Protective Film and Electronic Device

Abstract

The present application provides a protective film and an electronic device, relating to the field of terminal technologies. The protective film is applied to an electronic device and is disposed on a side of a cover plate away from a display panel. The protective film includes an adhesive layer, and a buffer layer and a film layer which are sequentially stacked on the adhesive layer. The adhesive layer is close to the cover plate and is used for bonding the buffer layer and the cover plate. The buffer layer at least includes a first sub-buffer layer and a second sub-buffer layer. The Young's modulus of the material of the first sub-buffer layer is less than or equal to the Young's modulus of the material of the second sub-buffer layer. The energy absorption ratios of the materials of the first sub-buffer layer and the second sub-buffer layer both increase with the increase of the impact rate of an external object on the protective film. Thus, when being impacted externally, the impact energy can be well absorbed through multiple sub-buffer layers or at least one sub-buffer layer with a unique molecular energy absorption mechanism, so that the protective film applied to the electronic device can achieve the impact protection effect on the screen.

Description

Technical Field

[0001] This application relates to the technical field of terminals, and in particular, to a protective film and an electronic device. Background Art

[0002] With the development of technology, foldable electronic devices have been studied and applied more and more widely. For foldable electronic devices, such as foldable screen mobile phones, in order to meet their bendable characteristics, the screens of traditional foldable screen mobile phones often use a large amount of flexible polymer materials, which makes the foldable screen mobile phones prone to bad conditions such as broken bright spots and black spots when being impacted by the outside world. Therefore, a protective film is generally attached to the screen surface to improve the impact resistance of the screen, etc.

[0003] However, the protective films currently attached to the screen surfaces of foldable screen mobile phones often have no impact resistance or have little impact resistance, resulting in the inability to protect the screen.

[0004] Therefore, there is an urgent need to provide a protective film to improve the impact resistance and other properties of the screen of an electronic device. Summary of the Invention

[0005] This application provides a protective film. When the protective film is impacted by the outside world, through multiple sub-buffer layers or at least one sub-buffer layer with a unique molecular energy absorption mechanism, the impact energy can be well absorbed. Furthermore, when applied to an electronic device, the impact protection effect on the screen can be achieved.

[0006] To achieve the above object, this application adopts the following technical solutions:

[0007] In a first aspect, a protective film is provided. The protective film includes: an adhesive layer, and a buffer layer and a film layer that are sequentially stacked on the adhesive layer along the OY direction. The buffer layer includes at least a first sub-buffer layer and a second sub-buffer layer. The Young's modulus of the material of the first sub-buffer layer is less than or equal to the Young's modulus of the material of the second sub-buffer layer. The energy absorption ratios of the materials of the first sub-buffer layer and the second sub-buffer layer both increase with the increase of the impact rate of an external object on the protective film.

[0008] An embodiment of this application provides a protective film. When being impacted by the outside world, first, the film layer contacts the impact. Since the Young's modulus of the film layer is relatively high, it can play a little role in isolating deformation, thereby absorbing a little impact energy. Then, the impact energy is transmitted to the buffer layer. Since the buffer layer has multiple sub-buffer layers, the impact energy can be well absorbed. Thus, after being absorbed by at least two sub-buffer layers, the impact energy transmitted to the adhesive layer is greatly weakened, so that the impact force absorption ratio of the protective film can be increased by at least 5 - 10%.

[0009] In a possible implementation of the first aspect, the relationship of the Young's modulus of the materials of each film layer satisfies: diaphragm layer (the value range of Young's modulus is 300 MPa - 10 GPa) ≥ second buffer layer (the value range of Young's modulus is 10 MPa - 1 GPa) ≥ first buffer layer (the value range of Young's modulus is 10 kPa - 50 MPa) ≥ bonding layer (the value range of Young's modulus is 10 kPa - 500 kPa).

[0010] In this implementation, it can provide support for the first sub-buffer layer and better exert the self-energy absorption level of the first sub-buffer layer.

[0011] In a possible implementation of the first aspect, when the impact rate is the preset rate, the energy absorption ratio of the material of the first sub-buffer layer is the same as that of the material of the second sub-buffer layer; when the impact rate is less than the preset rate, at the same impact rate, the energy absorption ratio of the material of the first sub-buffer layer is less than that of the material of the second sub-buffer layer; when the impact rate is greater than the preset rate, at the same impact rate, the energy absorption ratio of the material of the first sub-buffer layer is greater than that of the material of the second sub-buffer layer.

[0012] In this implementation, the impact energy not absorbed by the diaphragm layer can be effectively absorbed by multiple sub-buffer layers with a certain relationship, so as to achieve the impact protection effect of the protective film on the screen.

[0013] In a possible implementation of the first aspect, along the OY direction, the diaphragm layer, the first sub-buffer layer, and the second sub-buffer layer have the same thickness, and the value range of the thickness can include 20 μm - 100 μm; the value range of the thickness of the bonding layer can include 20 μm - 60 μm.

[0014] In this implementation, the protective film is neither too thin to exert a good anti-impact effect, nor too thick to affect the overall design of the electronic device.

[0015] In a possible implementation of the first aspect, the material of the first sub-buffer layer can be a sacrificial bond structure combined on a first main material such as TPU, polyurea, and silicone gel. This sacrificial bond structure can be dynamically reversibly damaged and recovered when subjected to external impact. The energy absorption ratio of the material of the first sub-buffer layer with the sacrificial bond structure is greater than that of the material of the first sub-buffer layer without the sacrificial bond structure. The sacrificial bond structure includes at least one of boron-oxygen bond, multiple hydrogen bonds, ionic bonds, host-guest interactions, and disulfide bonds.

[0016] In this implementation, due to the unique molecular energy absorption mechanism of the first sub-buffer layer, that is, the energy absorption ratio of the first sub-buffer layer is relatively high at high impact rates, it can effectively absorb the impact energy, so that the protective film achieves a good buffer energy absorption effect.

[0017] In a possible implementation of the first aspect, the material of the second sub-buffer layer can be designed for materials such as TPU, polyurea, and silicone gel in terms of the branched-chain content, network chain density, third component, etc., to obtain TPU with a molecular network, polyurea with a molecular network, and silicone gel with a molecular network.

[0018] In this implementation, the energy absorption ratio of the second sub-buffer layer obtained from the modified material at low impact rates can increase with the increase in the impact rate.

[0019] In a possible implementation of the first aspect, the protective film includes an adhesive layer, and a second sub-buffer layer, a first sub-buffer layer, and a film layer sequentially stacked on the adhesive layer. The material of the first sub-buffer layer includes a first main material and a sacrificial bond structure bonded to the first main material.

[0020] In this implementation, the impact energy not absorbed after passing through the film layer is first significantly absorbed by the first sub-buffer layer and then further absorbed by the second sub-buffer layer, greatly enhancing the buffering and energy absorption effect of the protective film.

[0021] In a possible implementation of the first aspect, the protective film includes an adhesive layer, and a first sub-buffer layer, a second sub-buffer layer, and a film layer sequentially stacked on the adhesive layer.

[0022] In this implementation, through the effective absorption of the two sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0023] In a possible implementation of the first aspect, the protective film includes an adhesive layer, and a second sub-buffer layer, a first sub-buffer layer, a second sub-buffer layer, and a film layer sequentially stacked on the adhesive layer.

[0024] In this implementation, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0025] In a possible implementation of the first aspect, the protective film includes an adhesive layer, and a second sub-buffer layer, a second sub-buffer layer, a first sub-buffer layer, and a film layer sequentially stacked on the adhesive layer.

[0026] In this implementation, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0027] In a possible implementation of the first aspect, the protective film includes an adhesive layer, and a second sub-buffer layer, a first sub-buffer layer, a first sub-buffer layer, and a film layer that are sequentially stacked on the adhesive layer.

[0028] In this implementation, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0029] In a possible implementation of the first aspect, the protective film includes an adhesive layer, and a first sub-buffer layer, a second sub-buffer layer, a first sub-buffer layer, and a film layer that are sequentially stacked on the adhesive layer.

[0030] In this implementation, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0031] In a possible implementation of the first aspect, the protective film includes an adhesive layer, and a first sub-buffer layer, a second sub-buffer layer, a second sub-buffer layer, and a film layer that are sequentially stacked on the adhesive layer.

[0032] In this implementation, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0033] In a possible implementation of the first aspect, the protective film includes an adhesive layer, and a first sub-buffer layer, a first sub-buffer layer, a second sub-buffer layer, and a film layer that are sequentially stacked on the adhesive layer.

[0034] In this implementation, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0035] In a possible implementation of the first aspect, the protective film includes an adhesive layer, and a second sub-buffer layer, an adhesive layer, a first sub-buffer layer, and a film layer that are sequentially stacked on the adhesive layer.

[0036] In this implementation, through the effective absorption of the two sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0037] In a possible implementation of the first aspect, the protective film includes an adhesive layer, and a first sub-buffer layer, an adhesive layer, a second sub-buffer layer, and a film layer that are sequentially stacked on the adhesive layer.

[0038] In this implementation manner, through the effective absorption of two sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0039] In a possible implementation manner of the first aspect, the protective film includes an adhesive layer, and a second sub-buffer layer, a first sub-buffer layer, a second sub-buffer layer, a first sub-buffer layer, and a film layer that are sequentially stacked on the adhesive layer.

[0040] In this implementation manner, through the effective absorption of four sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0041] In a possible implementation manner of the first aspect, the protective film includes an adhesive layer, and a first sub-buffer layer, a second sub-buffer layer, a first sub-buffer layer, a second sub-buffer layer, and a film layer that are sequentially stacked on the adhesive layer.

[0042] In this implementation manner, through the effective absorption of four sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0043] In the second aspect, a protective film is provided. The protective film includes: an adhesive layer, and a buffer layer and a film layer that are sequentially stacked on the adhesive layer along the OY direction. The buffer layer includes one or more first sub-buffer layers. The energy absorption ratio of the material of the first sub-buffer layer increases with the increase of the impact rate. The impact rate is the impact rate of an external object on the protective film. The material of the first sub-buffer layer has an impact-resistant structure. The impact-resistant structure is used to dynamically and reversibly break and recover when and after being impacted by an external object. The energy absorption ratio of the material of the first sub-buffer layer with the impact-resistant structure is greater than the energy absorption ratio of the material of the first sub-buffer layer without the impact-resistant structure.

[0044] The embodiment of the present application provides a protective film. When being impacted by an external object, first, the film layer contacts the impact. Due to the relatively high Young's modulus of the film layer, it can play a little role in isolating deformation, thereby absorbing a little impact energy. Then, the impact energy is transmitted to the buffer layer. Since the buffer layer has at least one sub-buffer layer with a unique molecular energy absorption mechanism, it can well absorb the impact energy. Thus, through the absorption of at least two sub-buffer layers, the impact energy transmitted to the adhesive layer is greatly weakened, so that the impact force absorption ratio of the protective film can be increased by at least 5-10%.

