Holder and charged particle beam device
By designing a new holder and a photodetector system for charged particle beam devices, the problem of inaccurate transmission electron image when the sample is thick in the prior art is solved, and high-precision transmission electron image acquisition and improvement of device performance are achieved.
Patent Information
- Application Number
- CN202410717620.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-03-19
- Filing Date
- 2020-03-06
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2040-03-06
AI Technical Summary
When the sample is thicker, it is difficult to obtain accurate transmitted electron images, and there are losses during signal conversion, which affects the harvest.
A new holder is designed, including an upper part, a bottom part and a side part, with a first hole for mounting the sample, and a first scintillator is provided in the area surrounding the opening. At the same time, a light detector is provided in the charged particle beam device to detect the optical signal emitted by the scintillator, and converted it into an electrical signal through the image processing device to generate a transmissive charged particle image.
The bright or dark field images of the sample are obtained with high precision, which improves the performance of the charged particle beam device, reduces the loss of signal conversion, and enhances the harvest.
Smart Images

Figure CN118486576B_ABST
Abstract
Description
[0001] This application is a divisional application of the invention application with application number 202080005075.2 and invention name “Holding member and charged particle beam device”. Technical Field
[0002] The present invention relates to a holder and a charged particle beam device, and is particularly applicable when the holder is used to detect light. Background Art
[0003] In order to scan an electron beam on a sample and obtain a desired transmission electron image from the sample, a charged particle beam device such as a scanning transmission electron microscope (STEM) or a scanning electron microscope (SEM) is used. In a scanning electron microscope, even a relatively low acceleration voltage of several tens of kV can obtain a transmission electron image with extremely high contrast and high resolution.
[0004] For example, Fig.21 FIG. 2 shows a charged particle beam device of the prior art. Fig.21 As shown, a sample SAM is carried on a mesh body MS of a holder HL provided in a charged particle beam device, and a reflector RF is provided on the holder HL below the sample SAM. Here, a charged particle beam EB1 is irradiated to the sample SAM, and the transmitted electrons EB4 transmitted to the bottom of the sample SAM are reflected by the inclined reflector RF. Then, the reflected secondary electrons EB5 are detected by a detector ETD called an Everhart-Thornley detector.
[0005] Patent document 1 discloses the following technology: an electron beam is irradiated onto a sample, and the transmitted electrons that are transmitted to the bottom of the sample collide with an inclined scintillator, so that light emitted from the scintillator passes through a horizontal hole and enters a photomultiplier tube provided at the exit of the hole.
[0006] Patent Document 2 discloses a technology for generating a luminescence phenomenon based on gas scintillation in a low vacuum chamber controlled to about 1 Pa to 3000 Pa, detecting excitation light having image information, and a detector capable of detecting the excitation light.
[0007] Prior art literature
[0008] Patent Literature
[0009] Patent Document 1: Japanese Patent Application Publication No. 2008-66057
[0010] Patent Document 2: Japanese Patent Application Publication No. 2013-225530 Summary of the invention
[0011] Problems to be solved by the invention
[0012] Fig.21 In the case of the prior art shown in the figure, the electrons detected by the detector ETD include not only the secondary electrons EB5 reflected by the reflector RF, but also the secondary electrons EB6 emitted from the surface of the sample SAM. Therefore, it is difficult to create an accurate transmission electron image based on the secondary electrons EB5 detected by the detector ETD. Fig.21 In terms of technology, when the sample SAM is thick, the amount of secondary electrons EB6 increases, which may significantly change the contrast of the transmitted electron image. Fig.21 It is also difficult to produce accurate transmission electron images using conventional techniques.
[0013] In addition, in order to prevent the excess transmitted electrons from colliding with the reflector RF, a scattering angle grating ASA3 that limits the scattering angle needs to be set just below the sample SAM. Therefore, it is difficult to obtain a transmitted electron image with only a small scattering angle (e.g., less than 75 mrad). On the other hand, it is also considered to reduce the scattering angle grating ASA3, but in this case, the observable area on the sample SAM becomes roughly the same as the aperture of the scattering angle grating ASA3, so the observable range becomes very small.
[0014] In addition, the detector ETD is usually equipped with a scintillator and a photomultiplier tube. The secondary electrons EB5 converted from the transmitted electrons EB4 are converted into light by the detector ETD, amplified by the photomultiplier tube, and replaced with an electrical signal. At this time, the signal conversion process is carried out in the order of the transmitted electrons EB4, the secondary electrons EB5, the light, and the electrical signal, so the loss during the signal conversion increases, and there is a problem of reduced yield.
[0015] Furthermore, in order to detect transmitted electrons, a high-precision detector must be newly installed on the side of the holder in Patent Document 1. This means that a new structure and system of a charged particle beam device must be rebuilt, which requires a lot of cost.
[0016] One of the purposes of the present application is to provide a charged particle beam device that improves the performance of the charged particle beam device and accurately obtains a bright field image or a dark field image of a sample to be observed. Another purpose is to provide a holder for such a charged particle beam device.
[0017] Other objects and novel features will become apparent from the description of this specification and the accompanying drawings.
[0018] Solutions to Solve Problems
[0019] The outline of a typical embodiment among the embodiments disclosed in the present application will be briefly described as follows.
[0020] A holder according to one embodiment includes: an upper member having a first hole for passing a charged particle beam and capable of carrying a sample in the first hole; a bottom member arranged to overlap with the upper member in a plan view; and a side member connected to a portion of the upper member and a portion of the bottom member in a manner that separates the upper member and the bottom member from each other in a cross-sectional view. In addition, the holder includes: an opening portion that is a region surrounded by the upper member, the side member, and the bottom member; and a first scintillator arranged in the opening portion.
[0021] In addition, a charged particle beam device according to one embodiment has: a chamber; a charged particle optical frame, which is mounted on the upper part of the chamber and can emit a charged particle beam; a stage, which is mounted on the lower part of the chamber; a holder, which is provided on the stage; and a first detector, which is located above the holder in a manner separated from the holder and is mounted on the upper part of the chamber. Here, the holder includes: an upper part, which has a first hole, and a sample can be carried in the above-mentioned first hole; a bottom part, which is arranged to overlap with the upper part in a plan view; and a side part, which is connected to a part of the upper part and a part of the bottom part in a manner that the upper part and the bottom part are separated from each other in a cross-sectional view. In addition, the holder includes: an opening, which is a region surrounded by the upper part, the side part and the bottom part; and a first scintillator, which is provided in the opening. In addition, the first light detector has a function of detecting the first light. When the sample is mounted on the above-mentioned upper component and the charged particle beam emitted from the charged particle optical frame irradiates the sample in the above-mentioned first hole and the transmitted charged particles transmitted through the sample collide with the first scintillator, the above-mentioned first light detector can detect the above-mentioned first light emitted from the first scintillator and emitted from the opening.
