Mainboard bracket and electronic equipment

Abstract

This application provides a motherboard bracket and an electronic device. The motherboard bracket includes a first bracket, a second bracket, a heat-conducting component, and an adhesive layer. A first end of the first bracket along its length and a second end of the second bracket along its length are disposed opposite to each other. The adhesive layer includes a first surface and a second surface facing opposite directions. The first surface of the adhesive layer is bonded to the first end of the first bracket and the second end of the second bracket, respectively. The second surface of the adhesive layer is bonded to the heat-conducting component. The heat-conducting component contacts the first end of the first bracket and the second end of the second bracket through the adhesive layer. Separating the motherboard bracket into a first bracket and a second bracket prevents deformation during the manufacturing process. The adhesive layer has good adhesion properties, ensuring close contact between the heat-conducting component and the first end of the first bracket and the second end of the second bracket. Heat conduction is achieved between the first bracket and the second bracket through the heat-conducting component, thereby ensuring good heat dissipation capacity of the motherboard bracket.

Description

Technical Field

[0001] This application relates to the field of motherboard bracket technology, and more specifically, to motherboard brackets and electronic devices. Background Technology

[0002] With the rise of foldable screen phones, a wide variety of foldable screen phones have appeared on the market.

[0003] Due to the unique design of outward-folding screen phones, the motherboard bracket is designed as a long strip, resulting in a larger aspect ratio. Furthermore, to improve the heat dissipation capacity of the motherboard bracket, a metal material with high thermal conductivity but low yield strength is used.

[0004] Because the motherboard bracket has a larger aspect ratio and lower yield strength, it is extremely prone to deformation during manufacturing. Therefore, ensuring that the motherboard bracket does not deform during manufacturing while also providing good heat dissipation capabilities has become a pressing technical challenge. Summary of the Invention

[0005] This application provides a motherboard bracket and an electronic device to ensure that the motherboard bracket has good heat dissipation capabilities without deforming during the manufacturing process.

[0006] In a first aspect, embodiments of this application provide a motherboard bracket, which includes a first bracket, a second bracket, a heat-conducting component, and an adhesive layer. The first end of the first bracket along its length and the second end of the second bracket along its length are disposed opposite to each other. The adhesive layer includes a first surface and a second surface facing opposite directions. The first surface of the adhesive layer is bonded to the first end of the first bracket and the second end of the second bracket, respectively. The second surface of the adhesive layer is bonded to the heat-conducting component, and the heat-conducting component contacts the first end of the first bracket and the second end of the second bracket through the adhesive layer.

[0007] In the first aspect, the embodiments of this application split the motherboard bracket into a first bracket and a second bracket, thereby reducing the aspect ratio of each bracket and making the motherboard bracket less prone to deformation during processing. Furthermore, the adhesive layer has good adhesion properties, ensuring that the heat-conducting component is in close contact with the first end of the first bracket and the second end of the second bracket, respectively. The first and second brackets can achieve heat conduction through the heat-conducting component, thereby ensuring that the motherboard bracket has good heat dissipation capabilities.

[0008] In one possible implementation, the first support includes a first body, a first end, and a first protective layer, wherein the first body and the first end are integrally formed, and the first protective layer is disposed on the outside of the first body; the second support includes a second body, a second end, and a second protective layer, wherein the second body and the second end are integrally formed, and the second protective layer is disposed on the outside of the second body.

[0009] The first protective layer is used to protect the first main body of the first support, and the second protective layer is used to protect the second main body of the second support.

[0010] In one possible implementation, the first body, the first end, the second body, and the second end are all made of aluminum alloy, and the first protective layer and the second protective layer are both made of low-density plastic.

[0011] Because aluminum alloy has a much higher thermal conductivity than conventional steel sheets, the heat dissipation effect of the first and second brackets is far better than that of motherboard brackets using steel sheets. Furthermore, aluminum alloy has a lower density than conventional steel sheets, so the weight of the first and second brackets will also be less than that of motherboard brackets using steel sheets, thus achieving a thinner and lighter motherboard bracket.

[0012] In addition, both the first and second protective layers are made of low-density plastic. Low-density plastic has a lower density than ordinary plastic, which reduces the weight of the first and second protective layers while keeping their volumes unchanged. This, in turn, reduces the weight of the first and second brackets, thus achieving a thinner and lighter motherboard bracket.

