Display panel, method of manufacturing the same, and display device

Abstract

The application discloses a display panel, a preparation method thereof and a display device. The method comprises the following steps: providing a substrate, the substrate has opposite first and second surfaces, and the first surface has an edge region; forming a plurality of first pads distributed at intervals on the edge region; forming a plurality of first wires on the substrate, the first wires extend from the first surface to the second surface, the first wires are electrically connected to the first pads one by one, the first wires have a third surface on a side away from the substrate, the first wires have opposite first and second side surfaces in a first direction, the first direction is perpendicular to the extension direction of the first wires and parallel to the first surface; and forming a first protective film on the first wires, the first protective film covers the third surface, the first side surface and the second side surface. The problem that the side wires of the display panel in the prior art are prone to being corroded in a process is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] In the prior art, the commonly used schemes for manufacturing side wiring mainly include laser direct engraving and mask (DFR, Dry Film Resist) patterning scheme. The efficiency of laser engraving is low, and there is a risk of damaging the circuit. The DFR scheme also faces the problem of positive and negative surface alignment deviation, and the DFR will deform, which may cause the overall side wiring to fail to achieve small line width and line spacing. The scheme of integrating side wiring and back fan-out wiring can solve the above-mentioned back patterning process difficulty and back alignment bottleneck, but the scheme still has the following problems: 1. DFR has side wiring metal corrosion in the stripping process, and the stripped metal sticks back, causing the side wiring to be open circuit; 2. The side metal wiring is in a bare state for a long time, which is easy to oxidize in the subsequent process, resulting in poor product reliability. SUMMARY

[0003] The present application provides a display panel, a preparation method thereof and a display device to solve the problem that the side wiring of the display panel in the prior art is easy to be corroded in the process.

[0004] According to one aspect of the present application, a preparation method of a display panel is provided, which comprises: providing a substrate, the substrate having opposite first and second surfaces, the first surface having an edge region; forming a plurality of first pads spaced apart on the edge region; forming a plurality of first wires on the substrate, the first wires extending from the first surface to the second surface, the first wires being electrically connected one by one with the first pads, the first wires having a third surface on the side away from the substrate, the first wires having opposite first and second side surfaces in a first direction, the first direction being perpendicular to the extension direction of the first wires and parallel to the first surface; forming a first protective film on the first wires, the first protective film covering the third surface, the first side surface and the second side surface. The above-mentioned first protective film covers the exposed surface of the first wire in all directions, ensuring that the first wire will not be corroded in the subsequent preparation process.

[0005] According to another aspect of the present application, a display panel is also provided, comprising: a substrate having opposite first and second surfaces, the first surface having an edge region; a plurality of first pads located in the edge region; a plurality of first traces extending from the first surface to the second surface, the first traces being electrically connected to the first pads one by one, the first traces having a third surface on a side away from the substrate, the first traces having opposite first and second side surfaces in a first direction, the first direction being perpendicular to a direction of extension of the first traces and parallel to the first surface; and a first protective film covering the third surface, the first side surface and the second side surface. The first protective film covers the exposed surfaces of the first traces in all directions, avoiding oxidation of the first traces due to long exposure.

[0006] According to another aspect of the present application, a display device is also provided, comprising the display panel as described above.

[0007] The present application provides a method for manufacturing a display panel, the method comprising: forming a plurality of first traces on a substrate, the first traces extending from a first surface to a second surface, the first traces being electrically connected to first pads in an edge region of the substrate one by one to transmit electrical signals from the first surface to the second surface; and forming a first protective film on the first traces, the first protective film covering the exposed surfaces of the first traces in all directions to prevent the first traces from being corroded in subsequent manufacturing processes, thereby solving the problem that the side traces of the display panel are easily corroded in the process in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0008] The accompanying drawings, which form a part of the present application, are intended to provide further understanding of the present application and are incorporated herein for a purpose of explanations. The illustrative embodiments of the present application, together with their description, are employed to explain the application and do not constitute improper limitations to the application. In the drawings:

[0009] Figure 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application;

[0010] Figure 2 is a cross-sectional structure of a substrate after the substrate is provided and the first pads are formed on the substrate in the method for manufacturing a display panel in Figure 1

