A tempered glass, its preparation method and uses

Abstract

A tempered glass, its preparation method, and its uses are disclosed. By controlling the difference between the average density of the exposed area and the average density of the unexposed area of ​​the tempered glass within a certain range, the density of the exposed and unexposed areas is balanced. This achieves a reduction in the warpage of the tempered glass by increasing the difference in light transmittance between the exposed and unexposed areas and reducing the deformation of the tempered glass during the heat treatment process.

Description

Technical Field

[0001] This application relates to the field of glass technology, and more specifically, to a reinforced glass, its preparation method, and its uses. Background Technology

[0002] Tempered glass is a glass material that undergoes structural changes under the irradiation of light of a specific wavelength, thereby exhibiting special properties. When exposed to ultraviolet light, the internal structure of tempered glass undergoes structural changes, resulting in the formation of crystal nuclei. After further heat treatment at a certain temperature, glass with microcrystals of a specific composition is formed in the irradiated area. These microcrystals in the irradiated area have the characteristic of reducing the intensity of transmitted light and blocking the light source.

[0003] After being exposed to ultraviolet light and heat-treated, tempered glass develops an opaque area in the exposed region that blocks light. This area has low light transmittance and provides light-blocking properties compared to the unexposed matrix glass. Therefore, when tempered glass is used in mobile phone cover plates, its structural design can prevent light from adjacent LEDs from interfering with each other, thus avoiding light crosstalk.

[0004] Currently, research on tempered glass mainly focuses on reducing the light transmittance of the material in the ultraviolet exposure area. However, during the heat treatment process, large-sized substrate glass is prone to irregular deformation, which leads to increased warping and reduced yield.

[0005] It should be noted that this part of the present invention only provides background technology related to the present invention, and does not necessarily constitute prior art or known technology. Summary of the Invention

[0006] The purpose of this application is to provide a reinforced glass that can achieve a balance in density between the exposed and unexposed areas, thereby reducing the warpage of the glass while increasing the difference in light transmittance between the exposed and unexposed areas.

[0007] To achieve the above objectives, this application provides the following technical solution:

[0008] In a first aspect, a tempered glass is provided, which is obtained by processing a substrate glass; the substrate glass includes a first region and a second region, and after the first region is masked, the first region and the second region are processed to obtain a non-exposed region and an exposed region, respectively, wherein the second region is a region that is not masked; wherein the first region of the substrate glass corresponds to the first region of the tempered glass, and the second region of the substrate glass corresponds to the second region of the tempered glass.

[0009] The processing includes radiation treatment, heat treatment, and strengthening treatment;

[0010] The tempered glass includes an exposed area and a non-exposed area. The average density ρ1 of the exposed area is greater than the average density ρ2 of the non-exposed area, and the difference Δρ between the average density ρ1 of the exposed area and the average density ρ2 of the non-exposed area is ≤0.01 g / cm³. 3 The preferred difference Δρ is ≤0.005g / cm³. 3 .

[0011] As an optional implementation, the processing further includes one or more of the following: pre-chemical forging cutting, CNC machining, grinding and polishing, cleaning, 3D hot bending, and sweeping.

[0012] As an optional implementation, the average density ρ1 of the exposed area satisfies 2.0000 g / cm³. 3 ≤ρ1≤3.0000g / cm 3 The preferred value is 2.3000 g / cm³. 3 ≤ρ1≤2.7000g / cm 3 More preferably, 2.3000 g / cm³ 3 ≤ρ1≤2.5000g / cm 3 ; and / or,

[0013] The average density ρ2 of the non-exposed region satisfies 2.0000 g / cm³. 3 ≤ρ2≤3.0000g / cm 3 The preferred value is 2.3000 g / cm³. 3 ≤ρ2≤2.7000g / cm 3 More preferably, 2.4000 g / cm³ 3 ≤ρ2≤2.5000g / cm 3 .

[0014] As an optional implementation, the average density ρ1 of the exposed area is 2.4714 g / cm³. 3 2.4846 g / cm 3 2.4896 g / cm³ 3 2.4872 g / cm 3 2.4918 g / cm³ 3 2.4964 g / cm 3 2.4753 g / cm 3 Or 2.4832 g / cm 3 ; and / or,

[0015] The average density ρ2 of the unexposed area is 2.4709 g / cm³. 3 2.4796 g / cm³3 2.4826 g / cm 3 2.4806 g / cm 3 2.4893 g / cm 3 2.4932 g / cm 3 2.4704 g / cm 3 Or 2.4736 g / cm 3 .

[0016] As an optional implementation, the difference Δρ between the average density ρ1 of the exposed area and the average density ρ2 of the unexposed area is 0.0005 g / cm³. 3 0.005g / cm 3 0.007g / cm 3 0.0066 g / cm 3 0.0025g / cm 3 0.0032g / cm 3 0.0049 g / cm 3 Or 0.0096 g / cm 3 .

[0017] As an optional implementation, the average crystal content X in the exposed region C1 Greater than the average crystal content X in the non-exposed region C2 ; and / or,

[0018] The average crystal content X in the exposed area, expressed as a percentage by mass. C1 Satisfies 3.00% ≤ X C1 ≤25.00%, preferably, 4.00%≤X C1 ≤20.00%, more preferably, 4.00%≤X C1 ≤15.00%; and / or,

[0019] The average crystal content X in the unexposed region, expressed as a percentage by mass. C2 Satisfying 0.50% ≤ X C2 ≤20.00%, preferably, 1.00%≤X C2 ≤18.00%, more preferably, 1.40%≤X C2 ≤13.00%.

[0020] As an optional implementation, the surface CS of the tempered glass is above 300 MPa, preferably above 350 MPa.

[0021] As an optional implementation, the CS_50 of the tempered glass is 50MPa to 100MPa, preferably 55MPa to 95MPa.

[0022] As an optional implementation, the average crystal content X in the exposed area, expressed as a mass percentage, is... C1 For 4.27%, 7.12%, 8.31%, 7.53%, 10.23%, 14.42%, 5.42%, or 6.32%; and / or,

[0023] The average crystal content X in the unexposed region, expressed as a percentage by mass. C2 The percentages are 1.49%, 5.14%, 6.35%, 5.65%, 8.54%, 12.53%, 3.56%, or 4.45%.

[0024] As an optional embodiment, the composition of the tempered glass, based on the mass percentage of oxides, comprises: SiO2: 65.00%–75.00%, Al2O3: 5.00%–10.00%, Li2O: 7.00%–13.00%, Na2O: 2.00%–4.00%, K2O: 2.00%–4.00%, ZrO2: 5.00%–7.00%, X: 0.05%–0.80%, CeO2: 0.05%–0.13%, and Sb2O3: 0%–0.50%.

[0025] Where X is Ag, Cu, Au, Bi and / or their respective oxides.

[0026] As an optional implementation, the composition of the tempered glass, based on the mass percentage of oxides, comprises:

[0027] The mass percentage of SiO2 is 66.00% to 74.50%, preferably 66.50% to 74.00%; and / or,

[0028] The mass percentage of Al2O3 is 5.10% to 9.70%, preferably 5.20% to 9.40%; and / or,

[0029] The mass percentage of Li2O is 7.10% to 12.80%, preferably, the mass percentage of Li2O is; and / or,

[0030] The mass percentage of Na₂O is 2.10% to 3.80%, preferably 2.10% to 3.60%; and / or,

[0031] The mass percentage of K2O is 2.10% to 3.95%, preferably 2.10% to 3.90%; and / or,

[0032] The ZrO2 mass percentage is 5.10% to 6.90%, preferably 5.10% to 6.80%; and / or,

[0033] The mass percentage of Ag₂O is 0.05% to 0.80%, preferably 0.22% to 0.48%; and / or,

[0034] The mass percentage of CeO2 is 0.05% to 0.12%, preferably 0.06% to 0.12%; and / or,

[0035] The mass percentage of Sb2O3 is 0.06% to 0.48%, preferably 0.07% to 0.46%.

[0036] As an optional implementation, the composition of the tempered glass, based on the mass percentage of oxides, comprises:

[0037] The mass percentage of SiO2 is 66.93%, 68.16%, 70.07%, 72.61%, 70.01%, 73.52%, 69.94%, or 72.40%; and / or,

[0038] The mass percentage of Al2O3 is 7.19%, 9.19%, 7.86%, 5.23%, 7.87%, 7.35%, 8.36%, or 5.87%; and / or,

[0039] The mass percentages of Li₂O are 12.32%, 11.56%, 8.95%, 10.25%, 8.93%, 7.33%, 9.77%, or 9.80%; and / or,

[0040] The mass percentage of Na₂O is 3.47%, 2.14%, 3.11%, 2.66%, 3.08%, 2.41%, 2.32%, or 2.84%; and / or,

[0041] The mass percentage of K2O is 3.83%, 3.02%, 3.72%, 2.42%, 3.74%, 2.15%, 3.34%, or 2.34%; and / or,

[0042] The mass percentage of ZrO2 is 5.62%, 5.12%, 5.74%, 6.25%, 5.71%, 6.78%, 5.54%, or 5.77%; and / or,

[0043] The mass percentage of Ag2O is 0.25%, 0.41%, 0.37%, 0.35%, 0.39%, 0.33%, 0.28%, or 0.43%; and / or,

[0044] The mass percentage of CeO2 is 0.12%, 0.08%, 0.09%, 0.11%, 0.06%, 0.10%, or 0.12%; and / or,

[0045] The mass percentages of Sb₂O₃ are 0.27%, 0.32%, 0.09%, 0.12%, 0.16%, 0.07%, 0.35%, or 0.43%.

