Photosensitive component and preparation method thereof, camera module and electronic equipment

Abstract

The present application discloses a photosensitive component and a preparation method thereof, a camera module and an electronic device. The photosensitive component includes a photosensitive chip, a circuit board, a package and a buffer material, the side wall of the photosensitive chip includes a plurality of corner areas, the photosensitive chip includes a first surface and a second surface arranged back to back, the first surface includes a photosensitive area and a non-photosensitive area; the circuit board is electrically connected to the non-photosensitive area of ​​the photosensitive chip, the package covers the circuit board and the non-photosensitive area of ​​the photosensitive chip, the buffer material is arranged between the package, the photosensitive chip and the circuit board, the elastic modulus of the buffer material is less than the elastic modulus of the circuit board, the elastic modulus of the photosensitive chip and the elastic modulus of the package, the buffer material is partially in contact with the side wall of the photosensitive chip, the surface of the side wall of the photosensitive chip in contact with the buffer material is the first part, the remaining part is the second part, and the second part includes at least one corner area.

Description

Technical Field

[0001] The present application relates to the field of optical element technology, and in particular to a photosensitive component and a preparation method thereof, a camera module and an electronic device. Background Art

[0002] With the popularity of smart devices, camera modules used in smart devices have developed and progressed rapidly, and miniaturization has become the development trend of camera modules. Camera modules have evolved from COB (Chip On Board) modules to MOB (Molding On Board) modules, and then from MOB modules to MOC (Molding On Chip) modules.

[0003] A camera module usually includes a package, a photosensitive chip and a circuit board. During the assembly process of the camera module, the photosensitive chip is easily subjected to stress and warps, which in turn affects the image quality and may even cause the photosensitive chip to break.

[0004] Currently, how to further reduce the stress on the photosensitive chip is one of the technical problems that technical personnel in this field urgently need to solve. Summary of the invention

[0005] The photosensitive component and its preparation method, camera module and electronic device provided in the embodiments of the present application can solve or partially solve the above-mentioned deficiencies in the prior art or other deficiencies in the prior art.

[0006] The photosensitive component provided according to the first aspect of the present application includes a photosensitive chip, a circuit board, a package and a buffer material, the side wall of the photosensitive chip includes a plurality of corner areas, the photosensitive chip includes a first surface and a second surface arranged back to back, the first surface includes a photosensitive area and a non-photosensitive area, the circuit board is electrically connected to the non-photosensitive area of ​​the photosensitive chip, the package covers the circuit board and the non-photosensitive area of ​​the photosensitive chip, the buffer material is arranged between the package, the photosensitive chip and the circuit board, the elastic modulus of the buffer material is smaller than the elastic modulus of the circuit board, the elastic modulus of the photosensitive chip and the elastic modulus of the package, the buffer material is in partial contact with the side wall of the photosensitive chip, the surface of the side wall of the photosensitive chip in contact with the buffer material is the first portion, the remaining portion is the second portion, and the second portion includes at least one of the corner areas.

[0007] According to one embodiment of the present application, the outer side of the photosensitive chip has a cavity, and the second portion is exposed to the cavity.

[0008] According to one embodiment of the present application, the second portion is in contact with the package body.

[0009] According to one embodiment of the present application, the non-photosensitive area includes a wide side area and a narrow side area spaced apart along a first direction, the multiple corner areas include two first corner areas adjacent to the narrow side areas and two second corner areas adjacent to the wide side areas, the two first corner areas are arranged opposite to each other along a second direction, the two second corner areas are arranged opposite to each other along the second direction, the second part includes at least one first corner area, and the first direction and the second direction intersect with the thickness direction of the photosensitive chip in pairs.

[0010] According to one embodiment of the present application, the first portion includes two second corner areas.

[0011] According to one embodiment of the present application, the wide side region is electrically connected to the circuit board, and the package body covers the wide side region and exposes the narrow side region.

[0012] According to one embodiment of the present application, the package body includes a wide side portion and a narrow side portion spaced apart along the first direction, the wide side portion covers the wide side region, and the narrow side portion is located on a side of the narrow side region away from the wide side portion along the first direction.

[0013] According to one embodiment of the present application, the side wall of the photosensitive chip further includes a connection area between adjacent corner areas, and the first portion includes at least a portion of the connection area.

[0014] According to one embodiment of the present application, along the thickness direction of the photosensitive chip, the photosensitive chip protrudes from the buffer material.

[0015] According to one embodiment of the present application, the non-photosensitive area includes a first electrical connection area, the second portion also includes at least a portion of the connection area connected to the first electrical connection area, and the first portion includes the remaining portion of the connection area.

[0016] According to one embodiment of the present application, the corner area includes: a first area extending along a first direction; and a second area extending in a second direction and intersecting with the first area, and the first direction and the second direction intersect with the thickness direction of the photosensitive chip in pairs.

[0017] According to one embodiment of the present application, a size of the first region along the first direction and / or a size of the second region along the second direction is 0.4 mm to 1 mm.

[0018] According to one embodiment of the present application, a size of the first region along the first direction is the same as a size of the second region along the second direction.

[0019] According to one embodiment of the present application, the circuit board is located on a side of the second surface away from the first surface.

[0020] According to one embodiment of the present application, the circuit board surrounds the photosensitive chip.

[0021] According to one embodiment of the present application, the photosensitive component also includes a support plate, the support plate is located on a side of the second surface away from the first surface, and the circuit board is arranged on the support plate and surrounds the photosensitive chip.

[0022] The camera module provided according to the second aspect of the present application includes an optical lens and the photosensitive component described in the first aspect of the present application, and the optical lens is located in the photosensitive path of the photosensitive chip of the photosensitive component.

[0023] The electronic device provided according to the third aspect of the present application includes an electronic device body and the camera module described in the second aspect of the present application, and the camera module is arranged in the electronic device body.

[0024] According to the fourth aspect of the present application, a method for preparing a photosensitive component includes: providing a circuit board and a photosensitive chip, the front side of the circuit board includes a first mounting area and a second mounting area located outside the first mounting area, the photosensitive chip includes a first surface and a second surface arranged back to back, the first surface includes a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip has a plurality of corner areas, the side wall of the photosensitive chip includes a first portion and a second portion, the second portion includes at least one of the corner areas; mounting the second surface of the photosensitive chip on the first mounting area of ​​the circuit board, and electrically connecting the non-photosensitive area of ​​the photosensitive chip to the circuit board; applying a buffer material in contact with the first portion on the front side of the circuit board; and forming a package body, the package body covering the second mounting area of ​​the circuit board, the non-photosensitive area and the buffer material.

[0025] According to the fifth aspect of the present application, a method for preparing a photosensitive component includes: providing a support plate and a photosensitive chip, the front side of the support plate having a third mounting area, a gap area located outside the third mounting area, and a fourth mounting area located outside the gap area, the photosensitive chip including a first surface and a second surface arranged back to back, the first surface including a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip having a plurality of corner areas, the side wall of the photosensitive chip including a first portion and a second portion, the second portion including at least one of the corner areas; mounting the second surface of the photosensitive chip on the third mounting area; mounting a ring-shaped circuit board on the fourth mounting area, and electrically connecting the circuit board to the non-photosensitive area of ​​the photosensitive chip; coating a buffer material in contact with the first portion on the gap area; and forming a package body, the package body covering the circuit board, the non-photosensitive area and the buffer material.

