A tape removal apparatus, system, and method for use in a pcb production line

Abstract

The present application relates to the technical field of adhesive tape removal, and in particular to an adhesive tape removal device, system and method for a PCB production line. The adhesive tape removal device for the PCB production line comprises adhesive tape removal devices and a carrying transfer mechanism, the carrying transfer mechanism is located between two symmetrically arranged adhesive tape removal devices, the adhesive tape removal device comprises a positioning and clamping module and an adhesive tape removal module, and the carrying transfer mechanism is used for carrying and transferring products; the positioning and clamping module is used for positioning and clamping the products on the carrying transfer mechanism, preventing the products from moving out of position during the removal of the adhesive tape, and ensuring the effect of removing the adhesive tape; the adhesive tape removal module can remove the adhesive tape on the products, ensure the cleanliness of the product surface, reduce the influence of adhesive tape residues on the products, and automatically remove the adhesive tape with high efficiency, thereby improving the production capacity.

Description

Technical Field

[0001] This invention relates to the field of tape removal technology, and more particularly to a tape removal device, system and method for use in PCB production lines. Background Technology

[0002] Copper-clad laminate, also known as copper clad laminate, is a sheet material made by impregnating electronic fiberglass cloth or synthetic fiber cloth with resin and covering one or both sides with copper foil, then hot-pressing it. Copper-clad laminates are divided into rigid and flexible types. They are a primary material in printed circuit board (PCB) manufacturing, playing a crucial role in interconnection, insulation, and support within the PCB. They significantly influence signal transmission speed, energy loss, and characteristic impedance. PCB manufacturers typically purchase copper-clad laminates and then process them to create PCBs for specific applications.

[0003] Currently, most copper-clad laminate (CCL) materials purchased directly are multilayer CCLs secured with adhesive tape. During the circuit board manufacturing process, the tape needs to be manually removed and the laminates disassembled. However, existing tape removal methods have the following drawbacks: 1) Manual tape removal is inefficient and has low production capacity; 2) There is a risk of tearing the tape during manual removal, leaving tape residue on some CCLs, which may contaminate the CCLs and affect their reuse; 3) Tape residue can also affect subsequent drilling processes, impacting drilling accuracy and ultimately the quality of the finished circuit board.

[0004] Therefore, there is an urgent need for a tape removal device for PCB production lines to solve the above problems. Summary of the Invention

[0005] The first objective of this invention is to provide a tape removal device for PCB production lines that can automatically remove tape thoroughly and without residue, reducing the impact of tape residue on products, and has high tape removal efficiency, thereby increasing production capacity.

[0006] The second objective of this invention is to provide a tape removal system, including the tape removal equipment described above for use in PCB production lines, which can achieve automatic feeding and tape removal with high operating efficiency.

[0007] The third objective of this invention is to provide a tape removal method that can employ the tape removal equipment described above for use in PCB production lines, achieving automatic tape removal that is thorough and leaves no residue, reducing the impact of tape residue on the product, and with high tape removal efficiency.

[0008] To achieve the above objectives, the following technical solution is provided:

[0009] In a first aspect, a tape removal device for a PCB production line is provided, comprising a tape removal unit and a carrying and transferring mechanism, wherein the carrying and transferring mechanism is located between two tape removal units symmetrically arranged along a first direction, and is used to receive and transfer products; the tape removal unit includes:

[0010] A positioning and clamping module is used to position and clamp the product on the carrying and transferring mechanism;

[0011] A tape removal module for removing tape from the product.

[0012] As an optional solution for the tape removal equipment in the PCB production line, the positioning and clamping module includes a positioning and clamping mechanism and a first translation mechanism. The positioning and clamping mechanism is used to position and clamp the product. The first translation mechanism includes a first translation drive component and a first mounting frame. The first translation drive component can drive the first mounting frame to move along a first direction. The positioning and clamping mechanism is mounted on the first mounting frame.

[0013] As an optional solution for the tape removal equipment in the PCB production line, the tape removal module includes a tape removal mechanism and a second translation mechanism. The tape removal mechanism is used to remove tape from the product. The second translation mechanism includes a second translation drive assembly and a second mounting frame. The second translation drive assembly is mounted on the first mounting frame and can drive the second mounting frame to move along a second direction. The tape removal mechanism is mounted on the second mounting frame, and the second direction is perpendicular to the first direction.

[0014] As an alternative to the tape removal equipment for the PCB production line, the tape removal mechanism further includes a fixing frame, the fixing frame comprising:

[0015] The first fastener is installed on the second mounting bracket.

[0016] The second fixing member includes multiple baffles, at least one of the baffles is fixed to the first fixing member, and the multiple baffles are sequentially fixedly connected and arranged to form a wall-like structure. The tape removal component is installed on the wall-like structure.

[0017] As an optional solution for the tape removal equipment in the PCB production line, the tape removal assembly includes a tape removal drive and a first brush. The tape removal drive is mounted on the second fixing member and is used to drive the first brush to rotate. The rotation axis of the first brush is perpendicular to the extension direction of the enclosure structure. The first brush is at least partially located within the enclosure structure, and the bristles of the first brush abut against the lower surface of the product.

[0018] As an alternative to the tape removal equipment for the PCB production line, the tape removal assembly further includes a second brush disposed on a first of the plurality of side guards, the bristles of the second brush being disposed opposite to the side of the product, and the bristles of the second brush being at least partially higher than the upper surface of the product.

