Display panel and manufacturing method thereof

Abstract

This application discloses a display panel and its fabrication method, relating to the field of display panel technology. The fabrication method includes: transferring and fixing multiple light-emitting elements on one side of an array substrate; preparing a patterned transfer film, with multiple grooves on one side surface of the transfer film corresponding one-to-one with the light-emitting elements; attaching and fixing a black adhesive film to the side surface of the transfer film with the grooves; pressing and fixing the black adhesive film onto the surface of the array substrate between the light-emitting elements using the transfer film; wherein, during the process of the light-emitting elements pressing the black adhesive film into the grooves, the black adhesive film ruptures, adheres and is fixed to the surface of the array substrate, and covers part of the sidewalls of the light-emitting elements; and removing the transfer film. This application not only achieves isolation between adjacent light-emitting elements but also avoids the black adhesive film covering the top of the light-emitting elements, thereby improving the image display quality of the display panel.

Description

Technical Field

[0001] This application relates to the field of display panel technology, and in particular to a display panel and a method for manufacturing the same. Background Technology

[0002] With the continuous development of science and technology, more and more electronic devices with display functions are being widely used in people's daily lives and work, bringing great convenience to people's daily lives and work, and becoming an indispensable tool for people today.

[0003] The main component of an electronic device that enables display functionality is the display panel. For display panels that use transferred light-emitting elements as pixels, after the light-emitting elements are transferred onto the array substrate, adjacent light-emitting elements need to be isolated with black adhesive to prevent display interference between different pixels.

[0004] In existing technologies, liquid black glue is generally used to fill the gaps between light-emitting elements. This can easily lead to uneven distribution of the black glue, and the black glue can cover the top light-emitting area of ​​the light-emitting elements, affecting the image display quality of the display panel. Summary of the Invention

[0005] In view of the above problems, this application provides a display panel and its manufacturing method, so as to achieve uniform distribution of black adhesive material between light-emitting elements and to avoid the black adhesive material covering the top light-emitting area of ​​the light-emitting elements. The specific solution is as follows:

[0006] The first aspect of this application provides a method for manufacturing a display panel, comprising:

[0007] Multiple light-emitting elements are transferred and fixed on one side of the array substrate;

[0008] A patterned transfer film is prepared, with multiple grooves on one side surface of the transfer film corresponding to the light-emitting elements.

[0009] A black adhesive film is attached and fixed to the surface of the transfer film on the side with the groove.

[0010] A black adhesive film is pressed and fixed onto the surface of the array substrate between the light-emitting elements using a transfer film. During the process of the light-emitting elements pressing the black adhesive film into the groove, the black adhesive film breaks and adheres to the surface of the array substrate, covering part of the sidewall of the light-emitting elements.

[0011] Remove the transfer membrane.

[0012] A second aspect of this application provides a display panel formed by the above-described preparation method, comprising:

[0013] Array substrate;

[0014] Multiple light-emitting elements disposed on the surface of the array substrate;

[0015] A black adhesive film is fixed on the surface of an array substrate between light-emitting elements and covers at least a portion of the sidewalls of the light-emitting elements.

[0016] By means of the above technical solution, in the display panel and its manufacturing method provided in this application, after the light-emitting element is transferred to the surface of the array substrate, a black adhesive film is pressed and fixed on the side surface of the array substrate on which the light-emitting element is disposed by a transfer film. The transfer film is provided with a plurality of grooves that correspond one-to-one with the light-emitting element. The black adhesive film covers the side surface of the transfer film on which the grooves are disposed. Therefore, during the process of pressing and fixing the black adhesive film on the surface of the array substrate by the transfer film, the light-emitting element will squeeze the black adhesive film into the groove above the light-emitting element, causing the black adhesive film to rupture. This not only allows the black adhesive film to adhere and fix on the surface of the array substrate between adjacent light-emitting elements, but also allows the black adhesive film above the light-emitting element to cover the side wall of the light-emitting element after rupture. This not only achieves isolation between adjacent light-emitting elements, but also prevents the black adhesive film from covering the top of the light-emitting element, thereby improving the image display quality of the display panel. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0018] The structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this application can produce, should still fall within the scope of the technical content disclosed in this application.

[0019] Figure 1 This is a cross-sectional view of a display panel;

[0020] Figures 2-11 A schematic diagram illustrating the process principle of a display panel fabrication method at different process stages, provided in an embodiment of this application.

[0021] Figure 12 A top view of a black adhesive film provided in an embodiment of this application;

[0022] Figure 13 A top view of another black adhesive film provided in an embodiment of this application;

[0023] Figure 14 A top view of yet another type of black adhesive film provided in an embodiment of this application;

[0024] Figure 15 A top view of yet another type of black adhesive film provided in an embodiment of this application;

[0025] Figure 16 A cross-sectional view of a black adhesive film provided in an embodiment of this application;

[0026] Figures 17-19 A schematic diagram illustrating the principle of a method for bonding and fixing a black adhesive film onto a transfer film, provided in an embodiment of this application;

[0027] Figure 20 A cross-sectional view of a transfer film with a black adhesive film fixed to its surface, provided in an embodiment of this application;

[0028] Figure 21 This is a schematic diagram illustrating the principle of repairing a faulty light-emitting element, as provided in an embodiment of this application.

