A high thermal shock skateboard material and a method of making the same

Abstract

The application relates to the technical field of refractory materials, and discloses a high-thermal-shock slide plate material and a preparation method thereof. The high-thermal-shock slide plate material comprises the following components by weight: high-aluminum material 30-50 parts, alumina powder 20-30 parts, high-aluminum fine powder 10-15 parts, aluminum powder 0.5-1.5 parts, a binder 3-5 parts, titanium boride 1-3 parts, carbon black 1-5 parts, bentonite 1-3 parts and thermal shock enhancer 4-8 parts; the thermal shock enhancer is modified silicon carbide fiber modified by 2,2'-diaminoethyleneglycol diphenyl ether. The technical scheme solves the problems of poor erosion resistance and poor thermal shock resistance of the slide plate material in the prior art.

Description

Technical Field

[0001] This invention relates to the field of refractory materials technology, specifically to a high thermal shock sliding plate material and its preparation method. Background Technology

[0002] Iron and steel smelting is a crucial guarantee for modern industrial development. The steel slag produced during smelting affects the lifespan of ladle refractory materials and the quality of molten steel. Therefore, the converter slag-blocking system has become increasingly important in the iron and steel smelting process, becoming a key step in steelmaking. The converter slag-blocking system includes a hydraulic cylinder drive device, mechanical components, and refractory materials. During slag control, the slag-blocking slide plate must withstand the mechanical erosion and chemical corrosion of molten steel and slag. As a functional refractory material used in steelmaking, the slide plate operates under harsh conditions, requiring high strength, impact rigidity, and thermal shock resistance. Therefore, how to prepare a slide plate material with good erosion resistance and thermal shock resistance is a problem urgently needing to be solved by those skilled in the art. Summary of the Invention

[0003] This invention proposes a high thermal shock resistance skateboard material and its preparation method, which solves the problem of poor erosion resistance and thermal shock resistance of skateboard materials in related technologies.

[0004] The technical solution of the present invention is as follows:

[0005] This invention proposes a high thermal shock resist material, comprising the following raw materials in parts by weight: 30-50 parts high alumina material, 20-30 parts alumina powder, 10-15 parts high alumina fine powder, 0.5-1.5 parts metallic aluminum powder, 3-5 parts binder, 1-3 parts titanium boride, 1-5 parts carbon black, 1-3 parts bentonite, and 4-8 parts thermal shock resist.

[0006] The thermal shock enhancer is obtained by modifying silicon carbide fibers with 2,2'-diaminoethylene glycol diphenyl ether.

[0007] As a further technical solution, the amount of 2,2'-diaminoethylene glycol diphenyl ether added is 4% to 5% of the mass of silicon carbide fiber.

[0008] In this invention, by limiting the amount of 2,2'-diaminoethylene glycol diphenyl ether added to 4%~5% of the mass of silicon carbide fiber, the erosion resistance and thermal shock resistance of the skateboard material are further improved.

[0009] As a further technical solution, the amount of 2,2'-diaminoethylene glycol diphenyl ether added is 4.5% of the mass of silicon carbide fiber.

[0010] As a further technical solution, the preparation method of the thermal shock enhancer includes the following steps: uniformly dispersing silicon carbide fiber and 2,2'-diaminoethylene glycol diphenyl ether in an aqueous ethanol solution, adding an acidic catalyst, heating and stirring, filtering, and drying to obtain the thermal shock enhancer.

[0011] As a further technical solution, the volume ratio of water to anhydrous ethanol in the ethanol-water solution is 1:2~3.

[0012] As a further technical solution, the acidic catalyst is 1 mol / L hydrochloric acid.

[0013] As a further technical solution, the amount of acidic catalyst added is 0.1% of the volume of the ethanol aqueous solution.

[0014] As a further technical solution, the heating and stirring temperature is 40~60℃, and the heating and stirring time is 2~3h.

