A mini three-temperature sorting machine

Abstract

The present invention relates to the field of chip processing technology, and discloses a mini three-temperature sorting machine, including a test box, a test assembly, one side of the test assembly is fixedly mounted with one end of a test box adjustment arm, the other end of the test box adjustment arm is fixedly mounted with an electric control box, the upper surface of the electric control box is provided with a human-machine interaction system, and the lower surface of the electric control box is fixedly mounted with a refrigeration system. The present invention has a compact and novel structure, a reasonable design of the electromechanical system, and high software fault tolerance, which can greatly save manpower, improve the continuity, stability, and reliability of the chip testing process, and improve the standardization of chip test result data management, and solve the problem that the prior art needs to manually take and place materials and test in a high and low temperature box or a heat flow hood, which is inefficient and requires a large amount of manpower, which wastes costs and easily causes safety accidents.

Description

Technical Field

[0001] The invention relates to the technical field of chip sorting, in particular to a mini three-temperature sorting machine. Background Art

[0002] After large-scale integrated circuits are packaged, they become chips, which are usually used in different fields such as communications, military industry, scientific research, and detection. After packaging, the chip needs to be tested for performance at high temperature, low temperature, and room temperature. The main equipment responsible for the test includes a system-level three-temperature sorter responsible for establishing a temperature control environment, product handling, and classification and placement. During the chip testing process, the three-temperature sorter transports the chip from the standard JEDEC loading tray to the preheating tray, and then from the preheating tray to the test station for three-temperature testing. When the test is completed, the tested chip is transported to the unloading tray, or the unqualified tray.

[0003] In the prior art, materials need to be manually taken out and put in and tested in a high and low temperature box or a heat flow hood, which is inefficient and requires a lot of manpower, which wastes costs and easily causes safety accidents.

[0004] Currently, no effective solution has been proposed for the problems in the related technologies. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] In view of the shortcomings of the prior art, the present invention provides a mini three-temperature sorting machine, which solves the problem that the prior art requires manual material taking and placing and testing in a high and low temperature box or a heat flow hood, which is inefficient and requires a large amount of manpower, which not only wastes costs but also easily causes safety accidents.

[0007] (II) Technical solution

[0008] In order to solve the technical problems in the above-mentioned prior art that the materials need to be manually taken out and put in and tested in a high and low temperature box or a heat flow hood, which is inefficient and requires a large amount of manpower, which wastes costs and easily causes safety accidents, the present invention provides the following technical solutions:

[0009] A mini three-temperature sorting machine comprises a test box, a test assembly, one side of the test assembly is fixedly mounted with one end of a test box adjustment arm, the other end of the test box adjustment arm is fixedly mounted with an electric control box, the upper surface of the electric control box is provided with a human-machine interaction system, and the lower surface of the electric control box is fixedly mounted with a refrigeration system.

[0010] Preferably, the test assembly comprises a test box, the inner cavity of the test box is a working cavity, a test socket is fixedly mounted on the bottom of the test box, and a test socket temperature compensation module is fixedly mounted around the upper part of the test socket.

[0011] Preferably, a pressure head moving module is fixedly installed on the inner wall of the test box, and a pressure head testing module is fixedly installed on the pressure head moving module to drive the pressure head testing module to move along the X and Y axis directions of the test box, and the pressure head testing module can move along the Z axis direction of the test box.

[0012] Preferably, a preheating plate evaporator is fixedly installed at the bottom of the test box, and the preheating plate evaporator is in close contact with the test socket, a material inlet and outlet module is fixedly installed at the bottom of the test box, and the material inlet and outlet module is in close contact with the preheating plate evaporator, and a material inlet and outlet door is opened on the side of the test box, and the material inlet and outlet door corresponds to the material inlet and outlet module.

[0013] Preferably, a high-precision nozzle module is installed on the side of the pressure head testing module.

