A display panel and display device

Abstract

The application discloses a display panel and a display device, the display panel comprising a substrate and a wiring structure, the substrate comprising a first surface and a connecting surface, the connecting surface being located between two first surfaces and connected with the first surfaces; a tangent plane of a point in the connecting surface is perpendicular to the plane where the first surface is located; the wiring structure comprises a surface wiring structure and a connecting wiring structure, the surface wiring structure being arranged on the first surface, and the connecting wiring structure being arranged on the connecting surface, and the thickness of the connecting wiring structure being greater than the thickness of the surface wiring structure. The technical scheme of the application can improve the connection reliability of the wiring structure in the display panel, and further improve the display reliability of the display panel.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0002] With the development of information society, the demand for display devices displaying images is increasing. In the existing display device, a side wire process can be used to reduce the frame width of the display panel. However, due to the limitation of the preparation process, the wire thickness on the chamfer surface is thin or uneven, which makes the wire on the chamfer surface have a high risk of disconnection, affecting the display effect of the display device. SUMMARY

[0003] The present application provides a display panel and a display device to improve the connection reliability of the wiring structure in the display panel, and further improve the display reliability of the display panel.

[0004] In a first aspect, the present application provides a display panel, comprising:

[0005] A substrate, comprising a first surface and a connecting surface, the connecting surface being located between two first surfaces and connected with the first surface; a tangent plane of a point in the connecting surface is not perpendicular to the plane where the first surface is located;

[0006] A wiring structure, comprising a surface wiring structure and a connecting wiring structure, the surface wiring structure being arranged on the first surface, and the connecting wiring structure being arranged on the connecting surface, and the thickness of the connecting wiring structure being greater than the thickness of the surface wiring structure.

[0007] In a second aspect, the present application provides a display device, comprising the display panel of the first aspect.

[0008] The present application provides a technical solution, by arranging the connecting surface of the substrate, the tangent plane of a point in the connecting surface is not perpendicular to the plane where the first surface is located, reducing the sharpness of the included angle between the connecting surface and the first surface, to reduce the disconnection risk of the surface wiring structure and the connecting wiring structure at the connecting surface and the first surface, improve the connection reliability of the surface wiring structure and the connecting wiring structure, and arrange the thickness of the connecting wiring structure to be greater than the thickness of the surface wiring structure, so that the connecting wiring structure has a larger thickness, to improve the mechanical strength of the connecting wiring structure, and further reduce the disconnection risk of the connecting wiring structure, and improve the connection reliability and stability of the connecting wiring structure and the surface wiring structure, to improve the stability of the signal transmission of the wiring structure, and further improve the display reliability of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1A structural schematic diagram of a display panel in the prior art;

[0010] Figure 2 A planar schematic diagram of a display panel provided by an embodiment of the present application;

[0011] Figure 3 A structural schematic diagram of a display panel provided by an embodiment of the present application;

[0012] Figure 4 A structural schematic diagram of another display panel provided by an embodiment of the present application;

[0013] Figure 5 A top view structural schematic diagram of a display panel provided by an embodiment of the present application;

[0014] Figure 6 A structural schematic diagram of yet another display panel provided by an embodiment of the present application;

[0015] Figure 7 A structural schematic diagram of still another display panel provided by an embodiment of the present application;

[0016] Figure 8 A structural schematic diagram of a display panel provided by an embodiment of the present application;

[0017] Figure 9 A structural schematic diagram of another display panel provided by an embodiment of the present application;

[0018] Figure 10 A top view structural schematic diagram of yet another display panel provided by an embodiment of the present application;

[0019] Figure 11 A structural schematic diagram of still another display panel provided by an embodiment of the present application;

[0020] Figure 12 A structural schematic diagram of yet another display panel provided by an embodiment of the present application;

[0021] Figure 13 A structural schematic diagram of still another display panel provided by an embodiment of the present application;

[0022] Figure 14 A structural schematic diagram of another display panel provided by an embodiment of the present application;

[0023] Figure 15 A structural schematic diagram of yet another display panel provided by an embodiment of the present application;

[0024] Figure 16 A structural schematic diagram of still another display panel provided by an embodiment of the present application;

[0025] Figure 17This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention;

[0026] Figure 18 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention;

[0027] Figure 19 This is a schematic diagram of a process structure for manufacturing a display panel according to an embodiment of the present invention;

[0028] Figure 20 This is a schematic diagram of another process structure for manufacturing a display panel provided in an embodiment of the present invention;

[0029] Figure 21 A flowchart illustrating another method for manufacturing a display panel according to an embodiment of the present invention;

[0030] Figure 22 This is a schematic diagram of another process structure for manufacturing a display panel provided in an embodiment of the present invention;

[0031] Figure 23 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0033] Figure 1 This is a schematic diagram of the structure of a display panel in the prior art, such as... Figure 1 As shown, the display panel 001 includes a substrate 01 and a wiring structure 02. The substrate 01 includes a first surface 011 and a connecting surface 012. The connecting surface 012 is located between the two first surfaces 011 and connected to the first surfaces 011. The wiring structure 02 includes a surface wiring structure 021 and a connecting wiring structure 022. The surface wiring structure 021 is disposed on the first surface 011, and the connecting wiring structure 022 is disposed on the connecting surface 012. The thickness of the connecting wiring structure 022 is less than the thickness of the surface wiring structure 021, which makes the connecting wiring structure 022 have a higher risk of breakage in subsequent use, thereby affecting the display effect of the display panel 001.

[0034] To solve the above problems, the embodiment of the present application provides a display panel, comprising a substrate and a wiring structure, the substrate comprises a first surface and a connecting surface, the connecting surface is located between two first surfaces and is connected with the first surface; a tangent plane of a point in the connecting surface is perpendicular to the plane where the first surface is located; the wiring structure comprises a surface wiring structure and a connecting wiring structure, the surface wiring structure is arranged on the first surface, the connecting wiring structure is arranged on the connecting surface, and the thickness of the connecting wiring structure is greater than the thickness of the surface wiring structure.

[0035] By adopting the technical scheme, the tangent plane of a point in the connecting surface of the substrate is perpendicular to the plane where the first surface is located, the sharpness of the included angle between the connecting surface and the first surface is reduced, the risk of disconnection of the surface wiring structure and the connecting wiring structure at the connecting position of the connecting surface and the first surface is reduced, and the connection reliability of the surface wiring structure and the connecting wiring structure is improved. Meanwhile, the thickness of the connecting wiring structure is greater than the thickness of the surface wiring structure, so that the connecting wiring structure has a greater thickness, the mechanical strength of the connecting wiring structure is improved, the risk of disconnection of the connecting wiring structure is reduced, and the connection reliability and stability of the connecting wiring structure and the surface wiring structure are improved, so that the stability of signal transmission of the wiring structure is improved, and the display reliability of the display panel is improved.

[0036] The above is the core idea of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application. The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application.

