Display panel and display device
By setting a resin filling layer and a light-shielding structure around the Micro LED chip, the problem of high reflectivity of the Micro LED chip is solved, improving the contrast and production yield of the display panel and ensuring the consistency and stability of the display effect.
Patent Information
- Application Number
- CN202410864706.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2044-06-28
AI Technical Summary
The high reflectivity of Micro LED chips in the current technology leads to reduced image contrast, and there are problems with the thickness control and curing effect of the black material, which affects the display effect and production yield.
By setting a resin filling layer and a light-shielding structure around the Micro LED chip, the reflectivity is reduced while the thickness of the light-shielding structure is controlled to avoid the problem of difficult photosensitive patterning caused by an excessively thick light-shielding structure. The heat dissipation characteristics of the thermally conductive resin are used to reduce the peak wavelength shift caused by temperature rise.
It improves the contrast and image clarity of the display panel, maintains a consistent display effect, increases production yield and reliability, reduces color shift caused by temperature rise, and enhances the user's visual experience and the stability of the display effect.
Smart Images

Figure CN118588730B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND
[0002] In recent years, micro light emitting diode (Micro LED) chips are widely used in the field of display technology due to their high brightness, high efficiency, long service life and other advantages. However, due to the existence of ambient light and the high reflectivity of Micro LED chips, the contrast of the picture is directly affected, resulting in a decrease in user viewing experience.
[0003] At present, in order to reduce the reflectivity of Micro LED chips, black materials are used to shield around the Micro LED chips. The black material has strong light absorption ability and can effectively absorb light of various wavelengths, thereby reducing the reflectivity of the Micro LED chip. However, there are still some technical problems to be solved about the thickness control and curing effect of the black material.
[0004] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present application, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY
[0005] The embodiments of the present application provide a display panel and a display device, which can reduce the reflectivity of the first light emitting unit, solve the problem of difficult light patterning caused by the over-thickness of the first light shielding structure, and improve the production yield and display effect of the display panel.
[0006] According to some embodiments, the present application provides a display panel, comprising:
[0007] a first sub-pixel, the first sub-pixel comprising a first driving unit and a first light emitting unit, the first light emitting unit being electrically connected to the first driving unit at least via a first contact electrode and a second contact electrode arranged with a spacing;
[0008] a resin filling layer located between the first light emitting unit and the corresponding first driving unit, and filling at least the spacing between the first contact electrode and the second contact electrode;
[0009] a first light shielding structure surrounding the sidewall of the first light emitting unit.
[0010] In some embodiments, the resin filling layer also fills the spacing between the first light shielding structure and the first light emitting unit.
[0011] In some embodiments, the thickness of the resin filling layer ranges from 2 μm to 5 μm.
[0012] In some embodiments, the first light-shielding structure has a thickness no less than 2 μm.
[0013] In some embodiments, the first sub-pixel is a red light sub-pixel; the display panel further comprises:
[0014] a second sub-pixel; the second sub-pixel comprises a second driving unit and a second light-emitting unit, the second light-emitting unit being electrically connected to the second driving unit at least via a third contact electrode and a fourth contact electrode arranged in a spaced manner;
[0015] a second light-shielding structure surrounding a sidewall of the second sub-pixel and filling a space between the third contact electrode and the fourth contact electrode.
[0016] In some embodiments, the number of the first sub-pixels is plural; the display panel further comprises:
[0017] a transparent medium layer between two adjacent first sub-pixels;
[0018] The transparent medium layer and the resin filling layer are in an integral molding structure.
[0019] In some embodiments, the thickness of the transparent medium layer ranges from 12 μm to 16 μm.
[0020] In some embodiments, the first sub-pixel is a red light sub-pixel; the display panel further comprises:
[0021] a second sub-pixel; the second sub-pixel comprises a second driving unit and a second light-emitting unit, the second light-emitting unit being electrically connected to the second driving unit at least via a third contact electrode and a fourth contact electrode arranged in a spaced manner;
[0022] a second light-shielding structure surrounding a sidewall of the second sub-pixel and filling a space between the third contact electrode and the fourth contact electrode.
