Optical element driving device, camera module and camera mounting device

Abstract

This invention achieves both miniaturization and mass production of the optical element driving device, camera module, and camera mounting device. The optical element driving device has a movable part that holds the optical element and a storage part that houses the movable part, supported by a support part above a fixed part. The movable part and storage part are moved by a driving part. The support part has at least one set of multiple wire components arranged to connect the fixed part and the storage part, and each is connected to an electrical component of the fixed part. The fixed part has a recessed portion in the vertical direction, exposing the connection portion between the electrical component and each wire component at its bottom. The sidewall of the recess has a first portion located in the arrangement direction of the multiple wire components, corresponding to each wire component, and a second portion located between adjacent first portions. The second portion is recessed in the first portion to bypass the corresponding wire component, and protrudes towards the gap between adjacent wire components in the second portion.

Description

Technical Field

[0001] This invention relates to an optical element driving device, a camera module, and a camera mounting device. Background Technology

[0002] Typically, portable devices such as smartphones incorporate small camera modules. These camera modules utilize optical element driving mechanisms that drive the optical elements.

[0003] The optical element drive unit has an autofocus function (hereinafter referred to as "AF function") and an image stabilization function (hereinafter referred to as "OIS function"). The optical element drive unit automatically focuses on the subject when shooting through the AF function, and performs optical correction on the shake (vibration) that occurs during shooting to reduce image clutter through the OIS function.

[0004] For example, Patent Document 1 shows an optical element driving device with both AF and OIS functions. The optical element driving device shown in Patent Document 1 includes: a movable part that can hold an optical element and has a coil; a cylindrical storage part that has a magnet and can move along the direction of the optical axis to store the movable part; and a fixing part that can move along a direction intersecting the optical axis (orthogonal direction of the optical axis) to support the movable part and the storage part.

[0005] Furthermore, for example, the optical element driving device described in Patent Document 1 includes: a leaf spring member mounted on a storage section and supporting the movable section from above to an opening side; and two wire members extending between a fixed section and the leaf spring member, corresponding to the four corners of the storage section, and supporting the storage section. Moreover, at each of the four corners of the storage section, the two wire members are connected to different leaf spring members. Each wire member is electrically connected to an electrical component provided in the fixed section for power supply and signal transmission.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2016-180836 Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] However, in conventional optical element driving devices, miniaturization is sometimes achieved by exposing the connection between the wire component and the electrical component while embedding the electrical component within a mounting portion. In such cases, the mounting portion, due to its construction, is susceptible to heat applied to the connection during the wire and electrical component connection process, potentially causing undesirable deformation. This can lead to problems with the mass production of the device.

[0011] The purpose of this invention is to provide an optical element driving device, a camera module, and a camera mounting device that can achieve both miniaturization and mass production.

[0012] Methods for solving problems

[0013] One embodiment of the optical element driving device of the present invention is an optical element driving device in which a movable part capable of holding an optical element and a receiving part for housing the movable part are supported above a fixed part by a support part, and the movable part and the receiving part are moved by a driving part.

[0014] The optical element driving device is characterized in that...

[0015] The support portion has at least one set of multiple wire components arranged together to connect the fixing portion and the storage portion, and to the electrical components of the fixing portion.

[0016] The fixing part has a recessed portion in the vertical direction that exposes the connection portion between the electrical component and each wire component at its bottom. The sidewall of the recessed portion has a first portion located at a position corresponding to each wire component in the arrangement direction of the plurality of wire components and a second portion located between adjacent first portions, and has the following shape: the first portion is recessed in such a way as to bypass the corresponding wire component, and the second portion protrudes toward the gap between adjacent wire components.

[0017] The effects of the invention

[0018] According to the present invention, it is possible to achieve both miniaturization and mass production of the optical element driving device, the camera module, and the camera mounting device. Attached Figure Description

[0019] Figure 1A This is a front view of an example of a camera mounting device equipped with a camera module according to an embodiment of the present invention. Figure 1B This is a rear view of an example of the camera mounting device according to an embodiment of the present invention.

[0020] Figure 2A This is a front view of another example of a camera mounting device equipped with a camera module according to an embodiment of the present invention. Figure 2BThis is a perspective view of another example of the camera mounting device according to an embodiment of the present invention.

[0021] Figure 3 This is a perspective view schematically illustrating the structure of a camera module according to an embodiment of the present invention.

[0022] Figure 4 This is a perspective view of the optical element driving device of the camera module according to an embodiment of the present invention.

[0023] Figure 5 This is an exploded perspective view, taken from above, of the camera module in an embodiment of the present invention with the cover removed from the optical element drive device.

[0024] Figure 6 The embodiments of the present invention are viewed from below. Figure 5 The decomposed 3D diagram of the state shown.

[0025] Figure 7 This indicates that in the embodiments of the present invention Figure 5 An exploded perspective view of the internal structure of the optical element drive device with the cover removed.

