Fabrication method of ultra-thin glass substrate, ultra-thin glass substrate and display device

Abstract

The present disclosure relates to a method for manufacturing an ultra-thin glass substrate, comprising: providing a large glass plate including a plurality of glass substrates to be cut, wherein the glass substrate to be cut includes a bendable region and non-bendable regions located on both sides of the bendable region along a first direction; performing slit processing along the edges of the bendable region of each glass substrate to be cut to form two opposite cutting slits; performing double-sided thinning on the large glass plate and performing edge etching treatment on the edges of the bendable region; performing laser cutting on the edges of the non-bendable regions of each glass substrate to be cut to obtain a glass substrate; performing chemical tempering on the cut glass substrate; and performing micro-etching treatment on the surface of the chemically tempered glass substrate. The present disclosure also relates to an ultra-thin glass substrate and a display device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of display product manufacturing, and particularly relates to a manufacturing method of an ultra-thin glass substrate, an ultra-thin glass substrate, and a display device. Background Art

[0002] The production and processing process of the ultra-thin glass monomer used for the folding smartphone cover plate is relatively cumbersome, and the yield of each process is relatively low, which directly leads to its high cost. The processing technology of the ultra-thin glass device in the related art includes the following processes: glass slab thinning → laser cutting → dispensing → laminating → edge treatment → debinding → dicing → chemical tempering → surface etching optimization and ultrasonic cleaning.

[0003] The most time-consuming process among all processes is the edge treatment process. The purpose of edge treatment is to cut out the sample size and optimize the edge of the sample with edge burrs after cutting. The existing edge treatment process flow: dispensing → laminating → curing → edge etching → debinding → dicing. Generally speaking, the existing edge treatment process has the following risk points:

[0004] 1. The glue used for laminating needs to have extremely strong acid resistance, and it needs to be sprayed / soaked in the thinning solution for several hours without loss of viscosity. The acid itself has strong corrosiveness to the human body, and the harm to personnel during the dispensing operation is relatively large; and the dispensing process involves a large number of parameters: the order, trajectory, volume, position, etc. of the acid-resistant glue flowing out. Each factor affects each other, and it is generally not easy to control. If any parameter changes slightly, it will have a great impact on the subsequent process. It can be said that a tiny mistake will lead to a huge error.

[0005] 2. Due to process limitations, after dispensing, there is more or less residual acid-resistant glue on the surfaces of the upper and lower glass sheets. After cutting the edge by CNC (computer numerical control) technology, some glue will still flow from the surface to the end face, resulting in some positions being blocked by the acid-resistant glue during the chemical etching process and thus unable to be etched sufficiently, resulting in appearance defects such as uneven edges. The existing proportion of such defects is about 2.3%.

[0006] 3. Since the thickness of the glass sample used for edge treatment is only 30 - 100um, the CNC process has extremely high requirements for equipment accuracy. Process parameters such as feed speed, air pressure, down-cut pressure, tool wheel angle, cutting fluid concentration, etc. have a great impact on the edge morphology. If there is a slight fluctuation, the ultra-thin glass edge is extremely prone to appearance defects such as chipping and corner breakage. The existing proportion of such defects is about 4.5%.

[0007] 4. During the edge chemical etching process, due to the decrease in the adhesion of some glue in a strong acid environment, some acid solution seeps into the surface of the ultra-thin glass, causing the surface of the ultra-thin glass to be etched by the acid, resulting in an increase in thickness non-uniformity and thus appearance defects. The proportion of such defects is about 4.8%.