[0023] The transparent medium layer is also between the first sub-pixel and the second sub-pixel; the thickness of the second light-shielding structure is less than that of the first light-shielding structure.
[0024] In some embodiments, the material constituting the resin filling layer comprises a heat-conducting resin.
[0025] In some embodiments, the heat-conducting coefficient of the heat-conducting resin ranges from 0.1 W / (m·K) to 5 W / (m·K).
[0026] In some embodiments, the material system of the heat-conductive resin comprises an organic material system; the organic material system comprises an epoxy system, a silicone system and / or an acrylic system.
[0027] In some embodiments, the material system of the heat-conductive resin comprises a composite material system; the composite material system comprises an organic material system added with heat-conductive particles and heat-conductive polymers.
[0028] In some embodiments, the resin filling layer contains a photoinitiator and / or a crosslinking agent.
[0029] In some embodiments, the resin filling layer is provided with a plurality of first protrusions arranged at intervals on a side surface close to the first light-emitting unit.
[0030] The first light-shielding structure is further arranged between the resin filling layer and the first light-emitting unit, and fills the intervals between the first protrusions.
[0031] In some embodiments, the material constituting the first light-shielding structure comprises an organic resin, and the first protrusions are formed into a low-surface-energy structure.
[0032] In some embodiments, the bottom of the first light-emitting unit is provided with a plurality of second protrusions arranged at intervals.
[0033] The first light-shielding structure further fills the intervals between the second protrusions.
[0034] In some embodiments, the top of the first light-emitting unit is provided with a plurality of third protrusions arranged at intervals, and the arrangement density of the third protrusions is less than that of the second protrusions.
[0035] In some embodiments, the first sub-pixel is a red light sub-pixel; the display panel further comprises:
[0036] a second sub-pixel; the second sub-pixel comprises a second driving unit and a second light-emitting unit, and the bottom of the second light-emitting unit is provided with a plurality of fourth protrusions arranged at intervals, and is electrically connected to the second driving unit via at least the third contact electrode and the fourth contact electrode arranged at intervals;
[0037] a second light-shielding structure surrounding the sidewall of the second sub-pixel, filling at least the interval between the third contact electrode and the fourth contact electrode, and filling the intervals between the fourth protrusions.
[0038] In some embodiments, the material constituting the first light-shielding structure comprises an organic resin, and the surface of the first protrusions is coated with a low-surface-energy material; or
[0039] The first light-shielding structure is made of a hydrophilic material, and the first protrusion is made of an inorganic material.
[0040] According to some embodiments, another aspect of the present application also provides a display device including the display panel provided in the above embodiments.
[0041] The embodiments of the present application can have / at least have the following advantages:
[0042] The embodiments of the present application can have / at least have the following advantages:
[0043] In the embodiments of the present application, the resin filling layer is arranged at least at the interval between the first contact electrode and the second contact electrode. In this way, the interval between the first contact electrode and the second contact electrode does not need to be filled with the light-shielding structure, avoiding the formation of a large gap in the light-shielding structure, so as to facilitate the subsequent process, and also facilitate the control of the thickness of the first light-shielding structure, avoiding the problem that the first light-shielding structure is too thick to be photo-patterned. Moreover, the arrangement of the resin filling layer at the interval between the first contact electrode and the second contact electrode can also avoid the problem that the light-shielding structure is not completely cured at the bottom of the first light-emitting unit, and the incompletely cured light-shielding structure forms a non-uniform gap at the bottom of the first light-emitting unit, improving the production yield and use reliability of the display panel. In addition, by using the heat dissipation characteristics of the resin filling layer, the peak wavelength shift of the first light-emitting unit caused by temperature rise can also be reduced, improving the stability and consistency of the display effect.
[0044] In addition, the preparation process of the embodiments of the present application is simple and easy to implement.
[0045] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS
[0046] Other features, objects and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments, made with reference to the following drawings.