[0026] Figure 8 This is an exploded perspective view showing the state of the base component and wiring component in the camera module according to an embodiment of the present invention.

[0027] Figure 9 This is a perspective view showing a state in which the connection between the wiring component and the line component is exposed and the wiring component is embedded in the base component in the camera module according to an embodiment of the present invention.

[0028] Figure 10A , Figure 10B as well as Figure 10C This refers to the base component of the camera module according to an embodiment of the present invention. Figure 9 A magnified view of part A, viewed from different directions.

[0029] Symbol Explanation

[0030] 1: Optical element driving device

[0031] 2: Lens section (optical element)

[0032] 3: Lid

[0033] 5: Camera Department

[0034] 10: OIS Correction Unit (Drive Unit)

[0035] 11: AF focusing unit (drive unit)

[0036] 12: AF holding section

[0037] 12a: Magnetic support (storage section)

[0038] 13: AF leaf spring support section (support section)

[0039] 13a: Upper leaf spring assembly (leaf spring assembly)

[0040] 13b: Lower leaf spring assembly

[0041] 20: OIS Basic Department

[0042] 22: OIS coil section

[0043] 23: Magnetic Sensor Section

[0044] 24: Protective components

[0045] 25: Base component (fixed part)

[0046] 27: Wiring components (electrical components)

[0047] 27a1: Terminal element for coil

[0048] 27a2: Terminal connection part for coil

[0049] 27b1: Terminal elements for substrates

[0050] 27b2: Terminal connection part for substrate

[0051] 27c1: Terminal components for electrical wires

[0052] 27c2: Terminal connection part for wires

[0053] 28: Sealing materials

[0054] 30: Suspension line (line component, support part)

[0055] 40: Wiring connection part; 110: Lens bracket (movable part)

[0056] 110a: Lens holding section

[0057] 110a1: Lens storage opening

[0058] 111: AF coil section

[0059] 125: Magnet section

[0060] 250: Central opening

[0061] 252: Recessed portion for coil

[0062] 254: Recess for wire wiring

[0063] 254a: Bottom

[0064] 254b: Sidewall

[0065] 254b1: Recessed portion (first part)

[0066] 254b2: Protrusion (Part Two)

[0067] 301: Opening

[0068] 501: Image sensor substrate

[0069] 502: Camera element

[0070] 503: Control Department Detailed Implementation

[0071] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0072] [Regarding the structure of the camera mounting device]

[0073] First, a camera mounting device for a camera module using an embodiment of the present invention will be described.

[0074] Figure 1A , Figure 1B This is a diagram showing a smartphone M (an example of a camera-equipped device) that is equipped with a camera module A. Figure 1A This is the main view of the smartphone M. Figure 1B This is a rear view of smartphone M. Smartphone M has more than one rear camera OC. Camera module A is applied in the rear camera OC.

[0075] The smartphone M is a camera-equipped device that functions as an information device. The smartphone M includes: a camera module A; and an image processing unit that processes the image information obtained by the camera module A. The camera module A has AF and OIS functions, enabling it to automatically focus on the subject when shooting and optically correct for camera shake (vibration) to capture images without image shakiness.

[0076] Figure 2A , Figure 2B This is a diagram showing a car V (another example of a camera-mounted device) equipped with a vehicle camera module VC (Vehicle Camera). Figure 2A This is the front view of car V. Figure 2B This is a 3D view of the rear of a car (V). For example... Figure 2A as well as Figure 2BAs shown, an in-vehicle camera module VC is mounted, for example, facing forward on the windshield or facing backward on the rear door. The in-vehicle camera module VC is used for rear monitoring, dashcams, collision avoidance control, and autonomous driving control, etc. Camera module A is applied in the in-vehicle camera module VC of a car V.

[0077] The vehicle-mounted camera module VC is a camera mounting device used as a conveyor. The vehicle-mounted camera module VC includes: a camera module A; and an image processing unit that processes the image information obtained from the camera module A. The vehicle-mounted camera module VC has AF and OIS functions, enabling automatic focusing when photographing the subject and optical correction of camera shake (vibration) to capture shake-free images.

[0078] Furthermore, optical element driving devices can be applied to various camera-mounted devices. For example, camera-mounted devices include various information devices and transmission devices. Information devices include, for example, mobile phones with cameras, laptops, tablets, portable game consoles, and webcams. Transmission devices include, for example, vehicle-mounted devices with cameras (e.g., rear-view monitors, dashcams), drones, and other unmanned aerial vehicles (UAVs). Furthermore, drones and other UAVs are also examples of information devices.

[0079] [Regarding the structure of camera module A]

[0080] Next, the general structure of camera module A will be described. An orthogonal coordinate system (X, Y, Z) will be used. Furthermore, the shape-related representation is a convenient way to illustrate a simplified, approximate shape; it goes without saying that the strict geometric definition of a figure may not apply.