[0019] As an optional solution for the tape removal equipment in the PCB production line, the tape removal assembly further includes a third brush, which is disposed on the second of the plurality of the retaining edges. The second retaining edge is perpendicular to the first retaining edge, and the bristles of the third brush abut against the lower surface of the product.

[0020] As an alternative to the tape removal equipment for the PCB production line, the tape removal mechanism further includes a tape collection assembly, which includes a collection box detachably installed within the enclosure structure and located below the brush of the tape removal assembly.

[0021] As an alternative to the tape removal equipment for the PCB production line, the tape collection assembly further includes a suction drive component, which is fixed to the first fixing member and communicates with the enclosure structure.

[0022] As an optional solution for the tape removal equipment in the PCB production line, the positioning and clamping mechanism includes two clamping components, which are symmetrically arranged on the first mounting bracket for clamping the product; at least one of the clamping components includes:

[0023] The clamping drive is mounted on the first mounting bracket;

[0024] A clamping member is movably mounted on the first mounting bracket, and the clamping drive member is used to drive the clamping member to reciprocate along the arrangement direction of the two clamping assemblies.

[0025] As an alternative to the tape removal device used in the PCB production line, the first mounting bracket includes:

[0026] The first mounting component is connected to the output end of the first translation drive component;

[0027] The second mounting component and the third mounting component are fixed to the first mounting component in parallel and spaced apart. One clamping drive component of the two clamping assemblies is provided on the second mounting component and the other is provided on the third mounting component.

[0028] A guide member is fixed between the second mounting member and the third mounting member, the guide member extending along the moving direction of the clamping member, and at least one clamping member of the clamping assembly is slidably sleeved on the guide member.

[0029] As an optional solution for the tape removal equipment in the PCB production line, the positioning and clamping mechanism further includes a positioning component, which includes a positioning drive and a positioning member. The positioning drive is mounted on the clamping member and is used to drive the positioning member to move along the moving direction of the clamping member. The positioning member can abut against the side of the product.

[0030] As an alternative to the tape removal equipment for the PCB production line, in one of the tape removal devices, two first translation mechanisms are arranged parallel and spaced apart along a second direction, and the positioning and clamping mechanism is mounted on a first mounting frame of the two first translation mechanisms; the second translation mechanism is mounted on the first mounting frame of the two first translation mechanisms.

[0031] In a second aspect, a tape removal system is provided, including a frame, a control system, and a tape removal device for a PCB production line as described above, wherein the control system and the tape removal device for the PCB production line are disposed on the frame.

[0032] As an optional solution to the tape removal system, the control system controls the tape removal equipment for the PCB production line to start working, and the carrying and transferring mechanism starts working to receive the product and transport the product to the tape removal equipment station for the PCB production line;

[0033] The control system sends instructions and controls the positioning and clamping mechanism to position and clamp the product based on the product signal fed back by the carrying and transferring mechanism.

[0034] The control system starts controlling the tape removal mechanism to start working based on the signal of completed positioning and clamping fed back by the positioning and clamping mechanism. The tape removal mechanism moves along the second direction and removes the tape on the product.

[0035] The control system controls the positioning and clamping mechanism to reset based on the tape removal completion signal fed back by the tape removal mechanism; the control system also controls the carrying and transferring mechanism to transport the product to the next workstation.

[0036] As an optional solution to the tape removal system, the number of tape removal devices for the PCB production line is two, and the two tape removal devices for the PCB production line are arranged along the product conveying direction;

[0037] One of the load transfer mechanisms in a tape removal device used in a PCB production line includes a load drive assembly and a load member. The load drive assembly is mounted on the frame and is capable of driving the load member to rotate 90° in a horizontal plane and move along a second direction.

[0038] Another load-bearing and transfer mechanism used in tape removal equipment in PCB production lines is a belt conveyor mechanism, in which the belt is used to carry the product and can drive the product to move along the product conveying direction.

[0039] Thirdly, a tape removal method is provided, based on the tape removal equipment for PCB production lines as described above, comprising the following steps:

[0040] Utilize a load-bearing transfer mechanism to receive products;

[0041] The product on the load-bearing transfer mechanism is positioned and clamped by the first translation mechanism in conjunction with the positioning and clamping mechanism.

[0042] The tape on the product is removed by using the second translation mechanism in conjunction with the tape removal mechanism.

[0043] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0044] The present invention provides a tape removal device for a PCB production line, comprising a tape removal unit and a carrying and transferring mechanism. The carrying and transferring mechanism is located between two symmetrically arranged tape removal units. The tape removal unit includes a positioning and clamping module and a tape removal module. The carrying and transferring mechanism is used to receive and transfer products. The positioning and clamping module is used to position and clamp the products on the carrying and transferring mechanism to prevent the products from moving or misaligning during the tape removal process, thus ensuring the effectiveness of tape removal. The tape removal module is used to remove the tape from the tape, ensuring the cleanliness of the product surface, reducing the impact of tape residue on the product, and the automated operation has high tape removal efficiency, which can improve production capacity.

[0045] The tape removal system provided by the present invention includes the tape removal equipment used in the PCB production line, which can realize automatic feeding and tape removal with high operating efficiency.