[0047] Figures 1 to 3 A cross-sectional structure schematic diagram of a display panel provided for some embodiments of the present application is shown in the figure;
[0048] Figure 4 A partial enlarged view of the first sub-pixel part in the structure shown in the figure; Figure 3
[0049] Figure 5 A partial enlarged view of the first sub-pixel part in the structure shown in the figure;Figure 4 Partial enlarged view of the resin filling layer under the first sub-pixel in the structure shown;
[0050] Figure 6 Cross-sectional structure schematic diagram of a display panel provided for another embodiment of the present application;
[0051] Figure 7 For Figure 6 Partial enlarged view of the first sub-pixel part in the structure shown;
[0052] Figures 8 to 9 Cross-sectional structure schematic diagram of a display panel provided for another embodiment of the present application;
[0053] Figure 10 For Figure 9 Partial enlarged view of the second sub-pixel part in the structure shown;
[0054] Figure 11 For Figure 10 Partial enlarged view of the second light emitting unit in the structure shown.
[0055] Explanation of reference signs:
[0056] 11a, first driving unit; 12a, first light emitting unit; 121a, second protrusion; 122a, third protrusion; 13a, first contact electrode; 14a, second contact electrode; 13b, third contact electrode; 14b, fourth contact electrode; 11b, second driving unit; 12b, second light emitting unit; 121b, fourth protrusion; 122b, fifth protrusion; 20, resin filling layer; 201a, first protrusion at the bottom of a red light sub-pixel; 201b, first protrusion at the bottom of a green light sub-pixel; 30a, first light shielding structure; 30b, second light shielding structure; 40, transparent dielectric layer. DETAILED DESCRIPTION
[0057] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.
[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the specification of the present application is only for the purpose of describing specific embodiments and is not intended to limit the present application.
[0059] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer, or intervening elements or layers can be present.
[0060] It will be understood that, although the terms first, second, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.
[0061] Spatially relative terms, such as "on", "above", "below", "bottom", "top", "side", "upper", "lower", "horizontal", "vertical", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is turned over, elements described as "above" other elements or features would then be oriented "below" the other elements or features. Thus, the exemplary term "above" can encompass both an orientation that is above and below. The device can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0062] The singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including", or the like, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.
[0063] Embodiments of the application are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the application. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments of the application should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. The regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the application.
[0064] In view of the shortcomings of related technologies, this application provides a display panel and display device that can reduce the reflectivity of the first light-emitting unit, solve the problem of difficulty in photosensitive patterning caused by the excessive thickness of the first light-shielding structure, and improve the production yield and display effect of the display panel. Details will be described in subsequent embodiments.
[0065] Please see Figure 1 This application provides a display panel. Specifically, the display panel may include a first sub-pixel, a resin filling layer 20, and a first light-shielding structure 30a.
[0066] It should be noted that the first sub-pixel may include a red sub-pixel R, a green sub-pixel G, and / or a blue sub-pixel B. The number of first sub-pixels can be one or more, for example... Figure 1 As shown, the first sub-pixel may include a red sub-pixel R, a green sub-pixel G, and a blue sub-pixel B.
[0067] like Figure 1 As shown, the first sub-pixel may specifically include a first driving unit 11a and a first light-emitting unit 12a. The first light-emitting unit 12a is electrically connected to the first driving unit 11a at least via a first contact electrode 13a and a second contact electrode 14a that are spaced apart. A resin filling layer 20 is located between the first light-emitting unit 12a and the corresponding first driving unit 11a, and at least fills the gap between the first contact electrode 13a and the second contact electrode 14a. A first light-shielding structure 30a surrounds the sidewall of the first light-emitting unit 12a.
[0068] This embodiment of the application uses a first light-shielding structure 30a to block the sidewall of the first light-emitting unit 12a, reducing the reflectivity of the first light-emitting unit 12a and thus improving the contrast and image clarity of the display panel. The first light-shielding structure 30a enables the display panel to maintain a consistent display effect under various lighting conditions, effectively improving the user's visual experience.