[0081] Figure 3 This is a perspective view schematically representing the structure of camera module A. Camera module A, for example, when taking pictures using a smartphone M, is mounted with the X direction as the vertical (or horizontal) direction, the Y direction as the horizontal (or vertical) direction, and the Z direction as the forward / backward direction. That is, the Z direction is the direction of the light path. Figure 3 In the diagram, the upper side (+Z side) is the light-receiving side (also known as the macro position side) in the optical path direction, and the lower side (-Z side) is the imaging side (also known as the infinity position side) in the optical path direction. Directions orthogonal to the Z direction are optical path orthogonal directions. The X and Y directions are examples of optical path orthogonal directions.

[0082] Figure 4 This is a perspective view of the optical element drive unit 1 of camera module A. (See image below.) Figure 4As shown, the light path, which serves as the light channel, is formed by the opening 301 of the cover 3, the lens receiving opening 110a1 of the lens receiving section 2 in the AF focusing section 11, and the central opening 250 in the OIS base section 20 relative to the imaging element 502. Furthermore, the direction in which this light path extends (the direction through which each opening passes) is the light path direction. Regarding the light path direction, it can also be referred to by other names such as optical axis direction, focal point direction (the direction for adjusting the focus), depending on the type of optical element. Additionally, the orthogonal direction of the light path can also be called the orthogonal direction of the optical axis, the shake correction direction, etc., and the XY plane can also be called the orthogonal plane of the optical axis, the shake correction plane, etc.

[0083] In addition, unless otherwise specified, "radial" refers to the direction in which the optical path extends radially or centrifugally around the optical axis, and "circumferential" refers to the direction in which the optical path extends around the optical axis. Furthermore, unless otherwise specified, "outer side" refers to the outer side of the optical path or the radial direction around the optical axis, and "inner side" refers to the inner side of the optical path or the radial direction around the optical axis.

[0084] Furthermore, in the following description, the four corners of the top-view shape (in this case, a square) of camera module A are sometimes defined differently from each other. In this case, for convenience, the corner on the X-direction + side and the Y-direction + side is called the first corner, the corner on the X-direction - side and the Y-direction + side is called the second corner, the corner on the X-direction - side and the Y-direction - side is called the third corner, and the corner on the X-direction + side and the Y-direction - side is called the fourth corner.

[0085] like Figure 3 As shown, camera module A includes: an optical element drive device 1, which implements AF and OIS functions; a lens section 2 (an example of an optical element), which houses a lens in a cylindrical lens tube; and an image capture section 5, which captures an image of a subject imaged by the lens section 2.

[0086] The outer side of the optical element drive unit 1 is covered by a cover 3. The cover 3 is a rectangular covered cylindrical body viewed from above in the Z direction. However, in this case, the cover 3 is square in shape when viewed from above. The cover 3 has a generally circular opening 301 on its upper surface (the surface in the Z direction + side). The lens part 2 faces outward from the opening 301 of the cover 3. The cover 3, for example, is fixed to the base component 25 of the OIS base part 20 of the optical element drive unit 1 by adhesive bonding (see reference). Figure 4 The cover 3, for example, is made of a magnetic material and functions as a shielding component to shield electromagnetic waves from the outside of the optical element drive device 1 and to prevent magnetic interaction between the inside and outside of the optical element drive device 1.

[0087] The imaging unit 5 is disposed on the imaging side (Z-direction - side) of the optical element driving device 1. The imaging unit 5, for example, includes an image sensor substrate 501, an imaging element 502 mounted on the image sensor substrate 501, and a control unit 503. The imaging element 502, for example, is composed of a CCD (charge-coupled device) type image sensor, a CMOS (complementary metal oxide semiconductor) type image sensor, etc., and captures an image of the subject imaged by the lens unit 2. The optical element driving device 1 is mounted on the image sensor substrate 501 and electrically connected to the image sensor substrate 501.

[0088] The control unit 503, for example, is composed of a control IC (Integrated Circuit) and performs drive control of the optical element driving device 1. The control unit 503 may be provided on the image sensor substrate 501, or it may be provided on a camera-mounted device (here, a smartphone M) that carries the camera module A.

[0089] Furthermore, here, relative to the image sensor substrate 501 whose position is fixed, the optical element driving device 1 employs a structure that allows the lens portion 2 of the OIS correction unit 10 to move along the optical axis direction and in the direction orthogonal to the optical axis. However, for the purpose of focusing or shake correction, the lens portion 2 may be fixed (cannot move) in at least one of the optical axis direction and the direction orthogonal to the optical axis, while the imaging element 502 is movable (can move). In this case, the imaging element 502 is an example of an optical element held by the AF focusing unit 11 or the OIS correction unit 10.