[0029] Figure label:

[0030] 11-Array substrate; 12-Light-emitting element; 13-Black adhesive material; 14-Transfer film; 141-Groove; 15-Carrier plate; 16-Black adhesive film; 160-Slit; 161-First region; 162-Second region; 163-First light-shielding adhesive film; 164-Second light-shielding adhesive film; 17-Transparent adhesive film; 18-Repair position. Detailed Implementation

[0031] The embodiments of this application will now be clearly and completely described with reference to the accompanying drawings. Those skilled in the art will recognize that, with technological advancements and the emergence of new scenarios, the technical solutions provided in the embodiments of this application are equally applicable to similar technical problems.

[0032] Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. The terminology used in the embodiments of this application is only used to explain the specific embodiments of this application, and is not intended to limit this application.

[0033] refer to Figure 1 , Figure 1 A cross-sectional view of a display panel is shown, the display panel comprising:

[0034] Array substrate 11;

[0035] Multiple light-emitting elements 12 are disposed on the surface of the array substrate 11;

[0036] A black adhesive material 13 is provided between the light-emitting elements 12 to isolate the light-emitting elements 12 and prevent display crosstalk between different light-emitting elements 12.

[0037] The conventional method is to use liquid black glue material 13 to fill the gaps between the light-emitting elements 12. This method is prone to uneven distribution of the black glue material 13, and the black glue material 13 will cover the top light-emitting area of ​​the light-emitting elements 12, affecting the image display quality of the display panel.

[0038] The reason for the above problems is that during the flow of liquid black glue material 13, due to the influence of surface tension near the light-emitting element, the liquid black glue material 13 will gather around and above the light-emitting element 12. As a result, the thickness of the black glue material 13 is thinnest near the center of the gap between the light-emitting elements 12 and the thickness is greatest near the light-emitting element 12. Furthermore, the edge of the top light-emitting area of ​​the light-emitting element 12 will be covered by the black glue material 13, resulting in uneven distribution of the black glue material 13, which seriously affects the image display quality of the display panel.

[0039] In view of this, embodiments of this application provide a method for manufacturing a display panel, the method comprising:

[0040] Multiple light-emitting elements are transferred and fixed on one side of the array substrate;

[0041] A patterned transfer film is prepared, with multiple grooves on one side surface of the transfer film corresponding to the light-emitting elements.

[0042] A black adhesive film is attached and fixed to the surface of the transfer film on the side with the groove.

[0043] A black adhesive film is pressed and fixed onto the surface of the array substrate between the light-emitting elements using a transfer film. During the process of the light-emitting elements pressing the black adhesive film into the groove, the black adhesive film breaks and adheres to the surface of the array substrate, covering part of the sidewall of the light-emitting elements.

[0044] Remove the transfer membrane.

[0045] In the preparation method provided in this application embodiment, after the light-emitting element is transferred to the surface of the array substrate, a black adhesive film is pressed and fixed on the side surface of the array substrate on which the light-emitting element is disposed by a transfer film. The transfer film is provided with a plurality of grooves corresponding to the light-emitting elements. The black adhesive film covers the side surface of the transfer film on which the grooves are disposed. Therefore, during the process of pressing and fixing the black adhesive film on the surface of the array substrate by the transfer film, the light-emitting element above the light-emitting element will squeeze the black adhesive film into the groove and cause the black adhesive film to break. This not only allows the black adhesive film to adhere and fix on the surface of the array substrate between adjacent light-emitting elements, but also allows the black adhesive film above the light-emitting element to cover the side wall of the light-emitting element after breaking. This not only achieves isolation between adjacent light-emitting elements, but also prevents the black adhesive film from covering the top of the light-emitting element, thereby improving the image display quality of the display panel.

[0046] The above are the core inventive points of this application. In order to make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0047] refer to Figures 2-9 , Figures 2-9 This application provides a schematic diagram illustrating the process principle of a display panel fabrication method at different process stages. The fabrication method includes:

[0048] Step S11: As Figure 2 As shown, multiple light-emitting elements 12 are transferred and fixed on one side of the array substrate 11.

[0049] The light-emitting element 12 can be a micro LED, which can be a Mini-LED, Micro-LED, or Nano-LED. The implementation of the light-emitting element 12 is not limited in this application embodiment.

[0050] The light-emitting element 12 serves as a pixel in the display panel, converting electrical energy into light energy to display images. The array substrate 11 supports the light-emitting element 12 and supplies it with power.

[0051] Multiple light-emitting elements 12 are arranged in an array on the array substrate 11 to form a display array. The display array includes light-emitting elements 12 that emit red light, light-emitting elements 12 that emit green light, and light-emitting elements 12 that emit blue light.

[0052] Step S12: As Figure 3 and Figure 4 As shown, a patterned transfer film 14 is prepared, and one side surface of the transfer film 14 has a plurality of grooves 141 corresponding one-to-one with the light-emitting element 12.

[0053] Step S13: In such Figure 5As shown, a black adhesive film 16 is attached and fixed to one side surface of the transfer film 14 with a groove 141.

[0054] Step S14: By means of Figures 6-8 As shown, a transfer film is used to press and fix the black adhesive film 16 onto the surface of the array substrate 11 between the light-emitting elements 12; wherein, during the process of the light-emitting elements 12 pressing the black adhesive film 16 into the groove 141, the black adhesive film 16 breaks and adheres to the surface of the array substrate 11, covering part of the sidewall of the light-emitting elements 12.