[0046] The tape removal method provided by this invention can be implemented using the tape removal equipment described above for PCB production lines, achieving automated tape removal that is thorough and leaves no residue, reducing the impact of tape residue on the product, and is highly efficient. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0048] Figure 1 This is a partial structural diagram of the product provided in an embodiment of the present invention;

[0049] Figure 2 This is a schematic diagram of the tape removal system provided in an embodiment of the present invention;

[0050] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0051] Figure 4 for Figure 2 Enlarged view of point B in the middle;

[0052] Figure 5 This is a schematic diagram of the tape removal device in the tape removal equipment for a PCB production line provided in an embodiment of the present invention;

[0053] Figure 6 This is a schematic diagram of the clamping assembly in the positioning and clamping mechanism provided in an embodiment of the present invention;

[0054] Figure 7 This is a schematic diagram of the positioning component in the positioning and clamping mechanism provided in an embodiment of the present invention;

[0055] Figure 8 This is a schematic diagram of the tape removal mechanism provided in one direction according to an embodiment of the present invention;

[0056] Figure 9 This is a schematic diagram of the tape removal mechanism provided in another embodiment of the present invention.

[0057] Figure label:

[0058] 100. Product; 101. Tape;

[0059] 200. Frame; 300. First tape removal device for PCB production line; 400. Second tape removal device for PCB production line; 500. Control system;

[0060] 10. Tape removal device; 20. First load-bearing transfer mechanism; 201. Load-bearing drive assembly; 202. Load-bearing component; 30. Second load-bearing transfer mechanism;

[0061] 1. Positioning and clamping mechanism; 11. Clamping assembly; 111. Clamping drive component; 112. Clamping component; 12. Positioning assembly; 121. Positioning drive component; 122. Positioning component;

[0062] 2. Tape removal mechanism; 21. Hot melt assembly; 22. Tape removal assembly; 221. Tape removal drive component; 222. First brush; 223. Second brush; 224. Third brush; 23. Adhesive residue collection assembly; 231. Collection box; 232. Suction drive component; 24. Fixing frame; 241. First fixing component; 242. Second fixing component; 2421. First baffle; 2422. Second baffle; 2423. Third baffle; 2424. Fourth baffle; 2425. Support;

[0063] 3. First translation mechanism; 31. First translation drive assembly; 32. First mounting bracket; 321. First mounting component; 322. Second mounting component; 323. Third mounting component; 324. Guide component;

[0064] 4. Second translation mechanism; 41. Second translation drive assembly; 42. Second mounting bracket. Detailed Implementation

[0065] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0066] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0067] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0068] In the description of this invention, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used merely for distinction in description and have no special meaning.

[0069] Figure 1 A partial structural schematic diagram of the product 100 provided by the present invention is shown. For example... Figure 1 As shown, product 100 consists of multiple plate-like structures fixed with tape. Of course, product 100 can also be a single plate-like structure with tape applied. Currently, the tape 101 on product 100 mostly needs to be manually removed and the product disassembled. Manually removing the tape 101 is inefficient, and there is a risk of tearing the tape 101 during the process. Residual tape 101 affects the surface quality of product 100 and subsequent processing steps.

[0070] This invention provides a tape removal system that can automatically remove tape 101 from product 100, improve work efficiency, thoroughly remove tape 101 from product 100, and reduce the impact of tape 101 residue on the surface quality of product 100 and subsequent processing steps of product 100.

[0071] Optionally, the tape removal system is suitable for removing tape 101 from a plate-shaped product 100. Product 100 may be a plate-shaped structure such as a copper-clad laminate.

[0072] Figure 2 A schematic diagram of the tape removal system provided by the present invention is shown. Figure 2 As shown, the tape removal system includes a frame 200, a first tape removal device 300 for a PCB production line, and a second tape removal device 400 for a PCB production line. The first tape removal device 300 and the second tape removal device 400 are mounted on the frame 200 along the product 100 conveying direction. The product 100 conveying direction is... Figure 2 The second direction in the process. Both the first tape removal device 300 and the second tape removal device 400 used in the PCB production line can be fixed to the frame 200 with screws.

[0073] Both the first tape removal device 300 and the second tape removal device 400 used in the PCB production line are for removing tape 101 from product 100. The purpose of having two tape removal devices in the PCB production line is to improve the tape 101 removal efficiency, for example... Figure 2 In this invention, a first tape removal device 300 for the PCB production line removes tape from the short side of product 100, and a second tape removal device 400 for the PCB production line removes tape from the long side of product 100. The two devices can operate simultaneously to improve efficiency. In other embodiments, the tape removal system provided by this invention may also include only one tape removal device for the PCB production line, with the tape on the long and short sides of product 100 removed separately in two operations. Of course, the tape removal devices in the tape removal system provided by this invention are not limited to one or two devices as described in the above examples; they can also include any number of devices, such as 3 to 20. The arrangement of the tape removal devices is not limited to the conveying direction of product 100; for example, they can be arranged in a rectangular array, a polygonal array, etc., which will not be illustrated here.

[0074] In one embodiment, such as Figure 2 As shown, the tape removal system also includes a control system 500, which is mounted on the frame 200. The control system 500 controls the operation of the first tape removal device 300 and the second tape removal device 400 used in the PCB production line, thereby automating the tape removal operation and improving its efficiency. The control system 500 can be a readily available industrial PLC controller, which is well-known to those skilled in the art of automation and will not be described in detail here.