[0037] Figure 2 A plane schematic view of a display panel provided by the embodiment of the present application is shown in the following figure, Figure 3 A structure schematic view of a display panel provided by the embodiment of the present application is shown in the following figure, Figure 2 And Figure 3 As shown in the figure, the display panel 100 comprises a substrate 10 and a wiring structure 20, the substrate 10 comprises a first surface 11 and a connecting surface 12, the connecting surface 12 is located between two first surfaces 11 and is connected with the first surface 11; a tangent plane of a point in the connecting surface 12 is perpendicular to the plane where the first surface 11 is located. The wiring structure 20 comprises a surface wiring structure 21 and a connecting wiring structure 22, the surface wiring structure 21 is arranged on the first surface 11, the connecting wiring structure 22 is arranged on the connecting surface 12, and the thickness of the connecting wiring structure 22 is greater than the thickness of the surface wiring structure 21.

[0038] As shown in the figure, Figure 2As shown, the display panel 100 includes a display area 110, a wiring area 120, and a driving chip (disposed on the non-light-emitting side of the display panel, not shown), the display area 110 includes a plurality of arrayed pixels 140, the wiring area 120 is provided with a wiring structure 20, one end of the wiring structure 20 is connected to the driving chip through a bonding pad, the other end is electrically connected to a signal line in the display area 110, for receiving a driving signal provided by the driving chip 131 and transmitting the driving signal to the signal line. The signal line may, for example, be a data signal line, a clock signal line, or other display signal line, and is electrically connected to a pixel circuit of the pixel 140 to control the working state of the pixel circuit, thereby controlling the pixel 140 to display a picture. By disposing the driving chip on the non-light-emitting side of the display panel, a narrow-frame design of the display panel can be achieved; by connecting the driving chip and the signal line through the wiring structure 20, normal transmission of the display signal can be ensured, and normal operation of the display panel can be ensured.

[0039] Further, the wiring structure 20 includes a conductive material such as gold, silver, or copper, and the shape and material of the wiring structure 20 can be set as needed, Figure 2 Only a fan-out shape of the wiring structure 20 is shown, and other shapes are also possible, which are not specifically limited here. After the display panel 100 is prepared, part of the wiring structure 20 is located on the non-light-emitting side (back) of the display panel, so that the display panel 100 achieves a narrow frame. The display panel provided by the present application includes a liquid crystal display panel, an organic light-emitting diode display panel, or a micro light-emitting diode display panel, etc. The first surface 11 includes a planar structure, etc., and the connecting surface 12 includes a planar structure or an arc-shaped structure, etc. When the connecting surface 12 is in an arc-shaped structure, a tangent plane of a point in the connecting surface 12 is perpendicular to the plane in which the first surface 11 is located, Figure 4 Another structure diagram of a display panel provided by an embodiment of the present application is shown in FIG. 2. Figure 4 As shown, the connecting surface 12 is in a planar structure, and a tangent plane of any point in the connecting surface 12 is perpendicular to the plane in which the first surface 11 is located. The above is only an exemplary description of the connecting surface 12 including a planar structure or an arc-shaped structure, and the specific structure of the connecting surface 12 can be set as needed, which is not specifically limited here. For ease of description, the following embodiments are described by taking the connecting surface 12 as an arc-shaped structure as an example.

[0040] Specifically, the connecting surface 12 is located between and connected with the two first surfaces 11, so the connecting surface 12 is only used to connect the adjacent first surfaces 11, and a tangent plane of a point in the connecting surface 12 is not perpendicular to the plane where the first surface 11 is located, so that the connection of the surface wiring structure 21 and the connecting wiring structure 22 is relatively gentle at the connection of the connecting surface 12 and the first surface 11, preventing the surface wiring structure 21 and the connecting wiring structure 22 from being broken at the connection, and further improving the connection reliability of the surface wiring structure 21 and the connecting wiring structure 22. By setting the thickness of the connecting wiring structure 22 to be greater than the thickness of the surface wiring structure 21, the connecting wiring structure 22 has a greater thickness, so as to improve the mechanical strength of the connecting wiring structure 22, and further reduce the risk of disconnection of the connecting wiring structure 22, while improving the connection reliability and stability of the connecting wiring structure 22 and the surface wiring structure 21, so as to improve the stability of the wiring structure 20 in signal transmission, and further improve the display reliability of the display panel 100.

[0041] The technical scheme of the embodiment of the present application reduces the sharpness of the included angle between the connecting surface and the first surface by setting the tangent plane of a point in the connecting surface of the substrate substrate to be not perpendicular to the plane where the first surface is located, so as to reduce the risk of disconnection of the surface wiring structure and the connecting wiring structure at the connection of the connecting surface and the first surface, and improve the connection reliability of the surface wiring structure and the connecting wiring structure. At the same time, the thickness of the connecting wiring structure is set to be greater than the thickness of the surface wiring structure, so that the connecting wiring structure has a greater thickness, so as to improve the mechanical strength of the connecting wiring structure, and further reduce the risk of disconnection of the connecting wiring structure, while improving the connection reliability and stability of the connecting wiring structure and the surface wiring structure, so as to improve the stability of the wiring structure in signal transmission, and further improve the display reliability of the display panel.

[0042] It can be understood that, on the basis that the thickness of the connecting wiring structure 22 is greater than the thickness of the surface wiring structure 21, the specific thicknesses of the connecting wiring structure 22 and the surface wiring structure 21 can be set according to actual needs. Figure 2 , the thickness of the surface wiring structure 21 is h1, and the thickness of the connecting wiring structure 22 is h2; wherein h1 < h2 < 2 * h1.

[0043] Specifically, if the thickness h2 of the connection wiring structure 22 is greater than or equal to 2 times the thickness h1 of the surface wiring structure 21, the connection wiring structure 22 has a greater protrusion degree relative to the surface wiring structure 21, which increases the risk of breakage of the connection wiring structure 22 when it is pressed, and the reliability of the connection wiring structure 22 is lower. Therefore, the thickness h2 of the connection wiring structure 22 is set to be between h1 and 2*h1, so as to reduce the risk of disconnection of the connection wiring structure 22 and improve the connection reliability of the connection wiring structure 22. In addition, the impedance of the wiring structure 20 is inversely proportional to the thickness of the wiring structure 20. By increasing the thickness of the connection wiring structure 22, the impedance of the connection wiring structure 22 can be reduced, and thus the overall impedance of the wiring structure 20 is reduced, the amount of attenuation of the signal transmitted in the wiring structure 20 is reduced, and the reliability of the wiring structure 20 in transmitting signals is improved.

[0044] It should be noted that the thickness h2 of the connection wiring structure 22 can be set between h1 and 2*h1 according to actual needs. For example, the thickness h2 of the connection wiring structure 22 is 1.5 times the thickness h1 of the surface wiring structure 21, and can also be other values, which are not limited here.