[0011] Figure 3 is a cross-sectional structure of a substrate after the second pads are formed on the second surface of the substrate provided in Figure 2

[0012] Figure 4 is a cross-sectional structure of a substrate after the second pads are formed on the second surface of the substrate provided in Figure 1 ​​The preparation method of the middle display panel, the structure schematic diagram of the substrate after the mask is provided and the patterning treatment is performed on the mask;

[0013] Figure 5 The mask in the Figure 4 is attached to the structure in the Figure 3 , and the cross-sectional structure schematic diagram of the substrate after the mask is attached to the structure in the ;

[0014] Figure 6 Figure 4 The mask in the Figure 3 is attached to the structure in the , and the cross-sectional structure schematic diagram of another substrate after the mask is attached to the structure in the

[0015] ; Figure 7 Figure 5 The first wire is formed in the hollow area of the mask in the , and the cross-sectional structure schematic diagram of the substrate after the first wire is formed in the hollow area of the mask in the

[0016] ; Figure 8 Figure 6 The first wire is formed in the hollow area of the mask in the , and the cross-sectional structure schematic diagram of the substrate after the first wire is formed in the hollow area of the mask in the

[0017] ; Figure 9 Figure 5 The third protective film is placed on the structure in the , and the cross-sectional structure schematic diagram of the substrate after the third protective film is placed on the structure in the

[0018] ; Figure 10 Figure 3 The first sub-wire is formed on the second surface on the structure in the , and the cross-sectional structure schematic diagram of the substrate after the mask is attached to the structure in the

[0019] ; Figure 11 Figure 10 The second sub-wire is formed in the hollow area of the mask in the , and the cross-sectional structure schematic diagram of the substrate after the second sub-wire is formed in the hollow area of the mask in the

[0020] ; Figure 12 Figure 11 The second sub-wire is formed in the , and the cross-sectional structure schematic diagram of another substrate after the second sub-wire is formed in the

[0021] ; Figure 13 Figure 11 The second sub-wire is formed in the , and the cross-sectional structure schematic diagram of another substrate after the second sub-wire is formed in the

[0022] ; Figure 14 Figure 12 The etching treatment is performed on the mask on both sides of the first wire in the , and the cross-sectional structure schematic diagram of the substrate after the etching treatment is performed on the mask on both sides of the first wire in the

[0023] ; Figure 15 Figure 14 The first protective film is formed on the structure in the , and the cross-sectional structure schematic diagram of the substrate after the first protective film is formed on the structure in the

[0024] ; Figure 16 is the cross-sectional structure schematic diagram of the substrate after the first protective film is formed on the structure in theFigure 9 FIG. 8 is a schematic view of a cross-sectional structure of a display panel according to an embodiment of the present application;

[0025] Figure 17 FIG. 8 is a schematic view of a cross-sectional structure of a display panel according to an embodiment of the present application;

[0026] Figure 18 FIG. 8 is a schematic view of a cross-sectional structure of a display panel according to an embodiment of the present application;

[0027] Figure 19 FIG. 8 is a schematic view of a cross-sectional structure of a display panel according to an embodiment of the present application; Figure 17 FIG. 8 is a schematic view of a cross-sectional structure of a display panel according to an embodiment of the present application;

[0028] Figure 20 FIG. 8 is a schematic view of a cross-sectional structure of a display panel according to an embodiment of the present application;

[0029] Figure 21 FIG. 8 is a schematic view of a cross-sectional structure of a display panel according to an embodiment of the present application;

[0030] In the above description, reference can be made to the following reference signs:

[0031] 1, display device; 2, display area; 10, substrate; 20, first pad; 30, first wire; 31, first sub-wire; 32, second sub-wire; 33, first line segment; 34, second line segment; 40, first protective film; 50, second pad; 60, mask; 61, hollow area; 70, second protective film; 80, third protective film. DETAILED DESCRIPTION

[0032] It should be noted that the embodiments and features in the present application can be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0033] In order to enable persons skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by persons skilled in the art without creative work should fall within the protection scope of the present application.

