Multilayer circuit board and method of using the same

Abstract

The present invention belongs to the technical field of electrical equipment, and specifically relates to a multilayer circuit board and a method for using the same. The multilayer circuit board comprises: at least two substrates and a plurality of connection units. The present invention opens through holes on the board body, and the connection units are used to weld components, so as to achieve precise welding of the pins of the components with pads or routings, reduce the welding difficulty and ensure the welding accuracy and yield rate. The connection units can ensure that the pins of the components are connected to the routings between the substrates, and improve the electrical performance of the multilayer circuit board. When stacking a plurality of board bodies, the connection between the board bodies is achieved through the connection units, and the electrical performance of the plurality of board bodies is tested at the same time, so as to improve the testing efficiency of the multilayer circuit board. The connection units cooperate with the through holes to achieve stable stacking of the board bodies, avoid relative friction and wear of the pads or routings between the board bodies, provide separation space between adjacent board bodies, achieve single-piece access to the multilayer circuit board, and overcome the problem of falling caused by stacking the multilayer circuit boards and affecting subsequent processing.

Description

Technical Field

[0001] The invention belongs to the technical field of electrical equipment, and in particular relates to a multi-layer circuit board and a use method thereof. Background Art

[0002] A multi-layer circuit board is formed by stacking multiple substrates. Pads and traces need to be arranged on each layer of the substrate. However, when soldering components to pads or traces on traditional multi-layer circuit boards, there is a problem of not being able to accurately connect the pins of the components to the pads or traces, resulting in over-soldering, cold soldering and other phenomena, making welding more difficult.

[0003] In addition, although vias are provided on the multi-layer circuit board to connect the wiring between the substrates, it is not possible to connect the pins of the components to the wiring between the substrates by directly soldering in the vias. Therefore, the electrical performance of each multi-layer circuit board needs to be tested separately, and the test efficiency is low.

[0004] At the same time, multiple multi-layer circuit boards need to be stacked during transportation, loading, and retrieval, and adjacent multi-layer circuit boards are directly attached to each other, which not only creates the risk of friction and wear on pads or traces on the multi-layer circuit boards, but also brings out multiple multi-layer circuit boards when they are taken out, which, on the one hand, causes the multi-layer circuit boards to fall off, and on the other hand affects subsequent processing of the multi-layer circuit boards.

[0005] Therefore, there is an urgent need to develop a new multilayer circuit board and a method of using the same to solve the above problems. Summary of the invention

[0006] The object of the present invention is to provide a multi-layer circuit board and a method for using the same.

[0007] In order to solve the above technical problems, the present invention provides a multilayer circuit board, which includes: at least two substrates and a plurality of connecting units; wherein the substrates are stacked in sequence to form a board body, the board body is provided with a plurality of through holes, and the connecting units are respectively inserted into the corresponding through holes; the connecting units and the tops of the through holes form supporting steps, and the connecting units and the bottoms of the through holes form positioning step grooves; when components are soldered into the connecting units, the components are electrically connected to the corresponding pads or traces on the substrate through the connecting units; when two of the board bodies are stacked and the supporting step on one board body is inserted into the positioning step groove on the other board body, the corresponding two connecting units are in contact; and when the two board bodies are stacked and one board body lifts up the other board body through the corresponding connecting unit, a separation space is provided between the two board bodies.

[0008] Specifically, the connecting unit includes: a connecting tube; the connecting tube is inserted into the through hole, and the connecting tube is in contact with the inner wall of the through hole; the top of the connecting tube is higher than the top of the through hole, so that the top of the connecting tube and the top of the through hole form a supporting step; the bottom of the connecting tube is located in the through hole, so that the bottom of the connecting tube and the bottom of the through hole form a positioning step groove.

[0009] Specifically, the connecting pipe is fixed to the inner side wall of the through hole by glue.

[0010] Specifically, a conductive layer is provided on the surface of the connecting tube.