[0045] It can be understood that, on the basis of the thickness of the connection wiring structure 22 being greater than the thickness of the surface wiring structure 21, the line width of the connection wiring structure 22 can be the same as or different from the line width of the surface wiring structure 21. In an optional embodiment, Figure 5 A top view structure schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 1. As shown in FIG. 1, the line width of the surface wiring structure 21 is d1, and the line width of the connection wiring structure 22 is d2; wherein d1>d2. Figure 5

[0046] In the top view structure diagram of the display panel 100, the direction of the connection wiring structure 22 pointing to the surface wiring structure 21 is the first direction Y, and the direction perpendicular to the first direction Y is the second direction X. The surface wiring structure 21 extends along the first direction Y, so the size of the surface wiring structure 21 in the first direction Y can be understood as the length of the surface wiring structure 21, the size of the surface wiring structure 21 in the second direction X can be understood as the line width d1 of the surface wiring structure 21, and the size of the connection wiring structure 22 in the second direction X can be understood as the line width d2 of the connection wiring structure 21.

[0047] ​Specifically, since the impedance of the wiring structure 20 is inversely proportional to the cross-sectional area of the wiring structure 20, and the cross-sectional area of the wiring structure 20 is proportional to the line width and thickness of the wiring structure 20, when the thickness of the connection wiring structure 22 is greater than the thickness of the surface wiring structure 21, if the line width of the surface wiring structure 21 is less than or equal to the line width of the connection wiring structure 22, the cross-sectional area of the surface wiring structure 21 is less than the cross-sectional area of the connection wiring structure 22, so that the impedance of the surface wiring structure 21 is greater than the impedance of the connection wiring structure 22, and the signal attenuation increases when the signal is transmitted from the connection wiring structure 22 to the surface wiring structure 21, and the reliability of the wiring structure 20 in transmitting signals is reduced. Therefore, by setting the line width d1 of the surface wiring structure 22 to be greater than the line width d2 of the connection wiring structure 21, the cross-sectional area of the surface wiring structure 22 is increased, and the impedance of the surface wiring structure 22 is reduced, so that the overall impedance of the wiring structure 20 is low, the signal attenuation in the wiring structure 20 is reduced, the reliability of the wiring structure 20 in transmitting signals is improved, and the display effect of the display panel 100 is improved.

[0048] Optionally, Figure 6 Another structure diagram of a display panel provided by an embodiment of the present application is shown in FIG. 6. Figure 6 As shown in FIG. 6, the wiring structure 20 further includes a variable wiring structure 23; the variable wiring structure 23 is in contact with the surface wiring structure 21 and the connection wiring structure 22 respectively, the variable wiring structure 23 includes a first part 231 and a second part 232, the thickness of the first part 231 is greater than the thickness of the second part 232, and the first part 231 and the second part 232 are arranged in the direction of the connection wiring structure 22 pointing to the surface wiring structure 21.

[0049] Specifically, the different thicknesses of the connection wiring structure 22 and the surface wiring structure 21 will cause the impedance of the connection wiring structure 22 and the surface wiring structure 21 to change abruptly, and then cause the signal attenuation to change abruptly when the signal is transmitted from the connection wiring structure 22 to the surface wiring structure 21, which will affect the stability of signal transmission. By setting the variable wiring structure 23 between the surface wiring structure 21 and the connection wiring structure 22, and arranging the first part 231 with a greater thickness close to the connection wiring structure 22 and the second part 232 with a smaller thickness close to the surface wiring structure 21, so that the impedance between the connection wiring structure 22 and the surface wiring structure 21 is between the impedance of the connection wiring structure 22 and the impedance of the surface wiring structure 21, so that the signal attenuation can increase or decrease smoothly when the signal is transmitted between the connection wiring structure 22 and the surface wiring structure 21, and the stability of the wiring structure 20 in transmitting signals is improved.

[0050] It can be understood that the above only takes the example of the variable wiring structure 23 being arranged on the connection surface 12. In an optional embodiment, Figure 7This is a schematic diagram of another display panel structure provided in an embodiment of the present invention, as shown below. Figure 7 As shown, the variable wiring structure 23 can be disposed on the first surface 11 near the connecting surface 12. Figure 8 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention, such as... Figure 8 As shown, the variable wiring structure 23 can be disposed in the area of ​​the first surface 11 near the connecting surface 12 and in the area of ​​the connecting surface 12 near the first surface 11. The principle of the variable wiring structure 23 being disposed on the first surface 11 or on the first surface 11 and the connecting surface 12 can be referred to the relevant description of the variable wiring structure 23 being disposed on the connecting surface 12, and no specific limitation is made here.

[0051] It should be noted that the structures of the first part 231 and the second part 232 in the variable wiring structure 23 can be set according to actual needs. Figures 6-8 Only the first part 231 and the second part 232 are shown as slope structures with gradually decreasing thickness. In this embodiment of the invention, the starting and ending positions of the slope structure can be set according to the desired steepness of the slope structure. In an exemplary embodiment, the starting position of the slope structure is located at the connection between the first part 231 and the connecting wiring structure 22, and the ending position of the slope structure can be located at the connection between the second part 232 and the surface wiring structure 21, so that the slope structure has a certain length and the thickness of the slope structure can decrease slowly, thereby reducing the degree of impedance change, reducing the impact of impedance on signal transmission, and improving the stability of signal transmission. The above description only uses the variable wiring structure 23 as an example of a slope structure. In an optional embodiment, Figure 9 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention, such as... Figure 9 As shown, along the direction from the connecting wiring structure 22 to the surface wiring structure 21, the variable wiring structure 23 includes multiple steps. The thickness of the step in the first part 231 connected to the connecting wiring structure 22 is greater than the thickness of the step in the first part 231 connected to the second part 232, and the thickness of the step in the second part 232 connected to the first part 231 is greater than the thickness of the step in the second part 232 connected to the surface wiring structure 21. Thus, by setting the thickness of the variable wiring structure 23 to gradually decrease in the form of steps, the degree of thickness abruptness between the connecting wiring structure 22 and the surface wiring structure 21 can be reduced, allowing the impedance of the variable wiring structure 23 to transition smoothly, reducing the impact of impedance on signal transmission, improving the stability of signal transmission, and consequently improving the display effect of the display panel 100.

[0052] Optional, see reference Figures 6-8The variable wiring structure 23 includes a first end portion 233 and a second end portion 234; the first end portion 233 is in contact with the surface wiring structure 21, and the thickness of the first end portion 233 is the same as the thickness of the surface wiring structure 21; and / or the second end portion 234 is in contact with the connecting wiring structure 22, and the thickness of the second end portion 234 is the same as the thickness of the connecting wiring structure 22. Figure 7 In the embodiment shown in FIG. 1, the thickness of the first end portion 233 is the same as the thickness of the surface wiring structure 21, so as to improve the connection reliability of the variable wiring structure 23 and the surface wiring structure 21. Figure 8 In the embodiment shown in FIG. 1, the thickness of the second end portion 234 is the same as the thickness of the connecting wiring structure 22, so as to improve the connection reliability of the variable wiring structure 23 and the connecting wiring structure 22. Figure 6 In the embodiment shown in FIG. 1, the thickness of the first end portion 233 is the same as the thickness of the surface wiring structure 21, and the thickness of the second end portion 234 is the same as the thickness of the connecting wiring structure 22. In this way, the variable wiring structure 23 is smoothly connected with the connecting wiring structure 22 and the surface wiring structure 21, so as to improve the connection smoothness and the connection reliability of the variable wiring structure 23, the connecting wiring structure 22 and the surface wiring structure 21.

