A substrate and its preparation method, a display panel, and a display device.
By setting a photosensitive adhesive layer on the substrate and creating grooves on the surface of the insulating layer, the traces are separated from the substrate by light, which solves the problem of high repair difficulty caused by traces sticking to the substrate, and achieves efficient trace repair and reduces the risk of damage.
Patent Information
- Application Number
- CN202410840235.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2044-06-26
AI Technical Summary
When traces are fabricated directly on the substrate, the traces adhere to and are fixed to the substrate, making repair difficult and easily damaging the substrate.
A first photosensitive adhesive layer is disposed on the substrate. The adhesiveness of the photosensitive adhesive layer decreases after receiving preset light, and it is used to bond the traces and the insulating layer. By opening grooves on the surface of the insulating layer and disposing of the photosensitive adhesive layer in the grooves, the bonding area between the traces and the substrate is reduced, and the traces and the substrate are separated by light.
It reduces the difficulty of separating the traces from the substrate, improves repair efficiency, reduces the risk of substrate damage, and improves the stability of the repaired circuit.
Smart Images
Figure CN118785776B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, specifically to a substrate and its preparation method, a display panel, and a display device. Background Technology
[0002] Display panels and printed circuit boards both include substrates, on which traces and components can be fabricated. When fabricating traces on one side of the substrate, metal material is typically deposited directly on the substrate at the corresponding location using methods such as deposition or laser engraving, and then cured to form the trace. However, this method of directly fabricating traces on the substrate causes the traces to adhere and be fixed directly to the substrate. When it is necessary to repair or replace the traces, it is not easy to separate the traces from the substrate, making repair difficult and easily damaging the substrate. Summary of the Invention
[0003] In view of this, this application provides a substrate and a method for preparing the same, a display panel, and a display device to help solve the above problems.
[0004] In a first aspect, embodiments of this application provide a substrate, including a wiring region, the wiring region comprising:
[0005] First insulating layer;
[0006] The first trace is located on the first insulating layer;
[0007] A first photosensitive adhesive layer is included between the first insulating layer and the first trace, and the first photosensitive adhesive layer bonds the first trace and the first insulating layer; wherein, the adhesion of the first photosensitive adhesive layer decreases after receiving a first preset light.
[0008] In one implementation of the first aspect, the surface of the first insulating layer facing the first trace includes a plurality of spaced first grooves;
[0009] The first photosensitive adhesive layer and the first trace are located in the first groove.
[0010] In one implementation of the first aspect, the first groove includes a first bottom surface; within the first groove, a first photosensitive adhesive layer is included between the first trace and the first bottom surface.
[0011] In one implementation of the first aspect, the first groove includes at least two first sidewalls disposed opposite to each other; within the first groove, a first photosensitive adhesive layer is included between the first trace and the first sidewalls.
[0012] In one implementation of the first aspect, the first trace is a light-transmitting and conductive structure.
[0013] In one implementation of the first aspect, the first trace includes a first sub-trace and a second sub-trace that are electrically connected, the first trace and the second sub-trace being located on opposite sides of the first insulating layer; the first photosensitive adhesive layer includes a first part and a second part, the first part being bonded to the first sub-trace and the first insulating layer, and the second part being bonded to the second sub-trace and the second insulating layer.
[0014] Along a direction perpendicular to the plane of the substrate, the first sub-trace and the second sub-trace at least partially overlap.
[0015] In one implementation of the first aspect, the first trace includes a first sub-trace and a second sub-trace that are electrically connected, the first sub-trace and the second sub-trace being located on opposite sides of the first insulating layer; the first photosensitive adhesive layer includes a first part and a second part, the first part being bonded to the first sub-trace and the first insulating layer, and the second part being bonded to the second sub-trace and the second insulating layer.
[0016] Along a direction perpendicular to the plane of the substrate, the first sub-trace and the second sub-trace do not overlap at least partially.
[0017] In one implementation of the first aspect, the substrate further includes a display area, and a wiring area is located on at least one side of the display area; the display area includes a plurality of transistors and light-emitting devices.
[0018] Secondly, embodiments of this application provide a display panel, including the substrate provided in the first aspect.
[0019] Thirdly, embodiments of this application provide a display device, including a display panel as provided in the second aspect.
[0020] Fourthly, embodiments of this application provide a method for fabricating a substrate, used to fabricate the substrate as provided in the first aspect; the substrate includes a wiring region; the fabrication method includes:
[0021] A first photosensitive adhesive layer is prepared on at least one side of the first insulating layer included in the wiring area;
[0022] A first trace is prepared on the side of the first photosensitive adhesive layer away from the first insulating layer.
[0023] In one implementation of the fourth aspect, the preparation method further includes:
[0024] A plurality of first grooves are formed at intervals on the surface of the first insulating layer facing the first trace; a protrusion is included between two adjacent first grooves.
[0025] In one implementation of the fourth aspect, the first groove includes a first bottom surface and at least two opposing first sidewalls; a first photosensitive adhesive layer is prepared on at least one side of the first insulating layer included in the wiring area, comprising:
[0026] A first photosensitive adhesive layer is prepared on the first bottom surface and the first sidewall.
