Film thickness measuring device and method

Abstract

The present application belongs to the field of semiconductor equipment technology and provides a film thickness measurement device, including a main station, the main station including an optical-mechanical module and a motion-supporting module, the sample to be measured is placed on the motion-supporting module, the optical-mechanical module including a light source assembly, a first optical assembly, and a second optical assembly, the light source assembly and the first optical assembly constitute a first measurement system, and the light source assembly and the second optical assembly constitute a second measurement system, the light source assembly includes a light source module that emits a first light and a beam splitter that divides the first light into multiple beams of second light, the beam splitter includes a first moving part, the first moving part causes the second light to be incident on the first optical assembly or the second optical assembly to achieve film thickness measurement of the sample to be measured, effectively improving the film thickness measurement range and measurement accuracy, simplifying the optical system layout, improving the light source utilization rate and equipment integration, and reducing costs. The present application also provides a film thickness measurement method, using the above-mentioned film thickness measurement device to measure the film thickness of the sample to be measured.

Description

Technical Field

[0001] The present application relates to the field of semiconductor equipment technology, and in particular to a film thickness measurement device and method. Background Art

[0002] Thin film materials are widely used in fields such as semiconductor manufacturing and optical devices. These thin films can range from dielectric films such as SiN2, Poly-Si, and SiO2 to metallic films such as Al and Cu, with thicknesses typically ranging from nanometers to micrometers. Film thickness measurement is a key technology in semiconductor manufacturing and optical devices, and accurate film thickness measurement is crucial to ensuring product quality, performance, and reliability. With the advancement of semiconductor manufacturing and precision optical technology, the demand for film thickness measurement equipment in semiconductor front-end production is increasing.

[0003] Currently, the most commonly used film thickness measurement instruments in the semiconductor field are spectroscopic ellipsometers and spectroscopic reflectometers. Spectroscopic ellipsometers measure the change in polarization state of linearly polarized light after it is reflected by a thin film sample, and then use a model to fit the film thickness. They are primarily used to measure film thicknesses ranging from tens of angstroms to several microns. Spectroscopic reflectometers analyze the reflection spectrum formed by the coherence of light reflected from the upper and lower surfaces of a film, and then use a fitting operation to determine the film thickness. They are primarily used to measure film thickness at the micron level.

[0004] Currently, in the semiconductor manufacturing field, due to the wide range of thin film sample thicknesses and the limited measurement range of spectroscopic ellipsometers and spectroscopic reflectometers, single spectroscopic ellipsometers and spectroscopic reflectometers often cannot meet a wide range of measurement needs. To ensure measurement accuracy and stability, a spectroscopic ellipsometer and spectroscopic reflectometer must be assembled together. However, this method has disadvantages such as large footprint and low light source utilization. Therefore, a new film thickness measurement device is urgently needed that can meet the wide range of film thickness measurement needs of users. Summary of the Invention

[0005] The purpose of this application is to provide a film thickness measurement device and method for improving the film thickness measurement range and equipment integration of the sample to be measured, reducing the equipment footprint, and meeting the user's film thickness measurement needs.

[0006] To achieve the above-mentioned and other related objectives, the present application provides a film thickness measurement device, comprising a main stage, the main stage comprising a stage body, an optical-mechanical module and a motion-carrying module located within the stage body, the motion-carrying module being used to carry a sample to be measured and adjust the position of the sample to be measured, the optical-mechanical module comprising a light source assembly, a first optical assembly, and a second optical assembly, the light source assembly and the first optical assembly constituting a first measurement system, and the light source assembly and the second optical assembly constituting a second measurement system;

[0007] The light source assembly includes a light source module that emits a first light and a beam splitter for splitting the first light into multiple beams of second light. The beam splitter has a first output port and a second output port, and the beam splitter includes a second reflector and a first moving part. The first moving part is used to drive the second reflector to move so that the second light is emitted to the second optical component through the first output port, or is emitted to the first optical component through the second output port, so as to measure the film thickness of the sample to be measured by the first measurement system or the second measurement system.

[0008] Optionally, when the film thickness of the sample to be measured is greater than or equal to a minimum film thickness value and less than a middle film thickness value, the first moving part drives the second reflector to move so that the second light is emitted to the first optical component;

[0009] When the film thickness of the sample to be measured is greater than or equal to the middle film thickness value and less than or equal to the maximum film thickness value, the first moving part drives the second reflector to move so that the second light is emitted to the second optical component.

[0010] Optionally, the first moving part includes a motor and a mirror fixing block, the second reflector is connected to the mirror fixing block, and the motor drives the mirror fixing block to drive the second reflector to move.

[0011] Optionally, the first light includes first parallel source light, the light source module includes a light source and a parabolic mirror, the parabolic mirror includes a first parabolic mirror, the light source radiates to generate first source light, and the first parabolic mirror converts the received first source light into the first parallel source light.

[0012] Optionally, the beam splitter further includes a first reflector, the second light includes a first parallel light, and the first parallel source light is reflected by the first reflector and the second reflector in sequence to form the first parallel light.

[0013] Optionally, the first optical component includes a first collimator, a first polarizer, a first objective lens, a fourth objective lens, a first analyzer and a first detector. The first parallel light is sequentially irradiated onto the sample to be tested through the first collimator, the first polarizer and the first objective lens, and after being reflected by the sample to be tested, is sequentially incident onto the first detector through the fourth objective lens and the first analyzer.

[0014] Optionally, the second optical component includes a second collimator, a second beam splitter, a second objective lens and a second detector. The first parallel light is sequentially irradiated onto the sample to be tested through the second collimator, the second beam splitter and the second objective lens, and after being reflected by the sample to be tested, is sequentially incident onto the second detector through the second objective lens and the second beam splitter.

[0015] Optionally, the first light further includes a second parallel source light, and the parabola further includes a second parabola, and the second parabola is used to convert the received first source light into the second parallel source light.

[0016] Optionally, the beam splitter also includes a third reflector, a first beam splitter, a first joint and a second joint, the second light also includes a second parallel light and a third parallel light, the second parallel source light is reflected by the first beam splitter to form the second parallel light, and is incident on the first joint, the second parallel source light passes through the first beam splitter and is reflected by the third reflector to form the third parallel light, and the third parallel light is incident on the second joint.