[0053] Optionally, Figure 10 Another top view of the display panel is provided in the embodiment of the present application, which is shown in FIG. 2. Figure 1 And Figure 10 The wiring structure 20 includes a first wiring structure 24 and a second wiring structure 25, and the extension length of the first wiring structure 24 is greater than the extension length of the second wiring structure 25; the thickness of the surface wiring structure 21 in the first wiring structure 24 is greater than the thickness of the surface wiring structure 21 in the second wiring structure 25, and / or the thickness of the connecting wiring structure 22 in the first wiring structure 24 is greater than the thickness of the connecting wiring structure 22 in the second wiring structure 25.

[0054] In the embodiment shown in FIG. 1, the extension length of the first wiring structure 24 is the sum of the extension length of the surface wiring structure 21 and the extension length of the connecting wiring structure 22 in the first wiring structure 24, and the extension length of the second wiring structure 25 is the sum of the extension length of the surface wiring structure 21 and the extension length of the connecting wiring structure 22 in the second wiring structure 25.

[0055] Specifically, since the size of the connecting surface in the substrate 10 is a fixed value, the extension length of the connecting wiring structure 22 in the first wiring structure 24 is the same as the extension length of the connecting wiring structure 22 in the second wiring structure 25, and thus when the extension length of the first wiring structure 24 is greater than the extension length of the second wiring structure 25, the extension length of the surface wiring structure 21 in the first wiring structure 24 is greater than the extension length of the surface wiring structure 21 in the second wiring structure 25. Since the impedance of the wiring structure 20 is proportional to the extension length of the wiring structure 20, when the thickness of the surface wiring structure 21 in the first wiring structure 24 is the same as the thickness of the surface wiring structure 21 in the second wiring structure 25, and the thickness of the connecting wiring structure 22 in the first wiring structure 24 is the same as the thickness of the connecting wiring structure 22 in the second wiring structure 25, the impedance of the first wiring structure 24 is greater than the impedance of the second wiring structure 25, so that the transmission rate of the signals in the first wiring structure 24 and the second wiring structure 25 is different. When the first wiring structure 24 and the second wiring structure 25 transmit the same signal, the attenuation degree of the signal in the first wiring structure 24 and the second wiring structure 25 is different, and thus the signal transmitted to the receiving end is different, which affects the display uniformity of the display panel 100. Therefore, by setting the thickness of the surface wiring structure 21 in the first wiring structure 24 to be greater than the thickness of the surface wiring structure 21 in the second wiring structure 25, or the thickness of the connecting wiring structure 22 in the first wiring structure 24 to be greater than the thickness of the connecting wiring structure 22 in the second wiring structure 25, the impedance of the first wiring structure 24 is reduced, the impedance difference between the first wiring structure 24 and the second wiring structure 25 is small, and the difference in signal transmission between the first wiring structure 24 and the second wiring structure 25 is reduced, thereby improving the display uniformity of the display panel 100.

[0056] In an optional embodiment, the thickness of the surface wiring structure 21 in the first wiring structure 24 is greater than the thickness of the surface wiring structure 21 in the second wiring structure 25, and the thickness of the connecting wiring structure 22 in the first wiring structure 24 is greater than the thickness of the connecting wiring structure 22 in the second wiring structure 25, so as to reduce the impedance of the first wiring structure 24, and the impedance difference between the first wiring structure 24 and the second wiring structure 25 is small, and the difference in signal transmission between the first wiring structure 24 and the second wiring structure 25 is reduced, thereby improving the display uniformity of the display panel 100.

[0057] It can be understood that the thickness difference of the surface wiring structure 21 and the connecting wiring structure 22 in the first wiring structure 24 and the thickness difference of the surface wiring structure 21 and the connecting wiring structure 22 in the second wiring structure 25 can be set according to actual needs. For example, when the impedance difference between the first wiring structure 24 and the second wiring structure 25 is small, only the thickness of the connecting wiring structure 22 in the first wiring structure 24 can be set to be greater than the thickness of the connecting wiring structure 22 in the second wiring structure 25, or only the thickness of the connecting wiring structure 22 in the first wiring structure 24 can be set to be greater than the thickness of the connecting wiring structure 22 in the second wiring structure 25, so as to reduce the impedance difference between the first wiring structure 24 and the second wiring structure 25. When the impedance difference between the first wiring structure 24 and the second wiring structure 25 is large, the thickness of the connecting wiring structure 22 in the first wiring structure 24 can be set to be greater than the thickness of the connecting wiring structure 22 in the second wiring structure 25, and the thickness of the connecting wiring structure 22 in the first wiring structure 24 can be set to be greater than the thickness of the connecting wiring structure 22 in the second wiring structure 25, so as to reduce the impedance difference between the first wiring structure 24 and the second wiring structure 25.

[0058] Optionally, Figure 11 a structure schematic diagram of still another display panel provided by an embodiment of the present application, Figure 12 a structure schematic diagram of still another display panel provided by an embodiment of the present application, Figure 11 and Figure 12 The first surface 11 includes a first type of sub-surface 111 and a second type of sub-surface 112. The first type of sub-surface 111 includes a first sub-surface 101 and a second sub-surface 102 arranged oppositely. The second type of sub-surface 112 is arranged on a plane intersecting with the plane of the first sub-surface 101 and the plane of the second sub-surface 102. The connecting surface 12 is connected with the second type of sub-surface 112 and the first type of sub-surface 111. The surface wiring structure 21 includes a first wiring part 201 arranged on the first sub-surface 101, a second wiring part 202 arranged on the second sub-surface 102, and a third wiring part 203 arranged on the second type of sub-surface 112. The connecting wiring structure 22 includes a first connecting part 221 connecting the first wiring part 201 and the third wiring part 203, and a second connecting part 222 connecting the second wiring part 202 and the third wiring part 203. The thickness of the first connecting part 221 is greater than the thickness of the first wiring part 201 and the thickness of the third wiring part 203, or the thickness of the second connecting part 222 is greater than the thickness of the second wiring part 202 and the thickness of the third wiring part 203.

[0059] The angle between the second type of sub-surface 112 and the first sub-surface 101 and the angle between the second type of sub-surface 112 and the second sub-surface 102 can be set according to actual needs. For example, the second type of sub-surface 112 is perpendicular to the first sub-surface 101 and the second sub-surface 102, and can also be other forms, which are not limited here.

[0060] Specifically, the first connecting part 221 is used to connect the first wiring part 201 and the third wiring part 203. By setting the thickness of the first connecting part 221 to be greater than the thickness of the first wiring part 201 and greater than the thickness of the third wiring part 203, the first connecting part 221 has a greater thickness, so as to improve the mechanical strength of the first connecting part 221, thereby reducing the risk of disconnection of the first connecting part 221, and improving the connection stability of the first connecting part 221 and the first wiring part 201 and the connection stability of the first connecting part 221 and the third wiring part 203, so as to improve the stability of signal transmission between the first connecting part 221, the first wiring part 201 and the third wiring part 203, thereby improving the display reliability of the display panel 100.