[0022] Effects of the Invention
[0023] According to the embodiment disclosed in the present application, a holder that can obtain a bright field image or a dark field image of a sample to be observed with high accuracy can be provided. In addition, by using the above-mentioned holder, the performance of the charged particle beam device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 This is a perspective view of the holder according to the first embodiment.
[0025] Figure 2 This is a cross-sectional view of the charged particle beam device according to the first embodiment.
[0026] Figure 3 It is a cross-sectional view of a charged particle beam device according to Modification 1.
[0027] Figure 4 This is a perspective view of an optical component according to the second embodiment.
[0028] Figure 5 This is a perspective view of a holder including an optical component according to the second embodiment.
[0029] Figure 6 This is a cross-sectional view of a charged particle beam device according to the second embodiment.
[0030] Figure 7 This is a cross-sectional view of a charged particle beam device according to a third embodiment.
[0031] Figure 8 This is a stereoscopic view of an optical component according to a fourth embodiment.
[0032] Fig. 9 This is a stereoscopic view of an optical component according to a fourth embodiment.
[0033] Fig.10 This is a perspective view of a holder including an optical component according to a fourth embodiment.
[0034] Fig.11 It is a top view of a holder including an optical component according to a fourth embodiment.
[0035] Fig.12 This is a cross-sectional view of a holder including an optical component according to a fourth embodiment.
[0036] Fig.13 This is a cross-sectional view of a charged particle beam device according to a fourth embodiment.
[0037] Fig.14 This is a cross-sectional view of a charged particle beam device according to a fourth embodiment.
[0038] Fig.15 This is a cross-sectional view of a charged particle beam device according to the fifth embodiment.
[0039] Fig.16 This is a cross-sectional view of a charged particle beam device according to a sixth embodiment.
[0040] Fig.17 This is a stereoscopic view of the optical component of embodiment 7.
[0041] Fig.18 This is a stereoscopic view of the optical component of embodiment 7.
[0042] Fig.19 This is a perspective view of a holder including an optical component according to a seventh embodiment.
[0043] Fig. 20 This is a cross-sectional view of a holder including an optical component according to a seventh embodiment.
[0044] Fig.21It is a simplified cross-sectional view of a charged particle beam device in the related art. DETAILED DESCRIPTION
[0045] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, in all the figures used to illustrate the embodiments, the same symbols are marked on the components having the same function, and their repeated descriptions are omitted. In addition, in the following embodiments, unless particularly necessary, the description of the same or identical parts is not repeated in principle.
[0046] (Implementation Method 1)
[0047] Below, use Figure 1 and Figure 2 The holder HL and the charged particle beam device 100 having the holder HL according to Embodiment 1 will be described. The charged particle beam device 100 is, for example, a scanning electron microscope (SEM). Figure 1 is a perspective view showing the appearance of the holder HL. Figure 2 2 is a cross-sectional view showing the charged particle beam device 100 , and also shows a detailed cross-sectional structure of the holder HL.
[0048] like Figure 1 As shown, the holder HL in the first embodiment includes an upper member HLt, a side member HLs, and a bottom member HLb. The bottom member HLb is arranged to overlap with the upper member HLt in a plan view, and the side member HLs is connected to a part of the upper member HLt and a part of the bottom member HLb in a manner that the upper member HLt and the bottom member HLb are separated from each other in a cross-sectional view. In addition, a portion of the upper member HLt is provided near the center thereof so as to penetrate the upper member HLt. Figure 2 The hole TH1 through which the charged particle beam EB1 is shown.
[0049] The opening OP is a region surrounded by the upper member HLt, the side member HLs, and the bottom member HLb. A scattering angle grating ASA1 and a scintillator SC1 are provided in the opening OP. The scattering angle grating ASA1 partially covers the surface of the scintillator SC1 so that only the transmitted charged particles having a specific scattering angle collide with the scintillator SC1. In Embodiment 1, an example is given in which the scattering angle grating ASA1 and the scintillator SC1 are provided on the bottom member HLb.
[0050] The planar shape of the retaining member HL is circular or elliptical, and a notch NC1 is provided on the inner wall of each of the upper member HLt and the bottom member HLb at the portion where the side member HLs is connected to the upper member HLt and the bottom member HLb. Therefore, in the opening OP, the planar shape of the inner wall of each of the upper member HLt and the bottom member HLb is a shape in which the notch NC1 is provided on a part of the circle or the ellipse.
[0051] In addition, the material of each component (upper component HLt, side component HLs, and bottom component HLb) constituting the holder HL is a metal such as aluminum, or an alloy such as stainless steel. In addition, these materials constituting the holder HL have a function of not transmitting light and X-rays. In addition, the above-mentioned light is light from the vacuum ultraviolet light region to the visible light region. In addition, in Embodiment 1, the case where the upper component HLt, the side component HLs, and the bottom component HLb are integrated is exemplified, but these components may also be constituted by mutually different components.
[0052] like Figure 2 As shown, the upper part HLt can carry the sample SAM in the hole TH1. The upper part HLt includes a table TB and a cap CP provided on the table TB. The table TB is provided for carrying the mesh body MS, on which the sample SAM is provided, and the cap CP is provided for holding the sample SAM and the mesh body MS.
[0053] The charged particle beam device 100 has a chamber 1, a charged particle optical frame 2 installed on the upper part of the chamber 1, a stage 3 installed on the lower part of the chamber 1, a holder HL provided on the stage 3, and a light detector 4 located above the holder HL and installed on the upper part of the chamber 1 in a manner separated from the holder HL.
[0054] The charged particle optical frame 2 includes an electron gun for emitting a charged particle beam (electron beam), a condenser, and a scanning coil for controlling horizontal scanning. The charged particle beam (electron beam) EB1 is emitted from the charged particle optical frame 2 and irradiated toward the sample SAM.
[0055] The stage 3 is a seat for mounting the holder HL, and has a mechanism for adjusting the position in the thickness direction and the horizontal direction and a mechanism for rotating in the horizontal direction. By rotating the stage 3, the orientation of the holder HL mounted on the stage 3 can be changed. In addition, the material constituting the stage 3 is the same as the material constituting each component of the holder HL. In addition, in Embodiment 1, the holder HL can be freely loaded and unloaded on the stage 3.
[0056] The photodetector 4 has a function of detecting the light LI1 emitted from the scintillator SC1 and output from the opening OP of the holder HL. Such a function will be described in detail later.
[0057] The image processing device 6 is connected to the photodetector 4 and has the function of converting the transmitted charged particle information contained in the light LI1 into a transmitted charged particle image. The image processing device 6 includes, for example, a photomultiplier tube, an amplifier circuit, and an A / D converter, through which the optical signal is converted into an electrical signal. That is, the light LI1 is converted into image data of the transmitted charged particle image by the image processing device 6. The image data is visually confirmed by a display device or the like provided inside or outside the image processing device 6. In addition, the image processing device 6 can also be installed inside the charged particle beam device 100, or can be installed outside the charged particle beam device 100.
