An SPI detection device for SMT patches

Abstract

The invention discloses an SPI detection device for SMT patches, which relates to the technical field of SMT patches and comprises a base; a main display and a sub-display, both of which are fixed on the side of the base; a warning light, which is fixed on the upper end surface of the base; a conveyor belt, which is installed in the base; a positioning component, which is fixed in the base and located in the middle of the conveyor belt; and a detection component, which is fixed in the base and located above the conveyor belt and the positioning component; and the detection component comprises a bracket, which is fixed on the base, an XU mobile platform, which is fixed on the bracket, and a scanning component, which is fixed on the output end of the XY mobile platform.

Description

Technical Field

[0001] The invention relates to the technical field of SMT patches, in particular to an SPI detection device for SMT patches. Background Art

[0002] SMT patch refers to the abbreviation of a series of process flows based on PCB. PCB (Prin ted Circuit Board) is a printed circuit board, and SMT is the abbreviation of surface assembly technology (surface mount technology). It is the most popular technology and process in the electronic assembly industry. Before patching, it is necessary to use printing equipment to print solder paste on the PCB board. After printing, it is necessary to use SPI equipment for detection, which is used to detect the height, volume, area, short circuit and offset of the solder paste after printing.

[0003] There are many types of existing SPI detection equipment, among which 3D scanning detection is relatively accurate, but it uses at least 5 scanning heads for scanning, which is costly, and its scanning accuracy will be greatly reduced for irregular solder joint positions. In addition, when the entire PCB board is moved for scanning and detection, the vibration generated by its movement will affect the display results, resulting in detection misjudgment and affecting detection efficiency.

[0004] In view of the above problems, the present invention provides an SPI detection device for SMT patches to solve the above problems. Summary of the invention

[0005] To achieve the above object, the present invention provides the following technical solution: an SPI detection device for SMT patches, comprising:

[0006] Base;

[0007] The main display and the auxiliary display are both fixed on the sides of the base;

[0008] A warning light, fixed on the upper end surface of the base;

[0009] A conveyor belt installed in the base;

[0010] A positioning assembly, fixed in the base and located in the middle of the conveyor belt; and

[0011] A detection assembly, fixed in the base and located above the conveyor belt and the positioning assembly;

[0012] The detection component includes a bracket fixed on the base; an XY moving platform fixed on the bracket; and a scanning component fixed on the output end of the XY moving platform.

[0013] Further, preferably, the positioning component includes:

[0014] An adapter plate, fixed on the base;

[0015] A fixing plate, fixed on the lower end surface of the adapter plate;

[0016] The slide rails are configured as two and symmetrically fixed on the fixing plate;

[0017] A lifting cylinder body is fixed on the fixing plate and is located between the two slide rails;

[0018] A connecting plate is slidably arranged on the slide rail by means of a slider and is connected to the output end of the lifting cylinder body;

[0019] A support plate, fixed on the connecting plate, and having a slide groove at one end;

[0020] A positioning plate, fixed to an end of the support plate away from the slide groove;

[0021] an adjusting assembly, slidably disposed in the slide slot; and

[0022] The regulating cylinder is fixed on the supporting plate, and the output end thereof is connected to the regulating assembly.

[0023] Further, preferably, the adjustment component comprises:

[0024] An adjusting plate is slidably arranged in the slide slot, and a sensing compartment is provided at the top of the adjusting plate;

[0025] A pressure sensing plate, detachably inserted into the sensing compartment; and

[0026] The sliding block is slidably arranged in the sensing bin, and a return spring is arranged between the sliding block and the pressure sensing plate.

[0027] Further, preferably, the scanning component comprises:

[0028] Carrying compartment;

[0029] A spray head is fixed to the outer wall of the carrier bin and is connected to an external spray device;

[0030] A fixed plate, fixed inside the carrying chamber, and having a scanning motor fixed on its upper end surface;

[0031] a rotating disk, rotatably disposed on the lower end surface of the fixed disk and connected to the output end of the scanning motor; and

[0032] The conversion assembly is fixed on the lower end surface of the rotating disk and is rotatably arranged with the inner wall of the carrying chamber.

[0033] Further, preferably, the maximum rotation angle of the scanning motor is 90°.

[0034] Further, preferably, the conversion component comprises:

[0035] The sweep panel is provided with three connection slots;

[0036] The connecting column is configured in three pieces and is respectively connected to the three connecting grooves by using a plurality of dampers;

[0037] The L-plate is configured in three pieces and is respectively fixed to the lower end surfaces of the three connecting columns;

[0038] The angle motor is configured as two and is respectively fixed on the L-plate located on both sides;

[0039] The mounting frames are configured into three, two of which are respectively fixed on the output ends of the angle motor, and the other is fixed on the L-plate located in the middle by a reinforcement block; and

[0040] The scanning heads are configured into three and are respectively fixed on the three mounting frames.