[0026] According to the sixth aspect of the present application, a method for preparing a photosensitive component includes: providing an annular circuit board and a photosensitive chip, the photosensitive chip including a first surface and a second surface arranged back to back, the first surface including a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip having a plurality of corner areas, the side wall of the photosensitive chip including a first portion and a second portion, the second portion including at least one of the corner areas; inserting the photosensitive chip into a central hole of the circuit board, with a gap between the circuit board and the photosensitive chip; applying a buffer material in contact with the first portion in the gap; and forming a package body, the package body covering the circuit board, the non-photosensitive area and the buffer material.

[0027] According to one embodiment of the present application, forming the package body includes: providing a mold, wherein the mold has a cavity for injecting molding liquid; and pressing the mold onto a component consisting of at least the circuit board and the photosensitive chip, wherein the second portion is located outside the cavity.

[0028] According to one embodiment of the present application, forming the package body includes: providing a mold, wherein the mold has a cavity for injecting molding liquid; and pressing the mold onto a component consisting of at least the circuit board and the photosensitive chip, wherein the second portion is located inside the cavity.

[0029] The photosensitive component provided in the embodiment of the present application makes the buffer material contact only part of the side wall of the photosensitive chip, so that at least one corner area of ​​the side wall of the photosensitive chip is not covered by the buffer material. This can change the stress transfer mode around the photosensitive chip, such as stress direction, stress magnitude, etc., and further improve the stress distribution around the photosensitive chip. This can not only shift the concentrated position of the stress on the photosensitive chip, but also reduce the total stress on the photosensitive chip, so that the photosensitive chip is not prone to cracking, solder joint breakage and other problems, and the package is not easily damaged.

[0030] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Other features, purposes and advantages of the present application will become more apparent by reading the detailed description of the non-limiting embodiments made with reference to the following drawings. The drawings are used to better understand the present solution and do not constitute a limitation of the present application.

[0032] In the attached picture:

[0033] Figure 1 It is a longitudinal cross-sectional schematic diagram of a COB module in the related art;

[0034] Figure 2 It is a longitudinal cross-sectional schematic diagram of a MOB module in the related art;

[0035] Figure 3 It is a longitudinal cross-sectional schematic diagram of one of the MOC modules in the related art;

[0036] Figure 4 It is a longitudinal cross-sectional schematic diagram of another MOC module in the related art;

[0037] Figure 5 It is a longitudinal cross-sectional schematic diagram of another MOC module in the related art;

[0038] Figure 6 It is a schematic diagram of the force principle of the photosensitive chip in the related technology;

[0039] Figure 7 It is a longitudinal cross-sectional schematic diagram of an MOC module provided with a buffer material in the related art;

[0040] Figure 8 It is a transverse cross-sectional schematic diagram of an MOC module provided with a buffer material in the related art;

[0041] Fig. 9 It is a partial cross-sectional schematic diagram of an MOC module provided with a buffer material in the related art;

[0042] Fig.10 is a schematic transverse cross-sectional view of a camera module according to one embodiment of the present application;

[0043] Fig.11 yes Fig.10 A schematic cross-sectional view at AA;

[0044] Fig.12 is a schematic transverse cross-sectional view of a camera module according to another embodiment of the present application;

[0045] Fig.13 yes Fig.12 A schematic cross-sectional view at AA;

[0046] Fig.14 yes Fig.12 A schematic cross-sectional view at BB;

[0047] Fig.15 is a longitudinal cross-sectional schematic diagram of a camera module according to one embodiment of the present application;

[0048] Fig.16 is a longitudinal cross-sectional schematic diagram of a camera module according to another embodiment of the present application;

[0049] Fig.17 is a schematic top view of a photosensitive chip according to one embodiment of the present application;

[0050] Fig.18 is a partial longitudinal cross-sectional schematic diagram of a camera module according to one embodiment of the present application;

[0051] Fig.19 is a schematic flow chart of a method for preparing a photosensitive component according to one embodiment of the present application;

[0052] Fig. 20 is a schematic flow chart of a method for preparing a photosensitive component according to another embodiment of the present application; and

[0053] Fig.21 It is a schematic flow chart of a method for preparing a photosensitive component according to another embodiment of the present application.

[0054] Reference numerals:

[0055] 100, circuit board; 110, electronic components; 120, second connection structure;

[0056] 200, photosensitive chip; 210, first surface; 211, photosensitive area;

[0057] 212, non-photosensitive area; 213, wide side area; 214, narrow side area;

[0058] 215, first electrical connection area; 220, second surface; 230, corner area;

[0059] 231, first corner area; 232, second corner area; 233, first area;

[0060] 234, second region; 240, connection region; 241, first sub-region;

[0061] 242, second sub-region; 250, first connection structure; 300, package body;

[0062] 310, wide side; 320, narrow side; 400, cushioning material; 500, cavity;

[0063] 600, support plate; 610, base; 700, optical lens; 800, wire;

[0064] 900. Filter. DETAILED DESCRIPTION

[0065] In the description of the embodiments of the present application, it should be noted that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc., indicating the position or state relationship, are based on the position or state relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0066] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0067] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0068] The following is a description of exemplary embodiments of the present application in conjunction with the accompanying drawings, including various details of the embodiments of the present application to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. Similarly, for the sake of clarity and conciseness, the description of well-known functions and structures is omitted in the following description.

[0069] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0070] like Figure 1 As shown, the COB module generally includes a circuit board 100, a photosensitive chip 200, an optical lens 700, a filter 900 and a base 610. The photosensitive chip 200 is mounted on the front of the circuit board 100. The photosensitive chip 200 is electrically connected to the circuit board 100 through a wire 800. At least one electronic component 110 is installed on the front of the circuit board 100. The electronic component 110 is located on the periphery of the photosensitive chip 200. The base 610 is fixed to the front of the circuit board 100 by glue and surrounds the photosensitive chip 200 and the electronic component 110. The optical lens 700 is fixed to the end of the base 610 away from the circuit board 100 by glue. The end of the base 610 away from the circuit board 100 has an opening, the opening is located on the light-sensitive path of the photosensitive chip 200, and the filter 900 is installed in the opening.

[0071] In order to avoid the electronic components 110 and the wires 800 , a certain gap needs to be maintained between the base 610 and the electronic components 110 and the wires 800 , which will increase the horizontal and vertical dimensions of the base 610 , thereby causing the overall size of the COB module to be larger.

[0072] In order to meet the demand for miniaturization of camera modules, MOB modules and MOC modules came into being. Figure 2As shown, the MOB module uses a molded body 301 to encapsulate the electronic components 110, eliminating the space required to avoid the electronic components 110 in the horizontal direction, so that compared with the COB module, the horizontal size of the MOB module can be smaller. Figures 3 to 5 The MOC modules with different structural forms are shown. Figures 3 to 5 As shown, the MOC module generally uses a molded body 301 to encapsulate the electronic components 110 and the wires 800 at the same time, eliminating the space required to avoid the electronic components 110 and the wires 800 in the horizontal and vertical directions. Therefore, compared with the MOB module, the MOC module can be smaller in the horizontal and vertical directions.