[0027] In one implementation of the fourth aspect, a first trace is prepared on the side of the first photosensitive adhesive layer away from the first insulating layer, including:
[0028] A first conductive structure is prepared on a first photosensitive adhesive layer. The first conductive structure includes a portion located in a first groove and a portion located on a protrusion.
[0029] After irradiating the first photosensitive adhesive layer on the protrusion with the first preset light, the first conductive structure and the first photosensitive adhesive layer on the protrusion are bonded and removed with an adhesive film to prepare the first trace.
[0030] In one implementation of the fourth aspect, a first trace is prepared on the side of the first photosensitive adhesive layer away from the first insulating layer, including:
[0031] The second trace on the trace mold is aligned and bonded to the first photosensitive adhesive layer in the trace area of the substrate to obtain the first trace; the trace mold includes a substrate, a second photosensitive adhesive layer and a second trace, the second photosensitive adhesive layer is located between the substrate and the second trace and bonds the substrate and the second trace;
[0032] After irradiating the second photosensitive layer with the second preset light, the substrate of the wiring mold is separated from the second photosensitive layer.
[0033] Separate the second photosensitive adhesive layer from the first trace.
[0034] In one implementation of the fourth aspect, a plurality of first grooves are spaced apart on the surface of the first insulating layer facing the first trace; the second trace on the trace mold is aligned and bonded to the first photosensitive adhesive layer of the trace area of the substrate to obtain the first trace, including:
[0035] The second trace on the trace mold is aligned with the first groove; the first groove includes a first photosensitive adhesive layer;
[0036] The second trace is heated to form a molten conductive material located within the first groove;
[0037] The molten conductive material in the first groove is solidified to form a first trace; the first trace is bonded to the first photosensitive adhesive layer in the first groove.
[0038] In this embodiment, a first photosensitive adhesive layer is provided between the first insulating layer and the first trace. This is beneficial because the traces fabricated on the substrate do not need to be directly bonded to the first insulating layer of the substrate. It is also beneficial because the characteristics of the first photosensitive adhesive layer can be used to separate the first trace from the substrate when repair is required. This reduces the difficulty of separating the first trace from the substrate, improves the efficiency of repairing the first trace, reduces the risk of damaging the surface of the first insulating layer during repair, and improves the working stability of the substrate after trace repair. Attached Figure Description
[0039] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0040] Figure 1 A cross-sectional schematic diagram of a substrate provided in an embodiment of this application;
[0041] Figure 2 A cross-sectional schematic diagram of another substrate provided in an embodiment of this application;
[0042] Figure 3 A cross-sectional schematic diagram of another substrate provided in an embodiment of this application;
[0043] Figure 4 A cross-sectional schematic diagram of another substrate provided in an embodiment of this application;
[0044] Figure 5 This is a planar schematic diagram of a substrate provided in an embodiment of this application;
[0045] Figure 6 A cross-sectional schematic diagram of another substrate provided in an embodiment of this application;
[0046] Figure 7 A cross-sectional schematic diagram of another substrate provided in an embodiment of this application;
[0047] Figure 8 A plan view of yet another substrate provided in an embodiment of this application;
[0048] Figure 9 A schematic diagram of a display panel provided in an embodiment of this application;
[0049] Figure 10 A schematic diagram of a display device provided in an embodiment of this application;
[0050] Figure 11This is a flowchart illustrating a method for preparing a substrate, as provided in an embodiment of this application.
[0051] Figure 12 A flowchart illustrating another method for preparing a substrate provided in this application embodiment;
[0052] Figure 13 A flowchart illustrating another method for preparing a substrate provided in this application embodiment;
[0053] Figure 14 A flowchart illustrating another method for preparing a substrate provided in this application embodiment;
[0054] Figure 15 This is a schematic diagram illustrating the operation of removing the first conductive structure and the first photosensitive adhesive layer from the protrusion, as provided in an embodiment of this application.
[0055] Figure 16 A flowchart illustrating the fabrication process of yet another substrate provided in this application embodiment;
[0056] Figure 17 A cross-sectional schematic diagram of a wiring mold provided in an embodiment of this application;
[0057] Figure 18 A flowchart illustrating the fabrication process of yet another substrate provided in this application embodiment;
[0058] Figure 19 A flowchart illustrating the fabrication process of yet another substrate provided in this application embodiment;
[0059] Figure 20 This is a flowchart illustrating the fabrication process of another substrate provided in an embodiment of this application. Detailed Implementation
[0060] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0061] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.
[0062] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.
[0063] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.
[0064] In the description of this specification, it should be understood that the terms "substantially", "approximately", "about", "about", "generally", "largely" used in the claims and embodiments of this application refer to values that can be generally agreed upon within a reasonable range of process operations or tolerances, rather than a precise value.
[0065] It should be understood that although terms such as "first," "second," etc., may be used to describe insulating layers, traces, photosensitive adhesive layers, etc., in the embodiments of this application, these should not be limited to these terms. These terms are only used to distinguish insulating layers, traces, photosensitive adhesive layers, etc., from each other. For example, without departing from the scope of the embodiments of this application, the first insulating layer may also be referred to as the second insulating layer, and similarly, the second insulating layer may also be referred to as the first insulating layer. Through meticulous and in-depth research, the applicant of this application provides a solution to the problems existing in the prior art.