[0015] As a further technical solution, the binder is phenolic resin.

[0016] As a further technical solution, the phenolic resin includes one or more of phenolic resin 5323, phenolic resin 5310, and phenolic resin 5116.

[0017] As a further technical solution, the particle size of the silicon carbide fiber is 2000 mesh.

[0018] As a further technical solution, the particle size of the high-alumina material is 1~3mm.

[0019] As a further technical solution, the particle size of the alumina powder is 50~100μm.

[0020] As a further technical solution, the particle size of the high-alumina fine powder is 200 mesh.

[0021] As a further technical solution, the particle size of the titanium boride is 100~500nm.

[0022] As a further technical solution, the particle size of the aluminum powder is 300 mesh.

[0023] As a further technical solution, the particle size of the carbon black is 120 mesh.

[0024] As a further technical solution, the bentonite has a particle size of 325 mesh.

[0025] This invention also proposes a method for preparing a high thermal shock sliding plate material, comprising the following steps:

[0026] S1. After mixing the high-alumina material, alumina powder, high-alumina fine powder, metallic aluminum powder, titanium boride, carbon black, and bentonite in a mill, we obtain mixture I.

[0027] S2. After adding a binder to mixture I and mixing evenly, mixture II is obtained;

[0028] S3. Add the thermal shock enhancer to mixture II, mix thoroughly, and then discharge from the mill;

[0029] S4. Pressing and sintering to obtain a high thermal shock sliding plate material.

[0030] As a further technical solution, the mixing time in S1 is 2~3 minutes.

[0031] As a further technical solution, the mixing time in S2 is 5~8 minutes.

[0032] As a further technical solution, in step S3, after adding a thermal shock enhancer to mixture II and mixing evenly, the mixture is discharged from the mill after the material temperature reaches 45°C. As a further technical solution, the sintering temperature is 700~900°C.

[0033] The working principle and beneficial effects of this invention are as follows:

[0034] In this invention, the erosion resistance and thermal shock resistance of the skateboard material are improved by adding a thermal shock enhancer obtained by modifying silicon carbide fiber with 2,2'-diaminoethylene glycol diphenyl ether. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0036] Example 1

[0037] A method for preparing a high thermal shock sliding plate material includes the following steps:

[0038] S1. Mix 30 parts of high-alumina material (1~3mm), 20 parts of alumina powder (50μm), 10 parts of high-alumina fine powder (200 mesh), 0.5 parts of metallic aluminum powder (300 mesh), 1 part of titanium boride (100nm), 1 part of carbon black (120 mesh), and 1 part of bentonite (325 mesh) in a mill for 2 minutes to obtain mixture I.

[0039] S2. Add 3 parts of phenolic resin 5323 to mixture I and mix for 5 minutes to obtain mixture II;

[0040] S3. Add 4 parts of thermal shock enhancer to mixture II, mix for 5 minutes, and after the material temperature reaches 45℃, discharge from the mill.

[0041] S4. Press molding, sintering at 700℃ to obtain high thermal shock sliding plate material.

[0042] Preparation method of thermal shock enhancer: 50g silicon carbide fiber (2000 mesh) and 1.5g 2,2'-diaminoethylene glycol diphenyl ether are uniformly dispersed in a mixed solution consisting of 200mL deionized water and 400mL anhydrous ethanol. 0.6mL 1mol / L hydrochloric acid is added, the mixture is heated to 40℃ and stirred for 3h, filtered, and dried to obtain thermal shock enhancer.

[0043] Example 2

[0044] A method for preparing a high thermal shock sliding plate material includes the following steps:

[0045] S1. Mix 40 parts of high-alumina material (1~3mm), 25 parts of alumina powder (80μm), 12 parts of high-alumina fine powder (200 mesh), 1 part of metallic aluminum powder (300 mesh), 2 parts of titanium boride (300nm), 3 parts of carbon black (120 mesh), and 2 parts of bentonite (325 mesh) in a mill for 3 minutes to obtain mixture I.