[0041] Further, preferably, the plurality of dampers are installed at an angle, and both ends thereof are hinged.

[0042] Further, preferably, the maximum rotation angle of the angle motor is 45°.

[0043] Compared with the prior art, the present invention provides an SPI detection device for SMT patches, which has the following beneficial effects:

[0044] In the present invention, the PCB board can be accurately positioned by the positioning component, so that the detection position is the same each time, thereby improving the accuracy of detection, and the PCB board is lifted up for detection by the positioning component, which can effectively avoid the vibration transmission of the conveyor belt, further improving the accuracy of detection, and the scanning head can be adjusted by the scanning motor during detection, so that the scanning head can scan the solder paste position in multiple directions, and when there is an abnormality in the solder paste, it can be marked by the spray head, thereby facilitating local cleaning, and the scanning head can also be adjusted by the angle motor during scanning, so that the scanning range can be adjusted, and the vibration transmission during mobile scanning can be reduced by the damper, thereby improving the stability of the scanning head. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is an overall schematic diagram of an SPI detection device for SMT patches;

[0046] Figure 2 A schematic diagram of a positioning component of an SPI detection device for SMT patches;

[0047] Figure 3 A schematic diagram of an adjustment component of an SPI detection device for SMT patches;

[0048] Figure 4 A schematic diagram of a detection component of an SPI detection device for SMT patches;

[0049] Figure 5 A schematic diagram of a scanning component of an SPI detection device for SMT patches;

[0050] Figure 6 A schematic diagram of a shock absorbing component for an SPI detection device for SMT patches;

[0051] Figure 7 A schematic diagram of the scanning range of an SPI detection device for SMT patches;

[0052] Figure 8 A schematic diagram of a main display of an SPI detection device for SMT patches;

[0053] Fig. 9 A schematic diagram of a secondary display of an SPI detection device for SMT patches;

[0054] Fig.10 It is a schematic diagram of the process of an SPI detection device for SMT patches;

[0055] In the figure: 1. base; 2. main display; 3. sub-display; 4. warning light; 5. conveyor belt; 6. positioning assembly; 7. detection assembly; 61. adapter plate; 62. fixing plate; 63. slide rail; 64. lifting cylinder; 65. connecting plate; 66. supporting plate; 67. positioning plate; 68. adjustment assembly; 69. adjusting cylinder; 681. adjustment plate; 682. pressure sensing plate; 683. sliding block; 684. reset spring; 71. bracket; 72. XY moving platform; 73. scanning assembly; 731. bearing chamber; 732. spray head; 733. fixing plate; 734. scanning motor; 735. rotating plate; 736. conversion assembly; 7361. scanning panel; 7362. connecting column; 7363. damper; 7364. L plate; 7365. angle motor; 7366. mounting bracket; 7367. scanning head. DETAILED DESCRIPTION

[0056] Reference Figures 1 to 10 The present invention provides a technical solution: an SPI detection device for SMT patches, comprising:

[0057] Base 1;

[0058] The main display 2 and the auxiliary display 3 are both fixed on the side of the base 1;

[0059] A warning light 4 is fixed on the upper end surface of the base 1;

[0060] A conveyor belt 5 is installed in the base 1;

[0061] A positioning assembly 6 is fixed in the base 1 and is located in the middle of the conveyor belt 5; and

[0062] A detection component 7 is fixed in the base 1 and is located above the conveyor belt 5 and the positioning component 6;

[0063] The detection component 7 includes a bracket 71 fixed on the base 1 ; an XY moving platform 72 fixed on the bracket 71 ; and a scanning component 73 fixed on the output end of the XY moving platform 72 .

[0064] Among them, the main display 2 and the sub-display 3 can respectively display the PCB board as a whole and in part, so that when the solder paste position is abnormal, the main display 2 and the sub-display 3 can intuitively show the abnormal position and abnormal type, which is convenient for repair work.