[0046] As an optional implementation, the exposed area has low transmittance in the infrared wavelength range, and the unexposed area has high transmittance in the infrared wavelength range; and / or,

[0047] At a thickness of 0.70 mm, for 550 nm wavelength light, the transmittance T1 of the exposed area is less than 20%, preferably less than 10%, more preferably less than 5%, and even more preferably 0; the transmittance T2 of the unexposed area is above 90%; and / or,

[0048] At a thickness of 0.70 mm, for 850 nm wavelength light, the transmittance T3 of the exposed area is 0% to 10%, preferably less than 5%, and the transmittance T4 of the unexposed area is above 90%; and / or,

[0049] With a thickness of 0.70 mm, for light with a wavelength of 1000 nm, the transmittance T5 of the exposed area is 0% to 5%, and the transmittance T6 of the unexposed area is above 90%.

[0050] As an optional implementation, the crystal phase of the exposed region includes one or more of lithium metasilicate, lithium disilicate, petalite, quartz, spodumene, nepheline, zinc oxide, Ag nanocrystals, Cu nanocrystals, Au nanocrystals, and Bi nanocrystals; and / or,

[0051] The main crystalline phase of the non-exposed region includes one or more of lithium metasilicate, lithium disilicate, lepidolite, quartz, spodumene, nepheline, zinc oxide, Ag nanocrystals, Cu nanocrystals, Au nanocrystals, and Bi nanocrystals.

[0052] Secondly, a method for preparing the strengthened glass as described above is provided, the method comprising:

[0053] A substrate glass is obtained; a first region of the substrate glass is masked, while a second region of the substrate glass is not masked; then, the first and second regions are processed to obtain a non-exposed region and an exposed region, respectively. The processing includes radiation treatment, heat treatment, and strengthening treatment; wherein, the first region of the substrate glass corresponds to the first region of the strengthened glass, and the second region of the substrate glass corresponds to the second region of the strengthened glass.

[0054] The tempered glass includes an exposed area and a non-exposed area. The average density ρ1 of the exposed area is greater than the average density ρ2 of the non-exposed area, and the difference Δρ between the average density ρ1 of the exposed area and the average density ρ2 of the non-exposed area is ≤0.01 g / cm³. 3 The preferred difference is Δρ ≤ 0.005 g / cm³. 3 .

[0055] As an optional implementation, the average density ρ1 of the exposed area satisfies 2.0000 g / cm³. 3 ≤ρ1≤3.0000g / cm 3 The preferred value is 2.3000 g / cm³. 3 ≤ρ1≤2.7000g / cm 3 More preferably, 2.3000 g / cm³ 3 ≤ρ1≤2.5000g / cm 3 ; and / or,

[0056] The average density ρ2 of the non-exposed region satisfies 2.0000 g / cm³. 3 ≤ρ2≤3.0000g / cm 3 The preferred value is 2.3000 g / cm³. 3 ≤ρ2≤2.7000g / cm 3 More preferably, 2.4000 g / cm³ 3 ≤ρ2≤2.5000g / cm 3 .

[0057] As an optional implementation, the average crystal content X in the exposed region C1 Greater than the average crystal content X in the non-exposed area C2 ; and / or,

[0058] The average crystal content X in the exposed area, expressed as a percentage by mass. C1 Satisfies 3.00% ≤ X C1 ≤25.00%, preferably, 4.00%≤X C1 ≤20.00%, more preferably, 4.00%≤X C1≤15.00%; and / or,

[0059] The average crystal content X in the unexposed region, expressed as a percentage by mass. C2 Satisfying 0.50% ≤ X C2 ≤20.00%, preferably, 1.00%≤X C2 ≤18.00%, more preferably, 1.40%≤X C2 ≤13.00%.

[0060] As an optional embodiment, the composition of the substrate glass, based on the mass percentage of oxides, comprises: SiO2: 65.00%–75.00%, Al2O3: 5.00%–10.00%, Li2O: 7.00%–13.00%, Na2O: 2.00%–4.00%, K2O: 2.00%–4.00%, ZrO2: 5.00%–7.00%, X: 0.05%–0.80%, CeO2: 0.05%–0.13%, and Sb2O3: 0%–0.50%.

[0061] Where X is Ag, Cu, Au, Bi and / or their respective oxides.

[0062] As an optional implementation, the radiation treatment method includes ultraviolet irradiation treatment.

[0063] As an optional implementation, the wavelength of the ultraviolet irradiation treatment is 300 nm to 320 nm; and / or,

[0064] The intensity of the ultraviolet irradiation treatment was 240 mw / cm². 2 ~260mw / cm 2 .

[0065] As an alternative implementation, the masking process includes masking using masking ink and / or a mask.

[0066] As an optional implementation, the heat treatment includes nucleation and crystallization.

[0067] As an optional implementation, the heating rate of the nucleation treatment is 1°C / min to 10°C / min; and / or,

[0068] The nucleation treatment is performed at a temperature of 450℃ to 600℃; and / or,

[0069] The nucleation treatment time is 180 min to 300 min; and / or,

[0070] The temperature rise rate for the crystallization treatment is 1℃ / min to 10℃ / min; and / or,

[0071] The crystallization treatment temperature is 550℃~800℃; and / or,

[0072] The crystallization process takes 30 to 180 minutes.

[0073] Thirdly, a cover glass is provided, said cover glass being made of reinforced glass as described in any embodiment of the first aspect.

[0074] Fourthly, an electronic device is provided, the electronic device comprising reinforced glass as described in any embodiment of the first aspect.

[0075] As an alternative embodiment, the electronic device includes a housing assembled on the outside of the electronic device, the housing comprising reinforced glass as described in any embodiment of the first aspect.

[0076] As an alternative embodiment, the electronic device further includes a camera assembly located inside a housing, the housing including a camera protective cover covering the camera assembly, the camera protective cover comprising reinforced glass as described in any embodiment of the first aspect.

[0077] In some implementations, the outer casing may be partially or entirely made of tempered glass.

[0078] Fifthly, a method for using reinforced glass in components for mobile phones, smartwatches, wearable devices, camera modules, or vehicles is provided, wherein the reinforced glass is prepared by a method for preparing reinforced glass as described in any embodiment of the first aspect or as described in any embodiment of the second aspect.

[0079] One or more of the technical solutions provided in this application have the following advantages compared with the prior art:

[0080] This application controls the difference Δρ between the average density ρ1 of the exposed area and the average density ρ2 of the unexposed area of ​​the tempered glass to be less than or equal to 0.01 g / cm³. 3 Within this range, the density of the exposed and unexposed areas is balanced, thereby increasing the difference in light transmittance between the exposed and unexposed areas while reducing the deformation of the tempered glass during the heat treatment process, thus reducing the warpage of the tempered glass. Attached Figure Description

[0081] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0082] Figure 1 A schematic diagram of the structure of the mask provided for an embodiment of this application.

[0083] Figure 2 A schematic diagram of a single hole in a mask provided for an embodiment of this application.

[0084] Figure 3 A schematic diagram of the structure of the reinforced glass provided in the embodiments of this application.

[0085] Figure 4 This is a schematic diagram of the rear structure of the electronic device mentioned in the embodiments of this application.

[0086] Figure 5 This is a schematic diagram of the structure of the electronic device mentioned in the embodiments of this application. Figure 1 .

[0087] Figure 6 This is a schematic diagram of the structure of the electronic device mentioned in the embodiments of this application. Figure 2 .

[0088] Figure 7 A comparison of XRD diffraction curves of the exposed and unexposed areas of the tempered glass provided in Embodiment 1 of this application.

[0089] Figure 8 A comparison diagram of the transmittance curves of the exposed and unexposed areas of the tempered glass provided in Embodiment 7 of this application.

[0090] Reference numerals: 1-Outer shell; 12-Back cover; 13-Camera protective cover; 2-Camera assembly; 3-Middle frame; 4-Display module; 5-Mask; 51-Light-transmitting area; 52-Light-blocking area; 6-Tempered glass; 61-Exposure area; 62-Non-exposure area. Detailed Implementation

[0091] The embodiments of this application will be described in detail below with reference to examples. However, those skilled in the art will understand that the following examples are for illustrative purposes only and should not be considered as limiting the scope of this application. Unless otherwise specified in the examples, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments whose manufacturers are not specified are all commercially available conventional products.

[0092] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the ranges, the endpoint values ​​of the ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein. The terms "optional" and "optional" mean that they may or may not be included (or may or may not be present). The term "and / or" as used herein is inclusive; for example, "A and / or B" means only A, or only B, or both A and B.

[0093] Terminology and testing methods:

[0094] In this application, the main surface refers to the surface with the largest surface area, such as the upper or lower surface of a horizontally placed tempered glass sheet.

[0095] In this application, the infrared wavelength range refers to 750nm to 1000nm.

[0096] In this application, when light of a certain wavelength is irradiated onto the main surface of the tempered glass, the light will be reflected, absorbed, and transmitted. The ratio of the intensity of the transmitted portion to the intensity of the incident light is the transmittance.