[0073] like Figure 6 As shown, the photosensitive chip 200 is usually attached to the front of the circuit board 100 by DA (Die Attach) adhesive, and the mold body 301 covers the circuit board 100 and part of the photosensitive chip 200. The mold body 301 and the photosensitive chip 200, as well as the mold body 301 and the circuit board 100, are rigidly connected. When the external temperature changes, stress will be generated between the mold body 301 and the photosensitive chip 200, as well as between the mold body 301 and the circuit board 100. However, since the molding temperature of the mold body 301 in the molding process is as high as 150°C or more, the temperature in the baking stage must also reach 80°C, and the ambient temperature may change many times in the subsequent process, and the thermal expansion coefficient of the photosensitive chip 200 is smaller than the thermal expansion coefficient of the mold body 301, the thermal expansion coefficient of the DA glue, and the thermal expansion coefficient of the circuit board 100, in other words, compared with the circuit board 100 and the mold body 301, the shrinkage or expansion degree of the photosensitive chip 200 is the smallest under the same ambient temperature. Therefore, when the ambient temperature changes drastically, the stress will be concentrated on the photosensitive chip 200, causing the photosensitive chip 200 to have a large deformation. For example, Figure 6 As shown, when the ambient temperature changes dramatically, the periphery of the photosensitive chip 200 may be warped upward, forming a smiley face field curvature. The bending of the photosensitive chip 200 will affect the imaging quality of the camera module, resulting in excessive field curvature, making the edge effect of the final image poor.

[0074] Taking the submerged MOC module as an example, in order to reduce the stress on the photosensitive chip 200 during the formation of the mold body 301, as shown in FIG. Figures 7 to 9As shown, a buffer material 400 is provided between the photosensitive chip 200 and the circuit board 100. In other words, the buffer material 400 surrounds the photosensitive chip 200, and the circuit board 100 surrounds the buffer material 400. The elastic modulus of the buffer material 400 is smaller than the elastic modulus of the circuit board 100, the elastic modulus of the photosensitive chip 200, and the elastic modulus of the molded body 301. When assembling the MOC module, the annular circuit board 100 is first mounted on the surface of the support plate 600, and then the photosensitive chip 200 is placed in the center hole of the circuit board 100, and the photosensitive chip 200 is mounted on the surface of the support plate 600 by DA glue, and the buffer material 400 is coated in the gap between the photosensitive chip 200 and the circuit board 100. Next, the molded body 301 covering the circuit board 100, the buffer material 400 and part of the photosensitive chip 200 is formed by a molding process or a compression molding process. Since the elastic modulus of the buffer material 400 is smaller than the elastic modulus of the circuit board 100, the elastic modulus of the photosensitive chip 200 and the elastic modulus of the mold body 301, during the process of forming the mold body 301, the buffer material 400 can absorb part of the stress generated by the mold body 301 and the circuit board 100, thereby reducing the stress applied by the mold body 301, the circuit board 100 and the DA glue to the photosensitive chip 200, thereby reducing the risk of warping of the photosensitive chip 200.

[0075] However, since the stress generated by the circuit board 100 and the mold body 301 is more likely to be concentrated at the junction of different materials and the position where the stress transfer direction turns, such as the corner, and the interface between the mold body 301 and the buffer material 400 is adjacent to the edge of the photosensitive chip 200, the stress on the corner of the photosensitive chip 200 is more likely to be concentrated in the position adjacent to the edge of the non-photosensitive area 212 of the photosensitive chip 200. Among them, the first surface 210 of the photosensitive chip 200, that is, the surface of the photosensitive chip 200 facing the filter 900 includes a photosensitive area 211 and a non-photosensitive area 212. In addition, since the non-photosensitive area 212 of the photosensitive chip 200 is usually provided with components such as microlenses, logic circuits, and pads, the non-photosensitive area 212 of the photosensitive chip 200 is more sensitive to stress. The stress concentration in these parts can easily cause damage to the photosensitive chip 200, such as cracks and solder joint breakage, thereby affecting the performance and reliability of the entire camera module.

[0076] Based on this, Figures 10 to 16As shown, an embodiment of the present application provides a photosensitive component, which includes a photosensitive chip 200, a circuit board 100, a packaging body 300 and a buffer material 400. Among them, the side wall of the photosensitive chip 200 includes multiple corner areas 230, the photosensitive chip 200 includes a first surface 210 and a second surface 220 arranged back to back, the first surface 210 includes a photosensitive area 211 and a non-photosensitive area 212, the circuit board 100 is electrically connected to the non-photosensitive area 212 of the photosensitive chip 200, the package body 300 covers the circuit board 100 and the non-photosensitive area 212 of the photosensitive chip 200, the buffer material 400 is arranged between the package body 300, the photosensitive chip 200 and the circuit board 100, the elastic modulus of the buffer material 400 is smaller than the elastic modulus of the circuit board 100, the elastic modulus of the photosensitive chip 200 and the elastic modulus of the package body 300, the buffer material 400 is partially in contact with the side wall of the photosensitive chip 200, the surface of the side wall of the photosensitive chip 200 that is in contact with the buffer material 400 is the first part, the remaining part is the second part, and the second part includes at least one corner area 230.

[0077] The embodiment of the present application makes the buffer material 400 contact only part of the side wall of the photosensitive chip 200, so that at least one corner area 230 of the side wall of the photosensitive chip 200 is not covered by the buffer material 400. This can change the stress transfer mode between the package body 300, the buffer material 400 and the circuit board 100, such as the stress direction, stress magnitude, etc., and thus improve the stress distribution around the photosensitive chip 200. This can not only shift the stress concentration position of the photosensitive chip 200, but also transfer the stress concentration part at the corner of the photosensitive chip 200 from the non-photosensitive area 212 adjacent to its edge to other parts, and can also reduce the total stress on the photosensitive chip 200, so that the photosensitive chip 200 is not prone to cracking, solder joint breakage and other problems, and the package body 300 is not easily damaged.

[0078] It should be noted that if Fig.15 As shown, the circuit board 100 can be located on the side of the second surface 220 of the photosensitive chip 200 away from the first surface 210 thereof. In other words, the second surface 220 of the photosensitive chip 200 can be mounted on the surface of the circuit board 100. Fig.16 As shown, the circuit board 100 may also surround the photosensitive chip 200, that is, the circuit board 100 is annular and is located at the periphery of the photosensitive chip 200. In some embodiments, as Fig.14 As shown, the photosensitive component may also include a support plate 600, which is located on the side of the second surface 220 of the photosensitive chip 200 away from its first surface 210, and the photosensitive chip 200 and the circuit board 100 are both arranged on the support plate 600, and the circuit board 100 surrounds the photosensitive chip 200.

