terminal equipment

Abstract

A terminal device includes a decorative element, a lens module, and a circuit board. The decorative element is located on the side of the lens module facing away from the circuit board. The lens module and the circuit board are connected. The circuit board includes a solder resist layer and a circuit board substrate, with the solder resist layer located on the surface of the circuit board substrate. The circuit board includes an opening penetrating the solder resist layer, and at least a portion of the lens module is accommodated in the opening. The portion of the lens module accommodated in the opening is insulated from the surface of the circuit board substrate. This reduces the mounting height of the lens module and the circuit board without affecting their performance.

Description

[0001] Cross-references to related applications

[0002] This application is a divisional application of application number 202280001151.1 filed on January 18, 2022, entitled "Terminal Equipment," and claims priority to patent application number 202121471478.4 filed with the Chinese Patent Office on June 30, 2021, entitled "Terminal Equipment," the contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of terminal technology, and in particular to a terminal device. Background Technology

[0004] Small size and high performance are important indicators that users currently seek in terminal devices. However, the size of some components has a significant impact on their performance, leading to a certain contradiction between small size and high performance in terminal devices. Summary of the Invention

[0005] In view of this, it is necessary to provide a terminal device that reduces the installation height without compromising performance.

[0006] A terminal device includes components and a circuit board. The circuit board includes a circuit substrate and a solder resist layer located on the surface of the circuit substrate. The circuit board includes a first opening recessed on the surface of the solder resist layer away from the circuit substrate, and at least a portion of the component is accommodated in the first opening.

[0007] In the above design, at least a portion of the component is housed within the first opening, which reduces the mounting height between the component and the circuit board without affecting the performance of the component and the circuit board. Furthermore, since the first opening does not penetrate the solder mask layer, there is no need to consider whether the surface of the component in direct contact with the solder mask layer is conductive, which could lead to short circuits or signal loss on the circuit board due to electrical connection. This expands the applicable scenarios for the component type; at the same time, the solder mask layer can still maintain its original function.

[0008] In one possible design, the portion of the component housed in the first opening contacts the solder mask.

[0009] The above design minimizes the mounting height of components and circuit boards.

[0010] In one possible design, the portion of the component housed in the first opening is spaced apart from the solder mask.

[0011] In the above design, while reducing the mounting height of the component on the circuit board, it is possible to prevent the component from rigidly contacting the circuit board under external force, thus affecting the component's performance.

[0012] In one possible design, the terminal device also includes a connector that connects elements to the non-adjacent surfaces of the circuit board.

[0013] In the above design, the components are spaced apart from the circuit board to prevent rigid contact between the components and the circuit board when external forces are applied, which would affect the performance of the components.

[0014] In one possible design, the component is one of the following: lens module, SIM card holder, screw washer, and nut.

[0015] The above design can be used in a variety of scenarios where a reduction in installation height is required.

[0016] In one possible design, the element includes a body and a protrusion connected to the body, the protrusion being received in a first opening and the body being located outside the first opening.

[0017] In the above design, the protrusion is housed in the first opening, reducing the mounting height of the components and the circuit board, and the mounting height will not be increased due to the presence of the protrusion.

[0018] In one possible design, the element includes a body and a protrusion connected to the body; the first opening includes a first sub-opening and a second sub-opening, which communicate with each other; the protrusion is received in the first sub-opening, and at least a portion of the body is received in the second sub-opening.

[0019] In the above design, the structure of the first opening can be designed according to the shape of the component, thereby further reducing the mounting height of the component and the circuit board.

[0020] In one possible design, the component is a lens module, and the protrusion has a sub-component, which is at least one of a sensor, a lens module, a voice coil motor, and a Hall effect device.

[0021] A terminal device includes components and a circuit board; the circuit board includes a circuit substrate and a solder resist layer; the circuit substrate includes a dielectric layer and a circuit layer stacked with the dielectric layer, and the solder resist layer is located on the surface of the circuit substrate; wherein the circuit board includes a second opening that penetrates the solder resist layer but is not disposed on the circuit substrate, and at least a portion of the component is accommodated in the second opening.