[0034] It should be noted that the terms "first", "second" and the like in the description and in the claims of the present application and above accompanying drawings are used to distinguish between similar objects and not necessarily describe a particular sequential or chronological order. It should be understood that the data thus used can be interchanged, where appropriate, so that the embodiments of the present application described herein can be implemented in any appropriate order. Moreover, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, processes, methods, systems, products, or devices that include a list of steps or units without being necessarily limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to such processes, methods, products, or devices.

[0035] As mentioned in the background, the scheme of integrating the side edge trace and the back fan-out trace can solve the above-mentioned difficulties in back patterning process and back alignment bottleneck, but the scheme still has the following problems: 1. DFR has side edge trace metal corrosion in the stripping process, and the stripped metal is re-stuck, resulting in a broken circuit of the side edge trace; 2. The side edge metal trace is in a bare state for a long time, which is easy to oxidize in the subsequent process, resulting in poor product reliability. In view of the prior art, the present application provides a display panel, a preparation method thereof and a display device.

[0036] According to one embodiment of the present application, as shown in Figure 1 A preparation method of a display panel is provided, comprising:

[0037] Step S101: providing a substrate, the substrate having opposite first and second surfaces, the first surface having an edge region;

[0038] Step S102: forming a plurality of first pads spaced apart on the edge region;

[0039] Step S103: forming a plurality of first traces on the substrate, the first traces extending from the first surface to the second surface, the first traces being electrically connected to the first pads one by one, the first traces having a third surface on a side away from the substrate, the first traces having opposite first and second side surfaces in a first direction, the first direction being perpendicular to the extension direction of the first traces and parallel to the first surface;

[0040] Step S104: forming a first protective film on the first traces, the first protective film covering the third surface, the first side surface and the second side surface.

[0041] By adopting the preparation method of the display panel, a plurality of first wires are formed on the substrate, the first wires extend from the first surface to the second surface, the first wires are electrically connected with the first pads in the edge region of the substrate one by one, the electrical signals on the first surface of the substrate are transmitted to the second surface, the first protective film is formed on the first wires, and the first protective film covers the exposed surface of the first wires in all directions, so that the first wires are prevented from being corroded in subsequent preparation processes, and the problem that the side wires of the display panel are easily corroded in the process in the prior art is solved.

[0042] Exemplary embodiments of the preparation method of the display panel provided in the present application will be described in more detail below. However, these exemplary embodiments can be implemented in various different forms, and should not be interpreted as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided in order to make the present application complete and comprehensive, and to fully convey the ideas of these exemplary embodiments to those skilled in the art.

[0043] First, as shown in FIG. 1, step S101 is performed: providing a substrate 10, the substrate 10 having opposite first and second surfaces, and the first surface having an edge region. Figure 2

[0044] Specifically, the position of the substrate 10 closest to the edge is the edge region of the substrate 10, Figure 2 Only a partial cross-sectional view is shown in the figure. The substrate 10 can be formed of any one of polyimide (PI), polycarbonate (PC), polyether sulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), glass fiber reinforced plastic (FRP), glass, and ceramic, and the conductive film can be made of organic and flexible materials, which are not limited in the present application.

[0045] After the step of providing the substrate, as shown in FIG. 2, step S102 is performed: forming a plurality of first pads 20 spaced apart on the edge region. Figure 2

[0046] Specifically, a plurality of first pads 20 spaced apart are arranged in the edge region, and the first pads 20 are used to collect the electrical signals generated on the first surface and transmit the electrical signals to other devices through the subsequently formed first wires.

[0047] In some optional embodiments, as shown in FIG. 3, Figure 3 and Figure 4 ​​As shown, before the step of forming the plurality of first traces, the preparation method further comprises: forming a plurality of second pads 50 on the second surface of the substrate 10, the second pads 50 corresponding to the first pads 20 one by one; providing a preliminary mask and patterning the preliminary mask to form a mask 60, the mask 60 having a plurality of hollow regions 61.