[0075] In one embodiment, such as Figure 2 As shown, both the first tape removal device 300 and the second tape removal device 400 used in a PCB production line include a tape removal unit 10 and a carrying and transferring mechanism. The carrying and transferring mechanism is located between two tape removal units 10 symmetrically arranged along a first direction and is used to carry and transfer the product 100. The first direction is perpendicular to the second direction.

[0076] For ease of description, the first tape removal device 300 used in the PCB production line is referred to as the first tape removal device 20, and the second tape removal device 400 used in the PCB production line is referred to as the second tape removal device 30. Figure 3 It shows Figure 2 A magnified view of point A in the middle. (See image below.) Figure 3As shown, the first carrier transfer mechanism 20 in the first tape removal device 300 for the PCB production line located at the front end of the conveying direction of product 100 includes a carrier drive assembly 201 and a carrier 202. The carrier drive assembly 201 is mounted on the frame 200 and can drive the carrier 202 to rotate 90° in the horizontal plane and move along the second direction. Figure 4 It shows Figure 2 A magnified view of point B in the middle. (See image below.) Figure 4 As shown, the second carrier transfer mechanism 30 in the second tape removal device 400 for the PCB production line, located at the rear end of the product 100 conveying direction, is a belt conveyor mechanism. The belt of the belt conveyor mechanism carries the product 100 and can drive the product 100 to move along the product 100 conveying direction. The tape removal process is as follows: 1) Place the product 100 on the carrier 202 of the carrier transfer mechanism in the first tape removal device 300 for the PCB production line; 2) Use the tape removal device 10 in the first tape removal device 300 for the PCB production line to position and clamp the product 100 and remove the tape 101 from the product 100; 3) The tape removal device 10 in the first tape removal device 300 for the PCB production line releases the product 100 onto the carrier 202; 4) The carrier drive assembly 201 drives the carrier 202. 2) Rotate product 100 by 90° and transfer product 100 onto the belt of the belt conveyor mechanism of the second tape removal device 400 in the PCB production line; 5) Position and clamp product 100 using the tape removal device 10 in the second tape removal device 400 in the PCB production line and remove tape 101 from product 100; 3) Release product 100 onto the belt of the belt conveyor mechanism using the tape removal device 10 in the second tape removal device 400 in the PCB production line, and transport it to the next station via the belt conveyor mechanism. Of course, in other embodiments, the first carrying and transferring mechanism 20 can be a belt conveyor mechanism, and the second carrying and transferring mechanism 30 can include a carrying drive assembly 201 and a carrying member 202, which can both realize transfer and transport and drive product 100 to rotate 90°.

[0077] Figure 5 A schematic diagram of the tape removal device 10 in the tape removal equipment for a PCB production line provided by the present invention is shown. Figure 5 As shown, two tape removal devices 10 are symmetrically arranged along the first direction. The two tape removal devices 10 are used to remove tape from opposite sides of the product 100, which can improve work efficiency.

[0078] Figure 5In this embodiment, both tape removal devices 10 include a positioning and clamping module and a tape removal module. The positioning and clamping module is used to position and clamp the product 100 on the carrying and transferring mechanism, and the tape removal module is used to remove the tape 101 from the product 100. The positioning and clamping module includes a positioning and clamping mechanism 1 and a first translation mechanism 3, while the tape removal module includes a tape removal mechanism 2 and a second translation mechanism 4. The positioning and clamping mechanism 1 positions and clamps the product 100 on the carrying and transferring mechanism to prevent the product 100 from moving or misaligning during tape removal, ensuring effective tape removal. The tape removal mechanism 2 removes the tape 101 from the product 100 via a heat-melting method. The first translation mechanism 3 drives the positioning and clamping mechanism 1 to move along a first direction to position and clamp the product 100. The second translation mechanism 4 drives the tape removal mechanism 2 to move along a second direction to remove the tape 101 from the product 100. The tape removal device 10 can operate automatically, remove tape thoroughly and without residue, reduce the impact of tape 101 residue on product 100, and has high tape removal efficiency, which can improve production capacity.

[0079] In one embodiment, such as Figure 5 As shown, the first translation mechanism 3 includes a first translation drive assembly 31 and a first mounting frame 32. The first translation drive assembly 31 can drive the first mounting frame 32 to move along a first direction; the positioning and clamping mechanism 1 is mounted on the first mounting frame 32. During the positioning and clamping process of the product 100, under the driving action of the corresponding first translation mechanism 3, the two tape removal devices 10 and the two positioning and clamping mechanisms 1 move towards each other along the first direction to position and clamp the two opposite sides of the product 100.

[0080] In one embodiment, such as Figure 5 As shown, the second translation mechanism 4 includes a second translation drive assembly 41 and a second mounting bracket 42 connected to the output end of the second translation drive assembly 41. The tape removal mechanism 2 is mounted on the second mounting bracket 42. The second translation drive assembly 41 can drive the second mounting bracket 42 to move along a second direction, thereby driving the tape removal mechanism 2 to move along the second direction to remove the tape 101 on the side of the product 100. The second translation drive assembly 41 is mounted on the first mounting bracket 32, so that the second translation mechanism 4 can move along the first mounting bracket 32 ​​along the first direction without the need for a separate translation module, reducing equipment costs and shrinking the structural size of the tape removal device 10. Of course, in other embodiments, the second translation mechanism 4 can also be additionally configured with a translation module to drive the second mounting bracket 42 to move along the first direction, so that the tape removal mechanism 2 on the second mounting bracket 42 can move to the position of the product 100, facilitating the removal of the tape 101 on the product 100.