[0069] In this embodiment, a resin filling layer 20 is provided at least at the gap between the first contact electrode 13a and the second contact electrode 14a. This eliminates the need for a light-shielding structure to fill the gap between the first contact electrode 13a and the second contact electrode 14a, avoiding large discontinuities in the light-shielding structure, facilitating subsequent processes, and also helps control the thickness of the first light-shielding structure 30a, preventing problems with photosensitive patterning due to excessive thickness. Furthermore, providing the resin filling layer 20 at the gap between the first contact electrode 13a and the second contact electrode 14a also prevents the light-shielding structure from not fully curing at the bottom of the first light-emitting unit 12a, which could lead to uneven gaps at the bottom of the first light-emitting unit 12a, improving the production yield and reliability of the display panel. In addition, utilizing the heat dissipation characteristics of the resin filling layer 20 can reduce the peak wavelength shift (also known as peak shift) of the first light-emitting unit 12a caused by temperature increases, improving the stability and consistency of the display effect.
[0070] Furthermore, the preparation process of the embodiments in this application is simple and easy to implement.
[0071] In some embodiments, please continue reading Figure 1 The resin filling layer 20 can also fill the gap between the first light-shielding structure 30a and the first light-emitting unit 12a.
[0072] As an example, after the first sub-pixel is bonded to the substrate, a resin-filled material layer can be formed on the surface of the substrate; and the resin-filled material layer can be patterned to obtain the resin-filled layer 20.
[0073] This application does not impose a specific limitation on the thickness of the resin filler layer 20. The thickness of the resin filler layer 20 can be adaptively optimized and adjusted according to the actual design and manufacturing process conditions. In some embodiments, the thickness of the resin filler layer 20 can range from 2 μm to 5 μm. For example, the thickness of the resin filler layer 20 can be 2 μm, 3 μm, 4 μm, or 5 μm, etc.
[0074] In some embodiments, the upper surface of the resin filling layer 20 may be higher than the lower surface of the first light-emitting unit 12a. That is, the resin filling layer 20 may also surround the sidewalls of the first light-emitting unit 12a at a certain height.
[0075] The embodiments of this application do not specifically limit the constituent materials of the resin filler layer 20. The constituent materials of the resin filler layer 20 can be adaptively selected according to the preparation process conditions in the actual embodiments.
[0076] In some embodiments, the constituent material of the resin filler layer 20 may include thermally conductive resin, but is not limited thereto.
[0077] Peak shift refers to the phenomenon that the wavelength or color of light emitted by a light-emitting unit (such as a Micro LED chip) changes during operation. In the above embodiment, a thermally conductive resin is used to form the resin filling layer 20. Since thermally conductive resin is a resin material with high thermal conductivity, heat has a high conduction efficiency in thermally conductive resin. Therefore, using thermally conductive resin to form the resin filling layer 20 can more effectively improve the transfer and dispersion of heat inside the resin filling layer 20, and more significantly reduce the temperature of the first light-emitting unit 12a, thereby further reducing or eliminating the peak shift phenomenon of the first light-emitting unit 12a, improving the display effect of the display panel, and enabling the display panel to maintain stable color and performance even under high load operation.
[0078] For example, the thermally conductive resin involved in the above embodiments can be a composite material made of resin matrix and thermally conductive filler (e.g., metal powder, ceramic powder, etc.).
[0079] As an example, the thermal conductivity of the aforementioned thermally conductive resin can specifically range from 0.1 W / (m·K) to 5 W / (m·K). Exemplarily, the resin-filled layer 20 can be prepared using thermally conductive resins with thermal conductivity of 0.1 W / (m·K), 0.5 W / (m·K), 0.1 W / (m·K), 2.5 W / (m·K), or 5 W / (m·K), etc.
[0080] In some embodiments, the material system of the thermally conductive resin may specifically include an organic material system. The organic material system may specifically include an epoxy system, a silicone system, and / or an acrylic system.
[0081] Among them, epoxy system refers to: molecules containing two or more epoxy groups and various organic functional groups; organosilicon system refers to: organic groups directly connected to silicon atoms, or polysiloxanes composed of silicon-oxygen bonds (-Si-O-Si-) as the main chain skeleton; acrylic system refers to: infusible acrylic polymers with acrylic monomers (such as methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate, n-butyl methacrylate, etc.) as basic components, which are cross-linked into a network structure.