[0061] Correspondingly, the second connecting part 222 is used to connect the second wiring part 202 and the third wiring part 203. By setting the thickness of the second connecting part 222 to be greater than the thickness of the second wiring part 202 and greater than the thickness of the third wiring part 203, the second connecting part 222 has a greater thickness, so as to improve the mechanical strength of the second connecting part 222, thereby reducing the risk of disconnection of the second connecting part 222, and improving the connection stability of the second connecting part 222 and the second wiring part 202 and the connection stability of the second connecting part 222 and the third wiring part 203, so as to improve the stability of signal transmission between the second connecting part 222, the second wiring part 202 and the third wiring part 203, thereby improving the display reliability of the display panel 100.

[0062] In an optional embodiment, Figure 13 A structural schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 1. As shown in FIG. 1, the display panel 100 includes a first sub-surface 101, a second sub-surface 102 and a third sub-surface 103. Figure 13As shown, the thickness of the first connecting section 221 is greater than the thickness of the first wiring section 201 and the thickness of the third wiring section 203, and the thickness of the second connecting section 222 is greater than the thickness of the second wiring section 202 and the thickness of the third wiring section 203. In this way, the mechanical strength of the first connecting section 221 can be improved, and the risk of disconnection of the first connecting section 221 can be reduced, so as to improve the connection stability of the first connecting section 221 and the first wiring section 201, and the connection stability of the first connecting section 221 and the third wiring section 203. At the same time, the mechanical strength of the second connecting section 222 can be improved, and the risk of disconnection of the second connecting section 222 can be reduced, so as to improve the connection stability of the second connecting section 222 and the second wiring section 202, and the connection stability of the second connecting section 222 and the third wiring section 203. The risk of fracture of the first connecting section 221 and the second connecting section 222 is reduced, so that the signal can be reliably transmitted between the first wiring section 201, the first connecting section 221, the third wiring section 203, the second connecting section 222, and the second wiring section 202, thereby improving the display reliability of the display panel 100.

[0063] It should be noted that, on the basis that the thickness of the first connecting section 221 is greater than the thickness of the first wiring section 201 and the thickness of the third wiring section 203, and / or the thickness of the second connecting section 222 is greater than the thickness of the second wiring section 202 and the thickness of the third wiring section 203, the thickness of the first wiring section 201, the thickness of the second wiring section 202, and the thickness of the third wiring section 203 can be the same or different, and can be set according to actual needs. In an optional embodiment, referring to Figures 11-13 , the thickness of the first wiring section 201 is h11, the thickness of the second wiring section 202 is h12, and the thickness of the third wiring section 203 is h13; wherein |h11-h13| / h13<5%, |h12-h13| / h13<5%.

[0064] Specifically, by setting |h11-h13| / h13<5% and |h12-h13| / h13<5%, the difference between the thickness h11 of the first wiring section 201 and the thickness h13 of the third wiring section 203 is small, and the difference between the thickness h12 of the second wiring section 202 and the thickness h13 of the third wiring section 203 is small, so that the same power target source can be used to sputter to form the first wiring section 201, the second wiring section 202, and the third wiring section 203 when the first wiring section 201, the second wiring section 202, and the third wiring section 203 are prepared, thereby reducing the number of target sources required when the wiring structure 20 is prepared, and reducing the preparation cost.

[0065] Optionally, Figure 14Another structural schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 2. As shown in FIG. 2, the first surface 11 includes a first type of sub-surface 111 and a second type of sub-surface 112. The first type of sub-surface 111 includes a first sub-surface 101 and a second sub-surface 102 arranged opposite to each other. The second type of sub-surface 112 is arranged in a plane that intersects the plane in which the first sub-surface 101 is arranged and the plane in which the second sub-surface 102 is arranged. The connecting surface 12 is in contact with the second type of sub-surface 112 and the first type of sub-surface 111. The display panel 100 further includes a first pad 31 and a second pad 32. The first pad 31 is arranged on the first sub-surface 101. The second pad 32 is arranged on the second sub-surface 102. A wiring structure 20 is electrically connected to the first pad 31 and the second pad 32. Figure 14

[0066] The first pad 31 and the second pad 32 include a conductive material such as copper, which can be arranged as required and is not limited herein. The wiring structure 20 includes one of a data line, a clock signal line, VGL or VGH, and a power signal line. The shape of the wiring structure 20 can be arranged as required, for example, the wiring structure 20 includes a line shape or a surface structure.

[0067] Specifically, the first pad 31 arranged on the first sub-surface 101 is electrically connected to the second pad 32 arranged on the second sub-surface 102 through the wiring structure 20, so that a signal in the first pad 31 can be transmitted to the second pad 32 through the wiring structure 20, or a signal in the second pad 32 can be transmitted to the first pad 31 through the wiring structure 20. A light emitting element can be arranged on the side of the first pad 31 away from the substrate 10, and the light emitting element is electrically connected to the first pad 31. A driving chip is arranged on the side of the second pad 32 away from the substrate 10, and the driving chip is electrically connected to the second pad 32. A driving signal in the driving chip is transmitted to the light emitting element through the wiring structure 20 and the first pad 31, so as to control the light emitting element to emit light, and the display panel 100 displays the light emission.

[0068] Optionally, Figure 15 Another structural schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 2. As shown in FIG. 2, the first surface 11 includes a first type of sub-surface 111 and a second type of sub-surface 112. The first type of sub-surface 111 includes a first sub-surface 101 and a second sub-surface 102 arranged opposite to each other. The second type of sub-surface 112 is arranged in a plane that intersects the plane in which the first sub-surface 101 is arranged and the plane in which the second sub-surface 102 is arranged. The connecting surface 12 is in contact with the second type of sub-surface 112 and the first type of sub-surface 111. The display panel 100 further includes a first pad 31 and a second pad 32. The first pad 31 is arranged on the first sub-surface 101. The second pad 32 is arranged on the second sub-surface 102. A wiring structure 20 is electrically connected to the first pad 31 and the second pad 32. Figure 16 Figure 15 and Figure 16 ​​The first surface 11 includes a first type of sub-surface 111 and a second type of sub-surface 112. The first type of sub-surface 111 includes a first sub-surface 101 and a second sub-surface 102 arranged oppositely. The second type of sub-surface 112 is arranged in a plane intersecting the plane of the first sub-surface 101 and the plane of the second sub-surface 102. The connecting surface 12 is connected to the second type of sub-surface 112 and the first type of sub-surface 111. The surface wiring structure 21 includes a first wiring part 201 arranged on the first sub-surface 101, a second wiring part 202 arranged on the second sub-surface 102, and a third wiring part 203 arranged on the second type of sub-surface 112. The thickness of the third wiring part 203 is greater than the thickness of the first wiring part 201, or the thickness of the third wiring part 203 is greater than the thickness of the second wiring part 202.

[0069] In the direction perpendicular to the first sub-surface 101, the thickness of the first wiring part 201 is h11, and the thickness of the second wiring part 202 is h12. In the direction perpendicular to the tangent of the connecting surface 12, the thickness of the third wiring part 203 is h13.