[0022] In the above design, the second opening penetrates the solder mask layer, which can further increase the depth of the component housed in the circuit board, thereby further reducing the mounting height of the component and the circuit board.

[0023] In one possible design, the portion of the component housed in the second opening contacts the circuit board.

[0024] The above design minimizes the mounting height of components and circuit boards.

[0025] In one possible design, the portion of the component housed in the second opening is spaced apart from the circuit board.

[0026] In the above design, while reducing the mounting height of the component on the circuit board, it is possible to prevent the component from rigidly contacting the circuit board under external force, thus affecting the component's performance.

[0027] In one possible design, the terminal device also includes a connector that connects elements to the non-adjacent surfaces of the circuit board.

[0028] In the above design, the components are spaced apart from the circuit board to prevent rigid contact between the components and the circuit board when external forces are applied, which would affect the performance of the components.

[0029] In one possible design, the component is one of the following: lens module, SIM card holder, screw washer, and nut.

[0030] The above design can be used in a variety of scenarios where a reduction in installation height is required.

[0031] In one possible design, the element includes a body and a protrusion connected to the body, the protrusion being received in a second opening, and the body being located outside the second opening.

[0032] In the above design, the protrusion is housed in the second opening, reducing the mounting height of the components and the circuit board, and the mounting height will not be increased due to the presence of the protrusion.

[0033] In one possible design, the element includes a body and a protrusion connected to the body, the second opening includes a first sub-opening and a second sub-opening in communication with each other; the protrusion is received in the first sub-opening, and at least a portion of the body is received in the second sub-opening.

[0034] In the above design, the structure of the second opening can be designed according to the shape of the component, thereby further reducing the mounting height of the component and the circuit board.

[0035] In one possible design, the component is a lens module, and the protrusion has a sub-component, which is at least one of a sensor, a lens module, a voice coil motor, and a Hall effect device.

[0036] A terminal device includes components and a circuit board. The circuit board includes a circuit substrate and a solder resist layer. The circuit substrate includes a dielectric layer and a circuit layer stacked with the dielectric layer. The number of circuit layers is greater than two. The solder resist layer is located on the surface of the circuit substrate. The circuit board includes a third opening that penetrates the solder resist layer and the circuit substrate. The circuit board has at least one circuit layer in the projection area of ​​the third opening. At least a portion of the components is accommodated in the third opening.

[0037] In the above design, the third opening penetrates the solder mask layer and part of the circuit layer, which can further increase the depth of the component housed in the circuit board, thereby further reducing the mounting height of the component and the circuit board. In addition, the third opening does not penetrate all the circuit layers, so it will not affect the routing of the circuit layer on the side of the circuit board away from the component, and therefore will not affect the position of other components that need to be electrically connected on the circuit layer on the side of the circuit board away from the component.

[0038] In one possible design, the dielectric layer is exposed to the third opening, and the portion of the element housed in the third opening contacts the dielectric layer.

[0039] The above design minimizes the mounting height of components and circuit boards.

[0040] In one possible design, the dielectric layer is exposed to the third opening, and the portion of the element housed in the third opening is spaced apart from the dielectric layer.

[0041] In the above design, while reducing the mounting height of the component on the circuit board, it is possible to prevent the component from rigidly contacting the circuit board under external force, thus affecting the component's performance.

[0042] In one possible design, the circuit layer is exposed to the third opening, and the portion of the component housed in the third opening contacts the circuit layer.

[0043] The above design minimizes the mounting height of components and circuit boards.

[0044] In one possible design, the circuit layer is exposed through the third opening, and the portion of the component housed in the third opening is spaced apart from the circuit layer.

[0045] In the above design, while reducing the mounting height of the component on the circuit board, it is possible to prevent the component from rigidly contacting the circuit board under external force, thus affecting the component's performance.

[0046] In one possible design, the terminal device also includes a connector that connects elements to the non-adjacent surfaces of the circuit board.