[0097] In this application, crystallized glass raw material refers to glass raw material that has undergone heat treatment for a period of time, so that the glass has reached a certain degree of crystallinity, but has not yet reached the target degree of crystallinity, and can continue to crystallize to reach the target degree of crystallinity when heated.

[0098] In this application, surface CS refers to surface compressive stress or surface stress. After the substrate glass is chemically strengthened, alkali metal ions with smaller surface radii are replaced with alkali metal ions with larger radii. Due to the crowding effect of the larger alkali metal ions, compressive stress is generated on the glass surface, which is called surface compressive stress.

[0099] In this application, CS_50 refers to the compressive stress value at a depth of 50 μm measured from the glass surface.

[0100] In this application, the thickness of the glass was obtained by micrometer measurement.

[0101] In this application, the density of the tempered glass was tested using an ALFAMIRAGE SD-200L electronic density balance from Japan. The density of the same piece of glass was measured at different locations, and the average density was taken.

[0102] In this application, the dimensions of the glass slides were measured using a two-dimensional measuring machine (instrument model: MiyuMY-YXCL-4030).

[0103] In this application, the warpage of the glass is obtained by testing with a laser thickness gauge.

[0104] Surface CS was measured using an Orihara FSM-6000 from Japan. Test conditions: light source wavelength 596nm, SOC = 28.6 (nm / cm) / MPa, refractive index = 1.52.

[0105] The CS_50 was tested using a Luceo SLP-2000 stress meter from Japan. The test conditions were: light source wavelength 518nm, SOC = 28.6 (nm / cm) / MPa, refractive index = 1.52, and exposure time: 5000 µsec.

[0106] In this application, the crystal phase and crystal content of the glass were confirmed by XRD testing as follows:

[0107] (1) XRD test: The reinforced glass of this application was crushed and ground into samples with a particle size of less than 75 μm. The ground samples were tested using an X-ray diffractometer to obtain XRD diffraction peak curves and XRD diffraction data. The X-ray diffractometer used in this application was a Shimadzu XRD-6100, the target material was copper, 2θ=10°-50°, the scanning speed was 6° / min, the working voltage was 40kV, and the working current was 30mA.

[0108] (2) Determination of crystal phase: The crystal phase in the sample was determined by analyzing the XRD diffraction data using Jade software (JADEStandard8.6).

[0109] (3) Determination of crystal content (also known as crystallinity): The crystallinity of the sample can be determined by importing the XRD test results (RAW format) into the Rietveld X-ray diffraction data refinement software Jade for fitting and calculation. Specifically, the ratio of the fitted crystal phase peak area to the fitted total peak area is recorded as the crystal content of the sample. In this application, the average crystal content is taken after testing the crystal content at different locations on the same glass piece.

[0110] In this application, a UV-Vis spectrophotometer is used to test the transmittance of the exposed and unexposed areas of the tempered glass. Specifically, the UV-Vis spectrophotometer is used to test the transmittance of the exposed and unexposed areas of five tempered glass pieces from the same batch to different wavelengths of light. The average transmittance of the exposed and unexposed areas of the five tempered glass pieces under different wavelengths of light is taken as the transmittance result of the exposed and unexposed areas of the tempered glass under that wavelength of light. The UV-Vis spectrophotometer used in this application is a Shimadzu UV-2000 UV-Vis spectrophotometer.

[0111] This application achieves a balance between the densities of the exposed and unexposed areas of the tempered glass by controlling the difference between the average density of the exposed and unexposed areas within a certain range. This, in turn, reduces the deformation of the tempered glass during the heat treatment process while increasing the difference in light transmittance between the exposed and unexposed areas, thereby reducing the warpage of the tempered glass.

[0112] In some embodiments of this application, a tempered glass is provided, which is obtained by processing a substrate glass. The substrate glass includes a first region and a second region. After the first region is masked, the first region and the second region are processed to obtain a non-exposed region and an exposed region, respectively. The second region is the region that is not masked. The first region of the substrate glass corresponds to the first region of the tempered glass, and the second region of the substrate glass corresponds to the second region of the tempered glass. The processing includes radiation treatment, heat treatment, and tempering treatment.

[0113] The tempered glass includes an exposed area and a non-exposed area. The average density ρ1 of the exposed area is greater than the average density ρ2 of the non-exposed area, and the difference Δρ between the average density ρ1 of the exposed area and the average density ρ2 of the non-exposed area is ≤0.01 g / cm³. 3 The preferred difference Δρ is ≤0.005g / cm³. 3 .

[0114] In some embodiments of this application, the difference Δρ between the average density ρ1 of the exposed area and the average density ρ2 of the unexposed area is 0.0001 g / cm³. 3 0.0005g / cm 3 0.0010 g / cm 3 0.0050g / cm 3 0.0070g / cm 3 0.0066 g / cm 3 0.0025g / cm 3 0.0032g / cm 3 0.0049 g / cm 3 0.0070g / cm 3 0.0080g / cm 3 0.0096g / cm 3 Or 0.01g / cm 3 The values ​​can be any values ​​within the range defined by any two of the above specific values ​​as endpoints, as long as they provide the required performance of the tempered glass. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other range, as long as the required performance of the tempered glass is obtained.

[0115] In some embodiments of this application, the average density ρ1 of the exposed area satisfies 2.0000 g / cm³. 3 ≤ρ1≤3.0000g / cm 3 The preferred value is 2.3000 g / cm³. 3 ≤ρ1≤2.7000g / cm 3 More preferably, 2.3000 g / cm³ 3 ≤ρ1≤2.5000g / cm 3 .

[0116] In some embodiments, the average density ρ1 of the exposed area is 2.1000 g / cm³. 3 2.2000g / cm 3 2.3000g / cm 3 2.4000g / cm 3 2.5000g / cm 3 2.6000g / cm 3 2.7000g / cm 3 2.8000g / cm 3 2.9000g / cm 3 3.0000g / cm 3 2.4714 g / cm³ 3 2.4846 g / cm 3 2.4896 g / cm³ 3 2.4872 g / cm 3 2.4918 g / cm³ 3 2.4964 g / cm 3 2.4753 g / cm 3 Or 2.4832 g / cm 3 The values ​​can be any values ​​within the range defined by any two of the above specific values ​​as endpoints, as long as they provide the required performance of the tempered glass. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other range, as long as the required performance of the tempered glass is obtained.

[0117] In some embodiments of this application, the average density ρ2 of the unexposed region satisfies 2.0000 g / cm³. 3 ≤ρ2≤3.0000g / cm 3 The preferred value is 2.3000 g / cm³. 3 ≤ρ2≤2.7000g / cm 3 More preferably, 2.4000 g / cm³ 3 ≤ρ2≤2.5000g / cm3 .

[0118] In some implementations, the average density ρ2 of the unexposed area is 2.1000 g / cm³. 3 2.2000g / cm 3 2.3000g / cm 3 2.4000g / cm 3 2.5000g / cm 3 2.6000g / cm 3 2.7000g / cm 3 2.8000g / cm 3 2.9000g / cm 3 3.0000g / cm 3 2.4709 g / cm³ 3 2.4796 g / cm³ 3 2.4826 g / cm 3 2.4806 g / cm 3 2.4893 g / cm 3 2.4932 g / cm 3 2.4704 g / cm 3 2.4736 g / cm³ 3 2.4900g / cm 3 Or 2.4950 g / cm 3 The values ​​can be any values ​​within the range defined by any two of the above specific values ​​as endpoints, as long as they provide the required performance of the tempered glass. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other range, as long as the required performance of the tempered glass is obtained.

[0119] In some embodiments of this application, the average crystal content X in the exposure region of the tempered glass is... C1 Greater than the average crystal content X in the non-exposed area C2 .

[0120] In some embodiments of this application, the average crystal content X in the exposed region is expressed as a mass percentage. C1 Satisfies 3.00% ≤ X C1 ≤25.00%, preferably, 4.00%≤X C1 ≤20.00%, more preferably, 4.00%≤X C1 ≤15.00%.

[0121] In some embodiments, the average crystal content X in the exposed region C1The percentages are 3.00%, 4.00%, 5.00%, 6.00%, 7.00%, 8.00%, 9.00%, 10.00%, 11.00%, 12.00%, 13.00%, 14.00%, 15.00%, 16.00%, 17.00%, 18.00%, 19.00%, 20.00%, 21.00%, 22.00%, 23.00%, 24.00%, 25.00%, 4.27%, 7.12%, 8.31%, 7.53%, 10.23%, 14.42%, 5.42%, or 6.32%, or any value within the range defined by any two of the above specific values ​​as endpoints, as long as the reinforced glass with the desired performance of this application is obtained. It should be understood that, in specific implementations, any of the above ranges can be combined with any other ranges, as long as the reinforced glass with the performance required by this application can be obtained.

[0122] In some embodiments of this application, the average crystal content X in the unexposed region is expressed as a mass percentage. C2 Satisfying 0.50% ≤ X C2 ≤20.00%, preferably, 1.00%≤X C2 ≤18.00%, more preferably, 1.40%≤X C2 ≤13.00%.

[0123] In some implementations, the average crystal content X in the non-exposed region C2 The percentages are 0.50%, 1.00%, 2.00%, 3.00%, 4.00%, 5.00%, 6.00%, 7.00%, 8.00%, 9.00%, 10.00%, 11.00%, 12.00%, 13.00%, 14.00%, 15.00%, 16.00%, 17.00%, 18.00%, 19.00%, 20.00%, 1.49%, 5.14%, 6.35%, 5.65%, 8.54%, 12.53%, 3.56%, or 4.45%.