[0055] like Figure 7 As shown, when the black film 16 is pressed down too heavily, the position where it contacts the corner of the light-emitting element 12 will break due to uneven force. After breaking, the black film 16 can retract to the side wall of the light-emitting element 12 based on its own elasticity.

[0056] The black adhesive film 16 can blacken the areas of the array substrate 11 that are not in contact with the light-emitting elements 12, thereby isolating different light-emitting elements 12 and improving display contrast. The black adhesive film 16 is an insulating material to prevent short circuits caused by contact with the pins of the light-emitting elements 12.

[0057] Step S15: As Figure 9 As shown, the transfer membrane 14 is removed.

[0058] Combination Figures 2-9 As shown, after the light-emitting element 12 is transferred to the surface of the array substrate 11, a black adhesive film 16 can be pressed and fixed on the side surface of the array substrate 11 where the light-emitting element 12 is disposed by the transfer film 14. The transfer film 14 is provided with a plurality of grooves 141 corresponding to the light-emitting elements 12. The black adhesive film 16 covers the side surface of the transfer film 14 where the grooves 141 are disposed. Therefore, during the process of pressing and fixing the black adhesive film 16 to the surface of the array substrate 11 by the transfer film 14, the light-emitting element 12 will squeeze the black adhesive film 16 into the grooves 141 above the light-emitting element 12, causing the black adhesive film 16 to break. This not only allows the black adhesive film 16 to adhere and fix to the surface of the array substrate 11 between adjacent light-emitting elements 12, but also allows the black adhesive film 16 above the light-emitting element 12 to cover the side wall of the light-emitting element 12 after breaking. This not only achieves isolation between adjacent light-emitting elements 12, but also prevents the black adhesive film 16 from covering the top of the light-emitting element 12, thereby improving the image display quality of the display panel.

[0059] In the preparation method provided in this application embodiment, a non-liquid black adhesive film 16 is used to achieve isolation between different light-emitting elements 12. During the downward pressing process, after the black adhesive film 16 is punctured by the light-emitting elements 12 and adhered to the surface of the array substrate 11, there is no problem of blocking the top light-emitting area of ​​the light-emitting elements 12 as in conventional liquid black adhesive material isolation solutions, which can significantly improve the image display quality of the display panel.

[0060] Optionally, the array substrate 11 includes a substrate and a display driving circuit located on the surface of the substrate. The light-emitting elements 12 are connected to the pixel driving circuit, and the light-emitting state of each light-emitting element 12 is controlled by the display driving circuit to achieve image display. Wherein, if used to fabricate a rigid display panel, the substrate can be a rigid substrate, such as a glass substrate; if used to fabricate a flexible display panel, the substrate can also be a flexible substrate, such as a PI (polyimide) substrate. The embodiments of this application do not limit the material of the substrate.

[0061] Based on any of the above embodiments, in another embodiment of this application, after removing the transfer membrane 14, the preparation method may further include:

[0062] Step S16: As Figure 10 As shown, a transparent film 17 is provided on the side of the light-emitting element 12 that is away from the array substrate 11.

[0063] Optionally, the transparent film 17 can be an epoxy resin film layer, a transparent silicone film layer, or a film made of other transparent materials. This application embodiment does not specify the material of the transparent film 17.

[0064] The transparent film 17 can serve as an encapsulation layer for the display panel, protecting the light-emitting element 12 and the array substrate 11 to prevent water and oxygen from corroding the light-emitting element 12 and thus improve its service life.

[0065] Step S17: As Figure 11 As shown, the transparent adhesive film 17 and the black adhesive film 16 are bonded and fixed together through a vacuum hot pressing process. After the black adhesive film 16 melts and solidifies, it fills the gap between the light-emitting element 12 and the array substrate 11. The melted and solidified black adhesive material can completely cover the surface of the array substrate 11 that is not in contact with the light-emitting element 12.

[0066] The upper surface of the black adhesive material located between the light-emitting elements 12 is either flat or has a slightly concave curved surface due to surface tension.

[0067] As described above, the light-emitting element 12 can be a miniature LED. The miniature LED is fixed to the surface of the array substrate 11 by soldering pins to be electrically connected to the display driving circuit in the array substrate 11. The pins have a certain height, so after soldering, there is a gap between the back of the light-emitting element 12 and the array substrate 11.

[0068] In this embodiment, a vacuum hot-pressing process can be used to melt and re-solidify the black adhesive film 16 bonded and fixed to the array substrate 11. This not only allows the molten black adhesive material to fill the gap between the light-emitting element 12 and the array substrate 11, but also enables the molten black adhesive material to undergo a uniform thickness redistribution under the constraint of the transparent adhesive film 17, resulting in a more uniform thickness distribution after melting and re-solidification. Furthermore, the melted and re-fixed black adhesive material can seal and protect the pin welding fixing positions, preventing water and oxygen from corroding the pin welding fixing positions, thereby improving the electrical connection reliability of the welding positions between the light-emitting element 12 and the array substrate 11.

[0069] As described above, since the molten black adhesive material fills the gap between the light-emitting element 12 and the array substrate 11, the light-emitting element 12 and the array substrate 11 can be bonded and fixed by the black adhesive material, ensuring the reliability of the light-emitting element 12's fixation on the array substrate 11. Furthermore, the vacuum hot-pressing process based on the transparent adhesive film 17 can perform surface planarization and positioning of the molten black adhesive material, thereby ensuring a relatively uniform thickness distribution of the black adhesive material.