[0045] In a possible implementation manner of the second aspect, the protective film includes an adhesive layer, and a first sub-buffer layer and a film layer that are sequentially stacked on the adhesive layer.

[0046] In this implementation, through the effective absorption of the first sub-buffer layer of one layer, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0047] In a third aspect, an electronic device is provided, including the protective film in the first aspect or any possible implementation of the first aspect.

[0048] The embodiment of the present application provides an electronic device. When subjected to an external impact, the impact energy not absorbed by the diaphragm layer is transmitted to the buffer layer of the electronic device. Since the buffer layer has multiple sub-buffer layers or at least one sub-buffer layer with a unique molecular energy absorption mechanism, it can well absorb the impact energy. After being absorbed by the buffer layer, the impact energy transmitted to the surface of the electronic device screen can be greatly weakened, thereby achieving the impact protection effect on the screen and making the performance of the electronic device better.

[0049] In a fourth aspect, a method for preparing a protective film is provided, which is used to prepare the protective film in the first aspect or any possible implementation of the first aspect. The method for preparing the protective film includes:

[0050] Mix a certain mass of vinyl polysiloxane, a certain mass of hydrogen-containing polysiloxane, a certain mass of platinum-based catalyst, and a certain mass of coupling agent to obtain an uncured silicone gel monomer; then, coat the uncured silicone gel monomer on the surface of the diaphragm layer and cure it at a certain temperature; after that, use the method of roll-to-roll laminating to compound the silicone gel with the pre-cured second sub-buffer layer and the adhesive layer to obtain the protective film.

[0051] The embodiment of the present application provides a method for preparing a protective film, which is simple and easy to implement.

[0052] In a fifth aspect, a method for preparing a protective film is provided, which is used to prepare the protective film in the first aspect or any possible implementation of the first aspect. The method for preparing the protective film includes:

[0053] Mix a certain mass of vinyl polysiloxane, a certain mass of hydrogen-containing polysiloxane, a certain mass of platinum-based catalyst, and a certain mass of coupling agent to obtain an uncured silicone gel monomer; then, add a certain mass of polysiloxane containing boron-oxygen bonds to the uncured silicone gel monomer to obtain an uncured silicone gel containing boron-oxygen bonds; then, coat the uncured silicone gel containing boron-oxygen bonds on the surface of the diaphragm layer and cure it at a certain temperature; after that, use the method of roll-to-roll laminating to compound the silicone gel with the pre-cured second sub-buffer layer and the adhesive layer to obtain the protective film.

[0054] The embodiment of the present application provides a method for preparing a protective film, which is simple and easy to implement.

[0055] The embodiments of the present application provide a protective film and an electronic device. When the protective film is impacted by the outside world, the film layer first contacts the external object, thereby absorbing some impact energy. Then the impact energy will be transmitted to the buffer layer. Since the buffer layer has at least two sub-buffer layers or one first sub-buffer layer, it can effectively absorb the impact energy, thus obtaining a highly impact-resistant folding protective film. When the highly impact-resistant folding protective film is applied to an electronic device, the impact energy transmitted to the surface of the electronic device screen can be significantly weakened, achieving the impact protection effect on the screen and making the performance of the electronic device better. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 It is a schematic diagram of the overall structure of an electronic device provided by an embodiment of the present application;

[0057] Figure 2 is Figure 1 a schematic diagram of the disassembled structure of the electronic device in;

[0058] Figure 3 It is a schematic diagram of the structure of an electronic device in the related art provided by an embodiment of the present application;

[0059] Figure 4 It is a schematic diagram of the structure of the first protective film provided by an embodiment of the present application;

[0060] Figure 5 It is a schematic diagram of the structure of the second protective film provided by an embodiment of the present application;

[0061] Figure 6 It is a schematic diagram of the structure of the third protective film provided by an embodiment of the present application;

[0062] Figure 7 It is a schematic diagram of the structure of the fourth protective film provided by an embodiment of the present application;

[0063] Figure 8 It is a schematic diagram of the structure of the fifth protective film provided by an embodiment of the present application;

[0064] Figure 9 It is a schematic diagram of the structure of the sixth protective film provided by an embodiment of the present application;

[0065] Figure 10 It is a schematic diagram of the structure of the seventh protective film provided by an embodiment of the present application;

[0066] Figure 11 It is a schematic diagram of the structure of the eighth protective film provided by an embodiment of the present application;

[0067] Figure 12 It is a schematic diagram of the structure of the ninth protective film provided by an embodiment of the present application;

[0068] Figure 13Schematic diagram of the tenth protective film provided by the embodiments of the present application;

[0069] Figure 14 Schematic diagram of the eleventh protective film provided by the embodiments of the present application;

[0070] Figure 15 Schematic diagram of the twelfth protective film provided by the embodiments of the present application;

[0071] Figure 16 Schematic diagram of the thirteenth protective film provided by the embodiments of the present application;

[0072] Figure 17 Schematic diagram of the first electronic device provided by the embodiments of the present application;

[0073] Figure 18 Schematic diagram of the second electronic device provided by the embodiments of the present application;

[0074] Figure 19 Schematic diagram of the third electronic device provided by the embodiments of the present application;

[0075] Figure 20 Schematic diagram of the fourth electronic device provided by the embodiments of the present application;

[0076] Figure 21 Schematic diagram of the fifth electronic device provided by the embodiments of the present application;

[0077] Figure 22 Schematic diagram of the sixth electronic device provided by the embodiments of the present application;

[0078] Figure 23 Schematic diagram of the seventh electronic device provided by the embodiments of the present application;

[0079] Figure 24 Schematic diagram of the eighth electronic device provided by the embodiments of the present application;

[0080] Figure 25 Schematic diagram of the ninth electronic device provided by the embodiments of the present application;

[0081] Figure 26 Schematic diagram of the tenth electronic device provided by the embodiments of the present application;

[0082] Figure 27 Schematic diagram of the eleventh electronic device provided by the embodiments of the present application;

[0083] Figure 28 Schematic diagram of the twelfth electronic device provided by the embodiments of the present application;

[0084] Figure 29 Schematic diagram of the structure of the thirteenth electronic device provided by an embodiment of the present application;

[0085] Figure 30 Schematic diagram of the energy absorption characteristics of the first sub-buffer layer and the second sub-buffer layer provided by an embodiment of the present application;

[0086] Figure 31 Schematic diagram of the structure of an electronic device provided by an embodiment of the present application;

[0087] Figure 32 Schematic diagram of the structure of an electronic device in another related technology provided by an embodiment of the present application.

[0088] Reference numerals:

[0089] 01 - Mobile phone; 100 - Display screen; 33 - Middle frame; 102 - Rear shell; 103 - Circuit board assembly; 1031 - Main circuit board; 1032 - Electronic components; 104 - Battery; 105 - Transparent cover plate; 41 - Film layer; 42 - Adhesive layer; 43 - Single-layer buffer layer; 02 - Electronic device; 1 - Protective film; 11 - Film sheet layer; 12 - Bonding layer; 10 - Buffer layer; 13 - First sub-buffer layer; 14 - Second sub-buffer layer; OY - Along the direction perpendicular to the cover plate; h1 - Thickness of the film sheet layer; h2 - Thickness of the bonding layer; h3 - Thickness of the first sub-buffer layer; h4 - Thickness of the second sub-buffer layer; L1 - Energy absorption ratio of the first sub-buffer layer; L2 - Energy absorption ratio of the second sub-buffer layer; 2 - Cover plate; 3 - Display panel; 31 - Light-shielding layer; 32 - Adhesive layer; 15 - Substrate; AA - Display area; BM - Non-display area. Detailed implementation manners

[0090] Hereinafter, the technical solutions in the embodiments of the present application will be clearly and elaborately described with reference to the accompanying drawings.

[0091] Among them, in the description of the embodiments of the present application, unless otherwise specified, " / " means "or". For example, A / B may mean A or B; "and / or" in the text is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist simultaneously.

[0092] Hereinafter, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as implying or suggesting relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first", "second", and "third" may explicitly or implicitly include one or more of such features.

[0093] In the description of the embodiments of the present application, unless otherwise specified, "at least one" means one or more; "a plurality" means two or more.

[0094] The following is an explanatory description of some terms in the embodiments of the present application to facilitate better understanding by those skilled in the art.

[0095] 1. Young's modulus

[0096] Young's modulus is a type of elastic modulus, which refers to the elastic modulus along the longitudinal direction and can be used to describe the ability of a material to resist deformation. Among them, the elastic modulus is a physical quantity that describes the elasticity of a material. Specifically, when an external force is applied to a material, the shape of the material will change. In the elastic deformation stage of the material, the stress is proportional to the strain, and the proportionality coefficient is called the elastic modulus.

[0097] 2. Polyurea

[0098] Polyurea refers to an elastomeric substance formed by the reaction of isocyanate with amino compounds. Among them, the isocyanate can be a monomer, polymer, derivative, prepolymer, semi-prepolymer, etc.

[0099] 3. Thermoplastic polyurethane (TPU)

[0100] TPU, also known as thermoplastic polyurethane elastomer or thermoplastic polyurethane rubber, is a type of (AB)n block linear polymer. Among them, A is a polyester or polyether with a high molecular weight (for example, the molecular weight ranges from 1000 to 6000), B is a diol containing 2 to 12 straight-chain carbon atoms, and the chemical structure between the AB chain segments is a diisocyanate.

[0101] 4. Non-Newtonian fluid

[0102] A non-Newtonian fluid refers to a fluid that does not satisfy Newton's viscosity experimental law, that is, a fluid in which the shear stress and the shear strain rate are not linearly related.

[0103] 5. Material energy absorption characteristics

[0104] The material energy absorption characteristics refer to the characteristics that when a material is subjected to impact or collision, the material can absorb and disperse energy, thereby reducing the impact force or collision force on other components or structures. Among them, the material energy absorption can have an energy absorption ratio, and the energy absorption ratio refers to the ratio of the energy absorption value of the material after being subjected to impact to the total impact energy value.

[0105] The above is a simple introduction to the terms involved in the embodiments of the present application, and will not be elaborated below.

[0106] To better understand the embodiments of the present application, the application background of the present application is introduced here first.

[0107] The embodiments of the present application provide an electronic device, and no specific limitation is imposed on the specific type of the electronic device here. In some embodiments, the electronic device provided by the present application may include consumer electronic products, home electronic products, vehicle-mounted electronic products, financial terminal electronic products, communication electronic products, etc.