[0124] It should be understood that the tempered glass in this application is made from a base glass through processing including radiation treatment, heat treatment (including nucleation treatment and crystallization treatment) and strengthening treatment. The composition of the base glass is the same as or substantially the same as that of the tempered glass in terms of the mass percentage of oxides.

[0125] In some embodiments of this application, the composition of the tempered glass, based on the mass percentage of oxides, comprises: SiO2: 65.00%–75.00%, Al2O3: 5.00%–10.00%, Li2O: 7.00%–13.00%, Na2O: 2.00%–4.00%, K2O: 2.00%–4.00%, ZrO2: 5.00%–7.00%, X: 0.05%–0.80%, CeO2: 0.05%–0.13%, and Sb2O3: 0%–0.50%.

[0126] Wherein X is Ag (silver), Cu (copper), Au (gold), Bi (bismuth), and / or their respective oxides. It should be noted that X being Ag, Cu, Au, Bi, and / or their respective oxides means that X is at least one of Ag, Cu, Au, Bi, Ag O, CuO, Au O, and BiO.

[0127] In this application, SiO2 is a glass-forming oxide that forms an irregular, continuous network of silicon-oxygen tetrahedral structural units, serving as the framework for glass formation. Increasing the SiO2 content can improve the glass's temperature (T). g Temperature enhances thermal stability and helps suppress phase separation during glass heat treatment; however, excessive SiO2 content leads to high glass viscosity and melting temperature. Reducing SiO2 content helps lower the glass melting temperature and suppress component volatilization during melting; however, insufficient SiO2 content makes the glass more prone to phase separation during heat treatment, and also affects the melting temperature. g The temperature will decrease accordingly, and the thermal stability will deteriorate. In some embodiments of this application, the mass percentage of SiO2 in the composition of the tempered glass or the substrate glass used to prepare the tempered glass is 65.00% to 75.00%, preferably 66.00% to 74.50%, and more preferably 66.50% to 74.00%, based on the mass percentage of oxides.

[0128] In some embodiments of this application, the SiO2 content in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of oxides, can be 65.00%, 66.00%, 67.00%, 68.00%, 69.00%, 70.00%, 71.00%, 72.00%, 73.00%, 74.00%, 75.00%, 66.93%, 68.16%, 70.07%, 72.61%, 70.01%, 73.52%, 69.94%, or 72.40%, or can be a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass or substrate glass with the desired performance of this application is obtained. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other ranges, as long as the tempered glass or substrate glass with the desired performance of this application is obtained.

[0129] In this application, Al2O3 serves as an intermediate in the glass network, entering the glass network structure as [AlO4] tetrahedra. Increasing the amount of Al2O3 can improve the glass's temperature (T). g Temperature and thermal stability are enhanced, and it is beneficial to suppress phase separation during glass heat treatment; however, excessive amounts will increase the melting temperature of the glass. In some embodiments of this application, the mass percentage of Al2O3 in the composition of the strengthened glass or the substrate glass used to prepare the strengthened glass is 5.00% to 10.00%, preferably 5.10% to 9.70%, and more preferably 5.20% to 9.40%, based on the mass percentage of oxides.

[0130] In some embodiments of this application, the Al2O3 content in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of oxides, can be 5.00%, 5.50%, 6.00%, 6.50%, 7.00%, 7.50%, 8.00%, 8.50%, 9.00%, 9.50%, 10.00%, 7.19%, 9.19%, 7.86%, 5.23%, 7.87%, 7.35%, 8.36%, or 5.87%, or a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass or substrate glass with the desired performance of this application is obtained. It should be understood that in specific embodiments, any of the above ranges can be combined with any other ranges, as long as the tempered glass or substrate glass with the desired performance of this application is obtained.

[0131] In this application, alkali metal oxide Li₂O is the main component for crystal formation in the strengthened glass material, and it can also lower the glass melting temperature. In some embodiments of this application, the mass percentage of Li₂O in the strengthened glass or the substrate glass used to prepare the strengthened glass is 7.00% to 13.00%, preferably 7.10% to 12.80%, and more preferably 7.10% to 12.80%, based on the mass percentage of the oxide.

[0132] In some embodiments of this application, the Li₂O content in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of oxides, can be 7.00%, 7.50%, 8.00%, 8.50%, 9.00%, 9.50%, 10.00%, 10.50%, 11.00%, 11.50%, 12.00%, 12.50%, 13.00%, 12.32%, 11.56%, 8.95%, 10.25%, 8.93%, 7.33%, 9.77%, or 9.80%, or can be a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass or substrate glass with the desired performance of this application is obtained. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other ranges, as long as the tempered glass or substrate glass with the desired performance of this application is obtained.

[0133] In this application, Na₂O and K₂O are the outer components of the glass network, acting as fluxes to lower the melting temperature of the glass. + K + In the case of existence, Na + K + It will preferentially enter the aluminum-silicon-oxygen network to compensate for the electricity price, which to some extent maintains the lithium content in the lithium-rich region, making the Si / Li ratio in the lithium-rich region closer to the chemical ratio of Li2SiO3. This results in the precipitated crystalline phase of lithium metasilicate in the strengthened glass containing Na2O and K2O. However, excessive Na2O and K2O can lead to phase separation and turbidity during glass heat treatment, increasing the light absorption coefficient, and T... g The temperature also decreases, and the thermal stability deteriorates. In some embodiments of this application, the mass percentage of Na₂O in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of oxides, is 2.00% to 4.00%, preferably 2.10% to 3.80%, and more preferably 2.10% to 3.60%. In some embodiments of this application, the mass percentage of K₂O in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of oxides, is 2.00% to 4.00%, preferably 2.10% to 3.95%, and more preferably 2.10% to 3.90%.

[0134] In some embodiments of this application, the Na2O content in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of oxides, can be 2.00%, 2.10%, 2.20%, 2.30%, 2.40%, 2.50%, 2.60%, 2.70%, 2.80%, 2.90%, 3.00%, 3.10%, 3.20%, 3.30%, 3.40%, 3.50%, 3.60%, 3.70%, 3.80%, 3.90%, 4.00%, 3.47%, 2.14%, 3.11%, 2.66%, 3.08%, 2.41%, 2.32%, or 2.84%, or can be a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass or substrate glass with the desired performance of this application can be obtained. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other ranges, as long as the tempered glass or substrate glass with the desired performance of this application can be obtained.

[0135] In some embodiments of this application, the K2O content in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of oxides, can be 2.00%, 2.10%, 2.20%, 2.30%, 2.40%, 2.50%, 2.60%, 2.70%, 2.80%, 2.90%, 3.00%, 3.10%, 3.20%, 3.30%, 3.40%, 3.50%, 3.60%, 3.70%, 3.80%, 3.90%, 4.00%, 3.83%, 3.02%, 3.72%, 2.42%, 3.74%, 2.15%, 3.34%, or 2.34%, or can be a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass or substrate glass with the desired performance of this application can be obtained. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other ranges, as long as the tempered glass or substrate glass with the desired performance of this application can be obtained.

[0136] In this application, ZrO2 can increase the crystal content of the glass and refine the grain size. Insufficient ZrO2 content will not function as a nucleating agent, while excessive content will easily lead to deposition during high-temperature melting, affecting the crystallization performance of the strengthened glass material. In some embodiments of this application, the mass percentage of ZrO2 in the strengthened glass or the substrate glass used to prepare the strengthened glass, based on the mass percentage of oxides, is 5.00% to 7.00%, preferably 2.10% to 3.95%, and more preferably 2.10% to 3.90%.

[0137] In some embodiments of this application, the ZrO2 content in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of oxides, can be 5.00%, 5.10%, 5.20%, 5.30%, 5.40%, 5.50%, 5.60%, 5.70%, 5.80%, 5.90%, 6.00%, 6.10%, 6.20%, 6.30%, 6.40%, 6.50%, 6.60%, 6.70%, 6.80%, 6.90%, 7.00%, 5.62%, 5.12%, 5.74%, 6.25%, 5.71%, 6.78%, 5.54%, or 5.77%, or can be a value within a range of values ​​defined by any two of the above specific values ​​as endpoints, as long as the tempered glass or substrate glass with the desired performance of this application can be obtained. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other ranges, as long as the tempered glass or substrate glass with the desired performance of this application can be obtained.

[0138] In this application, X is Ag, Cu, Au, Bi, and / or their respective oxides. In some embodiments of this application, the content of X in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of the oxide, can be 0.05%, 0.1%, 0.20%, 0.22%, 0.24%, 0.26%, 0.28%, 0.30%, 0.32%, 0.34%, 0.36%, 0.38%, 0.40%, 0.42%, 0.44%, 0.46%, 0.48%, 0.50%, 0.60%, 0.70%, or 0.80%, or a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass or substrate glass with the desired performance of this application is obtained. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other ranges, as long as the tempered glass or substrate glass with the desired performance of this application is obtained.