[0011] Specifically, a plurality of welding holes are arranged on the connecting tube, and each of the welding holes is arranged along the axial direction of the connecting tube; each of the welding holes is exposed from the through hole; and the components are welded to the connecting tube through each of the welding holes.

[0012] Specifically, when two of the plates are stacked and the supporting step on one plate is inserted into the positioning step groove on the other plate, the corresponding two connecting tubes are in contact; when the two plates are stacked and the supporting step on one plate is staggered with the positioning step groove on the other plate, the corresponding two connecting tubes are staggered.

[0013] Specifically, the connecting unit includes: a connecting ring and a plurality of arc-shaped connecting pieces; each of the arc-shaped connecting pieces is fixed to the connecting ring, and each of the arc-shaped connecting pieces is located in the inner ring of the connecting ring; each of the arc-shaped connecting pieces is inserted into the through hole, and each of the arc-shaped connecting pieces is in contact with the inner wall of the through hole; the top of the connecting ring and each of the arc-shaped connecting pieces is higher than the top of the through hole, so that the connecting ring and the top of each of the arc-shaped connecting pieces form a supporting step; the bottom of each of the arc-shaped connecting pieces is located in the through hole, so that the bottom of each of the arc-shaped connecting pieces and the bottom of the through hole form a positioning step groove.

[0014] Specifically, two adjacent arc-shaped connecting pieces are arranged with a gap to form corresponding welding holes; components are welded to the connecting ring and each arc-shaped connecting piece through each welding hole.

[0015] Specifically, each of the arc-shaped connecting pieces is fixed to the inner side wall of the through hole by glue.

[0016] Specifically, the surfaces of the connecting ring and each arc-shaped connecting piece are provided with a conductive layer.

[0017] Specifically, when two of the plates are stacked and the supporting step on one plate is inserted into the positioning step groove on the other plate, the corresponding arc-shaped connecting pieces are in contact with each other, and the connecting ring on one plate lifts up the other plate to provide a separation space between the two plates.

[0018] On the other hand, the present invention provides a method for using a multilayer circuit board as described above, comprising: stacking the substrates in sequence to form a board body, and opening a plurality of through holes on the board body, and inserting the connection units into the corresponding through holes respectively; forming a support step at the top of the connection unit and the through hole, and forming a positioning step groove at the bottom of the connection unit and the through hole; when components are soldered into the connection unit, the components are electrically connected to the corresponding wiring on the substrate through the connection unit; when two board bodies are stacked and the support step on one board body is inserted into the positioning step groove on the other board body, the corresponding two connection units are in contact; and when two board bodies are stacked and one board body lifts up the other board body through the corresponding connection unit, a separation space is provided between the two board bodies.

[0019] The beneficial effects of the present invention are that, by opening through holes on the board and welding components through the connecting unit, the present invention can achieve precise welding of the pins of the components with the pads or routing, reduce the difficulty of welding and ensure the accuracy and yield of welding, and the connecting unit can ensure that the pins of the components are connected to the routing between each substrate, thereby improving the electrical performance of the multi-layer circuit board, and when multiple boards are stacked at the same time, the connection between the boards is achieved through the connecting unit, and the electrical performance of multiple boards can be tested at the same time, thereby improving the testing efficiency of the multi-layer circuit board, and the connecting unit cooperates with the through holes to achieve stable stacking of the boards, avoid relative friction and wear of the pads or routing between the boards, and provide separation space between adjacent boards, thereby achieving single-piece access to the multi-layer circuit board, and overcoming the problem of falling off caused by stacking multi-layer circuit boards and affecting subsequent processing.

[0020] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practicing the present invention.

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is a structural diagram of the plate body of the present invention;

[0024] Figure 2 is a structural diagram of a multilayer circuit board of the present invention;

[0025] Figure 3 is a structural diagram of an optional implementation of the connection unit of the present invention;

[0026] Figure 4 The present invention Figure 3 Structural diagram installed in the plate body;

[0027] Figure 5 is a structural diagram of another optional embodiment of the connection unit of the present invention;

[0028] Figure 6 The present invention Figure 5 Structural diagram installed in the plate body.

