Spliced display unit, spliced display screen and electronic device

Abstract

The spliced display unit, the spliced display screen and the electronic equipment provided by the embodiments of the present application relate to the technical field of display. In the spliced display unit, the peripheral circuit located in the non-display area and the circuit in the display area are connected through a wiring structure, and the flexible substrate of the display area close to the blocking layer of the non-display area is not in contact. When the spliced display unit is spliced into a spliced display screen, the flexible substrate of the display area close to the non-display area can be bent relative to the direction away from the blocking layer. The bending radius of the flexible substrate can be increased, the length of the flexible substrate after bending relative to the display area protruding part can be reduced, thereby reducing the width of the gap area that cannot be displayed at the splicing position when multiple spliced display units are spliced, and improving the overall display effect of the spliced display screen.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a splicing display unit, a splicing display screen, and an electronic device. Background Technology

[0002] Large-size display technology is gaining increasing popularity in the market. However, due to limitations in display manufacturing, even the largest single display screen cannot meet the demand for large-size displays on its own. Current large-size displays are achieved by splicing multiple display units together to form a video wall. The non-display areas outside the splicing display units contain peripheral circuits, such as peripheral driving circuits (GIP circuits or Demax circuits) and peripheral protection circuits (ESD circuits). This results in a non-displayable area at the splicing position when multiple display units are spliced ​​together to form a video wall, affecting the overall display effect of the video wall. Summary of the Invention

[0003] In order to overcome the technical problems mentioned in the above technical background, this application provides a splicing display unit, a splicing display screen, and an electronic device.

[0004] A first aspect of this application provides a splicing display unit having a display area and a non-display area at least partially surrounding the display area;

[0005] The splicing display unit includes a flexible substrate;

[0006] In the non-display area, the splicing display unit also includes peripheral circuitry located on the flexible substrate;

[0007] In the display area, the splicing display unit further includes a barrier layer, an array driving layer and a pixel device layer stacked sequentially on the flexible substrate. In the display area near the non-display area, the barrier layer does not contact the flexible substrate.

[0008] The splicing display unit also includes a wiring structure that connects the peripheral circuitry to the circuitry in the array driving layer.

[0009] The aforementioned splicing display unit connects the peripheral circuits located in the non-display area and the circuits in the display area through a wiring structure, and ensures that the barrier layer near the non-display area in the display area does not contact the flexible substrate. When splicing display units are used to form a splicing display screen, the flexible substrate near the non-display area in the display area can be bent relative to the direction away from the barrier layer. This can increase the bending radius of the flexible substrate and reduce the length of the flexible substrate extending relative to the display area after bending. This reduces the width of the gap area that cannot be displayed when multiple splicing display units are spliced ​​together, thereby improving the overall display effect of the splicing display screen.

[0010] In one possible embodiment of this application, the splicing display unit further includes a release layer;

[0011] The release layer is located between the flexible substrate and the barrier layer, and the release layer is located in the display area near the non-display area. The release layer is used to isolate the barrier layer located in the display area near the non-display area from the flexible substrate.

[0012] In one possible embodiment of this application, the side of the release layer near the non-display area is flush with the side of the barrier layer near the non-display area.

[0013] In one possible embodiment of this application, the trace structure includes a first conductive trace and a second conductive trace;

[0014] The first conductive trace is located on the flexible substrate and is connected to the peripheral circuit.

[0015] The second conductive trace is located on the side of the barrier layer away from the flexible substrate, and the second conductive trace is connected to the circuit in the array driving layer;

[0016] The second conductive trace is connected to the first conductive trace through a via in the film layer on the barrier layer.

[0017] In one possible embodiment of this application, the first conductive trace extends from the non-display area toward the display area;

[0018] The orthographic projection of the via on the barrier layer onto the flexible substrate is located on the side of the orthographic projection of the release layer onto the flexible substrate away from the non-display area.

[0019] In one possible embodiment of this application, the wiring structure is made of molybdenum or titanium.

[0020] And / or, the release layer is made of a material with an etching ratio greater than a preset etching ratio;

[0021] And / or, the release layer is made of metal or metal oxide.