[0070] The thickness of the black adhesive film 16 and the height of the light-emitting element 12 can be adjusted so that the thickness of the molten and re-cured black adhesive material in the gap region between the light-emitting elements 12 is not less than half the height of the light-emitting element 12, thereby facilitating better isolation between the light-emitting elements 12 through the black adhesive material. Optionally, this thickness can be set to be not less than two-thirds of the height of the light-emitting element 12. To achieve better isolation between the light-emitting elements 12, this thickness can be equal to or slightly less than the height of the light-emitting element 12.

[0071] In the preparation method provided in this application embodiment, the black adhesive film 16 can be melted and then fixed by vacuum hot pressing process, so that all areas on the surface of the array substrate 11 that are not in contact with the light-emitting element 12 are covered with black adhesive material, and the black adhesive material can be redistributed in a uniform thickness, which can better achieve isolation between the light-emitting elements 12.

[0072] Therefore, compared with the solution of forming black adhesive material on the surface of array substrate 11 by printing, the technical solution of this application can prevent the black adhesive material from blocking the top area of ​​the light-emitting element 12, and can also achieve full coverage of the black adhesive material on all areas of the surface of array substrate 11 that are not in contact with the light-emitting element 12; compared with the solution of thick film filling black adhesive material, the technical solution of this application does not need to remove the black adhesive material above the light-emitting element 12, and the manufacturing cost is lower; compared with the solution of forming black adhesive material on the surface of array substrate 11 by photolithography, it can achieve full coverage of the black adhesive material on all areas of the surface of array substrate 11 that are not in contact with the light-emitting element 12.

[0073] Based on the description of any of the above embodiments, the method for preparing the patterned transfer film 14 in step S12 includes:

[0074] First, such as Figure 3 As shown, the transfer film 14 is attached and fixed on the surface of the carrier plate 15.

[0075] Then, a groove 141 is formed on the side surface of the transfer film 14 facing away from the carrier plate 15.

[0076] The transfer film 14 can be patterned by etching or imprinting to form a plurality of grooves 141 corresponding to the light-emitting elements 12 on the side of the transfer film 14 facing away from the carrier plate 15.

[0077] The carrier plate 15 has greater mechanical strength than the transfer film 14. During the patterning process of the transfer film 14, the carrier plate 15 can serve as a support platform for the transfer film 14, facilitating the patterning process. In the subsequent lamination process, it can also serve as a lamination tool to provide sufficient downward pressure to the transfer film 14, facilitating the bonding and fixation of the black adhesive film 16 to the array substrate 11.

[0078] In this process, after the transfer film 14, whose surface is covered with black adhesive film 16, is pressed and fixed to the array substrate 11 with light-emitting element 12 through the carrier plate 15, the carrier plate 15 and the transfer film 14 are removed simultaneously.

[0079] In other embodiments, a patterned transfer film 14 can be prepared using a material with high mechanical hardness. In this case, the black adhesive film 16 can be directly bonded and fixed to the surface of the array substrate 11 through the transfer film 14, without the need for a carrier plate 15.

[0080] refer to Figure 12 , Figure 12 This is a top view of a black adhesive film provided in an embodiment of the present application. Based on any of the above embodiments, before pressing and fixing the black adhesive film 16 onto the surface of the array substrate 11, the method further includes: forming a slit 160 in the area of ​​the black adhesive film 16 corresponding to the groove 141. Figure 16 To make the correspondence between the slit 160 and the groove 141 in the black film 16 clearer in the illustration, the black film 16 has been made transparent.

[0081] The desired pattern structure slits 160 can be formed by scribing the areas corresponding to the grooves 141 in the black adhesive film 16 with a blade, or by embossing. This application embodiment does not limit the method of forming the slits 160 in the black adhesive film 16.

[0082] exist Figure 12In the illustrated method, before the black adhesive film is bonded and fixed to the transfer film 14, a plurality of slits 160 corresponding to the grooves 141 can be formed on the black adhesive film 16. Alternatively, after the black adhesive film 16 is bonded and fixed to the surface of the transfer film 14, a plurality of slits 160 corresponding to the grooves 141 can be formed on the black adhesive film 16.

[0083] In this embodiment, multiple slits 160 corresponding to the grooves 141 can be pre-formed on the black adhesive film 16. During the process of the light-emitting element 12 pressing the black adhesive film 16 into the grooves 141, it is convenient for the light-emitting element 12 to quickly break through the part of the black adhesive film 16 covering the grooves 141, so that the broken black adhesive film can adhere to the surface of the array substrate 11 and the sidewall of the light-emitting element 12.

[0084] The slit 160 may be located within the area of ​​the corresponding groove 141 or may extend beyond that area; this embodiment does not limit this.

[0085] In one embodiment of this application, after the black adhesive film 16 is bonded and fixed onto the surface of the array substrate 11, the black adhesive film 16 can be melted and then solidified through a vacuum hot pressing process to achieve a uniform thickness distribution of the black adhesive material. Therefore, the slit 160 can be located within the area of ​​the corresponding groove 141 or extend beyond that area. Whether the slit 160 extends beyond the corresponding area of ​​the groove 141 has little impact on the final distribution of the black adhesive material. In order to facilitate the rapid breaking of the black adhesive film 16 by the light-emitting element 12 during the bonding process, it is preferable to set the slit to extend beyond the area of ​​the corresponding groove 141.

[0086] In one implementation, it can be as follows Figure 12 As shown, each slit 160 can be a straight slit 160, and the extension direction of the slit 160 corresponding to different grooves 141 can be the same.

