Tilt sensor

Abstract

The present application relates to an inclination sensor, which measures the inclination through an inclination sensing module, and the obtained measurement data is transmitted to a data acquisition module through a communication cable, and finally the data acquisition module transmits the measurement data to the outside world. Since the inclination sensing module and the data acquisition module are separated from each other, and the inclination sensing module adopts a single-point fixing method, it can effectively avoid the data acquisition module from being unevenly deformed due to abnormal temperature, and finally distorting the inclination sensing module, resulting in the measurement data of the inclination sensing module being inaccurate. The sensor can monitor the temperature of the inclination sensing module in real time to reduce the interference of temperature on the inclination sensing module and improve the inclination measurement accuracy.

Description

Technical Field

[0001] The present application relates to the technical field of engineering monitoring, and in particular to a tilt sensor. Background Art

[0002] Inclinometers are used for long-term measurement of the inclination changes of hydraulic structures such as concrete dams, panel dams, earth-rock dams, etc. They are also suitable for the inclination measurement of industrial and civil buildings, roads, bridges, tunnels, roadbeds, civil engineering foundation pits, etc., and can realize the automation of inclination measurement.

[0003] Traditional inclinometers generally fix the four corners of the inclination measurement circuit board in the inclinometer at specified positions, and the inclination sensor chip is directly soldered on the inclination circuit board. Once the inclination measurement circuit board is unevenly deformed due to heat, the inclination sensor chip will be distorted, thereby affecting the monitoring data of the inclination sensor chip. In addition, since the inclination sensor chip lacks temperature monitoring and temperature compensation functions, it is difficult to sense and perform temperature compensation for changes in ambient temperature, so the ambient temperature will have a greater impact on the measurement accuracy of the inclinometer. Summary of the invention

[0004] Based on this, it is necessary to provide a tilt sensor to address the problem that once the tilt measurement circuit board is unevenly deformed due to heat, the tilt sensor chip will be distorted, thereby affecting the monitoring data of the tilt sensor chip. Moreover, since the tilt sensor chip lacks temperature monitoring and temperature compensation functions, it is difficult to sense and perform temperature compensation for changes in ambient temperature, so the ambient temperature will have a greater impact on the measurement accuracy of the inclinometer.

[0005] The present application provides a tilt sensor, comprising:

[0006] A tilt sensing module, a data acquisition module and a communication cable, wherein the tilt sensing module includes a tilt sensing chip and a temperature sensing chip, the tilt sensing module is fixedly connected to the top surface of the inner wall of the tilt sensor, the data acquisition module is fixed to the bottom surface of the inner wall of the tilt sensor, and the communication cable is arranged between the tilt sensing module and the data acquisition module to realize the communication connection between the tilt sensing module and the data acquisition module.

[0007] The present application relates to an inclination sensor, which measures the inclination through an inclination sensing module, and the obtained measurement data is transmitted to a data acquisition module through a communication cable, and finally the data acquisition module transmits the measurement data to the outside world. Since the inclination sensing module and the data acquisition module are separated from each other, and the inclination sensing module adopts a single-point fixing method, it can effectively avoid uneven deformation of the data acquisition module due to temperature changes, and finally distort the inclination sensing module, resulting in inaccurate measurement data of the inclination sensing module. The sensor can monitor the temperature of the inclination sensing module in real time to reduce the interference of the ambient temperature on the inclination sensing module and improve the inclination measurement accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic diagram of the structure of a tilt sensor provided in one embodiment of the present application.

[0009] Figure 2 A schematic diagram of the internal structure of a tilt sensor provided in one embodiment of the present application.

[0010] Figure 3 A bottom view of a fixed upper end of a tilt sensor provided in one embodiment of the present application.

[0011] Figure 4 A schematic structural diagram of a tilt sensor module of a tilt sensor provided in one embodiment of the present application.

[0012] Figure 5 A schematic diagram of the connection between a data acquisition module and a support plate of a tilt sensor provided in one embodiment of the present application.

[0013] Figure 6 A top view of a fixed upper end of a tilt sensor provided in one embodiment of the present application.

[0014] Reference numerals:

[0015] 100, tilt sensor; 101, fixed upper end; 102, fixed lower end; 103, fixed cylinder;

[0016] 104, support plate; 201, tilt sensor module; 201a, tilt circuit board; 202, data acquisition module; 202a, acquisition circuit board; 203, communication cable;

[0017] 205, tilt sensor chip; 206, temperature sensor chip; 207, fixing part; 208, base part;

[0018] 209, fixing hole; 210, mounting hole; 211, communication cable; 212, cable connection port;

[0019] 213. Connecting groove; 214. Guide groove. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0021] The present application provides a tilt sensor. It should be noted that the tilt sensor provided by the present application is applicable to any type of tilt sensor.