[0013] In one possible implementation, the aspect ratio of both the first and second supports is less than or equal to 5.

[0014] In this way, by controlling the aspect ratio of the first and second supports, the problem of processing deformation is avoided, thereby improving the yield of the first and second supports in the production process.

[0015] In one possible implementation, heat is conducted between the first body of the first support and the second body of the second support through a first end, a heat-conducting element, and a second end.

[0016] Since the first bracket, the heat-conducting component, and the second bracket form a complete heat dissipation chain, the heat dissipation effect is far better than heat dissipation only on the first bracket. Therefore, the motherboard bracket provided in this application embodiment has better heat dissipation capability.

[0017] In one possible implementation, a waterproof layer is also included, which is bonded to the heat-conducting component, with the waterproof layer and the adhesive layer located on opposite sides of the heat-conducting component.

[0018] The waterproof layer prevents external liquids from flowing into the gap between the first and second supports, thus providing waterproofing for the gap between the first and second supports.

[0019] In one possible implementation, the waterproof layer is made of foam.

[0020] Among them, foam not only serves as a waterproof material, but also has good elasticity, which can protect the heat-conducting components.

[0021] In one possible implementation, the heat-conducting element is made of gold foil, silver foil, or copper foil, and its thickness ranges from 0.05 mm to 0.8 mm. The contact area between the heat-conducting element and the first or second support is greater than or equal to 3 square millimeters.

[0022] Gold, silver, or copper foil, when used as materials for heat-conducting components, offer excellent thermal conductivity and possess high yield strength, resulting in a longer service life. Furthermore, the greater the thickness of the heat-conducting component, the stronger its thermal conductivity; conversely, the smaller the thickness, the smaller the space it occupies. Additionally, the larger the contact area between the heat-conducting component and the first or second support, the stronger its thermal conductivity; and the smaller the contact area, the smaller the space it occupies.

[0023] In one possible implementation, the adhesive layer is made of polyethylene terephthalate, polyimide, or polyurethane, and the thickness of the adhesive layer ranges from 0.01 mm to 0.1 mm. The bonding area between the adhesive layer and the first or second support is greater than or equal to 3 square millimeters.

[0024] Polyethylene terephthalate, polyimide, or polyurethane, used as the adhesive layer material, provides good bonding performance and high-temperature resistance, preventing it from melting during heat conduction. Furthermore, a thinner adhesive layer results in stronger thermal conductivity of the heat-conducting component; a thicker adhesive layer enhances the bonding effect. Additionally, a larger bonding area between the adhesive layer and the first or second support results in better bonding. Conversely, a smaller bonding area between the adhesive layer and the first or second support reduces the space required.

[0025] In one possible implementation, the height difference between the first support and the second support in the thickness direction is less than 0.15 mm, and the distance between the first support and the second support is less than 1 mm.

[0026] The height difference between the first and second supports in the thickness direction refers to the height difference between the surfaces of the first and second supports bonded to the adhesive layer. If the height difference is too large, the heat-conducting component cannot form an effective contact area with the first end of the first support and the second end of the second support, thus failing to provide the function of heat conduction. Therefore, the smaller the height difference between the first and second supports in the thickness direction, the better, ensuring that the first and second supports are located on the same plane, allowing for better adhesion between the first and second supports and the heat-conducting component.

[0027] Secondly, embodiments of this application provide an electronic device, including a housing, a motherboard on which components are disposed, and a motherboard bracket as described in the first aspect or any possible implementation of the first aspect; the motherboard is disposed on the housing, the motherboard bracket is pressed on the motherboard and fixedly connected to the housing by a fastener, and the motherboard bracket is in contact with the components on the motherboard.