[0017] Optionally, the optical-mechanical module further includes a third optical assembly, the third optical assembly including a third light conductor, a fourth light conductor, a third collimator, a fourth collimator, a first light reflector, a third beam splitter, a fourth beam splitter, a fifth beam splitter, a third objective lens, a third tube lens, a third focusing lens, a third detector, and a fourth detector;

[0018] The third light conductor, the third collimator, the first light reflector, the third beam splitter, the fourth beam splitter, the third objective lens, the fifth beam splitter, the third focusing lens, and the third detector constitute an automatic focusing system, so that the focus of the third objective lens coincides with the surface of the sample to be measured;

[0019] The fourth light conductor, the fourth collimator, the third beam splitter, the fourth beam splitter, the third objective lens, the fourth beam splitter, the fifth beam splitter, the third tube lens and the fourth detector constitute an imaging system to acquire an image of the sample to be measured;

[0020] The third light conductor is connected to the second connector, and the fourth light conductor is connected to the first connector.

[0021] Optionally, the host station further includes a second heat dissipation module, and the second heat dissipation module includes:

[0022] a second air inlet duct, wherein an air inlet of the second air inlet duct is connected to the external space of the main unit, and an air outlet of the second air inlet duct is oriented toward the light source module, so that air outside the main unit is blown toward the light source module through the second air inlet duct;

[0023] a second air outlet duct, wherein the air outlet of the second air outlet duct is in communication with the external space of the main unit, and the air inlet of the second air outlet duct is oriented toward the light source module, so that the air flowing through the light source module is transported to the outside of the main unit through the second air outlet duct;

[0024] The second fan is arranged in the second air inlet duct and / or the second air outlet duct.

[0025] Optionally, the machine body comprises a machine chamber, and from the top to the bottom of the machine chamber, the machine chamber comprises a first machine compartment, a second machine compartment and a third machine compartment in sequence, and the main machine further comprises a heating module and an air filtration module;

[0026] The heating module is located in the first machine compartment. A first heating chamber opening is provided on a side wall of the first machine compartment to allow air from the external space of the main machine compartment to enter the first machine compartment. The heating module heats the air in the first machine compartment to generate heated gas, and transports the heated gas to the second machine compartment.

[0027] The air filtration module is located in the second machine compartment and is spaced apart from the optical-mechanical module. The air filtration module is used to purify the air in the second machine compartment to generate purified gas, and blow the purified gas to the optical-mechanical module to provide a measurement microenvironment for the optical-mechanical module.

[0028] The motion bearing module and the optomechanical module are both located in the third machine compartment. The optomechanical module is spaced apart from the top of the third machine compartment. The outer surface of the third machine compartment is covered with a third cavity skin. The third cavity skin includes a third inner skin and a third outer skin that are spaced apart.

[0029] The present application also provides a film thickness measurement method, which uses any of the film thickness measurement devices in the aforementioned embodiments to measure the film thickness of a sample to be measured, comprising the following steps:

[0030] Obtaining a predicted film thickness range of the sample to be tested;

[0031] determining a measurement mode of the film thickness measuring device according to the predicted film thickness range;

[0032] Activating the film thickness measuring device to provide a measurement microenvironment in the third machine compartment of the main machine;

[0033] Placing the sample to be measured on the moving bearing module of the film thickness measuring device;

[0034] According to the measurement mode, controlling the motion bearing module to move the sample to be measured to a target measurement position;

[0035] Using the first moving part to move the second reflecting mirror, so that the film thickness measuring device operates in a determined measurement mode;

[0036] The film thickness of the sample to be tested is measured.

[0037] The film thickness measurement device and method provided in this application have at least the following beneficial effects:

[0038] On the one hand, in the film thickness measuring device of the present application, the film thickness measurement range and measurement accuracy of the thin film are effectively improved through the first measuring system and the second measuring system, and the first moving part is used to realize the switching between the first measuring system and the second measuring system, thereby improving the operability, ease of use and measurement efficiency of the device, and the second light is parallel light. By replacing the objective lens of the first measuring system and the second measuring system, the measurement level of the film thickness measuring device can be changed, thereby adapting to a wider range of film thickness measurement needs; the optical-mechanical module also integrates an imaging system and an automatic focusing system, which realizes the surface recognition and automatic focusing functions of the sample to be measured, ensuring that the imaging system can obtain a clear image of the surface of the sample to be measured, and makes the focus of the objective lens of the first measuring system coincide with the surface of the sample to be measured, thereby improving the accuracy of film thickness measurement; by sharing some optical devices in the optical-mechanical module, the utilization rate of the light source and the integration of the optical-mechanical module are effectively improved, the optical system layout is simplified, the volume of the optical-mechanical module is reduced, and the cost is reduced.

[0039] Secondly, a second heat dissipation module is set in the main machine, which effectively solves the heat dissipation problem of the light source while ensuring the high integration of the main machine, prevents the heat of the light source from affecting the film thickness measurement, and ensures the working stability of the light source assembly; by setting a double-layer third chamber skin, the temperature stability in the third machine compartment is effectively improved; the microenvironment system composed of the heating module and the air filtration module can provide a suitable measurement microenvironment for film thickness measurement, effectively prevent external impurities from affecting the air cleanliness of the third machine compartment, reduce the impact of fluctuations in environmental factors on film thickness measurement, and improve the accuracy of film thickness measurement.

[0040] The film thickness measurement method provided in the present application utilizes the above-mentioned film thickness measurement device to measure the film thickness of the sample to be measured, and therefore also has the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 Shown is a structural diagram of the host station provided in Example 1 of the present application.

[0043] Figure 2Shown is a schematic diagram of the specific structure of the host station provided in Example 1 of the present application.

[0044] Figure 3 Shown is a structural schematic diagram of the optical-mechanical module provided in Example 1 of the present application.

[0045] Figure 4 Shown is a structural schematic diagram of a beam splitter provided as an optional embodiment in the first embodiment of the present application.

[0046] Figure 5 Shown is a structural schematic diagram of a beam splitter provided as another optional embodiment in the first embodiment of the present application.

[0047] Figure 6 Shown is a schematic diagram of the top structure of the host station provided in Example 2 of the present application.

[0048] Figure 7 Shown is a flow chart of the film thickness measurement method provided in Example 4 of the present application.

