Display panel, method for manufacturing display panel, and display device

Abstract

The application discloses a display panel, a preparation method of the display panel and a display device, relates to the technical field of display, and the display panel comprises a substrate, a plurality of sub-pixels and a carrier substrate, the plurality of sub-pixels are arrayed on the substrate, the carrier substrate is arranged on the side, away from the substrate, of the sub-pixels, the display panel further comprises a plurality of anti-reflection films, the plurality of anti-reflection films are arranged on one side of the light-emitting surface of the carrier substrate and are arranged in one-to-one correspondence with the plurality of sub-pixels, wherein the thicknesses of the plurality of anti-reflection films are different; through the above design, the overall penetration is improved, and the color gamut of the display panel is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] With the development of display panel technology and its increasingly widespread application, consumers have higher and higher demands for a better display panel experience. How to reduce the reflectivity and increase the transmittance of display panels during use has become one of the main issues in improving the display experience.

[0003] A common method to reduce reflectivity or increase transmittance is to add one or more layers of anti-reflection coating to the entire surface of the display panel. However, this method can only effectively reduce reflection or increase transmittance in a specific wavelength band (such as red R), while the improvement effect is limited in another one or two color bands (G and / or B), thereby reducing the overall color gamut effect of the display panel.

[0004] Therefore, how to improve the overall transmittance of the display panel, reduce the overall reflectivity, and thus improve the color gamut of the display panel is an urgent problem to be solved. Summary of the Invention

[0005] The purpose of this application is to provide a display panel that improves overall transmittance and enhances color gamut, a method for manufacturing the display panel, and a display device.

[0006] This application discloses a display panel, including a substrate, a plurality of sub-pixels and a carrier substrate. The plurality of sub-pixels are arrayed on the substrate, and the carrier substrate is disposed on the side of the sub-pixels away from the substrate. The display panel also includes a plurality of anti-reflection films, which are disposed on one side of the light-emitting surface of the carrier substrate and correspond one-to-one with the plurality of sub-pixels. The plurality of anti-reflection films have different thicknesses.

[0007] Optionally, the refractive index of the antireflective film is 1.3 to 1.5.

[0008] Optionally, the antireflective film is a single-layer structure, and the plurality of antireflective films include a first antireflective film, a second antireflective film and a third antireflective film, and the plurality of sub-pixels include a first sub-pixel, a second sub-pixel and a third sub-pixel, wherein the first antireflective film is set corresponding to the first sub-pixel, the second antireflective film is set corresponding to the second sub-pixel and the third antireflective film is set corresponding to the third sub-pixel;

[0009] The thickness of the first antireflective film is 115nm-125nm, the thickness of the second antireflective film is 89nm-99nm, and the thickness of the third antireflective film is 70nm-80nm.

[0010] Optionally, the first antireflective coating, the second antireflective coating, and the third antireflective coating have a refractive index of 1.46 and are all made of silicon oxide.

[0011] Optionally, the antireflective coating includes a first antireflective coating, a second antireflective coating, and a third antireflective coating; the sub-pixel includes a first sub-pixel, a second sub-pixel, and a third sub-pixel; the first antireflective coating is configured corresponding to the first sub-pixel, the second antireflective coating is configured corresponding to the second sub-pixel, and the third antireflective coating is configured corresponding to the third sub-pixel; the first antireflective coating includes a first material layer, a first antireflective layer, and a second material layer stacked sequentially; the second antireflective coating includes a first material layer, a second antireflective layer, and a second material layer stacked sequentially; the third antireflective coating includes a first material layer, a third antireflective layer, and a second material layer stacked sequentially; wherein the thickness of the first antireflective coating is 115nm-125nm, the thickness of the second antireflective coating is 109nm-119nm, and the thickness of the third antireflective coating is 90nm-100nm; the thickness of the first material layer is 8nm-12nm, and the thickness of the second material layer is 8nm-12nm.