[0090] [Structure of optical element driving device 1]

[0091] Next, use Figure 5 Figure 10 illustrates the structure of the optical element driving device 1. For convenience, in the description of the structure of the optical element driving device 1, the Z-direction + side is designated as "upper" and the Z-direction - side as "lower".

[0092] Figure 5 This is an exploded perspective view of the camera module A with the cover 3 removed from the optical element drive device 1, viewed from above. Figure 6 Viewed from below Figure 5 The decomposed 3D diagram of the state shown. Figure 7 It means in Figure 5 An exploded perspective view of the internal structure of the optical element driving device 1 after removing the cover 3. Furthermore, Figure 8 This is an exploded perspective view showing the state after the base component 25 and wiring component 27 are separated in the camera module A. Figure 9This is a perspective view showing the state in which the connection between the wiring component 27 and the wire component 30 is exposed in the camera module A and the wiring component 27 is embedded in the base component 25. Figure 10A , Figure 10B as well as Figure 10C It is the base component 25 of camera module A. Figure 9 Enlarged from part A, respectively from Figure 9 The diagram shows views taken in the a direction (parallel to the -Y direction), the b direction (parallel to the +Z direction), and the c direction (diagonal direction of the base component 25). Furthermore, in... Figures 4 to 6 The structure shown is similar to Figures 7 to 9 There are several differences in the terminal configuration and fine shape between the structures shown, but they illustrate that various variations can be applied to the shape and configuration other than the main features of the invention in this embodiment.

[0093] The optical element drive device 1 includes an OIS correction section 10, an OIS base section 20, and a suspension wire 30 as a wire component.

[0094] [Regarding OIS Correction Section 10]

[0095] The OIS correction unit 10 includes an OIS magnet section, which constitutes an OIS voice coil motor as an example of an OIS drive unit, and is the part that oscillates within the plane orthogonal to the optical axis during jitter correction. The OIS base unit 20 is the part that includes an OIS coil section. That is, the OIS drive unit of the optical element drive device 1 adopts a moving magnet type. The OIS correction unit 10 is also an "AF unit" that includes an AF drive unit.

[0096] The OIS correction unit 10 is disposed separately from the OIS base unit 20 on the OIS base unit 20 in the Z direction + side (light-receiving side or upper side in the optical axis direction) and is connected to the OIS base unit 20 by the suspension wire 30.

[0097] The OIS correction unit 10 includes an AF focusing unit 11, an AF holding unit 12, and an AF leaf spring support unit 13 (upper leaf spring component 13a and lower leaf spring component 13b).

[0098] [Regarding the AF focusing section 11]

[0099] The AF focusing section 11 is arranged radially inward relative to the AF holding section 12 and is connected to the AF holding section 12 via the upper leaf spring member 13a and the lower leaf spring member 13b.

[0100] The AF focusing unit 11 has a coil portion that constitutes an AF voice coil motor as an example of an AF drive unit, and is a portion that moves relative to the AF holding unit 12 in the Z direction (optical axis direction) during focusing. The AF holding unit 12 is a portion that has a magnet portion that constitutes an AF voice coil motor. That is, the AF drive unit of the optical element drive device 1 is a moving coil type.

[0101] The AF focusing unit 11 has a lens support 110 as a movable part and an AF coil part 111.

[0102] The lens holder 110 is capable of holding the lens portion 2, which is an optical element. The lens holder 110 has a cylindrical lens holding portion 110a. The lens portion 2 is fixed to the inner peripheral surface of the opening (lens storage opening) 110a1 of the lens holding portion 110a, for example, by adhesive bonding. In addition, the method of fixing the lens portion 2 to the lens holder 110 is not limited to adhesive bonding, and other methods may also be used.

[0103] The lens holder 110 is formed, for example, from a molding material composed of polyarylate (PAR) or a PAR alloy (e.g., PAR / PC) that incorporates various resin materials containing PAR. This results in higher weld strength than conventional molding materials, such as liquid crystal polymers (LCP), thus ensuring toughness and impact resistance even when the lens holder 110 is made thin-walled. Therefore, the overall size of the optical element drive device 1 can be reduced, achieving miniaturization and weight reduction.

[0104] The lens holder 110 has an upper flange and a lower flange (not shown) that protrude radially outward from the upper and lower parts of the outer peripheral surface of the lens holding portion 110a, respectively, and a groove that runs continuously throughout the entire circumference is formed between the upper flange and the lower flange on the outer peripheral surface. That is, the lens holder 110 has a spool structure. An AF coil portion 111 is disposed in the groove on the outer peripheral surface of the lens holder 110.

[0105] The AF coil section 111 is a coil that is energized during focusing. The two ends of the AF coil section 111 are wound around a winding section (not shown) provided on the lens holder 110.

[0106] [Regarding AF holding part 12]

[0107] The AF holding part 12 supports the AF focusing part 11 in a movable manner along the optical axis via the AF leaf spring support part 13. The AF holding part 12 has a magnet bracket 12a as a storage part and a magnet part 125.