[0066] Both display panels and printed circuit boards include substrates, on which traces and components can be fabricated. This application uses the fabrication of traces on a substrate in a display panel as an example, and takes the traces as a metal material as an example. In the prior art, when fabricating traces on one side of a substrate, metal material is usually directly fabricated and solidified at the corresponding position on the substrate using methods such as deposition or laser engraving to form the traces. However, directly fabricating traces on the substrate results in direct contact between the trace material and the substrate, meaning the traces are adhered and fixed to the substrate. In this case, if some traces break or need to be replaced, it is not easy to separate the traces from the substrate because the traces are directly fixed to the substrate, making repair difficult. Especially for side traces on the substrate, a side trace area is usually reserved on one side of the substrate to fabricate traces for flexible circuit boards. One end of the flexible circuit board is electrically connected to the display area, and the other end is bent to the side of the backlight surface of the display panel and electrically connected to the printed circuit board. Since the traces on flexible circuit boards need to be bent, they are prone to bending cracks. Therefore, reducing the difficulty of repairing traces in the side trace area is of great significance to improving the efficiency of the repair work.
[0067] Figure 1 This is a cross-sectional schematic diagram of a substrate provided in an embodiment of this application.
[0068] This application provides a substrate 100, such as... Figure 1As shown, the substrate 100 includes a wiring region 10, which is the area on the substrate 100 where wiring is fabricated.
[0069] The wiring area 10 on the substrate 100 includes a first insulating layer L1. It should be noted that the first insulating layer L1 can be a single insulating film layer, or the first insulating layer L1 can be a composite film layer including a substrate, an inorganic insulating layer, and other film layers.
[0070] The wiring area 10 also includes a first wiring L2, which is located on the first insulating layer L1.
[0071] The wiring area 10 also includes a first photosensitive adhesive layer L3. The first insulating layer L1 and the first wiring L2 are separated by the first photosensitive adhesive layer L3, and the position of the first photosensitive adhesive layer L3 between the first insulating layer L1 and the first wiring L2 can form a separation. The first photosensitive adhesive layer L3 has an adhesive function, bonding the first wiring L2 to the first insulating layer L1. One of the two opposing surfaces of the first photosensitive adhesive layer L3 is bonded to the first insulating layer L1, and the other surface is bonded to the first wiring L2.
[0072] In this embodiment, the first photosensitive adhesive layer L3 exhibits reduced adhesion after receiving a first preset light irradiation G1. Optionally, the first photosensitive adhesive layer L1 comprises a photosensitive polymer. The first photosensitive adhesive layer L1 may also include a photosensitive anti-adhesion material, meaning that the first photosensitive adhesive layer L3 is an adhesive layer whose adhesion can be altered under light irradiation (typically ultraviolet light). In this application's technical solution, the reduced adhesion of the first photosensitive adhesive layer L3 after receiving the first preset light irradiation G1 at least allows the first photosensitive adhesive layer L3 to separate from the first insulating layer L1.
[0073] In this embodiment, a first photosensitive adhesive layer L3 is provided between the first insulating layer L1 and the first trace L2. This is beneficial because the trace L2 fabricated on the substrate 100 does not need to be directly bonded to the first insulating layer L1 of the substrate 100. It is also beneficial because the characteristics of the first photosensitive adhesive layer L3 can be used to separate the first trace L2 from the substrate 100 when repair is required. This reduces the difficulty of separating the first trace L2 from the substrate 100, improves the efficiency of repairing the first trace L2, and reduces the risk of damaging the surface of the first insulating layer L1 during repair, thereby improving the working stability of the substrate 100 after trace repair.
[0074] Figure 2 This is a cross-sectional schematic diagram of another substrate provided in an embodiment of this application.
[0075] In one embodiment of this application, such as Figure 2As shown, the surface of the first insulating layer L1 on the substrate 100 facing the first trace L2 includes a plurality of spaced first grooves L1A. A portion of the first insulating layer L1 is included between two adjacent first grooves L1A. Optionally, the shape of the first groove L1A located on the surface of the first insulating layer L1 facing the first trace L2 is the same as the shape of the first trace L2.
[0076] The first photosensitive adhesive layer L3 and the first trace L2 are located in the first groove L1A. Multiple first traces L2 are fabricated in the spaced-apart first grooves L1A, which helps to prevent short circuits between adjacent first traces L2. Furthermore, fabricating the first traces L2 within the first grooves L1A helps to fix the shape of the first traces L2, avoiding irregular shapes, protrusions, burrs, etc., thus improving the fabrication yield of the first traces L2.
[0077] In this embodiment, a first photosensitive adhesive layer L3 is also provided in the first groove L1A. The first photosensitive adhesive layer L3 is located between the inner wall of the first groove L1A and the first trace L2. This helps to reduce the area of the first trace L2 directly contacting the inner wall of the first groove L1A, thereby reducing the adhesion between the first trace L2 and the first groove L1A. This also helps to reduce the difficulty of separating the first trace L2 from the substrate 100 when repairing the first trace L2.
[0078] Figure 3 This is a cross-sectional schematic diagram of another substrate provided in an embodiment of this application.
