Metal corrosion inhibition packaging film, preparation method, application method and photovoltaic module packaging assembly

Abstract

The present invention discloses a metal corrosion-inhibiting encapsulating film comprising a thermosetting adhesive layer and a thermoplastic corrosion-inhibiting layer. The thermosetting adhesive layer is composed of the following raw materials, by weight: 100 parts of a cross-linkable matrix resin, 0.1-1 parts of a peroxide cross-linking agent, 0.1-1 parts of a co-crosslinking agent, 0.1-1 parts of a coupling agent, and 0.1-1 parts of a light stabilizer; the thermoplastic corrosion-inhibiting layer is composed of the following raw materials, by weight: 100 parts of a thermoplastic matrix resin, 1-20 parts of a plasticizer, 0.1-1 parts of a coupling agent, and 0.5-10 parts of a corrosion inhibitor. The resulting metal corrosion-inhibiting encapsulating film is used to prepare photovoltaic cell modules, solving the problem of shadows under solder strips and effectively preventing oxidative corrosion of active metal materials. The resulting photovoltaic cell exhibits low PID power attenuation, improving the long-term reliability of the photovoltaic module.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic encapsulation films, and in particular to a metal corrosion-inhibiting encapsulation film, a preparation method, an application method, and a photovoltaic module encapsulation assembly. Background Art

[0002] With technological advancements, solar cell busbar technology has evolved from MBB and SMBB to 0BB (busbar-free). Busbar-free technology is a further upgrade of SMBB technology, offering significant cost-saving advantages. Busbar-free technology eliminates the cell busbar and instead uses silver-coated copper paste to create fine grids, or employs copper electroplating to create grid lines, further reducing silver consumption. Furthermore, embedded circular copper solder strips replace the current-carrying function of the cell's silver busbar within the module. MBB modules typically use solder strips with a diameter of 0.2-0.4mm, while 0BB modules require only 0.2mm, resulting in a smaller shading area and increased module power. Busbar-free technology is currently widely used in IBC, HJT, and TOPCON cells.

[0003] Material Issues with Busbarless Technology: Busbarless technology utilizes low-cost silver-coated copper paste or electroplated pure copper to replace traditional pure silver thin grids. The battery's pure silver busbars are also replaced with embedded circular copper solder strips. Copper is more chemically active than silver, susceptible to oxidation and corrosion, and its conductivity degrades, placing higher demands on packaging materials. Patent CN117701189A utilizes magnesium oxide as an acid-absorbing material to absorb acetic acid and moisture from EVA, thereby improving issues such as cell solder strip corrosion, cell blackening, and film delamination. However, acetic acid generated during EVA aging inevitably corrodes the battery material.

[0004] Problems with busbar-free technology: In the busbar-free mass production process, a glue point (UV glue, hot melt glue, or other adhesives) is first applied to solidify the entire solder ribbon on the cell using UV lamps, ovens, and other equipment. The solder ribbon and cell are then alloyed through lamination. This solution differs from the soldering glue point solution in that it does not require welding and can be fixed by glue point or silk screen printing, resulting in strong stability. However, the conventional EVA and POE adhesive films currently used in the industry have low melting temperatures and high fluidity. During module encapsulation, the adhesive film material melts before the solder ribbon, resulting in a shadow under the solder ribbon during EL testing (the solder ribbon is wrapped by the EVA and POE materials and cannot form a conductive connection with the cell). To solve this problem, the industry uses electron radiation to pre-crosslink the EVA and POE adhesive films to reduce the fluidity of the adhesive film to solve the shadow under the solder ribbon during EL testing. However, the pre-crosslinked adhesive film results in insufficient bonding between the solder ribbon and the cell, poor module reliability, and a complex process with high costs. In addition, the busbar-less photovoltaic industry uses low-fluidity thermoplastic PVB film to solve the LE shadow problem, but the price of pure PVB film is high, which is not conducive to component cost reduction, efficiency improvement and application promotion.

[0005] In summary, the development of a metal corrosion inhibition packaging film and its practical application preparation method is of great significance. Summary of the Invention

[0006] In summary, the present invention is necessary to provide a metal corrosion-inhibiting encapsulation film that effectively prevents active metal materials from being oxidized and corroded, and the resulting photovoltaic cell has low PID power attenuation, thereby improving the long-term reliability of the photovoltaic module.