[0028] In the second aspect, the motherboard bracket in the electronic device provided in this application embodiment is divided into a first bracket and a second bracket, thereby reducing the aspect ratio of each bracket and making the motherboard bracket less prone to deformation during processing. Furthermore, the adhesive layer has good adhesive properties, ensuring that the heat-conducting component is in close contact with the first end of the first bracket and the second end of the second bracket, respectively. The first bracket and the second bracket can achieve heat conduction through the heat-conducting component, thereby ensuring that the motherboard bracket has good heat dissipation capabilities. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of a foldable screen phone disclosed in an embodiment of this application;

[0030] Figure 2 This is a partial schematic diagram of the interior of a foldable screen phone disclosed in an embodiment of this application;

[0031] Figure 3 This is a schematic diagram showing the motherboard bracket under deformation and without deformation as disclosed in the embodiments of this application;

[0032] Figure 4 This is a schematic diagram of a motherboard bracket disclosed in an embodiment of this application;

[0033] Figure 5 This is an exploded view of a motherboard bracket disclosed in an embodiment of this application;

[0034] Figure 6 This is a schematic diagram of the structure of the first and second supports disclosed in the embodiments of this application;

[0035] Figure 7 This is a schematic diagram of heat conduction in the motherboard bracket disclosed in an embodiment of this application;

[0036] Figure 8 This is a schematic diagram of the structure of an electronic device disclosed in an embodiment of this application. Detailed Implementation

[0037] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0038] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” and “one or more” refer to one, two, or more than two. The term “and / or” is used to describe the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can indicate: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0039] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0040] Currently, foldable phones on the market are mainly divided into outward-folding and inward-folding phones. Outward-folding phones have only one foldable screen. When an outward-folding phone is folded, the folded screen is exposed. The motherboard bracket provided in this embodiment is applied to outward-folding phones. Of course, the motherboard bracket provided in this embodiment can also be applied to other types of electronic devices, such as tablet computers.

[0041] To ensure clarity and conciseness in the description of the following embodiments, a brief introduction to the related technologies is given first:

[0042] Please see Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of a foldable screen phone disclosed in an embodiment of this application. Figure 2 This is a partial schematic diagram of the interior of a foldable screen phone disclosed in an embodiment of this application.

[0043] exist Figure 1 and Figure 2In the example, the foldable screen phone 100 includes a casing 101, a motherboard 102, a motherboard bracket 103, a heat-generating device 104, components 105, a fixing member 106, a hinge 107, and a foldable screen 108. The heat-generating device 104 and components 105 are mounted on the motherboard 102. The motherboard bracket 103 secures the motherboard 102 to the casing 101 via the fixing member 106, and the motherboard bracket 103 is in contact with the heat-generating device 104 and components 105 on the motherboard 102. The heat-generating device 104 represents components that generate heat, such as chips, flash memory, and RAM, while the components 105 represent components that do not generate heat, such as cameras and radio frequency modules.

[0044] After the heat-generating device 104 generates heat, the heat on the heat-generating device 104 will be conducted to the motherboard bracket 103, the heat on the motherboard bracket 103 will be conducted to the outer casing 101, and finally the outer casing 101 will dissipate the heat to the outside of the foldable screen phone 100.

[0045] pass Figure 1 and Figure 2 As can be seen from the example, due to the unique shape of the foldable screen phone 100, the motherboard 102 and motherboard bracket 103 are placed in the elongated area on the side of the foldable screen phone 100. Therefore, the motherboard 102 and motherboard bracket 103 are designed to be elongated, resulting in a larger aspect ratio of the motherboard bracket 103, where the aspect ratio is the ratio of the length to the width of the motherboard bracket 103. Moreover, in order to improve the heat dissipation capacity of the motherboard bracket 103, a metal material with high thermal conductivity but low yield strength is used for the motherboard bracket 103. Due to the larger aspect ratio and lower yield strength of the motherboard bracket 103, the motherboard bracket 103 is extremely prone to deformation during the manufacturing process.

[0046] Please see Figure 3 As shown, Figure 3 This is a schematic diagram showing the motherboard bracket of the present application under deformed and undeformed conditions. Figure 3 In the diagram, motherboard bracket A1 represents a deformed form during the manufacturing process, while motherboard bracket A2 represents a form that does not deform during the manufacturing process. If motherboard bracket A1 deforms, it does not meet the finished product requirements. If motherboard bracket A2 does not deform, it meets the finished product requirements. Frequent deformation of the motherboard bracket during manufacturing will significantly reduce the yield rate.

[0047] Therefore, this application provides a motherboard bracket to ensure that the motherboard bracket has good heat dissipation capabilities without deforming during the manufacturing process.

[0048] Please see Figure 4 and Figure 5 As shown, Figure 4 This is a schematic diagram of a motherboard bracket disclosed in an embodiment of this application. Figure 5 This is an exploded view of a motherboard bracket disclosed in an embodiment of this application.