[0139] In some embodiments of this application, the mass percentage of Ag2O is 0.05% to 0.80%, preferably 0.21% to 0.49%, and more preferably 0.22% to 0.48%. In some embodiments of this application, the Ag2O content in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of oxides, can be 0.05%, 0.1%, 0.20%, 0.22%, 0.24%, 0.26%, 0.28%, 0.30%, 0.32%, 0.34%, 0.36%, 0.38%, 0.40%, 0.42%, 0.44%, 0.46%, 0.48%, 0.50%, 0.25%, 0.41%, 0.37%, 0.35%, 0.39%, 0.33%, 0.43%, 0.50%, 0.60%, 0.70%, or 0.80%, or can be a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass or substrate glass with the desired performance of this application can be obtained. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other ranges, as long as the tempered glass or substrate glass with the desired performance of this application can be obtained.

[0140] In this application, CeO2 is a photosensitizer, and Ag is used. + When the CeO2 content is below 0.05%, insufficient electrons are provided, resulting in an excessively low crystal content and increased light transmittance in the exposed glass area. When the CeO2 content is above 0.13%, the transmittance of the glass in the ultraviolet exposure band decreases, the penetration depth of ultraviolet light decreases, and the density of the exposed area increases significantly. In some embodiments of this application, the mass percentage of CeO2 in the composition of the tempered glass or the substrate glass used to prepare the tempered glass is 0.05% to 0.13%, preferably 0.05% to 0.12%, and more preferably 0.06% to 0.12%, based on the mass percentage of oxides.

[0141] In some embodiments of this application, the CeO2 content in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of oxides, can be 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.10%, 0.11%, 0.12%, or 0.13%, or can be a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass or substrate glass with the desired performance of this application is obtained. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other ranges, as long as the tempered glass or substrate glass with the desired performance of this application is obtained.

[0142] In this application, Sb₂O₃ is a weak reducing agent and also acts as a clarifying agent. 3+ During the glass melting process, it will react with Ce. 4+ A redox reaction occurs, maintaining Ce 3+ The effective content. In some embodiments of this application, the mass percentage of Sb2O3 in the composition of the tempered glass or the substrate glass used to prepare the tempered glass is 0.05% to 0.50%, preferably 0.06% to 0.48%, and more preferably 0.07% to 0.46%, based on the mass percentage of oxides.

[0143] In some embodiments of this application, the Sb₂O₃ content in the composition of the tempered glass or the substrate glass used to prepare the tempered glass, based on the mass percentage of oxides, can be 0.05%, 0.10%, 0.15%, 0.20%, 0.25%, 0.30%, 0.35%, 0.40%, 0.45%, 0.50%, 0.27%, 0.32%, 0.09%, 0.12%, 0.16%, 0.07%, or 0.43%, or a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass or substrate glass with the desired performance of this application is obtained. It should be understood that in specific embodiments, any of the above ranges can be combined with any other ranges, as long as the tempered glass or substrate glass with the desired performance of this application is obtained.

[0144] In some embodiments of this application, the exposed area has low transmittance in the infrared wavelength range, while the unexposed area has high transmittance in the infrared wavelength range. Strengthened glass that meets these transmittance requirements ensures good light transmission and transparency in the unexposed area, while the exposed area has low transmittance and good shielding effect, making it suitable for use in cover glass where light source shielding is required. Here, "infrared wavelength range" refers to light with wavelengths from 750nm to 1000nm.

[0145] In some embodiments of this application, with a thickness of 0.70 mm, for 550 nm wavelength light, the transmittance T1 of the exposed area is less than 20%, preferably less than 10%, preferably less than 5%, preferably 0%, and the transmittance T2 of the unexposed area is above 90%.

[0146] In some embodiments, with a thickness of 0.70 mm, the transmittance T2 of the unexposed area for 550 nm wavelength light can be 90.00%, 90.10%, 90.20%, 90.30%, 90.40%, 90.50%, 91.00%, 92.00%, 91.05%, 90.98%, 90.73%, 90.83%, 90.65%, 90.51%, 91.02%, or 91.02%, or a value within a range defined by any two of the above specific values ​​as endpoints, as long as the strengthened glass with the desired performance of this application is obtained. It should be understood that in specific embodiments, any of the above ranges can be combined with any other ranges, as long as the strengthened glass with the desired performance of this application is obtained.

[0147] In some embodiments of this application, with a thickness of 0.70 mm, for 850 nm wavelength light, the transmittance T3 of the exposed area is 0% to 10%, preferably less than 5%, and the transmittance T4 of the unexposed area is above 90%.

[0148] In some embodiments, with a thickness of 0.70 mm, the transmittance T4 of the unexposed area for 850 nm wavelength light can be 90.00%, 90.10%, 90.20%, 90.30%, 90.40%, 90.50%, 91.00%, 92.00%, 92.23%, 91.54%, 91.35%, 91.46%, 91.21%, 91.15%, 92.09%, or 91.76%, or a value within a range defined by any two of the above specific values ​​as endpoints, as long as the strengthened glass with the desired performance of this application is obtained. It should be understood that in specific embodiments, any of the above ranges can be combined with any other range, as long as the strengthened glass with the desired performance of this application is obtained.

[0149] In some embodiments, the crystal phase of the exposed region includes one or more of lithium metasilicate, lithium disilicate, lithium feldspar, quartz, spodumene, nepheline, zinc oxide, Ag nanocrystals, Cu nanocrystals, Au nanocrystals, and Bi nanocrystals.

[0150] In some embodiments, the crystalline phase of the non-exposed region includes one or more of lithium metasilicate, lithium disilicate, lithium feldspar, quartz, spodumene, nepheline, zinc oxide, Ag nanocrystals, Cu nanocrystals, Au nanocrystals, and Bi nanocrystals.

[0151] In some embodiments, the tempered glass is primary tempered glass, secondary tempered glass, or microcrystalline glass (including primary tempered microcrystalline glass, secondary tempered microcrystalline glass, or multiple tempered microcrystalline glass).

[0152] In some embodiments, the substrate glass may also be plain glass, nucleated glass (e.g., glass that has only undergone nucleation but not crystallization), or microcrystalline glass (e.g., single-crystallized microcrystalline glass, double-crystallized microcrystalline glass, or multi-crystallized microcrystalline glass).

[0153] Understandably, the crystallinity of single-strength microcrystalline glass, double-strength microcrystalline glass, multiple-strength microcrystalline glass, single-crystallized microcrystalline glass, double-crystallized microcrystalline glass, or multiple-crystallized microcrystalline glass can all be 10%-100%.

[0154] In some embodiments of this application, both the exposed area and the non-exposed area can be microcrystalline glass, or the exposed area can be microcrystalline glass and the non-exposed area can be non-microcrystalline glass.

[0155] In some embodiments of this application, the crystal phase of the exposed region includes one or more of lithium metasilicate, lithium disilicate, lepidolite, quartz, spodumene, nepheline, zinc oxide, Ag nanocrystals, Cu nanocrystals, Au nanocrystals, and Bi nanocrystals; the crystal phase of the non-exposed region includes one or more of lithium metasilicate, lithium disilicate, lepidolite, quartz, spodumene, nepheline, zinc oxide, Ag nanocrystals, Cu nanocrystals, Au nanocrystals, and Bi nanocrystals.

[0156] In this application, warpage refers to the warpage caused by shrinkage or expansion due to crystal precipitation in different regions during the heat treatment of the substrate glass. In some embodiments of this application, the warpage is no greater than 100 μm, preferably no greater than 90 μm, and more preferably no greater than 80 μm.

[0157] In some embodiments, the warpage of the tempered glass can be 5μm, 10μm, 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, 60μm, 65μm, 70μm, 75μm, 80μm, 85μm, 90μm, 95μm, or 100μm, or it can be a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass with the desired performance of this application is obtained. It should be understood that in specific embodiments, any of the above ranges can be combined with any other range, as long as the tempered glass with the desired performance of this application is obtained.

[0158] In some embodiments of this application, the tempered glass is planar or curved.

[0159] In some embodiments of this application, the thickness of the tempered glass is not particularly limited, for example, it can be 0.4 to 2.0 mm; preferably 0.4 to 1.0 mm. In some embodiments of the present invention, the thickness of the tempered glass can be 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, or 2.0 mm, or it can be a value within the range formed by any two of the above specific values ​​as endpoints, as long as the tempered glass with the desired performance of this application can be obtained. It should be understood that, in specific embodiments, any of the above ranges can be combined with any other range, as long as the tempered glass with the desired performance of this application can be obtained.

[0160] In this application, chemical fortification can be carried out using existing and known methods; for example, chemical fortification includes single-step chemical fortification or multi-step chemical fortification. In some embodiments of this application, the single-step chemical fortification uses a salt bath containing NaNO3; preferably, the content of NaNO3 is 30-100 wt%; more preferably, the single-step chemical fortification uses a mixed salt bath containing NaNO3 and KNO3, preferably, the content of KNO3 in the mixed salt bath is 80-100 wt%, and the content of NaNO3 is 0-20 wt%.

[0161] In some embodiments of this application, the temperature of the single-step chemical enhancement is 380-480°C, and preferably, the ion exchange time of the single-step chemical enhancement is 5-10 h.

[0162] In some embodiments of this application, the multi-step chemical strengthening includes two-step chemical strengthening, wherein the first step of chemical strengthening uses a salt bath containing NaNO3, preferably with a NaNO3 content of 30-100 wt%; and the second step of chemical strengthening uses a salt bath containing KNO3, preferably with a KNO3 content of 60-100 wt%.