[0022] like Figure 1 , Figure 2 and Figure 3 As shown, in one embodiment of the present application, the inclination sensor 100 includes a inclination sensing module 201, a data acquisition module 202 and a communication cable 203, the inclination sensing module 201 includes a inclination sensing chip 205 and a temperature sensing chip 206, the inclination sensing module 201 is fixedly connected to the top surface of the inner wall of the inclination sensor 100, the data acquisition module 202 is fixed to the bottom surface of the inner wall of the inclination sensor 100, and the communication cable 203 is arranged between the inclination sensing module 201 and the data acquisition module 202 to realize the communication connection between the inclination sensing module 201 and the data acquisition module 202.

[0023] Specifically, the tilt sensor module 201 also includes a tilt circuit board 201a, the tilt sensor chip 205 is a MEMS tilt sensor chip, the tilt sensor chip 205 is fixedly connected to the bottom surface of the tilt circuit board 201a, the temperature sensor chip 206 is fixedly connected to the top surface of the tilt circuit board 201a, the central axis of the tilt sensor chip 205 and the central axis of the temperature sensor chip 206 are arranged on the same straight line, the tilt circuit board 201a is provided with a cable connection port 212, and the communication connection with the communication cable 203 is realized through the cable connection port 212. The data measured by the tilt sensor module 201 is transmitted to the data acquisition module 202 through the communication cable 203.

[0024] The data acquisition module 202 also includes an acquisition circuit board 202a, which is fixedly connected to the top surface of the fixed lower end 102. The acquisition circuit board 202a is vertically arranged to the top surface of the fixed lower end 102. A communication device is embedded on the acquisition circuit board 202a. One end of the communication cable 211 is communicatively connected to the communication device. A cable connection port 212 is also provided on the acquisition circuit board 202a and is communicatively connected to the communication cable 203.

[0025] The acquisition circuit board 202a is also provided with a power supply cable, and is electrically connected to the outside through the power supply cable, and provides working power to the tilt sensor module 201 through the power supply cable, thereby maintaining the normal operation of the data acquisition module 202.

[0026] The data acquisition module 202 can adopt a 485 communication module and a LORA wireless communication module to realize multiple communication modes including wired communication and wireless communication.

[0027] Since the inclination sensor module 201 and the data acquisition module 202 are respectively installed on the fixed lower end 102 and the fixed upper end 101 and are in a separated state, even if the data acquisition module 202 generates heat during operation, resulting in abnormal temperature and eventually causing deformation of the data acquisition module 202, it will not affect the angle of the inclination sensor chip 205, thereby ensuring the accuracy of the monitoring data of the inclination sensor chip 205.

[0028] In this embodiment, the inclination is measured by the inclination sensor module 201 and the monitoring data is transmitted to the data acquisition module 202 through the communication cable 203. The communication module on the acquisition circuit board performs wired communication with the external receiving end through the communication cable 211, or performs wireless communication with the external receiving end through the communication module to transmit the monitoring data to the outside. Multiple communication methods can ensure that the monitoring data of the inclination sensor module 201 can always be transmitted to the receiving end.

[0029] Since the data acquisition module 202 and the tilt sensor module 201 are installed separately, the influence between them is reduced, and errors in the measurement data of the tilt sensor chip 205 caused by the deformation of the tilt sensor module 201 are avoided.

[0030] In this embodiment, the inclination is measured by the inclination sensor module 201, and the obtained measurement data is transmitted to the data acquisition module 202 through the communication cable 203, and finally the data acquisition module 202 transmits the measurement data to the outside world. Since the inclination sensor module 201 and the data acquisition module 202 are separated from each other, and the inclination sensor module 201 adopts a single-point fixing method, it is possible to effectively avoid uneven deformation of the data acquisition module 202 due to temperature abnormalities, which ultimately distorts the inclination sensor module 201 and causes the measurement data of the inclination sensor module 201 to be inaccurate. The temperature sensor chip 206 can monitor the temperature of the inclination sensor module 201 in real time to reduce the interference of temperature on the inclination sensor module 201 and improve the inclination measurement accuracy.

