper surface of the thin plate 200 by dispensing glue, and the center spacing between the glue drops 210 is matched with the center spacing between the single brackets 1. In this embodiment, the thin plate 200 is flat, and the thickness is preferably 1mm-10mm. It can be a metal thin plate 200 or a plastic thin plate 200, and it only needs to meet the requirements of not deforming during high-temperature baking.

[0082] The shapes and layout of these glue drops 210 match the protrusions of the first glue layer 31 , which helps to form the second glue layer 32 in the subsequent fusion process.

[0083] Step 4: Flip the glue-dispensed thin plate 200 180° and place it directly above the entire LED bracket 100, and make the glue drop 210 on the bottom surface of the thin plate 200 merge with the first glue layer 31 in the single bracket 1 to form a second glue layer 32 between the top surface of the single bracket 1 and the bottom surface of the thin plate 200.

[0084] Through this step, the thin plate 200 is set horizontally after flipping 180°, and the glue drop 210 is on the lower surface of the thin plate 200. By controlling the flipping speed of the thin plate 200, the glue drop 210 can be prevented from flowing during the flipping process. Of course, since the glue drop 210 is made of the same colloid as the first glue layer 31, it has a certain viscosity and will adhere to the surface of the thin plate 200, and will not flow to cause the shape of the glue drop 210 to be destroyed. In the actual production process, the viscosity of the glue drop 210 can be controlled so that it does not flow during the flipping process of the thin plate 200.

[0085] After the thin plate 200 is flipped 180 degrees to a horizontal state, the thin plate 200 is slowly moved to the top of the entire LED bracket 100, so that the glue drop 210 on the bottom surface of the thin plate 200 contacts the first glue layer 31 in the monomer bracket 1. Since a certain distance between the thin plate 200 and the entire LED bracket 100 remains unchanged, the distance is the overall thickness of the second glue layer 32. At this time, since the glue drop 210 is adsorbed on the bottom surface of the thin plate 200, it has a certain gravity. When the glue drop 210 contacts the convex first glue layer 31 in the monomer bracket 1, due to the liquid adsorption effect, the two are instantly fused together. There is an adsorption attraction in the height direction between the monomer bracket 1 and the thin plate 200 for the fused colloid. At this time, the colloid between the monomer bracket 1 and the thin plate 200 is fused to form the second glue layer 32. Due to the adsorption force of the glue layer, a concave shape will be formed on the outer peripheral side of the second glue layer 32, and the concave shape can reflect the outer contour shape of the lens.

[0086] Step 5: Keep the relative position between the thin plate 200 and the whole LED bracket 100 unchanged, bake the thin plate 200 and the whole LED bracket 100 as a whole, and after the first adhesive layer 31 and the second adhesive layer 32 are completely cured, remove the thin plate 200 to obtain the whole LED bracket 100 with the packaging glue 3.

[0087] In this step, the entire encapsulation glue 3 on the LED bracket is completely cured by setting the baking temperature and time, and finally the thin plate 200 is removed to obtain a whole LED bracket 100 with the encapsulation glue 3. At this time, the encapsulation glue 3 on the single LED bracket has a lens shape. In this embodiment, preferably, the baking temperature is 80°C-150°C.

[0088] Step 6: Separate the entire LED bracket 100 to obtain LED lamp beads with an enlarged light-emitting angle.

[0089] This step can be achieved by stamping and blanking to obtain a single LED lamp bead, or by cutting.

[0090] The manufacturing method of LED lamp beads with enlarged light-emitting angle disclosed in the present invention uses a prefabricated glue drop 210 and an uncured first glue layer 31 to fuse to form a second glue layer 32. The first glue layer 31 and the second glue layer 32 together constitute a packaging glue 3 with a lens shape, which effectively enlarges the light-emitting angle of the LED lamp beads and improves the coverage of the lighting effect.

[0091] The entire production process does not require the use of customized molds, avoiding the expensive customized molds and long research and development cycles required by traditional molding processes. Compared with traditional molding processes, this manufacturing method does not require high-precision customized molds, saving production costs. At the same time, the production steps and research and development cycles are reduced, further reducing production costs and product development cycles. At the same time, glue droplets 210 of different shapes can be prefabricated to meet the structural form of the second glue layer 32 that needs to be formed. Compared with the lens solution formed by the secondary dispensing method in the prior art, the LED lamp beads disclosed in this embodiment can be designed with lens structures of different forms to meet the optical applications of different scenarios and have a wider range of applications.

[0092] In some optional embodiments, the following steps are also included between step five and step six: dispensing white colloid on the top surface of the cured second glue layer 32, and forming a white glue layer 33 after baking and hardening. Through the provision of the white glue layer 33, since the white glue layer 33 has a very high light reflectivity, it can effectively reflect the light penetrating the second glue layer 32 to suppress the front light of the LED, thereby expanding the light emitting angle of the LED by 160° to 180°, and meeting the needs of different customers for different DHRs. In addition, the reflection of the white glue layer 33 can reduce the loss of light energy and increase the overall luminous efficiency of the lamp beads. The white glue layer 33 reflects back the light that may escape, so that more light is utilized, thereby increasing the light output efficiency of the LED. In this embodiment, the baking temperature of the white glue layer 33 is 80°C-150°C.

[0093] It should be noted that the setting of the white glue layer 33 is suitable for the top surface of the second glue layer 32 to be flat. More specifically, when the top surface of the second glue layer 32 is flat, the white glue layer 33 is formed into a convex state by dispensing glue.