[0079] In one embodiment of this application, such as Figure 3 As shown, the first groove L1A includes a first bottom surface L1A1. Within the first groove L1A1, a first photosensitive adhesive layer L3 is included between the first trace L2 and the first bottom surface L1A1. This helps to reduce the area of direct adhesion between the first trace L2 and the first bottom surface L1A1 of the first groove L1A, thereby reducing the risk of the first trace L2 damaging part of the material of the first bottom surface L1A1 of the first groove L1A when repairing the first trace L2. This also helps to reduce the risk of unevenness of the first bottom surface L1A1 of the first groove L1A when repairing the first trace L2.
[0080] Figure 4 This is a cross-sectional schematic diagram of another substrate provided in an embodiment of this application.
[0081] In one embodiment of this application, such as Figure 4As shown, the first groove L1A includes at least two first sidewalls L1A2 disposed opposite to each other. The at least two first sidewalls L1A2 disposed opposite to each other in the first groove L1A can be surfaces in a direction perpendicular to the surface of the substrate 100, so that the at least two first sidewalls L1A2 are also the surfaces of the spaced portions of two adjacent first grooves L1A.
[0082] Within the first groove L1A, a first photosensitive adhesive layer L3 is included between the first trace L2 and the first sidewall L1A2. This helps to reduce the area of direct adhesion between the first trace L2 and the two opposing first sidewalls L1A2 in the first groove L1A, thereby reducing the risk of the first trace damaging part of the material of the first sidewall L1A2 of the first groove L1A when repairing the first trace L2. This also helps to reduce the risk of unevenness of the first sidewall L1A2 when repairing the first trace L2. In addition, it also helps to avoid damage to the first sidewall L1A2 when repairing the first trace L2, which would cause damage to the gap between two adjacent first grooves L1A, thereby reducing the risk of short circuits in the first traces L2 within two adjacent first grooves L1A.
[0083] Figure 5 This is a planar schematic diagram of a substrate provided in an embodiment of this application.
[0084] In one embodiment of this application, such as Figure 5 As shown, the first trace L2 is a transparent and conductive structure.
[0085] In this embodiment, the first trace L2 is designed to be transparent and conductive, which helps the first preset light G1 to more easily irradiate the first photosensitive adhesive layer L3 located between the first trace L2 and the first insulating layer L1; it also helps to improve the efficiency of the first preset light G1 in applying the first photosensitive adhesive layer L3 to reduce its adhesion, and further reduces the difficulty of repairing the first trace L2.
[0086] Figure 6 This is a cross-sectional schematic diagram of another substrate provided in an embodiment of this application.
[0087] In one embodiment of this application, such as Figure 6As shown, the first trace L2 includes a first sub-trace L2A and a second sub-trace L2B that are electrically connected. The first sub-trace L2A and the second sub-trace L2B are located on opposite sides of the first insulating layer L1, respectively. In a direction perpendicular to the plane of the substrate 100, the first insulating layer L1 includes opposite sides. For example, in a display panel, the first insulating layer L1 includes a side facing the light-emitting surface of the display panel and a side facing the backlight surface of the display panel. The display panel includes a flexible circuit board, and the traces on the flexible circuit board need to be folded from the light-emitting surface side of the display panel to the backlight surface side of the display panel. In the technical solution of this application, the first trace L2 located on one side of the first insulating layer L1 includes a first sub-trace L2A and a second sub-trace L2B. Optionally, as shown... Figure 6 As shown, the first sub-trace L2A and the second sub-trace L2B are electrically connected on the side of the first insulating layer L1. That is, a trace is also fabricated on the side of the first insulating layer L1, with one end of the trace electrically connected to the first sub-trace L2A and the other end electrically connected to the second sub-trace L2B.
[0088] The first photosensitive adhesive layer L3 includes a first portion L3A and a second portion L3B. The first portion L3A is bonded to the first sub-trace L2A and the first insulating layer L2, and the second portion L3B is bonded to the second sub-trace L2B and the first insulating layer L1. Preparing the first photosensitive adhesive layer L3 on the side of the first sub-trace L2A closest to the first insulating layer L1, and on the side of the second sub-trace L2B closest to the first insulating layer L1, helps to reduce the adhesion between the first sub-trace L2A and the second sub-trace L2B located on opposite sides of the first insulating layer L1 and the first insulating layer L1. This reduces the difficulty of separating the traces from the substrate 100 during the repair of traces located on opposite sides of the first insulating layer L1.
[0089] In this embodiment, the first sub-trace L2A and the second sub-trace L2B are at least partially overlapped along a direction perpendicular to the plane of the substrate 100. That is, the projection of the first sub-trace L2A onto the first insulating layer L1 and the projection of the second sub-trace L2B onto the first insulating layer L1 at least partially coincide. This helps to make the positions of the first sub-trace L2A and the second sub-trace L2B more regular and reduces the fabrication difficulty of the first sub-trace L2. It should be noted that setting the first preset illumination G1 at this time can still reduce the adhesion of the first portion L3A or the second portion L3B of the first photosensitive adhesive layer L3, allowing the first sub-trace L2A or the second sub-trace L2B to separate from the substrate 100.
[0090] Optionally, the intensity of the first preset light G1 applied to the first portion L3A of the first photosensitive adhesive layer L3 is different from the intensity of the first preset light G1 applied to the second portion L3B of the first photosensitive adhesive layer L3.