[0108] Among them, consumer electronic products may include mobile phones, tablets, laptops, notebook computers, handheld computers, personal computers (PCs), e-readers, desktop monitors, cellular phones, drones, personal digital assistants (PDAs), smart wearable devices (such as smart bracelets, smart watches, earphones, etc.), ultra-mobile personal computers (UMPCs), augmented reality (AR) / virtual reality (VR) devices and other Internet of Things (IOT) devices. Home electronic products may include televisions, smart door locks, remote controls, refrigerators, rechargeable household small appliances (such as soybean milk machines, floor sweeping robots, etc.), printers, projectors, etc. Vehicle-mounted electronic products may include vehicle-mounted navigators, vehicle-mounted high-density digital video discs (DVDs), etc. Financial terminal electronic products may include automated teller machines (ATMs), terminals for self-service business handling, etc. Communication electronic products may include communication devices such as servers, memories, base stations, etc.

[0109] For the convenience of description, please refer to Figure 1 and Figure 2 , Figure 1 which is an overall schematic diagram of an electronic device applicable to some embodiments of the present application, Figure 2 is Figure 1 a split schematic diagram of the electronic device shown in Figure 1 and Figure 2 The electronic devices shown in

[0110] are all illustrated by taking a phablet as an example.

[0111] In Figure 1 and Figure 2In the example, the electronic device includes a display screen 100, a middle frame 33, a rear shell 102, a circuit board assembly 103, a battery 104, etc.

[0112] It can be understood that Figure 1 and Figure 2 and the related drawings in the following only schematically show some components in the electronic device, and the actual shapes, sizes, positions, structures, etc. of these components are not limited by Figure 1 and Figure 2 and the limitations of each drawing in the following.

[0113] Now, the specific structure of the electronic device applicable to the embodiments of the present application will be further elaborated.

[0114] Please refer to Figure 1 and Figure 2 , taking the electronic device as a mobile phone 01 as an example, the mobile phone 01 includes a display screen 100 and a middle frame 33, and the display screen 100 is located on one side of the middle frame 33.

[0115] In the application, the display screen 100 can be used to display images, videos, etc.

[0116] It should be noted that the display screen 100 can be any one of a liquid crystal display (LCD), an organic light emitting diode (OLED) display screen, a mini light emitting diode (Mini LED) display screen, a micro light emitting diode (Micro LED) display screen, etc.

[0117] As Figure 2 shown, the mobile phone 01 further includes a light-transmitting cover plate 105, and the light-transmitting cover plate 105 can be stacked with the display screen 100 and is mainly used to protect the display screen 100, prevent dust, etc.

[0118] In Figure 1 the embodiment shown, the shape of the electronic device can be a rectangular flat shape. Of course, the shape of the electronic device can also be any other shape, specifically subject to the actual application.

[0119] Please refer to Figure 2 , the mobile phone 01 further includes other structures such as a rear shell 102, a circuit board assembly 103, and a battery 104.

[0120] Among them, the rear shell 102 can be disposed on the side of the middle frame 33 away from the display screen 100; and, an internal accommodation space of the mobile phone 01 can be formed between the rear shell 102 and the middle frame 33, and structures such as the circuit board assembly 103 and the battery 104 can be accommodated in this internal accommodation space.

[0121] Among them, the battery 104 can be used to supply power to structures such as the display screen 100 and the circuit board assembly 103 in the mobile phone 01.

[0122] For another example Figure 2 As shown, the circuit board assembly 103 can include a main circuit board 1031, electronic components 1032, etc. Among them, the main circuit board 1031 can be used to carry the electronic components 1032 and complete signal interaction with the electronic components 1032.

[0123] Figure 2 Taking the circuit board assembly 103 including two electronic components 1032 as an example for illustration. Of course, the number of the electronic components 1032 is not limited to two, and it is subject to the actual application.

[0124] In application, the main circuit board 1031 can include printed circuit boards (PCBs), flexible printed circuits (FPCs), etc.

[0125] It should be understood that the electronic components 1032 can include but are not limited to chips, resistors, capacitors, inductors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, subscriber identity module (SIM) card holders, etc.

[0126] In actual application, the rear shell 102 can include a back cover ( Figure 2 not shown in the figure), a frame ( Figure 2 not shown in the figure), and other structures.

[0127] Among them, the back cover can be disposed on the side of the display screen 100 away from the light-transmitting cover plate 105 and is stacked with the light-transmitting cover plate 105 and the display screen 100.

[0128] The frame can be disposed between the back cover and the light-transmitting cover plate 105 and is fixed to the back cover.

[0129] The light-transmitting cover plate 105 can be fixed to the frame.

[0130] In an application, when the electronic device does not include the middle frame 33, the circuit board assembly 103, the battery 104, etc. can be fixed to the surface of the display screen 100 close to the back cover side; or, the circuit board assembly 103, the battery 104, etc. can also be fixed to the inner surface of the back cover.

[0131] In some embodiments, a battery installation groove ( Figure 2 not shown in ) may be provided on the surface of the middle frame 33 facing the back cover, and the battery 104 can be installed in the battery installation groove, subject to actual applications.

[0132] In addition, the above mobile phone 01 may further include other structures such as a microphone, a speaker, a camera, etc.

[0133] Only the content related to the inventive point is introduced here, and the rest will not be elaborated.

[0134] The following describes the protective film provided in the related art.

[0135] Currently, electronic devices, such as mobile phones, etc., are becoming more and more widely used. The display screen, that is, the screen, is an important component of the electronic device. During the production, factory, assembly, and subsequent use of the electronic device, in order to prevent the screen from being scratched, scuffed, broken, or damaged by heavy objects, etc., a protective film is generally attached to the surface of the screen cover to protect the screen.

[0136] With the development of technology, foldable electronic devices have received more and more extensive research and application. For example, a foldable screen mobile phone is one of the foldable electronic devices. In order to meet the bendable characteristics, a large amount of flexible polymer materials are usually used in the design of the screen of the current foldable screen mobile phone. Therefore, when impacted by an external object, the screen of the foldable screen mobile phone is prone to display defects such as broken bright spots and black spots. At this time, the above protective film can be attached to the screen surface to improve the scratch resistance, impact resistance, and other properties of the screen.

[0137] As an example, as Figure 3 shown, a cover plate 2 and a protective film 1 are sequentially stacked on the display panel 3. The protective film 1 usually includes two layers: a film material layer 41 and an adhesive layer 42. The adhesive layer 42 is disposed between the film material layer 41 and the cover plate 2 and is used to bond the film material layer 41 and the cover plate 2. At this time, the protective film 1 is a traditional non - impact - resistant foldable protective film.

[0138] Among them, the elastic modulus of the film material layer 41 itself is usually relatively high. Then, when impacted by an external object, the buffer and energy absorption effect of the film material layer 41 is limited. And the adhesive layer 42 mainly plays a bonding role, and the cross - linking density of the adhesive layer 42 molecules is relatively high, without a buffer and energy absorption effect.

[0139] As another example, in a traditional impact-resistant folding protective film, a film layer with buffer energy absorption characteristics is usually designed in the protective film. However, the buffer energy absorption is often small, and a good buffer energy absorption effect cannot be achieved.

[0140] It can be seen from this that whether it is the traditional non-impact-resistant folding protective film in the related art or the traditional impact-resistant folding protective film in the related art, the protective film either has no impact resistance or has poor impact resistance, resulting in a failure to achieve a good buffer energy absorption effect.

[0141] In view of this, the present application provides a protective film. When the protective film is subjected to an external impact, first, the film sheet layer contacts the impact. Due to the relatively high Young's modulus of the film sheet layer, it can play a little role in isolating deformation, thereby absorbing a little impact energy. Then, the impact energy is transmitted to the buffer layer. Since the buffer layer has multiple sub-buffer layers or at least one sub-buffer layer with a unique molecular energy absorption mechanism, it can well absorb the impact energy. Thus, after being absorbed by at least two sub-buffer layers, the impact energy transmitted to the adhesive layer is greatly weakened, so that the impact force absorption ratio of the protective film can be increased by at least 5-10%. In addition, this protective film can be applied to the screen protection of almost all consumer electronic products.

[0142] Furthermore, the present application provides an electronic device. When the electronic device is subjected to an external impact, first, the film sheet layer contacts the external impact. Due to the relatively high Young's modulus of the film sheet layer, it can play a little role in isolating deformation, thereby absorbing a little impact energy. Then, the impact energy is transmitted into the buffer layer. Since the buffer layer has multiple sub-buffer layers or at least one sub-buffer layer with a unique molecular energy absorption mechanism, it can well absorb the impact energy. In this way, after being absorbed by the buffer layer, the impact energy transmitted to the surface of the electronic device screen can be greatly weakened, thereby achieving the impact protection effect on the screen and making the performance of the electronic device better.

[0143] Please refer to the following Figures 4 to 16 for a detailed introduction to the protective film 1 provided by the embodiments of the present application.

[0144] As an example, as Figures 4 to 15 shown, the protective film 1 provided by the embodiments of the present application may include: an adhesive layer 12, and a buffer layer 10 and a film sheet layer 11 that are sequentially stacked on the adhesive layer 12 along the OY direction. The buffer layer 10 at least includes a first sub-buffer layer 13 and a second sub-buffer layer 14. The Young's modulus of the material of the first sub-buffer layer 13 is less than or equal to the Young's modulus of the material of the second sub-buffer layer 14, and both the first sub-buffer layer 13 and the second sub-buffer layer 14 have shear thickening non-Newtonian fluid characteristics, that is, the energy absorption ratio of the material of the first sub-buffer layer 13 and the energy absorption ratio of the material of the second sub-buffer layer 14 both increase with the increase of the impact rate, and this impact rate is the impact rate of an external object on the protective film 1.

[0145] As another example, Figure 16 As shown, the protective film 1 provided in the embodiment of the present application may include: an adhesive layer 12, and a buffer layer and a film layer 11 sequentially stacked on the adhesive layer 12 along the OY direction. The buffer layer includes one or more first sub-buffer layers 13. The energy absorption ratio of the material of the first sub-buffer layer 13 increases with the increase of the impact rate. The impact rate is the impact rate of an external object on the protective film. The material of the first sub-buffer layer 13 has an impact-resistant structure. The impact-resistant structure is used to dynamically and reversibly break and recover when and after being impacted by an external object. The energy absorption ratio of the material of the first sub-buffer layer with the impact-resistant structure is greater than that of the material of the first sub-buffer layer without the impact-resistant structure.

[0146] In practical applications, when the above-mentioned protective film 1 is applied to an electronic device, the electronic device may further include at least a display panel and a cover plate. The cover plate is disposed on one side of the display panel. The adhesive layer 12 is disposed close to the cover plate and is used to bond the buffer layer 10 to the cover plate. Of course, it is not limited thereto. The above-mentioned protective film 1 may also be applied to other scenarios, and the present application does not make specific limitations thereto.