[0047] In the above design, the components are spaced apart from the circuit board to prevent rigid contact between the components and the circuit board when external forces are applied, which would affect the performance of the components.

[0048] In one possible design, the component is one of the following: lens module, SIM card holder, screw washer, and nut.

[0049] The above design can be used in a variety of scenarios where a reduction in installation height is required.

[0050] In one possible design, the element includes a body and a protrusion connected to the body, the protrusion being accommodated in a third opening, and the body being located outside the third opening.

[0051] In the above design, the protrusion is housed in the third opening, reducing the mounting height of components and circuit boards, and the mounting height will not be increased due to the presence of the protrusion.

[0052] In one possible design, the element includes a body and a protrusion connected to the body, and the third opening includes a first sub-opening and a second sub-opening that are in communication with each other; the protrusion is received in the first sub-opening, and at least a portion of the body is received in the second sub-opening.

[0053] In the above design, a third opening structure can be designed according to the shape of the component, thereby further reducing the mounting height of the component and the circuit board.

[0054] In one possible design, the component is a lens module, and the protrusion has a sub-component, which is at least one of a sensor, a lens module, a voice coil motor, and a Hall effect device.

[0055] A terminal device includes a component and a circuit board, wherein the circuit board includes a fourth opening that is recessed inward on the surface of the circuit board facing the component, and at least a portion of the component is disposed corresponding to the fourth opening.

[0056] In the above design, the safety distance that needs to be reserved between the components and the circuit board is compensated for, thereby reducing the installation height of the components and the circuit board.

[0057] In one possible design, the area corresponding to the four openings of the element is provided with sub-elements, which are Hall elements.

[0058] In the above design, since the Hall element is a component that is sensitive to external forces, a certain safety distance needs to be reserved between the component and the circuit board. By setting a fourth opening, at least part of the safety distance can be compensated, thereby reducing the installation height of the component and the circuit board.

[0059] In one possible design, the circuit board includes a circuit board substrate and a solder resist layer located on the surface of the circuit board substrate; the fourth opening is recessed on the surface of the solder resist layer opposite to the circuit board substrate.

[0060] In the above design, the safety distance that needs to be reserved between the components and the circuit board is compensated for, thereby reducing the installation height of the components and the circuit board.

[0061] In one possible design, the circuit board includes a circuit board substrate and a solder resist layer located on the surface of the circuit board substrate; the fourth opening penetrates the solder resist layer but is not located on the circuit board substrate.

[0062] In the above design, the safety distance that needs to be reserved between the components and the circuit board is further compensated, thereby reducing the installation height of the components and the circuit board.

[0063] In one possible design, the circuit board includes a circuit substrate and a solder resist layer located on the surface of the circuit substrate. The circuit substrate includes a dielectric layer and circuit layers stacked with the dielectric layer, and the number of circuit layers is greater than two. The fourth opening penetrates the solder resist layer and a portion of the circuit substrate, and the circuit board has at least one circuit layer within the projection area of ​​the fourth opening.

[0064] The above design further compensates for the safety distance that needs to be reserved between components and circuit boards, thereby reducing the installation height of components and circuit boards. Attached Figure Description

[0065] Figure 1 This is a partial structural diagram of a terminal device provided in an embodiment of this application.

[0066] Figure 2 This is a partial structural diagram of a terminal device with a first opening on a circuit board, provided in the first embodiment of this application.

[0067] Figure 3 This is a partial structural diagram of a terminal device with protruding elements provided in the first embodiment of this application.

[0068] Figure 4 This is a partial structural diagram of a terminal device with a stepped first opening, as provided in the first embodiment of this application.

[0069] Figure 5 This is a partial structural schematic diagram of a terminal device with a second opening on a circuit board, provided for the second embodiment of this application.

[0070] Figure 6 A partial structural schematic diagram of a terminal device with a third opening on a circuit board provided in the third embodiment of this application.

[0071] Figure 7 This is a partial structural diagram of a terminal device with a stepped third opening, as provided in the third embodiment of this application.