[0058] The following describes an observation mechanism for a transmitted charged particle image of a sample SAM using the charged particle beam device 100 of Embodiment 1. In addition, in Embodiment 1, a case of observing a dark field image of the sample SAM is described. The observation of the transmitted charged particle image of the sample SAM in Embodiment 1 is performed in a state where the pressure inside the chamber 1 is set within a range of 1×10-6Pa to 3000Pa and the inside of the chamber 1 is filled with air or nitrogen or the like.
[0059] First, prepare a holder HL on which a sample SAM as an observation object is mounted on a mesh body MS, and fix the holder HL on the stage 3. Then, a charged particle beam (electron beam) EB1 is emitted from the charged particle optical frame 2. The charged particle beam EB1 passes through the hole TH1 of the holder HL along the optical axis OA and irradiates the sample SAM. The charged particle beam EB1 is scattered inside the sample SAM and is transmitted below the sample SAM. The transmitted charged particles (transmitted electrons) EB2 that have passed through the sample SAM reach the scattering angle grating ASA1 in the opening OP of the holder HL. The scattering angle grating ASA1 is set to allow only the transmitted charged particles EB2 with a specific scattering angle to pass through. The transmitted charged particles EB2 that have passed through the scattering angle grating ASA1 collide with the scintillator SC1 in the opening OP of the holder HL.
[0060] When the transmitted charged particle EB2 collides with the scintillator SC1, the kinetic energy of the transmitted charged particle EB2 is converted into light energy, and light LI1 is emitted from the scintillator SC1. The light LI1 is emitted from the opening OP and detected by the photodetector 4. The light LI1 detected by the photodetector 4 is acquired as a light signal by the image processing device 6 connected to the photodetector 4, and the light signal is converted into an electrical signal inside the image processing device 6. Thus, image data is generated as a transmitted charged particle image, and by confirming the image data using a display device or the like, the transmitted charged particle image (dark field image) of the sample SAM can be observed.
[0061] In Embodiment 1, the light LI1 emitted from the scintillator SC1 is light from the vacuum ultraviolet region to the visible region and has the same transmitted charged particle information as the transmitted charged particle EB2. Therefore, as described above, the transmitted charged particle image can be confirmed by the image processing device 6 based on the light LI1.
[0062] Hereinafter, the characteristics of the photodetector 4 and the light LI1 used in the first embodiment will be described.
[0063] The light detector 4 is a detector called a low vacuum detector (UVD: Ultra Variable pressure Detector), which is equivalent to the detector disclosed in Patent Document 2, or a detector that can detect light. In particular, UVD is used in low vacuum observation, and the pressure inside the chamber 1 is set to, for example, 30 Pa, and the inside of the chamber 1 is filled with air or nitrogen. Low vacuum observation is mainly performed for the purpose of removing charge during observation of insulating samples, and UVD is installed in a large number of electron microscopes.
[0064] The following is a description of low vacuum observation using the photodetector 4 disclosed in Patent Document 2. In Patent Document 2, in order to capture the amplified signal of the secondary electron gas, a voltage of several hundred V is applied to the bias electrode disposed near the photodetector 4. When an electric field is thus formed between the bias electrode and the sample SAM, the secondary electrons generated on the surface of the sample SAM are accelerated, and the secondary electrons collide with the residual gas molecules, and the residual gas molecules are ionized into positive ions and electrons. The photodetector 4 detects the excitation light generated at this time, thereby forming a secondary electron image of the object in low vacuum.
[0065] The light detector 4 (UVD) of Embodiment 1 was originally designed to detect tiny excitation light and can be a highly sensitive light detector. The light detector 4 can also detect the excitation light as described above, but here, the formation of a transmitted electron image based on the excitation light is not performed, and the formation of a transmitted electron image based on the light LI1 is performed. In other words, the detection of light LI1 is performed in an environment where the light detector 4 does not detect the excitation light. In order to make such a method possible, the voltage of the bias electrode arranged near the light detector 4 is set to be disconnected (0V). At this time, the environment in the chamber 1 can be either a low vacuum or a high vacuum. In Embodiment 1, the light detector 4 only detects the light LI1 emitted from the scintillator SC1, so an accurate transmitted charged particle image can be obtained.
[0066] Thus, in Embodiment 1, the transmitted charged particle EB2 can be directly converted into light LI1 in the holder HL, and the light LI1 can be converted into an electrical signal by the photomultiplier tube connected to the photodetector 4. That is, the signal conversion process is performed in the order of the transmitted charged particle EB2, the light LI1, and the electrical signal, so the loss during signal conversion is reduced, and the yield can be increased.
[0067] In addition, in the transmission electron image, the contrast of the image is greatly different by changing the scattering angle. For example, when observing metal nanoparticles, the contrast is reversed at the scattering angle of 0mrad to 75mrad and the scattering angle of 300mrad to 600mrad. Therefore, in order to obtain a clear transmission electron image, the control of the scattering angle is important. In particular, when the acceleration voltage of the charged particle beam EB1 is 30kV, a scattering angle of less than 75mrad is mostly required in bright field observation. When controlling the scattering angle, the accuracy of the control of the scattering angle can be improved in a place separated from the sample SAM as much as possible. Therefore, in embodiment 1, a scattering angle grating ASA1 serving as a mask is provided on the scintillator SC1, thereby limiting the range of collision between the transmitted charged particle EB2 and the scintillator SC1. That is, by changing the shape of the scattering angle grating ASA1 serving as a mask, the detectable scattering angle can be easily controlled.
[0068] Furthermore, in the first embodiment, the scintillator SC1 in the bottom member HLb is partially covered with the scattering angle grating ASA1 , but the scattering angle grating ASA1 can be changed to a scattering angle grating corresponding to a desired scattering angle also included in the dark field.
[0069] Thus, according to the charged particle beam device 100 of embodiment 1, a bright field image or a dark field image of the sample to be observed can be obtained with high precision. In addition, such an effect can be obtained because a holder HL having an upper part HLt on which the sample SAM can be mounted and a scintillator SC1 disposed in the opening OP is provided. In other words, according to embodiment 1, a holder HL can be provided that can obtain a bright field image or a dark field image of the sample SAM to be observed with high precision. In addition, by using the holder HL, the performance of the charged particle beam device 100 can be improved.
[0070] In addition, as described above, in Embodiment 1, the light LI1 emitted from the scintillator SC1 and emitted from the opening OP of the holder HL can be detected using the photodetector 4 installed on the upper part of the chamber 1. Therefore, it is not necessary to connect a cable or the like to the holder HL. In other words, it is not necessary to newly introduce a dedicated photodetector for detecting the light LI1, develop a new structure of a charged particle beam device, and reconstruct the detection system. Therefore, the cost spent for this can be suppressed.
[0071] (Variant 1)
[0072] Below, use Figure 3 A description will be given of a holder HL and a charged particle beam device 100 including the holder HL according to Modification 1 of Embodiment 1. FIG.