[0081] In one embodiment, the second translation mechanism 4 is screwed onto the first mounting bracket 31. The tape removal mechanism 2 is screwed onto the second mounting bracket 42.

[0082] In one embodiment, such as Figure 5 As shown, two first translation mechanisms 3 are arranged parallel to each other and spaced apart along the second direction. Specifically, a single first translation mechanism 3 extends along the first direction, and two first translation mechanisms 3 are arranged parallel to each other along the second direction. The positioning and clamping mechanism 1 is mounted on the two first translation mechanisms 3. Since the second translation mechanism 4 needs to drive the tape removal mechanism 2 to move along the second direction, the space occupied by the second translation mechanism 4 in the second direction is larger than the space it occupies in the first direction. The arrangement of the two first translation mechanisms 3 can not only make full use of the space occupied by the second translation mechanism 4 in the second direction, but also better support the second translation mechanism 4. In addition, this design also allows a first translation mechanism 3 to be configured at both ends of the positioning and clamping mechanism 1 for driving, so that the positioning and clamping mechanism 1 is subjected to balanced force. The positioning and clamping mechanism 1 is more stable and smooth during the movement along the first direction, thereby better positioning and clamping the product 100 and preventing the product 100 from shaking.

[0083] In one embodiment, such as Figure 5 As shown, the positioning and clamping mechanism 1 includes a clamping component 11 and a positioning component 12. The positioning component 12 is used to center the product 100, and the clamping component 11 is used to clamp the edge of the product 100. When the product 100 is located between the two tape removal devices 10, the first translation mechanism 3 of the two tape removal devices 10 drives the positioning and clamping mechanism 1 to move along a first direction to approach the product 100 and position the product 100 using the positioning component 12, and then clamp the product 100 using the clamping component 11.

[0084] Figure 6 A partial structural schematic diagram of the clamping component 11 in the positioning and clamping mechanism 1 provided by the present invention is shown. For example... Figure 6 As shown, two clamping assemblies 11 are symmetrically arranged on the first mounting bracket 32 ​​for clamping the product 100. Each clamping assembly 11 includes a clamping drive 111 and a clamping member 112. The clamping drive 111 is mounted on the first mounting bracket 32; the clamping member 112 is movably mounted on the first mounting bracket 32. The clamping drive 111 drives the clamping member 112 to reciprocate along the arrangement direction of the two clamping assemblies 11. During the clamping of the product 100, the clamping members 112 of the two clamping assemblies 11 move closer to each other to clamp the product 100. Alternatively, in other embodiments, the clamping assemblies 11 can have one clamping member 112 fixedly arranged and the other clamping member 112 movable, thereby enabling the two clamping members 112 to cooperate in clamping the product 100.

[0085] In one embodiment, such as Figure 6 Combination Figure 5As shown, the first mounting bracket 32 ​​includes a first mounting member 321, a second mounting member 322, a third mounting member 323, and a guide member 324. The first mounting member 321 is connected to the output end of the first translation drive assembly 31. The second mounting member 322 and the third mounting member 323 are fixedly fixed to the first mounting member 321 in parallel with a spacing between them. One clamping drive member 111 of the two clamping assemblies 11 is disposed on the second mounting member 322, and the other is disposed on the third mounting member 323. The guide member 324 is fixed between the second mounting member 322 and the third mounting member 323. The guide member 324 extends along the moving direction of the clamping member 112, and the clamping members 112 of the two clamping assemblies 11 can be slidably sleeved on the guide member 324. The guide member 324 is used to ensure that the clamping member 112 can move smoothly and directionally to better clamp the product 100.

[0086] Figure 7 A partial structural schematic diagram of the positioning component 12 in the positioning and clamping mechanism 1 provided by the present invention is shown. For example... Figure 7 As shown, the positioning assembly 12 includes a positioning drive 121 and a positioning member 122. The positioning drive 121 is mounted on the clamping member 112 and is used to drive the positioning member 122 to move along the moving direction of the clamping member 112. The positioning member 122 can abut against the side of the product 100. The positioning drive 121 drives the positioning member 122 to extend in so that when the positioning clamping mechanism 1 moves in the first direction, the positioning member 122 can abut against the side of the product 100 to position the product 100.

[0087] Figure 8 A schematic diagram of the tape removal mechanism 2 provided by the present invention is shown in one direction. Figure 9 A schematic diagram of the tape removal mechanism 2 provided by the present invention is shown from another direction. For example... Figures 8-9 As shown, the tape removal mechanism 2 includes a hot melt assembly 21 and a tape removal assembly 22. The hot melt assembly 21 is used to melt the tape 101 on the product 100, shrinking the tape 101 into solid glue residue, ensuring that there is no tape 101 residue on the product 100. The tape removal assembly 22 is used to remove the tape residue, ensuring that the surface of the product 100 is clean.

[0088] In one embodiment, the tape removal component 22 is not limited to removing the tape 101 on the product 100 by hot melting. It can also remove the tape 101 by other means, such as using a plasma spray gun, an industrial hot air gun, or laser removal.