[0079] As an example, at least one electronic component 110 is mounted on the surface of the circuit board 100, and the electronic component 110 may include, but is not limited to, components such as resistors, capacitors, inductors or transistors. Among them, the electronic component 110 can be mounted on the surface of the circuit board 100 by surface mounting technology (Surface Mounting Technology, SMT). In order to reduce the height of the electronic component 110 protruding from the circuit board 100, the electronic component 110 can also be pre-buried in the circuit board 100. The package 300 can cover the electronic component 110 to avoid interference between adjacent electronic components 110. In this way, not only can the required spacing between adjacent electronic components 110 be reduced, so that the entire photosensitive component can have a smaller size in the horizontal direction, but also the number of electronic components 110 allowed to be mounted on the circuit board 100 can be increased without changing the size of the photosensitive component.

[0080] In some embodiments, Fig.10 and Fig.11 As shown, the outer side of the photosensitive chip 200 has a cavity 500, the buffer material 400 is in contact with a first portion of the side wall of the photosensitive chip 200, and a second portion of the side wall of the photosensitive chip 200 is exposed to the cavity 500. In other words, the second portion of the photosensitive chip 200 is neither in contact with the buffer material 400 nor with the package body 300. When the photosensitive chip 200 is mounted on the surface of the circuit board 100, the above-mentioned cavity 500 is provided between the second portion of the photosensitive chip 200 and the package body 300; Fig.11 As shown, when the circuit board 100 surrounds the photosensitive chip 200, the cavity 500 is provided between the second portion of the photosensitive chip 200 and the circuit board 100. The presence of the cavity 500 can separate at least one corner region 230 of the photosensitive chip 200 from the circuit board 100 or the package 300, thereby cutting off the stress source of the corner region 230 and avoiding the problem of stress concentration in the corner region 230.

[0081] In other embodiments, Fig.12 and Fig.13As shown, the buffer material 400 contacts the first part of the side wall of the photosensitive chip 200, and the second part of the side wall of the photosensitive chip 200 contacts the package body 300. In other words, at least one corner area 230 of the photosensitive chip 200 contacts the package body 300. The package body 300 may include, but is not limited to, a molded body, and the material of the molded body may include a hot melt material or a thermosetting material; the buffer material 400 may include, but is not limited to, epoxy molding compound (EMC), resin or adhesive. Since the package body 300 in the embodiment of the present application is in contact with at least one corner region 230 of the photosensitive chip 200, at the corner of the photosensitive chip 200 corresponding to the above-mentioned corner region 230, the package body 300 is not only in contact with the portion of the non-photosensitive region 212 adjacent to the corner region 230, but also in contact with the corner region 230. In other words, the material in contact with the corner of the photosensitive chip 200 is the same material, so that the stress transfer at the corner is continuous, and the stress concentration part at the corner of the photosensitive chip 200 can be transferred from the position adjacent to the edge of the non-photosensitive region 212 to the bottom of the side wall of the photosensitive chip 200, and the bottom of the side wall of the photosensitive chip 200 is usually a silicon material with a higher stress resistance. It can be seen that the embodiment of the present application can not only reduce the risk of damage to the photosensitive chip 200, but also reduce the total stress to which the photosensitive chip 200 is subjected.

[0082] In some other embodiments, the buffer material 400 contacts a first portion of the side wall of the photosensitive chip 200 , at least one corner region 230 of a second portion of the photosensitive chip 200 is exposed in the cavity 500 , and at least another corner region 230 of the second portion may contact the package body 300 .

[0083] In some embodiments, Fig.10 As shown, the corner area 230 includes a first area 233 and a second area 234, the first area 233 extends along the first direction, the second area 234 extends along the second direction and intersects with the first area 233, the first direction, the second direction and the third direction intersect with each other, and the third direction is the thickness direction of the photosensitive chip 200. It should be noted that the intersection of the first direction, the second direction and the third direction can generally be understood as an angle between the first direction and the second direction, between the second direction and the third direction, and between the first direction and the third direction. For example, the first direction is perpendicular or approximately perpendicular to the second direction, the second direction is perpendicular or approximately perpendicular to the third direction, and the first direction is perpendicular or approximately perpendicular to the third direction. As an example, in the embodiment of the present application, the first direction can be the x direction in the accompanying drawings, the second direction can be the y direction in the accompanying drawings, and the third direction can also be the z direction.

[0084] In some embodiments, the extension direction of the first region 233 is perpendicular to the extension direction of the second region 234, that is, the first direction is perpendicular to the second direction. In this case, the projection of the corner region 230 on a plane perpendicular to the third direction is L-shaped.

[0085] In some embodiments, the size of the first region 233 along the first direction and / or the size of the second region 234 along the second direction is 0.4 mm to 1 mm. For example, the size of the first region 233 along the first direction and / or the size of the second region 234 along the second direction is 0.5 mm. In the embodiment of the present application, by limiting the extended size of the first region 233 and the second region 234 within the above range, the stress transfer mode between the package body 300 and the buffer material 400 can be effectively changed under the premise of ensuring the buffer performance of the buffer material 400, thereby reducing the risk of damage to the corner of the photosensitive chip 200.

[0086] As an example, the size of the first region 233 along the first direction is the same as the size of the second region 234 along the second direction. Through simulation, it is found that when the size of the first region 233 along the first direction is the same as the size of the second region 234 along the second direction, the stress on the corner region 230 of the photosensitive chip 200 is minimal.

[0087] like Fig.15 and Fig.17 As shown, the photosensitive chip 200 includes a first surface 210 and a second surface 220 that are arranged back to back, the first surface 210 includes a photosensitive area 211 and a non-photosensitive area 212, the non-photosensitive area 212 includes a wide side area 213 and a narrow side area 214 that are spaced apart along a first direction, and the photosensitive area 211 is located between the wide side area 213 and the narrow side area 214 along the first direction. As the name implies, the size of the wide side area 213 in the first direction is greater than the size of the narrow side area 214 in the first direction. As an example, the package 300 covers the wide side area 213 of the photosensitive chip 200 and exposes the narrow side area 214 of the photosensitive chip 200. In other words, the narrow side area 214 of the photosensitive chip 200 is not covered by the package 300.

[0088] In some embodiments, the wide side region 213 of the photosensitive chip 200 is electrically connected to the circuit board 100. As an example, the photosensitive chip 200 and the circuit board 100 can be electrically connected by a wire bump (WB) process. Fig.12 As shown, the wide side region 213 of the photosensitive chip 200 is provided with a first connection structure 250 such as a pad, and the surface of the circuit board 100 is provided with a second connection structure 120 such as a pad, and the first connection structure 250 is connected to the second connection structure 120 through a wire 800. The material of the wire 800 may include, but is not limited to, at least one of gold, silver and copper.

[0089] The embodiment of the present application can reduce the size of the photosensitive chip 200 in the first direction by designing the wide side region 213 and the narrow side region 214 in the non-photosensitive region 212 of the photosensitive chip 200 and setting the first connection structure 250 in the wide side region 213, thereby reducing the overall size of the photosensitive chip 200. In addition, since the edge of the photosensitive chip 200 adjacent to the narrow side region 214 is closer to the photosensitive region 211, the embodiment of the present application can make the stress center of the photosensitive chip 200 closer to the geometric center of the photosensitive region 211 by making the package body 300 cover the wide side region 213 of the photosensitive chip 200 and expose the narrow side region 214 of the photosensitive chip 200, thereby effectively improving the field curvature of the camera module.