[0022] A second aspect of this application provides a splicing display screen, the splicing display screen including the splicing display unit in any possible embodiment of the first aspect;

[0023] At the splicing position of adjacent splicing display units, the flexible substrate of the splicing display unit is bent toward the direction away from the blocking layer of the splicing display unit.

[0024] In one possible embodiment of this application, the splicing display screen further includes a protective adhesive;

[0025] The protective adhesive is filled in the area where the flexible substrate is bent relative to the barrier layer, to support and protect the bent portion of the flexible substrate;

[0026] Preferably, the splicing display screen further includes a cover layer, which is located on the light-emitting side of the splicing display unit.

[0027] In one possible embodiment of this application, the orthographic projection of the bent portion of the flexible substrate onto the plane of the barrier layer is located within the barrier layer.

[0028] A third aspect of this application provides an electronic device, the electronic device including the splicing display screen in any possible embodiment of the second aspect.

[0029] The splicing display unit, splicing display screen, and electronic device provided in this application embodiment connect the peripheral circuits located in the non-display area and the circuits in the display area through a wiring structure, and ensure that the barrier layer near the non-display area in the display area does not contact the flexible substrate. When splicing display units are used to form a splicing display screen, the flexible substrate near the non-display area in the display area can be bent relative to the direction away from the barrier layer, which can increase the bending radius of the flexible substrate and reduce the length of the flexible substrate after bending relative to the display area. This reduces the width of the gap area that cannot be displayed when multiple splicing display units are spliced ​​together, and improves the overall display effect of the splicing display screen. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 An example is shown in the schematic diagram of the state of the splicing display unit before and after bending in the prior art;

[0032] Figure 2 An example is provided in the embodiment showing the area distribution of the splicing display unit;

[0033] Figure 3 One of the state change diagrams of the splicing display unit provided in this embodiment before and after bending is illustrated;

[0034] Figure 4 This example illustrates the state change of the splicing display unit before and after bending, as shown in the second illustration.

[0035] Figure 5 A schematic diagram illustrating the structure of the splicing display screen provided in this embodiment is shown;

[0036] Figure 6 Example Figure 5 A schematic diagram of the cross-section along the AA direction;

[0037] Figure 7 A schematic diagram illustrating the manufacturing process of the splicing display unit provided in this embodiment is shown.

[0038] Figure 8 Example Figure 7 The corresponding process flow diagram.

[0039] Icons: 1-Splicing display screen; 10-Splicing display unit; 10A-Display area; 10B-Non-display area; 110-Flexible substrate; 120-Blocking layer; 130-Array driving layer; 140-Pixel device layer; 150-Trace structure; 1501-First trace structure; 1502-Second trace structure; 160-Release layer; 200-Peripheral circuit; 20-Protective adhesive; 30-Cover plate layer. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0042] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0043] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0044] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0045] To address the technical problems mentioned in the background section, please refer to... Figure 1 Existing technology can reduce the width of the gap area that cannot be displayed by bending the non-display area 10B of the distributed peripheral circuit 200. As shown in the figure, compared with the non-display area 10B before bending, the above method can further reduce the width a2 of the undisplay area of ​​a single splicing display unit 10 from width a1. However, the reduced width a2 is generally still about 2mm, which still affects the display effect of the splicing display screen.

[0046] To address the aforementioned problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below are contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0047] Please refer to Figure 2 and Figure 3 , Figure 2 The example illustrates the area distribution of the splicing display unit provided in this embodiment. Figure 3 Example Figure 2 One of the state change diagrams of the splicing display unit before and after bending. In this embodiment, the splicing display unit 10 has a display area 10A and a non-display area 10B, wherein the non-display area 10B at least partially surrounds the display area 10A, and the splicing display unit 10 includes a flexible substrate 110.

[0048] In the non-display area 10B, the splicing display unit 10 also includes peripheral circuitry 200 located on the flexible substrate 110. In the display area 10A, the splicing display unit 10 also includes a barrier layer 120, an array driving layer 130, and a pixel device layer 140 sequentially stacked on the flexible substrate 110. In the display area 10A near the non-display area 10B, the barrier layer 120 does not contact the flexible substrate 110.