[0094] As some preferred implementations, refer to the attached Figure 14-19 As shown, a molding structure 220 for shaping the top surface shape of the second adhesive layer 32 is provided at the adhesive spot on the upper surface of the thin plate 200. For example, when the top surface of the second adhesive layer 32 is a plane, the adhesive spot on the upper surface of the thin plate 200 is a plane molding structure, and when the top surface of the second adhesive layer 32 is an arc-shaped convex, the adhesive spot on the upper surface of the thin plate 200 is an arc-shaped concave molding structure. According to the shape of the top surface of the second adhesive layer 32, the molding structure 220 at the adhesive spot on the upper surface of the thin plate 200 can be selectively provided.

[0095] As some preferred embodiments, a release agent is provided on the molding structure 220. The release agent is provided to facilitate the easy removal of the thin plate 200 after the curing is completed, so as to prevent the thin plate 200 from adhering to the packaging glue 3.

[0096] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing an LED lamp bead with an enlarged light-emitting angle, characterized in that: The steps include: Step 1: Take a whole piece of LED bracket (100), and set the LED chips (2) in a plurality of single brackets (1) corresponding to the whole piece of LED bracket (100), and electrically connect the positive and negative electrodes of the LED chips (2) to the positive and negative terminals on the single brackets (1) respectively; Step 2: injecting packaging glue (3) into the mounting groove (10) of the single-body bracket (1), so that the packaging glue (3) fills the mounting groove (10) and wraps the LED chip (2) to form a first glue layer (31), and at the same time, the first glue layer (31) is higher than the top surface of the mounting groove (10) to form an arc-shaped convex shape; Step 3: Take a thin plate (200) that matches the area of ​​the entire LED bracket (100), and arrange a plurality of arc-shaped convex glue drops (210) in an array on the upper surface of the thin plate (200) by dispensing glue, wherein the center distance between the glue drops (210) matches the center distance between the single brackets (1); Step 4: flip the glue-doped thin plate (200) by 180° and place it directly above the entire LED bracket (100), and fuse the glue drop (210) on the bottom surface of the thin plate (200) with the first glue layer (31) in the single bracket (1), so as to form a second glue layer (32) between the top surface of the single bracket (1) and the bottom surface of the thin plate (200); Step 5: Keeping the relative position between the thin plate (200) and the whole LED bracket (100) unchanged, the thin plate (200) and the whole LED bracket (100) are baked as a whole, and after the first adhesive layer (31) and the second adhesive layer (32) are completely cured, the thin plate (200) is removed to obtain the whole LED bracket (100) with the packaging adhesive (3); Step 6: Separate the entire LED bracket (100) to obtain LED lamp beads with an enlarged light-emitting angle; The LED lamp bead with an enlarged light-emitting angle comprises a single-body bracket (1), an LED chip (2) and a packaging glue (3); the single-body bracket (1) comprises a substrate (11) and a plastic body (12) arranged on the substrate (11); the plastic body (12) and the substrate (11) are connected and a mounting groove (10) is formed inside the plastic body; The LED chip (2) is located in the mounting groove (10), and the LED chip is electrically connected to the substrate (11); The packaging glue (3) comprises a first glue layer (31) and a second glue layer (32); the first glue layer (31) is filled in the installation groove (10) and covers the LED chip (2), so that the LED chip (2) emits a predetermined light after stimulating the first glue layer (31); the second glue layer (32) is located on the first glue layer (31) and is formed by fusing a prefabricated glue drop (210) with the uncured first glue layer (31); the top of the second glue layer (32) forms a lens-shaped structure, and the outer side surface forms a concave shape.

2. The method for manufacturing an LED lamp bead with an enlarged light-emitting angle as claimed in claim 1, characterized in that: The first adhesive layer (31) and the second adhesive layer (32) are the same type of colloid, the first adhesive layer (31) is a colloid containing fluorescent powder, and the second adhesive layer (32) is a colloid not containing fluorescent powder; or the first adhesive layer (31) and the second adhesive layer (32) are both colloids containing fluorescent powder.

3. The method for manufacturing an LED lamp bead with an enlarged light-emitting angle as claimed in claim 2, characterized in that: A surface of the second adhesive layer (32) away from the first adhesive layer (31) is horizontal.

4. The method for manufacturing an LED lamp bead with an enlarged light-emitting angle as claimed in claim 2, characterized in that: A surface of the second adhesive layer (32) away from the first adhesive layer (31) is convex.

5. The method for manufacturing an LED lamp bead with an enlarged light-emitting angle as claimed in claim 2, characterized in that: A surface of the second adhesive layer (32) away from the first adhesive layer (31) is in a concave shape.

6. The method for manufacturing an LED lamp bead with an enlarged light-emitting angle as claimed in claim 3, characterized in that: A white glue layer (33) is also provided on a side of the second glue layer (32) away from the first glue layer (31).

7. The method for manufacturing an LED lamp bead with an enlarged light-emitting angle as claimed in claim 1, characterized in that: The following steps are also included between step five and step six: dispensing white glue on the top surface of the solidified second glue layer (32), and baking and hardening to form a white glue layer (33).

8. The method for manufacturing an LED lamp bead with an enlarged light-emitting angle as claimed in claim 1, characterized in that: A shaping structure (220) for shaping the top surface shape of the second glue layer (32) is provided at the glue spot on the upper surface of the thin plate (200).

9. The method for manufacturing an LED lamp bead with an enlarged light-emitting angle as claimed in claim 8, characterized in that: A release agent is provided on the shaping structure (220).

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