[0012] Optionally, the display panel further includes a fourth sub-pixel, and the anti-reflective film further includes a fourth anti-reflective film, which is set corresponding to the fourth sub-pixel, and the thickness of the fourth anti-reflective film is 285nm-315nm.

[0013] Optionally, the fourth antireflective film includes a first antireflective layer, a second antireflective layer, and a third antireflective layer stacked sequentially.

[0014] This application also discloses a method for manufacturing a display panel, used in the display panel described above, comprising the following steps:

[0015] A display module with a pixel array was prepared.

[0016] A carrier substrate is disposed on the light-emitting surface of the display module;

[0017] On the carrier substrate, according to the alignment structure in the display module, a first antireflection film is prepared corresponding to the first sub-pixel, a second antireflection film is prepared corresponding to the second sub-pixel, and a third antireflection film is prepared corresponding to the third sub-pixel.

[0018] Optionally, the step of preparing a first antireflective film on the carrier substrate according to the alignment structure within the display module, corresponding to the first sub-pixel, preparing a second antireflective film corresponding to the second sub-pixel, and preparing a third antireflective film on the third sub-pixel, includes:

[0019] A photoresist material is deposited on the carrier substrate, and then exposed and developed to form a first photoresist layer with cutouts corresponding to the positions of the first sub-pixels.

[0020] A first antireflective coating material is applied over the first sub-pixel and the first photoresist layer;

[0021] Peel off the first photoresist layer to obtain the first antireflective film corresponding to the first sub-pixel;

[0022] A photoresist material is deposited on the carrier substrate, and then exposed and developed to form a second photoresist layer with cutouts corresponding to the positions of the second sub-pixels;

[0023] A second antireflective coating material is applied over the second sub-pixel and the second photoresist layer;

[0024] Peel off the second photoresist layer to obtain the second antireflection film corresponding to the second sub-pixel;

[0025] A photoresist material is deposited on the carrier substrate, and then exposed and developed to form a third photoresist layer with cutouts corresponding to the third sub-pixel position;

[0026] A third antireflective coating material is applied over the third sub-pixel and the third photoresist layer;

[0027] The third photoresist layer is peeled off to obtain the third antireflective film corresponding to the third sub-pixel.

[0028] This application also discloses a display device, including a display panel as described above.

[0029] Compared to existing technologies that add one or more anti-reflection films by coating the entire surface of the display panel, the display panel of this application includes multiple anti-reflection films. These multiple anti-reflection films are disposed on one side of the light-emitting surface of the carrier substrate and correspond one-to-one with multiple sub-pixels. The thickness of the multiple anti-reflection films is different. By setting anti-reflection films corresponding to different sub-pixels, the transmittance of the corresponding sub-pixel in the corresponding wavelength band can be improved, while the transmittance of the same sub-pixel in other wavelength bands can be reduced, thereby reducing reflectance. This results in purer colors in the corresponding wavelength band and a higher color gamut for the display panel. Attached Figure Description

[0030] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings:

[0031] Figure 1 This is a block diagram of the display device provided in this application;

[0032] Figure 2 This is a cross-sectional structural diagram of the display panel provided in this application;

[0033] Figure 3 This is a schematic diagram of the transmittance curves of the antireflective coating provided in the first embodiment of this application in various wavelength bands;

[0034] Figure 4 This is a schematic diagram of the steps in the manufacturing method of the display panel provided in this application;

[0035] Figure 5 This is a schematic diagram of the preparation process of the first antireflective film provided in this application;

[0036] Figure 6 yes Figure 5 A schematic diagram of the further steps in step S3;

[0037] Figure 7 yes Figure 5 A schematic diagram of the steps following step S3;

[0038] Figure 8 This is a cross-sectional structural diagram of the display panel according to the second embodiment of this application;

[0039] Figure 9 This is a schematic diagram of the film structure of the first, second, or third antireflection film provided in the second embodiment of this application;

[0040] Figure 10 This is a cross-sectional structural diagram of the display panel provided in the third embodiment of this application.