[0089] In one embodiment, such as Figures 8-9As shown, the tape removal mechanism 2 also includes a fixing frame 24, which includes a first fixing member 241 and a second fixing member 242. The first fixing member 241 is mounted on the second mounting frame 42, and the second fixing member 242 includes a retaining edge. Multiple retaining edges are fixed to the first fixing member 241 and form a wall-like structure. The tape removal assembly 22 is mounted on the wall-like structure. This design allows the tape removal assembly 22 to be mounted on the retaining edge of the second fixing member 242, and the hot melt assembly 21 to be mounted on the first fixing member 241. The two can be installed separately, improving assembly efficiency. In addition, the wall-like structure formed by the retaining edge can be used to collect tape slag, preventing tape slag from accumulating on the frame 200.

[0090] In one embodiment, such as Figure 8 As shown, there are two hot melt components 21. The energy outlet of one hot melt component 21 is set at an angle to the product 100 and faces the side of the product 100, so that the heating energy emitted by the hot melt component 21 can spread to the upper surface of the product 100, so as to better heat and melt the tape 101 on the side and upper surface of the product 100. The energy outlet of the other hot melt component 21 is set perpendicular to the product 100 and at least partially located below the product 100, so as to better heat and melt the tape 101 on the side and lower surface of the product 100.

[0091] In one embodiment, such as Figure 9 As shown, the tape removal assembly 22 includes a tape removal drive 221 and a first brush 222. The tape removal drive 221 is mounted on the second fixing member 242 and is used to drive the first brush 222 to rotate. The rotation axis of the first brush 222 is perpendicular to the extension direction of the enclosure structure. The first brush 222 is at least partially located within the enclosure structure, and the bristles of the first brush 222 abut against the lower surface of the product 100. The first brush 222 is used to remove the tape 101 from the product 100 by rotation. The rotating first brush 222 has a greater cleaning force and is less likely to scratch the product 100. Figure 9 Combination Figure 8 As shown, the second fixing member 242 also includes a bracket 2425, which is fixed to the edge away from the product 100. The tape removal drive 221 is mounted on the bracket 2425, and the output end of the tape removal drive 221 extends into the enclosure structure to drive the first brush 222 to rotate.

[0092] For ease of description, such as Figure 9As shown, the plurality of baffles includes a first baffle 2421, a second baffle 2422, a third baffle 2423, and a fourth baffle 2424. The first baffle 2421 and the third baffle 2423 are arranged in parallel and spaced apart and fixed to the first fixing member 241. The first baffle 2421 is located on the side away from the product 100. The second baffle 2422 and the fourth baffle 2424 are arranged in parallel and spaced apart and fixedly connected to the first baffle 2421 and the third baffle 2423. The output end of the tape removal drive member 221 extends through the first baffle 2421 into the interior of the enclosure structure and drives the first brush 222 to rotate.

[0093] In one embodiment, such as Figure 9 As shown, the tape removal assembly 22 also includes a second brush 223, which is disposed on the first retaining edge 2421. The bristles of the second brush 223 are disposed opposite to the side of the product 100, and the bristles of the second brush 223 are at least partially higher than the upper surface of the product 100, so that the second brush 223 can smoothly remove the adhesive residue from the side and upper surface of the product 100.

[0094] In one embodiment, such as Figure 9 As shown, the tape removal assembly 22 also includes a third brush 224, which is disposed on the second side 2422 of the plurality of side guards. The second side 2422 is perpendicular to the first side guard 2421. The bristles of the third brush 224 abut against the lower surface of the product 100 to facilitate the removal of adhesive residue from the lower surface of the product 100.

[0095] In this embodiment, as Figure 9 As shown, the tape removal assembly 22 includes a tape removal drive 221, a first brush 222, a second brush 223, and a third brush 224. The first brush 222 is rotatably disposed within a wall-like structure. The second brush 223 is fixed to a first retaining edge 2421, with its bristles facing the side of the product 100. The third brush 224 is fixed to the second retaining edge 2422, with its bristles located below the product 100. When the first fixing member 241 moves along a second direction, the first brush 222 rotates to remove adhesive residue, while the second brush 223 and the third brush 224 directly sweep away adhesive residue from the product 100. Of course, in other embodiments, the tape removal component 22 may include only the first brush 222, or only the first brush 222 and the second brush 223, or only the second brush 223 and the third brush 224, etc. Various combinations of the first brush 222, the second brush 223 and the third brush 224 will not be described one by one here.

[0096] It is worth noting that the first brush 222, the second brush 223, and the third brush 224 can be made of nylon, wire, or silicone, depending on the specific needs, and are not limited here. Of course, in other embodiments, the tape removal assembly 22 can also use an air nozzle, a spray nozzle, a cleaning wheel brush, or a vacuum cleaner for rotary suction, all of which can achieve tape removal. In other embodiments, the tape removal assembly 22 can also remove the tape using a flexible spatula, not limited to the brush structure described above.

[0097] In one embodiment, such as Figure 9 As shown, the tape removal mechanism 2 also includes a tape residue collection assembly 23, which includes a collection box 231. The collection box 231 is detachably installed within the enclosure structure and located below the brush of the tape removal assembly 22 to facilitate regular cleaning of tape residue and prevent its accumulation. For example, a notch is provided on the fourth retaining edge 2424, through which the collection box 231 can be pulled out and extended into the enclosure structure.