[0008] 5. The slicing process involves anti - acid glue dissolution and the separation of the ultra - thin glass from the glue. For anti - acid glue dissolution, the sample after edge etching needs to be placed in a UV environment with ultra - high illuminance. After the glue fails, the sample still needs to be soaked in constant - temperature hot water for several hours before separation. Since the above processes all involve operations on ultra - thin glass, the equipment accuracy cannot be achieved, and the above actions cannot be completed by a robotic arm. Currently, actions such as glue dissolution and separation are all manually operated by personnel, and the glass is not tempered, with relatively poor absolute strength. Glass fragments are extremely likely to be caused during the operation process, and the fragment loss ratio during the slicing process is 18.6%. Summary of the Invention

[0009] In order to solve the above - mentioned technical problems, the present disclosure provides a method for manufacturing an ultra - thin glass substrate, an ultra - thin glass substrate, and a display device, which solve the problems of cumbersome manufacturing processes and low yield in the edge treatment process of ultra - thin glass products.

[0010] To achieve the above object, the technical solution adopted in the embodiments of the present disclosure is: A method for manufacturing an ultra - thin glass substrate, including:

[0011] Providing a large - size glass including a plurality of glass substrates to be cut, wherein the glass substrates to be cut include a bendable region and non - bendable regions located on both sides of the bendable region along a first direction;

[0012] Performing slit processing along the edges of the bendable regions of each glass substrate to be cut to form two opposite cutting slits;

[0013] Performing double - sided thinning on the large - size glass and performing edge etching on the edges of the bendable regions;

[0014] Performing laser cutting on the edges of the non - bendable regions of each glass substrate to be cut to obtain glass substrates;

[0015] Performing chemical tempering on the cut - out glass substrates;

[0016] Performing micro - etching on the surfaces of the chemically tempered glass substrates.

[0017] Optionally, in the first direction, the length of the bendable region is the distance between the stress starting point and the stress ending point when the glass substrate to be cut is bent.

[0018] Optionally, in the step of performing slits along the edges of the bendable regions of each glass substrate to be cut to form two opposite cutting slits, the length of the cutting slits in the first direction is greater than or equal to the length of the bendable region in the first direction.

[0019] Optionally, both ends of each cutting slit extend 8 - 12 mm into the corresponding non - bendable regions respectively.

[0020] Optionally, in the step of forming two opposite cutting slits by making slits along the edges of the bendable regions of each glass to be cut, laser slitting is performed on each edge of the bendable region to form the cutting slit formed by a plurality of sub-slits extending along the first direction and distributed at intervals.

[0021] Optionally, in the step of forming two opposite cutting slits by making slits along the edges of the bendable regions of each glass to be cut, the laser parameters include: a wavelength of 532 - 1064 nm, a power of 30 - 60 W, and a pulse spacing of 1 - 6 μm.

[0022] Optionally, in the step of performing double-sided thinning on the large-sized glass and performing edge etching treatment on the edges of the bendable regions, the large-sized glass is thinned integrally by spraying an acidic solution, and the plurality of sub-slits in each cutting slit are made to communicate.

[0023] Optionally, in the step of performing double-sided thinning on the large-sized glass and performing edge etching treatment on the edges of the bendable regions, a fillet is formed at the angle between the surface and the side surface of the bendable region.

[0024] Optionally, in the step of performing double-sided thinning on the large-sized glass and performing edge etching treatment on the edges of the bendable regions, the acidic solution is hydrofluoric acid.

[0025] Optionally, the chemical tempering is a process of performing sodium-potassium ion exchange under high-temperature conditions, and the extrusion effect generated by the volume difference between the two is used to improve the surface strength and flexibility of the glass.

[0026] Optionally, a micro-etching treatment is performed on the surface of the glass substrate after chemical tempering, specifically, a surface micro-etching treatment is performed on the tempered glass substrate to passivate the micro-cracks on the surface and edges of the glass substrate.

[0027] The embodiments of the present disclosure also provide an ultra-thin glass substrate manufactured by using the manufacturing method of the ultra-thin glass substrate described above.

[0028] The embodiments of the present disclosure also provide a display device including a cover plate made of the ultra-thin glass substrate described above.