[0007] Necessarily, the present invention also provides a method for preparing the above-mentioned metal corrosion-inhibiting packaging film.

[0008] If necessary, the present invention also provides an application method of the above-mentioned metal corrosion inhibition packaging film.

[0009] More importantly, the present invention also provides a photovoltaic module packaging assembly.

[0010] The technical solution of the present invention is:

[0011] A metal corrosion inhibition packaging film comprises a heat-curing adhesive layer and a thermoplastic corrosion inhibition layer.

[0012] The heat-curing adhesive layer is composed of the following raw material components by weight: 100 parts of a cross-linkable base resin, 0.1-1 parts of a peroxide cross-linking agent, 0.1-1 parts of a co-cross-linking agent, 0.1-1 parts of a coupling agent, and 0.1-1 parts of a light stabilizer;

[0013] The thermoplastic corrosion inhibition layer is composed of the following raw material components in parts by weight: 100 parts of thermoplastic base resin, 1-20 parts of plasticizer, 0.1-1 part of coupling agent, and 0.5-10 parts of corrosion inhibitor.

[0014] Wherein, the corrosion inhibitor is selected from one or both of formulas A or B,

[0015]

[0016] In formulas [A] and [B]], R1, R2, and R3 are H, alkyl, aryl, or heterocyclic groups.

[0017] The corrosion inhibitor is composed of the following two substances A2 and B1, and the structural formula of A is

[0018] The structural formula of B is

[0019] The weight ratio of A to B is 1:1

[0020] Wherein, the cross-linkable matrix resin is selected from one or more of EVA, PVB, and POE resins.

[0021] Wherein, the thermoplastic matrix resin is selected from one or more of PVB resin, TPU resin, PVA resin, PA resin, PI resin and epoxy resin.

[0022] Wherein, the peroxide crosslinking agent is selected from one or more of tert-butyl peroxycarbonate-2-ethylhexyl, tert-amyl peroxy (2-ethylhexyl) carbonate, tert-butyl peroxybenzoate, tert-butyl peroxyacetate, tert-amyl peroxy-2-ethylhexanoate, tert-butyl peroxy-2-ethylhexanoate, and dicumyl peroxide;

[0023] The auxiliary cross-linking agent is selected from one or more of triallyl isocyanurate, trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, trimethylolpropane triethoxyacrylate, and triallyl isocyanate;

[0024] The coupling agent is selected from one or more of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(β-methoxyethoxy)silane, γ-methacryloxypropyltrimethoxysilane, vinyltri-tert-butoxysilane, 3-glycidyloxypropyltrimethoxysilane, and γ-aminopropyltriethoxysilane;

[0025] The light stabilizer is selected from hindered amine light stabilizers, including one or more of bis-2,2,6,6-tetramethylpiperidinol sebacate, poly(4-hydroxy-2,2,6,6-tetramethyl-1-piperidinethanol) succinate, and bis(2,2,6,6-tetramethyl-4-piperidinol) sebacate;

[0026] The plasticizer is selected from one or more of DOP, DOTP, hydrogenated DOTP, 3GO, DOA, DOS, and DBS.

[0027] Wherein, the thickness of the heat-curing adhesive layer is 0.30-0.60 mm, and the thickness of the thermoplastic corrosion inhibition layer is 10-200 μm.

[0028] A method for preparing the metal corrosion inhibition packaging film as described above is characterized by comprising the following steps:

[0029] Step 1, preparation of a heat-curing adhesive layer: by weight, 100 parts of a cross-linkable matrix resin, 0.1-1 parts of a peroxide cross-linking agent, 0.1-1 parts of a co-cross-linking agent, 0.1-1 parts of a coupling agent, and 0.1-1 parts of a light stabilizer are placed in a horizontal mixer and stirred thoroughly. The stirred materials are then fed into a single-screw extruder controlled at a temperature of 70°C-110°C, and extruded through a T-type distributor at the die head to prepare a heat-curing adhesive layer base film.

[0030] Step 2: Preparation of corrosion inhibition layer glue: by weight, 100 parts of thermoplastic matrix resin, 1-20 parts of plasticizer, 0.1-1 parts of coupling agent, and 0.5-10 parts of corrosion inhibitor are placed in a stirring tank, and then 100-1000 parts of solvent are added to the stirring tank and stirred to dissolve to obtain corrosion inhibition layer glue.