[0041] Wherein, 10 is a display device; 100 is a display panel; 110 is a substrate; 120 is a sub-pixel; 121 is a first sub-pixel; 122 is a second sub-pixel; 123 is a third sub-pixel; 124 is a fourth sub-pixel; 130 is a carrier substrate; 140 is an anti-reflection film; 141 is a first anti-reflection film; 142 is a second anti-reflection film; 143 is a third anti-reflection film; 144 is a first material layer; 145 is a second material layer; 146 is a first anti-reflection layer; 147 is a second anti-reflection layer; 148 is a third anti-reflection layer; 149 is a fourth anti-reflection film; 150 is a first photoresist layer; 160 is a second photoresist layer; 170 is a third photoresist layer; and 180 is a blank area. Detailed Implementation

[0042] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.

[0043] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of technical features indicated. Therefore, unless otherwise stated, a feature specified as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. Furthermore, terms indicating orientation or positional relationships, such as "upper," "lower," "left," "right," "vertical," and "horizontal," are described based on the orientation or relative positional relationships shown in the accompanying drawings and are only for the purpose of simplifying the description of this application, not indicating that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0044] Figure 1 This is a block diagram of the display device provided in this application. Figure 2 This is a schematic diagram of the cross-sectional structure of the display panel provided in this application, as shown below. Figures 1-2 As shown, this application discloses a display device 10, including a display panel 100. Specifically, the display panel 100 includes a substrate 110, a plurality of sub-pixels 120, and a carrier substrate 130. The plurality of sub-pixels 120 are arrayed on the substrate 110, and the carrier substrate 130 is disposed on the side of the sub-pixels 120 away from the substrate 110. The display panel 100 also includes a plurality of anti-reflection films 140, which are disposed on one side of the light-emitting surface of the carrier substrate 130 and correspond one-to-one with the plurality of sub-pixels 120. The plurality of anti-reflection films 140 have different thicknesses.

[0045] Compared to existing technologies that add one or more anti-reflection films by coating the entire surface of the display panel 100, the display panel 100 of this application includes multiple anti-reflection films 140. These multiple anti-reflection films 140 are disposed on one side of the light-emitting surface of the carrier substrate 130 and correspond one-to-one with the multiple sub-pixels 120. The thickness of each of the multiple anti-reflection films 140 is different. By using anti-reflection films 140 corresponding to different sub-pixels 120, the transmittance of the corresponding sub-pixel 120 in the corresponding wavelength band can be increased, while the transmittance of the same sub-pixel 120 in other wavelength bands can be reduced, thereby reducing reflectivity. This results in purer colors in the corresponding wavelength bands and a higher color gamut for the display panel 100.

[0046] The display panel 100 may be a liquid crystal display panel, an OLED display panel, a Micro LED display panel, or other types of display panels. The present application will be described in detail below with reference to the accompanying drawings and optional embodiments.

[0047] First embodiment:

[0048] The refractive index of the antireflective coating 140 can be 1.3 to 1.5. For example... Figure 2 As shown, the antireflective coating 140 is a single-layer structure. The plurality of antireflective coatings 140 include a first antireflective coating 141, a second antireflective coating 142, and a third antireflective coating 143. The plurality of sub-pixels 120 include a first sub-pixel 121, a second sub-pixel 122, and a third sub-pixel 123. The first antireflective coating 141 is disposed corresponding to the first sub-pixel 121, the second antireflective coating 142 is disposed corresponding to the second sub-pixel 122, and the third antireflective coating 143 is disposed corresponding to the third sub-pixel 123. The thickness of the first antireflective coating 141 is 115nm-125nm, the thickness of the second antireflective coating 142 is 89nm-99nm, and the thickness of the third antireflective coating 143 is 70nm-80nm. In this case, light is incident perpendicularly, the thickness of the antireflective coating 140 is d, the phase difference of the light reflected from the front and back surfaces of the antireflective coating 140 is 2d, the first antireflective coating 141, the second antireflective coating 142, and the third antireflective coating 143 are single-layer films, and the thickness d of the antireflective coating 140 is adjusted to satisfy n12=n0n g ,and When the reflectivity R = 0, the incident light λ0 is not reflected and "disappears," meaning the reflectivity condition is satisfied. Where n0 is the refractive index of air, n1 is the refractive index of the antireflection coating, and n g This represents the refractive index of the carrier substrate. When the first antireflective film 141, the second antireflective film 142, and the third antireflective film 143 are a double-layer film, then they must satisfy... It can also achieve the purpose of interference cancellation.