[0090] In some embodiments, the multiple corner regions 230 of the photosensitive chip 200 include two first corner regions 231 and two second corner regions 232. The two first corner regions 231 are relatively arranged along the second direction, and compared with the second corner regions 232, the first corner regions 231 are closer to the narrow side region 214 in the first direction. The two second corner regions 232 are relatively arranged along the second direction, and compared with the first corner regions 231, the second corner regions 232 are closer to the wide side region 213 in the first direction. The second part includes at least one first corner region 231, and the first direction, the second direction and the third direction intersect each other, and the third direction is the thickness direction of the photosensitive chip 200.

[0091] Since the first corner region 231 is closer to the narrow side region 214 of the photosensitive chip 200 in the first direction than the second corner region 232, in other words, the first corner region 231 is closer to the photosensitive region 211 of the photosensitive chip 200 than the second corner region 232, when stress concentration occurs in the first corner region 231, it is more likely to cause damage to the non-photosensitive region 212 of the photosensitive chip 200, and even affect the photosensitive region 211 of the photosensitive chip 200. In the embodiment of the present application, by making at least one first corner region 231 of the photosensitive chip 200 not covered with the buffer material 400, not only the risk of damage to the first corner region 231 of the photosensitive chip 200 can be reduced, but also the risk of affecting the photosensitive region 211 due to stress concentration in the first corner region 231 can be reduced.

[0092] For example, the first part includes one of the first corner areas 231 and two of the second corner areas 232, and the second part includes another of the first corner areas 231. In other words, one of the first corner areas 231 and two of the second corner areas 232 of the photosensitive chip 200 is in contact with the buffer material 400, and the other of the first corner area 231 of the photosensitive chip 200 is in contact with the package 300. Through simulation, it is found that the stress on the first corner area 231 in contact with the package 300 is reduced to 60% of the original stress, and the total stress on the photosensitive chip 200 as a whole is also reduced. For another example, the first part includes two of the second corner areas 232, and the second part includes two of the first corner areas 231. In other words, the two second corner areas 232 of the photosensitive chip 200 are in contact with the buffer material 400, and the two first corner areas 231 of the photosensitive chip 200 are in contact with the package 300. Through simulation, it is found that the stresses on the two first corner regions 230 and the two second corner regions 232 are reduced, and the total stress on the photosensitive chip 200 as a whole is significantly reduced. For another example, the second portion includes two first corner regions 231 and two second corner regions 232. In other words, the two first corner regions 231 and the two second corner regions 232 of the photosensitive chip 200 are in contact with the package 300. Through simulation, it is found that in this case, the total stress on the photosensitive chip 200 as a whole is significantly reduced.

[0093] In some embodiments, Fig.17 and Fig.18As shown, the package body 300 includes a wide side portion 310 and a narrow side portion 320 spaced apart along the first direction, the wide side portion 310 covers the wide side region 213, and the narrow side portion 320 is located on the side of the narrow side region 214 away from the wide side portion 310 along the first direction. In other words, the narrow side region 214 of the photosensitive chip 200 does not cover the package body 300. As the name implies, the size of the wide side portion 310 in the first direction is larger than the size of the narrow side portion 320 in the first direction. The advantage of such a setting is that since the size of the wide side region 213 of the photosensitive chip 200 in the first direction is larger than the size of its narrow side region 214 in the first direction, the optical center of the photosensitive chip 200 deviates from its geometric center, and the optical center of the photosensitive chip 200 is closer to its narrow side region 214 in the first direction. Therefore, in the present application, by making the wide side portion 310 of the package body 300 cover the wide side area 213 of the photosensitive chip 200 and at the same time making the narrow side portion 320 of the package body 300 away from the narrow side area 214 of the photosensitive chip 200, the stress on the wide side area 213 of the photosensitive chip 200 and the stress on the narrow side area 214 of the photosensitive chip 200 during the curing process of the package body 300 can be symmetrical relative to the optical center of the photosensitive chip 200. In other words, the stress applied by the package body 300 to the two opposite sides of the photosensitive chip 200 can be made basically the same, thereby avoiding unilateral offset of the force-bearing position of the photosensitive chip 200, and further avoiding problems such as falling off or deformation of the corners or edges of the photosensitive chip 200. In addition, the narrow side region 214 of the photosensitive chip 200 has a smaller size in the first direction, that is, its strength is smaller. The embodiment of the present application can avoid the narrow side portion 320 from applying stress to the narrow side region 214 of the photosensitive chip 200 by making the narrow side portion 320 of the package body 300 located on the side of the narrow side region 214 away from the wide side portion 310 along the first direction. The narrow side portion 320 only applies stress to the side wall of the photosensitive chip 200, thereby reducing the risk of damage to the narrow side region 214 of the photosensitive chip 200.

[0094] As an example, Fig.12 As shown, the wide side area 213 of the photosensitive chip 200 is provided with a first connecting structure 250 such as a solder pad, and the surface of the circuit board 100 is provided with a second connecting structure 120 such as a solder pad. The first connecting structure 250 is connected to the second connecting structure 120 through a wire 800, and the wide side portion 310 of the package body 300 covers the first connecting structure 250, the second connecting structure 120, the wire 800 and the wide side area 213 of the photosensitive chip 200.

[0095] In some other embodiments, the photosensitive chip 200 includes a first surface 210 and a second surface 220 disposed back to back, the first surface 210 includes a photosensitive area 211 and a non-photosensitive area 212, the non-photosensitive area 212 includes an avoidance area and a peripheral area, the avoidance area surrounds the photosensitive area 211, the peripheral area surrounds the avoidance area, the package body 300 covers the peripheral area, the buffer material 400 contacts the first portion of the side wall of the photosensitive chip 200, and the second portion of the side wall of the photosensitive chip 200 includes at least one corner area 230. For example, the second portion of the photosensitive chip 200 includes all corner areas 230, in other words, all corner areas 230 of the photosensitive chip 200 are in contact with the package body 300.

[0096] In some embodiments, the sidewall of the photosensitive chip 200 further includes a connection area 240 located between adjacent corner areas 230, and the first portion includes at least a portion of the connection area 240. For example, the buffer material 400 contacts all the connection areas 240 of the sidewall of the photosensitive chip 200, and the package body 300 contacts all the corner areas 230 of the sidewall of the photosensitive chip 200. For another example, the buffer material 400 contacts at least one corner area 230 and all the connection areas 240 of the sidewall of the photosensitive chip 200, and the package body 300 contacts the remaining corner areas 230 of the sidewall of the photosensitive chip 200. For another example, the buffer material 400 contacts at least one corner area 230 and a portion of the connection areas 240 of the sidewall of the photosensitive chip 200, and the package body 300 contacts the remaining corner areas 230 and the remaining connection areas 240 of the sidewall of the photosensitive chip 200.