[0082] In other embodiments, the thermally conductive resin material system may further include a composite material system. The composite material system may specifically include an organic material system containing thermally conductive particles and thermally conductive polymers.
[0083] As an example, the thermally conductive particles can be composed of carbon-based materials, oxide ceramic particles, nitride ceramic particles, material particles with a perovskite structure (also known as perovskite particles), or any combination thereof. Carbon-based materials may include, but are not limited to, carbon nanotubes, graphene, graphite, etc. The constituent materials of oxide ceramic particles may include, but are not limited to, alumina (Al2O3), zinc oxide (ZnO), beryllium oxide (BeO), and / or silicon dioxide (SiO2), etc. The constituent materials of nitride ceramic particles may include, but are not limited to, aluminum nitride (AlN), boron nitride (BN), and / or silicon nitride (Si3N4).
[0084] As an example, thermally conductive polymers may include polyvinylidene fluoride derivatives and / or azobenzene derivatives.
[0085] In some embodiments, the resin filler layer 20 may contain a photoinitiator and / or a crosslinking agent.
[0086] As an example, the photoinitiator may include, but is not limited to, free radical photoinitiators or cationic photoinitiators. Free radical photoinitiators may be, for example, benzoyl, alkyl phenyl ketones, benzophenones, etc., but are not limited to these. Free radical photoinitiators may contain carbonyl and phenyl structures, which can decompose to generate free radicals after absorbing light energy. Free radical photoinitiators include benzoyl, alkyl phenyl ketones, benzophenones, etc., characterized by compounds containing carbonyl and phenyl groups. Cationic photoinitiators may be, for example, diazonium salts, diaryliodomonium salts, triarylthionium salts, alkylthionium salts, iron aromatic salts, sulfonyloxyketones, triarylsiloxanes, etc., but are not limited to these.
[0087] In this embodiment, the first light-shielding structure 30a may be formed after the first sub-pixel transfer, but it is not limited to this.
[0088] In some embodiments, the first light-shielding structure 30a not only surrounds the sidewall of the first light-emitting unit 12a, but also surrounds a portion of the sidewall and top surface of the first driving unit 11a.
[0089] The embodiments of this application do not specifically limit the thickness of the first light-shielding structure 30a. The thickness of the first light-shielding structure 30a can be adaptively optimized and adjusted according to the actual design and manufacturing process conditions.
[0090] In some embodiments, the thickness of the first light-shielding structure 30a is not less than 2 μm. Exemplarily, the thickness of the first light-shielding structure 30a can be 2 μm, 3 μm, 4 μm, or 5 μm, etc. Controlling the thickness to not less than 2 μm ensures that the optical density value (OD value) of the first light-shielding structure 30a is greater than 3, meaning that the first light-shielding structure 30a can effectively block most of the light. Therefore, setting the thickness of the first light-shielding structure 30a to not less than 2 μm ensures that the first light-shielding structure 30a can provide sufficient optical density to achieve the light-shielding effect.
[0091] The embodiments of this application do not specifically limit the constituent materials of the first light-shielding structure 30a. The constituent materials of the first light-shielding structure 30a can be adaptively selected according to the preparation process conditions in the actual embodiments.
[0092] In some embodiments, the constituent material of the first light-shielding structure 30a may specifically include organic resin, but is not limited thereto. In other embodiments, the constituent material of the first light-shielding structure 30a may also include hydrophilic materials.
[0093] Please see Figure 2 In some embodiments, the display panel may also have a transparent dielectric layer 40 formed between two adjacent first sub-pixels. The transparent dielectric layer 40 can be used to define and fill the transparent area between adjacent sub-pixels.
[0094] This application does not impose a specific limitation on the thickness of the transparent dielectric layer 40. The thickness of the transparent dielectric layer 40 can be adaptively optimized and adjusted according to the actual design and fabrication process conditions. In some embodiments, the thickness of the transparent dielectric layer 40 can range from 12 μm to 16 μm. For example, the thickness of the transparent dielectric layer 40 can be 12 μm, 13 μm, 14 μm, 15 μm, or 16 μm, etc.