[0049] Specifically, the first sub-pixel 121 is a red sub-pixel 120, the second sub-pixel 122 is a green sub-pixel 120, and the third sub-pixel 123 is a blue sub-pixel 120. The first antireflective coating 141, the second antireflective coating 142, and the third antireflective coating 143 have a refractive index of 1.46 and are all made of silicon oxide. Figure 3 This is a schematic diagram showing the transmittance curves of the antireflective coating 140 provided in the first embodiment of this application in various wavelength bands. Figure 3 The dashed lines represent the maximum transmittance of each antireflective coating 140 in the corresponding wavelength band, such as... Figure 3As shown, the carrier at the light-emitting position of the red sub-pixel 120 is coated with a film layer with the highest transmittance near the 700nm band, while the transmittance is lower at the green and blue sub-pixels 120. Similarly, antireflective films 140 with correspondingly high transmittance are coated on the carrier at the light-emitting positions of the green sub-pixel 120 near 546nm and the blue sub-pixel 120 near 436nm. The inventors have demonstrated through experiments that the thickness of the first antireflective film 141 can be set to 120nm, the thickness of the second antireflective film 142 can be set to 94nm, and the thickness of the third antireflective film 143 can be set to 75nm. In this case, the antireflective effects of the first antireflective film 141, the second antireflective film 142, and the third antireflective film 143 are relatively better. The first antireflective film 141, the second antireflective film 142 and the third antireflective film 143 are all made of silicon oxide material, which can be coated in only one process and then etched with a semi-permeable film to form different thicknesses. Moreover, the coating machine does not need to be changed during coating, thus saving time and improving efficiency.

[0050] Of course, it is also possible for the first antireflective film 141, the second antireflective film 142, and the third antireflective film 143 to all be made of silicon nitride, or for a portion of the antireflective film 140 to be made of silicon oxide, while the other portion of the antireflective film 140 is made of silicon nitride. Similarly, it is also possible for the three antireflective films 140 to be made of three different materials, as long as the requirements are met, and no limitation is made here.

[0051] In addition, such as Figure 2 As shown, the display panel 100 further includes a fourth sub-pixel 124, and the anti-reflective film 140 further includes a fourth anti-reflective film 149. The fourth anti-reflective film 149 is configured corresponding to the fourth sub-pixel 124. The fourth sub-pixel 124 is a white sub-pixel 120. The thickness of the fourth anti-reflective film 149 is 285nm-315nm. The fourth anti-reflective film 149 is formed by stacking the first anti-reflective film 141, the second anti-reflective film 142, and the third anti-reflective film 143. Moreover, the anti-reflective effect of the fourth anti-reflective film 149 is best when the thickness of the first anti-reflective film 141 is 120nm, the thickness of the second anti-reflective film 142 is 94nm, and the thickness of the third anti-reflective film 143 is 75nm.

[0052] Figure 4 This is a schematic diagram of the steps in the manufacturing method of the display panel provided in this application, as shown below. Figure 4 As shown, this application also discloses a method for manufacturing a display panel 100, used in the display panel 100 as described above, comprising the following steps:

[0053] S1: A display module with a pixel array is prepared;

[0054] S2: A carrier substrate is disposed on the light-emitting surface of the display module;

[0055] S3: On the carrier substrate, according to the alignment structure in the display module, a first antireflection film is prepared corresponding to the first sub-pixel, a second antireflection film is prepared corresponding to the second sub-pixel, and a third antireflection film is prepared corresponding to the third sub-pixel.