[0049] In this embodiment, the splicing display unit 10 further includes a wiring structure 150, which connects the peripheral circuit 200 and the array driving layer 130 and / or the pixel device layer 140.

[0050] In the above structure, the peripheral circuit 200 located in the non-display area 10B and the circuit in the display area 10A are connected by the wiring structure 150, and the barrier layer 120 of the display area 10A near the non-display area 10B is not in contact with the flexible substrate 110. When splicing display units 10 are used to form a splicing display screen, the flexible substrate 110 of the display area 10A near the non-display area 10B can be bent relative to the direction away from the barrier layer 120. This can increase the bending radius of the flexible substrate 110 and reduce the length of the part of the flexible substrate 110 that protrudes relative to the display area 10A after bending. This reduces the width of the gap area that cannot be displayed at the splicing position when multiple splicing display units 10 are spliced, and improves the overall display effect of the splicing display screen.

[0051] Please refer to Figure 4 Furthermore, the splicing display unit 10 also includes a release layer 160, which is located between the flexible substrate 110 and the barrier layer 120. Specifically, the release layer 160 is located in the display area 10A near the non-display area 10B. The release layer 160 is used to separate the barrier layer 120 located in the display area 10A near the non-display area 10B from the flexible substrate 110, so that when the flexible substrate 110 is bent, the flexible substrate 110 located in the display area 10A near the non-display area 10B can be bent relative to the direction away from the barrier layer 120. This design can increase the bending radius of the flexible substrate 110, allowing the bent portion of the flexible substrate 110 to extend towards the display area 10A, and reducing the length of the extended portion of the flexible substrate 110 relative to the display area 10A after bending.

[0052] For example, in this embodiment, the side of the release layer 160 near the non-display area 10B is flush with the side of the barrier layer 120 near the non-display area 10B.

[0053] Furthermore, please refer to again Figure 3 and Figure 4The wiring structure 150 includes a first conductive trace 1501 and a second conductive trace 1502. The first conductive trace 1501 is located on the flexible substrate 110 and is connected to the peripheral circuit 220. The second conductive trace 1502 is located on the side of the barrier layer 120 away from the flexible substrate 110 and is connected to the circuit in the array driving layer 130. The second conductive trace 1502 is connected to the first conductive trace 1501 through a film via on the barrier layer 120.

[0054] To prevent damage to the wiring structure 150 when the flexible substrate 110 is bent, thus affecting the electrical connection between the peripheral circuit 200 and the circuit in the display area 10A, in this embodiment, the first conductive trace 1501 extends from the non-display area 10B toward the display area 10B. The orthographic projection of the film via on the barrier layer 120 onto the flexible substrate 110 is located on the side of the release layer 160 onto the flexible substrate 110 that is away from the non-display area 10B. This design prevents the flexible substrate 110 located in the display area 10A from being pulled by the first conductive trace 1501 and the second conductive trace 1502 when bent, thus affecting the stability of the wiring structure 150.

[0055] Furthermore, the wiring structure 150 can be made of molybdenum or titanium, and the release layer 120 can be made of a material with a high etching ratio, such as a material with an etching ratio greater than a preset etching ratio. Preferably, the release layer 120 can be made of metal or metal oxide, such as aluminum or aluminum oxide. In this embodiment, the splicing display unit 10 may or may not include the release layer 160. When the release layer 160 is not included, the barrier layer 120 located near the non-display area 10B in the display area 10A has a film layer gap, which separates the barrier layer 120 from the flexible substrate 110. It is understood that... Figure 3 The splicing display unit 10 in the middle can be made by Figure 4 The splicing display unit 10 is obtained after removing the release layer 160. For example, the release layer 160 can be removed by etching with an etching solution.

[0056] In this embodiment, the flexible substrate 110 can be made of polyimide (PI), and the thickness of the flexible substrate can be between 8 μm and 15 μm. The barrier layer 120 has an insulating function. Exemplarily, the barrier layer 120 can be a silicon oxide layer or a silicon nitride layer, and the thickness of the barrier layer 120 can be between 5000 angstroms and 7000 angstroms.