[0048] In the optional embodiment, as shown, Figure 3 after the first pads 20 are formed, a plurality of second pads 50 are formed on the second surface of the substrate 10, each second pad 50 corresponding to a first pad 20. Figure 4 As shown, a preliminary mask is prepared, and the preliminary mask is patterned to obtain a mask 60 having a plurality of hollow regions 61, each hollow region 61 corresponding to a first pad and a second pad.

[0049] After the step of forming the plurality of first pads, as shown, Figures 5 to 9 a step S103 is performed: forming a plurality of first traces 30 on the substrate 10, the first traces 30 extending from the first surface to the second surface, the first traces 30 corresponding to the first pads 20 one by one and being electrically connected thereto, the first traces 30 having a third surface on the side away from the substrate 10, the first traces 30 having opposite first and second side surfaces in a first direction, the first direction being perpendicular to the extension direction of the first traces 30 and parallel to the first surface.

[0050] Specifically, the plurality of first traces 30 are formed on the substrate 10 having the first pads 20 and the second pads 50, each first trace 30 having an electrical connection relationship with a first pad 20 and a second pad 50, and the first trace 30 also covers part of the first pad 20 and part of the second pad 50, making the electrical connection more stable.

[0051] In some optional embodiments, as shown, Figures 5 to 9As shown, the step of forming the plurality of first traces 30 comprises: attaching the mask 60 to the substrate 10, the substrate 10 further has a third side, the third side connects the first surface and the second surface, the mask 60 covers the third side, part of the second pads 50 and part of the first pads 20, the hollow regions 61 correspond to the second pads 50 one by one, the hollow regions 61 extend from the first surface to the second surface, the projection of the mask 60 on the second surface has a first overlapping region with the projection of the second pads 50 on the second surface; depositing a conductive material on the mask 60, part of the conductive material covers the mask 60, and another part of the conductive material covers the hollow regions 61, the conductive material covering the hollow regions 61 forms the first traces 30.

[0052] As shown in the optional embodiments, Figure 5 and Figure 6 the mask 60 is attached to the substrate 10, the mask 60 covers the third side of the substrate, part of the second pads 50 and part of the first pads 20, so that the hollow regions 61, the first pads 20 and the second pads 50 are aligned. The projection of the mask 60 on the first surface has an overlapping region with the projection of the first pads 20 on the first surface, and the projection of the mask 60 on the second surface has the first overlapping region with the projection of the second pads 50 on the second surface. Before the mask 60 is attached, a second protective film 70 is also formed on the first surface and the second surface of the substrate 10 to protect other areas of the display panel from the heat generated when the mask 60 is attached.

[0053] As shown in some optional embodiments, Figure 7 before the step of forming the plurality of first traces, the preparation method further comprises: covering the second protective film 70 on part of the second surface and part of the first surface; placing a third protective film 80 on the substrate 10, the projection of the third protective film 80 on the second surface has a second overlapping region with the projection of the second protective film 70 on the second surface, and the projection of the third protective film 80 on the second surface has a third overlapping region with the projection of the mask 60 on the second surface, the third overlapping region is located in the first overlapping region.

[0054] As shown in the optional embodiments, Figure 7As shown, before attaching the mask 60 to the substrate 10, a second protective film 70 is formed on the first and second surfaces of the substrate 10. After the second protective film 70 is formed, the mask 60 is attached to the substrate 10. During the process of attaching the mask 60, hot pressing or other methods are used, which will generate high temperature. The second protective film 70 can protect the areas where the mask 60 does not need to be attached when attaching the mask 60, and prevent the high temperature from having an adverse effect on other areas. Figure 7 The first pad 20 and the second pad 50 in Figure 3 The description is consistent with that in the text.

[0055] In the above optional implementations, such as Figure 8 and Figure 9 As shown, before depositing conductive material on the mask 60 to form the first trace, a third protective film 80 is placed on the second protective film 70 and the mask 60 on the second surface. The third protective film 80 protects the second pad 50 from conductive material deposition. To ensure the cutout area is completely filled during conductive material deposition, forming a more complete first trace, the contact area between the third protective film 80 and the mask 60 is very small; that is, the third overlapping area is within the first overlapping area and occupies a small proportion. The conductive material covers the mask 60 and fills the cutout area to form the first trace 30. Figure 8 A cross-sectional view of the display panel for the first trace 30. Figure 9 This is a cross-sectional view of another structure of the display panel for the first trace 30. Figure 8 and Figure 9 substrate 10 and Figure 7 The structure is consistent with that in the text.