[0031] Step 3. Preparation of metal corrosion-inhibiting encapsulating film: The corrosion-inhibiting layer glue of step 2 is coated on any surface of the adhesive layer base film of step 1 through a slit coating process, and the solvent is removed by oven drying to form a thermoplastic corrosion-inhibiting layer on the base film, and finally a metal corrosion-inhibiting encapsulating film with a double-layer structure is obtained.

[0032] The solvent of the corrosion inhibition layer glue is selected from one or more of water, ethanol, isopropyl alcohol, xylene, acetone, dichloromethane, ethyl acetate and DMF.

[0033] The application method of the metal corrosion-inhibiting packaging film as described above is applied to a photovoltaic module package without a main grid cell, wherein the heat-curing adhesive layer of the metal corrosion-inhibiting packaging film contacts the photovoltaic glass or backboard, and the thermoplastic corrosion-inhibiting layer of the metal corrosion-inhibiting packaging film contacts the cell.

[0034] A photovoltaic assembly packaging assembly without a main grid cell comprises a photovoltaic front plate glass, a metal corrosion inhibition packaging film, a main grid cell string, a metal corrosion inhibition packaging film and a photovoltaic back plate.

[0035] The photovoltaic front panel glass, metal corrosion-inhibiting packaging film, main grid-free battery string, metal corrosion-inhibiting packaging film and photovoltaic back panel are combined by hot pressing.

[0036] Compared to the prior art, the metal corrosion-inhibiting packaging film provided by the present invention includes a thermosetting adhesive layer and a thermoplastic corrosion-inhibiting layer. The thermosetting adhesive layer is composed of the following raw material components by weight: 100 parts of a cross-linkable base resin, 0.1-1 parts of a peroxide cross-linking agent, 0.1-1 parts of a co-cross-linking agent, 0.1-1 parts of a coupling agent, and 0.1-1 parts of a light stabilizer; the thermoplastic corrosion-inhibiting layer is composed of the following raw material components by weight: 100 parts of a thermoplastic base resin, 1-20 parts of a plasticizer, 0.1-1 parts of a coupling agent, and 0.5-10 parts of a corrosion inhibitor. The metal corrosion-inhibiting packaging film of the present invention effectively solves the problem of shadows under the soldering strip by forming a thermoplastic corrosion-inhibiting layer on the thermosetting adhesive layer. Moreover, the thermoplastic layer only needs to be 10-200 microns thick, which is greater than 300 microns of traditional pure thermoplastic PVB packaging film, resulting in lower cost. When the component is encapsulated, the contact glass (or backplane) is a heat-cured adhesive layer of the film, which provides long-lasting and effective heat-cured bonding force; and the layer that adheres to the battery cell is a thermoplastic corrosion inhibition layer of the film. The high molecular weight thermoplastic material has the characteristics of low fluidity, which prevents the film material from filling between the welding ribbon and the battery cell during the lamination process (causing the welding ribbon and the battery cell to be disconnected and non-conductive). It can effectively solve the problem of shadows under the welding ribbon during EL testing of main grid-free component packaging. The corrosion inhibitor contained in it can form a protective layer with the metal grid line, welding ribbon, conductive coating, and busbar material on the surface of the battery, effectively preventing the active metal material from being oxidized and corroded, thereby improving the long-term reliability of the photovoltaic component and having a low PID power attenuation rate. DETAILED DESCRIPTION

[0037] The present invention will be further described below in conjunction with some specific embodiments. The specific embodiments are provided to further illustrate the present invention in detail, but are not intended to limit the scope of protection of the present invention.

