A method for preparing micro-nano flexible conductive circuit based on ultrasonic driving liquid metal

Abstract

The application provides a method for preparing a micro-nano flexible conductive circuit based on ultrasonic driving liquid metal, comprising the following steps: using 3D printing to prepare a mold with a channel pattern and a liquid metal chamber, and adding a mixed flexible substrate resin mixture into the mold; then defoaming, curing, peeling from the mold to obtain an unsealed flexible substrate; using a bottom plate to seal the bottom to obtain a flexible substrate sealing mold; fixing the flexible substrate sealing mold on a metal clamp table, injecting liquid metal into the liquid metal chamber, contacting the clamp table on one side with an ultrasonic welder, applying ultrasonic waves, and completing channel filling; removing the bottom plate to obtain a liquid metal flexible conductive circuit. The technical scheme of the application can fill sub-micron level channels with a minimum width of 750 nm, and can realize effective filling of multi-channel, staggered complex channels and blind hole structures, and the filling process can be completed within a few seconds, which is fast, accurate, efficient and low in cost.

Description

Technical Field

[0001] This invention relates to the field of electronic component fabrication technology, and in particular to a method for fabricating micro-nano flexible conductive circuits based on ultrasonically driven liquid metal. Background Technology

[0002] Currently, the methods for fabricating flexible electronic conductive circuits using liquid metal patterning are mainly divided into two categories: direct patterning methods, which involve directly depositing liquid metal onto a designated area, and indirect patterning methods, which involve fabricating flexible channels and filling them with liquid metal. Indirect liquid metal patterning methods are further divided into two types: the first is the injection method, which uses a syringe to apply external pressure to force liquid metal into the flexible channel; the second is the vacuum method, which places the liquid metal at the channel entrance and places the flexible device in a vacuum environment. When the device returns from the vacuum environment to the atmospheric environment, the liquid metal is forced into the channel by atmospheric pressure because the internal pressure is lower than the external pressure, thus filling the channel. The indirect method has two main characteristics: (1) it uses materials such as PDMS and Ecoflex to fabricate a flexible substrate, which already has the channels required for the liquid metal circuit fabricated inside; (2) it uses external pressure (syringe, atmospheric pressure) to completely fill the channel with liquid metal. Therefore, once the liquid metal completely fills the channel, the size of the channel represents the precision of the flexible liquid metal circuit fabricated by the indirect method.

[0003] The indirect injection method uses pressure to inject liquid metal into the channel. However, it is important to note that the channel size is inversely proportional to the pressure required for filling. That is, the finer the channel, the greater the pressure required. Excessive pressure can damage the encapsulation of the flexible substrate, causing liquid metal leakage and thus damaging the flexible device. This results in the following limitations of the injection method: (1) Low dimensional accuracy, making it difficult to process high-precision liquid metal circuits. Currently, the finest dimension of liquid metal circuits prepared by the injection method reported in the literature is 50 μm. (2) It cannot achieve the filling of complex channel structures such as multi-channel, blind via, and staggered channels. Due to the limitations of the injection method itself, the channel must have an inlet and a corresponding outlet, thus blind via structures cannot be filled. When there are multi-channel or staggered channels, the fluid tends to flow to the outlet with less channel resistance, making complete filling impossible. Figure 1 As shown.

[0004] To protect the flexible substrate, researchers developed a vacuum method based on the injection molding method. This method uses atmospheric pressure to fill liquid metal, which can better protect the flexible substrate and achieve a planar accuracy of 10 μm. However, the vacuum preparation time (i.e., evacuating the internal channels of the flexible substrate) is at least 30 minutes, resulting in low production efficiency. Furthermore, when the pattern is complex and has many corners, incomplete filling may still occur. Therefore, the vacuum method has the following limitations: (1) Limited accuracy, limited by atmospheric pressure. Currently, the literature reports that the vacuum method can achieve a liquid metal patterning accuracy limit of 10 μm. (2) Long preparation time (i.e., long processing time and low efficiency), requiring at least 30 minutes to achieve a vacuum environment in the channels and thus generate a pressure difference. (3) Incomplete filling may occur, especially when there are many corners. Summary of the Invention

[0005] To address the above technical problems, this invention discloses a method for fabricating micro-nano flexible conductive circuits based on ultrasonically driven liquid metal, which solves the problems of low precision, long preparation time, and inability to fill complex channels faced by traditional indirect patterning methods.