[0065] In this embodiment, the positioning component 6 includes:

[0066] An adapter plate 61, fixed on the base 1;

[0067] A fixing plate 62, fixed on the lower end surface of the adapter plate 61;

[0068] The slide rails 63 are configured as two and symmetrically fixed on the fixing plate 62;

[0069] A lifting cylinder 64 is fixed on the fixing plate 62 and is located between the two slide rails 63;

[0070] The connecting plate 65 is slidably disposed on the slide rail 63 by means of a slider, and is connected to the output end of the lifting cylinder 64;

[0071] A support plate 66 is fixed on the connecting plate 65 and has a slide groove at one end;

[0072] A positioning plate 67, fixed to an end of the support plate 66 away from the slide groove;

[0073] an adjustment assembly 68, slidably disposed in the slide slot; and

[0074] The adjusting cylinder 69 is fixed on the supporting plate 66 , and its output end is connected to the adjusting assembly 68 .

[0075] As a preferred embodiment, the adjustment component 68 includes:

[0076] The adjusting plate 681 is slidably disposed in the slide slot, and a sensing compartment is provided at the top thereof;

[0077] A pressure sensing plate 682, which is detachably inserted into the sensing compartment; and

[0078] The sliding block 683 is slidably disposed in the sensing chamber, and a return spring 684 is disposed between the sliding block 683 and the pressure sensing plate 682 .

[0079] That is to say, during detection, the PCB board can be accurately positioned through the positioning component 6, so that the detection position is the same each time, thereby improving the accuracy of detection, and the PCB board is lifted up for detection by the lifting cylinder 64, which can effectively avoid the vibration transmission of the conveyor belt 5, further improving the accuracy of detection.

[0080] In this embodiment, the scanning component 73 includes:

[0081] Carrying chamber 731;

[0082] A spray head 732 is fixed to the outer wall of the carrier chamber 731 and is connected to an external spray device;

[0083] A fixed plate 733 is fixed inside the carrier chamber 731 and a scanning motor 734 is fixed on its upper end surface;

[0084] a rotating disk 735, which is rotatably disposed on the lower end surface of the fixed disk 733 and connected to the output end of the scanning motor 734; and

[0085] The conversion assembly 736 is fixed to the lower end surface of the rotating disk 735 and is rotatably disposed with the inner wall of the carrying chamber 731 .

[0086] As a preferred embodiment, the maximum rotation angle of the scanning motor 734 is 90°.

[0087] It should be noted that the maximum rotation angle of the scanning motor 734 is Figure 5 The position is rotated 90° clockwise or 90° counterclockwise to perform a full-scale scan.

[0088] As a preferred embodiment, the conversion component 736 includes:

[0089] The sweep panel 7361 is provided with three connection slots;

[0090] The connecting column 7362 is configured in three pieces, and a plurality of dampers 7363 are respectively connected in the three connecting grooves;

[0091] The L-plates 7364 are configured in three pieces and are respectively fixed to the lower end surfaces of the three connecting pillars 7362;

[0092] The angle motor 7365 is configured as two and is respectively fixed on the L-plate 7364 located on both sides;

[0093] The mounting brackets 7366 are configured as three, two of which are respectively fixed on the output ends of the angle motor 7365, and the other is fixed on the L plate 7364 located in the middle position by a reinforcement block; and

[0094] The scanning head 7367 is configured into three and is fixed on the three mounting frames 7366 respectively.

[0095] That is, the position of the conversion component 736 can be adjusted by the scanning motor 734 so as to perform multi-directional scanning on the solder paste position, such as Fig. 9 As shown, when the solder paste is in an irregular state, it is not easy to completely scan out the abnormal state by detecting from both sides. At this time, the conversion component 736 is rotated by the scanning motor 734, so that the scanning head 7367 scans the abnormal position again to improve the accuracy of the detection.

[0096] As a preferred embodiment, the plurality of dampers 7363 are installed at an angle, and both ends thereof are hinged.

[0097] As a preferred embodiment, the maximum rotation angle of the angle motor 7365 is 45°.

[0098] Among them, the scanning range of the scanning head 7367 can be adjusted by rotating the angle motor 7365, so as to make corresponding adjustments according to the arrangement position of the solder paste on the PCB board. That is to say, the number of solder pastes in the scanning position should not exceed 3 at a time, so as to avoid inaccurate results caused by too much scanning at one time.

[0099] The specific testing process is:

[0100] S1. The printed PCB board is conveyed to the top of the positioning assembly 6 via the conveyor belt 5;

[0101] S2. The positioning assembly 6 performs preliminary lifting and positioning of the PCB board through the lifting cylinder 64;

[0102] S3. The adjustment component 68 pushes the PCB board so that the positioning plate 67 performs a secondary precise positioning thereof;

[0103] S4. Detection component 7 is scanned;

[0104] S5. After the detection is completed, the positioning component 6 resets the PCB board and the conveyor belt 5 starts conveying.