[0014] A chip sorting system based on a three-temperature sorting machine includes a low-temperature control system, an electromechanical control system and a fault-tolerant control system, wherein:

[0015] The low temperature control system includes a refrigeration system, a heating pad, a preheating plate evaporator, a pressure head evaporator, a test socket temperature compensation module, and a temperature control system;

[0016] The refrigeration system includes water-cooling refrigeration and air-cooling refrigeration;

[0017] The heating pad can establish heating capacity;

[0018] The preheating plate evaporator is used for precooling and preheating the chip;

[0019] The pressure head evaporator is responsible for maintaining the temperature during the chip testing process;

[0020] The test socket temperature compensation module is responsible for controlling the temperature of the surrounding environment during chip testing;

[0021] The temperature control system is responsible for establishing the temperature field and promptly correcting temperature deviations during the test.

[0022] Preferably, the electromechanical control system includes an electric control box, a test box, a test box adjustment arm, a pressure head moving module, a high-precision suction nozzle module, a pressure head testing module, a working chamber, a human-computer interaction system, and a material inlet and outlet module.

[0023] The electric control box is equipped with a power processing and control module, a motor control module, and an analog-to-digital conversion module;

[0024] The test box is equipped with a pressure head moving module, a high-precision nozzle module, a pressure head test module, a preheating plate, and an inlet and outlet plate;

[0025] The test box adjustment arm is responsible for adjusting the hovering position of the test box to facilitate connection with the test machine;

[0026] The pressure head moving module is responsible for moving the pressure head or nozzle to the corresponding coordinate position;

[0027] The high-precision nozzle module is responsible for sucking and placing chips when transporting them between the loading and unloading trays and the preheating tray;

[0028] The pressure head test module is responsible for transporting chips between the preheating plate and the test socket, pressure testing chips, and maintaining the test environment temperature during the chip test;

[0029] The working chamber is responsible for providing a dry atmosphere so that the chip can be tested normally in a low temperature environment;

[0030] The human-computer interaction system is responsible for human-computer interaction, and mainly includes industrial computers, display screens, status indicators, keyboards, and access control switches;

[0031] The loading and unloading module is responsible for loading the chips into the tray for loading and unloading.

[0032] Preferably, the fault-tolerant control system includes a main interface, a debugging interface, a vision, a connection test machine, a setting, a product, and an automatic operation mode;

[0033] Among them: the main interface is responsible for displaying the running test status, temperature status, chip counting, etc., and provides automatic operation configuration options, test station selection, return to zero button, run button, stop button, and alarm clearing;

[0034] The debugging interface is responsible for manual control of point movement, manual control of input and output status, and setting of three-temperature machine operation parameters;

[0035] The visual module is responsible for chip grabbing position correction, QR code recognition, character recognition, and preheating tray slot visual positioning recognition;

[0036] The connection tester is responsible for the communication with the tester;

[0037] The setting module can be used to set system function switches, communication addresses and ports, motion speed / acceleration percentage, and nozzle compensation.

[0038] The product module can establish unique operating parameters for each chip and save them into product files for easy access next time;

[0039] The automatic operation modes include initial operation, continued operation, idle operation and single-step operation.

[0040] (III) Beneficial effects

[0041] Compared with the prior art, the present invention provides a mini three-temperature sorting machine, which has the following beneficial effects:

[0042] The present invention has a compact and novel structure, a reasonable design of the electromechanical system, and high software fault tolerance, which can greatly save manpower, improve the continuity, stability, and reliability of the chip testing process, and improve the standardization of chip test result data management. It solves the problem that the prior art requires manual material loading and unloading and testing in a high and low temperature box or a heat flow hood, which is inefficient and requires a large amount of manpower, which not only wastes costs but also easily causes safety accidents. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is the external structure diagram of the present invention;

[0044] Figure 2 It is a diagram of the internal electromechanical system of the present invention;

[0045] Figure 3 The internal schematic diagram of the present invention

[0046] Figure 4 It is a diagram of the software system structure of the present invention.

[0047] In the figure: 1. Test component; 2. Test box adjustment arm; 3. Human-computer interaction system; 4. Electric control box; 5. Refrigeration system; 6. Test socket temperature compensation module; 7. Test socket; 8. Pressure head moving module; 9. Preheating plate evaporator; 10. Inlet and outlet module; 11. Pressure head test module; 12. Inlet and outlet door; 13. High-precision nozzle module; 14. Working chamber. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] As introduced in the background technology, there are deficiencies in the prior art. In order to solve the above technical problems, the present application proposes a mini three-temperature sorting machine.