[0056] The display module may include an array substrate, a liquid crystal layer, and a color filter substrate. The display panel 100 is obtained by assembling the array substrate and the color filter substrate. The alignment structure refers to the alignment mask and other structures on the array substrate and the color filter substrate. Alternatively, the display module may include an OLED substrate and an encapsulation layer. The display panel 100 is obtained by covering the carrier substrate 130 after the encapsulation layer is applied to the OLED substrate. Other types of display panels 100 are also possible, and the design will be based on actual production needs.

[0057] Figure 5 This is a schematic diagram of the preparation process of the first antireflective film provided in this application. Figure 6 yes Figure 5 A diagram illustrating further steps in step S3, combined with... Figures 5-6 The step of preparing a first antireflective film on the carrier substrate according to the alignment structure within the display module, corresponding to the first sub-pixel, preparing a second antireflective film corresponding to the second sub-pixel, and preparing a third antireflective film corresponding to the third sub-pixel includes:

[0058] S31: Deposit photoresist material on the carrier substrate, and expose and develop to form a first photoresist layer with a cutout corresponding to the position of the first sub-pixel;

[0059] S32: Coat the first antireflective film material over the first sub-pixel and the first photoresist layer;

[0060] S33: Peel off the first photoresist layer to obtain the first anti-reflection film set corresponding to the first sub-pixel;

[0061] S34: Deposit photoresist material on the carrier substrate, and expose and develop to form a second photoresist layer with cutouts corresponding to the second sub-pixel position;

[0062] S35: Apply a second antireflective coating material over the second sub-pixel and the second photoresist layer;

[0063] S36: Peel off the second photoresist layer to obtain the second antireflection film corresponding to the second sub-pixel;

[0064] S37: Deposit photoresist material on the carrier substrate, and expose and develop to form a third photoresist layer with a cutout corresponding to the position of the third sub-pixel;

[0065] S38: A third antireflective coating material is applied over the third sub-pixel and the third photoresist layer; and

[0066] S39: Peel off the third photoresist layer to obtain the third antireflective film corresponding to the third sub-pixel.

[0067] Figure 7 yes Figure 5 A schematic diagram of the steps following step S3 is shown below. Figure 7 As shown, when the display module further includes a fourth sub-pixel 124, the step of preparing a first anti-reflection film on the carrier substrate according to the alignment structure in the display panel, corresponding to the first sub-pixel, preparing a second anti-reflection film, and preparing a third anti-reflection film, further includes:

[0068] S4: Prepare the fourth antireflection film corresponding to the fourth sub-pixel.

[0069] The fourth sub-pixel 124 is a white sub-pixel 120. The preparation steps of the fourth anti-reflection film 149 refer to the preparation steps of the first anti-reflection film 141, the second anti-reflection film 142, and the third anti-reflection film 143, and will not be repeated here. When the fourth anti-reflection film 149 is formed by stacking the first anti-reflection film 141, the second anti-reflection film 142, and the third anti-reflection film 143, the preparation step of the fourth anti-reflection film 149 is to simultaneously form the first anti-reflection film 141, the second anti-reflection film 142, and the third anti-reflection film 143 above the corresponding fourth sub-pixel 124 to form the stacked fourth anti-reflection film 149.

[0070] Second embodiment:

[0071] Figure 8 This is a cross-sectional structural diagram of the display panel according to the second embodiment of this application; as shown Figure 8 As shown, as a second embodiment of this application, this embodiment differs from the first embodiment in that the antireflective film 140 includes a first antireflective film 141, a second antireflective film 142, and a third antireflective film 143, and the sub-pixel 120 includes a first sub-pixel 121, a second sub-pixel 122, and a third sub-pixel 123. The first antireflective film 141 is disposed corresponding to the first sub-pixel 121, the second antireflective film 142 is disposed corresponding to the second sub-pixel 122, and the third antireflective film 143 is disposed corresponding to the third sub-pixel 123.