[0072] Figure 8 This is a partial structural schematic diagram of a terminal device with a fourth opening on a circuit board, provided in the fourth embodiment of this application.

[0073] Explanation of main component symbols

[0074] terminal equipment 100, 100a, 100b, 100c, 100' element 10、10’ Ontology 11 protrusion 13 Sub-component 131、131a circuit board 20、20’ Circuit board 21 Dielectric layer 212 Line layer 214 solder resist layer 23 connector 25 decorative items 30、30’ convex part 31’ First opening 40 The first son spoke 41、41a The second son spoke. 43、43a Second opening 50 Third opening 60 Fourth opening 70 width W1, W2

[0075] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0076] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.

[0077] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0078] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0079] This application provides a terminal device in some embodiments, the terminal device including components and a circuit board. The circuit board includes a circuit substrate and a solder resist layer, the circuit substrate including a dielectric layer and a circuit layer stacked on top of the dielectric layer. Openings of different depths are made on the circuit board according to actual needs, at least a portion of the components are accommodated in the openings or disposed corresponding to the openings.

[0080] In the above design, the mounting height of the components and the circuit board is reduced without affecting the performance of the components and the circuit board.

[0081] In this application, the installation height refers to the height of the component and the circuit board after installation along the stacking direction of the component and the circuit board. In some embodiments, it includes the distance between the component and the circuit board.

[0082] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0083] Please see Figure 1 One embodiment of this application provides a terminal device 100', such as a mobile phone or tablet computer, which is trending towards miniaturization. The inventors of this application have discovered that the circuit board 20', the components 10' mounted on the surface of the circuit board 20' (such as a lens module), and the decorative parts 30' covering the components 10' are among the important factors affecting the mounting height of the terminal device 100'. Because the lens module is relatively large, a protrusion 31' is designed on the decorative part 30' of the actual terminal device 100'. For aesthetic reasons, the size of the protrusion 31' should be as small as possible, which contradicts the performance requirements of the lens module.

[0084] First Embodiment

[0085] Please see Figures 2 to 4 This application provides a terminal device 100, which includes a component 10 and a circuit board 20, with at least a portion of the component 10 embedded in the circuit board 20. The terminal device 100 is a product having at least a circuit board 20 and a component 10, with the component 10 disposed on the circuit board 20. The terminal device 100 includes, but is not limited to, mobile phones, tablet computers, cameras, camcorders, and monitors.

[0086] Component 10 can be electrically connected to circuit board 20, such as a lens module or a SIM (Subscriber Identity Module) socket; or it can be insulated from circuit board 20, such as a screw washer or a nut (e.g., a surface-mount nut). Component 10 is insulated from adjacent surfaces of circuit board 20. It should be noted that when component 10 is electrically connected to circuit board 20, it can be in contact with circuit board 20, and can be electrically connected to other areas of circuit board 20 via wires (not shown).

[0087] The following description uses a mobile phone as an example, with terminal device 100 and lens module 10 as an example. Terminal device 100 includes component 10 and circuit board 20. Terminal device 100 may also include decorative element 30. At least a portion of component 10 is housed in circuit board 20, and decorative element 30 is located on the side of component 10 facing away from circuit board 20 and covers component 10. It is understood that, without conflict, the following features may be applied to other terminal devices 100 and other components.

[0088] The circuit board 20 can be one of a flexible board, a rigid board, or a rigid-flex board.

[0089] Please refer to it again. Figures 2 to 4 The circuit board 20 includes a circuit board 21 and a solder resist layer 23 located on the surface of the circuit board 21. The circuit board 21 includes a dielectric layer 212 and a circuit layer 214 stacked on the dielectric layer 212, with at least one surface of the circuit layer 214 exposed to the dielectric layer 212. The solder resist layer 23 covers the dielectric layer 212 and also covers the circuit layer 214 exposed to the dielectric layer 212; the solder resist layer 23 has the functions of insulation, enhancing aesthetics, and preventing the circuit layer 214 from short-circuiting, oxidizing, and corroding.