[0098] In one embodiment, such as Figure 9 As shown, the glue residue collection assembly 23 also includes a suction drive 232, which is fixed to the first fixing member 241 and communicates with the enclosure structure. The suction drive 232 is used to generate negative pressure within the enclosure structure to suck the glue residue swept down by the brush into the enclosure structure and store it in the collection box 231.

[0099] Based on the aforementioned tape removal equipment for PCB production lines, this invention provides a tape removal method, comprising the following steps: receiving a product 100 using a carrying and transferring mechanism; positioning and clamping the product 100 on the carrying and transferring mechanism using a first translation mechanism 3 in conjunction with a positioning and clamping mechanism 1; and removing the tape 101 from the product 100 using a second translation mechanism 4 in conjunction with a tape removal mechanism 2. Specifically, the positioning component 12 positions the product 100 with tape 101 attached to the carrying and transferring mechanism; then the clamping component 11 clamps the product 100; the hot melt component 21 is activated to melt the tape 101 on the product 100 into adhesive residue; then the tape removal component 22 removes the adhesive residue; and finally, the adhesive residue is collected by the adhesive residue collection component 23. This tape removal method, by positioning and clamping the product 100, can prevent the product 100 from moving or misaligning during the tape 101 removal process. The tape 101 on the product 100 can be completely melted into adhesive residue through a heat-melting method. Finally, the adhesive residue is cleaned and collected to thoroughly remove the tape 101 on the product 100, reducing the impact of tape 101 residue on the surface quality of the product 100 and subsequent processing steps.

[0100] Based on the above-described tape removal system, the present invention provides a tape removal method, comprising the following steps:

[0101] In the first step, based on the information transmitted from the previous workstation, the control system 500 controls the first tape removal device 300 in the PCB production line to start working, and the first carrying and transferring mechanism 20 starts working to receive the product 100 and transport the product 100 to the workstation of the first tape removal device 300 in the PCB production line.

[0102] In the second step, the control system 500 sends a command to the first translation mechanism 3 to move forward and position the product 100 through the positioning component 12 of the positioning clamping mechanism 1, based on the feedback of the product signal from the first load transfer mechanism 20.

[0103] The third step is to send an instruction to the clamping component 11 of the positioning clamping mechanism 1 to clamp the product after the product positioning is completed according to the feedback from the control system 500. Then the positioning component 122 of the positioning component 12 retracts to avoid the product.

[0104] Fourth step, the control system 500 receives the preparation completion command and starts to control the second translation mechanism 4 and the tape removal mechanism 2 to start working. The second translation mechanism 4 drives the tape removal mechanism 2 to move along the second direction and remove the tape 101 on the product 100. First, the hot melt assembly 21 starts working to heat melt the tape 101 and shrink it into glue residue. The tape removal assembly 22 cleans and removes the glue residue from the product surface. The glue residue collection assembly 23 starts working to collect the glue residue into the collection box 231. The staff regularly removes the glue residue from the collection box 231.

[0105] Fifth step, the control system 500, based on the position feedback of the second translation mechanism 4, completes the tape removal action, the positioning clamping mechanism 1 resets, the first translation mechanism 3 retracts, the tape removal action is completed, and the control system 500 controls the first load transfer mechanism 20 to transport the product to the second load transfer mechanism 30 of the second tape removal equipment 400 used in the PCB production line.

[0106] Step 6: The control system 500 controls the operation of the second tape removal device 400 used in the PCB production line. Its working process is similar to that of the first tape removal device 300 used in the PCB production line, and will not be described again here.

[0107] Note that in the description of this specification, references to terms such as "an embodiment," "in other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0108] The above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A tape removal device for use in a PCB production line, characterized in that, The device includes a tape removal device (10) and a carrying and transferring mechanism, wherein the carrying and transferring mechanism is located between two tape removal devices (10) symmetrically arranged along a first direction, and is used to receive and transfer products (100); the tape removal device (10) includes: A positioning and clamping module is used to position and clamp the product (100) on the carrying and transferring mechanism. The tape removal module is capable of moving in a second direction to remove tape (101) from the edge of the product (100). The positioning and clamping module includes a positioning and clamping mechanism (1) and a first translation mechanism (3). The positioning and clamping mechanism (1) is used to position and clamp the product (100). The first translation mechanism (3) includes a first translation drive assembly (31) and a first mounting bracket (32). The first translation drive assembly (31) can drive the first mounting bracket (32) to move along a first direction. The positioning and clamping mechanism (1) is mounted on the first mounting bracket (32). The positioning clamping mechanism (1) includes two clamping components (11), which are symmetrically arranged on the first mounting bracket (32) in the vertical direction for clamping the edge of the product (100) from top to bottom. The first direction, the second direction, and the vertical direction are perpendicular to each other. At least one of the clamping components (11) includes: The clamping drive (111) is mounted on the first mounting bracket (32); The clamping member (112) is movably mounted on the first mounting bracket (32), and the clamping drive member (111) is used to drive the clamping member (112) to reciprocate along the arrangement direction of the two clamping assemblies (11); The positioning and clamping mechanism (1) further includes a positioning component (12), which includes a positioning drive (121) and a positioning component (122). The positioning drive (121) is mounted on the clamping component (112). The positioning drive (121) is used to drive the positioning component (122) to move along the moving direction of the clamping component (112). The positioning component (122) can abut against the side of the product (100). When positioning and clamping, the first translation mechanism (3) drives the positioning and clamping mechanism (1) to move along the first direction and approach the product (100), and uses the positioning component (12) to position the product (100), and then uses the clamping component (11) to clamp the product (100).