[0031] like Figure 1As shown, in one embodiment of the present application, the inclination sensor 100 includes a fixed upper end 101, a fixed lower end 102 and a fixed tube 103, the fixed tube 103 is a cylinder with upper and lower openings, the fixed upper end 101 is fixedly connected to the upper opening of the fixed tube 103, the fixed lower end 102 is fixedly connected to the lower opening of the fixed tube 103, and the fixed upper end 101, the fixed lower end 102 and the fixed tube 103 surround and form the inclination sensor 100.

[0032] In this embodiment, when assembling the inclinometer assembly, the fixed lower end 102 is first fixedly connected to the lower end of the fixed tube 103, and then the data acquisition module 202 is fixedly connected to the top surface of the fixed lower end 102. The inclination sensor module 201 is fixed to the bottom surface of the fixed upper end 101, and the communication connection between the inclination sensor module 201 and the data acquisition module 202 is realized through the communication cable 203. Finally, the fixed upper end 101 is fixed in the top surface opening of the fixed tube 103 to complete the installation of the inclination sensor 100.

[0033] like Figure 3 As shown, the fixed upper end 101 includes a base portion 208 and a fixing portion 207 , the bottom surface of the fixing portion 207 is fixedly connected to the top surface of the base portion 208 , the fixing portion 207 is provided with a fixing hole 209 , and the fixing portion 207 is a right-angle plate.

[0034] Specifically, the base portion 208 is fixedly connected to the fixing tube 103 .

[0035] In this embodiment, the base portion 208 is fixedly connected in the fixing tube 103 to achieve fixed connection between the fixed upper end 101 and the fixing tube 103, and then the housing is fixed at the measuring position through the fixing hole 209 of the fixing portion 207 to complete the measurement of the inclination angle.

[0036] Since the fixing hole 209 is arranged at the top of the shell, fixing the shell through the fixing hole 209 is a single-point fixing method, such as hanging fixation. The shell can be fixed at the measuring position by simply passing the screw through the fixing hole 209. In this single-point fixing method, the influence of the uneven deformation of the acquisition circuit board on the inclination sensor chip 205 can be eliminated as much as possible.

[0037] like Figure 5 As shown, in one embodiment of the present application, one end of the data acquisition module 202 is fixedly connected to a communication cable 211, and the communication cable 211 passes through the fixed lower end 102 and extends to the outside.

[0038] Specifically, the communication cable 211 and the power supply cable of the data acquisition module 202 are both extended to the outside through the fixed lower end 102, and the communication cable 211 is provided with a sealing screw to fix the communication cable 211 and the power supply cable.

[0039] In this embodiment, the communication cable 211 is connected to an external receiving end through the fixed lower end 102, so as to transmit the monitoring data collected by the tilt sensor chip 205 to the outside world in a wired communication manner.

[0040] The power supply cable is electrically connected to an external power source through a connection channel to realize power transmission, thereby providing the tilt sensor module 201 and the data acquisition module 202 with power required for operation.

[0041] like Figure 4 As shown, in one embodiment of the present application, a mounting hole 210 is provided on the tilt sensor module 201 , and the temperature sensor chip 206 is disposed on one side of the mounting hole 210 .

[0042] In this embodiment, the temperature of the tilt sensor module 201 is monitored in real time by the temperature sensor chip 206 to prevent the temperature of the tilt sensor module 201 from being too high, which may cause a decrease in monitoring accuracy.

[0043] The tilt sensor module 201 is fixedly connected to the bottom surface of the base 208 through the mounting hole 210. Since the mounting hole 210 and the base 208 are connected at a single point and a certain gap is left, even if the tilt sensor module 201 is deformed due to high temperature, it will not affect the normal operation of the tilt sensor chip 205.

[0044] like Figure 3 As shown, in one embodiment of the present application, the fixing portion 207 is provided with a fixing hole 209 , and the orientation of the fixing hole 209 is consistent with the orientation of the tilt sensor chip 205 .

[0045] Specifically, a connection groove 213 is further formed on the bottom surface of the base portion 208 , and the tilt sensor module 201 is fixedly connected to the bottom surface of the base portion 208 via the connection groove 213 .

[0046] Since the connection slot 213 is provided with a hole position corresponding to the mounting hole, the connection slot 213 can not only fix the tilt sensor module 201, but also fix the orientation of the tilt sensor module 201, thereby improving the efficiency of installing the tilt sensor module 201. In this embodiment, a screw can be passed through the fixing hole 209 to fix the housing in the working position, and the housing is in a vertical state, at which time the tilt sensor module 201 can monitor the tilt of the target.

[0047] like Figure 6 As shown, in one embodiment of the present application, a guide groove 214 is formed on the top surface of the fixing portion 207 , and a horizontal central axis of the guide groove 214 is arranged parallel to a horizontal central axis of the tilt sensor chip 205 .