[0091] Figure 7 This is a cross-sectional schematic diagram of another substrate provided in an embodiment of this application.
[0092] In one embodiment of this application, such as Figure 7 As shown, the first trace L2 includes a first sub-trace L2A and a second sub-trace L2B that are electrically connected. The first sub-trace L2A and the second sub-trace L2B are located on opposite sides of the first insulating layer L1, respectively. In a direction perpendicular to the plane of the substrate 100, the first insulating layer L1 includes opposite sides. For example, in a display panel, the first insulating layer L1 includes a side facing the light-emitting surface of the display panel and a side facing the backlight surface of the display panel. The display panel includes a flexible circuit board, and the traces on the flexible circuit board need to be folded from the light-emitting surface side of the display panel to the backlight surface side of the display panel. In the technical solution of this application, the first trace L2 located on one side of the first insulating layer L1 includes a first sub-trace L2A and a second sub-trace L2B. Optionally, as shown... Figure 6 As shown, the first sub-trace L2A and the second sub-trace L2B are electrically connected on the side of the first insulating layer L1. That is, a trace is also fabricated on the side of the first insulating layer L1, with one end of the trace electrically connected to the first sub-trace L2A and the other end electrically connected to the second sub-trace L2B.
[0093] The first photosensitive adhesive layer L3 includes a first portion L3A and a second portion L3B. The first portion L3A is bonded to the first sub-trace L2A and the first insulating layer L1, and the second portion L3B is bonded to the second sub-trace L2A and the first insulating layer L1. Preparing the first photosensitive adhesive layer L3 on the side of the first sub-trace L2A closest to the first insulating layer L1, and on the side of the second sub-trace L2B closest to the first insulating layer L1, helps to reduce the area of direct bonding between the first sub-trace L2A and the second sub-trace L2B located on opposite sides of the first insulating layer L1 and the first insulating layer L1, thereby reducing the difficulty of repairing the traces located on opposite sides of the first insulating layer L1.
[0094] In this embodiment, along the direction perpendicular to the plane of the substrate 100, the first sub-trace L2A and the second sub-trace L2B at least partially do not overlap. That is, the projection of the first sub-trace L2A onto the first insulating layer L1 and the projection of the second sub-trace L2B onto the first insulating layer L1 at least partially do not coincide. Optionally, the first insulating layer L1 includes a light-transmitting insulating material, so that when irradiating the first portion L3A of the first photosensitive adhesive layer L3, a first preset illumination G1 can be applied from one side of the second sub-trace L2B to the first portion L3A; when irradiating the second portion L3B of the first photosensitive adhesive layer L3, the first preset illumination G1 can be applied from one side of the first sub-trace L2A to the second portion L3B. This helps to reduce the difficulty of applying the first preset illumination G1 to the first photosensitive adhesive layer L3 to reduce its adhesion.
[0095] Optionally, the intensity of the first preset light G1 applied to the first portion L3A of the first photosensitive adhesive layer L3 is different from the intensity of the first preset light G1 applied to the second portion L3B of the first photosensitive adhesive layer L3.
[0096] Figure 8 This is a planar schematic diagram of another substrate provided in an embodiment of this application.
[0097] In one embodiment of this application, such as Figure 8 As shown, the substrate 100 also includes a display area 20, and a wiring area 10 is located on at least one side of the display area 20. The display area 20 includes a plurality of transistors M1 and a light-emitting device OLED.
[0098] Display area 20 can be used to prepare light-emitting elements for displaying images; wiring area 10 is located on at least one side of display area 2, and optionally, wiring area 10 is a flexible circuit board wiring preparation area.
[0099] Figure 9 This is a schematic diagram of a display panel provided in an embodiment of this application.
[0100] This application provides a display panel 200, such as... Figure 9 As shown, the display panel 200 includes a substrate 100 as provided in the above embodiments.
[0101] In the display panel 200, a first photosensitive adhesive layer L3 is provided between the first insulating layer L1 and the first trace L2. This is beneficial because the trace L2 fabricated on the substrate 100 does not need to be directly bonded to the first insulating layer L1 of the substrate 100. It is also beneficial because the characteristics of the first photosensitive adhesive layer L3 can be used to separate the first trace L2 from the substrate 100 when repair is required. This reduces the difficulty of separating the first trace L2 from the substrate 100, improves the efficiency of repairing the first trace L2, and reduces the risk of damaging the surface of the first insulating layer L1 during repair. This also improves the working stability of the substrate 100 after trace repair.
[0102] Figure 10 This is a schematic diagram of a display device provided in an embodiment of this application.
[0103] This application provides a display device 300, such as... Figure 10 As shown, the display device 300 includes the display panel 200 as provided in the above embodiment. The display device 300 can be a display device such as a mobile phone, television, or computer.
[0104] The inclusion of a first photosensitive adhesive layer L3 between the first insulating layer L1 and the first trace L2 facilitates the separation of the trace L2 from the substrate 100, allowing it to be separated from the substrate 100 without direct bonding. It also allows the use of the properties of the first photosensitive adhesive layer L3 to separate the first trace L2 from the substrate 100 during repairs. This reduces the difficulty of separating the first trace L2 from the substrate 100, improves the efficiency of repairing the first trace L2, reduces the risk of damaging the surface of the first insulating layer L1 during repairs, and enhances the operational stability of the substrate 100 after trace repair work.