[0056] In some alternative implementations, such as Figures 10 to 12 As shown, the step of forming multiple first traces 30 includes: forming multiple first sub-traces 31 on the second surface, wherein each first sub-trace 31 is electrically connected to a corresponding second pad 50; attaching a mask 60 to the substrate 10, wherein the substrate 10 also has a third side surface, the third side surface connecting the first surface and the second surface, the mask 60 covering the third side surface, a portion of the second pad 50 and a portion of the first pad 20, wherein each first sub-trace 31 corresponds to a cutout area, the cutout area extending from the first surface to the second surface; forming second sub-traces 32 on the first surface and the third side surface, wherein the second sub-traces 32 are located in the cutout area, and the second sub-traces 32 are electrically connected to the first sub-traces 31 and the first pad 20 respectively, wherein the first sub-traces 31 and the second sub-traces 32 form the first traces 30.

[0057] In the optional embodiment, as shown in Figure 10 The first sub-wire 31 is formed on the second surface, and the first sub-wire 31 is in contact with the side surface of the second pad 50 away from the substrate 10 to realize electrical connection. The mask 60 is attached to the third side surface and the first surface of the substrate 10, so that the mask 60 is in contact with the side surface of the first pad 20 away from the substrate 10, and the first wire 30 formed later is in contact with the side surface of the first pad 20 away from the substrate 10 to realize electrical connection. As shown in Figure 11 and Figure 12 The conductive material is deposited on the mask 60 to form the second sub-wire 32 in the hollow area, and the first sub-wire 31 and the second sub-wire 32 form the first wire 30.

[0058] In some optional embodiments, as shown in Figures 12 to 15 Before the step of forming the first protective film and after the step of forming the first wire 30, the preparation method further includes: etching the mask 60 on both sides of the first wire 30, the length of the first wire 30 in the first direction is less than the length of the hollow area in the first direction, and there is a gap between the first wire 30 and the mask 60 on both sides of the first wire 30.

[0059] In the optional embodiment, as shown in Figure 12 and Figure 13 As shown in Figure 12 and Figure 13 are cross-sectional views of forming the second sub-wire 32 or the first wire, and at this time, there is basically no gap between the second sub-wire 32 or the first wire and the mask 60. As shown in Figure 14 and Figure 15 The mask 60 on both sides of the second sub-wire 32 or the first wire 30 is etched by using an ashing process, so that as shown in Figure 15 There is a gap between the second sub-wire or the first wire 30 and the mask 60, that is, the width of the hollow area is expanded, so that the width W2 of the hollow area after etching is greater than the width W1 of the second sub-wire or the first wire 30. The shape of the mask 60 is preferably set to be wide at the top and narrow at the bottom, so that the conductive material can be better cut off to form the first wire 30 in the hollow area during the formation of the first electrode, and the conductive material is prevented from adhering to the side wall of the mask 60. Figures 12 to 15 The substrate 10 and the first pad 20 are the same as described in Figure 2

[0060] ​If the first trace is integrally formed, that is, the first trace is formed on the first surface, the third side and the second side at one time, the mask on both sides of the first trace needs to be narrowed, if the first sub-trace on the second surface is formed first, and then the second sub-trace on the first surface and the third side is formed, only the mask on both sides of the second sub-trace needs to be narrowed.

[0061] In the optional embodiment described above, the ashing process described above can make the upper and lower widths of the mask be narrowed by the same proportion, and the upper and lower widths can be narrowed by 1 μm to 2 μm.

[0062] After the step of forming the plurality of first traces, as shown in Figure 15 Step S104 is performed: a first protective film 40 is formed on at least the first trace 30, and the first protective film 40 covers the third surface, the first side and the second side of the first trace 30.