[0049] exist Figure 4 and Figure 5 In the illustrated embodiment, the motherboard bracket can be installed in an electronic device such as a foldable screen phone or tablet computer. The motherboard bracket includes a first bracket 201, a second bracket 202, an adhesive layer 203, and a heat-conducting element 204. The first end 2011 of the first bracket 201 along its length and the second end 2021 of the second bracket 202 along their length are disposed opposite to each other. The adhesive layer 203 includes a first surface and a second surface facing opposite directions. The first surface of the adhesive layer 203 is bonded to the first end 2011 of the first bracket 201 and the second end 2021 of the second bracket 202, respectively, and the second surface of the adhesive layer 203 is bonded to the heat-conducting element 204. The heat-conducting element 204 contacts the first end 2011 of the first bracket 201 and the second end 2021 of the second bracket 202 through the adhesive layer 203.

[0050] The heating element 208 and the component 209 are mounted on the motherboard 207. The first bracket 201 and the second bracket 202 fix the motherboard 207 to the shell of the foldable screen phone through multiple fasteners 206.

[0051] In this embodiment, the motherboard bracket is divided into a first bracket 201 and a second bracket 202, thereby reducing the aspect ratio of each bracket and making the motherboard bracket less prone to deformation during processing. Furthermore, the adhesive layer 203 has excellent adhesion properties, ensuring that the heat-conducting element 204 is in close contact with the first end 2011 of the first bracket 201 and the second end 2021 of the second bracket 202, respectively. Heat conduction between the first bracket 201 and the second bracket 202 can be achieved through the heat-conducting element 204, thus ensuring good heat dissipation capacity of the motherboard bracket.

[0052] In addition, the adhesive layer 203 also has a certain buffering effect. When the electronic device is collided, the adhesive layer 203 can release the force conducted by the heat-conducting component 204 to the first bracket 201 and the second bracket 202, thereby avoiding the problem of component damage under the influence of the force.

[0053] exist Figure 4 and Figure 5 In the embodiment shown, the motherboard bracket further includes a waterproof layer 205, which is bonded to the heat-conducting component 204. The waterproof layer 205 and the adhesive layer 203 are located on both sides of the heat-conducting component 204.

[0054] The waterproof layer 205 prevents external liquids from flowing into the gap between the first support 201 and the second support 202, thus providing waterproofing for this gap. The waterproof layer 205 can be made of foam, which not only provides waterproofing but also has good elasticity, protecting the heat-conducting component 204.

[0055] exist Figure 4 and Figure 5 In the illustrated embodiment, the waterproof layer 205 only covers the upper surface of the heat-conducting component 204. Of course, to achieve better waterproofing, the waterproof layer 205 can also extend from the upper surface of the heat-conducting component 204 to the upper surfaces of the first support 201 and the second support 202, so that the waterproof layer 205 can completely cover the first support 201, the heat-conducting component 204, and the second support 202, thereby preventing external liquids from flowing into the first support 201, the heat-conducting component 204, and the second support 202.

[0056] exist Figure 4 and Figure 5 In the illustrated embodiment, the heat-conducting element 204 can be made of materials such as gold foil, silver foil, or copper foil. Gold foil, silver foil, or copper foil have good thermal conductivity, enabling heat conduction between the first support 201 and the second support 202. Furthermore, gold foil, silver foil, or copper foil have high yield strength, thus resulting in a longer service life.

[0057] The thickness of the heat-conducting component 204 ranges from 0.05 mm to 0.8 mm. A larger thickness results in stronger thermal conductivity and a larger space occupied by the heat-conducting component 204; conversely, a smaller thickness results in weaker thermal conductivity and a smaller space occupied. Therefore, the thickness of the heat-conducting component 204 can be set according to the available space and heat dissipation requirements.

[0058] The contact area between the heat-conducting component 204 and the first bracket 201 or the second bracket 202 is greater than or equal to 3 square millimeters. The larger the contact area between the heat-conducting component 204 and the first bracket 201 or the second bracket 202, the stronger the heat conduction capacity of the heat-conducting component 204, and the larger the space occupied by the heat-conducting component 204; conversely, the smaller the contact area between the heat-conducting component 204 and the first bracket 201 or the second bracket 202, the weaker the heat conduction capacity of the heat-conducting component 204, and the smaller the space occupied by the heat-conducting component 204. Therefore, the contact area between the heat-conducting component 204 and the first bracket 201 or the second bracket 202 can be set according to the reserved space size and heat dissipation requirements.