[0090] Circuit board 21 can be a single-layer circuit board (see [link]). Figure 2 It can also be a multilayer circuit board (see [link]). Figure 3 and Figure 4 The number of circuit layers 214 in a single-layer circuit board is one; the number of circuit layers 214 in a multi-layer circuit board is greater than or equal to two, and the multi-layer circuit layers 214 are spaced apart by dielectric layers 212 and electrically connected to each other.

[0091] In this embodiment, a first opening 40 is formed on the solder resist layer 23. The first opening 40 is located on the surface of the solder resist layer 23 facing away from the circuit board 21 and recessed towards the circuit board 21. The first opening 40 does not penetrate the solder resist layer 23. The first opening 40 can be formed by mechanical processing, causing the solder resist layer 23 to be recessed to form the first opening 40; or, in the area where the first opening 40 is located, no circuit layer 214 is provided. During the formation of the solder resist layer 23, the thickness of the solder resist layer 23 in the area where no circuit layer 214 is provided is less than the thickness of the surrounding solder resist layer 23 or the total thickness of the solder resist layer 23 and the circuit layer 214, so that the solder resist layer 23 in a certain area is recessed to form the first opening 40. The first opening 40 can be formed in an area on the outer surface of the circuit board 20 where there are no solder pads (not shown) for electrical connection, to prevent affecting the electrical connection between the circuit board 20 and other components.

[0092] At least a portion of component 10 may be disposed within the first opening 40. That is, in some embodiments, a portion of component 10 is accommodated within the first opening 40, while another portion protrudes from the circuit board 20; in other embodiments, the entire component 10 is accommodated within the first opening 40. By accommodating at least a portion of component 10 within the first opening 40, the mounting height of component 10 and circuit board 20 can be reduced, effectively decreasing their mounting height without affecting their respective performance. Furthermore, the protrusion of the decorative element 30 of the actual terminal device 100 is also reduced, improving the overall aesthetics of the terminal device 100.

[0093] The reduction in mounting height is related to the depth of the element 10 housed in the first opening 40. In some embodiments, the reduction in mounting height is 0.04 mm to 0.05 mm.

[0094] In this embodiment, when the first opening 40 does not penetrate the solder resist layer 23, since the solder resist layer 23 itself has an insulating function, the component 10 housed in the first opening 40 and the circuit board 21 are spaced apart by the solder resist layer 23 and will not be directly electrically connected to the circuit board 21. Therefore, in this embodiment, it is not necessary to consider whether the surface of the component 10 in direct contact with the solder resist layer 23 is conductive, which could lead to a short circuit or signal loss in the circuit board 20 due to electrical connection with the circuit board 21. That is, this embodiment improves the applicable scenarios for the component 10 type; in addition, since the first opening 40 does not penetrate the solder resist layer 23, the solder resist layer 23 in the area with the first opening 40 can still maintain its original function.

[0095] The portion of component 10 housed in the first opening 40 may be in contact with the solder resist layer 23 (see [link]). Figure 2 You can also set intervals (see [link]). Figure 3 and Figure 4 This means that a certain distance is reserved between component 10 and solder resist layer 23. In some embodiments, when external forces (e.g., impacts) have little or negligible impact on the performance of component 10, component 10 can contact the surface of solder resist layer 23 of circuit board 20 along the stacking direction of component 10 and circuit board 20 to minimize the mounting height between component 10 and circuit board 20. The contact surface between component 10 and solder resist layer 23 of circuit board 20 may also include other surfaces, such as the side surface of component 10. In some embodiments, when external forces have a significant impact on the performance of component 10, the solder resist layer 23 of component 10 and circuit board 20 is spaced apart, leaving a certain safety distance to avoid rigid contact between component 10 and circuit board 20. A connector 25 can be connected to the non-adjacent surfaces of component 10 and circuit board 20 (i.e., surfaces other than adjacent surfaces, such as the side surface of component 10). (See [link to relevant documentation]) Figure 3and Figure 4 The component 10 is supported to prevent it from directly contacting the circuit board 20. In some embodiments, when the external force has a significant impact on the performance of the component 10, the surface of the component 10 adjacent to the circuit board 20 is made of a cushioning material (e.g., an elastic material, not shown), in which case the component 10 may also directly contact the solder resist layer 23.