[0006] The technical solution adopted by this invention is as follows:

[0007] A method for fabricating micro / nano flexible conductive circuits based on ultrasonically driven liquid metal includes the following steps:

[0008] Step S1: Prepare a mold with a channel pattern and a liquid metal chamber, and add a well-mixed flexible base resin mixture into the mold;

[0009] Step S2: Place the mold filled with the flexible base resin mixture into a vacuum environment to eliminate air bubbles and cure it. Peel the cured flexible base off the mold to obtain an unsealed flexible base.

[0010] Step S3: Seal the unsealed flexible substrate with a base plate to obtain a flexible substrate sealing mold;

[0011] Step S4: Fix the flexible substrate bottom sealing mold on the titanium alloy fixture platform, inject liquid metal into the liquid metal chamber of the flexible substrate bottom sealing mold, use an ultrasonic welding machine to contact the fixture platform on one side of the flexible substrate bottom sealing mold and apply ultrasound, and the liquid metal inside the liquid metal chamber completes the filling of the channel due to ultrasonic drive.

[0012] Step S5: Remove the bottom plate of the flexible substrate sealing mold to obtain the liquid metal flexible conductive circuit.

[0013] The liquid metal is Ga-based liquid metal. Using this technology, the Ga-based liquid metal is liquid at room temperature, possessing fluidity for easy filling. Furthermore, the Ga-based liquid metal contains Ga, which is oxidized by oxygen to form an oxide film. This oxide film can adhere to most substrates, ensuring that the injected liquid metal adheres to the inside of the channel. This prevents the liquid metal from retracting due to its surface tension after entering the channel, thus achieving ultrasonically driven liquid metal filling of ultrafine channels.

[0014] The technical solution of this invention adopts the ultrasonic driving method. By introducing ultrasound as a pressure source, it induces a non-uniform sound pressure distribution inside the liquid metal. The liquid metal is forced from the positive sound pressure region (liquid metal chamber) to the negative sound pressure region (channel) through the sound pressure gradient, thereby driving the liquid metal to fill the micro-nano channel and obtain the conductive circuit of flexible electronics.

[0015] As a further improvement of the present invention, in step S4, the power of the ultrasound is 400-800W.

[0016] As a further improvement of the present invention, in step S4, an ultrasonic head is used to apply ultrasonic waves vertically to the fixture table.

[0017] As a further improvement of the present invention, in step S4, the ultrasonic head is pressed onto the fixture table by the air pressure of the air compressor, and the pressure of the air compressor is 0.3 to 0.5 MPa.

[0018] As a further improvement of the present invention, the distance between the ultrasonic head and the flexible substrate sealing mold is no greater than 100mm. Further, the distance between the ultrasonic head and the flexible substrate sealing mold is 30-75mm.

[0019] As a further improvement of the present invention, in step S3, the bottom of the unsealed flexible substrate is connected to the base plate and cured with PDMS solution to obtain a flexible substrate sealing mold.

[0020] As a further improvement of the present invention, the base plate is a PMMA sheet.

[0021] As a further improvement of the present invention, the flexible substrate resin mixture comprises PDMS and a curing agent. Further, the mass ratio of PDMS to curing agent is 10:0.5-2. Further, the mass ratio of PDMS to curing agent is 10:1.

[0022] As a further improvement of the present invention, the metal clamping platform is made of titanium alloy or aluminum alloy. More specifically, the metal clamping platform is made of titanium alloy.

[0023] This invention discloses a micro-conductive circuit, which is prepared by the method described above for preparing micro-nano flexible conductive circuits based on ultrasonically driven liquid metal.

[0024] This invention discloses a flexible electronic component, including the micro-conductive circuit described above.

[0025] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0026] The technical solution of this invention introduces ultrasound as a pressure source to drive liquid metal to fill micro-nano channels, thereby obtaining a flexible electronic conductive circuit. It can fill submicron level channels as fine as 750nm and can effectively fill multi-channel, interlaced complex channels and blind hole structures. The filling process can be completed in a few seconds, which is fast, accurate, efficient and low cost. Attached Figure Description

[0027] Figure 1 The diagram shows the results of filling complex channels using the prior art injection method of this invention; where a) is the result of multiple channels and b) is the result of interlaced channels.