[0059] exist Figure 4 and Figure 5In the illustrated embodiment, the adhesive layer 203 can be made of materials such as polyethylene terephthalate (PET), polyimide (PI), or polyurethane (PU). Using polyethylene terephthalate (PET), polyimide (PI), or polyurethane (PU) as the adhesive layer material provides good adhesion and also exhibits high-temperature resistance, preventing it from melting due to heat transfer from the heat conductor 204.

[0060] The adhesive layer 203 has a thickness ranging from 0.01 mm to 0.1 mm, and the bonding area between the adhesive layer 203 and the first support 201 or the second support 202 is greater than or equal to 3 square millimeters. The total bonding area of ​​the adhesive layer 203 is greater than or equal to 10 square millimeters, wherein the total bonding area of ​​the adhesive layer 203 is the sum of the first bonding area and the second bonding area, the first bonding area being the bonding area between the adhesive layer 203 and the first support 201, and the second bonding area being the bonding area between the adhesive layer 203 and the second support 202.

[0061] The thinner the adhesive layer 203, the stronger the thermal conductivity of the heat-conducting component 204, but the weaker the bonding effect provided by the adhesive layer 203. Conversely, the thicker the adhesive layer 203, the weaker the thermal conductivity of the heat-conducting component 204, but the stronger the bonding effect provided by the adhesive layer 203. Therefore, the thickness of the adhesive layer 203 can be set according to the requirements of bonding capability and heat dissipation.

[0062] The larger the bonding area between the adhesive layer 203 and the first support 201 or the second support 202, the better the bonding effect, but the larger the space occupied. Conversely, the smaller the bonding area between the adhesive layer 203 and the first support 201 or the second support 202, the weaker the bonding effect, but the smaller the space occupied. Therefore, the bonding area between the adhesive layer 203 and the first support 201 or the second support 202 can be set according to the requirements of bonding capability and space occupation.

[0063] exist Figure 4 and Figure 5 In the embodiment shown, the height difference between the first support 201 and the second support 202 in the thickness direction is less than 0.15 mm.

[0064] The height difference in the thickness direction between the first support 201 and the second support 202 refers to the height difference between the surfaces of the first support 201 and the adhesive layer 203 and the surfaces of the second support 202 and the adhesive layer 203. If the height difference is too large, the heat-conducting element 204 cannot form an effective contact area with the first end 2011 of the first support 201 and the second end 2012 of the second support 202, thus failing to provide the function of heat conduction. Therefore, the smaller the height difference in the thickness direction between the first support 201 and the second support 202, the better. This ensures that the first support 201 and the second support 202 are located on the same plane, allowing them to better adhere to the heat-conducting element 204.

[0065] exist Figure 4 and Figure 5 In the embodiment shown, the distance between the first bracket 201 and the second bracket 202 is less than 1 mm.

[0066] During the manufacturing process of the first bracket 201 and the second bracket 202, some acceptable process errors may exist to ensure that the lengths of the first bracket 201 and the second bracket 202 are controlled within a certain range. During the installation of the motherboard bracket, a certain distance is maintained between the first bracket 201 and the second bracket 202 to avoid collisions between the first bracket 201 and the second bracket 202 due to process errors, preventing installation.

[0067] Please see Figure 6 As shown, Figure 6 This is a schematic diagram of the structure of the first and second supports disclosed in an embodiment of this application. Figure 6 In the illustrated embodiment, the first support 201 includes a first body 2012, a first end 2011, and a first protective layer 2013. The first body 2012 and the first end 2011 are integrally formed, and the first protective layer 2013 is disposed on the outside of the first body 2012. The second support 202 includes a second body 2022, a second end 2021, and a second protective layer 2023. The second body 2022 and the second end 2021 are integrally formed, and the second protective layer 2023 is disposed on the outside of the second body 2022. The first protective layer 2013 is used to protect the first body 2012 of the first support 201, and the second protective layer 2023 is used to protect the second body 2022 of the second support 202.