[0029] The beneficial effects of the present disclosure are: simplifying the process flow of ultra-thin glass products, reducing costs, and improving the yield. Description of the Drawings

[0030] Figure 1 Schematic diagram showing the treatment effect of the edge of the ultra-thin glass Figure 1 ;

[0031] Figure 2 Schematic diagram showing the treatment effect of the edge of the ultra-thin glass Figure 2 ;

[0032] Figure 3 Schematic diagram showing the state after cutting on a large plate glass;

[0033] Figure 4 Indicates Figure 3 Cross-sectional schematic diagram;

[0034] Figure 5 Schematic diagram showing the large plate glass after thinning;

[0035] Figure 6 Indicates Figure 5 Cross-sectional schematic diagram;

[0036] Figure 7 Schematic diagram showing the state of cutting out a glass substrate on a large plate glass;

[0037] Figure 8 Schematic diagram of the glass substrate structure;

[0038] Figure 9 Indicates Figure 8 Cross-sectional schematic diagram in the A-A direction;

[0039] Figure 10 Indicates Figure 8 Cross-sectional schematic diagram in the B-B direction;

[0040] Figure 11 Schematic diagram for comparing impact strength tests;

[0041] Figure 12 Schematic diagram of the manufacturing method process in the embodiments of the present disclosure. Detailed implementation manners

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure fall within the scope of protection of the present disclosure.

[0043] In the description of the present disclosure, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present disclosure. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0044] The reason for the long edge treatment process in the related process of the ultra-thin glass product is to process the UTG edge into the effect as Figure 1 shown. Among them, experimental data shows that the size of the c value in the figure plays a crucial role in the impact and bending strength of the sample. As Figure 2 shown is the ideal c value state: if the c value is too large, the stress at the junction of the end face and the plane in the illustrated direction is too large, and it is extremely easy to start cracking from this point during the ultimate bending test; if the c value is too small, stress concentration will also occur at the junction, which will not only affect the bending performance but also reduce the overall impact strength.

[0045] In order to achieve a reasonable c value for the UTG edge treatment while simplifying the process as much as possible, this embodiment provides a method for manufacturing an ultra-thin glass substrate, and proposes an effective process for simplifying the edge treatment process in the ultra-thin glass production process to increase the production yield of the process and reduce costs in response to the problems and potential risks in the above-mentioned edge treatment solution.

[0046] Refer to Figures 3 - 12 , specifically, a method for manufacturing an ultra-thin glass substrate 2 in this embodiment includes:

[0047] Providing a large plate glass including a plurality of glass substrates 2 to be cut, where the glass substrates to be cut include a bendable area 21 and non-bendable areas 22 located on both sides of the bendable area 21 in a first direction;

[0048] Performing slit treatment along the edge of the bendable area 21 of each glass substrate to be cut to form two opposite cutting slits (refer to Figure 3 and Figure 4 , Figure 4 is Figure 3 the cross-sectional schematic diagram of the bendable area of the large plate glass in

[0049] Performing double-sided thinning on the large plate glass, and performing edge etching treatment on the edge of the bendable area 21 (refer to Figure 5 and Figure 6 , Figure 6 is Figure 5 the cross-sectional schematic diagram of the bendable area in

[0050] Performing laser cutting on the edge of the non-bendable area 22 of each glass substrate 2 to be cut to obtain the glass substrate 2 (refer to Figure 7 );

[0051] Performing chemical tempering on the cut glass substrate 2;

[0052] Performing micro-etching treatment on the surface of the chemically tempered glass substrate 2.

[0053] In this embodiment, by simplifying the processing process of UTG (ultra-thin glass), especially the edge treatment process, replacing processes such as dispensing and laminating with laser slitting and acid etching treatment processes, the edge of the bendable area 21 is etched once during the thinning of the large panel, and etched again during the etching treatment process after chemical strengthening. After two etchings, the corners of the bendable area 21 can obtain smooth corners, maintaining better impact resistance and bending performance, and increasing the yield rate of the edge treatment process from 47.2% to 91.4%.