[0163] In some embodiments of this application, the temperature of the first step of chemical strengthening is 380-480°C, and the time of the first step of chemical strengthening is preferably 3-10 h; preferably, the temperature of the second step of chemical strengthening is 380-480°C, and the time of the second step of chemical strengthening is preferably 5-30 min.

[0164] In some embodiments of this application, the CS_50 of the tempered glass described herein is 50MPa to 100MPa, preferably 55MPa to 95MPa. In some embodiments of the present invention, the CS_50 of the colored chemically tempered glass described herein is 50MPa, 55MPa, 60MPa, 65MPa, 70MPa, 75MPa, 80MPa, 82MPa, 84MPa, 86MPa, 88MPa, 90MPa, 92MPa, 94MPa, 96MPa, 98MPa, or 100MPa, or it can be a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass with the desired performance of this application is obtained. It should be understood that in specific embodiments, any of the above ranges can be combined with any other range, as long as the tempered glass with the desired performance of this application is obtained.

[0165] In some embodiments of this application, the surface CS of the tempered glass is 300 MPa or higher, preferably 350 MPa or higher, and more preferably 300 MPa to 600 MPa. In some embodiments of this application, the surface CS of the chemically tempered glass is 350 MPa, 380 MPa, 400 MPa, 450 MPa, 500 MPa, or 600 MPa, or can be a value within a range defined by any two of the above specific values ​​as endpoints, as long as the tempered glass with the desired performance of this application is obtained. It should be understood that in specific embodiments, any of the above ranges can be combined with any other range, as long as the tempered glass with the desired performance of this application is obtained.

[0166] The method for preparing tempered glass in this application includes: obtaining a substrate glass; performing a masking treatment on a first region of the substrate glass, and not performing a masking treatment on a second region of the substrate glass; and then processing the first region and the second region to obtain a non-exposed region and an exposed region, respectively. The processing treatment includes radiation treatment, heat treatment, and tempering treatment. The first region of the substrate glass corresponds to the first region of the tempered glass, and the second region of the substrate glass corresponds to the second region of the tempered glass.

[0167] In this application, the substrate glass can be prepared using existing forming methods, and this application has no limitations on this. For example, the forming method of the substrate glass may include, but is not limited to, float glass, overflow glass, calendering, or casting processes. For instance, by uniformly mixing the components according to the formula, melting and forming the substrate glass, and then cooling and annealing it, the substrate glass can be obtained.

[0168] For example, raw materials (common industrial raw materials) are prepared according to the formula ratio, a clarifying agent is added, and then mixed for a period of time to obtain a uniformly mixed raw material mixture. The raw material mixture is placed in a platinum crucible and heated to 1250℃~1680℃, preferably a melting temperature of 1480℃~1680℃, and preferably held at this temperature for 3~12 hours. Then, it is poured into a molding die for cooling and shaping, preferably cooled to 750℃~1000℃, and then placed in an annealing furnace for annealing treatment, preferably at an annealing temperature of 400℃~650℃, and preferably for an annealing time of 10~48 hours. Afterward, it is cooled to room temperature in the furnace to obtain the substrate glass. Those skilled in the art can select the type and amount of clarifying agent according to their needs without any inventive effort. Furthermore, the clarifying agent may include, but is not limited to, one or more of sodium chloride, tin oxide, antimony oxide, or arsenic oxide, and the amount of clarifying agent added may be 0wt%-1wt% of the total amount of each raw material.

[0169] In some embodiments of this application, the radiation treatment includes ultraviolet irradiation treatment, wherein the wavelength of the ultraviolet irradiation treatment is 300 nm to 320 nm, and the intensity of the ultraviolet irradiation treatment is 240 mW / cm². 2 ~260mw / cm 2 In some embodiments of this application, the substrate glass is masked prior to the radiation treatment to form the non-exposed area after the radiation and heat treatments. The masking treatment includes masking the substrate glass using masking ink and / or a mask. The structure of the mask 5 is shown below. Figure 1 It has one of 36, 48, or 90 composite circular holes, each of which has a light-transmitting area 51 within its inner diameter and a light-blocking area 52 excluding the inner diameter. A schematic diagram of the composite circular hole structure is shown below. Figure 2 As shown, the structure of the corresponding reinforced glass 6 is described in [reference needed]. Figure 3 The position corresponding to the light-transmitting area 51 forms the exposure area 61, and the position corresponding to the light-blocking area 52 forms the non-exposure area 62.

[0170] In some embodiments of this application, the heat treatment process of the substrate glass may include nucleation and / or crystallization, preferably both nucleation and crystallization. In some embodiments, the crystallization process includes a one-step crystallization process or a multi-step crystallization process. In some embodiments, to prepare curved tempered glass, a two-step crystallization process may be used. When a two-step crystallization process is used, the second crystallization process involves placing the crystallized glass material obtained from the first crystallization process into a hot bending mold, heating it to the crystallization temperature, and performing 3D hot bending forming.

[0171] In some embodiments of this application, in order to obtain the desired physicochemical properties from the tempered glass, the heat treatment of the substrate glass can be performed in one step, or in two or more steps. A one-step heat treatment means that nucleation (i.e., nucleation) is not performed separately; instead, the temperature is directly increased in one step, and nucleation and target crystal growth occur at the temperature reached during this one-step heating process. This can be understood as direct crystallization. A two-step heat treatment means that two heating processes are performed: first, nucleation (i.e., nucleation), and then target crystal growth (i.e., crystallization).

[0172] To induce the precipitation of the desired crystalline phase and obtain the desired physicochemical properties in the strengthened glass, the nucleation treatment temperature can be 450℃~600℃, and the nucleation treatment time can be 180min~300min, preferably 210min~270min; the crystallization treatment temperature can be 550℃~800℃, and the crystallization treatment time can be 30min~180min, preferably 60min~120min. During heat treatment, the heating rate is preferably controlled at 1℃ / min~10℃ / min, more preferably 10℃ / min. Here, the nucleation treatment temperature refers to the temperature at which crystal nuclei can form. The crystallization treatment temperature refers to the temperature at which the target crystal can grow in a controllable manner.

[0173] Before and / or after heat treatment, those skilled in the art may perform other conventional steps to obtain tempered glass samples that meet the required specifications or requirements. These steps may include shaping, cutting (e.g., using a multi-wire cutting machine), CNC machining, thinning, or polishing. This application does not limit the dimensional processing of the substrate glass or tempered glass samples; for example, they may be 50mm × 50mm × 1.0mm, 300mm × 120mm × 0.7mm, etc.

[0174] The high-performance tempered glass provided in this application can be used in electronic devices, including but not limited to mobile phones, tablets, handheld game consoles, portable digital devices (e.g., digital cameras), smart home devices, and smart wearables (e.g., smart bracelets, smartwatches, smart glasses). It can also be used in vehicles, aircraft, or spacecraft, and in any glass device requiring tempered glass. For example, it can be used for the back cover glass of mobile phones and smartwatches; for example, it can be used for windshields of vehicles, aircraft, or spacecraft, such as front or side windshields. For example, it can be used for worktops, other surfaces, appliance doors, floor tiles, wall panels, or storage containers. Other surfaces may include, but are not limited to, exterior wall surfaces, stair tread surfaces, column cladding, or countertop surfaces; storage containers may include, but are not limited to, cups, plates, medicine bottles, or beverage bottles.

[0175] For example, the high-performance tempered glass provided in this application can be used to manufacture glass devices. The glass devices referred to herein can be regular or irregular, and can be manufactured according to the needs of those skilled in the art.

[0176] For example, the high-performance tempered glass provided in this application can be used to manufacture cover glass, which can be the back cover or camera protective cover of electronic devices such as mobile phones. For example, the high-performance tempered glass provided in this application can be used in electronic devices. (Reference) Figure 4 , Figure 5 and Figure 6 In some embodiments of this application, an electronic device is provided, which may be a mobile phone (e.g., Figure 5 (As shown), it can also be a tablet computer, smart wearable device (such as...) Figure 6 As shown, tempered glass can be used as the back cover of a smartwatch and other electronic products. The electronic device includes a housing 1 assembled on the outside of the electronic device. The housing 1 includes a display screen cover assembled on the front side and a back cover 12 assembled on the rear side. The display screen cover is disposed on the display module 4. The back cover 12 uses the aforementioned tempered glass. In this application, the back cover 12 may be entirely made of the aforementioned tempered glass, or it may only be partially made of the aforementioned tempered glass. In this application, the display screen may be a touch screen, and the display screen cover may be a protective cover disposed on the touch screen. In this application, the back cover 12 may only cover the rear side of the electronic device (and the side away from the display screen), or it may cover both the rear side and the side frame of the electronic device. Optionally, the back cover 12 may cover all the side frames around the electronic device, or it may cover only part of the side frames.

[0177] In some embodiments of this application, such as Figure 4 As shown, the electronic device also includes a camera assembly 2 located inside the housing 1. The housing 1 may include a camera protective cover 13, which covers the camera assembly 2 to protect it. The camera protective cover 13 is made of the aforementioned tempered glass. In this application, the camera protective cover 13 may be partially or entirely made of the aforementioned tempered glass. In this application, the location of the camera protective cover 13 depends on the location of the camera assembly 2; it may be located on the front side of the electronic device or on the rear side. In some embodiments of this application, the camera protective cover 13 may be a separate structure from the rear cover 12. In other embodiments of this application, the camera protective cover 13 may be an integral structure with the rear cover 12.