[0050] See also Figure 1-Figure 4 A mini three-temperature sorting machine includes a test component 1, one side of the test component 1 is fixedly mounted with one end of a test box adjusting arm 2, the other end of the test box adjusting arm 2 is fixedly mounted with an electric control box 4, the upper surface of the electric control box 4 is provided with a human-computer interaction system 3, and the lower surface of the electric control box 4 is fixedly mounted with a refrigeration system 5.

[0051] Further, for the above-mentioned test assembly 1, the test assembly 1 includes a test box, the inner cavity of the test box is a working cavity 14, a test socket 7 is fixedly installed on the bottom of the test box, a test socket temperature compensation module 6 is fixedly installed around the upper part of the test socket 7, a pressure head moving module 8 is fixedly installed on the inner wall of the test box, and a pressure head test module 11 is fixedly installed on the pressure head moving module 8 to drive the pressure head test module 11 to move along the X and Y axis directions of the test box, and the pressure head test module 11 can move along the Z axis direction of the test box, and the bottom of the test box A preheating plate evaporator 9 is fixedly installed, and the preheating plate evaporator 9 is in close contact with the test socket 7. A loading and unloading module 10 is fixedly installed on the bottom of the test box, and the loading and unloading module 10 is in close contact with the preheating plate evaporator 9. A loading and unloading hatch 12 is opened on the side of the test box, and the loading and unloading hatch 12 corresponds to the loading and unloading module 10. The loading and unloading hatch 12 can be opened to send the loading and unloading module 10 into and out of the test box, which can ensure that the test process is not interrupted during loading and unloading, and there is no need to re-precooling and preheating. A high-precision suction nozzle module 13 is installed on the side of the pressure head test module 11.

[0052] The pressure head test module 11 can move up and down along the Z direction of the test box to suck and place chips and perform pressure testing at the test socket 7; a high-precision suction nozzle module 13 is installed on the side of the pressure head test module 11, and this suction nozzle module 13 can transport chips between the feed and discharge module 10 and the preheating disk evaporator 9; the working chamber 14 is filled with dry gas to ensure the normal progress of the low-temperature test.

[0053] The system is powered on, the industrial computer is powered on, the equipment software is opened, the tray with the chip to be tested is placed in the loading and unloading module 10 in the test box, the test socket 7 on the test machine is connected to the bottom plate hardware of the test box, and the chip data file to be tested is selected in the main interface 14 of the software. Then, the machine is reset to zero, the test temperature is set, the operation mode is selected, and the operation starts; at this time, the pressure head moving module 8 moves the high-precision suction nozzle module 13 installed on the pressure head moving module 8 to the tray in the loading and unloading module 10 to suck the chips into the preheating plate evaporator 9 in sequence; when the chips in the preheating plate are preheated / precooled, the pressure head test module 11 on the pressure head moving module 8 moves the chips to the test socket 7 and waits for the pressure test to end; after the test is completed, the pressure head test module 11 moves the chips to the fixed area in the preheating plate evaporator 9; then, the high-precision suction nozzle module 13 moves the tested chips to the area where the tested chips are placed in the loading and unloading module 10 or the defective product area. After selecting to end the test in the software, the pressure head test module 11 and the high-precision nozzle module 13 will clean up the remaining chips in the preheating tray. When the feed and discharge module 10 is full of tested chips, the system prompts to change the tray. When it is replaced with an empty tray, it will continue. When all the tested chips are cleaned up, disconnect the test machine hardware, turn off the software, turn off the industrial computer, and turn off the power of the whole machine to end the entire test process.

[0054] This embodiment has a compact and novel structure, a reasonable electromechanical structure design, and high software fault tolerance, which can greatly improve the reliability and continuity of chip testing and reduce personnel requirements.