[0038] Prepare the following substances for corrosion inhibitor according to the above method:

[0039] Prepared using the method of patent CN201510774530.6, the corrosion inhibitor structure is as follows [A-1]:

[0040]

[0041] The corrosion inhibitor was prepared using the patented CN103562323B method and obtained as follows [B-1]:

[0042]

[0043] Preparation method of [A-2]:

[0044] A mixture of 4,7-dibromo-1H-2-isobutylbenzotriazole (1.32 g, 4.0 mmol), 4-tert-butylphenylboronic acid (10.0 mmol), tetrakis(triphenylphosphine)palladium(0) (1.00 g, 0.86 mmol), sodium carbonate (2.12 g, 20 mmol) in water (15 mL), butanol (50 mL) and toluene (30 mL) was vigorously stirred and heated at 100° C. under argon for 16 hours. The reaction mixture was poured into water (300 mL), stirred for 30 minutes, and extracted with toluene / ethyl acetate / hexane (5:3:2, 500 mL). Volatiles were removed under reduced pressure, and the residue was chromatographed (silica gel, hexane / dichloromethane, 1:1). The isolated product was recrystallized from ethanol to obtain [A-2], which is 4,7-bis(4-tert-butylphenyl)-2-isobutyl-1H-benzotriazole.

[0045]

[0046] Preparation method of [A-3]: A mixture of 4,7-dibromo-1H-2-isobutylbenzotriazole (1.32 g, 4.0 mmol), phenylboronic acid (10.0 mmol), tetrakis(triphenylphosphine)palladium(0) (1.00 g, 0.86 mmol), sodium carbonate (2.12 g, 20 mmol) in water (15 mL), butanol (50 mL) and toluene (30 mL) was vigorously stirred and heated at 100°C under argon for 16 hours. The reaction mixture was poured into water (300 mL), stirred for 30 minutes, and extracted with toluene / ethyl acetate / hexane (5:3:2, 500 mL). Volatiles were removed under reduced pressure, and the residue was chromatographed (silica gel, hexane / dichloromethane, 1:1). The separated product was recrystallized from ethanol to obtain [A-3] as 4,7-bis(phenyl)-2-isobutyl-1H-benzotriazole:

[0047]

[0048] Preparation of Metal Corrosion Inhibition Packaging Films in Examples and Comparative Examples

[0049] Step 1, preparation of a heat-curing adhesive layer: according to the weight parts shown in Table 1, 100 parts of a cross-linkable base resin, 0.1-1 parts of a peroxide cross-linking agent, 0.1-1 parts of a co-cross-linking agent, 0.1-1 parts of a coupling agent, and 0.1-1 parts of a light stabilizer are placed in a horizontal mixer and stirred thoroughly. The stirred materials are then put into a single-screw extruder controlled at a temperature of 70°C-110°C, and extruded and cast through a T-type distributor at the die head to prepare a 0.3-0.6 mm heat-curing adhesive layer base film;

[0050] Step 2: Preparation of corrosion inhibition layer glue: According to the weight parts shown in Table 1, 100 parts of thermoplastic matrix resin, 1-20 parts of plasticizer, 0.1-1 parts of coupling agent, and 0.5-10 parts of corrosion inhibitor are placed in a stirring tank, and then 100-1000 parts of solvent are added to the stirring tank and stirred to dissolve to obtain corrosion inhibition layer glue.

[0051] Step 3. Preparation of metal corrosion-inhibiting encapsulating film: The corrosion-inhibiting layer glue of step 2 is coated on any surface of the adhesive layer base film of step 1 through a slit coating process, and the solvent is removed by oven drying. The thickness of the coated glue is controlled by a slit coating device to form a 10-200μm thermoplastic corrosion-inhibiting layer on the base film, and finally a double-layer metal corrosion-inhibiting encapsulating film is obtained.

[0052] A lamination preparation method for a photovoltaic module packaging component without a main grid cell: the component layering order is: photovoltaic front panel glass, metal corrosion-inhibiting packaging film, main grid-free cell string (UV dispensing fixation), metal corrosion-inhibiting packaging film of the embodiment and comparative example, photovoltaic back panel, wherein the surface of the metal corrosion-inhibiting packaging film contacting the photovoltaic glass (or back panel) is an adhesive layer, and the surface of the metal corrosion-inhibiting packaging film contacting the cell is a thermoplastic corrosion-inhibiting layer.

[0053] Component lamination process: After the metal corrosion inhibition packaging film and the battery in the embodiment and comparative example are laid, they are heated and laminated to form the sample to be tested, wherein the lamination process parameters are temperature 145°C, vacuum 6 minutes, pressurization 1 minute, and pressure holding 12 minutes.