[0068] The first main body 2012, the first end 2011, the second main body 2022, and the second end 2021 are all made of aluminum alloy. Since the thermal conductivity of aluminum alloy is much higher than that of conventional steel sheets, the heat dissipation effect of the first bracket 201 and the second bracket 202 is far better than that of a motherboard bracket using steel sheets. Furthermore, the density of aluminum alloy is lower than that of conventional steel sheets, so the weight of the first bracket 201 and the second bracket 202 will also be less than that of a motherboard bracket using steel sheets, thus achieving a thinner and lighter motherboard bracket.

[0069] In addition, both the first protective layer 2013 and the second protective layer 2023 are made of low-density plastic. Low-density plastic has a lower density than ordinary plastic, which reduces the weight of the first and second protective layers 2013 and 2023 while maintaining the same volume. This, in turn, reduces the weight of the first support 201 and the second support 202, thus achieving a thinner and lighter motherboard support.

[0070] exist Figure 6 In the illustrated embodiment, the first body 2012, the first end 2011, the second body 2022, and the second end 2021 are all made of aluminum alloy. Since aluminum alloy has a low yield strength, if the aspect ratio of the first support 201 and the second support 202 is too large, they are prone to deformation during the manufacturing process. Therefore, the aspect ratio of both the first support 201 and the second support 202 can be less than or equal to 5. This controls the aspect ratio to avoid deformation during manufacturing, thereby improving the yield rate of the first support 201 and the second support 202 during production.

[0071] Of course, since different materials have different yield strengths, if the first body 2012, the first end 2011, the second body 2022 and the second end 2021 are made of other materials, then the aspect ratio of the first support 201 and the second support 202 needs to be set according to the yield strength of the materials.

[0072] Furthermore, the motherboard bracket provided in this application embodiment is not limited to being split into two brackets. The number of brackets that need to be split can be determined based on the quotient of the expected aspect ratio of the motherboard bracket and the aspect ratio threshold.

[0073] For example, assuming the aspect ratio threshold Y1 = 5, the expected length of the motherboard bracket L1 = 10cm, and the expected width of the motherboard bracket L2 = 1cm, then the expected aspect ratio of the motherboard bracket Y2 = L1 ÷ L2 = 10cm ÷ 1cm = 10. The quotient of the expected aspect ratio Y2 and the aspect ratio threshold Y1 = Y2 ÷ Y1 = 2, indicating that the motherboard bracket can be split into two brackets. Setting the length of each of the two split brackets to 5cm ensures that the aspect ratio of each bracket is less than or equal to the aspect ratio threshold.

[0074] For example, assuming the aspect ratio threshold Y3 = 5, the expected length of the motherboard bracket L3 = 15cm, and the expected width of the motherboard bracket L4 = 1cm, then the expected aspect ratio of the motherboard bracket Y4 = L3 ÷ L4 = 15cm ÷ 1cm = 15. The quotient of the expected aspect ratio Y4 and the aspect ratio threshold Y3 = Y4 ÷ Y3 = 3, indicating that the motherboard bracket can be split into 3 brackets. Setting the length of each of the 3 brackets to 5cm ensures that the aspect ratio of each bracket is less than or equal to the aspect ratio threshold.

[0075] Please combine Figures 4 to 6 As shown, the first body 2012 of the first support 201 and the second body 2022 of the second support 202 conduct heat through the first end 2011, the heat-conducting element 204 and the second end 2021.

[0076] Please see Figure 7 As shown, Figure 7 This is a schematic diagram of heat conduction in the motherboard bracket disclosed in an embodiment of this application. Figure 7 The arrow in the diagram indicates the direction of heat conduction. When the heating element 208 dissipates heat, the heat dissipated by the heating element 208 is conducted to the first body 2012 of the first support 201 because the first body 2012 of the first support 201 is in contact with the heating element 208. Then, the heat is sequentially conducted through the first body 2012 of the first support 201, the first end 2011 of the first support 201, the adhesive layer 203, the heat-conducting element 204, the second end 2021 of the second support 202, and the second body 2022 of the second support 202. Since the first support 201, the heat-conducting element 204, and the second support 202 form a complete heat dissipation chain, its heat dissipation effect is far better than heat dissipation only on the first support 201. Therefore, the motherboard bracket provided in this embodiment has good heat dissipation capabilities.