[0028] Figure 2 This is a flowchart of an embodiment of the present invention, showing an ultrasonically driven liquid metal filling flexible channel.

[0029] Figure 3 These are the speed statistics of the ultrasonic driving method in the embodiments of the present invention, wherein a) is the liquid metal filling speed of the ultrasonic driving method under different ultrasonic power and different channel size; b) is a comparison of the liquid metal filling speed of the ultrasonic driving method and the traditional injection method.

[0030] Figure 4 These are the observation results of different width and height dimensions obtained by the ultrasonic driving method in the embodiments of the present invention, obtained by optical microscopy and Micro-CT scanning; wherein, a) is the observation result of optical microscopy, and b) is the observation result of Micro-CT scanning.

[0031] Figure 5 These are before-and-after comparison images of ultrasonically driven liquid metal filling of a 750nm channel in an embodiment of the present invention; where a) is before ultrasonic application and b) is after ultrasonic application.

[0032] Figure 6 The simulation results of the ultrasonically driven chamber with liquid metal filling channel according to an embodiment of the present invention are shown. Here, a is the sound pressure field distribution diagram inside the chamber and channel, b is the flow velocity distribution and streamline diagram of the liquid metal inside the chamber, and c is the flow velocity and streamline simulation diagram of the liquid metal filling process.

[0033] Figure 7The following are the results of filling complex patterned microchannels using the ultrasonic driving method in the embodiments of the present invention. Among them, a is a schematic diagram and result diagram of the filling process of a 3-channel connected LED array, b is the result of ultrasonic and injection filling of a 32-channel connected microcontroller, c is the result of ultrasonic and injection filling of a Spider-Man pattern with interleaved interconnected channels, and d is the result of ultrasonic and injection filling of a snowflake pattern with planar and blind hole structures.

[0034] Figure 8 This is the result of filling comb-shaped patterned microchannels using an ultrasonic driving method in an embodiment of the present invention.

[0035] Figure 9 These are actual images of the channels obtained by applying ultrasound at different positions and orientations in an embodiment of the present invention. In (a)-(d), the distances from the chamber to the center of the ultrasound head where ultrasound is applied are 40mm, 35mm, 30mm, and 40mm, respectively. Detailed Implementation

[0036] The preferred embodiments of the present invention will be described in further detail below.

[0037] Example 1

[0038] A method for fabricating micro / nano flexible conductive circuits based on ultrasonically driven liquid metal is presented, using PDMS flexible substrate as an example (other flexible substrates can also be used, but PDMS is chosen as an example because its good light transmittance facilitates the demonstration of the filling results). The method employs ultrasonic driving to fabricate flexible liquid metal conductive circuits, such as... Figure 2 As shown, the specific steps include:

[0039] The first step is to print the mold: use 3D printing to prepare a resin mold with channel patterns and liquid metal chambers, and drip a well mixed PDMS liquid (PDMS component to curing agent ratio of 10:1) into the mold.

[0040] The second step is molding: the mold filled with PDMS liquid is placed in a vacuum environment for 0.5 hours to eliminate air bubbles, and then heated in an oven at 60°C for 2 hours to cure the PMDS. After that, the PDMS flexible substrate is peeled off from the resin mold with tweezers to obtain the unsealed PDMS flexible substrate.

[0041] The third step is spin coating and curing: 0.5 mL of PDMS liquid is dropped onto the cut PMMA acrylic sheet (30 mm × 30 mm × 2 mm), and then evenly spread on the PMMA sheet by spin coating at 750 rpm for 1 minute. The PMMA sheet is then placed in a 60°C oven for half an hour to allow the PDMS layer to semi-cured. The unsealed PDMS flexible substrate obtained in the second step is then placed on top of the semi-cured PDMS layer, and both are placed in a 60°C oven for 2 hours to complete the sealing of the PDMS flexible substrate.

[0042] Step 4: Ultrasonic-driven liquid metal filling of the channel: The PMMA sheet carrying the flexible substrate is clamped onto the TC4 fixture using bolts. This fixture is used to conduct high-power ultrasound. Liquid metal is injected into the liquid metal chamber inside the PDMS flexible substrate using a syringe. If the channel size is less than 50μm, the liquid metal will only fill the entire chamber and will not spread along the channel. On the other side of the titanium alloy fixture, 75mm from the PDMS flexible substrate, ultrasound (400-800W) is applied using an ultrasonic welder. The liquid metal inside the chamber is then driven by the ultrasound to fill the channel.