[0097] As an example, Fig.10 As shown, the non-photosensitive area 212 of the photosensitive chip 200 includes a first electrical connection area 215, and the first electrical connection area 215 is provided with a first connection structure such as a pad. Among them, the second part includes at least a portion of the connection area 240 connected to the first electrical connection area 215 and at least one corner area 230, and the first part includes the remaining portion of the connection area 240. Therefore, when the buffer material 400 is coated on the side wall of the photosensitive chip 200, avoiding at least a portion of the connection area 240 connected to the first electrical connection area 215 can prevent the buffer material 400 from being coated too much and overflowing upward to cover the first electrical connection area 215.

[0098] For example, Fig.12As shown, the connection area 240 includes a first sub-area 241 and a second sub-area 242, and the first sub-area 241 is connected to the first electrical connection area 215. In other words, the first sub-area 241 is adjacent to the first electrical connection area 215 and shares the same edge. The second part may include all of the first sub-area 241 and at least one corner area 230, and the first part includes all of the second sub-area 242. In some other embodiments, the second part may also include part of the first sub-area 241 and at least one corner area 230, and the first part includes the remaining first sub-area 241 and all of the second sub-area 242.

[0099] In some embodiments, the photosensitive chip 200 protrudes from the buffer material 400 along a third direction, and the third direction is the thickness direction of the photosensitive chip 200. As an example, a portion of the first portion of the photosensitive chip 200 contacts the buffer material 400, and another portion of the first portion contacts the package body 300. Among them, a portion of the first portion is located below the other portion of the first portion along the third direction. The advantage of such a setting is that it can prevent the buffer material 400 from being coated in an excessive amount and overflowing to the first surface 210 of the photosensitive chip 200 when the buffer material 400 is coated, thereby preventing the buffer material 400 from covering the pads disposed on the surface of the photosensitive chip 200. For example, when the photosensitive chip 200 is mounted on the surface of the circuit board 100, the surface of the photosensitive chip 200 away from the circuit board 100, that is, the first surface 210, is higher than the surface of the buffer material 400 away from the circuit board 100. For another example, when the circuit board 100 surrounds the photosensitive chip 200, the circuit board 100 and the photosensitive chip 200 are installed on the surface of the support plate 600, and the surface of the photosensitive chip 200 away from the support plate 600, i.e., the first surface 210, and the surface of the circuit board 100 away from the support plate 600 are both higher than the surface of the buffer material 400 away from the support plate 600.

[0100] like Figures 10 to 16 As shown, the embodiment of the present application further provides a camera module, which includes an optical lens 700 and the above-mentioned photosensitive component, and the optical lens 700 is located in the photosensitive path of the photosensitive chip 200.

[0101] It should be noted that the camera module of the embodiment of the present application can be a fixed-focus camera module or a dynamic-focus camera module. If the camera module is a dynamic-focus camera module, the camera module also includes a driving member such as a motor, which is connected to the optical lens 700 and is used to drive the optical lens 700 to move along the light-sensitive path to change the distance between the optical lens 700 and the light-sensitive chip 200, thereby adjusting the focal length of the camera module.

[0102] In some embodiments, the camera module may further include a filter 900, which is disposed at one end of the package body 300 away from the photosensitive chip 200 along the third direction and located in the photosensitive path of the photosensitive chip 200. The incident light passes through the optical lens 700 and the filter 900 in sequence and then is emitted to the photosensitive area 211 of the photosensitive chip 200, and the incident light is photoelectrically converted in the photosensitive area 211 of the photosensitive chip 200 to form an image. Among them, the filter 900 may include, but is not limited to, an infrared cutoff filter and / or a full-spectrum filter, the infrared cutoff filter can filter infrared rays in the incident light, and the full-spectrum filter can allow infrared rays in the incident light to pass through.

[0103] In addition, an embodiment of the present application further provides an electronic device, which includes an electronic device body and the above-mentioned camera module, and the camera module is arranged in the electronic device body.

[0104] like Fig.19 As shown, the embodiment of the present application also provides a method for preparing a photosensitive component, and the preparation method 1000 includes:

[0105] S100, providing a circuit board 100 and a photosensitive chip 200, wherein the front side of the circuit board 100 includes a first mounting area and a second mounting area located outside the first mounting area, the photosensitive chip 200 includes a first surface 210 and a second surface 220 disposed back to back, the first surface 210 includes a photosensitive area 211 and a non-photosensitive area 212, the side wall of the photosensitive chip 200 has a plurality of corner areas 230, the side wall of the photosensitive chip 200 includes a first portion and a second portion, and the second portion includes at least one corner area 230;

[0106] S110, mounting the second surface 220 of the photosensitive chip 200 on the first mounting area of ​​the circuit board 100, and electrically connecting the non-photosensitive area 212 of the photosensitive chip 200 to the circuit board 100;

[0107] S120, applying a buffer material 400 in contact with the first portion on the front side of the circuit board 100;

[0108] S130 , forming a package body 300 , wherein the package body 300 covers the second mounting area, the non-photosensitive area 212 and the buffer material 400 of the circuit board 100 .

[0109] Thus, the photosensitive chip 200 is mounted on the front side of the circuit board 100 , and the package body 300 covers the second mounting area of ​​the circuit board 100 , the non-photosensitive area 212 of the photosensitive chip 200 , and the buffer material 400 . Since the buffer material 400 is in contact with only the first portion of the side wall of the photosensitive chip 200, and the second portion of the side wall of the photosensitive chip 200 is not covered with the buffer material 400, in other words, at least one corner area 230 of the photosensitive chip 200 is not covered with the buffer material 400, the embodiment of the present application can change the stress transfer mode such as stress direction and stress magnitude between the package body 300, the buffer material 400 and the circuit board 100, and thus can improve the stress distribution around the photosensitive chip 200, thereby not only shifting the stress concentration position to which the photosensitive chip 200 is subjected, but also shifting the stress concentration position at the corner of the photosensitive chip 200 from the non-photosensitive area 212 adjacent to its edge to other positions, and can also reduce the total stress to which the photosensitive chip 200 is subjected, so that the photosensitive chip 200 is not prone to cracking, solder joint breakage and other problems, and the package body 300 is not easily damaged.

[0110] like Fig. 20 As shown, the embodiment of the present application also provides another method for preparing a photosensitive component, and the preparation method 2000 includes:

[0111] S200, providing a support plate 600, a photosensitive chip 200 and a ring-shaped circuit board 100, wherein the front surface of the support plate 600 has a third mounting area, a gap area located outside the third mounting area, and a fourth mounting area located outside the gap area, the photosensitive chip 200 includes a first surface 210 and a second surface 220 arranged back to back, the first surface 210 includes a photosensitive area 211 and a non-photosensitive area 212, the side wall of the photosensitive chip 200 has a plurality of corner areas 230, the side wall of the photosensitive chip 200 includes a first portion and a second portion, and the second portion includes at least one corner area 230;

[0112] S210, mounting the second surface 220 of the photosensitive chip 200 on the third mounting area;

[0113] S220, mounting the circuit board 100 on the fourth mounting area, and electrically connecting the circuit board 100 to the non-photosensitive area 212 of the photosensitive chip 200;

[0114] S230, applying a buffer material 400 in contact with the first portion in the gap area;

[0115] S240 , forming a package body 300 , wherein the package body 300 covers the circuit board 100 , the non-photosensitive area 212 and the buffer material 400 .