[0147] There is no specific limitation on the above-mentioned external object. Exemplarily, the external object may include a heavy object, a heavy ball, etc.

[0148] It should be understood that the above-mentioned buffer layer including at least the first sub-buffer layer and the second sub-buffer layer means that: the buffer layer may only include the first sub-buffer layer and the second sub-buffer layer. At this time, there is no limitation on the specific number of the first sub-buffer layer and the second sub-buffer layer. Specifically, the number of the first sub-buffer layer may be one or more layers, and the number of the second sub-buffer layer may be one or more layers; or, in addition to including the first sub-buffer layer and the second sub-buffer layer, the buffer layer may further include other film layers. For example, a third sub-layer. At this time, there is no limitation on the specific number of the other film layers. Specifically, the number of the other film layers may be one or more layers, and no specific limitation is made here.

[0149] In the application, the Young's modulus of the materials of the above-mentioned diaphragm layer, first sub-buffer layer, second sub-buffer layer, and bonding layer is not specifically limited. Exemplarily, the relationship of the Young's modulus of the materials of each film layer can satisfy: diaphragm layer (the value range of Young's modulus is 300 MPa - 10 GPa) ≥ second buffer layer (the value range of Young's modulus is 10 MPa - 1 GPa) ≥ first buffer layer (the value range of Young's modulus is 10 kPa - 50 MPa) ≥ bonding layer (the value range of Young's modulus is 10 kPa - 500 kPa). Specifically, the Young's modulus of the material of the first sub-buffer layer can be 10 kPa, 1 MPa, 10 MPa, 20 MPa, 40 MPa, or 50 MPa, etc. The Young's modulus of the material of the second buffer layer can be 10 MPa, 100 MPa, 300 MPa, 600 MPa, 700 MPa, or 1 GPa, etc. The Young's modulus of the material of the diaphragm layer can be 300 MPa, 500 MPa, 800 MPa, 900 MPa, 1 GPa, or 10 GPa, etc. The Young's modulus of the material of the bonding layer can be 10 kPa, 100 kPa, 200 kPa, 300 kPa, 400 kPa, or 500 kPa, etc.

[0150] In the application, the specific thicknesses of the above-mentioned diaphragm layer, first sub-buffer layer, second sub-buffer layer, and bonding layer are not limited. If the thicknesses of the first sub-buffer layer and the second sub-buffer layer are too thin, they cannot play a good anti-impact role. If the thicknesses of the first sub-buffer layer and the second sub-buffer layer are too thick, it may cause the protective film to be too thick, thereby affecting the overall design of the electronic device. Thus, in order for the buffer layer to play a good anti-impact effect and also considering the overall use scenario of the device, the embodiments of the present application can design the above Young's modulus and the thicknesses of the following film layers. In addition, the gradient matching design of the Young's modulus of the first sub-buffer layer and the second sub-buffer layer, that is, the Young's modulus of the second sub-buffer layer > the Young's modulus of the first sub-buffer layer, can also provide support for the first sub-buffer layer and better exert the self-energy absorption level of the first sub-buffer layer.

[0151] Exemplarily, the thicknesses of the above-mentioned diaphragm layer, first sub-buffer layer, and second sub-buffer layer can be the same. For example, as Figures 4 to 16 shown, along the OY direction, the value range of the thickness h3 of the first sub-buffer layer 13 can include 20 μm - 100 μm. Specifically, the thickness h3 of the first sub-buffer layer 13 can be 20 μm, 40 μm, 50 μm, 70 μm, 90 μm, or 100 μm, etc.

[0152] It should be noted that the thickness h1 of the diaphragm layer 11 and the thickness h4 of the second sub-buffer layer 14 can refer to the thickness h3 of the first sub-buffer layer 13, which will not be elaborated here.

[0153] Exemplarily, as Figures 4 to 16As shown, along the OY direction, the value range of the thickness h2 of the bonding layer 12 may include 20μm - 60μm. Specifically, the thickness of the bonding layer can be 20μm, 30μm, 40μm, 45μm, 50μm, 60μm, etc.

[0154] The buffer layer in the embodiments of the present application is usually soft in texture and has a buffer energy absorption effect. In practical applications, the material of the first sub - buffer layer is not specifically limited. Exemplarily, the material of the first sub - buffer layer can be materials such as TPU, polyurea, silicone gel, etc.; or the material of the first sub - buffer layer can be a material obtained by modifying the first main materials such as TPU, polyurea, silicone gel, etc. For example, an impact - resistant structure can be combined on materials such as TPU, polyurea, silicone gel, etc. to obtain the first sub - buffer layer.

[0155] The material of the second sub - buffer layer is not specifically limited. Exemplarily, the material of the second sub - buffer layer can be materials such as TPU, polyurea, silicone gel, etc.; or the material of the second sub - buffer layer can be a material obtained by modifying materials such as TPU, polyurea, silicone gel, etc. For example, a molecular network design can be carried out on materials such as TPU, polyurea, silicone gel, etc. to obtain the second sub - buffer layer.

[0156] It should be noted that the energy absorption mechanism of TPU mainly comes from its unique soft - hard segment micro - phase separation structure, but the modulus of TPU itself is relatively high, usually between 10MPa - 1GPa. If TPU is not modified, its buffer energy absorption effect is limited.

[0157] After materials such as TPU, polyurea, silicone gel, etc. are modified, the materials of the first sub - buffer layer and the second sub - buffer layer are different and their properties are completely different. Specifically, when the Young's modulus of the material of the first sub - buffer layer is less than or equal to the Young's modulus of the material of the second sub - buffer layer, and the energy absorption ratio of the material of the first sub - buffer layer and the energy absorption ratio of the material of the second sub - buffer layer both increase with the increase of the impact rate, after materials such as TPU, polyurea, silicone gel, etc. are modified, it can be made that the energy absorption ratio of the material of the first sub - buffer layer becomes larger with the increase of the impact rate at high impact rates, and the energy absorption ratio of the material of the second sub - buffer layer becomes larger with the increase of the impact rate at low impact rates.

[0158] In the application, the structure of the above - mentioned cover plate is a three - dimensional structure, but for the convenience of description, the embodiments of the present application can regard the cover plate as a two - dimensional structure. Thus, the OY direction in the embodiments of the present application is along the direction perpendicular to the cover plate.

[0159] One side of the above-mentioned adhesive layer is used for bonding with the buffer layer, and the other side is used for bonding with other structures in the electronic device (such as the cover plate). There is no specific limitation on the material of the adhesive layer. Exemplarily, the material of the adhesive layer can be sticky materials such as acrylate, silicone gel, polyurethane, etc. For example, the optical adhesive (OCA) in optically clear adhesive. It should be noted that the adhesive layer can only play a bonding role, and its molecular self-crosslinking density is relatively high, without buffer and energy absorption characteristics.

[0160] In application, there is no limitation on the specific structure of the above-mentioned protective film. Exemplarily, the protective film can only include a film layer and an adhesive layer; or, in addition to the film layer and the adhesive layer, the protective film can also include other film layers, specifically subject to actual application.

[0161] There is no specific limitation on the specific material of the above-mentioned film layer. Exemplarily, the material of the film layer can be polyethylene terephthalate (PET), TPU, etc.

[0162] In application, there is no specific limitation on the preparation process of the above-mentioned protective film. As an example, taking the material of the first sub-buffer layer as silicone gel without sacrificial bond structure: First, mix a certain mass of vinyl polysiloxane, a certain mass of hydrogen-containing polysiloxane, a certain mass of platinum-based catalyst, and a certain mass of coupling agent to obtain an uncured silicone gel monomer; then, coat the uncured silicone gel monomer on the surface of PET and cure it at a certain temperature; after that, use the method of roll-to-roll lamination to compound the silicone gel with the pre-cured TPU layer and OCA layer to obtain the protective film.

[0163] There is no specific limitation on the mass of the above-mentioned vinyl polysiloxane, hydrogen-containing polysiloxane, platinum-based catalyst, and coupling agent. Exemplarily, the value range of the mass of vinyl polysiloxane can include 50 - 80 g. Specifically, the mass of vinyl polysiloxane can be 50 g, 60 g, 70 g, or 80 g, etc.; the value range of the mass of hydrogen-containing polysiloxane can include 20 - 50 g. Specifically, the mass of hydrogen-containing polysiloxane can be 20 g, 30 g, 40 g, or 50 g, etc.; the value range of the mass of platinum-based catalyst can include 0.1 - 5 g. Specifically, the mass of platinum-based catalyst can be 0.1 g, 1 g, 3 g, or 5 g, etc.; the value range of the mass of coupling agent can include 0.1 - 3 g. Specifically, the mass of coupling agent can be 0.1 g, 1 g, 2 g, or 3 g, etc.

[0164] The above-mentioned curing temperature is not specifically limited. Exemplarily, the value range of the curing temperature may include 130°C - 150°C. Specifically, the curing temperature may be 130°C, 140°C, or 150°C, etc.

[0165] As another example, taking the material of the first sub-buffer layer as silicone gel with sacrificial bond structure: First, a certain mass of vinyl polysiloxane, a certain mass of hydrogen-containing polysiloxane, a certain mass of platinum-based catalyst, and a certain mass of coupling agent are mixed to prepare an uncured silicone gel monomer; then, a certain mass of boron-oxygen bond-containing polysiloxane is added to the uncured silicone gel monomer to prepare an uncured boron-oxygen bond-containing silicone gel; then, after coating the uncured boron-oxygen bond-containing silicone gel on the PET surface, it is cured at a certain temperature; after that, the silicone gel is laminated with the pre-cured TPU layer and OCA layer by using the roll-to-roll laminating method to obtain a protective film.

[0166] The addition amount of the above-mentioned boron-oxygen bond-containing polysiloxane is not specifically limited. Exemplarily, the value range of the addition amount of the boron-oxygen bond-containing polysiloxane may include 10 - 70 g. Specifically, the addition amount of the boron-oxygen bond-containing polysiloxane may be 10 g, 20 g, 50 g, 60 g, or 70 g, etc.

[0167] It should be noted that the preparation of the uncured silicone gel monomer in this example can refer to the above example and will not be elaborated here.

[0168] When the protective film provided by the embodiment of the present application is impacted by the outside world, first, the film layer contacts the impact. Since the Young's modulus of the film layer is relatively high, it can play a little role in isolating deformation and thus absorb a little impact energy; then, the impact energy is transmitted to the buffer layer. Since the buffer layer has multiple sub-buffer layers or at least one sub-buffer layer with at least one unique molecular energy absorption mechanism, it can absorb the impact energy well. Thus, after being absorbed by at least two sub-buffer layers, the impact energy transmitted to the bonding layer is greatly weakened. In this way, when the high-impact-resistant folding protective film of the embodiment of the present application is applied to an electronic device, the impact energy on the screen surface of the electronic device can be greatly weakened, so that the impact force absorption ratio of the protective film can be increased by at least 5 - 10%, thereby achieving the impact protection effect on the screen.