[0063] Specifically, after the mask 60 is narrowed, it can be ensured that the first protective film 40 formed does not adhere to the mask 60, and the first protective film 40 is prevented from being torn when the mask 60 is removed. The first protective film 40 is formed on the mask 60, so that the first protective film 40 covers the third surface, the first side and the second side of the first trace 30, that is, the first protective film 40 wraps the third surface, the first side and the second side of the first trace 30 exposed, which prevents the first trace 30 from being oxidized for a long time in the subsequent process, and improves the quality of the display panel. In the subsequent process of peeling off the mask 60, the first trace 30 can be corroded, and the first protective film 40 can protect the first trace 30 from being corroded, so as to prevent the side trace of the display panel from being broken.

[0064] In the optional embodiment described above, in the process of depositing the first protective film, in order to form better protection for the first trace, a person skilled in the art can reasonably select the angle of the deposition process according to the actual situation.

[0065] In some optional embodiments, as shown in Figure 16 The step of forming the first protective film 40 includes: moving the third protective film 80 to a target position along a second direction, so that the first overlap region is located in the third overlap region, the second direction is a direction in which the second surface extends to the first surface; and depositing a material of the first protective film 40 on the first trace 30 to form the first protective film 40.

[0066] In the optional embodiment described above, as shown in Figure 16 The third protective film 80 is moved along Figure 16The first protective film 40 is formed on the third surface, the first side surface and the second side surface of the first trace 30, and the first protective film 40 covers the exposed surface of the first trace 30. The first protective film 40 is formed on the third surface, the first side surface and the second side surface of the first trace 30, and the first protective film 40 covers the exposed surface of the first trace 30. The distance between the second pad 50 and the first protective film 40 in the second direction can be 3-5 μm. Figure 16 The substrate 10, the first pad 20 and the second protective film 70 in the display panel of the present application are consistent with the description in the Figure 8 The substrate 10, the first pad 20 and the second protective film 70 in the display panel of the present application are consistent with the description in the

[0067] According to another embodiment of the present application, as shown in Figure 17 and Figure 18 Further provided is a display panel, the substrate 10 has opposite first and second surfaces, the first surface has an edge region; a plurality of first pads 20 are located in the edge region; a plurality of first traces 30 extend from the first surface to the second surface, the first traces are electrically connected to the first pads one by one, the first traces 30 have a third surface on the side away from the substrate 10, the first traces 30 have opposite first and second side surfaces in the first direction, the first direction is perpendicular to the direction of extension of the first traces 30 and parallel to the first surface; and a first protective film 40 covers the third surface, the first side surface and the second side surface.

[0068] By forming a plurality of first traces on the substrate, the first traces extend from the first surface to the second surface, the first traces are electrically connected to the first pads in the edge region of the substrate one by one, the electrical signal on the first surface of the substrate is transmitted to the second surface, the first protective film is formed on the first traces, and the first protective film covers the exposed surface of the first traces in all directions, so that the first traces are not corroded in the subsequent preparation process, and the problem that the side traces of the display panel are easily corroded in the process in the prior art is solved.

[0069] The above is the core idea of the present application, and the technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0070] In the display panel in the embodiments of the present application, as shown in Figure 17 and Figure 18As shown, a first pad 20 is arranged at an edge region of a first surface of a substrate 10, a first trace 30 is formed on the substrate 10, the first trace 30 extends from the first surface to a second surface to form a side trace of a display panel, a first protective film 40 is formed on the first trace 30, the first protective film 40 covers the third surface, the first side surface and the second side surface of the first trace 30 to prevent the first trace 30 from being oxidized due to long-time contact with air and from being corroded by other solutions in subsequent manufacturing processes, thereby improving the quality of the display panel.

[0071] The substrate 10 can be formed of any one of polyimide (PI), polycarbonate (PC), polyether sulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), glass fiber reinforced plastic (FRP), glass and ceramic, and the conductive film can be formed of organic and flexible materials, which are not limited in the present application.

[0072] In some optional embodiments, as shown in Figure 19 As shown, the thickness of the first protective film 40 covering the third surface is T1, the thickness of the first protective film 40 covering the first side surface in the first direction is T2, and the thickness of the first protective film 40 covering the second side surface in the first direction is T3, T1>T2, T2=T3.