[0054] Adopting the above solution in this embodiment, on the one hand, the acid-proof glue is omitted, reducing costs, and on the other hand, the process steps are effectively reduced, the working hours are shortened, and the first-pass yield is improved.

[0055] In addition, compared with the solution of thinning the raw material with a thickness of 70um in the process including processes such as dispensing and laminating, this embodiment can use a thicker and lower-cost raw material (the lower the thickness of the raw material, the higher the requirements for the forming process. Therefore, when the thickness of the raw material is below 400um, the price increases sharply with the decrease in thickness. For example, while ensuring performance, the prices of relatively thick glasses such as 145um, 175um, 200um, 330um, 400um, etc. are lower than the price of the raw material with a thickness of 70um). Using a thicker raw material in this embodiment can make the edge etching amount of the bendable area larger during the etching process after slitting (that is, the steps of double-sided thinning of the large panel glass and edge etching treatment of the edge of the bendable area), so that the edge of the bendable area is more rounded and the bending strength is improved. At the same time, a thicker raw material can also be used to be thinned to 170 - 190um in one step and then slit (that is, the step of slitting along the edge of the bendable area 21 of each glass to be cut to form two opposite cutting slits). Through the introduction of thick glass raw materials, there is still room for further cost reduction in this embodiment.

[0056] Exemplarily, in the first direction, the length of the bendable area 21 is the distance between the stress starting point and the stress ending point when the glass substrate 2 to be cut is bent.

[0057] Exemplarily, in the step of slitting along the edge of the bendable area 21 of each glass to be cut to form two opposite cutting slits, the length of the cutting slit in the first direction is greater than or equal to the length of the bendable area 21 in the first direction.

[0058] Exemplarily, both ends of each cutting slit extend 8 - 12mm respectively towards the corresponding non-bendable area 22. For example, in one embodiment, both ends of each cutting slit extend 10mm respectively towards the corresponding non-bendable area 22, but it is not limited thereto.

[0059] ReferenceFigures 3 - 7 Exemplarily, in the step of forming two opposite cutting slits by making slits along the edges of the bendable regions 21 of each glass to be cut, laser slitting is performed on each edge of the bendable region 21 to form the cutting slit 3 formed by a plurality of sub-slits 31 extending in the first direction and distributed at intervals.

[0060] Figure 7 Figure 7

[0061] Reference Figure 3 and Figure 4 In the above step, the cutting slits are discontinuously arranged in the first direction (i.e., including a plurality of sub-slits), and in the thickness direction of the large sheet glass, the cutting slits penetrate the large sheet glass.

[0062] Exemplarily, in the step of forming two opposite cutting slits 3 by making slits along the edges of the bendable regions 21 of each glass substrate 2 to be cut, the laser parameters include: a wavelength of 532 - 1064 nm, a power of 30 - 60 W, and a pulse spacing of 1 - 6 μm. In one embodiment, the wavelength of the laser is 1064 nm, the power is 45 W, and the pulse spacing is 2 μm.

[0063] In one embodiment, the thickness of the large sheet glass 1 is 170 mm, but this is not limiting.

[0064] Reference Figure 4 Exemplarily, in the steps of performing double-sided thinning on the large sheet glass 1 and performing edge etching treatment on the edges of the bendable regions 21, the large sheet glass is thinned integrally by spraying an acidic solution, and the plurality of sub-slits 31 in each cutting slit 3 are made to communicate.

[0065] Taking a UTG product with a target plate thickness (the thickness of the cut glass substrate 2) of 30 μm as an example, when the thickness of the large sheet glass in the slitting process section is 170 - 190 μm, an ideal edge morphology can be achieved in the subsequent thinning and etching section. If the plate thickness is too thick, the etching amount is too large and the edge c value is too small; vice versa. In one embodiment, the large sheet glass is thinned on both sides, and the large sheet glass is thinned from 170 mm to 32 mm, but this is not limiting. At the same time, edge etching treatment is performed on the edges of the bendable regions 21. Figure 6 shows a cross-sectional schematic diagram of a glass substrate 2 to be cut on the large sheet glass, showing the state of the edge of the bendable region 21 of the glass substrate 2 after being etched.