[0055] A chip sorting system based on a three-temperature sorting machine includes a low-temperature control system, an electromechanical control system and a fault-tolerant control system, wherein:

[0056] The low temperature control system includes a refrigeration system, a heating pad, a preheating plate evaporator, a pressure head evaporator, a test socket temperature compensation module, and a temperature control system;

[0057] The refrigeration system includes water-cooling refrigeration and air-cooling refrigeration;

[0058] The heating pad can establish heating capacity;

[0059] The preheating plate evaporator is used for precooling and preheating the chip;

[0060] The pressure head evaporator is responsible for maintaining the temperature during the chip testing process;

[0061] The test socket temperature compensation module is responsible for controlling the temperature of the surrounding environment during the chip testing process;

[0062] The temperature control system is responsible for establishing the temperature field and promptly correcting temperature deviations during the test.

[0063] Preferably, the electromechanical control system includes an electric control box, a test box, a test box adjustment arm, a pressure head moving module, a high-precision suction nozzle module, a pressure head testing module, a working chamber, a human-computer interaction system, and a material inlet and outlet module.

[0064] The electric control box is equipped with a power processing and control module, a motor control module, and an analog-to-digital conversion module;

[0065] The test box is equipped with a pressure head moving module, a high-precision nozzle module, a pressure head test module, a preheating plate, and an inlet and outlet plate;

[0066] The test box adjustment arm is responsible for adjusting the hovering position of the test box to facilitate connection with the test machine;

[0067] The pressure head moving module is responsible for moving the pressure head or nozzle to the corresponding coordinate position;

[0068] The high-precision nozzle module is responsible for sucking and placing chips when transporting them between the loading and unloading trays and the preheating tray;

[0069] The pressure head test module is responsible for transporting chips between the preheating plate and the test socket, pressure testing chips, and maintaining the test environment temperature during the chip test;

[0070] The working chamber is responsible for providing a dry atmosphere so that the chip can be tested normally in a low temperature environment;

[0071] The human-computer interaction system is responsible for human-computer interaction, and mainly includes industrial computers, display screens, status indicators, keyboards, and access control switches;

[0072] The loading and unloading module is responsible for loading the chips into the tray for loading and unloading.

[0073] Preferably, the fault-tolerant control system includes a main interface, a debugging interface, a vision, a connection test machine, a setting, a product, and an automatic operation mode;

[0074] Among them: the main interface is responsible for displaying the running test status, temperature status, chip counting, etc., and provides automatic operation configuration options, test station selection, return to zero button, run button, stop button, and alarm clearing;

[0075] The debugging interface is responsible for manual control of point movement, manual control of input and output status, and setting of three-temperature machine operation parameters;

[0076] The visual module is responsible for chip grabbing position correction, QR code recognition, character recognition, and preheating tray slot visual positioning recognition;

[0077] The connection tester is responsible for the communication with the tester;

[0078] The setting module can be used to set system function switches, communication addresses and ports, motion speed / acceleration percentage, and nozzle compensation.

[0079] The product module can establish unique operating parameters for each chip and save them into product files for easy access next time;

[0080] The automatic operation modes include initial operation, continued operation, idle operation and single-step operation.

[0081] When the present invention is working, it is divided into a preparation stage, a test stage and an end stage. The preparation stage includes: powering on the system, powering on the industrial computer, opening the equipment software, placing the tray loaded with the chip to be tested into the test box, connecting with the hardware of the test machine, selecting the chip data file to be tested in the software or inputting the relevant data of the chip to be tested; the test stage includes function selection, machine zeroing, product file selection, operation mode selection, starting chip position selection of the loading tray, test temperature setting, starting operation, and ending feeding; the end stage includes cleaning the preheating tray, disconnecting the test machine, closing the software, closing the industrial computer, and closing the power supply of the whole machine.

[0082] Compared with the existing artificial high and low temperature box or heat flow hood chip testing technology, the patent of the present invention has the following beneficial effects: it can greatly save manpower, improve the continuity, stability and reliability of the chip testing process, and improve the standardization of chip test result data management.

[0083] While the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the invention.