[0095] This application does not specifically limit the material of the transparent dielectric layer 40. The constituent materials of the transparent dielectric layer 40 can be adaptively selected according to the preparation process conditions of the actual embodiment.
[0096] In some embodiments, please continue reading Figure 2 The transparent dielectric layer 40 can be integrally formed with the resin filler layer 20. That is, the constituent material of the resin filler layer 20 is used as a filler layer for the transparent area.
[0097] In some embodiments, the resin filling layer 20 may have a plurality of spaced-apart first protrusions on the side surface near the first light-emitting unit 12a. The first light-shielding structure 30a is also disposed between the resin filling layer 20 and the first light-emitting unit 12a, and fills the gaps between the first protrusions.
[0098] As an example, the first protrusion formed at the bottom of the red sub-pixel R (such as...) Figure 3 , Figure 4 and Figure 5 The arrangement density of the first protrusion 201a shown can be greater than that of the first protrusion formed at the bottom of the blue photonics B or the green photonics G (as shown in the figure). Figure 3 The arrangement density of the first protrusion 201b shown.
[0099] The embodiments of this application do not specifically limit the constituent material of the first protrusion. In actual embodiments, the surface energy of the first protrusion can be controlled by adjusting the constituent material, so that it has specific surface properties to meet the needs of different application scenarios, such as making the surface have functions such as hydrophilic, hydrophobic, oleophilic or oleophobic.
[0100] In some embodiments, the material constituting the first light-shielding structure 30a includes an organic resin, which has a relatively low surface energy; based on this, a low surface energy material can be coated on the surface of the first protrusion, thereby forming the first protrusion as a low surface energy structure.
[0101] In the above embodiments, the constituent material of the first protrusion may include, but is not limited to, metallic and / or inorganic materials, and the surface is coated with a polymer of a low surface energy material. The polymer may be, for example, a fluorinated organic compound, but is not limited thereto.
[0102] In other embodiments, the first light-shielding structure 30a is made of a hydrophilic material, which has a relatively high surface energy; based on this, the first protrusion may be made of an inorganic material.
[0103] In the above embodiments, the material constituting the first protrusion may include, but is not limited to, inorganic materials. The first protrusion may be a single-layer structure or a composite multilayer structure. Inorganic materials may, for example, be silicon nitride (SiN). x ) and / or silicon dioxide (SiO2) x )etc.
[0104] This application does not specifically limit the size range of the first protrusion. The size of the first protrusion can be adaptively optimized and adjusted according to the actual design and manufacturing process conditions. In some embodiments, the size of the first protrusion is less than 20 nm. For example, the size of the first protrusion can be 10 nm, 12 nm, 14 nm, 16 nm, or 18 nm, etc.
[0105] In some embodiments, please refer to Figure 6 and Figure 7Furthermore, a plurality of spaced second protrusions 121a can be provided at the bottom of the first light-emitting unit 12a. For example, the spaces between the second protrusions 121a can be filled by a first light-shielding structure 30a. The second protrusions 121a can complement the first protrusions to avoid defects during the bonding process of the first light-emitting unit 12a.
[0106] In some embodiments, please continue reading Figure 6 and Figure 7 Furthermore, multiple spaced third protrusions 122a can be provided on the top of the first light-emitting unit 12a. In this first sub-pixel, the arrangement density of the third protrusions 122a can be set to be less than the arrangement density of the second protrusions 121a.
[0107] The following combination Figures 8 to 11 Taking the first sub-pixel as the red light sub-pixel R as an example, some embodiments of this application will be described in detail.
[0108] In some embodiments, please refer to Figure 8 The display panel may also include a second sub-pixel and a second light-shielding structure 30b.
[0109] It should be noted that the second sub-pixel and the first sub-pixel are different sub-pixels; in the embodiment shown in the figure, the second sub-pixel can be a green light sub-pixel G and / or a blue light sub-pixel B.
[0110] The second sub-pixel may specifically include a second driving unit 11b and a second light-emitting unit 12b. The second light-emitting unit 12b is electrically connected to the second driving unit 11b at least via a third contact electrode 13b and a fourth contact electrode 14b that are spaced apart. The second light-shielding structure 30b surrounds the sidewall of the second sub-pixel and at least fills the gap between the third contact electrode 13b and the fourth contact electrode 14b.