[0073] In the above optional embodiments, as shown in Figure 19 As shown, the first protective film 40 covers all the surfaces of the first trace 30, so that the thickness of the first protective film 40 on the third surface is T1, the thickness of the first protective film 40 on the first side surface is T2, and the thickness of the first protective film 40 on the second side surface is T3. T1 is the thickest, T2 is substantially the same as T3, T1 can be 0.8 μm-1.1 μm, T2 and T3 can be 0.3 μm-0.8 μm, and the thickness of the first trace 30 can be 1 μm-2.5 μm. Figure 19 The substrate 10 and the first trace 30 in the above embodiments are consistent with the description of Figure 17 .

[0074] In some optional embodiments, as shown in Figure 20As shown, the display panel further includes a plurality of second pads 50, the substrate 10 further has a third side surface connecting the first surface and the second surface, the second pads 50 are spaced apart on the second surface, the first traces 30 on the second surface have first segments 33 and second segments 34, the first segments 33 are electrically connected to the first traces 30 on the third side surface, the second segments 34 include fan-out traces, and the second pads 50 are electrically connected to the fan-out traces one by one.

[0075] In the optional embodiments, as shown in Figure 20 the first traces 30 on the second surface include the first segments 33 and the second segments 34, the second segments 34 include the fan-out traces, the first segments 33 and the first traces 30 on the first surface and the third side surface transmit the electrical signals from the first pads 20 on the first surface to the fan-out traces, the fan-out traces are electrically connected to the second pads 50, and the second pads 50 are further electrically connected to other devices or modules to transmit the electrical signals from the first pads 20 again, so as to realize the side traces.

[0076] In some optional embodiments, as shown in Figure 20 the projection of the fan-out traces on the second surface and the projection of the second pads 50 on the second surface have a fourth overlapping area, and the projection of the first protective film 40 on the second surface and the projection of the second pads 50 on the second surface have no overlapping area.

[0077] In the optional embodiments, as shown in Figure 20 the fan-out traces or cover part of the second pads 50 to establish a good electrical connection relationship with the second pads 50, the first protective film 40 is used to protect the first traces 30, the first protective film 40 has an insulating property, and the first protective film 40 is not located on the side surface of the first traces 30 away from the second pads 50, so that the poor electrical contact between the fan-out traces and the second pads 50 caused by the first protective film 40 is avoided, and the short circuit of the display panel is avoided.

[0078] In some optional embodiments, as shown in Figure 20 the projection of the first protective film 40 on the second surface and the projection of the second pads 50 on the second surface have a first spacing.

[0079] In the optional embodiments, as shown in Figure 20 the second pads 50 and the first protective film 40 have a first spacing in the second direction, and the first spacing can be 3 μm to 5 μm.

[0080] According to still another embodiment of the present application, as shown in Figure 21As shown, there is provided a display device 1 comprising the display panel as described above, the display panel having a display area 2 and a non-display area.

[0081] In particular, the display device as described above can be electronic devices such as mobile phones, computers and televisions, and the display panel as described above can be applied to the electronic devices.

[0082] It should be noted that the terms "comprising", "including", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that processes, methods, articles, or apparatuses that comprise a list of elements do not include only those elements but can also include other elements not expressly listed or inherent to such processes, methods, articles, or apparatuses. Without further limitation, an element preceded by "comprises a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0083] The above only is the embodiment of the present application, and is not used to limit the present application. The present application can have various changes and variations for those skilled in the art. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the scope of claims of the present application.

Claims

1. A method for manufacturing a display panel, characterized by, The preparation method comprises: providing a substrate having opposite first and second surfaces, the first surface having an edge region; forming a plurality of first pads spaced apart on the edge region; forming a plurality of first traces on the substrate, the first traces extending from the first surface to the second surface, the first traces being electrically connected to the first pads one by one, the first traces having a third surface on a side away from the substrate, the first traces having opposite first and second side surfaces in a first direction, the first direction being perpendicular to the extension direction of the first traces and parallel to the first surface; forming a first protective film on the first traces, the first protective film covering the third surface, the first side surface and the second side surface; providing a preliminary mask and patterning the preliminary mask to form a mask having a plurality of hollow regions; before the step of forming the first protective film and after the step of forming the first traces, etching the mask on both sides of the first traces, the length of the first traces in the first direction being less than the length of the hollow regions in the first direction, and the first traces having gaps with the mask on both sides thereof.