[0029] In the figure:

[0030] 1. Substrate;

[0031] 2. Plate body; 21. Through hole;

[0032] 3. Connecting unit; 31. Supporting step; 32. Positioning step groove; 33. Connecting pipe; 34. Welding hole; 35. Connecting ring; 36. Arc-shaped connecting piece. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Embodiment 1, in this embodiment, as Figures 1 to 6 As shown, the present embodiment provides a multilayer circuit board, which includes: at least two substrates 1 and a plurality of connection units 3; wherein the substrates 1 are stacked in sequence to form a board body 2, the board body 2 is provided with a plurality of through holes 21, and the connection units 3 are respectively inserted into the corresponding through holes 21; the connection units 3 and the tops of the through holes 21 form support steps 31, and the connection units 3 and the bottoms of the through holes 21 form positioning step grooves 32; when components are soldered into the connection units 3, the components are electrically connected to the corresponding pads or traces on the substrate 1 through the connection units 3; when two of the board bodies 2 are stacked and the support step 31 on one board body 2 is inserted into the positioning step groove 32 on the other board body 2, the corresponding two connection units 3 are in contact; and when two of the board bodies 2 are stacked and one board body 2 lifts up the other board body 2 through the corresponding connection units 3, a separation space is provided between the two board bodies 2.

[0035] In this embodiment, by opening a through hole 21 on the board 2 and welding components through the connecting unit 3, it is possible to achieve precise welding of the pins of the components with the pads or routing, reduce the difficulty of welding and ensure the accuracy and yield of welding, and the connecting unit 3 can ensure that the pins of the components are connected to the routing between each substrate 1, thereby improving the electrical performance of the multi-layer circuit board. When multiple board bodies 2 are stacked at the same time, the connection between each board body 2 is achieved through the connecting unit 3, and the electrical performance of multiple board bodies 2 can be tested at the same time, thereby improving the testing efficiency of the multi-layer circuit board. In addition, the connecting unit 3 cooperates with the through hole 21 to achieve stable stacking of the board bodies 2, avoid relative friction and wear of the pads or routing between the board bodies 2, and provide separation space between adjacent board bodies 2, thereby achieving single-piece access to the multi-layer circuit board, and overcoming the problem of falling off caused by stacking multi-layer circuit boards and affecting subsequent processing.

[0036] In this example, see Figures 2 to 4 The connecting unit 3 includes: a connecting tube 33; the connecting tube 33 is inserted into the through hole 21, and the connecting tube 33 is in contact with the inner wall of the through hole 21; the top of the connecting tube 33 is higher than the top of the through hole 21, so that the top of the connecting tube 33 and the top of the through hole 21 form a supporting step 31; the bottom of the connecting tube 33 is located in the through hole 21, so that the bottom of the connecting tube 33 and the bottom of the through hole 21 form a positioning step groove 32.

[0037] Specifically, compared with the vias on the multi-layer circuit board, the through hole 21 itself does not have electrical properties. By inserting the connecting tube 33 into the through hole 21, the connecting tube 33 can be used as a soldering pad on the board body 2, and the component and the connecting tube 33 are electrically connected by soldering the pins of the component into the connecting tube 33. At the same time, the connecting tube 33 can also be electrically connected to the corresponding substrate 1 on the board body 2, thereby realizing the electrical connection between the component and the substrate 1. At the same time, the top of the connecting tube 33 extends out of the through hole 21 and can be inserted into the positioning step groove 32 of the other board body 2 to contact the other connecting tube 33, thereby realizing the electrical connection between the two board bodies 2 through the corresponding connecting tube 33.

[0038] In this embodiment, the connecting pipe 33 is fixed to the inner wall of the through hole 21 by glue.

[0039] Specifically, if the connecting tube 33 needs to be electrically connected to multiple substrates 1 in the board body 2 at the same time, the connecting tube 33 can be fixed to the inner wall of the through hole 21 by conductive glue; if only the connecting tube 33 needs to be electrically connected to the topmost substrate 1 on the board body 2, the connecting tube 33 is fixed to the inner wall of the through hole 21 by insulating glue.