[0072] Figure 9 This is a schematic diagram of the film structure of the first, second, or third antireflection film provided in the second embodiment of this application, as shown below. Figure 8 As shown, combined with Figure 9The first antireflective film 141 includes a first material layer 144, a first antireflective layer 146, and a second material layer 145 stacked in sequence; the second antireflective film 142 includes a first material layer 144, a second antireflective layer 147, and a second material layer 145 stacked in sequence; and the third antireflective film 143 includes a first material layer 144, a third antireflective layer 148, and a second material layer 145 stacked in sequence.

[0073] The thickness of the first antireflective film 141 is 115nm-125nm, the thickness of the second antireflective film 142 is 109nm-119nm, and the thickness of the third antireflective film 143 is 90nm-100nm; the thickness of the first material layer 144 is 8nm-12nm, and the thickness of the second material layer 145 is 8nm-12nm.

[0074] Specifically, the first antireflective film 141, the second antireflective film 142, and the third antireflective film 143 all employ a stacked design. The first material layer 144 and the second material layer 145 are both made of titanium dioxide, while the first antireflective layer 146, the second antireflective layer 147, and the third antireflective layer 148 can be made of silicon dioxide. The first material layer 144 serves to flatten the layers, facilitating the deposition of subsequent antireflective layers and also improving film adhesion. The intermediate first antireflective layers 146, 147, and 148 serve to reduce reflection, while the second material layer 145 serves to prevent contamination and dust. Of course, the first material layer 144, the second material layer 145, the first antireflective layer 146, the second antireflective layer 147, and the third antireflective layer 148 can also be made of other materials, as long as the requirements are met.

[0075] The first material layer 144, corresponding to the first antireflective layer 146, the second antireflective layer 147, and the third antireflective layer 148, can be applied to the entire display area at once, or it can be formed separately for each sub-pixel 120. Similarly, the second material layer 145 can also be applied to the entire display area at once or formed separately for each sub-pixel 120. When the first antireflective film 141, the second antireflective film 142, and the third antireflective film 143 are all designed in a stacked manner, the fourth antireflective film 149 can be made of a single layer of material or can be formed by stacking multiple materials. That is, there are two ways: one is to directly deposit an antireflective layer with a thickness of 265nm-295nm; the other is to form the first antireflective layer 146, the second antireflective layer 147, and the third antireflective layer 148 in a stacked manner at the fourth pixel position when forming the first antireflective layer 146, the second antireflective layer 147, and the third antireflective layer 148 to obtain the fourth antireflective film 149.

[0076] Furthermore, an uneven structure can be provided, which includes multiple uneven and spaced moth-eye structures. The moth-eye structures can be formed by the second material layer 145 or can be provided on the side of the second material layer 145 away from the carrier substrate 130, which can significantly reduce reflectivity.

[0077] Third embodiment:

[0078] Figure 10 This is a cross-sectional structural diagram of the display panel provided in the third embodiment of this application, as shown below. Figure 10 As shown, as the third embodiment of this application, this embodiment differs from the first and second embodiments in that the blank area 180 between two adjacent sub-pixels 120 is provided with an anti-reflection film 140. The anti-reflection film 140 of the blank area 180 is formed by stacking a first anti-reflection film 141, a second anti-reflection film 142 and a third anti-reflection film 143, so that the light between adjacent sub-pixels 120 can also be reduced in the blank area 180.

[0079] It should be noted that the limitations on each step involved in this solution are not considered as limiting the order of steps, provided that they do not affect the implementation of the specific solution. The steps listed first can be executed first, later, or even simultaneously. As long as this solution can be implemented, it should be considered to fall within the scope of protection of this application.