[0105] Figure 11 This is a flowchart illustrating a method for preparing a substrate according to an embodiment of this application.
[0106] This application provides a method for preparing a substrate, such as... Figure 11 As shown, this is used to prepare the substrate 100 provided in the above embodiment. Combined with... Figure 1 As shown, the substrate 100 includes a wiring region 10, in which wiring is fabricated.
[0107] The method for preparing substrate 100 includes:
[0108] S1: A first photosensitive adhesive layer L3 is prepared on at least one side of the first insulating layer L1 included in the wiring area 10;
[0109] A first photosensitive adhesive layer L3 is prepared on opposite sides of the first insulating layer L1 in a direction perpendicular to the surface of the substrate 100, such that the side of the first photosensitive adhesive layer L3 closest to the first insulating layer L1 is bonded to the first insulating layer L3.
[0110] S2: A first trace L2 is prepared on the side of the first photosensitive adhesive layer L3 away from the first insulating layer L1, such that the first trace L2 and the first insulating layer L1 include the first photosensitive adhesive layer L3, and the side of the first photosensitive adhesive layer L3 close to the first trace L2 is bonded to the first trace L2.
[0111] Optionally, the material for preparing the first trace L2 is deposited on the first photosensitive adhesive layer L3 and cured to form the first trace L2.
[0112] Figure 12 This is a flowchart illustrating another method for preparing a substrate provided in this application embodiment.
[0113] In one embodiment of this application, combined with Figure 2 and Figure 12 As shown, the method for preparing substrate 100 further includes:
[0114] S3: A plurality of first grooves L1A are provided at intervals on the surface of the first insulating layer L1 facing the first trace L2.
[0115] Optionally, the step of forming a plurality of spaced first grooves L1A on the surface of the first insulating layer L1 facing the first trace L2 is performed before the step of preparing the first photosensitive adhesive layer L3 on at least one side of the first insulating layer L1 included in the trace area 10. This allows the plurality of first grooves L1A to be formed on the first insulating layer L1 in preparation for preparing the first trace L2 within the first grooves L1A.
[0116] The preparation of spaced first grooves L1A on the surface of the first insulating layer L1 helps to make the shape of the first trace L2 more regular, and helps to avoid short circuits between adjacent first traces L2. It also helps to prevent the first trace L2 from protruding too much from the plane where the first insulating layer L1 is located, and prevents the first trace L2 from protruding too much from the first insulating layer L1 and increasing the overall thickness of the substrate 100.
[0117] like Figure 2 As shown, a protrusion L1B is included between two adjacent first grooves L1A, that is, the two adjacent first grooves L1A are spaced apart. The protrusion L1B between the two adjacent first grooves L1A can be used to avoid short circuit of the first trace L2 in the two adjacent first grooves L1A.
[0118] Figure 13 This is a flowchart illustrating another method for preparing a substrate provided in this application embodiment.
[0119] In one embodiment of this application, combined with Figures 2-4 , Figure 13 As shown, the first groove L1A includes a first bottom surface L1A1, and the first groove L1A also includes at least two opposing first sidewalls L1A2.
[0120] Preparing a first photosensitive adhesive layer L3 on at least one side of the first insulating layer L1 included in the wiring area 10 includes:
[0121] S11: Prepare a first photosensitive adhesive layer L3 on the first bottom surface L1A1 and the first sidewall L1A2.
[0122] A first photosensitive adhesive layer L3 is applied to the first bottom surface L1A1 and the first sidewall L1A2 in the first groove L1A. The side of the first photosensitive adhesive layer L3 closest to the first groove L1A is bonded to the first bottom surface L1A1 and the first sidewall L1A2 respectively.
[0123] Figure 14 This is a flowchart illustrating another method for preparing a substrate according to an embodiment of this application. Figure 15 This is a schematic diagram illustrating the operation of removing the first conductive structure and the first photosensitive adhesive layer from a protrusion, as provided in an embodiment of this application.
[0124] In one embodiment of this application, combined with Figure 14 , Figure 15 As shown, fabricating the first trace L2 on the side of the first photosensitive adhesive layer L3 away from the first insulating layer L1 includes:
[0125] S21: A first conductive structure L21 is prepared on the first photosensitive adhesive layer L3. The first conductive structure L21 includes a portion located in the first groove L1A and a portion located on the protrusion L1B.
[0126] Optionally, the first conductive structure L21 is made of the same material as the first trace L2. When coating the first photosensitive adhesive L3, the first photosensitive adhesive layer L3 is coated on one side of the first insulating layer L1, that is, the first photosensitive adhesive layer L3 is also included on the protrusion L1B between two adjacent first grooves L1A on the first insulating layer L1.
[0127] When preparing the first trace L2, the first conductive structure L21 is deposited on the side of the first photosensitive adhesive layer L3 away from the first insulating layer L1. That is, the first conductive structure L21 exists both in the portion deposited in the first groove L1A and in the portion deposited on the side of the protrusion L1B away from the first photosensitive adhesive layer L3.
[0128] S22: After irradiating the first photosensitive adhesive layer L3 on the protrusion L1B with the first preset light G1, the first conductive structure L21 and the first photosensitive adhesive layer L3 on the protrusion L1B are bonded and removed with an adhesive film to prepare the first trace L2.