[0073] In Embodiment 1, the case of observing a dark field image of the sample SAM is described, and in Modification 1, the case of observing a bright field image of the sample SAM is described. Therefore, in Modification 1, a scattering angle grating ASA2 is used instead of the scattering angle grating ASA1 of Embodiment 1. In addition, the scintillator SC2 in Modification 1 has the same properties as the scintillator SC1 in Embodiment 1.
[0074] like Figure 3 As shown, in Modification 1, the charged particle beam EB1 is scattered inside the sample SAM, or is not scattered and is transmitted below the sample SAM. The transmitted charged particles EB3 that have passed through the sample SAM pass through the scattering angle grating ASA2 and collide with the scintillator SC2 in the opening OP of the holder HL.
[0075] The transmitted charged particles EB3 of variant example 1 are transmitted in the opening OP at a smaller scattering angle than the transmitted charged particles EB2 of embodiment 1. That is, the angle formed by the transmission direction of the transmitted charged particles EB3 and the optical axis OA is smaller than the angle formed by the transmission direction of the transmitted charged particles EB2 and the optical axis OA. Therefore, in the retaining member HL of variant example 1, a scattering angle grating ASA2 is provided instead of the scattering angle grating ASA1 due to the transmitted charged particles EB3 that are transmitted at a small scattering angle. The scattering angle grating ASA2 of variant example 1 is designed to allow only the transmitted charged particles EB3 to pass through.
[0076] When the transmitted charged particle EB3 collides with the scintillator SC2, the kinetic energy of the transmitted charged particle EB3 is converted into light energy, and light LI2 is emitted from the scintillator SC2. The light LI2 is emitted from the opening OP and detected by the photodetector 4. Moreover, based on the detected light LI2, a transmitted charged particle image (bright field image) of the sample SAM is obtained by the image processing device 6.
[0077] As described above, in Modification 1, except for the difference between the dark field image and the bright field image, substantially the same effect as that of Embodiment 1 can be obtained.
[0078] (Implementation Method 2)
[0079] Below, use Figures 4 to 6 The optical component (component) OM1, the holder HL having the optical component OM1, and the charged particle beam device 200 having the holder HL in Embodiment 2 will be described. In addition, the differences between Embodiment 2 and Embodiment 1 will be mainly described below.
[0080] In Embodiment 2, Figure 1 The holder HL described above configures the optical component OM1. Figure 4 is a perspective view showing the appearance of the optical component OM1. Figure 5 2 is a perspective view showing the appearance of the holder HL to which the optical component OM1 is mounted. Figure 6 2 is a cross-sectional view showing a charged particle beam device 200 having a holder HL.
[0081] like Figure 4 As shown, the optical component OM1 is composed of a light guide LG1 having a hole TH2. The light guide LG1 has a function of transmitting light and not transmitting X-rays. The material constituting the light guide LG1 is, for example, glass or acrylic resin.
[0082] The planar shape of the optical component OM1 (light guide LG1) is a shape in which a notch NC2 is provided in a part of a circle or an ellipse. In other words, the optical component OM1 is a columnar body in which a notch NC2 is provided in a part of a cylinder or an ellipse.
[0083] like Figure 5 As shown, the optical component OM1 is disposed in the opening OP of the holder HL. At this time, a portion of the light guide LG1 is covered by the side member HLs of the holder HL, and another portion of the light guide LG1 is exposed from the side member HLs. The cutout NC2 of the optical component OM1 is a portion covered by the side member HLs, and is located in the opening OP in a manner corresponding to the cutout NC1 of the holder HL. That is, the optical component OM1 is disposed in the opening OP in a manner that the cutout NC2 is connected to the side member HLs. Therefore, when the optical component OM1 is mounted on the holder HL, it is easy to align the optical component OM1 and the holder HL.
[0084] In addition, the hole TH2 of the optical component OM1 overlaps with the hole TH1 of the holder HL in a plan view, and the diameter of the hole TH2 is larger than the diameter of the hole TH1.
[0085] like Figure 6 As shown, the charged particle beam EB1 emitted from the charged particle optical frame 2 passes through the hole TH1 to irradiate the sample SAM, and is scattered inside the sample SAM and transmitted below the sample SAM. The scintillator SC1 is arranged between the light guide LG1 and the bottom member HLb in a manner that a portion is exposed in the hole TH2. The transmitted charged particle EB2 passes through the scattering angle grating ASA1 in the hole TH2 and collides with the scintillator SC1.
[0086] The light LI1 emitted from the scintillator SC1 is transmitted through the light guide LG1 , emitted from the opening OP using the side surface LG1 s of the light guide LG1 as an emission surface, and detected by the photodetector 4 .
[0087] In addition, the light guide LG1 has a hole TH2, so the side surface of the light guide LG1 has an inner diameter surface along the hole TH2 and an outer diameter surface corresponding to the outer wall of the light guide LG1. When the “side surface of the light guide LG1” is described in this application, it refers to the outer diameter surface of the light guide LG1. Therefore, the symbol LG1s is used for both the side surface of the light guide LG1 and the emission surface of the light LI1.
[0088] As described above, the light guide LG1 has a function of transmitting light. Here, the light LI1 emitted from the scintillator SC1 is light from the vacuum ultraviolet region to the visible light region. Therefore, it can be said that the light guide LG1 has a function of transmitting light from the vacuum ultraviolet region to the visible light region.
[0089] However, when observing a sample SAM, it is sometimes required to detect the X-rays emitted from the sample SAM and analyze the elements contained in the sample SAM. Figure 6 As shown, the X-ray detector 5 is located above the holder HL in a manner separated from the holder HL, and is mounted on the upper part of the chamber 1 of the charged particle beam device 200. Such an X-ray detector 5 is generally called an EDS (Energy Dispersive X-ray Spectrometry) detector.
[0090] When the charged particle beam EB1 is irradiated to a specific part of the sample SAM, characteristic X-rays with element-specific information are generated. The EDS detector is used to detect the X-rays, and the energy and intensity thereof are measured, so that the elements constituting the specific part can be qualitatively analyzed. In the present application, the X-rays XR1 to XR3 described below are, for example, such characteristic X-rays.
[0091] like Figure 6 As shown, when the charged particle beam EB1 irradiates the sample SAM, X-rays XR1 are emitted from the sample SAM, and when the transmitted charged particles EB2 collide with the scintillator SC1, X-rays XR2 are emitted from the scintillator SC1. In order to analyze the elements contained in the sample SAM, it is sufficient to detect the X-rays XR1. If the X-ray detector 5 also detects the X-rays XR2, there is a problem that accurate element analysis cannot be performed.
[0092] Therefore, as described above, the light guide LG1 of the second embodiment has a function of preventing X-rays from being transmitted. Therefore, the X-ray detector 5 cannot detect the X-ray XR2, and can only detect the X-ray XR1. In addition, if the thickness of the light guide LG1 is too thin, there is a possibility that the X-ray XR2 is transmitted, so the light guide LG1 is preferably formed with a sufficient thickness so that the X-ray XR2 is not transmitted.