[0169] Optionally, as a feasible way, as Figure 30 shown, the energy absorption ratio L1 of the material of the first sub-buffer layer increases with the increase of the impact rate, and the energy absorption ratio L2 of the material of the second sub-buffer layer also increases with the increase of the impact rate. At the same time, when the impact rate is the preset impact rate, the energy absorption ratio of the material of the first sub-buffer layer is the same as that of the material of the second sub-buffer layer. Among them, Figure 30 the abscissa in is the impact rate, the unit is m / s, and the ordinate is the energy absorption ratio.

[0170] When the impact rate is in the first rate range, that is, when the impact rate is less than the preset rate, with the same impact rate, the energy absorption ratio of the first sub-buffer layer is less than that of the second sub-buffer layer; when the impact rate is in the second rate range, that is, when the impact rate is greater than the preset rate, with the same impact rate, the energy absorption ratio of the first sub-buffer layer is greater than that of the second sub-buffer layer.

[0171] The protective film provided by the embodiment of the present application, by designing the monomer energy absorption characteristics of the first sub-buffer layer and the second sub-buffer layer as Figure 30 shown, that is, the higher the impact rate, the greater the energy absorption ratio. In this way, through the combination of at least a double-layer sub-buffer layer with shear thickening non-Newtonian fluid characteristics, the buffer layer can have the characteristic of gradually absorbing impact energy, thereby achieving a better buffer energy absorption effect.

[0172] Optionally, as an implementable way, the material of the first sub-buffer layer may include a first main material and an impact-resistant structure bonded to the first main material. The first main material may be one or a combination of TPU, polyurea, and silicone gel. The impact-resistant structure may be a sacrificial bond structure of one or more of boron-oxygen (B-O) bonds, multiple hydrogen bonds, ionic bonds, host-guest interactions, and disulfide bonds. The sacrificial bond structure is used to dynamically and reversibly break and recover after being subjected to an external impact, and the energy absorption ratio of the material of the first sub-buffer layer with the impact-resistant structure is greater than that of the material of the first sub-buffer layer without the impact-resistant structure.

[0173] It should be understood that the above-mentioned sacrificial bond structure being able to dynamically and reversibly break and recover after being subjected to an external impact means that some specific chemical bonds in the sacrificial bond structure will break when subjected to an external impact and can be reconnected after the impact. Since these chemical bonds consume energy during the breaking process, impact energy can be absorbed.

[0174] Exemplarily, the material of the above-mentioned first sub-buffer layer may be Since the material of the first sub-buffer layer contains multiple B-O bonds, these B-O bonds can break when subjected to an impact and bond after the impact. Since the B-O bonds consume energy during the breaking process, impact energy can be absorbed.

[0175] In practical applications, the material of the second sub-buffer layer can be designed for materials such as TPU, polyurea, and silicone gel in terms of the branched-chain content, network chain density, third component, etc., so as to adjust the second sub-buffer layer to have a higher energy absorption ratio at low impact rates. At this time, since the adjustment method of the second sub-buffer layer is molecular network design and does not involve the introduction of sacrificial bonds, the shear thickening non-Newtonian fluid property of its material is weaker than that of the material of the first sub-buffer layer. Thus, it can be achieved that at low impact rates (impact rates within the first rate range), the energy absorption ratio of the first sub-buffer layer < the energy absorption ratio of the second sub-buffer layer, and at high impact rates (impact rates within the second rate range), the energy absorption ratio of the first sub-buffer layer > the energy absorption ratio of the second sub-buffer layer.

[0176] Due to the unique molecular energy absorption mechanism of the first sub-buffer layer in the protective film provided by the embodiments of the present application, that is, the energy absorption ratio of the material of the first sub-buffer layer is relatively high at high impact rates, it can effectively absorb the impact energy, so that the protective film achieves a good buffer energy absorption effect.

[0177] The protective film provided by the embodiments of the present application will be specifically introduced below through multiple embodiments.

[0178] Embodiment 1

[0179] Figure 4 Fig. shows a schematic structural diagram of a protective film 1.

[0180] As Figure 4 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a second sub-buffer layer 14, a first sub-buffer layer 13, and a film layer 11 that are sequentially stacked on the adhesive layer 12. Among them, the material of the first sub-buffer layer 13 includes a first main material and a sacrificial bond structure bonded to the first main material. At this time, at low impact rates, the energy absorption ratio of the material of the first sub-buffer layer < the energy absorption ratio of the material of the second sub-buffer layer, and at high impact rates, the energy absorption ratio of the material of the first sub-buffer layer > the energy absorption ratio of the material of the second sub-buffer layer.

[0181] When the protective film provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed after passing through the film layer is first transmitted to the first sub-buffer layer of one layer. At this time, the impact rate is very high. However, due to the unique molecular energy absorption mechanism of the first sub-buffer layer, that is, the energy absorption ratio of the material of the first sub-buffer layer is relatively high at a high impact rate, the impact energy can be effectively absorbed, so as to absorb a large amount of impact energy as the main absorption layer; then after being absorbed by the first sub-buffer layer, the unabsorbed impact energy will be further transmitted to the second sub-buffer layer of one layer. At this time, the impact rate drops significantly, and since the energy absorption ratio of the material of the second sub-buffer layer is higher at a low impact rate, these impact energies can be further absorbed by the second sub-buffer layer, thereby greatly enhancing the buffering and energy absorption effect of the protective film.

[0182] Example Two

[0183] Figure 5 Schematically shows a structural diagram of a protective film 1.

[0184] As Figure 5 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a first sub-buffer layer 13, a second sub-buffer layer 14, and a film layer 11 that are sequentially stacked on the adhesive layer 12.

[0185] When the protective film provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed after passing through the film layer is sequentially transmitted to the second sub-buffer layer of one layer and the first sub-buffer layer of one layer. At this time, through the effective absorption of the two sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0186] Example Three

[0187] Figure 6 Schematically shows a structural diagram of a protective film 1.

[0188] As Figure 6 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a second sub-buffer layer 14, a first sub-buffer layer 13, a second sub-buffer layer 14, and a film layer 11 that are sequentially stacked on the adhesive layer 12.

[0189] For the protective film provided by the embodiment of the present application, when it is impacted by the outside world, the impact energy that is not absorbed after passing through the film layer is sequentially transmitted to the second sub-buffer layer of one layer, the first sub-buffer layer of one layer, and the second sub-buffer layer of one layer. At this time, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0190] Example Four

[0191] Figure 7 It shows a schematic structural diagram of a protective film 1.

[0192] As Figure 7 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a second sub-buffer layer 14, a second sub-buffer layer 14, a first sub-buffer layer 13 and a film layer 11 that are sequentially stacked on the adhesive layer 12.

[0193] When the protective film provided by the embodiment of the present application is subjected to an external impact, the impact energy that is not absorbed after passing through the film layer is sequentially transmitted to the first sub-buffer layer of one layer, the second sub-buffer layer of one layer and the second sub-buffer layer of one layer. At this time, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0194] Embodiment Five

[0195] Figure 8 It shows a schematic structural diagram of a protective film 1.

[0196] As Figure 8 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a second sub-buffer layer 14, a first sub-buffer layer 13, a first sub-buffer layer 13 and a film layer 11 that are sequentially stacked on the adhesive layer 12.

[0197] When the protective film provided by the embodiment of the present application is subjected to an external impact, the impact energy that is not absorbed after passing through the film layer is sequentially transmitted to the first sub-buffer layer of one layer, the first sub-buffer layer of one layer and the second sub-buffer layer of one layer. At this time, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0198] Embodiment Six

[0199] Figure 9 It shows a schematic structural diagram of a protective film 1.

[0200] As Figure 9 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a first sub-buffer layer 13, a second sub-buffer layer 14, a first sub-buffer layer 13 and a film layer 11 that are sequentially stacked on the adhesive layer 12.

[0201] When the protective film provided by the embodiment of the present application is subjected to an external impact, the impact energy that is not absorbed after passing through the film layer is sequentially transmitted to the first sub-buffer layer of one layer, the second sub-buffer layer of one layer and the first sub-buffer layer of one layer. At this time, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0202] Example VII

[0203] Figure 10 The structural schematic diagram of a protective film 1 is shown.

[0204] As Figure 10 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a first sub-buffer layer 13, a second sub-buffer layer 14, a second sub-buffer layer 14 and a film layer 11 which are sequentially laminated on the adhesive layer 12.

[0205] When the protective film provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed after passing through the film layer is sequentially transmitted to the second sub-buffer layer of one layer, the second sub-buffer layer of one layer and the first sub-buffer layer of one layer. At this time, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0206] Example VIII

[0207] Figure 11 The structural schematic diagram of a protective film 1 is shown.

[0208] As Figure 11 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a first sub-buffer layer 13, a first sub-buffer layer 13, a second sub-buffer layer 14 and a film layer 11 which are sequentially laminated on the adhesive layer 12.

[0209] When the protective film provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed after passing through the film layer is sequentially transmitted to the second sub-buffer layer of one layer, the first sub-buffer layer of one layer and the first sub-buffer layer of one layer. At this time, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0210] Example IX

[0211] Figure 12 The structural schematic diagram of a protective film 1 is shown.

[0212] As Figure 12 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a second sub-buffer layer 14, an adhesive layer 12, a first sub-buffer layer 13 and a film layer 11 which are sequentially laminated on the adhesive layer 12.

[0213] When the protective film provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed after passing through the film layer is sequentially transmitted to the first sub-buffer layer of one layer, the adhesive layer of one layer, and the second sub-buffer layer of one layer. At this time, through the effective absorption of the two sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0214] Embodiment Ten

[0215] Figure 13 Fig. shows a schematic structural diagram of a protective film 1.

[0216] As Figure 13 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a first sub-buffer layer 13, an adhesive layer 12, a second sub-buffer layer 14, and a film layer 11 that are sequentially stacked on the adhesive layer 12.

[0217] When the protective film provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed after passing through the film layer is sequentially transmitted to the second sub-buffer layer of one layer, the adhesive layer of one layer, and the first sub-buffer layer of one layer. At this time, through the effective absorption of the two sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0218] Embodiment Eleven

[0219] Figure 14 Fig. shows a schematic structural diagram of a protective film 1.

[0220] As Figure 14 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a second sub-buffer layer 14, a first sub-buffer layer 13, a second sub-buffer layer 14, a first sub-buffer layer 13, and a film layer 11 that are sequentially stacked on the adhesive layer 12.