[0057] In this embodiment, the splicing display unit 10 may further include a flexible printed circuit board (FPC). The flexible printed circuit board includes a driving display chip that drives the splicing display unit 10 to display. The flexible printed circuit board is bound to the peripheral circuit 200, and the peripheral circuit 200 drives the circuit in the display area 10A so that the splicing display unit 10 can display normally.

[0058] Please refer to Figure 5 and Figure 6 This embodiment also provides a splicing display screen. The splicing display screen 1 can be formed by splicing multiple splicing display units 10 described above. For example, as shown in the example... Figure 5 As shown, the splicing display screen 1 can be formed by splicing four splicing display units 10. For example... Figure 6 As shown, at the splicing position of adjacent splicing display units 10, the flexible substrate 110 of the splicing display unit is bent toward the blocking layer 120 away from the splicing display unit.

[0059] Please refer to this again. Figure 6 The splicing display screen 1 also includes a protective adhesive 20, which fills the area where the flexible substrate 110 is bent relative to the barrier layer 120, and is used to support and protect the bent portion of the flexible substrate 110.

[0060] Furthermore, the splicing display screen 1 may also include a cover layer 30, which is located on the light-emitting side of the splicing display unit 10.

[0061] In this embodiment, the orthographic projection of the bent portion of the flexible substrate 110 onto the plane of the barrier layer 120 is located within the barrier layer 120. This design ensures that the bent portion of the flexible substrate 110 does not protrude relative to the display area 10A. In this case, the gap width a3 of the splicing position area can be less than 0.1mm. This can negate the influence of the non-display area at the splicing position on the overall display effect of the splicing display screen, thereby improving the display effect of large-size displays.

[0062] This embodiment also provides an electronic device, which includes the splicing display screen described in the previous embodiment. The electronic device using the aforementioned splicing display screen has a better large-size display effect, which can increase the market competitiveness of the electronic device.

[0063] This embodiment also provides a method for manufacturing a splicing display unit, please refer to... Figure 7 and Figure 8 , Figure 7 A flowchart illustrating the manufacturing process of a splicing display unit is provided. Figure 8 Example Figure 7 The corresponding process flow diagram shows that the splicing display unit 10 includes a display area 10A and a non-display area 10B. The following section will discuss this in conjunction with... Figure 7 and Figure 8 The manufacturing method of the splicing display unit is described in detail.

[0064] Step S11: Fabricate a flexible substrate.

[0065] In this embodiment, the flexible substrate 110 can be fabricated on a glass substrate, and the flexible substrate 110 is distributed in the display area 10A and the non-display area 10B.

[0066] Step S12: Pre-fabricate the wiring structure for connecting the peripheral circuits and the circuits in the display area.

[0067] In this embodiment, the trace structure 150 may include a conductive trace 1501 and a second conductive trace 1502, and step S12 may be implemented in the following manner.

[0068] First, a first conductive trace 1501 extending from the non-display area 10B to the display area 10A is fabricated on the flexible substrate 110.

[0069] Next, a release layer 160 is fabricated on a flexible substrate 110 at a location near the non-display area 10B in the display area 10A. The release layer 160 covers a portion of the first conductive trace 1501, wherein the first conductive trace 1501 extends to the side of the release layer 160 away from the non-display area 10B.

[0070] Then, a barrier layer 120 is fabricated on the flexible substrate 110 and the release layer 160.

[0071] Finally, a second conductive trace 1502 is fabricated on the barrier layer 120 away from the flexible substrate 110, and connected to the first conductive trace 1501 through the film via of the barrier layer 120 to form a trace structure 150.

[0072] Step S13: Fabricate an array driving layer and a pixel device layer stacked sequentially in the display area, and fabricate peripheral circuits in the non-display area.

[0073] The second conductive trace 1502 is connected to the circuit in the array driving layer 130, and the first conductive trace 1501 is connected to the peripheral circuit 20.