[0093] (Implementation method 3)
[0094] Below, use Figure 7A charged particle beam device 300 including a holder HL according to Embodiment 3 will be described. In addition, the following mainly describes the differences between Embodiment 3 and Embodiment 2.
[0095] In the second embodiment, the mesh body MS for placing the sample SAM is provided on the upper part HLt of the holder HL, but in the third embodiment, the upper part HLt is not provided on the holder HL, and a rotating disk 3d is provided as a part of the stage 3 instead of the upper part HLt. That is, the hole TH1, the mesh body MS, and the sample SAM mounted on the mesh body MS are provided on the rotating disk 3d.
[0096] The stage 3 of the third embodiment includes a base 3a, a rotating part 3b, a support 3c and a rotating disk 3d. The base 3a is mounted on the lower part of the chamber and has a mechanism for adjusting the position in the thickness direction and the horizontal direction and a mechanism for rotating in the horizontal direction. The rotating part 3b has a mechanism for rotating the support 3c and can rotate the rotating disk 3d via the support 3c. The support 3c is connected to the rotating part 3b and the rotating disk 3d. In addition, when replacing the sample SAM, the support 3c and the rotating disk 3d can be easily removed from the stage 3 (rotating part 3b).
[0097] The rotating disk 3d has a table TB and a cap CP similarly to the upper member HLt of Embodiment 2, and has a larger surface area than the upper member HLt of Embodiment 2. The rotating disk 3d is provided with a plurality of holes TH1, and the mesh body MS and the sample SAM can be placed in each hole TH1.
[0098] In addition, the holder HL of the third embodiment does not have an upper member HLt as described above, but is composed of a side member HLs and a bottom member HLb. Therefore, in the third embodiment, the opening OP is an area surrounded by the rotating disk 3d, which is a part of the stage 3, the side member HLs, and the bottom member HLb. In addition, the same optical member OM1 as in the second embodiment is provided in the opening OP, and a scintillator SC1 is provided between the light guide LG1 and the bottom member HLb.
[0099] For example, after observing one sample SAM, the rotating part 3b of the stage 3 is rotated, thereby rotating the rotating disk 3d, and the next sample SAM can be observed. If the holder HL and the charged particle beam device 300 of the third embodiment are used in this way, each time a plurality of samples SAM are observed, the following work can be omitted: restoring the pressure in the chamber 1 to the atmospheric pressure, replacing the holder HL with the next sample SAM, and adjusting the pressure in the chamber 1 again, etc.
[0100] (Implementation 4)
[0101] Below, use Figure 8 to Figure 14, the optical component (component) OM2 of Embodiment 4, the holder HL having the optical component OM2, and the charged particle beam device 400 having the holder HL are described. In addition, the following mainly describes the differences between Embodiment 4 and Embodiments 1 and 2.
[0102] In Embodiment 4, Figure 1 The holder HL described above configures the optical component OM2. Figure 8 is a perspective view showing the appearance of the optical component OM2. Fig. 9 It means Figure 8 A perspective view of the appearance of the optical component OM2 on the opposite side, Fig.10 1 is a perspective view showing the appearance of the holder HL to which the optical component OM2 is mounted. Fig.11 LG2 is a plan view showing the approximate positions of the emission surface LG2s of the light guide LG2 and the emission surface LG3s of the light guide LG3. Fig.12 is a detailed cross-sectional view of the holder HL having the optical component OM2, Fig.13 2 is a cross-sectional view showing a charged particle beam device 400 including a holder HL.
[0103] like Figure 8 and Fig. 9 As shown, the optical component OM2 includes a light guide LG2 and a light guide LG3 provided with a hole TH3 and a hole TH4. The light guide LG2 and the light guide LG3 have the function of transmitting light but not transmitting X-rays, similarly to the light guide LG1 of Embodiment 2. The material constituting the light guide LG2 and the light guide LG3 is, for example, glass or acrylic resin.
[0104] In addition, the side surfaces of the light guide LG2 and the light guide LG3 are partially covered by the blocking layer BL. The material constituting the blocking layer BL is the same as that of the holder HL and the stage 3, and is a metal such as aluminum, or an alloy such as stainless steel. In addition, these materials constituting the blocking layer BL have the function of not allowing light and X-rays to pass through. In addition, the above-mentioned light is light from the vacuum ultraviolet light region to the visible light region.
[0105] The planar shape of the optical component OM2 is similar to the optical component OM1 of Embodiment 2, and is a shape in which the notch NC2 is provided in a part of a circle or an ellipse. In other words, the optical component OM2 is a columnar body in which the notch NC2 is provided in a part of a cylinder or an ellipse.
[0106] In addition, in the optical component OM2, a blocking layer BL is partially provided on each side surface of the light guide LG2 and the light guide LG3. Therefore, the planar shape of the optical component OM2 is a shape in which a thin step (convexoconcave) is formed in a part of the arc of a circle or an ellipse, and therefore, strictly speaking, the planar shape of each of the light guide LG2 and the light guide LG3 is a shape in which a notch NC2 is provided in a part of a circle or an ellipse. However, the main purpose of the description of the planar shape here is the notch NC2, and therefore, in Embodiment 4, such a small difference is recognized as an error, and the planar shape of the optical component OM2 is defined as a shape in which a notch NC2 is provided in a part of a circle or an ellipse.
[0107] like Fig.10 As shown, the optical component OM2 is disposed in the opening OP of the holder HL. At this time, the cutout NC2 of the optical component OM2 is a portion covered by the side member HLs, and is located in the opening OP in a manner corresponding to the cutout NC1 of the holder HL. That is, the optical component OM2 is disposed in the opening OP in a manner that the cutout NC2 is in contact with the side member HLs. Thus, when the optical component OM2 is mounted on the holder HL, it is easy to align the optical component OM2 and the holder HL.
[0108] In addition, the hole TH3 and the hole TH4 of the optical component OM2 overlap with the hole TH1 of the holder HL in a plan view.
[0109] In the fourth embodiment, the portion of the optical component OM2 along the cutout NC2 is covered by the blocking layer BL. Fig.10 As shown, this portion is also covered by the side part HL of the holder HL, so the blocking layer BL is not necessary and may not be provided in this portion.
[0110] As described above, the side surfaces of the light guide LG2 and the light guide LG3 are partially covered by the side parts HLs of the holder HL and the blocking layer BL. In other words, in a plan view, the side surfaces of the light guide LG2 and the light guide LG3 are separated by the side parts HLs and the blocking layer BL. Fig.11 As shown, the side surface (emission surface) LG2s of the light guide LG2 and the side surface (emission surface) LG3 of the light guide LG3 are located on opposite sides and exposed at a certain degree of opening angle. The opening angles of the emission surfaces LG2s and LG3s are equivalent to the central angles with the center of the optical component OM2 (the center of the hole TH3, the center of the hole TH4) as the base point. In the fourth embodiment, considering the range of light LI2 and light LI3 emission, they are respectively set to about 60 to 120 degrees. Fig.11 The case where the above-mentioned opening angle is 120 degrees is exemplified.