[0049] Reference numerals:

[0050] 2. Main machine; 21. Machine body; 211. Machine frame; 212. Machine cover; 2121. Film loading port; 213. Machine partition; 214. Machine chamber; 2141. First machine compartment; 2142. Second machine compartment; 2143. Third machine compartment; 22. Optomechanical module; 221. Light source assembly; 2211. Light source module; 2021. Light source; 2022. Parabolic mirror; 2101. First parabolic mirror; 2102. Second parabolic mirror; 2212. Beam splitter; 2024. First output port; 2025, second output port; 2026, third output port; 2027, fourth output port; 2031, first reflector; 2032, second reflector; 2033, third reflector; 2034, first beam splitter; 2035, first moving part; 2041, motor; 2042, mirror fixing block; 2036, first connector; 2037, second connector; 222, first optical component; 2221, first collimator; 2222, first polarizer; 2223, first objective lens; 2224, fourth objective lens; 22 25. First analyzer; 2226. First detector; 223. Second optical component; 2231. Second collimator; 2232. Second beam splitter; 2233. Second objective lens; 2234. Second detector; 224. Third optical component; 2001. Third light conductor; 2002. Fourth light conductor; 2003. Third collimator; 2004. Fourth collimator; 2005. First light reflector; 2006. Third beam splitter; 2007. Fourth beam splitter; 2008. Fifth beam splitter; 2009. Third objective lens; 2010, third cylindrical mirror; 2011, third focusing mirror; 2012, third detector; 2013, fourth detector; 23, motion bearing module; 231, bearing assembly; 232, platform motion assembly; 233, first supporting assembly; 234, second supporting assembly; 24, second heat dissipation module; 241, second air inlet duct; 2411, air inlet of second air inlet duct; 242, second air outlet duct; 2421, air outlet of second air outlet duct; 25, heating module; 26, air filtration module; 27, air pressure module. DETAILED DESCRIPTION

[0051] To make the technical objectives, technical solutions, and technical effects of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with embodiments. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Generally, the components of the embodiments of this application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the claimed application, but rather merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in this application without creative effort are within the scope of protection of this application. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance.

[0053] In the description of this application, it should be noted that the reference terms "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any appropriate scheme in any one or more embodiments or examples.

[0054] Example 1

[0055] This embodiment provides a film thickness measurement device for improving the film thickness measurement range and device integration of the sample to be measured, reducing the footprint of the device, and meeting various film thickness measurement needs of users. Figure 1 The film thickness measuring device of this embodiment includes a main unit 2.

[0056] The main machine 2 includes a machine body 21 and an optical-mechanical module 22 and a motion-carrying module 23 located in the machine body 21. The motion-carrying module 23 is used to carry the sample to be tested and adjust the position of the sample to be tested. The optical-mechanical module 22 includes a light source component 221, a first optical component 222 and a second optical component 223. The light source component 221 and the first optical component 222 constitute a first measuring system, and the light source component 221 and the second optical component 223 constitute a second measuring system. The film thickness of the sample to be tested can be measured by the first measuring system or the second measuring system, where the film thickness is the film thickness of the sample to be tested.

[0057] In an optional embodiment, the first measurement system is an ellipsometric measurement system, and the film thickness measurement range of the first measurement system is 2nm to 5μm. The first measurement system has higher measurement accuracy when measuring the thickness of relatively thin films. Optionally, when the film thickness of the sample to be measured is greater than or equal to the minimum film thickness and less than the middle value of the film thickness, the film thickness of the sample to be measured is obtained by measuring the first measurement system. Furthermore, the minimum film thickness is 2nm, and the middle value of the film thickness can be set according to actual needs. For example, the middle value of the film thickness can be 100nm, 200nm, 300nm, 400nm, 500nm, 600nm, 700nm, 800nm ​​or other values ​​between any two of the above value points.

[0058] In an optional embodiment, the second measurement system is a reflection measurement system, and the film thickness measurement range of the second measurement system is 50nm to 5μm. The second measurement system has higher measurement accuracy when measuring the thickness of relatively thick thin films. Optionally, when the film thickness of the sample to be measured is greater than or equal to the middle value of the film thickness, and less than or equal to the maximum value of the film thickness, the film thickness of the sample to be measured is obtained by measuring the second measurement system, and further, the maximum value of the film thickness is 5μm. By using the second measurement system to measure the film thickness of the sample to be measured with a thicker film thickness, and using the first measurement system to measure the film thickness of the sample to be measured with a thinner film thickness, the film thickness measurement range of the film thickness measurement device is improved, and it is ensured that within the film thickness measurement range, the measurement results have a higher measurement accuracy.

[0059] By cooperating with the second measurement system, the film thickness measurement of a wider film thickness range is achieved while ensuring the measurement accuracy, and the first measurement system and the second measurement system share the same light source component 221, which effectively improves the utilization rate of the light source, simplifies the optical system layout, improves the integration of the optical-mechanical module 22, reduces the volume of the optical-mechanical module 22, and reduces the cost.

[0060] Reference Figure 2 and Figure 3 In this embodiment, the light source assembly 221 includes a light source module 2211 and a beam splitter 2212. The light source module 2211 can emit a first light. Optionally, the light source module 2211 includes a light source 2021 and a parabolic mirror 2022. The light source 2021 is used to radiate and generate the first source light. The parabolic mirror 2022 can convert the first source light radiated by the light source 2021 into parallel first light and then input it into the beam splitter 2212. Furthermore, the light source 2021 can be a xenon lamp light source, an LDLS light source, or other acceptable light sources. The beam splitter 2212 splits the received first light into multiple beams of second light.

[0061] The first light includes a first parallel source light, and the parabola 2022 includes a first parabola 2101. The first parabola 2101 is used to convert the first source light radiated by the light source 2021 into the first parallel source light. Optionally, the first light also includes a second parallel source light, and the parabola 2022 also includes a second parabola 2102. The second parabola 2102 is used to convert the first source light radiated by the light source 2021 into the second parallel source light. The first parallel source light and the second parallel source light have different emission directions. Furthermore, the first parabola 2101 and the second parabola 2102 are respectively located on both sides of the light source 2021, the first parabola 2101 is located in the beam splitter 2212, and the second parabola 2102 is located on the side of the light source 2021 away from the beam splitter 2212. The first source light radiated by the light source 2021 can be irradiated to the first parabola 2101 and the second parabola 2102, and the emission direction of the first parallel source light is perpendicular to the emission direction of the second parallel source light.