[0178] In some embodiments of this application, such as Figure 5As shown, the electronic device may also include a mid-frame 3 located between the display module 4 and the housing 1, and the mid-frame 3 may include the aforementioned reinforced glass.

[0179] In this embodiment of the application, the back cover and camera protection cover of the electronic device can be made of the aforementioned tempered glass, or both of them can be made of the aforementioned tempered glass.

[0180] The technical solutions of this application will be further described in detail below with reference to the embodiments. The embodiments of this application described in detail below are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0181] Example 1

[0182] A type of reinforced glass, the preparation process of which is as follows:

[0183] (1) Preparation of substrate glass:

[0184] Prepare each raw material (conventional industrial raw material) according to the proportions of each component in Table 1. The total mass of the prepared raw materials is 5000g. Add 10g of clarifying agent sodium chloride (NaCl) to the prepared raw materials, and then mix with a V-type mixer for 30 minutes to obtain a uniformly mixed raw material mixture.

[0185] The raw material mixture is transferred to a melting furnace and melted at 1500℃. The melt is stirred with a platinum stirring rod for 12 hours, then drawn into shape and continuously pulled into glass bricks of the required specifications. The glass bricks are then quickly placed in an annealing furnace at 450℃ and held for 5 hours, after which they are allowed to cool naturally to room temperature to obtain the base glass bricks.

[0186] After the obtained substrate glass brick is sequentially cut, CNC machined (the CNC instrument used in this application is model: RCG500S), and polished, a substrate glass sample that meets the required specifications and requirements can be obtained. In Examples 1 to 8 of this application, the substrate glass sample brick is subjected to the aforementioned cold working treatment to make a glass substrate with dimensions of 300mm × 120mm × 0.7mm.

[0187] (2) Preparation of tempered glass: The glass substrate was ultrasonically cleaned sequentially in deionized water, anhydrous ethanol, propanol, and deionized water for 10 min, and then dried in a drying oven; the glass substrate and the mask were fixed together and placed horizontally in the predetermined line of the ultraviolet parallel spot, with the mask on top and the glass substrate below, the wavelength of ultraviolet irradiation was 310 nm, and the irradiation intensity was 250 mw / cm. 2The exposure time is 10 minutes; the exposed glass substrate is then separated from the mask; and then heat-treated according to the heat treatment process in Table 1 to obtain crystallized glass. The mask used has 90 composite circular holes, each with a light-transmitting area and a light-blocking area, as shown in the structure... Figure 2 As shown in the figure. The heat treatment includes nucleation and crystallization, with a heating rate of 10℃ / min for both. The crystallized glass sample obtained above is then processed according to a two-step chemical strengthening process to obtain strengthened glass. The specific two-step chemical strengthening process conditions are shown in Table 1.

[0188] The warpage of the test substrate glass during heat treatment is shown in Table 1.

[0189] The following tests were conducted on the strengthened glass sample obtained in Example 1:

[0190] The crystal phase content, density, and transmittance of the exposed and unexposed areas of the tempered glass samples were tested separately (under wavelengths of 550 nm, 850 nm, and 1000 nm), and the results are shown in Table 1.

[0191] Examples 2 to 8

[0192] Each of these experiments was conducted in accordance with Example 1, except that the raw material composition, different process parameters, and corresponding test results for each example are shown in the table below.

[0193] The XRD patterns of the exposed and unexposed areas of the tempered glass in Example 1 are as follows: Figure 7 As shown in the figure, the crystal structure of the tempered glass contains lithium metasilicate.

[0194] The transmittance curves of the exposed and unexposed areas of the tempered glass in Example 7 are as follows: Figure 8 As shown in the figure, the exposed area of ​​the tempered glass has low transmittance in the infrared wavelength range, while the unexposed area of ​​the tempered glass has high transmittance in the infrared wavelength range.

[0195] Table 1

[0196]

[0197]

[0198]

[0199] As can be seen from the embodiments in Table 1 above, in each embodiment of this application, the difference Δρ between the average density ρ1 of the exposed area and the average density ρ2 of the unexposed area of ​​the tempered glass is less than or equal to 0.01 g / cm³. 3Within this range, the reinforced glass exhibits low warpage, below 80 μm.

[0200] The above description is merely a specific embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A type of tempered glass, characterized in that, The tempered glass is obtained by processing a substrate glass. The substrate glass includes a first region and a second region. After the first region is masked, the first region and the second region are processed to obtain a non-exposed region and an exposed region, respectively. The second region is the region that is not masked. The first region of the substrate glass corresponds to the first region of the tempered glass, and the second region of the substrate glass corresponds to the second region of the tempered glass. The processing includes radiation treatment, heat treatment and strengthening treatment. The radiation treatment includes ultraviolet irradiation treatment. The heat treatment includes nucleation treatment and crystallization treatment. The tempered glass includes an exposed area and a non-exposed area. The average density ρ1 of the exposed area is greater than the average density ρ2 of the non-exposed area, and the difference Δρ between the average density ρ1 of the exposed area and the average density ρ2 of the non-exposed area is ≤0.01 g / cm³. 3 The exposed region has a lithium metasilicate crystal phase, and the unexposed region has a lithium metasilicate crystal phase. The composition of the tempered glass, based on the mass percentage of oxides, comprises: SiO2: 65.00%~75.00%, Al2O3: 5.00%~10.00%, Li2O: 7.00%~13.00%, Na2O: 2.00%~4.00%, K2O: 2.00%~4.00%, ZrO2: 5.00%~7.00%, X: 0.05%~0.80%, CeO2: 0.05%~0.13%, and Sb2O3: 0%~0.50%. Where X is Ag, Cu, Au, Bi and / or their respective oxides.

2. The tempered glass according to claim 1, characterized in that, The difference Δρ between the average density ρ1 of the exposed area and the average density ρ2 of the unexposed area is ≤0.005 g / cm³. 3 .

3. The tempered glass according to claim 1, characterized in that, The processing also includes one or more of the following: pre-chemical forging cutting, CNC machining, grinding and polishing, cleaning, 3D hot bending, and sweeping.

4. The tempered glass according to claim 1, characterized in that, The masking process includes masking using masking inks and / or masks.

5. The tempered glass according to claim 1, characterized in that, The wavelength of the ultraviolet irradiation treatment is 300 nm to 320 nm; and / or, the intensity of the ultraviolet irradiation treatment is 240 mw / cm². 2 ~260mw / cm 2 .

6. The tempered glass according to claim 1, characterized in that, The heating rate of the nucleation treatment is 1℃ / min to 10℃ / min; and / or, The nucleation treatment is performed at a temperature of 450℃~600℃; and / or, The nucleation treatment time is 180 min to 300 min; and / or, The temperature rise rate for the crystallization treatment is 1℃ / min ~ 10℃ / min; and / or, The crystallization treatment temperature is 550℃~800℃; and / or, The crystallization process takes 30 to 180 minutes.

7. The tempered glass according to claim 1, characterized in that, The difference Δρ between the average density ρ1 of the exposed area and the average density ρ2 of the unexposed area is 0.0005 g / cm³. 3 0.005 g / cm 3 0.007 g / cm 3 0.0066 g / cm 3 0.0025 g / cm 3 0.0032 g / cm 3 0.0049 g / cm 3 Or 0.0096 g / cm 3 .

8. The tempered glass according to any one of claims 1 to 7, characterized in that, The average density ρ1 of the exposed area satisfies 2.0000 g / cm³. 3 ≤ρ1≤3.0000 g / cm 3 ; and / or, The average density ρ2 of the non-exposed region satisfies 2.0000 g / cm³. 3 ≤ρ2≤3.0000 g / cm 3 .

9. The tempered glass according to claim 8, characterized in that, The average density ρ1 of the exposed area satisfies 2.3000 g / cm³. 3 ≤ρ1≤2.7000 g / cm 3 ; and / or, The average density ρ2 of the unexposed region satisfies 2.3000 g / cm³. 3 ≤ρ2≤2.7000 g / cm 3 .

10. The tempered glass according to claim 9, characterized in that, The average density ρ1 of the exposed area satisfies 2.3000 g / cm³. 3 ≤ρ1≤2.5000 g / cm 3 ; and / or, The average density ρ2 of the non-exposed region satisfies 2.4000 g / cm³. 3 ≤ρ2≤2.5000 g / cm 3 .

11. The tempered glass according to any one of claims 1 to 7, characterized in that, The average density ρ1 of the exposed area is 2.4714 g / cm³. 3 2.4846 g / cm 3 2.4896 g / cm 3 2.4872 g / cm 3 2.4918 g / cm 3 2.4964 g / cm 3 2.4753 g / cm 3 Or 2.4832 g / cm 3 ; and / or The average density ρ2 of the unexposed region is 2.4709 g / cm³. 3 2.4796 g / cm 3 2.4826 g / cm 3 2.4806 g / cm 3 2.4893 g / cm 3 2.4932 g / cm 3 2.4704 g / cm 3 Or 2.4736 g / cm 3 .

12. The tempered glass according to any one of claims 1 to 7, characterized in that, The average crystal content X in the exposed area C1 Greater than the average crystal content X in the non-exposed region C2 ; and / or, The average crystal content X in the exposed area, expressed as a percentage by mass. C1 Satisfying 3.00% ≤ X C1 ≤25.00%; and / or, The average crystal content X in the unexposed region, expressed as a percentage by mass. C2 Satisfying 0.50% ≤ X C2 ≤20.00%.