[0111] In addition, the light guide LG2 or the light guide LG3 has the hole TH3 or the hole TH4, and therefore, similarly to the light guide LG1 of Embodiment 2, when described as "the side surface of the light guide LG2" or "the side surface of the light guide LG3" in the present application, they represent the outer diameter surface of each of the light guide LG2 and the light guide LG3. Therefore, the symbol LG2s is used for both the side surface of the light guide LG2 and the emission surface of the light LI1 as described above, and the symbol LG3s is used for both the side surface of the light guide LG3 and the emission surface of the light LI2 as described above.
[0112] like Fig.12 and Fig.13 As shown, the blocking layer BL is provided between the light guide LG2 and the light guide LG3 so that the light guide LG2 and the light guide LG3 do not contact each other. Thus, the light LI2 that can pass through the light guide LG2 and the light LI3 that can pass through the light guide LG3 interfere with each other.
[0113] A hole TH3 is provided in the light guide LG2, and a hole TH4 communicating with the hole TH3 and having a smaller diameter than the hole TH3 is provided in the light guide LG2, the blocking layer BL, and the light guide LG3. The hole TH3 has a larger diameter than each of the hole TH1 and the hole TH4.
[0114] The scintillator SC1 is provided on the light guide LG2 located around the hole TH4 in the hole TH3, and is in direct contact with the light guide LG2. The scintillator SC2 is provided between the light guide LG3 and the bottom member HLb in a manner that a portion is exposed in the hole TH4, and is in direct contact with the light guide LG3. Therefore, the light LI1 emitted from the scintillator SC1 directly propagates inside the light guide LG2, and the light LI2 emitted from the scintillator SC2 directly propagates inside the light guide LG3.
[0115] In addition, a reflective film (mirror film) RF is provided between the light guide LG2 and the blocking layer BL, and between the light guide LG3 and the blocking layer BL, for the purpose of reflecting the light LI1 and the light LI2. The material constituting the reflective film RF is, for example, a metal such as aluminum or an alloy such as brass. In addition, in Embodiment 4, the reflective film RF is provided in such a manner that the light LI1 propagating in the light guide LG2 and the light LI2 propagating in the light guide LG3 are not attenuated, respectively. However, if such a purpose can be fully achieved by the blocking layer BL, the reflective film RF is not necessary and may not be provided. For example, the blocking layer BL may also have the same function as the reflective film RF by mirror-finishing the surface of the blocking layer BL.
[0116] like Fig.12 , Fig.13 as well as Fig.14As shown, the charged particle beam EB1 emitted from the charged particle optical frame 2 passes through the hole TH1 to irradiate the sample SAM, is scattered inside the sample SAM, and is transmitted to the bottom of the sample SAM. Among the transmitted charged particles that have passed through the sample SAM, the transmitted charged particle EB2 that is transmitted at a relatively large scattering angle collides with the scintillator SC1 in the hole TH3, and the transmitted charged particle EB3 that is transmitted at a relatively small scattering angle collides with the scintillator SC2 in the hole TH4. In other words, the angle formed by the transmission direction of the transmitted charged particle EB3 and the optical axis OA is smaller than the angle formed by the transmission direction of the transmitted charged particle EB2 and the optical axis OA, and the transmitted charged particle EB2 collides with the scintillator SC1 in the hole TH3, and the transmitted charged particle EB3 passes through the scattering angle grating ASA2 in the hole TH4 and collides with the scintillator SC2.
[0117] Fig.13 The light LI1 emitted from the scintillator SC1 is transmitted through the light guide LG2 , emitted from the opening OP with the side surface LG2 s of the light guide LG2 as an emission surface, and detected by the photodetector 4 .
[0118] Fig.14 The case of detecting light LI2 is shown. Fig.13 In this case, the stage 3 is rotated to rotate the holder HL. Fig.14 As shown, the light LI2 emitted from the scintillator SC2 is transmitted through the light guide LG3 , emitted from the opening OP with the side surface LG3 s of the light guide LG3 as an emission surface, and detected by the photodetector 4 .
[0119] Thus, the light guide LG2 and the light guide LG3 have the function of transmitting light. Here, the light LI1 emitted from the scintillator SC1 and the light LI2 emitted from the scintillator SC2 are lights from the vacuum ultraviolet region to the visible light region. Therefore, it can also be said that the light guide LG2 and the light guide LG3 have the function of transmitting light from the vacuum ultraviolet region to the visible light region.
[0120] However, in the fourth embodiment, similarly to the second embodiment, when observing the sample SAM, it is sometimes necessary to detect the X-rays emitted from the sample SAM and analyze the elements contained in the sample SAM. Fig.13 and Fig.14 As shown, an X-ray detector 5 similar to that of the second embodiment is installed in the chamber 1 of the charged particle beam device 400 .
[0121] Here, when the charged particle beam EB1 irradiates the sample SAM, X-rays XR1 are emitted from the sample SAM, when the transmitted charged particles EB2 collide with the scintillator SC1, X-rays XR2 are emitted from the scintillator SC1, and when the transmitted charged particles EB3 collide with the scintillator SC2, X-rays XR3 are emitted from the scintillator SC2.
[0122] The light guide LG2 and the light guide LG3 of the fourth embodiment have the function of not allowing X-rays to pass through. Therefore, the X-ray detector 5 cannot detect the X-rays XR2 and XR3, and can only detect the X-ray XR1. In addition, if the thickness of the light guide LG2 and the light guide LG3 is too thin, there is a problem of the transmission of the X-rays XR2 and XR3. Therefore, the light guide LG2 and the light guide LG3 are preferably formed with a sufficient thickness so that the X-rays XR2 and XR3 cannot pass through.
[0123] In addition, the blocking layer BL and the holder HL are respectively made of metal materials or alloy materials, and have the function of preventing light and X-rays from being transmitted. Therefore, in the fourth embodiment, the light LI1 and the light LI2 are not mixed with each other, and are emitted from the emission surface LG2s and the emission surface LG3s respectively. Therefore, the light LI1 and the light LI2 can be reliably detected by the photodetector 4. Moreover, the X-rays XR2 and XR3 can be blocked by the light guide LG2, the light guide LG3, the blocking layer BL and the holder HL.
[0124] In Embodiment 4, light LI1 and light LI2 can be simultaneously emitted from the transmitted charged particles EB3 and EB4 having different scattering angles. Then, light LI1 and light LI2 can be detected by the photodetector 4 simply by rotating the stage 3 without removing the holder HL from the chamber 1.
[0125] For example, in the first or second embodiment, when trying to obtain both a dark field image and a bright field image from one sample, it is necessary to replace the holder HL and replace the scintillator SC1 and the scattering angle grating ASA1 with the scintillator SC2 and the scattering angle grating ASA2. In contrast, in the fourth embodiment, both a dark field image and a bright field image can be obtained even without replacing the holder HL.