[0111] In the manufacturing process of the red sub-pixel R, ultraviolet (UV) curing is used to cure the light-shielding structure at the bottom of the first light-emitting unit 12a. Because the red sub-pixel R has low light transmittance (e.g., ultraviolet light), UV light is significantly attenuated, causing the light-shielding structure to fail to cure completely at the bottom of the first light-emitting unit 12a. Therefore, product defects or performance degradation primarily occur in the red sub-pixel R.
[0112] In the display panel provided in the above embodiment, at the interval between the first contact electrode 13a and the second contact electrode 14a of the red photon sub-pixel R, the problem of uneven gaps caused by the light-shielding structure not being fully cured at the bottom of the first light-emitting unit 12a can be avoided, thereby improving the production yield and reliability of the display panel.
[0113] In addition, the red sub-pixel R is more sensitive to temperature. When the red sub-pixel R is affected by temperature, the color (wavelength) of its emitted light is prone to significant shift, which affects the color accuracy and consistency of the display panel.
[0114] The display panel provided in the above embodiments can also utilize the heat dissipation characteristics of the resin filling layer 20 to reduce the impact of temperature rise on the red photon pixel R, and avoid the color shift of the emitted light from the red photon pixel R, thereby improving the color accuracy and consistency of the display panel.
[0115] In some embodiments, the display panel may also have a transparent dielectric layer 40 formed between adjacent first sub-pixels and second sub-pixels.
[0116] The surface of the red sub-pixel R is sometimes designed with microscopic irregularities (also known as roughened structure) to increase the surface area and improve light extraction efficiency. However, this also makes the siphon effect of the red sub-pixel R more obvious, that is, the multiple reflections and scattering of light on the surface are difficult to completely block.
[0117] In some embodiments, the thickness of the second light-shielding structure 30b can be set to be less than the thickness of the first light-shielding structure 30a. A thicker first light-shielding structure 30a can increase the light absorption path, thereby further improving the light absorption rate of the first light-shielding structure 30a, more effectively blocking light from entering, and ensuring that the red sub-pixel R can achieve the expected optical characteristics and performance indicators when working.
[0118] In some embodiments, please refer to Figure 9 , Figure 10 and Figure 11 Multiple spaced fourth protrusions 121b can be provided at the bottom of the second light-emitting unit 12b. For example, the gaps between the fourth protrusions 121b can be filled by the second light-shielding structure 30b.
[0119] Understandable, such as Figure 9 , Figure 10 and Figure 11 As shown, a plurality of spaced fifth protrusions 122b may also be provided on the top of the second light-emitting unit 12b. In some embodiments, in the first sub-pixel, the arrangement density of the third protrusion 122a may be set to be less than the arrangement density of the second protrusion 121a; while in the second sub-pixel, the arrangement density of the fifth protrusions 122b is not less than the arrangement density of the fourth protrusion 121b.
[0120] It should be noted that the "protrusions" involved in this application (such as the first protrusion, the second protrusion, the third protrusion, and the fourth protrusion) can specifically manifest as microlenses, micropyramids, or microgrids, etc., but are not limited to these. The "protrusions" involved in this application can have regular shapes or irregular surface structures, both of which are permissible.
[0121] Those skilled in the art will understand that the structures shown in the accompanying drawings are merely schematic diagrams of a portion of the structure related to the present application and do not constitute a limitation on other components applied thereto. In actual embodiments, the display panel may include more or fewer components than shown in the figures, or combine certain components, or have different component arrangements.
[0122] Based on the same inventive concept, embodiments of this application also provide a display device, including the display panel provided in the above embodiments. This display device can be any electronic device with display functionality, such as an in-vehicle display device, a mobile phone, a computer, a smart wearable device (e.g., a smartwatch), etc., and embodiments of this application do not limit this to any particular type.
[0123] The specific limitations of the display panel have been described in detail in the foregoing embodiments and will not be repeated here. The display device can also achieve all the technical effects achievable by the aforementioned display panel, and will not be elaborated upon here either.