[0062] Reference Figure 4 and Figure 5 The second light includes a first parallel light, the beam splitter 2212 has a first output port 2024 and a second output port 2025, and the beam splitter 2212 includes a first reflector 2031, a first moving part 2035 and a second reflector 2032, wherein the second reflector 2032 is connected to the first moving part 2035, and the first moving part 2035 can adjust the output position of the first parallel light by adjusting the position of the second reflector 2032. Specifically, the first moving part 2035 can drive the second reflector 2037 to move forward or backward in the direction from the first output port 2024 to the second output port 2025, so that the first parallel light formed after the first parallel source light is reflected by the first reflector 2031 and the second reflector 2032 is output through the first output port 2024 or the second output port 2025.

[0063] In an optional embodiment, the second light also includes a second parallel light and a third parallel light, and the beam splitter 2212 also has a third output port 2026 and a fourth output port 2027. In addition, the beam splitter 2212 also includes a third reflector 2033, a first beam splitter 2034, a first connector 2036 and a second connector 2037. The first connector 2036 is arranged at the third output port 2026, and the second connector 2037 is arranged at the fourth output port 2027. The second parallel source light is reflected by the first beam splitter 2034 to form a second parallel light, and is output from the beam splitter 2212 through the first connector 2036. The second parallel source light is transmitted through the first beam splitter 2034 to form a third parallel light, and is reflected by the third reflector 2033 and output from the beam splitter 2212 through the second connector 2037. Optionally, the ratio of transmittance to reflectivity of the first beam splitter 2034 is 1:1, and the first connector 2036 and the second connector 2037 are both SMA905 connectors.

[0064] In an optional embodiment, the first moving portion 2035 includes a motor 2041 and a mirror fixing block 2042. The motor 2041 may be a linear motor. The second reflector is connected to the mirror fixing block 2042. The linear motor can drive the mirror fixing block 2042 to move in a direction from the first output port 2024 to the second output port 2025. When the mirror fixing block 2042 moves to a position corresponding to the first output port 2024, the first parallel light is output through the first output port 2024. When the mirror fixing block 2042 moves to a position corresponding to the second output port 2025, the first parallel light is output through the second output port 2025. The first moving portion 2035 enables the film thickness measurement device to switch between the first measurement system and the second measurement system during operation, thereby adjusting the operating mode of the film thickness measurement device. In specific use, the first measurement system or the second measurement system can be selected to measure the sample according to the film thickness characteristics of the sample to be measured, effectively improving the operability, ease of use, and measurement efficiency of the film thickness measurement device.

[0065] Reference Figure 3 and Figure 5 The first optical assembly 222 includes a first collimator 2221, a first polarizer 2222, a first objective lens 2223, a fourth objective lens 2224, a first analyzer 2225, and a first detector 2226. The second light generated by the first light splitting by the beam splitter 2212 passes through the first collimator 2221, the first polarizer 2222, and the first objective lens 2223 in sequence and is incident on the sample to be measured. The second light reflected by the sample to be measured passes through the fourth objective lens 2224 and the first analyzer 2225 in sequence and is incident on the first detector 2226, thereby achieving thickness measurement of the sample to be measured. Optionally, the first parallel light generated by the first light splitting by the beam splitter 2212 is input into the first optical assembly 222 via the second output port 2025 of the beam splitter 2212, so that the film thickness measurement device can perform film thickness measurement using the first measurement system. The first objective lens 2223 is exactly the same as the fourth objective lens 2224. The first objective lens 2223 is a transmission objective lens, which can realize film thickness measurement in the light wave band range of 190nm to 900nm; further, the first objective lens 2223 can also be a reflection objective lens, which can realize film thickness measurement in the light wave band range of 190nm to 1700nm.

[0066] Reference Figure 3 and Figure 4The second optical assembly 223 includes a second collimator 2231, a second beam splitter 2232, a second objective lens 2233, and a second detector 2234. The second light generated by the first light splitting by the beam splitter 2212 is sequentially transmitted through the second collimator 2231, the second beam splitter 2232, and the second objective lens 2233 to irradiate the sample to be measured. The second light reflected by the sample to be measured is sequentially transmitted through the second objective lens 2233 and the second beam splitter 2232 to enter the second detector 2234, thereby achieving thickness measurement of the sample to be measured. Optionally, the first parallel light generated by the first light splitting by the beam splitter 2212 is input into the second optical assembly 223 via the first output port 2024 of the beam splitter 2212, so that the film thickness measurement device can perform film thickness measurement using the second measurement system. The second objective lens 2233 is a transmission objective lens to achieve film thickness measurement in a wavelength range of 400nm to 800nm; further, the second objective lens 2233 can also be a reflection objective lens to achieve film thickness measurement in a wavelength range of 230nm to 900nm.

[0067] In this embodiment, refer to Figure 3 The optical-mechanical module 22 also includes a third optical component 224, which includes a third light transmitter 2001, a fourth light transmitter 2002, a third collimator 2003, a fourth collimator 2004, a first light reflector 2005, a third beam splitter 2006, a fourth beam splitter 2007, a fifth beam splitter 2008, a third objective lens 2009, a third tube lens 2010, a third focusing lens 2011, a third detector 2012 and a fourth detector 2013.

[0068] In an optional embodiment, the third light conductor 2001, the third collimator 2003, the first light reflector, the third beam splitter, the fourth beam splitter, the third objective lens 2009, the fifth beam splitter 2008, the third focusing lens 2011, and the third detector 2012 form an autofocus system. Optionally, the third objective lens 2009 is confocal with the first objective lens 2223. The third light conductor 2001 is connected to the second connector 2037. The third parallel light generated after the first light is split by the beam splitter 2212 is input into the autofocus system via the second connector 2037. After being transmitted by the third light conductor 2001, the third parallel light enters the third collimator 2003, is collimated by the third collimator 2003, and then is emitted to the first light reflector 2005. After being reflected by the first light reflector 2005, it passes through the third beam splitter 2006, is reflected and redirected by the fourth beam splitter 2007, and then is transmitted to the third objective lens 2011. The second light is irradiated by the objective lens 2009 onto the sample to be measured. The second light reflected by the sample to be measured passes through the third objective lens 2009 and the fourth beam splitter 2007 in sequence, and is reflected and redirected by the fifth beam splitter 2008 before entering the third focusing lens 2011. After being focused by the third focusing lens 2011, it is incident on the third detector 2012 to obtain the focal position of the third objective lens 2009. The focus of the third objective lens 2009 is made to coincide with the surface of the sample to be measured through the automatic focusing system, thereby realizing the automatic focusing function.