[0087] refer to Figure 13 , Figure 13 This is a top view of another black adhesive film provided in an embodiment of this application. In this method, each slit 160 can be a straight slit, and... Figure 12 The difference is that, Figure 13 In the manner shown, the extension directions of the slits 160 corresponding to any two adjacent grooves 141 in the same row intersect, and the extension directions of the slits 160 corresponding to any two adjacent grooves 141 in the same row are the same; the extension directions of the slits 160 corresponding to any two adjacent grooves 141 in the same column intersect, and the extension directions of the slits 160 corresponding to any two adjacent grooves 141 in the same column are the same.

[0088] For a straight slit of 160mm Figure 13The method shown can balance the surface tension of the film layer in the black adhesive film 16, and can make the black adhesive film 16 with the slit 160 be attached and fixed to the surface of the transfer film 14 more smoothly.

[0089] Furthermore, this method allows the extruded black adhesive film 16 to be alternately distributed on the left and right sides and top and bottom sides of the light-emitting element. This ensures that in any two adjacent light-emitting elements 12 in the same row, one's left and right sidewalls are covered by the black adhesive film 16, while the other's front and back sidewalls are covered by the black adhesive film 16; similarly, in any two adjacent light-emitting elements 12 in the same column, one's left and right sidewalls are covered by the black adhesive film 16, while the other's front and back sidewalls are covered by the black adhesive film 16. This facilitates the rapid and uniform distribution of the molten black adhesive material on the surface of the array substrate 11 during the subsequent vacuum hot pressing process, reducing processing time.

[0090] refer to Figure 14 , Figure 14 This is a top view of another type of black adhesive film provided in this application embodiment. Based on any of the above embodiments, the method of forming a slit 160 in the black adhesive film 16 may include: forming an intersecting first slit and a second slit in the region of the black adhesive film 16 corresponding to the groove 141, wherein the first slit and the second slit can be as follows: Figure 14 The shown method may be perpendicular or non-perpendicular; this application does not limit this in its embodiments.

[0091] Optionally, the intersection of the first slit and the second slit is located at the center of the area of ​​the groove 141 corresponding to the black adhesive film 16.

[0092] exist Figure 14 In the illustrated configuration, the black adhesive film 16 forms a cross-shaped slit 160 in the area corresponding to the groove 141. This allows the light-emitting element 12 to more quickly break through the portion of the black adhesive film 16 covering the groove 141, facilitating the adhesion of the broken black adhesive film to the surface of the array substrate 11 and the sidewalls of the light-emitting element 12. Furthermore, it ensures that all four sidewalls of each light-emitting element 12 are covered by the black adhesive film 16. In the subsequent vacuum hot pressing process, a shorter process time can achieve a uniform redistribution of the complete thickness of the molten black adhesive material on the surface of the array substrate 11.

[0093] Optionally, the vertical projection of the light-emitting element 12 onto the plane of the array substrate 11 is rectangular, and correspondingly, the vertical projection of the groove 141 onto the plane of the array substrate 11 is rectangular, with the size of the rectangular vertical projection of the groove being larger than that of the rectangular vertical projection of the light-emitting element 12. If the slit 160 is a cross-shaped slit 160 formed by the intersection of the first slit and the second slit, one embodiment can be as follows: Figure 14As shown, one of the first slit and the second slit is parallel to one side of the vertical projection rectangle corresponding to the groove 141, and the other is parallel to the other side of the vertical projection rectangle corresponding to the groove 141. The sides corresponding to the first slit and the second slit are perpendicular.

[0094] refer to Figure 15 , Figure 15 A top view of yet another type of black adhesive film provided in the embodiments of this application, and... Figure 14 The difference is that, Figure 15 In the illustrated configuration, the first and second slits are parallel to one diagonal of the vertical projection rectangle corresponding to the groove 141. This configuration allows the black adhesive film 16 to be broken along the two diagonals of the vertical projection rectangle corresponding to the groove 141 in the area corresponding to the groove 141, making it easier for the broken black adhesive film 16 to adhere and fix to the four side walls of the light-emitting element 12.

[0095] refer to Figure 16 , Figure 16 This is a cross-sectional view of a black adhesive film provided in an embodiment of this application. Based on any of the above embodiments, the black adhesive film 16 includes a first region 161 and a second region 162 surrounding the first region 161, with the first region 161 covering a groove 141; wherein the thickness of the first region 161 is less than the thickness of the second region 162. In this configuration, the first region 161 covering the groove 141 of the black adhesive film 16 has a thinner thickness, which facilitates the black adhesive film 16 covering the groove 141 being squeezed by the light-emitting element 12.

[0096] In this embodiment of the application, it is possible to choose to set the thickness of the first region 161 to be less than the thickness of the second region 162 and not set the slit 160, or to set the slit 160 separately and use a black adhesive film 16 with uniform thickness, or to set the thickness of the first region 161 to be less than the thickness of the second region 162 and set the slit 160.

[0097] If the thickness of the first region 161 is less than the thickness of the second region 162, in one embodiment, the method of attaching and fixing the black adhesive film 16 to the surface of the transfer film 14 with the groove 141 can be as follows: Figures 17-19 As shown.

[0098] refer to Figures 17-19 , Figures 17-19 This application provides a schematic diagram of a method for bonding and fixing a black adhesive film onto a transfer film, which includes:

[0099] Step S21: As Figure 17 As shown, a black adhesive film 16 of uniform thickness is provided.