[0040] In this embodiment, a conductive layer is disposed on the surface of the connecting tube 33 .

[0041] Specifically, a conductive layer is provided on the surface of the connecting tube 33, so that the two plates 2 can be electrically connected when the two connecting tubes 33 are in contact.

[0042] In this embodiment, a plurality of welding holes 34 are arranged on the connecting tube 33 , and each welding hole 34 is arranged along the axial direction of the connecting tube 33 ; each welding hole 34 is exposed from the through hole 21 ; and components are welded to the connecting tube 33 through each welding hole 34 .

[0043] Specifically, by setting the welding hole 34 on the connecting tube 33, the welding equipment can weld the components inserted into the connecting tube 33 through the welding hole 34, thereby reducing the welding difficulty. At the same time, solder can also flow into the welding hole 34 to avoid cold soldering and leaking soldering.

[0044] In this embodiment, when two of the plates 2 are stacked and the supporting step 31 on one plate 2 is inserted into the positioning step groove 32 on the other plate 2, the corresponding two connecting tubes 33 are in contact; when the two plates 2 are stacked and the supporting step 31 on one plate 2 is staggered with the positioning step groove 32 on the other plate 2, the corresponding two connecting tubes 33 are staggered.

[0045] Specifically, two plate bodies 2 are stacked and the supporting step 31 on one plate body 2 is staggered with the positioning step groove 32 on the other plate body 2 as a way of providing a separation space for the two plate bodies 2 when they are stacked; a connecting tube 33 is arranged to extend from the through hole 21 at a height greater than the depth of the step groove, so that there is a gap when the two plate bodies 2 are stacked, and the connecting tube 33 can both stabilize the stacked plate bodies 2 and provide a space for separating the two plate bodies 2.

[0046] Example 2, based on Example 1, in this example, please refer to Figure 2 , Figures 5 and 6 The connecting unit 3 includes: a connecting ring 35 and a plurality of arc-shaped connecting pieces 36; each of the arc-shaped connecting pieces 36 is fixed to the connecting ring 35, and each of the arc-shaped connecting pieces 36 is located in the inner circle of the connecting ring 35; each of the arc-shaped connecting pieces 36 is inserted into the through hole 21, and each of the arc-shaped connecting pieces 36 is in contact with the inner wall of the through hole 21; the top of the connecting ring 35 and each of the arc-shaped connecting pieces 36 is higher than the top of the through hole 21, so that the connecting ring 35 and the top of each of the arc-shaped connecting pieces 36 form a supporting step 31; the bottom of each of the arc-shaped connecting pieces 36 is located in the through hole 21, so that the bottom of each of the arc-shaped connecting pieces 36 and the bottom of the through hole 21 form a positioning step groove 32.

[0047] Specifically, by inserting each arc-shaped connecting piece 36 into the through hole 21, the connecting ring 35 and each arc-shaped connecting piece 36 can be used as a soldering pad on the board body 2, and by soldering the pins of the components between the arc-shaped connecting pieces 36, the components are electrically connected to the connecting ring 35 and each arc-shaped connecting piece 36. At the same time, the connecting ring 35 and each arc-shaped connecting piece 36 can also be electrically connected to the corresponding substrate 1 on the board body 2, thereby realizing the electrical connection between the components and the substrate 1. At the same time, the top of each arc-shaped connecting piece 36 extends out from the through hole 21 and can be inserted into the positioning step groove 32 of the other board body 2 to contact with the other arc-shaped connecting pieces 36, thereby realizing the electrical connection between the two board bodies 2 through the corresponding arc-shaped connecting pieces 36.

[0048] In this embodiment, two adjacent arc-shaped connecting pieces 36 are arranged with a gap to form corresponding welding holes 34 ; components are welded to the connecting ring 35 and the arc-shaped connecting pieces 36 through the welding holes 34 .