[0069] In an optional embodiment, the fourth light transmitter 2002, the fourth collimator 2004, the third beam splitter 2006, the fourth beam splitter 2007, the third objective lens 2009, the fourth beam splitter 2007, the fifth beam splitter 2008, the third tube lens 2010 and the fourth detector 2013 constitute an imaging system. Optionally, the detection surface of the fourth detector 2013 coincides with the imaging surface of the third tube lens 2010. The fourth light transmitter 2002 is connected to the first connector 2036. The second parallel light generated after the first light is split by the beam splitter 2212 is input into the imaging system through the first connector 2036. After being transmitted by the fourth light transmitter 2002, it enters the fourth collimator 2004. After being collimated by the fourth collimator 2004, it is reflected and redirected by the third beam splitter 2006 and the fourth beam splitter 2007 respectively, and then irradiated onto the sample to be tested through the third objective lens 2009. After being reflected by the sample to be tested, the second parallel light passes through the third objective lens 2009, the fourth beam splitter 2007, the fifth beam splitter 2008, and the third tube lens 2010 in sequence and is incident on the fourth detector 2013, so that the sample to be tested is imaged on the fourth detector 2013, thereby obtaining an image of the sample to be tested.

[0070] The imaging system and the automatic focusing system use a common objective lens setting, and the objective lens focus of the automatic focusing system coincides with the objective lens focus of the first measurement system. When the objective lens focus of the automatic focusing system coincides with the surface of the sample to be measured, it can ensure that the imaging system obtains a clear image of the sample to be measured, and the objective lens focus of the first measurement system coincides with the surface of the sample to be measured.

[0071] Reference Figure 2 In this embodiment, the motion bearing module 23 includes a bearing component 231, a platform motion component 232, a first support component 233 and a second support component 234. Optionally, the motion bearing module 23 is located below the optical-mechanical module 22, and the area between the motion bearing module 23 and the optical-mechanical module 22 is the film thickness measurement area of ​​the sample to be measured. The carrying assembly 231 is used to carry the sample to be tested, and the platform motion assembly 232 is located below the carrying assembly 231, and is used to drive the carrying assembly 231 to move; optionally, the platform motion assembly 232 includes a first motion axis, a second motion axis and a third motion axis, and the platform motion assembly 232 can move along the first motion axis, the second motion axis and the third motion axis, which are respectively extended in the x-axis direction, the y-axis direction and the z-axis direction, and the x-axis direction, the y-axis direction and the z-axis direction are perpendicular to each other, so that the sample to be tested can move to the focus of the first objective lens 2223 or the second objective lens 2233; further, a gantry-type structure is stacked to form the first motion axis, the second motion axis and the third motion axis; further, the platform motion assembly 232 also includes a marble platform, which is located below the first motion axis, the second motion axis and the third motion axis, and is used to carry the platform motion assembly 232.

[0072] Reference Figure 2 The first support assembly 233 is connected to the bottom of the platform motion assembly 232 to support the platform motion assembly 232. Optionally, the first support assembly 233 includes four support parts, which are respectively connected to the four top corners and bottoms of the marble platform to support the platform motion assembly 232. The opposite ends of the second support assembly 234 are respectively connected to the platform motion assembly 232 and the optical-mechanical module 22 to support the optical-mechanical module 22. The second support assembly 234 can keep the optical-mechanical module 22 and the motion-carrying module 23 relatively still, thereby reducing the impact of the external environment on the measurement results.

[0073] The film thickness measuring device provided in this embodiment cooperates with the second measuring system through the first measuring system and uses the first moving part to switch between the first measuring system and the second measuring system, thereby effectively improving the film thickness measurement range and ensuring the measurement accuracy. The measurement level of the film thickness measuring device can be changed by replacing the objective lenses of the first measuring system and the second measuring system, and can adapt to a wider range of film thickness measurement needs; the motion supporting module 23 can move the sample to be measured to the focus of the objective lens of the first measuring system or the second measuring system; the surface features of the sample to be measured can be identified by the imaging system, and the automatic focusing function is realized by the automatic focusing system, ensuring that the imaging system can obtain a clear image of the sample to be measured, and the focus of the objective lens of the first measuring system coincides with the surface of the sample to be measured; the first measuring system, the second measuring system, the imaging system and the automatic focusing system share the light source assembly 221 and some optical devices, which effectively improves the utilization rate of the light source and the integration of the optical-mechanical module 22, simplifies the optical system layout, reduces the volume of the optical-mechanical module 22, and reduces the cost.

[0074] Example 2

[0075] This embodiment provides another film thickness measuring device, which also includes the main unit 2 of the first embodiment. The same points as the first embodiment will not be repeated here. The difference is that:

[0076] Reference Figure 2 and Figure 6 In this embodiment, the main unit 2 further includes a second heat dissipation module 24, which includes a second air inlet duct 241, a second air outlet duct 242, and a second fan (not shown). The second fan is disposed in the second air inlet duct 241 and / or the second air outlet duct 242 to form an air flow from the air entering the second air inlet duct 241 and / or the second air outlet duct 242; the air inlet 2411 of the second air inlet duct is in communication with the external space of the main unit 2; the air outlet (not shown) of the second air inlet duct 241 faces the light source module 2211, so that the air outside the main unit 2 is blown toward the light source module 2211 through the air in the second air inlet duct 241; the air outlet 2421 of the second air outlet duct 242 is in communication with the external space of the main unit 2. , the air inlet (not released) of the second air outlet duct 242 faces the light source module 2211, so that the air flowing through the light source module 2211 is transported to the outside of the main unit 2 through the second air outlet duct 242; optionally, the second air outlet duct 242, the second air inlet duct 241 and the light source module 2211 are airtightly connected; further, the second air inlet duct 241 and the second air outlet duct 242 are both located above the optical machine module 22, and the air inlet 2411 of the second air inlet duct and the air outlet 2421 of the second air outlet duct are located on opposite sides of the main unit 2.

[0077] In an optional embodiment, the light source module 2211 further includes a light source lamp chamber and a heat-conducting structure. The light source is located in the light source lamp chamber. One end of the heat-conducting structure is connected to the light source lamp chamber, and the other end is located in the heat dissipation path formed by the second air inlet duct 241 and the second air outlet duct 242 to dissipate heat from the light source lamp chamber. Optionally, the heat-conducting structure is located in the air path formed by the second air inlet duct 241 and the second air outlet duct 242, and is connected between the second air inlet duct 241 and / or the second air outlet duct 242. Furthermore, the heat-conducting structure is airtightly connected to the second air inlet duct 241 and the second air outlet duct 242. A second fan is provided at the air inlet 2411 of the second air inlet duct and at the air outlet 2421 of the second air outlet duct. The second fan can form an airflow between the air in the second air inlet duct 241 and the second air outlet duct 242 to improve heat dissipation efficiency. During use, low-temperature gas enters the second air inlet duct 241 from the outside of the main unit 2, and is driven by the second fan. The gas is blown toward the heat-conducting structure of the light source module 2211 through the second air inlet duct 241, and then flows out through the second air outlet duct 242 after passing through the heat-conducting structure. Since the heat-conducting structure is airtightly connected to the second air inlet duct 241 and the second air outlet duct 242, the air flow therein can be effectively prevented from overflowing into the measurement area, thereby adversely affecting the film thickness measurement.