[0066] Figure 6 is a cross-sectional schematic diagram when the glass substrate and the large sheet glass are not separated. Figure 9 is a cross-sectional schematic diagram of the bendable region of the glass substrate after being separated from the large sheet glass.

[0067] Exemplarily, in the steps of double-sided thinning of the large-panel glass and edge etching treatment of the edge of the bendable region 21, a fillet is formed at the angle between the surface and the side surface of the bendable region 21.

[0068] Exemplarily, in the steps of double-sided thinning of the large-panel glass and edge etching treatment of the edge of the bendable region 21, the acidic solution is hydrofluoric acid, but not limited thereto.

[0069] The main principle of large-panel thinning is that hydrofluoric acid reacts with silicon dioxide on the glass surface to generate fluosilicic acid to achieve the effect of glass thinning. In this step, hydrofluoric acid spraying is used, and an etching effect will also be generated at the cutting seam formed after the slitting treatment (i.e., the edge of the bendable region), so that a fillet is formed at the angle between the surface and the side surface of the bendable region, and there is no need to perform edge grinding and chamfering through the CNC precision carving technology, let alone processes such as dispensing and laminating.

[0070] It should be noted that in the direction perpendicular to the surface of the large-panel glass, for the part of the bendable region 21 that has been locally laser-treated (i.e., the cutting seam), the acid etching rate is relatively faster in the middle. After the thinning process, due to the existence of the etching rate difference, an edge morphology that meets the requirements can be obtained.

[0071] Exemplarily, the chemical tempering is a process of sodium-potassium ion exchange under high-temperature conditions, and the extrusion effect generated by the volume difference between the two is used to improve the surface strength and flexibility of the glass. In a specific embodiment, a plurality of cut glass substrates are positioned in an etching jig with a PVC material surface, and are collectively placed in a mixed solution of one of hydrofluoric acid, nitric acid, sulfuric acid, ammonium fluoride and water, and the etching rate is controlled at 0.5 - 1 μm / min, and the etching amount is 1 μm. An ultrasonic device is accompanied during the etching process to prevent fixture marks from appearing on the glass substrate, remove the glass sand remaining on the surface of the glass substrate after etching, ensure the thickness uniformity of the glass substrate, optimize the surface roughness of the glass substrate, and can effectively passivate the surface microcrack defects of the tempered glass substrate and improve the surface impact resistance of the glass substrate.

[0072] Exemplarily, micro-etching treatment is performed on the surface of the chemically tempered glass substrate 2, specifically, surface micro-etching treatment is performed on the tempered glass substrate 2 to passivate the microcracks on the surface and edges of the glass substrate and increase the strength of the glass substrate. After that, it can be obtained as a finished product after ultrasonic cleaning.

[0073] After etching, ensure that the thickness uniformity of the glass plate is controlled within 1 μm. By controlling the acid concentration, etching time, and acid temperature, the etching amount of the micro-etching surface is controlled within 1 - 4 μm. If the etching amount is too low, it is difficult to completely remove the surface defects of UTG. If the etching amount is too high, it will cause slight warping of the UTG product after tempering. At the same time, control the etching rate within 0.5 - 1 μm / min. If the etching rate is too low, the etching time will be too long and the production efficiency will be low. If the etching rate is too high, it is easy to cause phenomena such as edge serrations, edge defects, and UTG fractures.

[0074] The acid solution in this step can be hydrofluoric acid, but it is not limited thereto.