[0221] When the protective film provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed after passing through the film layer is sequentially transmitted to the first sub-buffer layer of one layer, the second sub-buffer layer of one layer, the first sub-buffer layer of one layer, and the second sub-buffer layer of one layer. At this time, through the effective absorption of the four sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0222] Embodiment Twelve

[0223] Figure 15 Fig. shows a schematic structural diagram of a protective film 1.

[0224] As Figure 15As shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a first sub-buffer layer 13, a second sub-buffer layer 14, a first sub-buffer layer 13, a second sub-buffer layer 14, and a film layer 11 that are sequentially stacked on the adhesive layer 12.

[0225] When the protective film provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed after passing through the film layer is sequentially transmitted to the second sub-buffer layer of one layer, the first sub-buffer layer of one layer, the second sub-buffer layer of one layer, and the first sub-buffer layer of one layer. At this time, through the effective absorption of the four sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0226] Embodiment Thirteen

[0227] Figure 16 Schematically shows a structural schematic diagram of a protective film 1.

[0228] As Figure 16 shown, along the OY direction, the protective film 1 includes an adhesive layer 12, and a first sub-buffer layer 13 and a film layer 11 that are sequentially stacked on the adhesive layer 12.

[0229] When the protective film provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed after passing through the film layer is transmitted to the first sub-buffer layer of one layer. At this time, through the effective absorption of the first sub-buffer layer, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0230] Of course, it is not limited to the above-mentioned protective film, and other structures of the protective film can also be designed, which will not be specifically described one by one here.

[0231] Next, please refer to Figures 17 to 29 , and a detailed introduction to the electronic device 02 provided by the embodiment of the present application will be given.

[0232] As Figures 17 to 29 shown, the electronic device 02 provided by the embodiment of the present application may include: a display panel 3, a cover plate 2, and a protective film 1. The display panel 3 includes an adjacent display area AA and a non-display area BM. The cover plate 2 is disposed on the display panel 3, and the protective film 1 is disposed on the cover plate 2. Among them, both the cover plate 2 and the protective film 1 are located in the display area AA and the non-display area BM. The adhesive layer 12 in the protective film 1 is used to bond the buffer layer to the cover plate 2.

[0233] In the application, the specific type of the above display panel is not limited. Exemplarily, the display panel may be a rigid display panel. For example, it may be a liquid crystal display (LCD) panel of types such as twisted nematic (TN type), vertical alignment (VA type), in-plane switching (IPS type), advanced superdimension switch (ADS type), etc.; or the display panel may be a flexible display panel (i.e., bendable and foldable), such as an organic light-emitting diode (OLED) display panel, a mini light emitting diode (Mini LED) display panel, a micro light emitting diode (Micro LED) display panel, etc.

[0234] It should be understood that the above display panel including an adjacent display area and a non-display area means that the display panel includes a display area and a non-display area provided around the display area. Among them, the active area (AA) is the area for realizing display. The non-display area BM is the area other than the AA area. The BM area is generally used to set driving traces, driving circuits, etc. For example, a gate driver on array (GOA) circuit can be set; or, an in-screen camera, a receiver, a speaker, etc. can be set.

[0235] As an example, as Figure 31 shown, the display panel may include a substrate 15, and a middle frame 33, an adhesive layer 32, and a light-shielding layer 31 sequentially stacked on the substrate 15. Among them, the substrate 15 is located in the display area AA and the non-display area BM. In the application, the substrate may be a rigid substrate, such as a glass substrate, etc.; or the substrate may be a flexible substrate, such as a polyimide (PI) substrate, etc., which is not specifically limited here. Among them, the light-shielding layer 31, the adhesive layer 32, and the middle frame 33 are all located in the non-display area BM. The middle frame 33 is disposed on the substrate 15, and the adhesive layer 32 is used to bond the middle frame 33 and the light-shielding layer 31. In the application, the specific type of the above light-shielding layer is not limited. Exemplarily, the light-shielding layer may be an oil black ink layer.

[0236] Of course, other properties of the above-mentioned each film layer can be determined according to the display panel, which will not be elaborated here.

[0237] It should be noted that the light transmittance, haze, etc. of the materials of the above-mentioned film layers all meet the requirements and will not affect the display effect of the display panel.

[0238] When the electronic device provided by the embodiment of the present application is impacted by the outside world, the outside impact first enters the film layer. Since the Young's modulus of the material of the film layer is relatively high, it can play a role in isolating deformation and absorb the impact energy. Then, the impact energy is transmitted to the buffer layer. Since the buffer layer has at least two sub-buffer layers or at least one sub-buffer layer with a unique molecular energy absorption mechanism, it can well absorb the impact energy. After being absorbed by the buffer layer, the impact energy transmitted to the surface of the electronic device screen can be greatly weakened, thus achieving the impact protection effect on the screen and making the performance of the electronic device better.

[0239] Next, the electronic device provided by the embodiment of the present application will be introduced in detail through multiple specific embodiments.

[0240] Embodiment Fourteen

[0241] Figure 17 It shows when Figure 4 the protective film 1 is applied to the electronic device 02, a schematic structural diagram of the electronic device 02.

[0242] As Figure 17 shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and a glue layer 32, a light-shielding layer 31, a cover plate 2, a bonding layer 12, a second sub-buffer layer 14, a first sub-buffer layer 13, and a film layer 11 that are sequentially stacked on the middle frame 33.

[0243] When the electronic device provided by the embodiment of the present application is impacted by the outside world, first, the film layer contacts the external object. Since the Young's modulus of the material of the film layer is relatively high, it can play a certain role in isolating deformation and thus absorb the impact energy. Then the impact energy will be transmitted to the first sub-buffer layer of one layer. At this time, the impact rate is very high. However, due to the unique molecular energy absorption mechanism of the first sub-buffer layer, that is, the energy absorption ratio of the material of the first sub-buffer layer is relatively high at a high impact rate, it can effectively absorb the impact energy and act as the main absorption layer to absorb a large amount of impact energy. Then, after being absorbed by the first sub-buffer layer, the unabsorbed impact energy will be further conducted to the second sub-buffer layer of one layer. At this time, the impact rate drops significantly, and since the energy absorption ratio of the material of the second sub-buffer layer is higher at a low impact rate, these impact energies can be further absorbed by the second sub-buffer layer. Thus, after being absorbed to a large extent by the two sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is greatly weakened, thereby achieving the impact protection effect on the screen.

[0244] Embodiment Fifteen

[0245] Figure 18Schematically shows when Figure 5 the protective film 1 is applied to the electronic device 02, a schematic structural diagram of the electronic device 02.

[0246] As Figure 18 shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and a glue layer 32, a light-shielding layer 31, a cover plate 2, an adhesive layer 12, a first sub-buffer layer 13, a second sub-buffer layer 14, and a film layer 11 that are sequentially stacked on the middle frame 33.

[0247] When the electronic device provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed by the film layer will be sequentially transmitted to the second sub-buffer layer of one layer and the first sub-buffer layer of one layer. At this time, through the absorption of the two sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0248] Example XVI

[0249] Figure 19 Schematically shows when Figure 6 the protective film 1 is applied to the electronic device 02, a schematic structural diagram of the electronic device 02.

[0250] As Figure 19 shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and a glue layer 32, a light-shielding layer 31, a cover plate 2, an adhesive layer 12, a second sub-buffer layer 14, a first sub-buffer layer 13, a second sub-buffer layer 14, and a film layer 11 that are sequentially stacked on the middle frame 33.

[0251] When the electronic device provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed by the film layer is sequentially transmitted to the second sub-buffer layer of one layer, the first sub-buffer layer of one layer, and the second sub-buffer layer of one layer. At this time, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0252] Example XVII

[0253] Figure 20 Schematically shows when Figure 7 the protective film 1 is applied to the electronic device 02, a schematic structural diagram of the electronic device 02.

[0254] As Figure 20 shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and a glue layer 32, a light-shielding layer 31, a cover plate 2, an adhesive layer 12, a second sub-buffer layer 14, a second sub-buffer layer 14, a first sub-buffer layer 13, and a film layer 11 that are sequentially stacked on the middle frame 33.

[0255] When the electronic device provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed by the diaphragm layer is transmitted to the first sub-buffer layer of one layer. At this time, the impact rate is very high. However, due to the unique molecular energy absorption mechanism of the first sub-buffer layer, that is, the energy absorption ratio of the material of the first sub-buffer layer is relatively high at a high impact rate, the impact energy can be effectively absorbed, so as to serve as the main absorption layer to absorb a large amount of impact energy; then after being absorbed by the first sub-buffer layer, the unabsorbed impact energy will be conducted to the second sub-buffer layer of two layers. At this time, the impact rate drops significantly, and since the energy absorption ratio of the material of the second sub-buffer layer is higher at a low impact rate, these impact energies can be absorbed to a greater extent by the second sub-buffer layer of two layers. Thus, through the very large extent of absorption by the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is greatly weakened, thereby achieving the impact protection effect on the screen.

[0256] Embodiment XVIII

[0257] Figure 21 Schematically shows when Figure 8 the protective film 1 is applied to the electronic device 02, a schematic structural diagram of the electronic device 02.

[0258] As Figure 21 shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and an adhesive layer 32, a light-shielding layer 31, a cover plate 2, a bonding layer 12, a second sub-buffer layer 14, a first sub-buffer layer 13, a first sub-buffer layer 13, and a diaphragm layer 11 that are sequentially stacked on the middle frame 33.

[0259] When the electronic device provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed by the diaphragm layer is transmitted to the first sub-buffer layer of one layer. At this time, the impact rate is very high. However, due to the unique molecular energy absorption mechanism of the first sub-buffer layer, that is, the energy absorption ratio of the material of the first sub-buffer layer is relatively high at a high impact rate, the impact energy can be effectively absorbed. Then after being absorbed by the first sub-buffer layer of one layer, the impact energy is absorbed by the first sub-buffer layer of one layer again, and the two first sub-buffer layers are used as the main absorption layer to absorb a large amount of impact energy; the unabsorbed impact energy will be conducted to the second sub-buffer layer of one layer. At this time, the impact rate drops significantly, and since the energy absorption ratio of the material of the second sub-buffer layer is higher at a low impact rate, these impact energies can be absorbed to a greater extent by the second sub-buffer layer. Thus, through the very large extent of absorption by the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is greatly weakened, thereby achieving the impact protection effect on the screen.

[0260] Embodiment XIX

[0261] Figure 22 Schematically shows when Figure 9A schematic structural diagram of an electronic device 02 when the protective film 1 is applied to the electronic device 02.

[0262] As Figure 22 shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and an adhesive layer 32, a light-shielding layer 31, a cover plate 2, a bonding layer 12, a first sub-buffer layer 13, a second sub-buffer layer 14, a first sub-buffer layer 13, and a film layer 11 that are sequentially stacked on the middle frame 33.