[0078] Reference Figure 3 In this embodiment, the machine body 21 includes a machine frame 211, a machine cover 212 and a machine partition 213. The overall outline of the machine frame 211 is a rectangular parallelepiped structure. The machine cover 212 is connected to the machine frame 211 and covers the outer side surfaces and outer top surface of the rectangular parallelepiped structure of the machine frame 211, so that a machine chamber 214 is formed in the machine body 21. An upper plate opening 2121 is provided in the machine cover 212 on the outer side surface of the machine body 21, through which the sample to be tested can be taken and placed. The machine partition 213 is located in the machine chamber 214 and is connected to the machine frame 211 to divide the machine chamber 214 into multiple machine compartments. Optionally, at least part of the machine partition plates 213 are provided with slots to achieve connectivity between adjacent machine compartments; further, the machine cover 212 on the outer side of the machine body 21 has an opening to expose the air inlet 2411 of the second air inlet duct and the air outlet 2421 of the second air outlet duct.

[0079] In an optional embodiment, the machine chamber 214 includes a third machine compartment 2143, the motion bearing module 23 is located at the bottom of the third machine compartment 2143, the optical machine module 22 is located in the third machine compartment 2143 and above the motion bearing module 23, and the optical machine module 22 is spaced apart from the top of the third machine compartment 2143; the machine skin 212 covering the outer surface of the third machine compartment 2143 is recorded as the third chamber skin, and the third chamber skin includes a third inner skin layer and a third outer skin layer spaced apart; optionally, air is filled between the third inner skin layer and the third outer skin layer; further, other material layers, such as a thermal insulation material layer, may be provided between the third inner skin layer and the third outer skin layer. By providing a double-layer third chamber skin, the temperature stability of the measurement area within the third chamber can be improved.

[0080] Reference Figure 2 In an optional embodiment, the main machine table 2 further includes a heating module 25 and an air filtering module 26, and the machine chamber 214 further includes a first machine compartment 2141 and a second machine compartment 2142. The second machine compartment 2142 is located between the first machine compartment 2141 and the third machine compartment 2143, and is located above the third machine compartment 2143, so that the first machine compartment 2141, the second machine compartment 2142 and the third machine compartment 2143 are distributed in sequence from the top to the bottom of the main machine table 2; the heating module 25 is located in the first machine compartment 2141. The side wall of the first machine compartment 2141 is provided with a first heating chamber opening, through which external air can enter the first machine compartment 2141, and the heating module 25 can heat the air in the first machine compartment 2141 to generate heated gas, and transport the heated gas to the second machine compartment 2142; the air filter is located in the second machine compartment 2142 and is spaced apart from the optical machine module 22. The air filter module 26 is used to purify the air in the second machine compartment 2142 to generate purified gas, and blow the purified gas to the optical machine module 22. Optionally, the air filtration module 26 has a filter inlet and a filter outlet, the filter inlet is located in the second machine compartment 2142, the air in the second machine compartment 2142 enters the air filtration module 26 through the filter inlet, the filter outlet is located in the third machine compartment 2143, and the filtered air is blown into the third machine compartment 2143 through the filter outlet; further, the area of ​​the second machine compartment 2142 other than the filter inlet is airtight to the third machine compartment 2143, so that the air in the second machine compartment 2142 can enter the third machine compartment 2143 only through the air filtration module 26, thereby ensuring the stability of the measurement microenvironment of the measurement area.

[0081] In an optional embodiment, the airflow velocity at the filter outlet of the air filter module 26 is 0.3 m / s to 0.4 m / s, and the airflow temperature at the filter outlet is 25.75° C. to 27.25° C., and optionally, the airflow temperature at the filter outlet is 26° C. to 27° C. By controlling the operating parameters of the air filter module 26, the air pressure in the measurement area in the third machine compartment 2143 can be made greater than the air pressure outside the main machine 2, thereby ensuring that the measurement area has a stable high air cleanliness and preventing external impurities from accumulating in the measurement area.

[0082] In this embodiment, the heating module 25 and the air filtration module 26 constitute a microenvironment system, which provides a measurement microenvironment for the optical-mechanical module 22. When the measurement area is within the measurement microenvironment, the measurement area has clean air and appropriate temperature and humidity, ensuring that environmental indicators are within an appropriate range. This reduces the impact of environmental fluctuations on the film thickness measurement of the sample to be measured and improves the accuracy of the film thickness measurement. In this embodiment, the measurement microenvironment can be understood as an environment suitable for film thickness measurement.

[0083] Reference Figure 2 In an optional embodiment, the main station 2 further includes an air pressure module 27, which is connected to the bottom of the motion bearing module 23. Optionally, the air pressure module 27 is fixedly connected to the first support assembly 233, and the air pressure module 27 is supported by the first support assembly 233. The air pressure module 27 is used to provide compressed gas and vacuum air circuits for the motion bearing module 23 to achieve adsorption and release of the sample to be tested, thereby ensuring the safety and reliability of the sample to be tested during movement. Optionally, a gas filter assembly is provided in the air pressure module 27 to filter the gas in the air pressure module 27 to ensure the cleanliness of the compressed air; further, a buffer pressure tank is also provided in the air pressure module 27 to facilitate the stability of the pressure flow in the air pressure module 27.