[0116] Thus, the photosensitive chip 200 and the circuit board 100 are both mounted on the front side of the support plate 600, the circuit board 100 surrounds the photosensitive chip 200, the buffer material 400 is located between the circuit board 100 and the photosensitive chip 200, and the package body 300 covers the circuit board 100, the non-photosensitive area 212 of the photosensitive chip 200 and the buffer material 400. Since the buffer material 400 is in contact with only the first portion of the side wall of the photosensitive chip 200, and the second portion of the side wall of the photosensitive chip 200 is not covered with the buffer material 400, in other words, at least one corner area 230 of the photosensitive chip 200 is not covered with the buffer material 400, the embodiment of the present application can change the stress transfer mode such as stress direction and stress magnitude between the package body 300, the buffer material 400 and the circuit board 100, and thus can improve the stress distribution around the photosensitive chip 200, thereby not only shifting the stress concentration position to which the photosensitive chip 200 is subjected, but also shifting the stress concentration position at the corner of the photosensitive chip 200 from the non-photosensitive area 212 adjacent to its edge to other positions, and can also reduce the total stress to which the photosensitive chip 200 is subjected, so that the photosensitive chip 200 is not prone to cracking, solder joint breakage and other problems, and the package body 300 is not easily damaged.

[0117] like Fig.21 As shown, the embodiment of the present application also provides another method for preparing a photosensitive component, and the preparation method 3000 includes:

[0118] S300, providing a ring-shaped circuit board 100 and a photosensitive chip 200, wherein the photosensitive chip 200 includes a first surface 210 and a second surface 220 disposed back to back, the first surface 210 includes a photosensitive area 211 and a non-photosensitive area 212, the side wall of the photosensitive chip 200 has a plurality of corner areas 230, the side wall of the photosensitive chip 200 includes a first portion and a second portion, and the second portion includes at least one corner area 230;

[0119] S310, inserting the photosensitive chip 200 into the central hole of the circuit board 100, with a gap between the circuit board 100 and the photosensitive chip 200;

[0120] S320, applying a buffer material 400 in contact with the first portion in the gap;

[0121] S330 , forming a package body 300 , wherein the package body 300 covers the circuit board 100 , the non-photosensitive area 212 and the buffer material 400 .

[0122] Thus, the circuit board 100 surrounds the photosensitive chip 200 , the buffer material 400 is located between the circuit board 100 and the photosensitive chip 200 , and the package body 300 covers the circuit board 100 , the non-photosensitive area 212 of the photosensitive chip 200 , and the buffer material 400 . Since the buffer material 400 is in contact with only the first portion of the side wall of the photosensitive chip 200, and the second portion of the side wall of the photosensitive chip 200 is not covered with the buffer material 400, in other words, at least one corner area 230 of the photosensitive chip 200 is not covered with the buffer material 400, the embodiment of the present application can change the stress transfer mode such as stress direction and stress magnitude between the package body 300, the buffer material 400 and the circuit board 100, and thus can improve the stress distribution around the photosensitive chip 200, thereby not only shifting the stress concentration position to which the photosensitive chip 200 is subjected, but also shifting the stress concentration position at the corner of the photosensitive chip 200 from the non-photosensitive area 212 adjacent to its edge to other positions, and can also reduce the total stress to which the photosensitive chip 200 is subjected, so that the photosensitive chip 200 is not prone to cracking, solder joint breakage and other problems, and the package body 300 is not easily damaged.

[0123] In some embodiments, the package body 300 may be formed in the following manner, that is, step S130, step S240 or step S330 may include: providing a mold, wherein the mold has a cavity for injecting molding liquid; pressing the mold onto a component consisting of at least a circuit board 100 and a photosensitive chip 200, wherein the second portion is located outside the cavity. Thus, after the molding liquid is solidified to form the package body 300, a cavity 500 is formed outside the photosensitive chip 200, and the second portion of the side wall of the photosensitive chip 200 is exposed to the cavity 500. In this case, the second portion of the photosensitive chip 200 is neither in contact with the buffer material 400 nor with the package body 300. When the photosensitive chip 200 is mounted on the surface of the circuit board 100, the above-mentioned cavity 500 is provided between the second portion of the photosensitive chip 200 and the package body 300; when the circuit board 100 surrounds the photosensitive chip 200, the above-mentioned cavity 500 is provided between the second portion of the photosensitive chip 200 and the circuit board 100. The presence of the cavity 500 can separate at least one corner region 230 of the photosensitive chip 200 from the circuit board 100 or the package body 300 , thereby cutting off the stress source of the corner region 230 and avoiding the problem of stress concentration in the corner region 230 .

[0124] In some other embodiments, the package 300 may be formed in the following manner, that is, step S130, step S240 or step S330 may include: providing a mold, wherein the mold has a cavity for injecting molding liquid; pressing the mold onto a component consisting of at least the circuit board 100 and the photosensitive chip 200, wherein the second portion is located inside the cavity. Thus, after the molding liquid is solidified to form the package 300, the package 300 contacts the second portion of the side wall of the photosensitive chip 200, in other words, the package 300 contacts at least one corner region 230 of the photosensitive chip 200. Since the package body 300 in the embodiment of the present application is in contact with at least one corner region 230 of the photosensitive chip 200, at the corner of the photosensitive chip 200 corresponding to the above-mentioned corner region 230, the package body 300 is not only in contact with the portion of the non-photosensitive region 212 adjacent to the corner region 230, but also in contact with the corner region 230. In other words, the material in contact with the corner of the photosensitive chip 200 is the same material, so that the stress transfer at the corner is continuous, and the stress concentration part at the corner of the photosensitive chip 200 can be transferred from the position adjacent to the edge of the non-photosensitive region 212 to the bottom of the side wall of the photosensitive chip 200, and the bottom of the side wall of the photosensitive chip 200 is usually a silicon material with a higher stress resistance. It can be seen that the embodiment of the present application can not only reduce the risk of damage to the photosensitive chip 200, but also reduce the total stress to which the photosensitive chip 200 is subjected.

[0125] It should be noted that, when the circuit board 100 is located on the side of the second surface 220 of the photosensitive chip 200 away from its first surface 210 and when the circuit board 100 is located outside the photosensitive chip 200, the mold is pressed onto the component consisting of the circuit board 100 and the photosensitive chip 200; and when the photosensitive chip 200 and the circuit board 100 are both arranged on the support plate 600 and the circuit board 100 surrounds the photosensitive chip 200, the mold is pressed onto the component consisting of the support plate 600, the circuit board 100 and the photosensitive chip 200.