[0070] Specifically, by setting the thickness of the third wiring part 203 to be greater than the thickness of the first wiring part 201, the third wiring part 203 has a greater thickness, thereby improving the mechanical strength of the third wiring part 203, reducing the risk of disconnection of the third wiring part 203, and improving the connection stability of the third wiring part 203 and the first connecting part 221 and the connection stability of the third wiring part 203 and the second connecting part 222, thereby improving the stability of signal transmission between the first connecting part 221, the third wiring part 203, and the second connecting part 222, and improving the display reliability of the display panel 100.

[0071] Specifically, by setting the thickness of the third wiring part 203 to be greater than the thickness of the first wiring part 201, the third wiring part 203 has a greater thickness, thereby improving the mechanical strength of the third wiring part 203, reducing the risk of disconnection of the third wiring part 203, and improving the connection stability of the third wiring part 203 and the first connecting part 221 and the connection stability of the third wiring part 203 and the second connecting part 222, thereby improving the stability of signal transmission between the first connecting part 221, the third wiring part 203, and the second connecting part 222, and improving the display reliability of the display panel 100.

[0072] In an optional embodiment, Figure 17 A structural schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 1. The display panel 100 includes a first surface 11, a second surface 12, and a surface wiring structure 21. The first surface 11 includes a first type of sub-surface 111 and a second type of sub-surface 112. The first type of sub-surface 111 includes a first sub-surface 101 and a second sub-surface 102 arranged oppositely. The second type of sub-surface 112 is arranged in a plane intersecting the plane of the first sub-surface 101 and the plane of the second sub-surface 102. The connecting surface 12 is connected to the second type of sub-surface 112 and the first type of sub-surface 111. The surface wiring structure 21 includes a first wiring part 201 arranged on the first sub-surface 101, a second wiring part 202 arranged on the second sub-surface 102, and a third wiring part 203 arranged on the second type of sub-surface 112. The thickness of the third wiring part 203 is greater than the thickness of the first wiring part 201, or the thickness of the third wiring part 203 is greater than the thickness of the second wiring part 202. Figure 17As shown, the thickness of the third wiring part 203 is greater than the thickness of the first wiring part 201, and the thickness of the third wiring part 203 is greater than the thickness of the second wiring part 202. In this way, the mechanical strength of the third wiring part 203 is improved, and the risk of disconnection of the third wiring part 203 is reduced. In addition, when preparing the wiring structure 20, the first wiring part 201 and the second wiring part 202 can be prepared respectively, and the third wiring part 203 is prepared once while preparing the first wiring part 201, and the third wiring part 203 is prepared once while preparing the second wiring part 202. In this way, the thickness of the third wiring part 203 is greater than the thickness of the first wiring part 201 and the second wiring part 202, so as to improve the mechanical strength of the third wiring part 203, reduce the risk of disconnection of the third wiring part 203, and improve the connection reliability of the third wiring part 203.

[0073] Figure 18 A flowchart of a preparation method of a display panel provided by an embodiment of the present application is shown in Figure 19 A process structure schematic diagram of a display panel provided by an embodiment of the present application is shown in Figure 18 As shown, the preparation method of the display panel includes:

[0074] S101, providing a substrate substrate.

[0075] The substrate substrate includes a first surface and a connecting surface, and the connecting surface is located between the two first surfaces and connected with the first surface. A tangent plane of a point in the connecting surface is perpendicular to the plane where the first surface is located.

[0076] Specifically, referring to Figure 19 The substrate substrate 10 includes a flexible substrate substrate or a rigid substrate substrate. The flexible substrate substrate can include a flexible organic material layer such as PI or PET, so that the substrate substrate has the characteristics of being bendable and coiled. The rigid substrate substrate can include a hard inorganic material layer such as glass, so that the substrate substrate has sufficient support ability. The connecting surface 12 in the substrate substrate 10 is located between the two first surfaces 11 and connected with the first surface 11, so that after other structures are prepared on the first surface 11, other structures can be arranged on the connecting surface 12 to connect the other structures on the two first surfaces 11 adjacent to the connecting surface 12.

[0077] S102, using a target source to sputter to form a surface wiring structure on the first surface and to form a connecting wiring structure on the connecting surface at the same time, so as to obtain a wiring structure.

[0078] The thickness of the connecting wiring structure is greater than the thickness of the surface wiring structure.

[0079] Specifically, referring to Figure 19The target source 40 can be placed on the side of the first surface 11 away from the substrate 10 to sputter form the surface wiring structure 21 on the first surface 11, and the target source 40 can be placed on the side of the connecting surface 12 away from the substrate 10 to sputter form the connecting wiring structure 22 on the connecting surface 12, so that the target sources 40 work simultaneously to sputter form the wiring structure 20 including the surface wiring structure 21 and the connecting wiring structure 22 on the first surface 11, thereby improving the preparation efficiency of the wiring structure 20. In addition, the target source 40 for forming the connecting wiring structure 22 can have a larger output power to form the connecting wiring structure 22 with a larger thickness, thereby reducing the risk of breaking of the connecting wiring structure 22 and improving the connection reliability of the wiring structure 20.

[0080] In an optional embodiment, on the basis of the above embodiment, the embodiment of the present application describes the case of sputtering the surface wiring structure on the first surface and the connecting wiring structure on the connecting surface by using the target source, Figure 20 Another process structure for preparing a display panel provided by the embodiment of the present application is shown in the figure. The process structure for sputtering the surface wiring structure on the first surface and the connecting wiring structure on the connecting surface by using the target source includes: sputtering the first wiring structure on the first type of sub-surface by using the first target source, and sputtering the third wiring part on the second type of sub-surface by using the second target source, while the first target source and the second target source sputter the connecting wiring structure on the connecting surface connected with the first type of sub-surface and the second type of sub-surface.

[0081] The first type of sub-surface includes the first sub-surface and / or the second sub-surface, the first sub-surface and the second sub-surface are oppositely arranged, and the second type of sub-surface is located on a plane intersecting the plane where the first sub-surface is located and the plane where the second sub-surface is located. The connecting surface is in contact with the second type of sub-surface and the first type of sub-surface, respectively. The first wiring structure includes the first wiring part and the second wiring part, the first wiring part is located on the first sub-surface, and the second wiring part is located on the second sub-surface. The connecting wiring structure includes the first connecting part connecting the first wiring part and the third wiring part, and the second connecting part connecting the second wiring part and the third wiring part.