[0084] The film thickness measuring device of this embodiment also includes a mainframe 2, and thus has the same beneficial effects as the first embodiment. In addition, in the film thickness measuring device of this embodiment, by providing a second heat dissipation module 24, while ensuring that the mainframe 2 has a high degree of integration, the problem of heat dissipation of the light source is effectively solved, preventing the heat of the light source from affecting the film thickness measurement process, and ensuring the working stability of the light source assembly 221; by providing a double-layer third chamber skin, the temperature stability within the third machine compartment 2143 is effectively improved; by forming a microenvironment system with a heating module 25 and an air filtration module 26, a suitable measurement microenvironment can be provided for film thickness measurement, effectively preventing external impurities from affecting the air cleanliness of the third machine compartment 2143, reducing the impact of fluctuations in environmental factors on the film thickness measurement of the sample to be measured, and improving the accuracy of the film thickness measurement; by providing an air pressure module 27, compressed gas and a vacuum air path can be provided to the motion bearing module 23, achieving adsorption and release of the sample to be measured, and ensuring the safety and reliability of the sample to be measured during movement.

[0085] Example 3

[0086] This embodiment provides another film thickness measuring device, which also includes a main unit 2. The film thickness measuring device provided in this embodiment is similar to that of the first or second embodiment and is not described in detail. The difference is that:

[0087] In this embodiment, the film thickness measurement device further includes a power supply module, a control module, and an information exchange module. The power supply module is used to provide energy for the film thickness measurement device. Optionally, the power supply module may include a DC power supply unit and an AC power supply unit, and is electrically connected to the host computer 2. The control module is used to control the operation of the film thickness measurement device. Optionally, the control module is in communication with the host computer 2. The control module includes an industrial computer unit, a motion control unit, and an optical-mechanical control unit. The industrial computer unit is used to collect, store, and process measurement information from the thickness measurement device. The motion control unit is used to control the movement of the motion bearing module 23. The optical-mechanical control unit is used to control the operation of the optical-mechanical module 22. The information exchange module is used to implement data exchange between the host computer 2 and external devices.

[0088] Example 4

[0089] This embodiment provides a film thickness measurement method, using any of the film thickness measurement devices in the above embodiments to measure the film thickness of a sample to be measured, referring to Figure 7 The film thickness measurement method of this embodiment includes steps S1 to S7.

[0090] Step S1: Obtain the predicted film thickness range of the sample to be tested.

[0091] In this embodiment, the film thickness refers to the film thickness of the sample to be measured. The film thickness of the sample to be measured is estimated in advance before measurement to obtain a predicted film thickness range of the sample to be measured.

[0092] In an optional embodiment, the predicted film thickness range includes a first film thickness range and a second film thickness range, wherein the maximum value of the first film thickness range is a mid-thickness value of the film thickness, the minimum value of the first film thickness range is a minimum film thickness value, the maximum value of the second film thickness range is a maximum film thickness value, and the minimum value of the second film thickness range is a mid-thickness value of the film thickness. The film thickness of the sample to be tested is estimated in advance, and it is determined whether the film thickness of the sample to be tested is within the first film thickness range or the second film thickness range to obtain a predicted film thickness range for the sample to be tested.

[0093] Step S2: Determine the measurement mode of the film thickness measuring device according to the predicted film thickness range.

[0094] In this embodiment, the measurement mode of the film thickness measuring device includes a first measurement mode and a second measurement mode. The first measurement mode is an operating mode in which the film thickness measuring device uses a first measurement system to measure film thickness, and the second measurement mode is an operating mode in which the film thickness measuring device uses a second measurement system to measure film thickness.

[0095] In an optional embodiment, when the predicted film thickness range obtained is the first film thickness range, the measurement mode of the film thickness measuring device is the first measurement mode; when the predicted film thickness range obtained is the second film thickness range, the measurement mode of the film thickness measuring device is the second measurement mode.

[0096] Step S3: Start the film thickness measuring device to create a measurement microenvironment in the third machine compartment of the main machine.

[0097] In this embodiment, the film thickness measuring device is started, and the heating module 25 and the air filtration module 26 of the film thickness measuring device start working. The heating module 25 heats the air in the first machine compartment 2141 to generate heated gas, and transports the heated gas to the second machine compartment 2142. The air filtration module 26 purifies the gas in the second machine compartment 2142 to generate purified gas, and blows the purified gas to the optical machine module 22 of the third machine compartment 2143, so that the third machine compartment 2143 has a measurement microenvironment.

[0098] Step S4: placing the sample to be tested on the moving supporting module of the film thickness measuring device; optionally, the sample to be tested can be placed on the moving supporting module 23 by an automatic loading device, or the sample to be tested can be placed on the moving supporting module 23 by other suitable methods.

[0099] Step S5: According to the measurement mode, the motion carrying module is controlled to move the sample to be measured to the target measurement position.

[0100] In this embodiment, the target measurement position includes a first measurement position and a second measurement position. When the film thickness measuring device operates in a first measurement mode, the target measurement position of the sample to be measured is the first measurement position, and the first measurement position is the film thickness measurement position of the first measurement system. When the film thickness measuring device operates in a second measurement mode, the target measurement position of the sample to be measured is the second measurement position, and the second measurement position is the film thickness measurement position of the second measurement system.

[0101] Step S6: using the first moving part to move the second reflecting mirror, so that the film thickness measuring device operates in the determined measurement mode.

[0102] In this embodiment, when the film thickness measuring device operates in the first measurement mode, the first moving portion 2035 is used to move the position of the second reflector 2032 so that the first parallel light in the second light is incident on the first optical component 222 through the second output port 2025 of the beam splitter 2212, so that the film thickness measuring device performs film thickness measurement through the first measurement system; when the film thickness measuring device operates in the second measurement mode, the first moving portion 2035 is used to move the position of the second reflector 2032 so that the first parallel light in the second light is incident on the second optical component 223 through the first output port 2024 of the beam splitter 2212, so that the film thickness measuring device performs film thickness measurement through the second measurement system.

[0103] Step S7: Measuring the film thickness of the sample to be tested. Optionally, when the predicted film thickness range is the first film thickness range, the film thickness of the sample to be tested is measured by the first measurement system, and when the predicted film thickness range is the second film thickness range, the film thickness of the sample to be tested is measured by the second measurement system.

[0104] The film thickness measurement method of this embodiment uses any of the film thickness measurement devices in the aforementioned embodiments to measure the film thickness of the sample to be measured, and therefore, also has the beneficial effects of the aforementioned embodiments.

[0105] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify, alter, or combine the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or variations accomplished by a person of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.