[0096] The portion of component 10 housed in the first opening 40 is spaced apart from the solder resist layer 23. Component 10 is connected to circuit board 20 via connector 25 mounted on a non-adjacent surface of component 10 to support component 10. Connector 25 serves to reduce impact and improve positioning accuracy. Connector 25 does not increase the mounting height between component 10 and circuit board 20. It is understood that connector 25 includes, but is not limited to, brackets, adhesives, etc., and is not limited to connecting component 10 and circuit board 20. For example, in some embodiments, component 10 can be adhered to decorative component 30 using adhesive.

[0097] In some embodiments, the element 10 includes a body 11 and a protrusion 13, the protrusion 13 being connected to the body 11 and protruding toward a first opening 40, the protrusion 13 being accommodated in the first opening 40.

[0098] Please see Figure 3 and Figure 4 In some embodiments, when component 10 is a lens module, the protrusion 13 has a sub-component 131. The presence of the sub-component 131 causes a thicker local area of ​​the lens module, such as a sensor, lens module, voice coil motor, Hall effect device, etc. The protrusion 13 is housed in the first opening 40, and the body 11 is located outside the first opening 40, thereby reducing the mounting height of component 10 and circuit board 20, and the mounting height will not be increased due to the presence of protrusion 13.

[0099] Please see Figure 4 In some embodiments, when element 10 includes protrusion 13, the shape of the first opening 40 may also be stepped.

[0100] Specifically, the first opening 40 may include a first sub-opening 41 and a second sub-opening 43, which are connected. Along the recessed direction perpendicular to the first opening 40, the depth of the first sub-opening 41 is greater than the depth of the second sub-opening 43, that is, the first sub-opening 41 is located on the side closer to the circuit board 21, and the second sub-opening 43 is located on the side farther from the circuit board 21. The width W1 of the first sub-opening 41 is smaller than the width W2 of the second sub-opening 43, so that the protrusion 13 can be accommodated in the first sub-opening 41 and at least a portion of the body 11 can be accommodated in the second sub-opening 43. The structure of the first opening 40 can be designed according to the shape of the component 10, thereby further reducing the mounting height of the component 10 and the circuit board 20.

[0101] Second Embodiment

[0102] Please see Figure 5 The second embodiment of this application provides a terminal device 100a, including a component 10 and a circuit board 20. The types of the component 10 and circuit board 20 in the second embodiment are largely the same as those in the first embodiment, with the main difference being that the circuit board 20 has a second opening 50. The second opening 50 penetrates the solder resist layer 23 but is not located on the circuit board 21; that is, the second opening 50 only penetrates the solder resist layer 23, and at least a portion of the component 10 is accommodated in the second opening 50. The fact that the second opening 50 penetrates the solder resist layer 23 further increases the depth of the component 10 accommodated in the circuit board 20, thereby further reducing the mounting height of the component 10 and the circuit board 20.

[0103] Since the second opening 50 penetrates the solder resist layer 23, the circuit board 21 is exposed to the second opening 50. The surface of the circuit board 21 exposed to the second opening 50 can be a dielectric layer 212 or a circuit layer 214, but it is necessary to ensure that the component 10 is insulated from the circuit layer 214 exposed to the second opening 50. This can be achieved by using an insulating material on the surface of the component 10, or by spacing the component 10 and the circuit layer 214 apart. Alternatively, the circuit layer 214 exposed to the second opening 50 can be formed into an "island," that is, not electrically connected to other circuit layers 214 to achieve an insulated connection between the component 10 and the circuit layer 214 exposed to the second opening 50. Preferably, the second opening 50 does not expose the circuit layer 214 to prevent the circuit layer 214 exposed to the second opening 50 from being oxidized or corroded.