[0108] The magnet holder 12a is a square, four-cornered cylindrical shape when viewed from the Z-direction. The magnet holder 12a surrounds the outer periphery of the lens holder 110 and houses the lens holder 110. The magnet holder 12a has magnet mounting portions on its inner circumferential surface corresponding to the four corners, where magnet portions 125 are mounted. The lens holder housing opening for housing the AF focusing unit 11 is formed by the magnet holder 12a and the hollow portion inside the magnet mounting portion 125.

[0109] Corresponding to the four corners of the outer peripheral surface of the magnet support 12a, grooves are formed that are recessed radially inward. Suspension wires 30 are disposed in each groove. Damping material (e.g., silicone gel) can be disposed in these grooves. By disposing of the damping material, the generation of unwanted resonances (higher-order resonance modes) can be suppressed, thereby stabilizing the operation of the OIS.

[0110] In the magnet bracket 12a, a lower leaf spring component 13b is fixed on the end face (back side) in the Z direction - side, and an upper leaf spring component 13a is fixed on the face (surface) in the Z direction + side.

[0111] Here, the magnet holder 12a, like the lens holder 110, is formed of a molding material composed of polyarylate (PAR) or a PAR alloy (e.g., PAR / PC) mixed with various resin materials containing PAR. This improves welding strength, ensuring toughness and impact resistance even when the magnet holder 12a is made thin-walled. Therefore, the overall size of the optical element drive device 1 can be reduced, achieving miniaturization and a lower height.

[0112] The magnet part 125 has four rectangular columnar permanent magnets (an example of a magnet). The magnet part 125 is fixed to the magnet mounting part, for example, by adhesive. Here, the magnet part 125 has a generally isosceles trapezoidal shape when viewed from above.

[0113] Therefore, the space at each of the four corners of the magnet support 12a (specifically, the magnet placement area) can be effectively utilized. The magnet section 125 is magnetized in such a way that it forms a magnetic field that traverses the AF coil section 111 radially and the OIS coil section 22 along the optical axis. Here, the inner circumference of the magnet section 125 is magnetized as the N pole, and the outer circumference is magnetized as the S pole.

[0114] The Z-direction-side end face (back face) of the magnet portion 125 protrudes further in the Z-direction-side than the magnet support 12a. That is, the height of the OIS correction portion 10 is defined by the magnet portion 125. As a result, the height of the OIS correction portion 10 can be minimized according to the size of the magnet portion 125 used to ensure magnetic force, thereby achieving a low-height optical element drive device 1.

[0115] The magnet part 125 and the AF coil part 111, as described above, constitute an AF voice coil motor (AF drive part). In addition, the magnet part 125 also serves as an AF magnet part and an OIS magnet part.

[0116] [Regarding AF leaf spring support part 13]

[0117] The AF leaf spring support 13 elastically supports the AF focusing unit 11 relative to the AF holding unit 12. The AF leaf spring support 13 has an upper leaf spring member 13a and a lower leaf spring member 13b. Here, the leaf springs constituting the upper leaf spring member 13a and the lower leaf spring member 13b are made of, for example, beryllium copper, nickel copper, or stainless steel.

[0118] The upper leaf spring member 13a is mounted on the magnet bracket 12a and supports the lens bracket 110 from the upper opening side. The upper leaf spring member 13a is fixed to the Z-direction + side surface of the magnet bracket 12a on the outer side and to the Z-direction + side surface of the lens bracket 110 on the inner side. In the upper leaf spring member 13a, the arm shape extending from the middle portion of the outer and inner sides can elastically deform, thereby allowing the inner portion of the upper leaf spring member 13a to be relatively displaced in the Z-direction relative to the outer portion of the upper leaf spring member 13a.

[0119] The upper leaf spring component 13a is separated into a power supply path portion connected to a suspension wire 30 used as a power supply path to the AF control unit (not shown), and a signal path portion connected to a suspension wire 30 used as a signal path to transmit control signals to the AF control unit (not shown). The upper leaf spring component 13a constituting the power supply path portion is connected to the AF coil portion 111 by solder at the winding portion provided on the magnet bracket 12a. Furthermore, in this embodiment, the upper leaf spring component 13a is separated into two parts to form a half-body, but it can also be further separated.

[0120] The lower leaf spring member 13b is fixed to the Z-direction side (back side) of the magnet bracket 12a on the outer side and to the Z-direction side (back side) of the lens bracket 110 on the inner side. In the lower leaf spring member 13b, the arm shape extending to the middle portion of the outer and inner sides can elastically deform, thereby allowing the inner portion of the lower leaf spring member 13b to be relatively displaced in the Z-direction relative to the outer portion of the lower leaf spring member 13b.