[0048] Optionally, the top surface of the fixing portion 207 can also be set as an inclined surface with a high front and a low back, the high part of the top surface of the fixing portion 207 corresponds to the head end of the tilt sensor chip 205, and the low part of the top surface of the fixing portion 207 corresponds to the tail end of the tilt sensor chip 205.

[0049] In this embodiment, since the horizontal center axis of the guide groove 214 is arranged parallel to the horizontal center axis of the tilt sensor chip 205 , the orientation of the tilt sensor chip 205 can be directly determined by the orientation of the guide groove 214 , thereby determining the measurement direction of the tilt sensor chip 205 .

[0050] Then, the front-to-back direction of the inclination sensor chip 205 is determined by the height direction of the top surface of the fixing part 207. Since the high part of the top surface of the fixing part 207 corresponds to the head end of the inclination sensor chip 205, and the low part of the top surface of the fixing part 207 corresponds to the tail end of the inclination sensor chip 205, after determining the measurement direction of the inclination sensor chip 205, the front-to-back direction of the inclination sensor chip 205 is determined by the height direction of the top surface of the fixing part 207.

[0051] Since the top surface of the fixing part 207 has an up and down trend, the user can determine the measurement direction and the front and back direction of the inclination sensor chip 205 by directly observing the orientation of the fixing part 207 and the up and down trend of its top surface, so that the user can accurately determine the monitoring range and monitoring requirements of the present application, and facilitate the user's installation and positioning.

[0052] like Figure 5 As shown, in one embodiment of the present application, the inclination sensor 100 also includes a support plate 104, and the support plate 104 is L-shaped. The vertical surface of the support plate 104 is fixedly connected to the lower end of the acquisition circuit board, and the horizontal surface of the support plate 104 is fixedly connected to the top surface of the fixed lower end 102.

[0053] Specifically, the support plate 104 is provided with screw holes, and the acquisition circuit board is fixedly connected to the support plate 104 through the screw holes.

[0054] In this embodiment, a support plate 104 is provided to fix the acquisition circuit board to the fixed lower end 102. Due to the presence of the support plate 104, the position of the acquisition circuit board in the monitoring room is more stable, avoiding deformation or displacement during use, thereby improving the measurement accuracy of the inclination measuring assembly.

[0055] The technical features of the above-described embodiments may be arbitrarily combined, and the execution order of the method steps is not limited. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A tilt sensor, characterized in that: The inclination sensor comprises: A tilt sensor module, a data acquisition module and a communication cable, wherein the tilt sensor module includes a tilt sensor chip and a temperature sensor chip, the tilt sensor module is fixedly connected to the top surface of the inner wall of the tilt sensor, the data acquisition module is fixed to the bottom surface of the inner wall of the tilt sensor, and the communication cable is arranged between the tilt sensor module and the data acquisition module to realize the communication connection between the tilt sensor module and the data acquisition module; The inclination sensor comprises a fixed upper end, a fixed lower end and a fixed cylinder, wherein the fixed cylinder is a cylindrical body with upper and lower openings, the fixed upper end is fixedly connected to the upper opening of the fixed cylinder, the fixed lower end is fixedly connected to the lower opening of the fixed cylinder, and the fixed upper end, the fixed lower end and the fixed cylinder surround and form the inclination sensor; The fixed upper end comprises a base portion and a fixing portion, the bottom surface of the fixing portion is fixedly connected to the top surface of the base portion, a fixing hole is provided in the fixing portion, and the fixing portion is a right-angle plate.

2. The inclination sensor according to claim 1, characterized in that: One end of the data acquisition module is fixedly connected with a communication cable, and the communication cable passes through the fixed lower end and extends to the outside.

3. The inclination sensor according to claim 2, characterized in that: The tilt sensor module is provided with a mounting hole, and the temperature sensor chip is arranged on one side of the mounting hole.

4. The inclination sensor according to claim 3, characterized in that: The fixing portion is provided with a fixing hole, and the orientation of the fixing hole is consistent with the orientation of the tilt sensor chip.

5. The inclination sensor according to claim 4, characterized in that: A guide groove is formed on the top surface of the fixing portion, and a horizontal center axis of the guide groove is arranged parallel to a horizontal center axis of the tilt sensor chip.

6. The inclination sensor according to claim 1, characterized in that: The inclination sensor also includes: The support plate is L-shaped, the vertical surface of the support plate is fixedly connected to the lower end of the acquisition circuit board, and the horizontal surface of the support plate is fixedly connected to the top surface of the fixed lower end.

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