2. The production method according to claim 1, characterized by, Before the step of forming a plurality of first traces, the preparation method further comprises: forming a plurality of second pads spaced apart on the second surface, the second pads corresponding to the first pads one by one.

3. The production method according to claim 2, characterized by, The step of forming a plurality of first traces comprises: attaching the mask to the substrate, the substrate further having a third side surface connecting the first and second surfaces, the mask covering the third side surface, part of the second pads and part of the first pads, the hollow regions corresponding to the second pads one by one, the hollow regions extending from the first surface to the second surface, the projection of the mask on the second surface having a first overlapping region with the projection of the second pads on the second surface; depositing a conductive material on the mask, part of the conductive material covering the mask and another part of the conductive material covering the hollow regions, the conductive material covering the hollow regions forming the first traces.

4. The preparation method according to claim 2, characterized in that, The step of forming a plurality of first traces comprises: forming a plurality of first sub-traces on the second surface, the first sub-traces being electrically connected to the second pads one by one; attaching the mask to the substrate, the substrate further having a third side surface connecting the first and second surfaces, the mask covering the third side surface, part of the second pads and part of the first pads, the first sub-traces corresponding to the hollow regions one by one, the hollow regions corresponding to the second pads one by one, the hollow regions extending from the first surface to the second surface; A second sub-wiring is formed on the first surface and the third side surface, the second sub-wiring is located in the hollowed-out area, the second sub-wiring is electrically connected with the first sub-wiring and the first pad respectively, and the first sub-wiring and the second sub-wiring form the first witting.

5. The preparation method according to claim 3, characterized in that, Before the step of forming a plurality of first wirings, the preparation method further comprises: A second protective film covers part of the second surface and part of the first surface; A third protective film is placed on the substrate, a projection of the third protective film on the second surface has a second overlapping area with a projection of the second protective film on the second surface, and a projection of the third protective film on the second surface has a third overlapping area with a projection of the mask on the second surface, and the third overlapping area is located in the first overlapping area.

6. The production method according to claim 5, wherein The step of forming the first protective film comprises: The third protective film is moved to a target position along a second direction, the first overlapping area is located in the third overlapping area, and the second direction is a direction in which the second surface extends to the first surface; The material of the first protective film is deposited on the first witting to form the first protective film.

7. A display panel, characterized by, The display panel obtained by the preparation method in any one of claims 1 to 6 comprises: A substrate has opposite first and second surfaces, and the first surface has an edge area; A plurality of first pads are located in the edge area; A plurality of first wirings extend from the first surface to the second surface, the first wirings are electrically connected with the first pads one by one, the first wirings have a third surface on a side away from the substrate, the first wirings have opposite first and second side surfaces in a first direction, the first direction is perpendicular to a direction in which the first wirings extend and parallel to the first surface; A first protective film covers the third surface, the first side surface and the second side surface.

8. The display panel of claim 7, wherein, The thickness of the first protective film covering the third surface is T1, the thickness of the first protective film covering the first side surface in the first direction is T2, and the thickness of the first protective film covering the second side surface in the first direction is T3, T1>T2, and T2=T3.

9. The display panel of claim 7, wherein, The display panel further comprises a plurality of second pads, the substrate further has a third side surface connecting the first surface and the second surface, the second pads are spaced apart on the second surface, the first wirings on the second surface have first and second line segments, the first line segments are electrically connected with the first wirings on the third side surface, and the second line segments include fan-out wirings.

10. The display panel of claim 9, wherein, A projection of the fan-out wirings on the second surface has a fourth overlapping area with a projection of the second pads on the second surface, and a projection of the first protective film on the second surface has no overlapping area with a projection of the second pads on the second surface.

11. The display panel of claim 9, wherein, The projection of the first protective film on the second surface has a first spacing between the projection of the second pad on the second surface.

12. A display device, characterized by comprising: The display panel as claimed in any one of claims 7 to 11.

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