[0074] In this embodiment, the film layer (such as the gate insulating layer, interlayer insulating layer and planarization layer used to fabricate the array driving layer 130) between the peripheral circuit 200 and the display area 10A is also etched away in this step, so as to facilitate the subsequent bending of the non-display area 10B relative to the display area 10A.

[0075] In this embodiment, the pixel device layer 140 can be formed by Micro LED. In this step, the Micro LED can be transferred to the array driving layer 130 by mass transfer to obtain the pixel device layer 140. After obtaining the pixel device layer 140, the Micro LED can be encapsulated and protected by applying a protective adhesive layer and a curing adhesive layer.

[0076] After completing the above operations, the glass substrate can be removed to obtain the splicing display unit 10.

[0077] It is understood that in this embodiment, the release layer 160 in the splicing display unit 10 may or may not be removed. When it is necessary to remove the release layer 160, it can be removed by etching.

[0078] In summary, the splicing display unit, splicing display screen, and electronic device provided in this application embodiment connect the peripheral circuits located in the non-display area and the circuits in the display area through a wiring structure, and ensure that the barrier layer near the non-display area in the display area does not contact the flexible substrate. When splicing display units are used to form a splicing display screen, the flexible substrate near the non-display area in the display area can be bent relative to the direction away from the barrier layer, which can increase the bending radius of the flexible substrate and reduce the length of the flexible substrate extending relative to the display area after bending. This reduces the width of the gap area that cannot be displayed at the splicing position when multiple splicing display units are spliced, thereby improving the overall display effect of the splicing display screen.

[0079] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A splicing display unit, characterized in that, The splicing display unit has a display area and a non-display area that at least partially surrounds the display area; The splicing display unit includes a flexible substrate; In the non-display area, the splicing display unit also includes peripheral circuitry located on the flexible substrate; In the display area, the splicing display unit further includes a barrier layer, an array driving layer and a pixel device layer stacked sequentially on the flexible substrate. When the flexible substrate is in a flattened state, the barrier layer does not contact the flexible substrate at the position of the display area near the non-display area. The splicing display unit further includes a release layer, which is located between the flexible substrate and the barrier layer. The release layer is located in the display area near the non-display area and is used to isolate the barrier layer located in the display area near the non-display area from the flexible substrate. The splicing display unit also includes a wiring structure that connects the peripheral circuit to the circuit in the array driving layer. The trace structure includes a first conductive trace and a second conductive trace. The first conductive trace is located on the flexible substrate and is connected to the peripheral circuit. The second conductive trace is located on the side of the barrier layer away from the flexible substrate, and the second conductive trace is connected to the circuit in the array driving layer; The second conductive trace is connected to the first conductive trace through a via in the barrier layer; The first conductive trace extends from the non-display area toward the display area; The orthographic projection of the via on the barrier layer onto the flexible substrate is located on the side of the orthographic projection of the release layer onto the flexible substrate away from the non-display area.

2. The splicing display unit as described in claim 1, characterized in that, The side of the release layer near the non-display area is flush with the side of the barrier layer near the non-display area.

3. The splicing display unit as described in any one of claims 1-2, characterized in that, The wiring structure is made of molybdenum or titanium. And / or, the release layer is made of a material with an etching ratio greater than a preset etching ratio; And / or, the release layer is made of metal or metal oxide.

4. A splicing display screen, characterized in that, The splicing display screen includes the splicing display unit as described in any one of claims 1-3; At the splicing position of adjacent splicing display units, the flexible substrate of the splicing display unit is bent toward the direction away from the blocking layer of the splicing display unit.

5. The splicing display screen as described in claim 4, characterized in that, The splicing display screen also includes protective adhesive; The protective adhesive is filled in the area where the flexible substrate is bent relative to the barrier layer, serving to support and protect the bent portion of the flexible substrate.

6. The splicing display screen as described in claim 4, characterized in that, The splicing display screen also includes a cover layer, which is located on the light-emitting side of the splicing display unit.

7. The splicing display screen as described in claim 5, characterized in that, The orthographic projection of the bent portion of the flexible substrate onto the plane of the barrier layer lies within the barrier layer.

8. An electronic device, characterized in that, The electronic device includes the splicing display screen as described in any one of claims 4-7.

Images