[0043] Specifically, to ensure effective ultrasonic transmission, the ultrasonic head is pressed onto the fixture by an air compressor, and ultrasonic waves are applied through the vertical vibration of the ultrasonic head. The air compressor pressure needs to reach at least 0.3 MPa to ensure effective ultrasonic transmission and guarantee the quality of the liquid metal filling channel. However, excessively high air compressor pressure will hinder the vibration of the ultrasonic head, thus affecting the experimental results. The recommended air compressor pressure for the experiment is 0.3–0.5 MPa.

[0044] The fifth step involves using a scalpel to peel the PDMS flexible substrate, which has been infused with liquid metal, off the PMMA sheet and then making necessary cuts to obtain the liquid metal flexible electronics.

[0045] Traditional injection molding methods can only fill channels up to 50 micrometers in size; sizes smaller than this will damage the substrate. However, the ultrasonic-driven method of this invention can generate a sound pressure gradient within the liquid metal, thereby driving the liquid metal to flow. Therefore, it can overcome the 50-micrometer limitation and fill channels as small as 750 nanometers.

[0046] Traditional indirect methods force liquid metal into the channel by creating a pressure difference between the inside and outside of the channel. Due to the high surface tension of liquid metal and its non-wetting nature of most substrates, the smaller the channel size, the greater the required pressure difference. The ultrasonic method, however, induces a non-uniform sound pressure distribution within the liquid metal. This sound pressure gradient forces the liquid metal from the positive sound pressure region (liquid metal chamber) to the negative sound pressure region (channel). Simultaneously, the anchoring and adhesion effect of the Ga-based liquid metal oxide film ensures that the liquid metal does not retract due to its own surface tension after entering the channel, thus achieving ultrasonically driven liquid metal filling of ultra-fine channels. Furthermore, because the channel interior remains a negative sound pressure region regardless of the complexity of the pattern, the liquid metal does not flow out along the path of least resistance as in injection methods.

[0047] Using the above steps, a liquid metal-filled channel was fabricated to create flexible electronic circuits. The channel was completely filled without voids or other defects, resulting in high processing efficiency. In this embodiment, channels with a length of 8 mm and equal width and height but different dimensions (width and height dimensions are 2 μm, 10 μm, 25 μm, 50 μm, and 100 μm, respectively) were obtained.

[0048] In this embodiment, ultrasonic power of 400W, 600W, and 800W was used to drive the liquid metal filling, and the filling speed was statistically analyzed. Specific results are as follows: Figure 3 As shown in Figure a, its filling speed is compared with that of the traditional injection method, such as... Figure 3 As shown in b, the speed statistics show that the filling speed of the ultrasonic-driven method increases with the increase of the applied ultrasonic power and the increase of the channel size. The slowest filling speed is 2.14 mm / s when filling a 10 μm channel with 200W ultrasound, which is on the order of mm / s. The fastest filling speed is 46.22 mm / s when filling a 100 μm channel with 800W ultrasound.

[0049] The filling speeds of ultrasonic-driven and traditional injection methods were compared under different channel sizes, such as... Figure 3 As shown in b, it can be seen that although the injection method has an advantage in terms of speed for large channels (>100μm), the speed of the ultrasonic-driven method is close to that of the channel size of about 75μm (~48mm / s). When the channel size is <50μm, the injection method is no longer applicable because excessive pressure will damage the channel and cause liquid metal leakage. However, the ultrasonic method can still perform the task and has a faster filling speed.

[0050] Next, the filling effect of ultrasonically driven liquid metal filling channels was observed. Channels with width and height dimensions of 2μm, 10μm, 25μm, 50μm, and 100μm were selected respectively, and observed using an optical microscope. The results are as follows. Figure 4 As shown in Figure a, the results observed using Micro-CT scanning are as follows: Figure 4 As shown in b, the optical microscopy results indicate that the liquid metal completely fills the channels, and the Micro-CT scan results prove that the liquid metal conductive circuit prepared by the ultrasonic driving method has no defects or pores, indicating that the ultrasonic driving method can be used as a reliable method to prepare liquid metal flexible conductive circuits.