2. The tape removal device for a PCB production line according to claim 1, characterized in that, The tape removal module includes a tape removal mechanism (2) and a second translation mechanism (4). The tape removal mechanism (2) is used to remove tape (101) from the product (100). The second translation mechanism (4) includes a second translation drive assembly (41) and a second mounting bracket (42). The second translation drive assembly (41) is mounted on the first mounting bracket (32) and can drive the second mounting bracket (42) to move in a second direction. The tape removal mechanism (2) is mounted on the second mounting bracket (42).

3. The tape removal device for a PCB production line according to claim 2, characterized in that, The tape removal mechanism (2) includes a hot melt assembly (21) and a tape removal assembly (22). The hot melt assembly (21) is used to melt the tape (101) on the product (100); the tape removal assembly (22) is used to remove the slag from the tape (101).

4. The tape removal device for a PCB production line according to claim 3, characterized in that, The tape removal mechanism (2) further includes a fixing frame (24), which includes: The first fastener (241) is installed on the second mounting bracket (42). The second fastener (242) includes multiple baffles, at least one of the baffles is fixed to the first fastener (241), the multiple baffles are sequentially fixedly connected and enclosed to form a wall-like structure, and the tape removal assembly (22) is installed on the wall-like structure.

5. The tape removal device for a PCB production line according to claim 4, characterized in that, The tape removal assembly (22) includes a tape removal drive (221) and a first brush (222). The tape removal drive (221) is mounted on the second fixing member (242) and is used to drive the first brush (222) to rotate. The rotation axis of the first brush (222) is perpendicular to the extension direction of the enclosure structure. The first brush (222) is at least partially located inside the enclosure structure, and the bristles of the first brush (222) abut against the lower surface of the product (100).

6. The tape removal device for a PCB production line according to claim 4, characterized in that, The tape removal mechanism (2) further includes a tape residue collection assembly (23), which includes a collection box (231) that is detachably installed within the enclosure structure and located below the brush of the tape removal assembly (22).

7. The tape removal device for a PCB production line according to claim 3, characterized in that, The first mounting bracket (32) includes: The first mounting component (321) is connected to the output end of the first translation drive assembly (31); The second mounting component (322) and the third mounting component (323) are fixed to the first mounting component (321) in parallel and spaced apart. One clamping drive component (111) of the two clamping assemblies (11) is provided on the second mounting component (322) and the other is provided on the third mounting component (323). A guide (324) is fixed between the second mounting member (322) and the third mounting member (323), the guide (324) extending along the moving direction of the clamping member (112), and at least one clamping member (112) in the clamping assembly (11) is slidably sleeved on the guide (324).

8. The tape removal device for a PCB production line according to any one of claims 2-7, characterized in that, In one of the tape removal devices (10), two first translation mechanisms (3) are arranged parallel to each other and spaced apart along a second direction, and the positioning clamping mechanism (1) is mounted on the first mounting frame (32) of the two first translation mechanisms (3); the second translation mechanism (4) is mounted on the first mounting frame (32) of the two first translation mechanisms (3).

9. A tape removal system, characterized in that, It includes a frame (200), a control system (500), and a tape removal device for a PCB production line as described in any one of claims 1-8, wherein the control system (500) and the tape removal device for a PCB production line are disposed on the frame (200).

10. The tape removal system according to claim 9, characterized in that, The control system (500) controls the tape removal equipment for the PCB production line to start working, and the carrying and transferring mechanism starts working to receive the product (100) and transport the product (100) to the tape removal equipment station for the PCB production line; The control system (500) sends an instruction and controls the positioning and clamping mechanism (1) to position and clamp the product (100) based on the product signal fed back by the carrying and transferring mechanism; The control system (500) starts to control the tape removal mechanism (2) to start working based on the signal of completed positioning and clamping fed back by the positioning and clamping mechanism (1). The tape removal mechanism (2) moves along the second direction and removes the tape (101) on the product (100). The control system (500) controls the positioning clamping mechanism (1) to reset according to the tape removal signal fed back by the tape removal mechanism (2); the control system (500) controls the carrying and transferring mechanism to transport the product (100) to the next station.

11. The tape removal system according to claim 10, characterized in that, The number of tape removal devices used in the PCB production line is two, and the two tape removal devices used in the PCB production line are arranged along the product conveying direction; One of the tape removal devices for a PCB production line includes a carrier transfer mechanism comprising a carrier drive assembly (201) and a carrier (202). The carrier drive assembly (201) is mounted on the frame (200) and is capable of driving the carrier (202) to rotate 90° in a horizontal plane and move along a second direction. Another of the carrying and transfer mechanisms in the tape removal equipment for the PCB production line is a belt conveyor mechanism, wherein the belt of the belt conveyor mechanism is used to carry the product (100) and can drive the product (100) to move along the product conveying direction.

12. A method for removing adhesive tape, characterized in that, The tape removal device for a PCB production line as described in any one of claims 1-8 includes the following steps: The product (100) is received using a load-bearing transfer mechanism. Positioning and clamping mechanism (1) positions and clamps the product (100) on the carrying and transferring mechanism. The tape removal mechanism (2) removes the tape (101) from the product (100).

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