[0124] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0125] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A display panel, characterized in that, include: The first sub-pixel is a red light sub-pixel. The first sub-pixel includes a first driving unit and a first light-emitting unit. The first light-emitting unit is electrically connected to the first driving unit via at least a first contact electrode and a second contact electrode that are spaced apart. A resin filling layer is located between the first light-emitting unit and the corresponding first driving unit, and at least fills the gap between the first contact electrode and the second contact electrode; A first light-shielding structure surrounds the sidewall of the first light-emitting unit; The second sub-pixel is a sub-pixel of a different color from the first sub-pixel. The second sub-pixel includes a second driving unit and a second light-emitting unit. The second light-emitting unit is electrically connected to the second driving unit at least via a third contact electrode and a fourth contact electrode that are spaced apart. A second light-shielding structure surrounds the sidewall of the second sub-pixel and at least fills the gap between the third contact electrode and the fourth contact electrode.
2. The display panel according to claim 1, characterized in that, The resin filling layer also fills the gap between the first light-shielding structure and the first light-emitting unit.
3. The display panel according to claim 2, characterized in that, The thickness of the resin filler layer ranges from 2μm to 5μm.
4. The display panel according to claim 2, characterized in that, The thickness of the first light-shielding structure is not less than 2 μm.
5. The display panel according to claim 2, characterized in that, The number of the first sub-pixels is multiple; the display panel also includes: A transparent dielectric layer is located between two adjacent first sub-pixels; The resin filling layer and the transparent medium layer are integrally formed.
6. The display panel according to claim 5, characterized in that, The thickness of the transparent dielectric layer ranges from 12μm to 16μm.
7. The display panel according to claim 5, characterized in that, The transparent dielectric layer is also located between adjacent first and second sub-pixels; the thickness of the second light-shielding structure is less than the thickness of the first light-shielding structure.
8. The display panel according to any one of claims 1 to 6, characterized in that, The resin filler layer is composed of thermally conductive resin.
9. The display panel according to claim 8, characterized in that, The thermal conductivity of the thermally conductive resin ranges from 0.1 W / (m·K) to 5 W / (m·K).
10. The display panel according to claim 9, characterized in that, The thermally conductive resin material system includes an organic material system; the organic material system includes an epoxy system, an organosilicon system, and / or an acrylic system.
11. The display panel according to claim 9, characterized in that, The material system of the thermally conductive resin includes a composite material system; the composite material system includes an organic material system with added thermally conductive particles and thermally conductive polymers.
12. The display panel according to claim 8, characterized in that, The resin filler layer contains a photoinitiator and / or a crosslinking agent.
13. The display panel according to claim 1, characterized in that, The resin filling layer has a plurality of spaced first protrusions on the side surface near the first light-emitting unit; The first light-shielding structure is also disposed between the resin filling layer and the first light-emitting unit, and fills the gap between each of the first protrusions.
14. The display panel according to claim 13, characterized in that, The first light-shielding structure is made of organic resin, and the first protrusion is formed as a low surface energy structure.
15. The display panel according to claim 13, characterized in that, The bottom of the first light-emitting unit is provided with a plurality of spaced second protrusions; The first light-shielding structure also fills the gaps between each of the second protrusions.
16. The display panel according to claim 15, characterized in that, The top of the first light-emitting unit is provided with a plurality of spaced third protrusions, the arrangement density of the third protrusions being less than the arrangement density of the second protrusions.
17. The display panel according to claim 15, characterized in that, The bottom of the second light-emitting unit is provided with a plurality of spaced fourth protrusions, which are electrically connected to the second driving unit at least via spaced third and fourth contact electrodes; The second light-shielding structure at least fills the gap between the third contact electrode and the fourth contact electrode, and fills the gap between each of the fourth protrusions.
18. The display panel according to any one of claims 15 to 17, characterized in that, The first light-shielding structure is made of organic resin, and the first protruding surface is coated with a low surface energy material; or The first light-shielding structure is made of a hydrophilic material, and the first protrusion is made of an inorganic material.
19. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 18.
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