[0082] Specifically, referring to Figure 20The first target source 41 can be used to sputter to form the first wiring part 201 in the wiring area of the first sub-surface 101, and the second target source 42 can be used to sputter to form the third wiring part 203 in the wiring area of the second sub-surface 112, and meanwhile, the second target source 42 and the first target source 41 located on the side of the first sub-surface 101 can be used to sputter to form the first connecting part 221 on the connecting surface 12 connected with the first sub-surface 101 and the second sub-surface 112. Correspondingly, the first target source 41 can be used to sputter to form the second wiring part 202 in the wiring area of the second sub-surface 102, and the second target source 42 can be used to sputter to form the third wiring part 203 in the wiring area of the second sub-surface 112, and meanwhile, the second target source 42 and the first target source 41 located on the side of the second sub-surface 102 can be used to sputter to form the second connecting part 222 on the connecting surface 12 connected with the second sub-surface 102 and the second sub-surface 112. In this way, the first target source 41 can be arranged on the side of the first sub-surface 101 away from the substrate 10, and the second target source 42 can be arranged on the side of the connecting surface 12 and the second sub-surface 112 away from the substrate 10, so that the first target source 41 and the second target source 42 can work at the same time, and then the wiring structure 20 can be formed, and the preparation efficiency can be improved. In order to make the first connecting part 221 and the second connecting part 222 have a larger thickness, the sputtering time of the first target source 41 and the second target source 42 can be increased, and at this time, the first wiring part 201, the second wiring part 202 and the third wiring part 203 also have a larger thickness, and the part of the first wiring part 201 away from the substrate 10, the part of the second wiring part 202 away from the substrate 10 and the part of the third wiring part 203 away from the substrate 10 can be removed by using a grinding tool, so that the thickness of the first connecting part 221 is greater than the thickness of the first wiring part 201 and the third wiring part 203, and the thickness of the second connecting part 222 is greater than the thickness of the second wiring part 202 and the third wiring part 203.

[0083] The technical scheme provided by the present application can improve the preparation efficiency of the wiring structure by providing a substrate and sputtering a target source to form a surface wiring structure on a first surface and a connecting wiring structure on a connecting surface at the same time. In addition, the mechanical strength of the connecting wiring structure can be improved by making the thickness of the connecting wiring structure greater than the thickness of the surface wiring structure, thereby reducing the risk of fracture of the connecting wiring structure and improving the connection reliability of the wiring structure, and further improving the display reliability of the display panel.

[0084] On the basis of the above-mentioned embodiments, the present application provides a method for preparing a display panel, Figure 21 The flow chart of another method for preparing a display panel provided by the present application, Figure 22This is a schematic diagram of another process structure for manufacturing a display panel provided by an embodiment of the present invention, as shown below. Figure 21 As shown, the method for manufacturing the display panel includes:

[0085] S201, Provide a substrate.

[0086] The substrate includes a first surface and a connecting surface, with the connecting surface located between and connected to the two first surfaces. A tangent plane at a point on the connecting surface is not perpendicular to the plane containing the first surfaces.

[0087] S202, Provide support structure and crimping structure.

[0088] Among them, reference Figure 22 The support structure 50 includes a support platform 51 and a first baffle 52 located on one side of the support platform 51, and the pressing structure 60 includes a pressing platform 61 and a second baffle 62 located on one side of the pressing platform 61.

[0089] Specifically, the support platform 51 and the pressing platform 61 can be made of materials with supporting properties, such as steel. The support platform 51 can provide a flat surface to ensure the flatness of the substrate 10 and other samples when they are placed on it. The support platform 51 can also provide support force for the substrate 10 and other samples. After the substrate 10 and other samples are placed on the support platform 51, the pressing platform 61 can provide pressing force to prevent the substrate 10 and other samples from sliding on the support platform 51, thereby fixing the position of the substrate 10 and other samples. The first baffle 52 and the second baffle 62 can be made of materials such as metal and can be set according to actual needs. The first baffle 52 is used to protect the support platform 51 and prevent sputtered materials from sputtering onto the support platform 51, which could cause unevenness on the support platform 51, thereby improving the reliability of the support platform 51 in supporting the substrate 10 and other samples. The second baffle 62 is used to protect the pressing platform 61 and prevent sputtered materials from splashing onto the pressing platform 61, which could lead to unevenness on the side of the pressing platform 61 near the support platform 51, thereby improving the reliability of pressing the sample on the pressing platform 61.

[0090] S203. A substrate is disposed within the space defined by the support structure and the pressing structure, and the first surface and the connecting surface are exposed in the space between the first baffle and the support table surface and the second baffle and the pressing table surface.

[0091] Specifically, the substrate 10 is placed in the space defined between the support structure 50 and the pressing structure 60, and the first surface 11 to be formed with the surface wiring structure and the connecting surface 12 to be formed with the connecting wiring structure are exposed to the space on the side of the first baffle 52 away from the support mesa 51 and the side of the second baffle 62 away from the pressing mesa 61, so as to facilitate the subsequent formation of the wiring structure on the exposed first surface 11 and connecting surface 12 by using the target source. The first baffle 52 and the second baffle 62 can prevent the target material sputtered by the target source from sputtering to the support mesa 51, the pressing mesa 61, the first surface 11 covered by the pressing mesa 61, and the first surface 11 in contact with the support mesa 51, thereby improving the accuracy of the target material sputtered by the target source.

[0092] In an optional embodiment, cooling pipelines can be arranged in the support mesa 51 and the pressing mesa 61 to reduce the temperature of the area of the substrate 10 where the wiring structure 20 is not arranged, prevent the temperature of the area where the wiring structure 20 is not arranged from being too high to cause internal wiring abnormalities, and improve the yield of the display panel.

[0093] S204, sputtering the first surface by using the target source to form the surface wiring structure and sputtering the connecting surface by using the target source to form the connecting wiring structure, so as to obtain the wiring structure.

[0094] The thickness of the connecting wiring structure is greater than the thickness of the surface wiring structure.

[0095] The technical solution provided by the present application places the substrate in the space defined by the support structure and the pressing structure to fix the substrate by the support structure and the pressing structure, so as to prevent the substrate from sliding on the support mesa. Meanwhile, the first baffle is arranged on one side of the support mesa, and the second baffle is arranged on one side of the pressing mesa, so that the first baffle and the second baffle can prevent the target material sputtered by the target source from sputtering to the support mesa, the pressing mesa, the first surface covered by the pressing mesa, and the first surface in contact with the support mesa during the process of forming the wiring structure on the exposed first surface and connecting surface by using the target source, thereby improving the accuracy of the target material sputtered by the target source.

[0096] Based on the same inventive concept, the present application also provides a display device comprising the display panel provided by any of the embodiments of the present application. Therefore, the display device has the technical features of the display panel provided by the embodiments of the present application, and can achieve the beneficial effects of the display panel provided by the embodiments of the present application. The same parts can be referred to the above description of the display panel provided by the embodiments of the present application, which will not be described here again.

[0097] Optionally, Figure 23 A structural schematic diagram of a display device provided by an embodiment of the present application is shown in Figure 23As shown, the display device 200 includes at least two display panels 100; the at least two display panels 100 are spliced to form the display device 200. In this way, the number of display panels 100 included in the display device 200 can be set according to actual needs, so that the display device 200 realizes different sizes to adapt to different display needs, and improves the practicability of the display device 200. The display device 200 can be any electronic product with a display function, including but not limited to the following categories: mobile phones, televisions, notebook computers, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, vehicle-mounted displays, medical equipment, industrial control equipment, touch interaction terminals, etc., and the present application is not specially limited to this.