[0054] The prepared battery PID and EL appearance tests were conducted according to the IEC61215 and IEC62804 standards. The test results are shown in Table 1.

[0055] Table 1

[0056]

[0057]

[0058] As shown in Table 1 and Comparative Example 4, pure EVA encapsulation film is not suitable for busbar-less battery modules. Due to the low melting point and high fluidity of EVA material, when used for busbar-less UV dispensing battery encapsulation, the EVA film melts before the solder ribbon during module lamination. After lamination, the EVA resin fills the gap between the solder ribbon and the cell, preventing the solder ribbon from forming a conductive connection with the cell. EL testing of the module using the IEC61215 standard revealed shadows under the solder ribbon. Furthermore, testing using the IEC62804 standard PID288 revealed severe corrosion of the busbars, solder ribbon, and fine grids, resulting in a 25.1% drop in module power.

[0059] As can be seen in Table 1, in Comparative Examples 1-3, a layer of thermoplastic TPU and PVB was coated on the EVA adhesive layer base film. After the modules were laminated, the EL test of the modules was conducted using the IEC61215 standard, and it was found that the problem of shadows under the soldering ribbons was solved. This shows that treating a layer of thermoplastic PVB and TPU materials on the EVA base film can effectively solve the EL shadow problem. However, no metal corrosion inhibitor components were added to the thermoplastic layer of Comparative Examples 1-3. After the modules were tested using the IEC62804 standard PID288, it was found that the soldering ribbons and fine grids were severely corroded, and the module power decreased by between 10-18%. This did not solve the problem of metal corrosion of the fine grids and soldering ribbons on the surface of the non-busbar cells. However, compared with Comparative Example 4, the busbars were not corroded, which is an improvement over the pure EVA film.

[0060] As can be seen from Table 1, in Examples 1-7 and Comparative Examples 1-3, a layer of thermoplastic material was coated on the base film of the thermosetting adhesive layer. After the components were laminated, the EL test of the components was performed using the IEC61215 standard, and it was found that the problem of shadows under the soldering strips was solved.

[0061] As shown in Table 1, in Examples 3 and 5, adding 0.5 parts of a metal corrosion inhibitor to the thermoplastic layer revealed slight corrosion of the busbars in the modules tested using IEC62804 standard PID288, resulting in module power reductions of 5.4% and 7.2%, respectively. This effectively addresses the issue of busbar-less cell surface corrosion of the busbars and solder ribbons compared to Examples 1-3.

[0062] As shown in Table 1, the thermoplastic glue coating materials of Examples 1, 2, 4, 6, and 7 contain 1.5 to 10 parts of corrosion inhibitor. After the components are tested using the IEC62804 standard PID288, no corrosion is found on the soldering ribbons or fine grids on the surface of the cells, and the component power drops by 2%-3%. Compared to Example 2, Example 4 uses a combination of two corrosion inhibitors, achieving better metal corrosion inhibition. This is reflected in the fact that after the components are tested using the IEC62804 standard PID288, the power drop in Example 4 is less than 1%, with the test value only dropping by 0.5%.

[0063] The corrosion inhibitor in the embodiment is composed of formula [A-2] / formula [B-1]=1:1, and its comprehensive effect is the best.

[0064] The above are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A metal corrosion inhibition packaging film, characterized in that: Contains a thermosetting bonding layer and a thermoplastic corrosion inhibition layer. The heat-curing adhesive layer is composed of the following raw material components by weight: 100 parts of a cross-linkable base resin, 0.1-1 parts of a peroxide cross-linking agent, 0.1-1 parts of a co-cross-linking agent, 0.1-1 parts of a coupling agent, and 0.1-1 parts of a light stabilizer; The thermoplastic corrosion inhibition layer is composed of the following raw material components by weight: 100 parts of thermoplastic base resin, 1-20 parts of plasticizer, 0.1-1 parts of coupling agent, and 0.5-10 parts of corrosion inhibitor; The corrosion inhibitor consists of A and B. The structural formula of A is ; The structural formula of B is .

2. The metal corrosion inhibition packaging film according to claim 1, characterized in that: The weight ratio of A to B is 1:

1.

3. The metal corrosion inhibition packaging film according to claim 1, wherein: The cross-linkable matrix resin is selected from one or more of EVA, PVB, and POE resins.