[0126] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0127] The above specific implementations do not constitute a limitation on the protection scope of the present disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A photosensitive component, It is characterized in that include: A photosensitive chip, whose side wall includes a plurality of corner areas, the photosensitive chip includes a first surface and a second surface arranged back to back, the first surface includes a photosensitive area and a non-photosensitive area; A circuit board electrically connected to the non-photosensitive area of ​​the photosensitive chip; A packaging body, covering the circuit board and the non-photosensitive area of ​​the photosensitive chip; A buffer material is provided between the package body, the photosensitive chip and the circuit board. The elastic modulus of the buffer material is smaller than the elastic modulus of the circuit board, the elastic modulus of the photosensitive chip and the elastic modulus of the package body. The buffer material partially contacts the side wall of the photosensitive chip. The surface of the side wall of the photosensitive chip in contact with the buffer material is the first portion, and the remaining portion is the second portion, and the second portion includes at least one of the corner areas.

2. The photosensitive component according to claim 1, in, The outer side of the photosensitive chip has a cavity, and the second portion is exposed to the cavity.

3. The photosensitive component according to claim 1, in, The second portion is in contact with the package body.

4. The photosensitive component according to claim 3, in, The non-photosensitive area includes a wide side area and a narrow side area spaced apart along a first direction, the multiple corner areas include two first corner areas adjacent to the narrow side areas and two second corner areas adjacent to the wide side areas, the two first corner areas are arranged opposite to each other along a second direction, the two second corner areas are arranged opposite to each other along the second direction, the second part includes at least one of the first corner areas, and the first direction and the second direction intersect with the thickness direction of the photosensitive chip in pairs.

5. The photosensitive component according to claim 4, in, The first portion includes two of the second corner areas.

6. The photosensitive component according to claim 4, in, The wide side region is electrically connected to the circuit board, and the package body covers the wide side region and exposes the narrow side region.

7. The photosensitive component according to claim 6, in, The package body includes a wide side portion and a narrow side portion spaced apart along the first direction, the wide side portion covers the wide side region, and the narrow side portion is located at a side of the narrow side region away from the wide side portion along the first direction.

8. The photosensitive component according to claim 1, in, The side wall of the photosensitive chip also includes a connection area located between adjacent corner areas, and the first portion includes at least a portion of the connection area.

9. The photosensitive component according to claim 8, in, Along the thickness direction of the photosensitive chip, the photosensitive chip protrudes from the buffer material.

10. The photosensitive component according to claim 8, in, The non-photosensitive area includes a first electrical connection area, the second portion also includes at least a portion of the connection area connected to the first electrical connection area, and the first portion includes the remaining portion of the connection area.

11. The photosensitive component according to claim 1, in, The corner area includes: a first region extending along a first direction; and The second region extends in a second direction and intersects with the first region, and the first direction, the second direction and the thickness direction of the photosensitive chip intersect with each other.

12. The photosensitive component according to claim 11, in, A size of the first region along the first direction and / or a size of the second region along the second direction is between 0.4 mm and 1 mm.

13. The photosensitive component according to claim 11, in, A size of the first region along the first direction is the same as a size of the second region along the second direction.

14. The photosensitive component according to any one of claims 1 to 10, in, The circuit board is located on a side of the second surface away from the first surface.

15. The photosensitive component according to any one of claims 1 to 10, in, The circuit board surrounds the photosensitive chip.

16. The photosensitive component according to any one of claims 1 to 10, in, The photosensitive component also includes a support plate, which is located on a side of the second surface away from the first surface. The circuit board is arranged on the support plate and surrounds the photosensitive chip.

17. A camera module, It is characterized in that include: Optical lens; as well as According to any one of claims 1 to 16, the optical lens is located in the photosensitive path of the photosensitive chip of the photosensitive component.

18. An electronic device, It is characterized in that include: Electronic device body; as well as The camera module as described in claim 17 is arranged in the electronic device body.

19. A method for preparing a photosensitive component, It is characterized in that include: A circuit board and a photosensitive chip are provided, wherein the front surface of the circuit board includes a first mounting area and a second mounting area located outside the first mounting area, the photosensitive chip includes a first surface and a second surface disposed back to back, the first surface includes a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip has a plurality of corner areas, the side wall of the photosensitive chip includes a first portion and a second portion, and the second portion includes at least one of the corner areas; Mounting the second surface of the photosensitive chip on the first mounting area of ​​the circuit board, and electrically connecting the non-photosensitive area of ​​the photosensitive chip to the circuit board; Applying a buffer material in contact with the first portion on the front side of the circuit board; as well as forming a packaging body, wherein the packaging body covers the second mounting area of ​​the circuit board, the non-photosensitive area and the buffer material; Among them, the elastic modulus of the buffer material is smaller than the elastic modulus of the circuit board, the elastic modulus of the photosensitive chip and the elastic modulus of the package body.

20. A method for preparing a photosensitive component, It is characterized in that include: A support plate, a photosensitive chip and a ring-shaped circuit board are provided, wherein the front surface of the support plate has a third mounting area, a gap area located outside the third mounting area and a fourth mounting area located outside the gap area, the photosensitive chip includes a first surface and a second surface arranged back to back, the first surface includes a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip has a plurality of corner areas, the side wall of the photosensitive chip includes a first portion and a second portion, and the second portion includes at least one of the corner areas; Mounting the second surface of the photosensitive chip on the third mounting area; Mounting the circuit board on the fourth mounting area, and electrically connecting the circuit board to the non-photosensitive area of ​​the photosensitive chip; Applying a buffer material in contact with the first portion to the gap region; as well as forming a packaging body, wherein the packaging body covers the circuit board, the non-photosensitive area and the buffer material; Among them, the elastic modulus of the buffer material is smaller than the elastic modulus of the circuit board, the elastic modulus of the photosensitive chip and the elastic modulus of the package body.

21. A method for preparing a photosensitive component, It is characterized in that include: Provide a ring-shaped circuit board and a photosensitive chip, wherein the photosensitive chip includes a first surface and a second surface disposed back to back, the first surface includes a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip has a plurality of corner areas, the side wall of the photosensitive chip includes a first portion and a second portion, and the second portion includes at least one of the corner areas; Inserting the photosensitive chip into the central hole of the circuit board, with a gap between the circuit board and the photosensitive chip; Applying a buffer material in contact with the first portion in the gap; as well as forming a packaging body, wherein the packaging body covers the circuit board, the non-photosensitive area and the buffer material; Among them, the elastic modulus of the buffer material is smaller than the elastic modulus of the circuit board, the elastic modulus of the photosensitive chip and the elastic modulus of the package body.

22. A method for preparing a photosensitive component according to any one of claims 19 to 21, It is characterized in that Forming the package body includes: Providing a mold, wherein the mold has a cavity for injecting molding liquid; and The mold is pressed onto a component consisting of at least the circuit board and the photosensitive chip, and the second portion is located outside the cavity.

23. A method for preparing a photosensitive component according to any one of claims 19 to 21, It is characterized in that Forming the package body includes: Providing a mold, wherein the mold has a cavity for injecting molding liquid; and The mold is pressed onto a component consisting of at least the circuit board and the photosensitive chip, and the second portion is located inside the cavity.

Images