[0098] It should be noted that the above are only the preferred embodiments of the present application and the technical principles applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, re-adjustments, mutual combinations and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that, include: A substrate, the substrate including a first surface and a connecting surface, the connecting surface being located between two first surfaces and connected to the first surfaces; The tangent plane at a point on the connecting surface is not perpendicular to the plane containing the first surface; A wiring structure, comprising a surface wiring structure and a connection wiring structure, wherein the surface wiring structure is disposed on the first surface, the connection wiring structure is disposed on the connection surface, and the thickness of the connection wiring structure is greater than the thickness of the surface wiring structure; The wiring structure further includes a variable wiring structure, which extends along the direction from the connecting wiring structure to the surface wiring structure, and the variable wiring structure includes at least two steps.

2. The display panel according to claim 1, characterized in that, The thickness of the surface wiring structure is h1, and the thickness of the connection wiring structure is h2; Where h1 < h2 < 2*h1.

3. The display panel according to claim 1, characterized in that, The linewidth of the surface wiring structure is d1, and the linewidth of the connecting wiring structure is d2; Where d1 > d2.

4. The display panel according to claim 1, characterized in that, The variable wiring structure is in contact with the surface wiring structure and the connection wiring structure respectively. The variable wiring structure includes a first part and a second part. The thickness of the first part is greater than the thickness of the second part, and the first part and the second part are arranged along the direction from the connection wiring structure to the surface wiring structure.

5. The display panel according to claim 4, characterized in that, The variable wiring structure includes a first end and a second end; The first end contacts the surface wiring structure, and the thickness of the first end is the same as the thickness of the surface wiring structure; and / or, The second end contacts the connecting wiring structure, and the thickness of the second end is the same as the thickness of the connecting wiring structure.

6. The display panel according to claim 1, characterized in that, The wiring structure includes a first wiring structure and a second wiring structure, wherein the extension length of the first wiring structure is greater than the extension length of the second wiring structure. The thickness of the surface wiring structure in the first wiring structure is greater than the thickness of the surface wiring structure in the second wiring structure, and / or the thickness of the connecting wiring structure in the first wiring structure is greater than the thickness of the connecting wiring structure in the second wiring structure.

7. The display panel according to claim 1, characterized in that, The first surface includes a first type of sub-surface and a second type of sub-surface. The first type of sub-surface includes a first sub-surface and a second sub-surface that are disposed opposite to each other. The plane containing the second type of sub-surface intersects the plane containing the first sub-surface and the plane containing the second sub-surface, respectively. The connecting surface is in contact with and connected to the second type of sub-surface and the first type of sub-surface, respectively. The surface wiring structure includes a first wiring portion located on the first sub-surface, a second wiring portion located on the second sub-surface, and a third wiring portion located on the second type of sub-surface. The connection wiring structure includes a first connection portion connecting the first wiring portion and the third wiring portion, and a second connection portion connecting the second wiring portion and the third wiring portion. The thickness of the first connection portion is greater than the thickness of the first wiring portion and the thickness of the third wiring portion, and / or the thickness of the second connection portion is greater than the thickness of the second wiring portion and the thickness of the third wiring portion.

8. The display panel according to claim 7, characterized in that, The thickness of the first wiring section is h11, the thickness of the second wiring section is h12, and the thickness of the third wiring section is h13; Among them, |h11-h13| / h13<5%, |h12-h13| / h13<5%.

9. The display panel according to claim 1, characterized in that, The first surface includes a first type of sub-surface and a second type of sub-surface. The first type of sub-surface includes a first sub-surface and a second sub-surface disposed opposite to each other. The plane containing the second type of sub-surface intersects the plane containing the first sub-surface and the plane containing the second sub-surface, respectively. The connecting surface is in contact with the second type of sub-surface and the first type of sub-surface, respectively. The display panel further includes: The first pad is located on the first sub-surface; The second pad is located on the second sub-surface; The wiring structure is electrically connected to the first pad and the second pad, respectively.

10. The display panel according to claim 1, characterized in that, The first surface includes a first type of sub-surface and a second type of sub-surface. The first type of sub-surface includes a first sub-surface and a second sub-surface that are disposed opposite to each other. The plane containing the second type of sub-surface intersects the plane containing the first sub-surface and the plane containing the second sub-surface, respectively. The connecting surface is in contact with and connected to the second type of sub-surface and the first type of sub-surface, respectively. The surface wiring structure includes a first wiring portion located on the first sub-surface, a second wiring portion located on the second sub-surface, and a third wiring portion located on the second type of sub-surface; The thickness of the third wiring section is greater than the thickness of the first wiring section, and / or the thickness of the third wiring section is greater than the thickness of the second wiring section.

11. A method for manufacturing a display panel as described in any one of claims 1-10, characterized in that, include: Provide substrates; The substrate includes a first surface and a connecting surface, wherein the connecting surface is located between the two first surfaces and is connected to the first surface; The tangent plane at a point on the connecting surface is not perpendicular to the plane containing the first surface; A surface wiring structure is formed by sputtering a target source on the first surface, and a connection wiring structure is formed by sputtering on the connection surface to obtain a wiring structure; The thickness of the connection wiring structure is greater than the thickness of the surface wiring structure.

12. The preparation method according to claim 11, characterized in that, Simultaneously forming a surface wiring structure on the first surface by sputtering with a target source, and forming a connection wiring structure on the connection surface by sputtering, including: A first type of wiring structure is formed by sputtering a first target source on a wiring area to be wired on a first type of sub-surface, and a third wiring portion is formed by sputtering a second target source on a wiring area to be wired on a second type of sub-surface. Simultaneously, the first target source and the second target source sputter on a connecting surface connected to the first type of sub-surface and the second type of sub-surface to form a connecting wiring structure. The first type of sub-surface includes a first sub-surface and / or a second sub-surface, which are disposed opposite to each other, and the plane containing the second type of sub-surface intersects the plane containing the first sub-surface and the plane containing the second sub-surface, respectively. The connecting surface is in contact with the second type of sub-surface and the first type of sub-surface, respectively. The first type of wiring structure includes a first wiring portion and a second wiring portion, with the first wiring portion located on the first sub-surface and the second wiring portion located on the second sub-surface. The connecting wiring structure includes a first connecting portion connecting the first wiring portion and the third wiring portion, and a second connecting portion connecting the second wiring portion and the third wiring portion.

13. The preparation method according to claim 11, characterized in that, The method further includes, before sputtering the connection wiring structure on the connection surface to form a surface wiring structure using a target source and before sputtering the connection wiring structure on the connection surface: A support structure and a pressing structure are provided; the support structure includes a support platform and a first baffle located on one side of the support platform, and the pressing structure includes a pressing platform and a second baffle located on one side of the pressing platform; The substrate is disposed within the space defined by the support structure and the pressing structure, and the first surface and the connecting surface are exposed in the space between the first baffle and the support platform and the second baffle and the pressing platform.

14. A display device, characterized in that, include: The display panel according to any one of claims 1 to 10.

15. The display device according to claim 14, characterized in that, include: At least two of the aforementioned display panels; At least two of the display panels are joined together to form the display device.

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