[0100] Step S22: As Figure 18As shown, the thickness of the black adhesive film 16 in the first region 161 is reduced.

[0101] Step S23: As Figure 19 As shown, after the first region 161 is thinned, the black adhesive film 16 is adhered and fixed to the side surface of the transfer film 14 with the groove 141, forming a shape as shown. Figure 16 The structure shown.

[0102] exist Figures 17-19 In the method shown, only one layer of black adhesive film 16 is needed. By successively thinning the film, a thinner black adhesive film 16 can be formed in the first region 161.

[0103] refer to Figure 20 , Figure 20 This is a cross-sectional view of a transfer film with a black adhesive film fixed to its surface, provided in an embodiment of this application. If the thickness of the first region 161 is less than the thickness of the second region 162, the method of fixing the black adhesive film 16 to the surface of the transfer film 14 with the groove 141 can also be as follows: Figure 20 As shown, the method includes: attaching and fixing a first light-shielding adhesive film 163 and a second light-shielding adhesive film 164 to one side surface of the transfer film 14 having a groove 141; wherein, the first light-shielding adhesive film 163 covers the groove 141 and the transfer film 14 outside the groove 141; the second light-shielding adhesive film 164 has a through hole in the area corresponding to the groove 141; the black adhesive film 16 includes the stacked first light-shielding adhesive film 163 and the second light-shielding adhesive film 164.

[0104] exist Figure 20 In the manner shown, a black adhesive film 16 with a thickness difference is formed on the side surface of the transfer film 14 with the groove 141 by layering a first light-shielding adhesive film 163 and a second light-shielding adhesive film 164, without the need for a thinning process.

[0105] exist Figure 20 In the illustrated method, the method of bonding and fixing the first light-blocking adhesive film 163 and the second light-blocking adhesive film 164 onto the side surface of the transfer film 14 with the groove 141 may include: firstly, bonding and fixing the first light-blocking adhesive film 163 onto the side surface of the transfer film 14 with the groove; then, bonding and fixing the second light-blocking adhesive film 164 onto the surface of the first light-blocking adhesive film 163, as described above, wherein the second light-blocking adhesive film 164 is pre-formed with through holes corresponding one-to-one with the groove 141. In other methods, the first light-blocking adhesive film 163 and the second light-blocking adhesive film 164 may be bonded and fixed first, and then the first light-blocking adhesive film 163 may be bonded and fixed onto the side surface of the transfer film 14 with the groove 141.

[0106] A first light-shielding adhesive film 163 and a second light-shielding adhesive film 164 of uniform thickness are prepared in advance. Through holes corresponding one-to-one with the grooves 141 are pre-formed in the second light-shielding adhesive film 164. The two light-shielding adhesive films are first stacked and fixed, and then the first light-shielding adhesive film 163 is attached and fixed to the side surface of the transfer film 14 with the grooves 141. Alternatively, the first light-shielding adhesive film 163 can be attached and fixed to the side surface of the transfer film 14 with the grooves 141 first, and then the second light-shielding adhesive film 164 with through holes is attached and fixed to the surface of the first light-shielding adhesive film 163.

[0107] Based on any of the above embodiments, the preparation method provided in this application further includes, before attaching and fixing the black adhesive film 16 on the surface of the array substrate 11, performing a light emission test on the light-emitting element 12 on the array substrate 11; if the light emission test results show that there is a faulty light-emitting element 12 that cannot emit light, repairing the faulty light-emitting element 12.

[0108] Performing a light emission test before attaching and fixing the black adhesive film 16 to the surface of the array substrate 11 can help identify faulty light-emitting elements 12 in advance, making it easier to repair faulty light-emitting elements 12.

[0109] Optionally, the above method for repairing the faulty light-emitting element 12 may include:

[0110] After removing the faulty light-emitting element 12, a new light-emitting element 12 is fixedly connected at the removal location. This method allows the faulty light-emitting element to be removed directly at the original location, and then the new light-emitting element 12 can be fixedly connected directly at the original location without the need for additional repairs, which can reduce the size of the display panel.

[0111] Alternatively, a new light-emitting element 12 can be fixedly connected to the repair position adjacent to the faulty light-emitting element 12. This method does not require removing the faulty light-emitting element 12; a new light-emitting element 12 can be bound based on a preset repair position to compensate for the display effect of the faulty light-emitting element 12. The principle of repairing the faulty light-emitting element 12 in this case is as follows: Figure 21 As shown.

[0112] refer to Figure 21 , Figure 21 This is a schematic diagram illustrating the principle of repairing a faulty light-emitting element according to an embodiment of this application. Figure 21 A top view of one side surface of the array substrate 11 on which the light-emitting element 12 is provided. The array substrate 11 has at least three types of light-emitting elements 12: a first type of light-emitting element 12 that emits red light and is used as a red pixel R; a second type of light-emitting element 12 that emits green light and is used as a green pixel G; and a third type of light-emitting element 12 that emits blue light and is used as a blue pixel B.

[0113] like Figure 21As shown, a red pixel R in the upper left corner is added as a faulty light-emitting element 12. At this time, a light-emitting element 12 that can emit red light can be bound to a repair position 18 below it as the repaired red pixel R.