[0051] Channels with a diameter of 750 nm and a length of 200 μm were printed using the Nanoscribe two-photon printer. Liquid metal can also fill nanoscale flexible channels under ultrasonic excitation, and the filling results are shown below. Figure 5 As shown, the channel is completely filled. This result represents the highest accuracy achievable to date in published indirect patterning liquid metal methods.

[0052] Ultrasound can cause uneven distribution of sound pressure inside liquid metal. The sound pressure gradient generates a force that drives the liquid metal to flow. The simulation results of the specific process of ultrasound driving the liquid metal to fill the channel inside the chamber are as follows: Figure 6 As shown. The ultrasonic power applied in the simulation was 800W, and the other conditions were the same as in the experiment above. Figure 6 'a' represents the sound pressure field distribution inside the chamber and channel. The liquid metal chamber is square, and the long, rod-shaped channel is 100 μm in size. When ultrasound is applied, the sound pressure distribution becomes uneven, with the maximum sound pressure value occurring inside the liquid metal chamber (1.3 * 10⁻⁶). 5 The sound pressure gradient, with a minimum at the channel exit (0 Pa), drives the liquid metal to fill the channel. For example... Figure 6 As shown in Figure b, the flow velocity distribution and streamline diagram of the liquid metal inside the chamber are shown. The streamlines represented by the white arrows can be used to observe the movement trajectory of the liquid metal inside the chamber. The flow trajectory of the liquid metal at the bottom layer points to the channel, which further illustrates that the sound pressure drives the flow of liquid metal. Figure 6 c represents the liquid metal filling process, where the flow velocity and streamlines at the interface between the leading edge and the air are simulated. The peak flow velocity is 60 mm / s, which is higher than the statistical average velocity of 46.22 mm / s. This is because the surface of gallium-based liquid metal is oxidized in the atmospheric environment, forming an oxide film that hinders the flow of liquid metal.

[0053] Example 2

[0054] Microchannels with complex patterns are filled using ultrasonically driven liquid metal.

[0055] Microchannels with different complex pattern structures were prepared using the method in Example 1 and filled using ultrasonication. These complex structures included: a 3-channel LED array, a 32-channel microcontroller interconnection pattern, a Spider-Man pattern with interlaced channels, and a snowflake pattern with planar and blind hole structures, etc. The results are shown in Figure 1. Figure 7 As shown, these patterns are effectively filled, demonstrating that the ultrasonic method can fabricate complex conductive circuits that traditional indirect methods cannot, further illustrating the universality of the ultrasonic-driven method.

[0056] Specifically, Figure 7 Inside the two PDMS substrates in component a are three straight channels of different lengths. One end of each channel is connected to a liquid metal chamber, and the other end is connected to the LED pins. A copper wire is used to connect the two liquid metal chambers, and a constant 3V voltage is applied. After ultrasound is applied, the three channels are filled almost simultaneously, and the LEDs are connected to the LED pins through the outlet, thus illuminating the LED array.

[0057] Figure 7b is a rectangular ring-shaped liquid metal chamber with 32 independent channels. One end of each channel is connected to the liquid metal chamber, and the other end is connected to a 32-pin microcontroller. Within 1 second of applying ultrasound, all channels are filled, forming an electrical interconnection with the 32-pin microcontroller. In contrast, the injection method only connects 5 channels, and the leaked liquid metal agglomerates into spheres due to high surface tension, causing short circuits and circuit failure. The successful filling of these two multi-channel methods demonstrates that the ultrasonic method has the characteristics of large-scale mass production in the fabrication of flexible circuits.

[0058] Interlocking liquid metal structures have high application value in lightweight electromagnetic shielding. This embodiment designs a Spider-Man pattern with a similar structure and uses ultrasonic filling, as shown in the following figure. Figure 7 As shown in Figure c, after 1 second of ultrasound application, 70% of the volume of the interlaced pattern was effectively filled by liquid metal, and the liquid metal completely filled the pattern at 1.2 seconds. In contrast, the injection method could only fill less than 30% of the channel volume and caused leakage of liquid metal.

[0059] Furthermore, this embodiment also designs a snowflake pattern that simultaneously possesses a planar structure and a blind-hole structure. It includes a central planar hexagonal star pattern and six branch channels, each containing four blind-hole structures. Under ultrasonic action, liquid metal can completely fill the pattern within 1 second. Figure 7 As shown in d. In contrast, injection molding not only fails to fill blind via structures, but also cannot achieve complete and effective filling of sharp areas in planar patterns. Meanwhile, planar structures of liquid metal can be used for hermetically sealed packaging of flexible devices (such as flexible batteries and capacitors), while blind via structures can be applied to the electrical interconnects of future three-dimensional integrated circuits, both of which have high application value.