[0104] The second opening 50 can be formed by machining or by omitting the solder resist layer 23 in certain areas. Specifically, during the fabrication of the circuit board 20, before forming the solder resist layer 23 on the surface of the circuit board 21, the area where the second opening 50 needs to be formed can be partially uncoated with the ink used to form the solder resist layer 23 on the screen, while the ink is coated in other areas. This forms the second opening 50 in a specific area without adding any additional processes or increasing production costs. In other words, the mounting height between the workpiece and the circuit board 20 can be reduced at a lower cost.

[0105] Understandably, in this embodiment, element 10 may also include body 11 and protrusion 13, and the installation method may be the same as in the first embodiment; the second opening 50 may also be stepped, which will not be described in detail here.

[0106] Third Embodiment

[0107] Please see Figure 6 and Figure 7 The third embodiment of this application provides a terminal device 100b, including a component 10 and a circuit board 20. The types of the component 10 and the circuit board 20 in the third embodiment are generally the same as those in the first embodiment, the main difference being that: a third opening 60 is provided on the circuit board 20, the third opening 60 penetrates the solder resist layer 23 and part of the circuit board 21, the surface of the dielectric layer 212 or the circuit layer 214 is exposed in the third opening 60, and at least a part of the component 10 is accommodated in the third opening 60.

[0108] In this embodiment, the surface of the dielectric layer 212 is exposed to the third opening 60. The circuit board 21 of the circuit board 20 is a multilayer circuit board. The third opening 60 penetrates the solder resist layer 23 and the circuit layer 214 to expose the dielectric layer 212. In some embodiments, the dielectric layer 212 of the same layer may only be partially penetrated, while the other part of the dielectric layer 212 is not penetrated, so that the dielectric layer 212 is exposed to the third opening 60. The components housed in the third opening 60 may be in contact with or spaced from the surface of the dielectric layer 212 exposed in the third opening 60. Since the dielectric layer 212 is made of an insulating material, the components 10 housed in the third opening 60 are the same as in the first embodiment, and it is not necessary to consider whether the surface of the component 10 in direct contact with the solder resist layer 23 is conductive, which could lead to a short circuit or signal loss in the circuit board 20 due to electrical connection with the circuit board 21. Preferably, the third opening 60 does not expose the circuit layer 214 to prevent the circuit layer 214 exposed to the third opening 60 from being oxidized or corroded.

[0109] In some embodiments, the surface of the circuit layer 214 is exposed to the third opening 60. The third opening 60 penetrates the solder resist layer 23, a portion of the circuit layer 214, and a portion of the dielectric layer 212 to expose the circuit layer 214. For example, the opening 60 penetrates the solder resist layer, a circuit layer, and a dielectric layer to expose the circuit lines. Components housed in the third opening 60 may be in contact with or spaced from the surface of the circuit layer 214 exposed in the third opening 60. Component 10 housed in the third opening 60 is insulated from the circuit layer 214 exposed in the third opening 60. This can be achieved by using an insulating material for the surface of component 10, or by spacing component 10 from the circuit layer 214. Alternatively, the circuit layer 214 exposed in the third opening 60 can be formed into an "island," i.e., not electrically connected to other circuit layers 214, to achieve insulated connection between component 10 and the circuit layer 214 exposed in the third opening 60. Preferably, the third opening 60 does not expose the circuit layer 214 to prevent oxidation or corrosion of the circuit layer 214 exposed in the third opening 60.

[0110] In some embodiments, the third opening 60 further penetrates the dielectric layer 212. The penetration depth of the third opening 60 must at least ensure that there is at least one circuit layer 214 in the projection area corresponding to the third opening 60 on the circuit board 20, that is, at least one circuit layer 214 is not penetrated by the third opening 60. The inventors of this application have found that when the third opening 60 penetrates all the circuit layers 214, it affects the routing of the circuit layer 214 on the side of the circuit board 20 away from the component 10, reducing the area of ​​the circuit layer 214; in addition, when other components (such as capacitors, inductors, chips, sensors, etc.) need to be electrically connected on the circuit layer 214 on the side of the circuit board 20 away from the component 10, these components 10 need to be moved to other positions, resulting in the need to rearrange the positions of the components 10 in the terminal device 100b, increasing costs.