[0046] S2. Add 4 parts of phenolic resin 5310 to mixture I and mix for 6 minutes to obtain mixture II;

[0047] S3. Add 6 parts of thermal shock enhancer to mixture II, mix for 8 minutes, and after the material temperature reaches 45℃, discharge from the mill.

[0048] S4. Press molding, sintering at 800℃ to obtain high thermal shock sliding plate material.

[0049] Preparation method of thermal shock enhancer: 50g silicon carbide fiber (2000 mesh) and 1.5g 2,2'-diaminoethylene glycol diphenyl ether are uniformly dispersed in a mixed solution consisting of 200mL deionized water and 600mL anhydrous ethanol. 0.8mL 1mol / L hydrochloric acid is added, the mixture is heated to 50℃ and stirred for 3h, filtered, and dried to obtain thermal shock enhancer.

[0050] Example 3

[0051] A method for preparing a high thermal shock sliding plate material includes the following steps:

[0052] S1. Mix 40 parts of high-alumina material (1~3mm), 30 parts of alumina powder (100μm), 15 parts of high-alumina fine powder (200 mesh), 1.5 parts of metallic aluminum powder (300 mesh), 3 parts of titanium boride (500nm), 5 parts of carbon black (120 mesh), and 3 parts of bentonite (325 mesh) in a mill for 3 minutes to obtain mixture I.

[0053] S2. Add 5 parts of phenolic resin 5116 to mixture I and mix for 8 minutes to obtain mixture II;

[0054] S3. Add 8 parts of thermal shock enhancer to mixture II, mix for 10 minutes, and after the material temperature reaches 45℃, discharge from the mill.

[0055] S4. Press molding, sintering at 900℃ to obtain high thermal shock sliding plate material.

[0056] Preparation method of thermal shock enhancer: 50g silicon carbide fiber (2000 mesh) and 1.5g 2,2'-diaminoethylene glycol diphenyl ether are uniformly dispersed in a mixed solution consisting of 200mL deionized water and 400mL anhydrous ethanol. 0.6mL 1mol / L hydrochloric acid is added, the mixture is heated to 60℃ and stirred for 2h, filtered, and dried to obtain thermal shock enhancer.

[0057] Example 4

[0058] The only difference between this embodiment and Example 1 is that the amount of 2,2'-diaminoethylene glycol diphenyl ether added is 3.5g.

[0059] Example 5

[0060] The only difference between this embodiment and Example 1 is that the amount of 2,2'-diaminoethylene glycol diphenyl ether added is 2g.

[0061] Example 6

[0062] The only difference between this embodiment and Example 1 is that the amount of 2,2'-diaminoethylene glycol diphenyl ether added is 2.25g.

[0063] Example 7

[0064] The only difference between this embodiment and Example 1 is that the amount of 2,2'-diaminoethylene glycol diphenyl ether added is 2.5g.

[0065] Comparative Example 1

[0066] The only difference between this comparative example and Example 1 is that the silicon carbide fibers are not modified.

[0067] The high thermal shock resistance sliding plate materials obtained in Examples 1-7 and Comparative Example 1 were tested for thermal shock resistance according to the method (water quenching method) in GB / T 30873-2014 "Test Method for Thermal Shock Resistance of Refractory Materials", for flexural strength according to the method in GB / T 3002-2017 "Test Method for High Temperature Flexural Strength of Refractory Materials", and for room temperature compressive strength according to the method in GB / T 5072-2008 "Test Method for Room Temperature Compressive Strength of Refractory Materials". The test results are recorded in Table 1.