[0060] Finally, this embodiment designs a comb-like pattern, which has two vertical channels connecting to the outside world, resulting in the following: Figure 8 As shown, under the action of ultrasound, liquid metal can overcome gravity to completely fill the channel, further illustrating that the ultrasonic method can be used in the future to construct three-dimensional liquid metal flexible conductive circuits.

[0061] Example 3

[0062] Based on Example 1, the location where ultrasound was applied in step four was changed. Ultrasound was applied at different locations and orientations from the channel, and the results are as follows. Figure 9 As shown, it can be seen that the channels are filled.

[0063] Furthermore, applying ultrasound at a distance of 75mm from the channel also achieved channel filling, and... Figure 9The effect is the same. It can be seen that within a range of less than 75mm, the different distances between the liquid metal chamber and the ultrasonic point, as well as the different directions of the channel, will not affect the experimental results. The liquid metal can fill the channel under the action of ultrasound.

[0064] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A method for fabricating micro / nano flexible conductive circuits based on ultrasonically driven liquid metal, characterized in that: Includes the following steps: Step S1: Prepare a mold with a channel pattern and a liquid metal chamber, and add a well-mixed flexible base resin mixture into the mold; Step S2: Place the mold filled with the flexible base resin mixture into a vacuum environment to eliminate air bubbles and cure it. Peel the cured flexible base from the mold to obtain an unsealed flexible base. Step S3: Seal the unsealed flexible substrate with a base plate to obtain a flexible substrate sealing mold; Step S4: Fix the flexible substrate bottom sealing mold on the metal fixture table, inject Ga-based liquid metal into the liquid metal chamber of the flexible substrate bottom sealing mold, use an ultrasonic welding machine to contact the fixture table on one side of the flexible substrate bottom sealing mold and apply ultrasound, and the Ga-based liquid metal inside the liquid metal chamber completes the filling of the channel due to ultrasonic drive. Step S5: Remove the bottom plate of the flexible substrate sealing mold to obtain the liquid metal flexible conductive circuit.

2. The method for fabricating micro / nano flexible conductive circuits based on ultrasonically driven liquid metal according to claim 1, characterized in that: In step S4, the power of the ultrasound is 400-800W.

3. The method for fabricating micro / nano flexible conductive circuits based on ultrasonically driven liquid metal according to claim 2, characterized in that: In step S4, an ultrasonic head is used to apply ultrasonic waves vertically to the fixture table.

4. The method for fabricating micro / nano flexible conductive circuits based on ultrasonically driven liquid metal according to claim 3, characterized in that: In step S4, the ultrasonic head is pressed onto the fixture table by the air pressure of the air compressor, and the air compressor pressure is 0.3 to 0.5 MPa.

5. The method for fabricating micro / nano flexible conductive circuits based on ultrasonically driven liquid metal according to claim 4, characterized in that: The distance between the ultrasonic head and the flexible substrate sealing mold is no more than 100mm.

6. The method for fabricating micro / nano flexible conductive circuits based on ultrasonically driven liquid metal according to claim 4, characterized in that: In step S3, the bottom of the unsealed flexible substrate is connected to the base plate and cured using a flexible substrate resin mixture to obtain a flexible substrate sealing mold.

7. The method for fabricating micro / nano flexible conductive circuits based on ultrasonically driven liquid metal according to any one of claims 1 to 6, characterized in that: The base plate is a PMMA sheet; the flexible substrate resin mixture contains PDMS and a curing agent.

8. The method for fabricating micro / nano flexible conductive circuits based on ultrasonically driven liquid metal according to any one of claims 1 to 6, characterized in that: The metal clamping platform is made of titanium alloy or aluminum alloy.

9. A micro-conductive circuit, characterized in that: The micro / nano flexible conductive circuit was prepared using the method for preparing micro / nano flexible conductive circuits based on ultrasonically driven liquid metal as described in any one of claims 1 to 8.

10. A flexible electronic component, characterized in that: Including the micro conductive circuit as described in claim 9.

Images