[0111] Understandably, in this embodiment, the element 10 may also include a body 11 and a protrusion 13, and the installation method may be the same as in the first embodiment, which will not be described again here.

[0112] Please see Figure 7 The third opening 60 can also be stepped. The step of the third opening 60 can be the same as in the first or second embodiment, located on the solder resist layer 23, or it can be located on the circuit board 21. For example, the second sub-opening 43a penetrates the solder resist layer 23, and the first sub-opening 41a penetrates the solder resist layer 23, part of the dielectric layer 212, and part of the circuit layer 214. In other embodiments, the stepped shape can be set according to the shape of the component 10.

[0113] Fourth embodiment

[0114] Please see Figure 8The fourth embodiment of this application provides a terminal device 100c, including a component 10 and a circuit board 20. The type of the component 10 and the circuit board 20 in the fourth embodiment is generally the same as that in the first embodiment, the main difference being that: the circuit board 20 has a fourth opening 70, the fourth opening 70 is recessed inward on the surface facing the component 10, and at least a portion of the component 10 is disposed corresponding to the fourth opening 70.

[0115] The portion of element 10 corresponding to the fourth opening 70 is provided with a sub-element 131a. The sub-element 131a is a component that is sensitive to external forces, such as a Hall effect device. The area with the sub-element 131a is provided corresponding to the fourth opening 70, which can compensate for at least part of the safety distance that needs to be reserved between element 10 and circuit board 20, thereby reducing the installation height of element 10 and circuit board 20.

[0116] The depth of the fourth opening 70 can be as in the first embodiment, located on a portion of the solder resist layer 23; it can be as in the second embodiment, penetrating the solder resist layer 23 but not located on the circuit board 21; or it can be as in the third embodiment, penetrating both the solder resist layer 23 and a portion of the circuit board 21. Specific configuration methods can be found in the first, second, and third embodiments, and will not be repeated here.

[0117] In the above design, openings (such as the first opening, the second opening, the third opening, the fourth opening, etc.) are made on the circuit board, and a portion of the component is placed in the opening. This does not affect the performance of the component and the circuit board, and can reduce the mounting height of the component and the circuit board. Alternatively, when a portion of the component needs to have a sufficient safety distance between it and the circuit board, the opening corresponds to that portion of the component to make up for the safety distance. This can also reduce the mounting height of the component and the circuit board without affecting the performance of the component and the circuit board.

[0118] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A terminal device, characterized by comprising: The terminal device comprises a decoration piece, a lens module and a circuit board. The decoration piece is located on a side of the lens module away from the circuit board, and the decoration piece covers the lens module. The circuit board comprises a solder resist layer and a circuit substrate, and the solder resist layer is located on a surface of the circuit substrate. The circuit board comprises an opening, the opening penetrates the solder resist layer, and a surface of the circuit substrate exposed to the opening is a circuit layer. In a stacking direction of the lens module and the circuit board, a bottom surface of the part of the lens module accommodated in the opening is spaced apart from the circuit layer, and the bottom surface of the part of the lens module accommodated in the opening is insulated from the circuit layer.

2. The terminal device according to claim 1, characterized by The decoration piece comprises a convex part.

3. The terminal device according to claim 1, characterized by The lens module is insulated from an adjacent surface of the circuit board.

4. The terminal device of any one of claims 1 to 3, wherein, The terminal device further comprises a connecting piece, the connecting piece connects non-adjacent surfaces of the lens module and the circuit board.

5. The terminal device according to any one of claims 1 to 3, another part of the lens module protrudes from the circuit board.

6. The terminal device according to any one of claims 1 to 3, characterized by, The solder resist layer is ink.

7. The terminal device according to any one of claims 1 to 3, characterized by, The circuit substrate comprises a dielectric layer and a circuit layer, and the dielectric layer and the circuit layer are stacked.

8. The terminal device according to any one of claims 1 to 3, characterized by, The circuit substrate is a multilayer circuit substrate.

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