[0049] Specifically, by forming welding holes 34 between each arc-shaped connecting piece 36, the welding equipment can weld the components inserted into the arc-shaped connecting piece 36 through the welding holes 34, thereby reducing the difficulty of welding. At the same time, solder can also flow into the welding holes 34 to avoid cold solder joints and leaking solder joints.

[0050] In this embodiment, each of the arc-shaped connecting pieces 36 is fixed to the inner wall of the through hole 21 by glue.

[0051] Specifically, if the connecting ring 35 and each arc-shaped connecting piece 36 need to be electrically connected to multiple substrates 1 in the board body 2 at the same time, each arc-shaped connecting piece 36 can be fixed to the inner wall of the through hole 21 by a conductive glue; if only the connecting ring 35 and each arc-shaped connecting piece 36 need to be electrically connected to the topmost substrate 1 on the board body 2, each arc-shaped connecting piece 36 is fixed to the inner wall of the through hole 21 by an insulating glue.

[0052] In this embodiment, the surfaces of the connecting ring 35 and each arc-shaped connecting piece 36 are provided with a conductive layer.

[0053] Specifically, a conductive layer is provided on the surface of the connecting ring 35 and each arc-shaped connecting piece 36 , so that the two plates 2 can be electrically connected when the arc-shaped connecting pieces 36 are in contact.

[0054] In this embodiment, when two of the plates 2 are stacked and the supporting step 31 on one plate 2 is inserted into the positioning step groove 32 on the other plate 2, the corresponding arc-shaped connecting pieces 36 are in contact with each other, and the connecting ring 35 on one plate 2 lifts up the other plate 2 to provide a separation space between the two plates 2.

[0055] Embodiment 3, on the basis of the above embodiments, this embodiment provides a method for using a multilayer circuit board as provided in Embodiment 1 or Embodiment 2, comprising: stacking the substrates 1 in sequence to form a board body 2, and opening a plurality of through holes 21 on the board body 2, and inserting the connection units 3 into the corresponding through holes 21 respectively; forming a support step 31 at the top of the connection unit 3 and the through hole 21, and forming a positioning step groove 32 at the bottom of the connection unit 3 and the through hole 21; when components are soldered into the connection unit 3, the components are electrically connected to the corresponding pads or traces on the substrate 1 through the connection unit 3; when two board bodies 2 are stacked and the support step 31 on one board body 2 is inserted into the positioning step groove 32 on the other board body 2, the corresponding two connection units 3 are in contact; and when two board bodies 2 are stacked and one board body 2 lifts up the other board body 2 through the corresponding connection unit 3, a separation space is provided between the two board bodies 2.

[0056] To summarize, the present invention opens through holes on the board and welds components through connecting units, thereby achieving precise welding of pins of components with pads or traces, reducing the difficulty of welding and ensuring welding accuracy and yield rate, and the connecting unit can ensure that the pins of the components are connected to the traces between each substrate, thereby improving the electrical performance of the multi-layer circuit board, and when multiple boards are stacked at the same time, the connection between the boards is achieved through the connecting unit, so that the electrical performance of multiple boards can be tested at the same time, thereby improving the testing efficiency of the multi-layer circuit board, and the connecting unit cooperates with the through holes to achieve stable stacking of the boards, avoiding relative friction and wear of the pads or traces between the boards, and at the same time providing separation space between adjacent boards, thereby achieving single-piece access to the multi-layer circuit board, and overcoming the problem of falling off caused by stacking multi-layer circuit boards and affecting subsequent processing.

[0057] The various devices selected in this application (components whose specific structures are not described) are all universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0058] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0060] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0061] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0062] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0063] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A multi-layer circuit board, characterized in that: include: At least two substrates and a plurality of connection units; in The substrates are stacked in sequence to form a plate body, the plate body is provided with a plurality of through holes, and the connection units are respectively plugged into corresponding through holes; The connecting unit and the top of the through hole form a supporting step, and the connecting unit and the bottom of the through hole form a positioning step groove; When components are soldered into the connection unit, the components are electrically connected to the corresponding pads or traces on the substrate through the connection unit; When two plates are stacked and the supporting step on one plate is inserted into the positioning step groove on the other plate, the corresponding two connecting units are in contact; as well as When two plates are stacked and one plate lifts up the other plate through the corresponding connecting unit, a separation space is provided between the two plates.