[0114] If there is a faulty light-emitting element 12, repair the faulty light-emitting element 12, and after confirming that all light-emitting elements 12 can emit light normally, then attach and fix the black adhesive film 16 to avoid the situation where there is a faulty light-emitting element 12 after attaching and fixing the black adhesive film 16, and avoid damage to the black adhesive film 16 caused by repairing the faulty light-emitting element 12 in this case.

[0115] In this embodiment, the depth of the groove 141 is greater than the height of the light-emitting element 12; the dimension of the groove 141 in the first direction is greater than the dimension of the light-emitting element 12 in the first direction, and the first direction is parallel to the plane of the array substrate 11.

[0116] In a direction perpendicular to the plane of the array substrate 11, the depth of the groove 141 is greater than the height of the light-emitting element 12. During the pressing process, the groove 141 has sufficient height to accommodate the entire light-emitting element 12 within the groove 141, so that the light-emitting element 12 can pierce the black adhesive film 16 above.

[0117] Optionally, in a direction perpendicular to the plane of the array substrate 11, the depth of the groove 141 is not less than the sum of the height of the light-emitting element 12 and the thickness of the portion of the black adhesive film 16 covering the groove 141, so as to ensure that during the pressing process, the groove 141 has sufficient height to accommodate the entire light-emitting element 12 and the black adhesive film 16 on its surface within the groove 141, so that the light-emitting element 12 can pierce the upper black adhesive film 16.

[0118] In this embodiment, the transfer film 14 can be prepared using non-elastic materials, such as glass plates, plastic plates, or metal plates.

[0119] To prevent the transfer film 14 from damaging the light-emitting element 12 during the pressing process, the transfer film 14 can also be made of elastic materials, such as epoxy resin board, acrylic board, or PI board.

[0120] In the first direction, the size of the groove 141 is larger than the size of the light-emitting element 12, so that the length and width of the groove 141 are sufficient to accommodate the light-emitting element 12, so that the light-emitting element 12 can enter the groove 141 as it is pressed, so that the light-emitting element 12 can pierce the black adhesive film 16 above.

[0121] Optionally, the dimensions of the groove 141 in the first direction and the dimensions of the light-emitting element 12 in the first direction have a preset difference, which is not less than the thickness of the black adhesive film. In this way, the length and width of the groove 141 are sufficient to accommodate the light-emitting element 12, so that the light-emitting element 12 can be pressed into the groove 141.

[0122] In this embodiment of the application, in order to avoid the thickness of the black adhesive material formed by the black adhesive film 16 exceeding the top of the light-emitting element 12, and to avoid the black adhesive material blocking the top light-emitting area of ​​the light-emitting element 12, the thickness of the black adhesive film 16 is set not to be greater than the height of the light-emitting element 12.

[0123] Generally, in order for the black adhesive material formed by the transfer film 14 to cover part of the sidewall of the light-emitting element 12, and for its thickness to not exceed the height of the light-emitting element 12, the thickness of the black adhesive film 16 is generally in the range of 2μm to 10μm. Furthermore, the transfer accuracy of the light-emitting element 12 on the array substrate 11 is 4μm to 8μm. Considering the thickness of the black adhesive film 16 and the transfer accuracy of the light-emitting element 12, the aforementioned preset difference is not less than 6μm.

[0124] Based on any of the preparation methods provided in the above embodiments, another embodiment of this application provides a display panel formed based on the preparation method provided in any of the above embodiments. This display panel can be as follows: Figure 9 Shown, including:

[0125] Array substrate 11;

[0126] Multiple light-emitting elements 12 are disposed on the surface of the array substrate 11;

[0127] Black adhesive film 16 is fixed on the surface of the array substrate 11 between the light-emitting elements 12 and covers at least part of the sidewalls of the light-emitting elements 12.

[0128] In this embodiment, a black adhesive film 16 is used to isolate the light-emitting element 12. Compared with the solution of directly using liquid black adhesive material to isolate the light-emitting element 12, the black adhesive material can avoid blocking the top light-emitting area of ​​the light-emitting element 12.

[0129] Optionally, the display panel further includes a transparent adhesive film 17 covering the black adhesive film 16 and the light-emitting element 12. The transparent adhesive film 17 can encapsulate and protect the light-emitting element 12 and the array substrate 11.

[0130] Among them, the black adhesive film 16 is subjected to vacuum hot pressing so that the black adhesive material fills the gap between the light-emitting element 12 and the array substrate 11.

[0131] The black adhesive film 16 and transparent adhesive film 17, which are bonded and fixed to the surface of the array substrate 11, undergo vacuum hot pressing, which allows the black adhesive material to melt and then solidify. This vacuum hot pressing process allows the black adhesive film 16 to melt and then solidify, resulting in a uniform redistribution of the black adhesive material's thickness. This not only improves the adhesion of the black adhesive material to the surface of the array substrate 11 but also allows the black adhesive material to fill the gap between the light-emitting element 12 and the array substrate 11. Furthermore, it enhances the adhesion between the transparent adhesive film 17 and the black adhesive material.

[0132] The various embodiments in this application are described in a progressive, parallel, or combined manner. Each embodiment focuses on its differences from other embodiments, and similar or identical parts between embodiments can be referred to interchangeably. The embodiments provided in this application can be combined with each other without contradiction.

[0133] It should be noted that, in the description of this application, the accompanying drawings and embodiments are illustrative rather than restrictive. The same reference numerals throughout the embodiments identify the same structures. Additionally, for ease of understanding and description, the thicknesses of some layers, films, panels, regions, etc., may be exaggerated in the drawings. It is also understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on the other element or there may be intermediate elements. Furthermore, "on" means positioning an element on or below another element, but does not inherently mean positioning it above another element according to the direction of gravity.