4. The metal corrosion inhibition packaging film according to claim 1, wherein: The thermoplastic matrix resin is selected from one or more of PVB resin, TPU resin, PVA resin, PA resin, PI resin and epoxy resin.

5. The metal corrosion inhibition packaging film according to claim 1, wherein: The peroxide crosslinking agent is selected from one or more of tert-butyl peroxycarbonate-2-ethylhexyl, tert-amyl peroxy (2-ethylhexyl) carbonate, tert-butyl peroxybenzoate, tert-butyl peroxyacetate, tert-amyl peroxy-2-ethylhexanoate, tert-butyl peroxy-2-ethylhexanoate, and dicumyl peroxide; The auxiliary cross-linking agent is selected from one or more of triallyl isocyanurate, trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, trimethylolpropane triethoxyacrylate, and triallyl isocyanate; The coupling agent is selected from one or more of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(β-methoxyethoxy)silane, γ-methacryloxypropyltrimethoxysilane, vinyltri-tert-butoxysilane, 3-glycidyloxypropyltrimethoxysilane, and γ-aminopropyltriethoxysilane; The light stabilizer is selected from hindered amine light stabilizers, including one or more of bis-2,2,6,6-tetramethylpiperidinol sebacate, poly(4-hydroxy-2,2,6,6-tetramethyl-1-piperidinol) succinate, and bis(2,2,6,6-tetramethyl-4-piperidinol) sebacate; The plasticizer is selected from one or more of DOP, DOTP, hydrogenated DOTP, 3GO, DOA, DOS, and DBS.

6. The metal corrosion inhibition packaging film according to claim 1, wherein: The thickness of the heat-curing adhesive layer is 0.30-0.60 mm, and the thickness of the thermoplastic corrosion inhibition layer is 10-200 μm.

7. A method for preparing a metal corrosion inhibition packaging film according to any one of claims 1 to 6, characterized in that The following steps are included: Step 1, preparation of a heat-curing adhesive layer: by weight, 100 parts of a cross-linkable matrix resin, 0.1-1 parts of a peroxide cross-linking agent, 0.1-1 parts of a co-cross-linking agent, 0.1-1 parts of a coupling agent, and 0.1-1 parts of a light stabilizer are placed in a horizontal mixer and stirred thoroughly. The stirred materials are then fed into a single-screw extruder controlled at a temperature of 70°C-110°C, and extruded through a T-type distributor at the die head to prepare a heat-curing adhesive layer base film. Step 2: Preparation of corrosion inhibition layer glue: by weight, 100 parts of thermoplastic matrix resin, 1-20 parts of plasticizer, 0.1-1 parts of coupling agent, and 0.5-10 parts of corrosion inhibitor are placed in a stirring tank, and then 100-1000 parts of solvent are added to the stirring tank and stirred to dissolve to obtain corrosion inhibition layer glue; Step 3. Preparation of metal corrosion-inhibiting encapsulating film: The corrosion-inhibiting layer glue of step 2 is coated on any surface of the adhesive layer base film of step 1 through a slit coating process, and the solvent is removed by oven drying to form a thermoplastic corrosion-inhibiting layer on the base film, and finally a metal corrosion-inhibiting encapsulating film with a double-layer structure is obtained.

8. The method for preparing the metal corrosion inhibition packaging film according to claim 7, wherein: The solvent of the corrosion inhibition layer glue is selected from one or more of water, ethanol, isopropyl alcohol, xylene, acetone, dichloromethane, ethyl acetate, and DMF.

9. The method for applying the metal corrosion inhibition packaging film according to any one of claims 1 to 6, wherein: The metal corrosion inhibition packaging film is applied to a photovoltaic module packaging without a main grid cell. The heat-curing adhesive layer of the metal corrosion inhibition packaging film contacts the photovoltaic glass or backboard, and the thermoplastic corrosion inhibition layer of the metal corrosion inhibition packaging film contacts the cell.

10. A photovoltaic module packaging assembly without a main grid cell, characterized in that: The structure comprises, in sequence, a photovoltaic front plate glass, the metal corrosion-inhibiting packaging film according to any one of claims 1 to 6, a main grid-free battery string, the metal corrosion-inhibiting packaging film according to any one of claims 1 to 6, and a photovoltaic back plate.

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