[0121] [Regarding OIS Basics Department 20]

[0122] The OIS base unit 20 supports the OIS correction unit 10 by means of a suspension wire 30 that can swing in the orthogonal direction of the optical axis. The OIS base unit 20 includes an OIS coil unit 22, a magnetic sensor unit 23, a protective member 24, a base member 25 as a fixing member, and a wiring member 27.

[0123] [Regarding OIS coil section 22]

[0124] The OIS base unit 20 has an OIS coil unit 22 at each of the four corners opposite the magnet unit 125 in the Z direction (optical axis direction). The OIS coil unit 22 is a coil that is energized during jitter correction. Four OIS coil units 22 are provided corresponding to the magnet unit 125. Here, the four OIS coil units 22 are air-core coils.

[0125] The size and arrangement of the OIS coil section 22 and the magnet section 125 are set so that the magnetic field radiating from the bottom surface of the magnet section 125 passes through the long side portion of each of the OIS coil sections 22 in the Z direction. The combination of the magnet section 125 and the OIS coil section 22 constitutes an OIS voice coil motor (OIS drive section).

[0126] The ends of the leads, which are respectively provided at both ends of each OIS coil section 22, are connected to the coil terminal elements 27a1 (an example of a coil terminal) of the wiring component 27 provided on the base component 25 by solder. That is, each OIS coil section 22 is directly connected to the coil terminal element 27a1 without going through the substrate. The base component 25 is provided with coil recesses (an example of a second recess) 252 for arranging each OIS coil section 22, and each OIS coil section 22 is respectively arranged in the coil recesses 252 at the four corners. Details regarding the arrangement of each OIS coil section 22 to the base component 25 will be described later.

[0127] [Regarding the magnetic sensor section 23]

[0128] The OIS base unit 20 has a magnetic sensor unit 23 in the central cavity of the corresponding OIS coil unit 22 at the first and fourth corners. The magnetic sensor unit 23 detects the position of the OIS correction unit 10 in the optical axis orthogonal plane, which is determined by detecting the magnetic field formed by the magnet unit 125 through the Hall element. This determination is based on the relative position of the magnet unit 125 and the Hall element in the optical axis orthogonal plane. The magnetic sensor unit 23 has a Hall element chip assembly. The Hall element chip assembly has a Hall element (an example of a magnetic sensor) and a magnetic sensor substrate on which the chip of the Hall element is mounted. The magnetic sensor substrate is, for example, a printed wiring board (PWB).

[0129] A Hall element is disposed in the center of the main surface of the magnetic sensor substrate, and a substrate-side terminal portion is disposed around its periphery. The substrate-side terminal portion is connected to a substrate terminal element 27b1 (an example of a substrate terminal) disposed on the wiring component 27 of the base component 25 via solder. That is, each Hall element is connected to the substrate terminal element 27b1 via the magnetic sensor substrate. A substrate recess (an example of a first recess) is provided in the base component 25 for arranging each Hall element chip assembly. Each Hall element chip assembly is disposed in one of the four corner substrate recesses.

[0130] [Regarding base component 25]

[0131] The base component 25 is a square component viewed from above, having a central opening 250 through which an optical path or optical axis passes. The base component 25 supports both the lens holder 110 and the magnet holder 12a from the opening side below. The base component 25 is made of a non-conductive material such as synthetic resin, for example, liquid crystal polymer (LCP). A wiring component 27 is embedded in the base component 25. The wiring component 27 is an example of an electrical component provided in the base component 25.

[0132] The wiring component 27 is a metal plate-shaped component embedded in the base component 25. The wiring component 27 is made of conductive materials such as beryllium copper, nickel copper, or stainless steel.

[0133] Wiring component 27 includes a coil terminal component, a substrate terminal component, and a wire terminal component.

[0134] The coil terminal component includes a coil terminal element 27a1 and a coil terminal connection portion 27a2. The coil terminal element 27a1 protrudes upward from the bottom of the coil recess 252 provided on the base component 25. The coil terminal element 27a1 is directly connected to the lead of the OIS coil portion 22 disposed in the coil recess 252 by solder. The coil terminal connection portion 27a2 protrudes from the outer edge of the base component 25 and can be connected to an external image sensor substrate 501. In the coil terminal component, the portion other than the part protruding from or exposed on the base component 25 is embedded inside the base component 25.

[0135] The substrate terminal component includes a substrate terminal element 27b1 and a substrate terminal connection portion 27b2. The substrate terminal element 27b1 protrudes upward from the bottom of the substrate recess provided in the base component 25. The substrate terminal element 27b2 is directly connected to the substrate-side terminal portion of the Hall element chip assembly disposed in the magnetic sensor portion 23 of the substrate recess via solder. The substrate terminal connection portion 27b2 protrudes from the outer edge of the base component 25 and can be connected to an external image sensor substrate 501. In the substrate terminal component, the portion other than the portion protruding from or exposed in the base component 25 is embedded inside the base component 25.