[0080] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0081] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A display panel, comprising a substrate, a plurality of sub-pixels and a carrier substrate, the plurality of sub-pixels are arranged on the substrate, the carrier substrate is arranged on a side of the sub-pixels away from the substrate, characterized in that, The display panel further comprises a plurality of anti-reflection films, the plurality of anti-reflection films are arranged on one side of the light-out surface of the carrier substrate and correspond to the plurality of sub-pixels one by one; wherein The thicknesses of the plurality of anti-reflection films are different; The anti-reflection film comprises a first anti-reflection film, a second anti-reflection film and a third anti-reflection film, the plurality of sub-pixels comprise a first sub-pixel, a second sub-pixel and a third sub-pixel, the first anti-reflection film is arranged corresponding to the first sub-pixel, the second anti-reflection film is arranged corresponding to the second sub-pixel, and the third anti-reflection film is arranged corresponding to the third sub-pixel; the first sub-pixel is a red sub-pixel, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a blue sub-pixel; The display panel further comprises a fourth sub-pixel, the fourth sub-pixel is a white sub-pixel, the anti-reflection film further comprises a fourth anti-reflection film, the fourth anti-reflection film is arranged corresponding to the fourth sub-pixel, and the fourth anti-reflection film comprises the first anti-reflection film, the second anti-reflection film and the third anti-reflection film stacked in sequence; The first anti-reflection film, the second anti-reflection film and the third anti-reflection film are all single-layer structures, and the first anti-reflection film, the second anti-reflection film and the third anti-reflection film are all made of silicon oxide material.

2. The display panel of claim 1, wherein, Wherein, the first AR film has a thickness of 115 nm 125 nm, the second AR film has a thickness of 89 nm 99 nm, the third AR film has a thickness of 70 nm 80 nm; the first, second and third AR films have a refractive index of 1.

46.

3. A display panel comprising a substrate, a plurality of sub-pixels and a carrier substrate, the plurality of sub-pixels being arranged in an array on the substrate, the carrier substrate being disposed on a side of the sub-pixels distal from the substrate, characterized in that, The display panel further comprises a plurality of anti-reflection films, the plurality of anti-reflection films are arranged on one side of the light-out surface of the carrier substrate and correspond to the plurality of sub-pixels one by one; wherein The thicknesses of the plurality of anti-reflection films are different; The anti-reflection film comprises a first anti-reflection film, a second anti-reflection film and a third anti-reflection film, the plurality of sub-pixels comprise a first sub-pixel, a second sub-pixel and a third sub-pixel, the first anti-reflection film is arranged corresponding to the first sub-pixel, the second anti-reflection film is arranged corresponding to the second sub-pixel, and the third anti-reflection film is arranged corresponding to the third sub-pixel; the first sub-pixel is a red sub-pixel, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a blue sub-pixel; the first anti-reflection film comprises a first material layer, a first anti-reflection layer and a second material layer stacked in sequence, the second anti-reflection film comprises a first material layer, a second anti-reflection layer and a second material layer stacked in sequence, and the third anti-reflection film comprises a first material layer, a third anti-reflection layer and a second material layer stacked in sequence; The display panel further comprises a fourth sub-pixel, the fourth sub-pixel is a white sub-pixel, the anti-reflection film further comprises a fourth anti-reflection film, the fourth anti-reflection film is arranged corresponding to the fourth sub-pixel, and the fourth anti-reflection film is a first anti-reflection layer, a second anti-reflection layer and a third anti-reflection layer stacked together; Wherein, the first material layer and the second material layer are both made of titanium oxide material, and the first anti-reflection layer, the second anti-reflection layer and the third anti-reflection layer are all made of silicon oxide material.

4. The display panel of claim 3, wherein, Wherein, the first AR reducing film has a thickness of 115 nm 125 nm, the second AR reducing film has a thickness of 109 nm 119 nm, the third AR reducing film has a thickness of 90 nm 100 nm; the first material layer has a thickness of 8 nm 12 nm, the second material layer has a thickness of 8 nm 12 nm.