[0075] In the manufacturing method of the ultra-thin glass substrate 2 in this embodiment, the original long edge treatment process (dispensing + lamination + curing + CNC + edge etching + sheet separation) is replaced by acid etching edge treatment after laser slitting in the bendable area 21. The advantages brought by the reduction of the process are as follows:

[0076] 1. According to the statistics of actual production data, the yield comparison between the manufacturing method of ultra-thin glass including the edge treatment process of dispensing and lamination (the original process in Table 1) and the manufacturing method of the ultra-thin glass substrate in this embodiment is shown in Table 1:

[0077] Table 1. Edge treatment section and corresponding yield data of new and old schemes

[0078] Original process edge treatment process Yield rate Edge treatment process of this solution Yield rate Large - board dispensing 93％ Laser cutting seam 98％ Wire cutting 89％ Top - spray thinning 97％ CNC 96％ Laser slicing 96％ Edge etching 91％ Slicing 73％ Edge treatment T - through yield rate 53％ Edge treatment T - through yield rate 91％

[0079] It is not difficult to see from the table that the most significant benefit brought by the reduction of the process is the improvement of the yield, which increases the first-pass yield of the edge treatment section from 53% to 91%.

[0080] 2. The shortening of the process can greatly reduce the production man-hours. Similarly, comparing the man-hours of the manufacturing method of ultra-thin glass including the edge treatment process of dispensing and lamination (the original process in Table 1) and the manufacturing method of the ultra-thin glass substrate in this embodiment, the total time used for the entire section of a single Lot (batch, one batch can produce dozens of samples) in the original process is about 18 h. After the process is simplified, this embodiment only needs 12 h to complete the production of a single Lot.

[0081] 3. The laser cutting and top spray thinning processes used in this embodiment can share equipment and jigs with the original process, without the need to purchase new equipment.

[0082] As shown in Table 2 and Figure 11 The following shows the module comparison data. The data are all taken from 3 samples, and the average value of 3 points measured in the same area of each sample is used.

[0083] Table 2. Corresponding test data of the original process (i.e., the ultra-thin glass manufacturing process including edge treatment processes such as dispensing and lamination) and the low-cost process described in this solution

[0084]

[0085] Figure 11 Among them, 100 represents the impact strength corresponding to the pen-down test, 200 represents the impact strength corresponding to the ball-drop test, 300 represents the impact strength corresponding to the pointed extrusion test, a represents the non-bendable area 22, b represents the bendable area 21, 10 represents the impact strength corresponding to the manufacturing process of the ultra-thin glass product through the edge treatment process including dispensing, laminating, etc., and 20 represents the impact strength of the ultra-thin glass product manufactured by the manufacturing method of the ultra-thin glass substrate 2 in this embodiment.

[0086] Based on the above data, the conclusion of the existing project is obtained: Based on the same module stacking, the UTG products processed by the manufacturing method of the ultra-thin glass substrate 2 in this embodiment have no difference in impact strength and bending strength from the mass production process.

[0087] It should be noted that, as Figure 8 shown is the three-dimensional schematic diagram of the glass substrate 2, Figure 9 which represents the schematic cross-sectional view in the A-A direction of the bendable area 21 (the area between the two dashed lines), Figure 10 and represents the schematic cross-sectional view in the B-B direction of the non-bendable area 22. Among them, the edge of the cross-section in the A-A direction of the bendable area 21 is a smooth transition fillet, and the edge at the cross-section in the B-B direction of the non-bendable area 22 is the remaining edge right angle after single laser cutting. The advantage of the fillet in the bendable area 21 is that stress concentration is not easily generated during bending, and the bending strength is higher.

[0088] It should be noted that the glass substrate 2 manufactured by the manufacturing method of this embodiment is applied to the module stacking structure, and the edge of the bendable area 21 of the glass substrate 2 has a very smooth transition, and the corresponding module bending and impact capabilities can be benchmarked against the existing conventional processes.

[0089] This embodiment also provides an ultra-thin glass substrate, which is manufactured by the manufacturing method of the above ultra-thin glass substrate.

[0090] This embodiment also provides a display device, including a cover plate made of the above ultra-thin glass substrate.