[0105] In S3, when the pressure value of the pressure sensing plate 682 reaches the set value, the adjusting cylinder 6 stops pushing, and the adjustment positioning is completed;

[0106] In S4 and S5, when the warning light 4 does not give an alarm after scanning, the detection is qualified, and the positioning component 6 resets the PCB board and conveys it to the next process through the conveyor belt 5;

[0107] When the warning light 4 gives an alarm after scanning, the spray head 732 sprays and marks the abnormal position, the main display 2 performs a plane display, and the auxiliary display 3 performs a partial three-dimensional display, so as to accurately judge the abnormal position and determine whether the printing process needs to be adjusted. Figure 8 and 9 As shown, A is solder paste breakage, B is solder paste deviation, C is solder paste collapse, and among them Figure 8 Display the image on the main display 2. Fig. 9 The auxiliary display 3 displays the image. After the detection is completed, the positioning component 6 resets the PCB board, and the PCB board is transported and taken out through the conveyor belt 5 for re-printing and detection.

[0108] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An SPI detection device for SMT patches, characterized by: include: Base (1); A main display (2) and a secondary display (3) are both fixed on the side of the base (1); A warning light (4) fixed on the upper end surface of the base (1); A conveyor belt (5) installed in the base (1); A positioning assembly (6) is fixed in the base (1) and is located in the middle of the conveyor belt (5); as well as A detection component (7) is fixed in the base (1) and is located above the conveyor belt (5) and the positioning component (6); The detection component (7) comprises a bracket (71) fixed on the base (1); an XY moving platform (72) fixed on the bracket (71); and a scanning component (73) fixed on the output end of the XY moving platform (72); The positioning component (6) comprises: An adapter plate (61) fixed on the base (1); A fixing plate (62) fixed to the lower end surface of the adapter plate (61); The slide rails (63) are configured as two and are symmetrically fixed on the fixing plate (62); A lifting cylinder (64) is fixed on the fixing plate (62) and is located between the two slide rails (63); A connecting plate (65) is slidably disposed on the slide rail (63) by means of a slider, and is connected to an output end of the lifting cylinder (64); A support plate (66) is fixed on the connecting plate (65) and has a slide groove at one end; A positioning plate (67) fixed to an end of the support plate (66) away from the slide groove; an adjustment component (68) slidably disposed in the slide groove; and An adjusting cylinder (69) is fixed on the support plate (66), and an output end thereof is connected to the adjusting component (68); The adjustment component (68) comprises: An adjustment plate (681) is slidably disposed in the slide groove, and a sensing compartment is provided at the top of the adjustment plate; A pressure sensing plate (682) is detachably inserted into the sensing compartment; and The sliding block (683) is slidably disposed in the sensing chamber, and a return spring (684) is disposed between the sliding block and the pressure sensing plate (682).

2. The SPI detection device for SMT patches according to claim 1, characterized in that: The scanning component (73) comprises: Carrying chamber (731); A spray head (732) is fixed to the outer wall of the carrier chamber (731) and is connected to an external spray device; A fixed plate (733) is fixed inside the carrying chamber (731), and a scanning motor (734) is fixed on its upper end surface; a rotating disk (735) rotatably disposed on the lower end surface of the fixed disk (733) and connected to the output end of the scanning motor (734); and The conversion assembly (736) is fixed to the lower end surface of the rotating disk (735) and is rotatably arranged with the inner wall of the carrying chamber (731).

3. The SPI detection device for SMT patches according to claim 2, characterized in that: The maximum rotation angle of the scanning motor (734) is 90°.

4. The SPI detection device for SMT patches according to claim 2, characterized in that: The conversion component (736) includes: The sweep panel (7361) is provided with three connection slots; The connecting columns (7362) are configured in three numbers, and are respectively connected to the three connecting grooves using a plurality of dampers (7363); The L-plate (7364) is configured in three pieces and is respectively fixed on the lower end surfaces of the three connecting pillars (7362); The angle motor (7365) is configured as two and is respectively fixed on the L-plate (7364) located on both sides; The mounting brackets (7366) are configured into three pieces, two of which are respectively fixed on the output ends of the angle motor (7365), and the other is fixed on the L-plate (7364) located in the middle position by using a reinforcement block; and The scanning head (7367) is configured into three and is respectively fixed on the three mounting frames (7366).

5. The SPI detection device for SMT patches according to claim 4, characterized in that: The plurality of dampers (7363) are all installed at an angle, and both ends thereof are hinged.

6. The SPI detection device for SMT patches according to claim 5, characterized in that: The maximum rotation angle of the angle motor (7365) is 45°.

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