[0068] Table 1. Performance test results of high thermal shock sliding plate materials in Examples 1-7 and Comparative Example 1

[0069]

[0070] Compared with Example 1, the silicon carbide fiber in Comparative Example 1 was not modified. As a result, the thermal shock resistance, room temperature compressive strength, and high temperature flexural strength of the obtained skateboard material were all lower than those of Example 1. This indicates that adding a thermal shock enhancer made of silicon carbide fiber modified with 2,2'-diaminoethylene glycol diphenyl ether to the skateboard material can improve the thermal shock resistance, room temperature compressive strength, and high temperature flexural strength of the skateboard material.

[0071] Compared with Example 1, Examples 4-7 changed the amount of 2,2'-diaminoethylene glycol diphenyl ether added to the thermal shock enhancer. As a result, the thermal shock resistance, room temperature compressive strength, and high temperature flexural strength of the skateboard materials obtained in Examples 5-7 were all higher than those in Examples 1 and 4. This indicates that when the amount of 2,2'-diaminoethylene glycol diphenyl ether added to the thermal shock enhancer is 4% to 5% of the mass of silicon carbide fiber, the thermal shock resistance, room temperature compressive strength, and high temperature flexural strength of the skateboard material can be further improved.

[0072] Comparing Examples 5-7, it was found that the skateboard material obtained in Example 6 had higher thermal shock resistance, room temperature compressive strength, and high temperature flexural strength than Examples 5 and 7. This indicates that when the amount of 2,2'-diaminoethylene glycol diphenyl ether added to the thermal shock enhancer is 4.5% of the mass of silicon carbide fiber, the obtained skateboard material has the highest thermal shock resistance, room temperature compressive strength, and high temperature flexural strength.

[0073] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high thermal shock chuck material, characterized in that, The raw materials include the following components by weight: 30-50 parts high alumina material, 20-30 parts alumina powder, 10-15 parts high alumina fine powder, 0.5-1.5 parts metallic aluminum powder, 3-5 parts binder, 1-3 parts titanium boride, 1-5 parts carbon black, 1-3 parts bentonite, and 4-8 parts thermal shock enhancer. The thermal shock enhancer is obtained by modifying silicon carbide fibers with 2,2'-diaminoethylene glycol diphenyl ether; The amount of 2,2'-diaminoethylene glycol diphenyl ether added is 4% to 5% of the mass of silicon carbide fiber; The preparation method of the thermal shock enhancer includes the following steps: mixing silicon carbide fibers and 2,2' Diaminoethylene glycol diphenyl ether is uniformly dispersed in an aqueous ethanol solution, an acidic catalyst is added, the mixture is heated and stirred, filtered, and dried to obtain a thermal shock enhancer.

2. The high thermal shock chuck material according to claim 1, characterized in that, The binder is phenolic resin.

3. The high thermal shock chuck material according to claim 1, characterized in that, The silicon carbide fiber has a particle size of 2000 mesh.

4. The high thermal shock chuck material according to claim 1, characterized in that, The high-alumina material has a particle size of 1~3mm.

5. The high thermal shock chuck material according to claim 1, characterized in that, The alumina powder has a particle size of 50~100μm.

6. The high thermal shock chuck material according to claim 1, characterized in that, The particle size of the high-alumina fine powder is 200 mesh.

7. The high thermal shock chuck material according to claim 1, characterized in that, The titanium boride has a particle size of 100~500nm.

8. The high thermal shock sliding plate material according to claim 1, characterized in that, The aluminum powder has a particle size of 300 mesh.

9. A method for preparing a high thermal shock sliding plate material according to any one of claims 1 to 8, characterized in that, Includes the following steps: S1. After mixing the high-alumina material, alumina powder, high-alumina fine powder, metallic aluminum powder, titanium boride, carbon black, and bentonite in a mill, we obtain mixture I. S2. After adding a binder to mixture I and mixing evenly, mixture II is obtained; S3. Add the thermal shock enhancer to mixture II, mix thoroughly, and then discharge from the mill; S4. Pressing and sintering to obtain a high thermal shock sliding plate material.

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