[0263] When the electronic device provided by the embodiment of the present application is subjected to an external impact, the impact energy that is not absorbed by the film layer is transmitted to the first sub-buffer layer of one layer. At this time, the impact rate is very high. However, due to the unique molecular energy absorption mechanism of the first sub-buffer layer, that is, the energy absorption ratio of the material of the first sub-buffer layer is relatively high at a high impact rate, the impact energy can be effectively absorbed. Then, after being absorbed by the first sub-buffer layer of one layer, it serves as the main absorption layer to absorb a large amount of impact energy; the unabsorbed impact energy will be further conducted to the second sub-buffer layer of one layer. At this time, the impact rate is greatly reduced, and since the energy absorption ratio of the material of the second sub-buffer layer is higher at a low impact rate, these impact energies can be absorbed to a greater extent by the second sub-buffer layer; then, there is still unabsorbed impact energy that will be further conducted to the first sub-buffer layer of one layer, and can be absorbed to a certain extent by the first sub-buffer layer. Thus, through the relatively large absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is greatly weakened, thereby achieving the impact protection effect on the screen.

[0264] Example Twenty

[0265] Figure 23 Schematically shows that when Figure 10 the protective film 1 is applied to the electronic device 02, a schematic structural diagram of the electronic device 02.

[0266] As Figure 23 shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and an adhesive layer 32, a light-shielding layer 31, a cover plate 2, a bonding layer 12, a first sub-buffer layer 13, a second sub-buffer layer 14, a second sub-buffer layer 14, and a film layer 11 that are sequentially stacked on the middle frame 33.

[0267] When the electronic device provided by the embodiment of the present application is subjected to an external impact, the impact energy that is not absorbed by the film layer is sequentially transmitted to the second sub-buffer layer of two layers and the first sub-buffer layer of one layer. At this time, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0268] Example Twenty - One

[0269] Figure 24Schematically shows when Figure 11 the protective film 1 is applied to the electronic device 02, a schematic structural diagram of the electronic device 02.

[0270] As Figure 24 shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and an adhesive layer 32, a light-shielding layer 31, a cover plate 2, a bonding layer 12, a first sub-buffer layer 13, a first sub-buffer layer 13, a second sub-buffer layer 14, and a film layer 11 that are sequentially stacked on the middle frame 33.

[0271] When the electronic device provided by the embodiment of the present application is subjected to an external impact, the impact energy not absorbed by the film layer is sequentially transmitted to the second sub-buffer layer of one layer and the first sub-buffer layers of two layers. At this time, through the effective absorption of the three sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0272] Embodiment Twenty-two

[0273] Figure 25 Schematically shows when Figure 12 the protective film 1 is applied to the electronic device 02, a schematic structural diagram of the electronic device 02.

[0274] As Figure 25 shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and an adhesive layer 32, a light-shielding layer 31, a cover plate 2, a bonding layer 12, a second sub-buffer layer 14, a bonding layer 12, a first sub-buffer layer 13, and a film layer 11 that are sequentially stacked on the middle frame 33.

[0275] When the electronic device provided by the embodiment of the present application is subjected to an external impact, the impact energy not absorbed by the film layer is transmitted to the first sub-buffer layer of one layer. At this time, the impact rate is very high. However, due to the unique molecular energy absorption mechanism of the first sub-buffer layer, that is, the energy absorption ratio of the material of the first sub-buffer layer is relatively high at a high impact rate, the impact energy can be effectively absorbed, so as to act as the main absorption layer to absorb a large amount of impact energy; then after the absorption of the first sub-buffer layer, the impact energy is conducted to the bonding layer, and the bonding layer does not have an energy absorption effect; then, the unabsorbed impact energy will be conducted to the second sub-buffer layer of one layer again. At this time, the impact rate drops significantly, and since the energy absorption ratio of the material of the second sub-buffer layer is higher at a low impact rate, these impact energies can be further absorbed by the second sub-buffer layer. Thus, through the relatively large absorption of the two sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is greatly weakened, thereby achieving the impact protection effect on the screen.

[0276] Embodiment Twenty-three

[0277] Figure 26 Schematically shows whenFigure 13 A schematic structural diagram of the electronic device 02 when the protective film 1 is applied to the electronic device 02.

[0278] Such as Figure 26 As shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and an adhesive layer 32, a light-shielding layer 31, a cover plate 2, a bonding layer 12, a first sub-buffer layer 13, a bonding layer 12, a second sub-buffer layer 14, and a film layer 11 that are sequentially stacked on the middle frame 33.

[0279] When the electronic device provided by the embodiment of the present application is subjected to an external impact, the impact energy not absorbed by the film layer is sequentially transmitted to the second sub-buffer layer of one layer, the bonding layer of one layer, and the first sub-buffer layer of one layer. At this time, through the effective absorption of the two sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is weakened to a certain extent, thereby achieving the impact protection effect on the screen.

[0280] Example Twenty-Four

[0281] Figure 27 Schematically shows when Figure 14 A schematic structural diagram of the electronic device 02 when the protective film 1 is applied to the electronic device 02.

[0282] Such as Figure 27 As shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and an adhesive layer 32, a light-shielding layer 31, a cover plate 2, a bonding layer 12, a second sub-buffer layer 14, a first sub-buffer layer 13, a second sub-buffer layer 14, a first sub-buffer layer 13, and a film layer 11 that are sequentially stacked on the middle frame 33.

[0283] When the electronic device provided by the embodiment of the present application is subjected to an external impact, the impact energy not absorbed by the film layer is sequentially transmitted to the first sub-buffer layer of one layer, the second sub-buffer layer of one layer, the first sub-buffer layer of one layer, and the second sub-buffer layer of one layer. At this time, through the effective absorption of the four sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is greatly weakened, thereby achieving the impact protection effect on the screen.

[0284] Example Twenty-Five

[0285] Figure 28 Schematically shows when Figure 15 A schematic structural diagram of the electronic device 02 when the protective film 1 is applied to the electronic device 02.

[0286] Such as Figure 28As shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and an adhesive layer 32, a light-shielding layer 31, a cover plate 2, a bonding layer 12, a first sub-buffer layer 13, a second sub-buffer layer 14, a first sub-buffer layer 13, a second sub-buffer layer 14, and a diaphragm layer 11 that are sequentially stacked on the middle frame 33.

[0287] When the electronic device provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed by the diaphragm layer is sequentially transmitted to the second sub-buffer layer of one layer, the first sub-buffer layer of one layer, the second sub-buffer layer of one layer, and the first sub-buffer layer of one layer. At this time, through the effective absorption of the four sub-buffer layers, the impact energy transmitted to the surface of the electronic device screen is greatly weakened, thereby achieving the impact protection effect on the screen.

[0288] Embodiment Twenty-five

[0289] Figure 29 Schematically shows when Figure 16 the protective film 1 is applied to the electronic device 02, a schematic structural diagram of the electronic device 02.

[0290] As Figure 29 shown, along the OY direction, the electronic device 02 includes: a middle frame 33, and an adhesive layer 32, a light-shielding layer 31, a cover plate 2, a bonding layer 12, a first sub-buffer layer 13, and a diaphragm layer 11 that are sequentially stacked on the middle frame 33.

[0291] When the electronic device provided by the embodiment of the present application is impacted by the outside world, the impact energy that is not absorbed by the diaphragm layer is transmitted to the first sub-buffer layer of one layer. At this time, the impact rate is very high. However, due to the unique molecular energy absorption mechanism of the first sub-buffer layer, that is, the energy absorption ratio of the material of the first sub-buffer layer is relatively high at a high impact rate, the impact energy can be effectively absorbed, so that the impact energy transmitted to the surface of the electronic device screen is weakened, thereby achieving the impact protection effect on the screen.

[0292] Of course, it is not limited to the above-mentioned electronic device, and other structures of electronic devices can also be designed according to the protective film, which will not be specifically described one by one here.

[0293] Only the content related to the inventive points is introduced above, and the rest of the content can be obtained by referring to the related art and will not be elaborated here.

[0294] Next, through multiple specific embodiments, the impact force and impact force absorption ratio of the protective film of the embodiment of the present application will be described.

[0295] Embodiment 26

[0296] Figure 4In the protective film, the material of the diaphragm layer 11 is PET, with a Young's modulus of about 1 GPa and a thickness of 50 μm; the material of the first sub-buffer layer 13 is a conventional addition-curable silicone gel, with a Young's modulus of about 300 kPa and a thickness of 30 μm; the material of the second sub-buffer layer 14 is TPU, with a Young's modulus of about 50 MPa and a thickness of 30 μm; the material of the adhesive layer 12 is OCA, with a Young's modulus of about 30 kPa and a thickness of 25 μm.

[0297] Among them, the conventional addition-curable silicone gel can be Its reaction mechanism can be

[0298]

[0299] In application, the preparation method of the above protective film can include: First, 50 - 80 g of vinyl polysiloxane, 20 - 50 g of hydrogen-containing polysiloxane, 0.1 - 5 g of a platinum-based catalyst, and 0.1 - 3 g of a coupling agent are mixed to obtain an uncured silicone gel monomer; then, the uncured silicone gel monomer is coated on the surface of PET and cured at 140 °C; after that, the silicone gel is laminated with the pre-cured TPU layer and OCA layer in a roll-to-roll manner to obtain the protective film.

[0300] Example 27

[0301] Figure 4 In the protective film, the material of the diaphragm layer 11 is PET, with a Young's modulus of about 1 GPa and a thickness of 50 μm; the material of the first sub-buffer layer is a silicone gel containing boron-oxygen bonds, with a modulus of about 200 kPa and a thickness of 30 μm; the material of the second sub-buffer layer 14 is TPU, with a Young's modulus of about 50 MPa and a thickness of 30 μm; the material of the adhesive layer 12 is OCA, with a Young's modulus of about 30 kPa and a thickness of 25 μm.

[0302] Among them, the silicone gel containing boron-oxygen bonds can be

[0303] In application, the preparation method of the above protective film can include: First, 50 - 80 g of vinyl polysiloxane, 20 - 50 g of hydrogen-containing polysiloxane, 0.1 - 5 g of a platinum-based catalyst, and 0.1 - 3 g of a coupling agent are mixed to obtain an uncured silicone gel monomer; then, 50 g of a polysiloxane containing boron-oxygen bonds is added to the uncured silicone gel monomer to obtain a silicone gel containing boron-oxygen bonds; then, the uncured silicone gel containing boron-oxygen bonds is coated on the surface of PET and cured at 140 °C; after that, the silicone gel is laminated with the pre-cured TPU layer and OCA layer in a roll-to-roll manner to obtain the protective film.