[0129] Because the first conductive structure L21 is deposited on the side of the first photosensitive adhesive layer L3 away from the first insulating layer L1 using a whole-surface preparation method, and a portion of the first conductive structure L21 in the first groove L1A is cured to form the first trace L2, the portion of the first conductive structure L21 located on the protrusion L1B exists at the portion of the first conductive structure L21 connected in the first groove L1A. After irradiating the first photosensitive adhesive layer L3 on the protrusion L1B with the first preset illumination G1, the adhesion of the first photosensitive adhesive layer L3 on the protrusion L1B decreases and it separates from the protrusion L1B. This allows the first conductive structure L21 on the protrusion L1B to separate together with the protrusion L1B. This helps to prevent the first trace L2 in the adjacent first groove L1A from being electrically connected due to the first conductive structure L21 on the protrusion L1B, and it also helps to avoid increasing the overall thickness of the substrate 100 because the protrusion L21 includes the first photosensitive adhesive layer L3 and the first conductive structure L21.
[0130] Figure 16 This is a flowchart illustrating the fabrication process of another substrate provided in an embodiment of this application. Figure 17 This is a cross-sectional schematic diagram of a wiring mold provided in an embodiment of this application. Figure 18 This is a flowchart illustrating the fabrication process of another substrate provided in an embodiment of this application.
[0131] In one embodiment of this application, such as Figure 16 As shown, fabricating the first trace L2 on the side of the first photosensitive adhesive layer L3 away from the first insulating layer L1 includes:
[0132] S2A: Align and bond the second trace L4 on the trace mold 400 with the first photosensitive adhesive layer L3 in the trace area 10 of the substrate 100 to obtain the first trace L2; the trace mold 400 includes a substrate L5, a second photosensitive adhesive layer L6 and a second trace L4, the second photosensitive adhesive layer L6 is located between the substrate L5 and the second trace L4 and bonds the substrate L5 and the second trace L4.
[0133] S2B: After irradiating the second photosensitive adhesive layer L6 with the second preset light G2, the substrate L5 of the wiring mold 400 is separated from the second photosensitive adhesive layer L6.
[0134] S2C: Separate the second photosensitive adhesive layer L6 from the first trace L2.
[0135] A second trace L4 is fabricated on the wiring die 400 and placed on one side of the substrate L5. In the prior art, full-surface deposition is typically used when fabricating traces on a substrate. However, when fabricating traces using metal deposition, the material utilization rate is low, only about one-third, and the substrate surface is prone to unevenness due to the impact of the bombardment material during the deposition process. Therefore, fabricating the second trace L4 first on the wiring die 400 and then transferring it to the wiring area 10 of the substrate 100 improves the material utilization rate during trace fabrication and reduces the risk of damaging the substrate 100 surface due to direct trace fabrication.
[0136] Combination Figure 18 As shown, a second photosensitive adhesive layer L6 is first prepared on one side of the substrate L5 of the wiring mold 400, and a second wiring L4 is prepared on the first side of the second photosensitive adhesive layer L6 away from the substrate L5. Optionally, the shape of the second wiring L4 is the same as the shape of the first wiring L2.
[0137] Align one side of the wiring mold 400, including the second wiring L4, with the portion of the wiring area 10 on the substrate 100 including the first photosensitive adhesive layer L3, and then bond the second wiring L4 to the side of the first photosensitive adhesive layer L3 away from the first insulating layer L1. At this time, the second wiring L4 bonded between the substrate 100 and the wiring mold 400 is transformed into the first wiring L2. The portion of the wiring area 10 on the substrate 100 including the first photosensitive adhesive layer L3 is the location where the first wiring L2 needs to be formed.
[0138] Applying a second preset light G2 to one side of the wiring mold 400 to the second photosensitive adhesive layer L6 reduces the adhesion of the second photosensitive adhesive layer L6, which helps to make the adhesion of the second photosensitive adhesive layer L6 to the side of the wiring mold 400 lower, thereby allowing the wiring mold 400 to be easily separated from part of the second photosensitive adhesive layer L6.
[0139] The first trace L2 is bonded and fixed to the first photosensitive adhesive layer L3 on the side closest to the first insulating layer L1. There may be a residual portion of the second photosensitive adhesive layer L6 on the side of the first trace L2 away from the first insulating layer L1. Optionally, a stripping solution SP can be used to peel the residual second photosensitive adhesive layer L6 off the first trace L2.
[0140] Figure 19 This is a flowchart illustrating the fabrication process of another substrate provided in an embodiment of this application. Figure 20 This is a flowchart illustrating the fabrication process of another substrate provided in an embodiment of this application.
[0141] In one embodiment of this application, combined with Figure 19 , Figure 20 As shown, a plurality of first grooves L1A are spaced apart on the surface of the first insulating layer L1 facing the first trace L2; the second trace L4 on the trace mold 400 is aligned and bonded to the first photosensitive adhesive layer L3 of the trace area 10 of the substrate 100 to obtain the first trace L2, which includes:
[0142] S2D: Align the second trace L4 on the trace mold 400 with the first groove L1A; the first groove L1A includes the first photosensitive adhesive layer L3;
[0143] S2E: Heating the second trace L4 forms a molten conductive material located in the first groove L1A;
[0144] S2F: The molten conductive material in the first groove L1A is solidified to form the first trace L2; the first trace L2 is bonded to the first photosensitive adhesive layer L3 in the first groove L1A.