[0126] In particular, when the structure to be observed in the sample SAM is a structure of nanometer (nm) units and both a dark field image and a bright field image are to be obtained from the structure, it is very difficult to find the same object and the same observation point each time the holder HL is replaced. As in Embodiment 4, by using the holder HL having the optical component OM2, such a problem can be suppressed and a high-precision dark field image and bright field image can be obtained.
[0127] (Implementation method 5)
[0128] Below, use Fig.15 A charged particle beam device 500 according to Embodiment 5 will be described. In addition, the differences between Embodiment 5 and Embodiment 4 will be mainly described below.
[0129] In the fifth embodiment, similarly to the fourth embodiment, Figure 1 The holder HL described is configured in Figure 8 and Fig. 9 However, in Embodiment 5, unlike Embodiment 4, Fig.15 As shown, the two photodetectors 4a and 4b are located above the holder HL in a manner separated from the holder HL and are installed in the upper part of the chamber 1. These photodetectors 4a and 4b have the same functions as the photodetector 4 of the fourth embodiment and are connected to the same image processing device 6.
[0130] The photodetector 4a and the photodetector 4b are respectively opposed to the light guide LG2 and the light guide LG3, and are located on opposite sides of the holder HL. That is, the photodetector 4a is located near the emission surface LG2s of the light guide LG2 than the photodetector 4b, and the photodetector 4b is located near the emission surface LG3s of the light guide LG3 than the photodetector 4a.
[0131] The light LI1 emitted from the emission surface LG2s is detected by the photodetector 4a, and the light LI2 emitted from the emission surface LG3s is detected by the photodetector 4b. Therefore, in the fifth embodiment, compared with the fourth embodiment, the cost of the charged particle beam device 500 increases accordingly to the provision of the photodetector 4b, but the light LI1 and the light LI2 can be detected without rotating the stage 3. Therefore, the dark field image and the bright field image of the sample SAM can be obtained at the same time.
[0132] (Implementation 6)
[0133] Below, use Fig.16 A charged particle beam device 600 having a holder HL according to Embodiment 6 is described. In addition, the following mainly describes the differences between Embodiment 6 and Embodiment 5. In addition, the technical idea disclosed in Embodiment 6 is similar to the technical idea disclosed in the above-mentioned Embodiment 3, so in the following description, the description that is repeated with the content described in Embodiment 3 is sometimes omitted.
[0134] In the sixth embodiment, the optical component OM2, the photodetector 4a, and the photodetector 4b are used in the same manner as in the fifth embodiment, but in the same manner as in the third embodiment, a rotating disk 3d is provided as a part of the stage 3 instead of the upper component HLt. That is, the hole TH1, the mesh body MS, and the sample SAM mounted on the mesh body MS are provided on the rotating disk 3d.
[0135] The stage 3 of the sixth embodiment has a base portion 3a, a rotating portion 3b, a support portion 3c, and a rotating disk 3d in the same manner as in the third embodiment. In addition, the holder HL of the sixth embodiment is not provided with an upper member HLt as described above, and is composed of a side member HLs and a bottom member HLb. Therefore, in the sixth embodiment, the opening OP is also an area surrounded by the rotating disk 3d, the side member HLs, and the bottom member HLb, which are part of the stage 3. In addition, an optical member OM2 similar to that of the fifth embodiment is provided in the opening OP.
[0136] In Embodiment 6, after observing one sample SAM, the rotating portion 3b of the stage 3 is rotated, thereby rotating the rotating disk 3d, and the next sample SAM can be observed. If the holder HL and the charged particle beam device 600 of Embodiment 3 are used in this way, the following work can be omitted each time a plurality of samples SAM are observed: returning the pressure in the chamber 1 to atmospheric pressure, replacing the holder HL with the next sample SAM, and adjusting the pressure in the chamber 1 again, etc.
[0137] That is, not only can the light LI1 and the light LI2 be detected simultaneously, and the dark field image and the bright field image of the sample SAM be obtained simultaneously, but also the next sample SAM can be observed quickly even without replacing the holder HL, etc. Moreover, for the next sample SAM, the light LI1 and the light LI2 can also be detected simultaneously, and both the dark field image and the bright field image of the sample SAM can be obtained.
[0138] In addition, in Embodiment 6, a case where two photodetectors, the photodetector 4a and the photodetector 4b, are provided based on Embodiment 5 is described, but the charged particle beam device 600 of Embodiment 6 can also be applied when only one photodetector 4 is provided as in Embodiment 4. In this case, the light LI1 and the light LI2 cannot be detected at the same time, but the cost of the charged particle beam device 600 can be suppressed accordingly, corresponding to not providing the photodetector 4b.
[0139] (Implementation 7)
[0140] Below, use Figures 17 to 20 , the optical component (component) OM3 of Embodiment 7 and the holder HL including the optical component OM3 are described. In addition, the differences between Embodiment 7 and Embodiment 4 are mainly described below.
[0141] In Embodiment 7, Figure 1 The optical component OM3 is arranged on the holder HL described above. The charged particle beam device of the seventh embodiment is the same as the charged particle beam device 400 of the fourth embodiment except that the optical component OM2 is replaced by the optical component OM3.
[0142] Fig.17is a perspective view showing the appearance of the optical component OM3. Fig.18 It means Fig.17 A perspective view of the appearance of the optical component OM3 on the opposite side, Fig.19 1 is a perspective view showing the appearance of the holder HL to which the optical component OM3 is mounted. Fig. 20 It is a detailed cross-sectional view of the holder HL including the optical component OM3.
[0143] like Fig.17 and Fig.18 As shown, the optical component OM3 has the light guide LG2 and the light guide LG3 in the same manner as the optical component OM2 of the fourth embodiment, but the position where the blocking layer BL covers the side surfaces of the light guide LG2 and the light guide LG3 is different from that of the optical component OM2 of the fourth embodiment. However, the positions of the emission surface LG2s of the light guide LG2 and the emission surface LG3s of the light guide LG3 in the top view are the same as those of the optical component OM3 of the fourth embodiment. Fig.11 The planar shape of the optical component OM3 is a shape in which the notch NC2 is provided in a part of a circle or an ellipse, similarly to the optical component OM2 of Embodiment 4. In other words, the optical component OM3 is a columnar body in which the notch NC2 is provided in a part of a cylinder or an ellipse.
[0144] like Fig.19 As shown, the optical component OM3 is disposed in the opening OP of the holder HL. At this time, the optical component OM3 is disposed in the opening OP so that the cutout NC2 is in contact with the side member HLs. Thus, when the optical component OM3 is mounted on the holder HL, the alignment of the optical component OM3 and the holder HL becomes easy.
[0145] In addition, the hole TH3 and the hole TH4 of the optical component OM2 overlap with the hole TH1 of the holder HL in a plan view.