[0091] It can be understood that the above embodiments are only exemplary embodiments adopted to illustrate the principles of the present disclosure. However, the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also regarded as the protection scope of the present disclosure.

Claims

1. A manufacturing method of an ultra-thin glass substrate, wherein, Including: Providing a large sheet of glass including a plurality of glass substrates to be cut, wherein the glass substrates to be cut include a bendable region and non-bendable regions located on both sides of the bendable region along a first direction; Performing slit processing along the edges of the bendable regions of each glass substrate to be cut to form two opposite cutting slits; Performing double-sided thinning on the large sheet of glass and performing edge etching processing on the edges of the bendable regions; Performing laser cutting on the edges of the non-bendable regions of each glass substrate to be cut to obtain glass substrates; Performing chemical tempering on the cut glass substrates; Performing micro-etching processing on the surfaces of the chemically tempered glass substrates.

2. The manufacturing method of the ultra-thin glass substrate according to claim 1, wherein, In the first direction, the length of the bendable region is the distance between the stress starting point and the stress ending point when the glass substrate to be cut is bent.

3. The manufacturing method of the ultra-thin glass substrate according to claim 1, wherein, In the step of performing slit processing along the edges of the bendable regions of each glass substrate to be cut to form two opposite cutting slits, the length of the cutting slits in the first direction is greater than or equal to the length of the bendable region in the first direction.

4. The manufacturing method of the ultra-thin glass substrate according to claim 3, wherein, Both ends of each cutting slit extend 8 - 12 mm respectively towards the corresponding non-bendable regions.

5. The manufacturing method of the ultra-thin glass substrate according to claim 1, wherein, In the step of performing slit processing along the edges of the bendable regions of each glass substrate to be cut to form two opposite cutting slits, laser slit cutting is performed on each edge of the bendable region to form the cutting slits formed by a plurality of sub-slits extending along the first direction and distributed at intervals.

6. The manufacturing method of the ultra-thin glass substrate according to claim 5, wherein, In the step of performing slit processing along the edges of the bendable regions of each glass substrate to be cut to form two opposite cutting slits, the laser parameters include: a wavelength of 532 - 1064 nm, a power of 30 - 60 W, and a pulse spacing of 1 - 6 μm.

7. The manufacturing method of the ultra-thin glass substrate according to claim 5, wherein, In the step of performing double-sided thinning on the large sheet of glass and performing edge etching processing on the edges of the bendable regions, the large sheet of glass is thinned as a whole by spraying an acidic solution, and the plurality of sub-slits in each cutting slit are made to communicate.

8. The manufacturing method of the ultra-thin glass substrate according to claim 7, wherein, In the step of performing double-sided thinning on the large sheet of glass and performing edge etching processing on the edges of the bendable regions, the angle between the surface and the side surface of the bendable region forms a rounded corner.

9. The manufacturing method of the ultra-thin glass substrate according to claim 7, wherein, In the step of performing double-sided thinning on the large sheet of glass and performing edge etching processing on the edges of the bendable regions, the acidic solution is hydrofluoric acid.

10. The manufacturing method of the ultra-thin glass substrate according to claim 1, wherein, The chemical tempering is a process of performing sodium-potassium ion exchange under high-temperature conditions, and the extrusion effect generated by the volume difference between the two is used to improve the surface strength and flexibility of the glass.

11. The manufacturing method of the ultra-thin glass substrate according to claim 1, wherein, Performing micro-etching processing on the surfaces of the chemically tempered glass substrates, specifically performing surface micro-etching processing on the tempered glass substrates to passivate the micro-cracks on the surfaces and edges of the glass substrates.

12. An ultra-thin glass substrate, wherein, Manufactured by using the manufacturing method of the ultra-thin glass substrate according to any one of claims 1 - 11.

13. A display device, wherein, Including a cover plate made of the ultra-thin glass substrate according to claim 12.

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