[0304] Example 28

[0305] Figure 5 In the protective film, the material of the diaphragm layer 11 is PET, the Young's modulus is about 1 GPa, and the thickness is 50 μm; the material of the first sub-buffer layer 13 is a conventional addition-curable silicone gel, the Young's modulus is about 300 kPa, and the thickness is 30 μm; the material of the second sub-buffer layer 14 is TPU, the Young's modulus is about 50 MPa, and the thickness is 30 μm; the material of the adhesive layer 12 is OCA, the Young's modulus is about 30 kPa, and the thickness is 25 μm.

[0306] In the application, the preparation method of the above protective film may include: First, 50 - 80 g of vinyl polysiloxane, 20 - 50 g of hydrogen-containing polysiloxane, 0.1 - 5 g of a platinum-based catalyst, and 0.1 - 3 g of a coupling agent are mixed to obtain an uncured silicone gel monomer; then, the uncured silicone gel monomer is coated on the surface of the TPU and cured at 140 °C; after that, the silicone gel is laminated with the pre-cured OCA layer by using a roll-to-roll laminating method to obtain the protective film.

[0307] Comparative Example 1

[0308] Figure 3 In the protective film, the material of the film material layer 41 is PET, the Young's modulus is about 300 kPa, and the thickness is 50 μm; the material of the adhesive layer 42 is OCA, the Young's modulus is about 30 kPa, and the thickness is 25 μm.

[0309] Comparative Example 2

[0310] Figure 32 In the protective film, the material of the film material layer 41 is PET, the Young's modulus is about 300 kPa, and the thickness is 50 μm; the material of the adhesive layer 42 is OCA, the Young's modulus is about 30 kPa, and the thickness is 25 μm; the material of the single-layer buffer layer 43 is TPU, the Young's modulus is about 300 kPa, and the thickness is 30 μm.

[0311] Next, the drop ball tests are respectively carried out on Examples 26 - 28 and Comparative Examples 1 - 2 to obtain the impact resistance results. Specifically, a sensor is arranged below the stage, and the protective films of Examples 26 - 28 and Comparative Examples 1 - 2 are respectively placed above the stage. After a 32 g steel ball is freely released from a height of 30 cm to impact the protective film, the measured impact force and impact force absorption ratio are shown in Table 1 below.

[0312] It should be noted that the blank sample in Table 1 refers to the impact force obtained by freely releasing a 32 g steel ball from a height of 30 cm to impact the stage when no protective film is placed above the stage. This blank sample can be used as a reference for the force value to reflect how much the impact force decreases when the drop ball impacts the protective film.

[0313] Table 1

[0314] Sample Name Impact Force (N) Impact Force Absorption Ratio (%) Blank Sample 5169 0 Example 26 2766 46.5 Example 27 2371 54.1 Example 28 2920 43.5 Comparative Example 1 3835 25.8 Comparative Example 2 3162 38.8

[0315] It can be seen from Table 1 that, compared with Comparative Examples 1-2, the impact force absorption ratio of Examples 26-27 is improved by 10-20%, indicating that the introduction of the double buffer layer and the sacrificial key achieves better impact protection of the screen.

[0316] Compared with Example 26, Example 28 replaces the positions of the first sub-buffer layer and the second sub-buffer layer, which slightly decreases the impact force absorption ratio, indicating that the arrangement of the first sub-buffer layer closer to the diaphragm layer is more conducive to absorbing impact energy.

[0317] It should be understood that the above is only to help those skilled in the art better understand the embodiments of the present application, rather than to limit the scope of the embodiments of the present application. Those skilled in the art can obviously make various equivalent modifications or changes based on the above examples given. Or a combination of any two or any multiple embodiments of the above. Such modifications, changes or combined solutions also fall within the scope of the embodiments of the present application.

[0318] It should also be understood that the above description of the embodiments of the present application focuses on emphasizing the differences between the various embodiments. The same or similar points that are not mentioned can be referenced to each other. For the sake of brevity, they will not be repeated here.

[0319] It should also be understood that the division of the methods, situations, categories and embodiments in the embodiments of the present application is only for the convenience of description and should not constitute a special limitation. The features of various methods, categories, situations and embodiments can be combined without contradiction.

[0320] It should also be understood that in the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other, and the technical features in different embodiments can be combined to form new embodiments according to their internal logical relationships.

[0321] Finally, it should be noted that the above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A protective film, characterized in that, Applied to an electronic device, the electronic device further includes a display panel and a cover plate. The cover plate is disposed on one side of the display panel, and the protective film is attached to the side of the cover plate away from the display panel. The protective film includes an adhesive layer, and a buffer layer and a film layer sequentially stacked on the adhesive layer. The adhesive layer is close to the cover plate and is used to bond the buffer layer and the cover plate; The buffer layer at least includes a first sub-buffer layer and a second sub-buffer layer. The Young's modulus of the material of the first sub-buffer layer is less than or equal to the Young's modulus of the material of the second sub-buffer layer. The energy absorption ratio of the material of the first sub-buffer layer and the energy absorption ratio of the material of the second sub-buffer layer both increase with the increase of the impact rate. Wherein, the impact rate is the impact rate of an external object on the protective film; Wherein, the buffer layer includes the first sub-buffer layer and the second sub-buffer layer. The first sub-buffer layer is disposed between the film layer and the second sub-buffer layer, and the second sub-buffer layer is disposed between the first sub-buffer layer and the adhesive layer; Or, the buffer layer includes the second sub-buffer layer and the first sub-buffer layer sequentially stacked and alternately disposed on the adhesive layer; Or, the buffer layer includes the first sub-buffer layer and the second sub-buffer layer sequentially stacked and alternately disposed on the adhesive layer; The material of the first sub-buffer layer has a first main material and an impact-resistant structure. The first main material includes at least one of thermoplastic polyurethane, polyurea, and silicone gel. The impact-resistant structure is bonded to the first main material. The impact-resistant structure includes a sacrificial bond structure. The sacrificial bond structure includes at least one of a boron-oxygen bond, a multiple hydrogen bond, an ionic bond, a host-guest interaction, and a disulfide bond. The impact-resistant structure is capable of dynamically reversibly breaking and recovering when being impacted by an external object and after the impact. The energy absorption ratio of the material of the first sub-buffer layer having the impact-resistant structure is greater than the energy absorption ratio of the material of the first sub-buffer layer without the impact-resistant structure; The material of the second sub-buffer layer is designed for the branch content, network chain density, and third component of thermoplastic polyurethane, polyurea, and silicone gel.

2. The protective film according to claim 1, characterized in that, When the impact rate is a preset rate, the energy absorption ratio of the material of the first sub-buffer layer is the same as the energy absorption ratio of the material of the second sub-buffer layer; When the impact rate is in a first rate range, at the same impact rate, the energy absorption ratio of the material of the first sub-buffer layer is less than the energy absorption ratio of the material of the second sub-buffer layer. Wherein, the impact rate in the first rate range is less than the preset rate; When the impact rate is in a second rate range, at the same impact rate, the energy absorption ratio of the material of the first sub-buffer layer is greater than the energy absorption ratio of the material of the second sub-buffer layer. Wherein, the impact rate in the second rate range is greater than the preset rate.

3. The protective film according to claim 1, wherein, The Young's modulus of the material of the film layer is greater than or equal to the Young's modulus of the material of the second sub-buffer layer; And / or, The Young's modulus of the material of the first sub-buffer layer is greater than or equal to the Young's modulus of the material of the adhesive layer.

4. The protective film according to claim 1, wherein The protective film further includes at least one third sub-layer, and the third sub-layer is any one of the first sub-buffer layer, the second sub-buffer layer, and the adhesive layer.

5. The protective film according to claim 4, wherein, When the first sub-buffer layer is disposed between the diaphragm layer and the second sub-buffer layer, and the second sub-buffer layer is disposed between the first sub-buffer layer and the adhesive layer, the third sub-layer is disposed on a side of the first sub-buffer layer away from the adhesive layer; Or, When the first sub-buffer layer is disposed between the diaphragm layer and the second sub-buffer layer, and the second sub-buffer layer is disposed between the first sub-buffer layer and the adhesive layer, the third sub-layer is disposed between the second sub-buffer layer and the adhesive layer; Or, The third sub-layer is disposed between the first sub-buffer layer and the second sub-buffer layer.

6. The protective film according to claim 3, wherein When the Young's modulus of the material of the diaphragm layer is greater than or equal to the Young's modulus of the material of the second sub-buffer layer; and, the Young's modulus of the material of the first sub-buffer layer is greater than or equal to the Young's modulus of the material of the adhesive layer, the value range of the Young's modulus of the material of the diaphragm layer includes 300 MPa - 10 GPa; The value range of the Young's modulus of the material of the second sub-buffer layer includes 10 MPa - 1 GPa; The value range of the Young's modulus of the material of the first sub-buffer layer includes 10 kPa - 50 MPa; The value range of the Young's modulus of the material of the adhesive layer includes 10 kPa - 500 kPa.

7. The protective film according to any one of claims 1 to 6, characterized in that, Along the direction perpendicular to the cover plate, the thickness of the diaphragm layer, the thickness of the first sub-buffer layer, and the thickness of the second sub-buffer layer are the same, and the value range of the thickness of the diaphragm layer includes 20 - 100 μm; The value range of the thickness of the adhesive layer includes 20 - 60 μm.

8. A protective film, characterized in that, Applied to an electronic device, the electronic device further includes a display panel and a cover plate, the cover plate is disposed on one side of the display panel, the protective film is attached to a side of the cover plate away from the display panel, the protective film includes an adhesive layer, and a buffer layer and a diaphragm layer sequentially stacked on the adhesive layer, the adhesive layer is close to the cover plate and is used to bond the buffer layer and the cover plate; The buffer layer includes at least one first sub-buffer layer, the energy absorption ratio of the material of the first sub-buffer layer increases with the increase of the impact rate, and the impact rate is the impact rate of an external object on the protective film; the material of the first sub-buffer layer has a first main material and an impact-resistant structure, the first main material includes at least one of thermoplastic polyurethane, polyurea, and silicone gel, the impact-resistant structure is bonded to the first main material, the impact-resistant structure includes a sacrificial bond structure, and the sacrificial bond structure includes at least one of a boron-oxygen bond, a multiple hydrogen bond, an ionic bond, a host-guest interaction, and a disulfide bond. The impact-resistant structure is used to be dynamically reversibly damaged and restored when and after being impacted by an external object, and the energy absorption ratio of the material of the first sub-buffer layer having the impact-resistant structure is greater than the energy absorption ratio of the material of the first sub-buffer layer without the impact-resistant structure.

9. An electronic device, characterized in that, At least including a display panel, a cover plate, and the protective film as described in any one of claims 1 to 8, the cover plate is disposed on one side of the display panel, and the protective film is attached to the side of the cover plate away from the display panel.

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