[0077] Please see Figure 8 As shown, Figure 8 This is a schematic diagram of the structure of an electronic device disclosed in an embodiment of this application. Figure 8 In the illustrated embodiment, the electronic device 300 can be a foldable screen phone or tablet computer, etc. The electronic device 300 includes a housing 301, a motherboard 302 with a heating element 303 and components 304, a fixing member 305, a foldable screen 306, a hinge 307, and... Figures 4 to 7The motherboard bracket 308 is shown. The motherboard 302 is mounted on the housing 301. The motherboard bracket 308 presses against the motherboard 302 and is fixedly connected to the housing 301 by a fastener 305. The motherboard bracket 308 is in contact with the heat-generating devices 303 and components 304 on the motherboard 302. The heat-generating devices 303 represent components that generate heat, such as chips, flash memory, and RAM. The components 304 represent components that do not generate heat, such as cameras and RF modules.

[0078] exist Figure 8 For a description of the motherboard bracket 308 in the illustrated embodiment, please refer to [link / reference needed]. Figures 4 to 7 The example shown.

[0079] The same or similar parts between the various embodiments in this specification can be referred to interchangeably. Each embodiment focuses on the differences from other embodiments. In particular, the device and system embodiments are basically similar to the method embodiments, so the description is relatively simple, and the relevant parts can be referred to in the description of the method embodiments section.

[0080] The embodiments of the present invention described above do not constitute a limitation on the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that, Includes the casing, motherboard, and motherboard bracket, among which: The outer casing has a long, narrow cavity on one side, and the main board has components mounted on it. The main board has a long, narrow structure and is located inside the cavity. The motherboard bracket includes a first bracket, a second bracket, a heat-conducting component, and an adhesive layer; The first end of the first bracket along the length direction is disposed opposite to the second end of the second bracket along the length direction; The adhesive layer includes a first surface and a second surface facing opposite directions. The first surface of the adhesive layer is bonded to the first end of the first bracket and the second end of the second bracket, respectively, and the second surface of the adhesive layer is bonded to the heat-conducting component. The thermally conductive component is thermally connected to the first end of the first bracket and the second end of the second bracket respectively through the adhesive layer; The first bracket and the second bracket are pressed onto the same motherboard and are fixedly connected to the housing by a fastener. The first bracket and the second bracket are in contact with the components on the motherboard.

2. The electronic device according to claim 1, characterized in that: The first bracket includes a first body, a first end, and a first protective layer. The first body and the first end are integrally formed, and the first protective layer is provided on the outside of the first body. The second bracket includes a second main body, a second end, and a second protective layer. The second main body and the second end are integrally formed, and the second protective layer is provided on the outside of the second main body.

3. The electronic device according to claim 2, characterized in that: The first body, the first end, the second body, and the second end are all made of aluminum alloy, and the first protective layer and the second protective layer are both made of low-density plastic.

4. The electronic device according to claim 3, characterized in that, The aspect ratios of both the first bracket and the second bracket are less than or equal to 5.

5. The electronic device according to any one of claims 2 to 4, characterized in that: Heat is conducted between the first body of the first bracket and the second body of the second bracket through the first end, the heat-conducting element and the second end.

6. The electronic device according to claim 1, characterized in that, It also includes a waterproof layer, which is bonded to the heat-conducting component, and the waterproof layer and the adhesive layer are located on both sides of the heat-conducting component.

7. The electronic device according to claim 6, characterized in that, The waterproof layer is made of foam.

8. The electronic device according to claim 1, characterized in that: The material of the heat-conducting component is gold foil, silver foil or copper foil, and the thickness of the heat-conducting component ranges from 0.05 mm to 0.8 mm. The thermal connection area between the heat-conducting component and the first bracket or the second bracket is greater than or equal to 3 square millimeters.

9. The electronic device according to claim 1, characterized in that: The adhesive layer is made of polyethylene terephthalate, polyimide, or polyurethane, and its thickness ranges from 0.01 mm to 0.1 mm. The bonding area between the adhesive layer and the first or second support is greater than or equal to 3 square millimeters.

10. The electronic device according to claim 1, characterized in that, The height difference between the first bracket and the second bracket in the thickness direction is less than 0.15 mm, and the distance between the first bracket and the second bracket is less than 1 mm.

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