[0134] The terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the middle.

[0135] It should also be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or apparatus that includes the aforementioned element.

[0136] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for manufacturing a display panel, characterized in that, include: Multiple light-emitting elements are transferred and fixed on one side of the array substrate; A patterned transfer film is prepared, wherein one side surface of the transfer film has a plurality of grooves corresponding one-to-one with the light-emitting element; A black adhesive film is attached and fixed to the surface of the transfer film on the side with the groove. The black adhesive film is pressed and fixed onto the surface of the array substrate between the light-emitting elements through the transfer film; wherein, during the process of the light-emitting elements pressing the black adhesive film into the groove, the black adhesive film breaks and adheres to the surface of the array substrate, covering part of the sidewall of the light-emitting elements; Remove the transfer membrane.

2. The preparation method according to claim 1, characterized in that, Also includes: A transparent adhesive film is disposed on the side of the light-emitting element that is away from the array substrate; The transparent adhesive film and the black adhesive film are bonded and fixed together by a vacuum hot pressing process, and the black adhesive film is melted and then solidified to fill the gap between the light-emitting element and the array substrate.

3. The preparation method according to claim 1, characterized in that, The preparation of patterned transfer films includes: The transfer film is attached and fixed to the surface of the carrier plate; The groove is formed on the side surface of the transfer film facing away from the carrier plate; In this process, after the transfer film, whose surface is covered with the black adhesive film, is pressed and fixed to the array substrate having the light-emitting element through the carrier plate, the carrier plate and the transfer film are removed simultaneously.

4. The preparation method according to claim 3, characterized in that, Before pressing and fixing the black adhesive film onto the surface of the array substrate, the process further includes: A slit is formed in the area of ​​the black adhesive film corresponding to the groove.

5. The preparation method according to claim 4, characterized in that, The method of forming the slit includes: An intersecting first and second slits are formed in the area of ​​the black adhesive film corresponding to the groove.

6. The preparation method according to claim 1, characterized in that, The black adhesive film includes a first region and a second region surrounding the first region, the first region covering the groove; The thickness of the first region is less than the thickness of the second region.

7. The preparation method according to claim 6, characterized in that, A black adhesive film is attached and fixed to the surface of the transfer film on the side with the groove, including: Provide a black adhesive film of uniform thickness; Reduce the thickness of the black adhesive film in the first region; After thinning is completed in the first region, the black adhesive film is adhered and fixed to the side surface of the transfer film with the groove.

8. The preparation method according to claim 6, characterized in that, A black adhesive film is attached and fixed to the surface of the transfer film on the side with the groove, including: A first light-shielding adhesive film and a second light-shielding adhesive film are attached and fixedly layered on one side surface of the transfer film having the groove. The first light-shielding film covers the groove and the transfer film outside the groove; the second light-shielding film has through holes in the area corresponding to the groove; the black film includes the first light-shielding film and the second light-shielding film stacked together.

9. The preparation method according to claim 8, characterized in that, A first and a second light-shielding adhesive film are adhered and fixedly layered on one side surface of the transfer film having the groove, including: The first light-shielding adhesive film is attached and fixed to the side surface of the transfer film having the groove; The second light-shielding film is attached and fixed to the surface of the first light-shielding film; or, After the first light-blocking adhesive film and the second light-blocking adhesive film are bonded and fixed together, the first light-blocking adhesive film is bonded and fixed to the side of the transfer film with the groove.

10. The preparation method according to claim 1, characterized in that, Before attaching and fixing the black adhesive film to the surface of the array substrate, the process further includes: The light-emitting elements on the array substrate are subjected to light-emitting tests; If the light emission test results indicate the presence of a faulty light-emitting element that cannot emit light, repair the faulty light-emitting element.

11. The preparation method according to claim 10, characterized in that, Repairing the faulty light-emitting element includes: After removing the faulty light-emitting element, a new light-emitting element is fixedly connected at the removal location, or a new light-emitting element is fixedly connected at the repair location adjacent to the faulty light-emitting element. After each light-emitting element can emit light normally, the black adhesive film is then attached and fixed.

12. The preparation method according to claim 1, characterized in that, The depth of the groove is greater than the height of the light-emitting element; The size of the groove in the first direction is larger than the size of the light-emitting element in the first direction, and the first direction is parallel to the plane of the array substrate.

13. The preparation method according to claim 12, characterized in that, The dimension of the groove in the first direction has a preset difference from the dimension of the light-emitting element in the first direction, and the preset difference is not less than the thickness of the black adhesive film.

14. The preparation method according to claim 1, characterized in that, The thickness of the black adhesive film is no greater than the height of the light-emitting element.

15. A display panel formed by the preparation method according to any one of claims 1-14, characterized in that, include: Array substrate; Multiple light-emitting elements are disposed on the surface of the array substrate; A black adhesive film is fixed to the surface of an array substrate between the light-emitting elements and covers at least a portion of the sidewalls of the light-emitting elements.

16. The display panel according to claim 15, characterized in that, Also includes: A transparent adhesive film covering the black adhesive film and the light-emitting element.

17. The display panel according to claim 15, characterized in that, The black adhesive film undergoes vacuum hot pressing to fill the gap between the light-emitting element and the array substrate.

Images