Claims

1. A mini three-temperature sorting machine, comprising a test assembly (1), characterized in that: One end of a test box adjustment arm (2) is fixedly mounted on one side of the test assembly (1), an electric control box (4) is fixedly mounted on the other end of the test box adjustment arm (2), a human-machine interaction system (3) is arranged on the upper surface of the electric control box (4), and a refrigeration system (5) is fixedly mounted on the lower surface of the electric control box (4); The test assembly (1) comprises a test box, the inner cavity of the test box being a working cavity (14), a test socket (7) being fixedly mounted on the bottom of the test box, and a test socket temperature compensation module (6) being fixedly mounted around the upper part of the test socket (7); A preheating plate evaporator (9) is fixedly mounted on the bottom of the test box, and the preheating plate evaporator (9) is in close contact with the test socket (7); an inlet and outlet module (10) is fixedly mounted on the bottom of the test box, and the inlet and outlet module (10) is in close contact with the preheating plate evaporator (9); an inlet and outlet door (12) is provided on the side of the test box, and the inlet and outlet door corresponds to the inlet and outlet module (10); A pressure head moving module (8) is fixedly mounted on the inner wall of the test box, and a pressure head testing module (11) is fixedly mounted on the pressure head moving module (8) to drive the pressure head testing module (11) to move along the X-axis and Y-axis directions of the test box, and the pressure head testing module (11) can move along the Z-axis direction of the test box.

2. A mini three-temperature sorting machine according to claim 1, characterized in that: A high-precision suction nozzle module (13) is installed on the side of the pressure head testing module (11).

3. A chip sorting system comprising the three-temperature sorting machine according to claim 2, characterized in that: It includes cryogenic control system, electromechanical control system and fault-tolerant control system, among which: The low temperature control system includes a refrigeration system, a heating pad, a preheating plate evaporator, a pressure head evaporator, a test socket temperature compensation module, and a temperature control system; The refrigeration system includes water-cooling refrigeration and air-cooling refrigeration; The heating pad can establish heating capacity; The preheating plate evaporator is used for precooling and preheating the chip; The pressure head evaporator is responsible for maintaining the temperature during the chip testing process; The test socket temperature compensation module is responsible for controlling the temperature of the surrounding environment during chip testing; The temperature control system is responsible for establishing the temperature field and promptly correcting temperature deviations during the test.

4. The chip sorting system according to claim 3, characterized in that: The electromechanical control system includes an electric control box, a test box, a test box adjustment arm, a pressure head moving module, a high-precision suction nozzle module, a pressure head test module, a working chamber, a human-computer interaction system, and a material inlet and outlet module, wherein: The electric control box is equipped with a power processing and control module, a motor control module, and an analog-to-digital conversion module; The test box is equipped with a pressure head moving module, a high-precision nozzle module, a pressure head test module, a preheating plate, and an inlet and outlet plate; The test box adjustment arm is responsible for adjusting the hovering position of the test box to facilitate connection with the test machine; The pressure head moving module is responsible for moving the pressure head or nozzle to the corresponding coordinate position; The high-precision nozzle module is responsible for sucking and placing chips when transporting them between the loading and unloading trays and the preheating tray; The pressure head test module is responsible for transporting chips between the preheating plate and the test socket, pressure testing chips, and maintaining the test environment temperature during the chip test; The working chamber is responsible for providing a dry atmosphere so that the chip can be tested normally in a low temperature environment; The human-computer interaction system is responsible for human-computer interaction, and mainly includes industrial computers, display screens, status indicators, keyboards, and access control switches; The loading and unloading module is responsible for loading the chips into the tray for loading and unloading.

5. The chip sorting system according to claim 4, characterized in that: The fault-tolerant control system includes a main interface, a debugging interface, a vision, a connection test machine, a setting, a product, and an automatic operation mode; Among them: the main interface is responsible for displaying the running test status, temperature status, chip counting, and providing automatic operation configuration options, test station selection, return to zero button, run button, stop button, and alarm clearing; The debugging interface is responsible for manual control of point movement, manual control of input and output status, and setting of three-temperature machine operation parameters; The visual module is responsible for chip grabbing position correction, QR code recognition, character recognition, and preheating tray slot visual positioning recognition; The connection tester is responsible for the communication with the tester; The setting module can be used to set the system function switch, communication address and port, motion speed and acceleration percentage, and nozzle compensation. The product module can establish unique operating parameters for each chip and save them into product files for easy access next time; The automatic operation modes include initial operation, continued operation, idle operation and single-step operation.

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