[0136] The wire terminal component includes wire terminal elements 27c1 and wire terminal connectors 27c2. The wire terminal elements 27c1 are configured to protrude downwards from the bottom 254a of the wire wiring connection recesses 254 located at the four corners of the base component 25, and are directly connected by solder to the lower end of the suspension wire 30 inserted into its own through-hole. The wire terminal connectors 27c2 protrude from the outer edge of the base component 25 and can be connected to an external image sensor substrate 501. In the wire terminal component, the portion other than the portion protruding from the base component 25 is embedded inside the base component 25. Furthermore, in the wire terminal component, the portion protruding from the base component 25 is exposed to the outside during the assembly of the optical element drive device 1, but is preferably covered by a resin-based sealing material 28 or the like upon completion.

[0137] [Regarding protective component 24]

[0138] The protective member 24 is configured to cover the area surrounding the central opening 250 in the base member 25. The protective member 24 is a thin plate or film member made of a non-conductive material such as resin. The protective member 24 completely covers the area where the OIS coil section 22 is positioned; therefore, the protective member 24 is positioned between the OIS coil section 22 and the magnet section 125 in the Z direction. This prevents the OIS coil section 22 and the magnet section 125 from colliding with each other due to external impacts. Furthermore, it also prevents a short circuit from occurring when the lower leaf spring member 13b, which is also made of metal, comes into contact with the metal OIS coil section 22.

[0139] [Regarding suspension line 30]

[0140] The suspension wire 30 is an elastic rod-shaped component extending along the Z direction. Two suspension wires 30 are arranged in groups corresponding to the four corner portions of the magnet support 12a. Alternatively, three or more suspension wires 30 may be arranged in groups corresponding to the four corner portions of the magnet support 12a. In each suspension wire 30, one end (lower end) is fixed to the OIS base 20, and the other end (upper end) is fixed to the OIS correction part 10 (specifically, the upper leaf spring component 13a). The OIS correction part 10 is supported by the suspension wires 30 so that it can swing within the plane orthogonal to the optical axis.

[0141] Suspension wires 30 extend between the base member 25 and the upper leaf spring member 13a, supporting the magnet bracket 12a. Groups of suspension wires 30, each located at one of the four corners of the magnet bracket 12a, are connected to the same upper leaf spring member 13a. These groups of suspension wires 30, located at the four corners of the magnet bracket 12a, are arranged at equal distances from the optical axis of the lens section 2.

[0142] Here, a pair of suspension wires 30 are arranged corresponding to each of the four corners. In this arrangement, compared to arranging one wire at each of the four corners, even with a lower spring constant for each wire (in other words, even with higher flexibility), the same weight of the OIS correction unit 10 can be supported. Thus, both stable support performance and sway performance during vibration correction can be achieved. Furthermore, stress is less likely to concentrate on each suspension wire 30, thereby improving durability.

[0143] The suspension wires 30, which are arranged corresponding to the four corners, are used, either entirely or selectively, as power supply paths to the AF coil section 111. Furthermore, the number of suspension wires 30 is not limited to eight; more than eight may be used as long as the ability to swing and support the OIS correction section 10 is maintained.

[0144] [Regarding the wire wiring connection recess 254 of the base component 25]

[0145] Recesses 254 for wire wiring connections are formed at the four corners of the bottom surface of the base component 25. The recesses 254 are recessed in the Z direction from the - side to the + side, and steps are formed vertically by the bottom 254a of the recesses 254 and the bottom surface of the base component 25. On the bottom 254a of the recesses 254, the wire wiring connection portion 40, which connects the wire terminal element 27c1 of the wiring component 27 to the lower end of each suspension wire 30, protrudes downwards.

[0146] When assembling the optical element drive device 1, the space of the wire wiring connection recess 254 becomes the working space for connecting (soldering) the lower end of the suspension wire 30 to the wire terminal element 27c1 of the wiring component 27. Therefore, if this working space is significantly narrow, the connection operation between the suspension wire 30 and the wiring component 27 becomes difficult. In addition, the sidewall 254b of the wire wiring connection recess 254 is located close to the wire wiring connection portion 40, making it susceptible to the heat applied to the wire wiring connection portion 40 during the connection operation. On the other hand, if this working space is significantly enlarged, it becomes difficult to form a structure that maintains the miniaturization of the optical element drive device 1 and positions the wiring component 27 relative to the base component 25.

[0147] Therefore, in this embodiment, the sidewall 254b of the wire wiring connection recess 254 surrounding the work space is formed into a wave shape.

[0148] Specifically, the sidewall 254b has the following shape: in the direction of wire arrangement in the corner, it has an alternating recess 254b1 that is concave in an arc shape in a manner that bypasses the suspension wire 30, and a protrusion 254b2 that protrudes toward the gap between adjacent suspension wires 30 in the direction of wire arrangement in the corner.