[0146] In addition, in Embodiment 7, the portion of the optical component OM3 along the cutout NC2 is covered by the blocking layer BL, as shown in FIG. Fig.19 As shown, this portion is also covered by the side part HL of the holder HL, so the blocking layer BL is not necessary and may not be provided in this portion.
[0147] like Fig. 20 As shown, the blocking layer BL is provided between the light guide LG2 and the light guide LG3 so that the light guide LG2 and the light guide LG3 do not contact each other. This can prevent the light LI2 transmitted through the light guide LG2 and the light LI3 transmitted through the light guide LG3 from interfering with each other.
[0148] A hole TH3 is provided in the light guide LG2, and a hole TH4 communicating with the hole TH3 and having a smaller diameter than the hole TH3 is provided in the light guide LG2 and the shielding layer BL. The hole TH3 has a larger diameter than each of the hole TH1 and the hole TH4.
[0149] The scintillator SC1 is disposed on the light guide LG2 located around the hole TH4 in the hole TH3 and is in direct contact with the light guide LG2. The scintillator SC2 is disposed on the light guide LG3 in such a manner that a portion of the scintillator SC2 is exposed in the hole TH4 and is in direct contact with the light guide LG3. Therefore, the light LI1 emitted from the scintillator SC1 directly propagates inside the light guide LG2, and the light LI2 emitted from the scintillator SC2 directly propagates inside the light guide LG3 below the scintillator SC2. In addition, the scattering angle grating ASA2 is disposed between the scintillator SC2 and the blocking layer BL.
[0150] The light LI1 emitted from the scintillator SC1 is transmitted through the light guide LG2, emitted from the opening OP with the side surface LG2s of the light guide LG2 as the emission surface, and detected by the photodetector 4. In addition, the light LI2 emitted from the scintillator SC2 is transmitted through the light guide LG3, emitted from the opening OP with the side surface LG3s of the light guide LG3 as the emission surface, and detected by the photodetector 4 by rotating the holder HL.
[0151] In addition, a reflective film (mirror film) RF is provided between the light guide LG2 and the blocking layer BL and between the light guide LG3 and the blocking layer BL for the purpose of reflecting the light LI1 and the light LI2, but the reflective film RF is sometimes not provided for the same reason as described in embodiment 4.
[0152] As described above, the charged particle beam device of Embodiment 7 is the same as the charged particle beam device 400 of Embodiment 4 except that the optical component OM2 is changed to the optical component OM3. Therefore, the description of other observation mechanisms and their effects is substantially the same as that of Embodiment 4, and therefore, their detailed description is omitted.
[0153] In Embodiment 7, two light detectors, light detector 4a and light detector 4b, may be installed on the upper portion of chamber 1 as in Embodiment 5. In this case, light LI1 and light LI2 can be detected without rotating stage 3, so that dark field image and bright field image of sample SAM can be obtained simultaneously.
[0154] In Embodiment 7, a rotating disk 3d having a plurality of mesh bodies MS and a plurality of samples SAM may be provided as part of the stage 3 instead of the upper member HLt, as in Embodiment 6. In this case, the next sample SAM can be observed quickly without replacing the holder HL.
[0155] As mentioned above, although the form for implementing this invention was demonstrated concretely, this invention is not limited to the said embodiment, Various changes are possible within the range which does not deviate from the summary.
[0156] Explanation of symbols
[0157] 1—chamber, 2—charged particle optical frame, 3—stage, 3a—base, 3b—rotating part, 3c—pillar part, 3d—rotating disk, 4, 4a, 4b—photodetector, 5—X-ray detector, 6—image processing equipment, 100, 200, 300, 400, 500, 600—charged particle beam device, ASA1~ASA3—scattering angle grating, BL—shielding layer, CP—cap, EB1—charged particle beam (electron beam), EB2~EB4—transmitted charged particles (transmitted electrons), EB5, EB6—secondary electrons, ETD— Detector, HL—holding part, HLb—bottom part, HLs—side part, HLt—upper part, LG1~LG3—light guide, LG1s~LG3s—side surface (outer diameter surface, emission surface), LI1, LI2—light, NC1, NC2—cut part, MR—reflective film (mirror film), MS—mesh body, OA—optical axis, OM1~OM3—optical part (component), OP—opening part, RF—reflecting plate, SAM—sample, SC1, SC2—scintillator, TB—working table, TH1~TH4—hole, XR1~XR3—X-ray.
Claims
1. A retaining member, comprising: an upper member having a hole for passing the charged particle beam and capable of carrying a sample in the hole; A bottom member, which is arranged to overlap with the upper member in a plan view; A side member connected to a portion of the upper member and a portion of the bottom member so that the upper member and the bottom member are separated from each other in cross-sectional view; an opening portion, which is a region surrounded by the upper member, the side members, and the bottom member; and a scintillator disposed in the opening; The upper part includes a workbench and a cap disposed above the workbench. wherein the workbench includes a recess in the upper surface of the workbench, the sample can be placed in the recess, and The width of the recess in a direction perpendicular to the transmission direction of the charged particle beam is greater than the width of the hole.
2. The holder according to claim 1, wherein: The scintillator is arranged on one side of the bottom member.
3. The holder according to claim 1, wherein: The above-mentioned bottom member can be mounted on a stage of a charged particle beam device.
4. A charged particle beam device, comprising: Chamber; a charged particle optical frame, which is mounted on the upper part of the chamber and is capable of emitting a charged particle beam; A stage installed at the bottom of the chamber; A retaining member disposed on the above-mentioned loading platform; and a light detector which is located above the holder in a manner separated from the holder and is mounted on the upper part of the chamber, The above-mentioned retaining member comprises: an upper member having a hole in which a sample can be placed; A bottom member, which is arranged to overlap with the upper member in a plan view; A side member connected to a portion of the upper member and a portion of the bottom member so that the upper member and the bottom member are separated from each other in cross-sectional view; an opening portion, which is a region surrounded by the upper member, the side members, and the bottom member; and a scintillator disposed in the opening; The upper part includes a workbench and a cap disposed above the workbench. The workbench includes a recessed portion in the upper surface of the workbench, and the sample can be placed in the recessed portion. wherein the width of the recess in a direction perpendicular to the transmission direction of the charged particle beam is greater than the width of the hole, In which, when the above-mentioned sample is carried on the above-mentioned upper part, and the sample in the above-mentioned hole is irradiated by the charged particle beam emitted from the above-mentioned charged particle optical frame and the transmitted charged particles passing through the above-mentioned sample collide with the above-mentioned scintillator, the above-mentioned light detector can detect the light emitted from the above-mentioned scintillator and emitted from the above-mentioned opening.
5. The charged particle beam device according to claim 4, wherein: The above-mentioned light detector is a low vacuum detector.
Citation Information
Patent Citations
Scanning transmission electron microscope
JP2008066057A
Charged particle beam device
JP2013225530A
Charged particle beam device and sample observation method
CN104584181A
Charged particle beam device, position adjusting method for diaphragm, and diaphragm position adjusting jig
CN104685602A