13. The tempered glass according to claim 12, characterized in that, The average crystal content X in the exposed area, expressed as a percentage by mass. C1 Satisfies 4.00%≤X C1 ≤20.00%; and / or, The average crystal content X in the unexposed region, expressed as a percentage by mass. C2 Satisfying 1.00% ≤ X C2 ≤18.00%.

14. The tempered glass according to claim 13, characterized in that, The average crystal content X in the exposed area, expressed as a percentage by mass. C1 Satisfies 4.00%≤X C1 ≤15.00%; and / or, The average crystal content X in the unexposed region, expressed as a percentage by mass. C2 Satisfying 1.40%≤X C2 ≤13.00%.

15. The tempered glass according to claim 8, characterized in that, The average crystal content X in the exposed area C1 Greater than the average crystal content X in the non-exposed region C2 ; and / or, The average crystal content X in the exposed area, expressed as a percentage by mass. C1 Satisfying 3.00% ≤ X C1 ≤25.00%; and / or, The average crystal content X in the unexposed region, expressed as a percentage by mass. C2 Satisfying 0.50% ≤ X C2 ≤20.00%.

16. The tempered glass according to any one of claims 1 to 7, characterized in that, The average crystal content X in the exposed area, expressed as a percentage by mass. C1 The percentages are 4.27%, 7.12%, 8.31%, 7.53%, 10.23%, 14.42%, 5.42%, or 6.32%; and / or, The average crystal content X in the unexposed region, expressed as a percentage by mass. C2 The percentages are 1.49%, 5.14%, 6.35%, 5.65%, 8.54%, 12.53%, 3.56%, or 4.45%.

17. The tempered glass according to any one of claims 1 to 7, characterized in that, The composition of the tempered glass, based on the mass percentage of oxides, comprises: The mass percentage of SiO2 is 66.00%~74.50%; and / or, The mass percentage of Al2O3 is 5.10%~9.70%; and / or, The mass percentage of Li2O is 7.10%~12.80%; and / or, The mass percentage of Na₂O is 2.10%~3.80%; and / or, The mass percentage of K2O is 2.10%~3.95%; and / or, The mass percentage of ZrO2 is 5.10%~6.90%; and / or, The mass percentage of Ag2O is 0.05%~0.80%; and / or, The mass percentage of CeO2 is 0.05%~0.12%; and / or, The mass percentage of Sb2O3 is 0.06%~0.48%.

18. The tempered glass according to claim 17, characterized in that, The composition of the tempered glass, based on the mass percentage of oxides, comprises: The mass percentage of SiO2 is 66.50%~74.00%; and / or, The mass percentage of Al2O3 is 5.20%~9.40%; and / or, The mass percentage of Li2O is 7.20%~12.60%.

19. The tempered glass according to any one of claims 1 to 7, characterized in that, The composition of the tempered glass, based on the mass percentage of oxides, comprises: The mass percentages of SiO2 are 66.93%, 68.16%, 70.07%, 72.61%, 70.01%, 73.52%, 69.94%, or 72.40%; and / or, The mass percentages of Al2O3 are 7.19%, 9.19%, 7.86%, 5.23%, 7.87%, 7.35%, 8.36%, or 5.87%; and / or, The mass percentages of Li₂O are 12.32%, 11.56%, 8.95%, 10.25%, 8.93%, 7.33%, 9.77%, or 9.80%; and / or, The mass percentage of Na₂O is 3.47%, 2.14%, 3.11%, 2.66%, 3.08%, 2.41%, 2.32%, or 2.84%; and / or, The mass percentage of K2O is 3.83%, 3.02%, 3.72%, 2.42%, 3.74%, 2.15%, 3.34%, or 2.34%; and / or, The ZrO2 mass percentages are 5.62%, 5.12%, 5.74%, 6.25%, 5.71%, 6.78%, 5.54%, or 5.77%; and / or, The mass percentage of Ag2O is 0.25%, 0.41%, 0.37%, 0.35%, 0.39%, 0.33%, 0.28%, or 0.43%; and / or, The mass percentage of CeO2 is 0.08%, 0.09%, 0.11%, 0.06%, 0.10%, or 0.12%; and / or, The mass percentages of Sb₂O₃ are 0.27%, 0.32%, 0.09%, 0.12%, 0.16%, 0.07%, 0.35%, or 0.43%.

20. The tempered glass according to any one of claims 1 to 7, characterized in that, The surface CS of the reinforced glass is above 300MPa.

21. The tempered glass according to claim 20, characterized in that, The surface CS of the reinforced glass is above 350 MPa.

22. The tempered glass according to claim 16, characterized in that, The surface CS of the reinforced glass is above 300MPa.

23. The tempered glass according to any one of claims 1 to 7, characterized in that, The CS_50 of the tempered glass is 50 MPa to 100 MPa. CS_50 refers to the compressive stress value at a depth of 50 μm from the glass surface.

24. The tempered glass according to claim 23, characterized in that, The CS_50 of the tempered glass is 55 MPa to 95 MPa.

25. The tempered glass according to claim 22, characterized in that, The CS_50 of the tempered glass is 50 MPa to 100 MPa. CS_50 refers to the compressive stress value at a depth of 50 μm from the glass surface.

26. The tempered glass according to any one of claims 1 to 7, characterized in that, The exposed area has low transmittance in the infrared wavelength range, and the unexposed area has high transmittance in the infrared wavelength range; and / or, At a thickness of 0.70 mm, for 550 nm wavelength light, the transmittance T1 of the exposed area is less than 20%; the transmittance T2 of the unexposed area is greater than 90%; and / or, At a thickness of 0.70 mm, for 850 nm wavelength light, the transmittance T3 of the exposed area is 0%~10%, and the transmittance T4 of the unexposed area is above 90%; and / or With a thickness of 0.70 mm, for light with a wavelength of 1000 nm, the transmittance T5 of the exposed area is 0%~5%, and the transmittance T6 of the unexposed area is above 90%.

27. The tempered glass according to claim 26, characterized in that, At a thickness of 0.70 mm, for 550 nm wavelength light, the transmittance T1 of the exposed area is less than 10%; the transmittance T2 of the unexposed area is greater than 90%; and / or, At a thickness of 0.70 mm, for 850 nm wavelength light, the transmittance T3 of the exposed area is less than 5%, and the transmittance T4 of the unexposed area is above 90%.

28. The tempered glass according to claim 27, characterized in that, At a thickness of 0.70 mm, for 550 nm wavelength light, the transmittance T1 of the exposed area is less than 5%; the transmittance T2 of the unexposed area is above 90%.

29. The tempered glass according to claim 28, characterized in that, At a thickness of 0.70 mm, for 550 nm wavelength light, the transmittance T1 of the exposed area is 0%; the transmittance T2 of the unexposed area is above 90%.

30. The tempered glass according to claim 25, characterized in that, The exposed area has low transmittance in the infrared wavelength range, and the unexposed area has high transmittance in the infrared wavelength range; and / or, At a thickness of 0.70 mm, for 550 nm wavelength light, the transmittance T1 of the exposed area is less than 20%; the transmittance T2 of the unexposed area is greater than 90%; and / or, At a thickness of 0.70 mm, for 850 nm wavelength light, the transmittance T3 of the exposed area is 0%~10%, and the transmittance T4 of the unexposed area is above 90%; and / or With a thickness of 0.70 mm, for light with a wavelength of 1000 nm, the transmittance T5 of the exposed area is 0%~5%, and the transmittance T6 of the unexposed area is above 90%.

31. A method for preparing tempered glass according to any one of claims 1 to 30, characterized in that, The method includes: A substrate glass is obtained; a first region of the substrate glass is masked, while a second region of the substrate glass is not masked. Then, the first and second regions are processed to obtain a non-exposed region and an exposed region, respectively. The processing includes radiation treatment, heat treatment, and strengthening treatment. The first region of the substrate glass corresponds to the first region of the strengthened glass, and the second region of the substrate glass corresponds to the second region of the strengthened glass. The radiation treatment includes ultraviolet irradiation, and the heat treatment includes nucleation treatment and crystallization treatment. The average density ρ1 of the exposed area is greater than the average density ρ2 of the unexposed area, and the difference Δρ between the average density ρ1 of the exposed area and the average density ρ2 of the unexposed area is ≤0.01 g / cm³. 3 .

32. A cover glass, characterized in that, The cover glass is made of reinforced glass as described in any one of claims 1-30 or reinforced glass prepared by the preparation method described in claim 31.

33. An electronic device, characterized in that, The electronic device comprises the reinforced glass as described in any one of claims 1-30 or the reinforced glass prepared by the preparation method of claim 31.

34. The electronic device according to claim 33, characterized in that, The electronic device includes a housing, the housing comprising the reinforced glass as described in any one of claims 1-30 or the reinforced glass prepared by the preparation method of claim 31.

35. The electronic device according to claim 34, characterized in that, The electronic device further includes a camera assembly, and the housing includes a camera protective cover plate, which covers the camera assembly. The camera protective cover plate includes tempered glass as described in any one of claims 1-30 or tempered glass prepared by the preparation method of claim 31.

36. Use of the reinforced glass according to any one of claims 1-30 or the reinforced glass prepared by the preparation method according to claim 31 in components for mobile phones, wearable devices, camera modules or vehicles.

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