[0149] With this shape, the sidewall 254b is separated from each suspension wire to a certain extent, so the sidewall 254b is not easily affected by the heat transferred to the surrounding area of ​​each suspension wire 30 when the suspension wire 30 is connected to the wiring component 27. Therefore, undesirable deformation will not occur in the sidewall 254b. Moreover, the portion between adjacent suspension wires 30 protrudes towards the gap, and is not simply a shape that increases the exposed area of ​​the wiring component 27, so there is no need to worry about significantly increasing the planar area of ​​the base component 25. Therefore, it is possible to achieve miniaturization and mass production of the optical element drive device 1, the camera module A equipped with the optical element drive device 1, and the camera mounting device.

[0150] Alternatively, this shape can be used to prevent the recessed portion 254b1 from overlapping with the wire terminal element 27c1 of the wiring component 27 in the Z direction, while allowing the protrusion 254b2 to overlap with the wire terminal element 27c1 of the wiring component 27 in the Z direction. In this case, the recessed portion 254b1 is less susceptible to the heat transferred to the wire terminal element 27c1 when the suspension wire 30 is connected to the wiring component 27. That is, the impact of heat on the sidewall 254b can be further reduced.

[0151] In this case, the protrusion 254b2 further overlaps with the wire terminal element 27c1, thereby pressing the wiring component 27 against the bottom 254a of the wire wiring connection recess 254. Therefore, the sidewall 254b can function as a positioning element for the wiring component 27 in the Z direction.

[0152] As explained above, in this embodiment, the optical element driving device 1 is configured such that a lens holder 110 for holding the lens section 2 and a magnet holder 12a for housing the lens holder 110 are supported above the base member 25 by an AF leaf spring support 13 and a suspension wire 30, and the lens holder 110 and the magnet holder 12a are moved by the driving of the OIS correction unit 10 and the AF focusing unit 11. In this structure, the suspension wire 30 has at least one set of multiple suspension wires 30, which are arranged to connect the base member 25 and the magnet holder 12a respectively, and are respectively connected to the wiring member 27 of the base member 25. The base component 25 has a wire wiring connection recess 254 that is recessed in the vertical direction (Z direction) and exposes the connection portion (wire wiring connection portion 40) between the wiring component 27 and each suspension wire 30 on its bottom 254a. The side wall 254b of the wire wiring connection recess 254 has a first part (recess 254b1) located in the arrangement direction of the plurality of suspension wires 30 corresponding to each suspension wire 30 and a second part (protrusion 254b2) located between adjacent first parts (recesses 254b1). It has a shape in which the first part (recess 254b1) is recessed in a manner that bypasses the corresponding suspension wire 30, and the second part (protrusion 254b2) protrudes toward the gap between adjacent suspension wires 30.

[0153] Based on this structure, as described above, it is possible to achieve miniaturization and mass production of the optical element drive device 1, the camera module A equipped with the optical element drive device 1, and the camera mounting device.

[0154] In addition, in this embodiment, the sidewall 254b does not overlap with the wiring component 27 in the vertical direction (Z direction) in the first part (recess 254b1), and overlaps with the wiring component 27 in the vertical direction (Z direction) in the second part (protrusion 254b2).

[0155] According to this structure, as described above, the sidewall 254b can function as the Z-direction positioning of the wiring component 27, thereby further improving the miniaturization and mass production of the optical element drive device 1, the camera module A equipped with the optical element drive device 1, and the camera mounting device.

[0156] The embodiments of the present invention have been described above. These embodiments are merely examples illustrating specific implementations of the present invention, and the scope of the invention should not be limited by these embodiments. That is, the present invention can be implemented in various forms without departing from its essential characteristics.

Claims

1. An optical element driving device that supports a movable section capable of holding an optical element and a housing section that houses the movable section, above a fixed section, and moves the movable section and the housing section by driving of a driving section, the optical element driving device being characterized in that the support section has at least one set of a plurality of wire members that are arranged in parallel with each other, and that the fixed section and the housing section are connected respectively, and are connected to an electrical member of the fixed section respectively.

2. The optical element driving device according to claim 1, characterized in that a side wall of the recess has a first section at a position corresponding to each wire member in an arrangement direction of the plurality of wire members, and a second section at a position between adjacent first sections, and has a shape that is recessed in a manner that passes around the corresponding wire member at the first section, and protrudes toward a gap between adjacent wire members at the second section.

3. A camera module comprising: the optical element driving device according to claim 1; the optical element; and a camera section that photographs an object image imaged by the optical element.

4. An image processing section that processes image information obtained by the camera module according to claim 3. ​ ​ 3. A camera module characterized by comprising: ​ ​ ​ ​ 4. A camera-mounted device that is an information device or a transport device, characterized by comprising: ​ ​ ​

Images