Claims

1. A film thickness measuring device, characterized in that: The apparatus comprises a main stage, the main stage comprising a main stage body, an optical-mechanical module and a motion-carrying module located within the main stage body, the motion-carrying module being used to carry a sample to be tested and adjust the position of the sample to be tested, the optical-mechanical module comprising a light source assembly, a first optical assembly and a second optical assembly, the light source assembly and the first optical assembly forming a first measurement system, and the light source assembly and the second optical assembly forming a second measurement system; The light source assembly includes a light source module that emits a first light and a beam splitter for splitting the first light into multiple beams of second light. The beam splitter has a first output port and a second output port, and the beam splitter includes a second reflector and a first moving part. The first moving part is used to drive the second reflector to move so that the second light is emitted to the second optical component through the first output port, or is emitted to the first optical component through the second output port, so as to measure the film thickness of the sample to be measured by the first measurement system or the second measurement system.

2. The film thickness measuring device according to claim 1, characterized in that When the film thickness of the sample to be measured is greater than or equal to the minimum film thickness value and less than the middle film thickness value, the first moving part drives the second reflector to move so that the second light is emitted to the first optical component; When the film thickness of the sample to be measured is greater than or equal to the middle film thickness value and less than or equal to the maximum film thickness value, the first moving part drives the second reflector to move so that the second light is emitted to the second optical component.

3. The film thickness measuring device according to claim 1, wherein The first moving part includes a motor and a mirror fixing block, the second reflector is connected to the mirror fixing block, and the motor drives the mirror fixing block to drive the second reflector to move.

4. The film thickness measuring device according to claim 1, wherein: The first light includes first parallel source light, the light source module includes a light source and a parabolic mirror, the parabolic mirror includes a first parabolic mirror, the light source radiates to generate first source light, and the first parabolic mirror converts the received first source light into the first parallel source light.

5. The film thickness measuring device according to claim 4, characterized in that: The beam splitter further includes a first reflector, the second light includes a first parallel light, and the first parallel source light is reflected by the first reflector and the second reflector in sequence to form the first parallel light.

6. The film thickness measuring device according to claim 5, characterized in that The first optical component includes a first collimator, a first polarizer, a first objective lens, a fourth objective lens, a first analyzer and a first detector. The first parallel light is sequentially irradiated onto the sample to be tested through the first collimator, the first polarizer and the first objective lens, and after being reflected by the sample to be tested, is sequentially incident on the first detector through the fourth objective lens and the first analyzer.

7. The film thickness measuring device according to claim 5, characterized in that The second optical component includes a second collimator, a second beam splitter, a second objective lens and a second detector. The first parallel light is sequentially irradiated onto the sample to be tested through the second collimator, the second beam splitter and the second objective lens, and after being reflected by the sample to be tested, is sequentially incident on the second detector through the second objective lens and the second beam splitter.

8. The film thickness measuring device according to claim 4, characterized in that The first light further includes a second parallel source light, and the parabolic mirror further includes a second parabolic mirror, and the second parabolic mirror is used to convert the received first source light into the second parallel source light.

9. The film thickness measuring device according to claim 8, characterized in that: The beam splitter also includes a third reflector, a first beam splitter, a first joint and a second joint. The second light also includes a second parallel light and a third parallel light. The second parallel source light is reflected by the first beam splitter to form the second parallel light and is incident on the first joint. The second parallel source light passes through the first beam splitter and is reflected by the third reflector to form the third parallel light. The third parallel light is incident on the second joint.

10. The film thickness measuring device according to claim 9, characterized in that: The optical-mechanical module further includes a third optical assembly, which includes a third light conductor, a fourth light conductor, a third collimator, a fourth collimator, a first light reflector, a third beam splitter, a fourth beam splitter, a fifth beam splitter, a third objective lens, a third tube lens, a third focusing lens, a third detector, and a fourth detector; The third light conductor, the third collimator, the first light reflector, the third beam splitter, the fourth beam splitter, the third objective lens, the fifth beam splitter, the third focusing lens, and the third detector constitute an automatic focusing system, so that the focus of the third objective lens coincides with the surface of the sample to be measured; The fourth light conductor, the fourth collimator, the third beam splitter, the fourth beam splitter, the third objective lens, the fourth beam splitter, the fifth beam splitter, the third tube lens and the fourth detector constitute an imaging system to acquire an image of the sample to be measured; The third light conductor is connected to the second connector, and the fourth light conductor is connected to the first connector.

11. The film thickness measuring device according to claim 1, wherein The host station further includes a second heat dissipation module, and the second heat dissipation module includes: a second air inlet duct, wherein an air inlet of the second air inlet duct is connected to the external space of the main unit, and an air outlet of the second air inlet duct is oriented toward the light source module, so that air outside the main unit is blown toward the light source module through the second air inlet duct; a second air outlet duct, wherein the air outlet of the second air outlet duct is in communication with the external space of the main unit, and the air inlet of the second air outlet duct is oriented toward the light source module, so that the air flowing through the light source module is transported to the outside of the main unit through the second air outlet duct; The second fan is arranged in the second air inlet duct and / or the second air outlet duct.

12. The film thickness measuring device according to claim 1, wherein The machine body has a machine chamber, which includes a first machine compartment, a second machine compartment, and a third machine compartment from the top to the bottom of the machine chamber. The main machine also includes a heating module and an air filtration module. The heating module is located in the first machine compartment. A first heating chamber opening is provided on a side wall of the first machine compartment to allow air from the external space of the main machine compartment to enter the first machine compartment. The heating module heats the air in the first machine compartment to generate heated gas, and transports the heated gas to the second machine compartment. The air filtration module is located in the second machine compartment and is spaced apart from the optical-mechanical module. The air filtration module is used to purify the air in the second machine compartment to generate purified gas, and blow the purified gas to the optical-mechanical module to provide a measurement microenvironment for the optical-mechanical module. The motion bearing module and the optomechanical module are both located in the third machine compartment. The optomechanical module is spaced apart from the top of the third machine compartment. The outer surface of the third machine compartment is covered with a third cavity skin. The third cavity skin includes a third inner skin and a third outer skin that are spaced apart.

13. A film thickness measurement method, comprising: measuring the film thickness of a sample using the film thickness measurement device according to any one of claims 1 to 12, wherein: The following steps are involved: Obtaining a predicted film thickness range of the sample to be tested; determining a measurement mode of the film thickness measuring device according to the predicted film thickness range; Activating the film thickness measuring device to provide a measurement microenvironment in the third machine compartment of the main machine; Placing the sample to be measured on the moving bearing module of the film thickness measuring device; According to the measurement mode, controlling the motion bearing module to move the sample to be measured to a target measurement position; Using the first moving part to move the second reflecting mirror, so that the film thickness measuring device operates in a determined measurement mode; The film thickness of the sample to be tested is measured.

Images