5. The display panel of claim 1, wherein, The fourth anti-reflective film has a thickness of 285 nm 315 nm.

6. A display panel comprising a substrate, a plurality of sub-pixels and a carrier substrate, the plurality of sub-pixels being arranged in an array on the substrate, the carrier substrate being disposed on a side of the sub-pixels distal from the substrate, characterized in that, The display panel further comprises a plurality of anti-reflection films, the plurality of anti-reflection films are arranged on one side of the light-out surface of the carrier substrate and correspond to the plurality of sub-pixels one by one; wherein The thicknesses of the plurality of anti-reflection films are different; The antireflection film comprises a first antireflection film, a second antireflection film and a third antireflection film, a plurality of the sub-pixels comprise a first sub-pixel, a second sub-pixel and a third sub-pixel, the first antireflection film is arranged corresponding to the first sub-pixel, the second antireflection film is arranged corresponding to the second sub-pixel, and the third antireflection film is arranged corresponding to the third sub-pixel; the first sub-pixel is a red sub-pixel, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a blue sub-pixel; The display panel further comprises a fourth sub-pixel, the fourth sub-pixel is a white sub-pixel, the antireflection film further comprises a fourth antireflection film, the fourth antireflection film is arranged corresponding to the fourth sub-pixel, and the fourth antireflection film comprises the first antireflection film, the second antireflection film and the third antireflection film stacked in sequence; Wherein, between the adjacent first sub-pixel and the second sub-pixel, between the adjacent second sub-pixel and the third sub-pixel, a blank area is formed, the blank area is also provided with the antireflection film, and the antireflection film of the blank area is formed by stacking the first antireflection film, the second antireflection film and the third antireflection film; The first antireflection film, the second antireflection film and the third antireflection film are all single-layer structures, and the first antireflection film, the second antireflection film and the third antireflection film are all made of silicon oxide material.

7. A method for manufacturing a display panel, characterized by, The display panel as claimed in any one of claims 1-5, comprising the steps of: Preparation of a display module with a pixel array; A carrier substrate is arranged on the light-emitting surface of the display module; According to the alignment structure in the display module, the first antireflection film is prepared corresponding to the first sub-pixel, the second antireflection film is prepared corresponding to the second sub-pixel, the third antireflection film is prepared corresponding to the third sub-pixel, and the fourth antireflection film is prepared corresponding to the fourth sub-pixel on the carrier substrate; The first sub-pixel is a red sub-pixel, the second sub-pixel is a green sub-pixel, the third sub-pixel is a blue sub-pixel, and the fourth sub-pixel is a white sub-pixel; the fourth antireflection film is formed by simultaneously forming the first antireflection film, the second antireflection film and the third antireflection film above the fourth sub-pixel when the first antireflection film, the second antireflection film and the third antireflection film are formed to form the stacked fourth antireflection film.

8. The method of producing a display panel according to claim 6, wherein In the step of preparing the first antireflection film corresponding to the first sub-pixel, the second antireflection film corresponding to the second sub-pixel and the third antireflection film corresponding to the third sub-pixel on the carrier substrate according to the alignment structure in the display module, the steps comprise: A photoresist material is deposited on the carrier substrate, and a first photoresist layer corresponding to the first sub-pixel position is formed by exposure and development; A first antireflection film material is coated above the first sub-pixel and the first photoresist layer; The first photoresist layer is peeled off to obtain the first antireflection film arranged corresponding to the first sub-pixel; A photoresist material is deposited on the carrier substrate, and a second photoresist layer corresponding to the second sub-pixel position is formed by exposure and development; A second antireflection film material is coated above the second sub-pixel and the second photoresist layer; The second photoresist layer is peeled off to obtain the second antireflection film arranged corresponding to the second sub-pixel; depositing photoresist material on the carrier substrate, exposing and developing to form a third photoresist layer corresponding to the third sub-pixel position being hollowed out; applying third anti-reflective film material above the third sub-pixel and the third photoresist layer; stripping the third photoresist layer to obtain a third anti-reflective film arranged corresponding to the third sub-pixel; wherein, when the first anti-reflective film, the second anti-reflective film and the third anti-reflective film are formed, the first anti-reflective film, the second anti-reflective film and the third anti-reflective film are simultaneously formed above corresponding to the fourth sub-pixel to form a stacked fourth anti-reflective film.

9. A display device, characterized by comprising: The display panel comprises the display panel as claimed in any one of claims 1-6.

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