2. The multilayer circuit board according to claim 1, wherein: The connecting unit comprises: a connecting pipe; The connecting pipe is inserted into the through hole, and the connecting pipe is in contact with the inner wall of the through hole; The top of the connecting pipe is higher than the top of the through hole, so that the top of the connecting pipe and the top of the through hole form a supporting step; The bottom of the connecting pipe is located in the through hole, so that the bottom of the connecting pipe and the bottom of the through hole form a positioning step groove.

3. The multilayer circuit board according to claim 2, wherein: The connecting pipe is fixed to the inner side wall of the through hole by glue.

4. The multilayer circuit board according to claim 2, wherein: A conductive layer is provided on the surface of the connecting tube.

5. The multilayer circuit board according to claim 2, wherein: A plurality of welding holes are arranged on the connecting pipe, and each of the welding holes is arranged along the axial direction of the connecting pipe; Each of the welding holes is exposed from the through hole; The components are welded to the connecting pipe through the welding holes.

6. The multilayer circuit board according to claim 2, wherein: When two plates are stacked and the supporting step on one plate is inserted into the positioning step groove on the other plate, the corresponding two connecting pipes are in contact; When two plates are stacked and the supporting step on one plate is staggered with the positioning step groove on the other plate, the corresponding two connecting pipes are staggered.

7. The multi-layer circuit board according to claim 1, wherein: The connecting unit comprises: a connecting ring and a plurality of arc-shaped connecting pieces; Each of the arc-shaped connecting pieces is fixed to the connecting ring, and each of the arc-shaped connecting pieces is located at the inner circle of the connecting ring; Each of the arc-shaped connecting pieces is inserted into the through hole, and each of the arc-shaped connecting pieces is in contact with the inner wall of the through hole; The tops of the connecting ring and each arc-shaped connecting piece are higher than the top of the through hole, so that the connecting ring and the tops of each arc-shaped connecting piece form a supporting step; The bottom of each arc-shaped connecting piece is located in the through hole, so that the bottom of each arc-shaped connecting piece and the bottom of the through hole form a positioning step groove.

8. The multi-layer circuit board according to claim 7, wherein: Two adjacent arc-shaped connecting pieces are arranged with a gap to form a corresponding welding hole; The components are welded to the connecting ring and the arc-shaped connecting pieces through the welding holes.

9. The multilayer circuit board according to claim 7, wherein: Each of the arc-shaped connecting pieces is fixed to the inner side wall of the through hole by glue.

10. The multi-layer circuit board according to claim 7, wherein: The surfaces of the connecting ring and each arc-shaped connecting piece are provided with a conductive layer.

11. The multi-layer circuit board according to claim 7, wherein: When two of the plates are stacked and the supporting step on one plate is inserted into the positioning step groove on the other plate, the corresponding arc-shaped connecting pieces are in contact with each other, and a connecting ring on one plate lifts up the other plate to provide a separation space between the two plates.

12. A method for using the multilayer circuit board according to any one of claims 1 to 11, characterized in that: include: The substrates are stacked in sequence to form a plate body, and a plurality of through holes are opened on the plate body, and the connection units are respectively plugged into the corresponding through holes; A supporting step is formed at the top of the connecting unit and the through hole, and a positioning step groove is formed at the bottom of the connecting unit and the through hole; When components are soldered into the connection unit, the components are electrically connected to the corresponding pads or traces on the substrate through the connection unit; When two plates are stacked and the supporting step on one plate is inserted into the positioning step groove on the other plate, the corresponding two connecting units are in contact; as well as When two plates are stacked and one plate lifts up the other plate through the corresponding connecting unit, a separation space is provided between the two plates.

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