[0145] Combination Figure 20 As shown, a second trace L4 is first fabricated on one side of the substrate L5 of the trace mold 400. Optionally, the shape of the second trace L4 is the same as the shape of the first trace L2.
[0146] Align one side of the wiring mold 400 including the second wiring L4 with the portion of the wiring area 10 on the substrate 100 including the first photosensitive adhesive layer L3, that is, align the second wiring L4 with the position of the first groove L1A on the substrate 100 where the first wiring L2 is formed.
[0147] The second trace L4 is heated on one side of the trace mold 400 to become a molten conductive material, and the molten conductive material formed by heating the second trace L4 flows into the corresponding first groove L1A.
[0148] The conductive material molten in the first groove L1A is solidified to form the first trace L2, and a first photosensitive adhesive layer L3 is pre-prepared in the first groove L1A. At this time, the side of the first trace L2 closest to the first insulating layer L1 is bonded to the first photosensitive adhesive layer L3.
[0149] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.
Claims
1. A substrate, characterized in that, Includes a routing area, wherein the routing area includes: First insulating layer; A first trace is located on the first insulating layer; the surface of the first insulating layer facing the first trace includes a plurality of spaced first grooves. A first photosensitive adhesive layer is included between the first insulating layer and the first trace, and the first photosensitive adhesive layer bonds the first trace and the first insulating layer. A first groove, the first groove including a first bottom surface and at least two first sidewalls disposed opposite each other, the first photosensitive adhesive layer and the first trace being located in the first groove; The first photosensitive adhesive layer becomes less viscous after receiving a first preset light irradiation; within the first groove, the first photosensitive adhesive layer is included between the first trace and the first bottom surface, and the first photosensitive adhesive layer is also included between the first trace and the first sidewall.
2. The substrate according to claim 1, characterized in that, The first trace is a light-transmitting and conductive structure.
3. The substrate according to claim 2, characterized in that, The first trace includes a first sub-trace and a second sub-trace that are electrically connected, and the first sub-trace and the second sub-trace are respectively located on opposite sides of the first insulating layer; the first photosensitive adhesive layer includes a first part and a second part, the first part is bonded to the first sub-trace and the first insulating layer, and the second part is bonded to the second sub-trace and the first insulating layer. Along a direction perpendicular to the plane of the substrate, the first sub-trace and the second sub-trace at least partially overlap.
4. The substrate according to claim 1, characterized in that, The first trace includes a first sub-trace and a second sub-trace that are electrically connected, and the first sub-trace and the second sub-trace are respectively located on opposite sides of the first insulating layer; the first photosensitive adhesive layer includes a first part and a second part, the first part is bonded to the first sub-trace and the first insulating layer, and the second part is bonded to the second sub-trace and the first insulating layer. Along a direction perpendicular to the plane of the substrate, the first sub-trace and the second sub-trace do not overlap at least partially.
5. The substrate according to claim 1, characterized in that, The substrate further includes a display area, and the wiring area is located on at least one side of the display area; the display area includes a plurality of transistors and light-emitting devices.
6. A display panel, characterized in that, Includes the substrate as described in any one of claims 1-5.
7. A display device, characterized in that, Includes the display panel as described in claim 6.
8. A method for preparing a substrate, characterized in that, Used to prepare a substrate as described in any one of claims 1-5; The substrate includes a wiring region; the fabrication method includes: A first photosensitive adhesive layer is prepared on at least one side of the first insulating layer included in the wiring area; A first trace is prepared on the side of the first photosensitive adhesive layer away from the first insulating layer.
9. The preparation method according to claim 8, characterized in that, The preparation method further includes: A plurality of first grooves are formed at intervals on the surface of the first insulating layer facing the first trace; a protrusion is included between two adjacent first grooves.
10. The preparation method according to claim 9, characterized in that, The first groove includes a first bottom surface, and the first groove also includes at least two opposing first sidewalls; the preparation of a first photosensitive adhesive layer on at least one side of the first insulating layer included in the wiring area includes: The first photosensitive adhesive layer is prepared on the first bottom surface and the first sidewall.
11. The preparation method according to claim 10, characterized in that, The step of fabricating a first trace on the side of the first photosensitive adhesive layer away from the first insulating layer includes: A first conductive structure is prepared on the first photosensitive adhesive layer, the first conductive structure including a portion located in the first groove and a portion located on the protrusion; After irradiating the first photosensitive adhesive layer on the protrusion with the first preset light, the first conductive structure and the first photosensitive adhesive layer on the protrusion are bonded and removed with an adhesive film to prepare the first trace.
12. The preparation method according to claim 8, characterized in that, The step of fabricating a first trace on the side of the first photosensitive adhesive layer away from the first insulating layer includes: The first trace is obtained by aligning and bonding the second trace on the trace mold with the first photosensitive adhesive layer in the trace area of the substrate; the trace mold includes a substrate, a second photosensitive adhesive layer and a second trace, wherein the second photosensitive adhesive layer is located between the substrate and the second trace and bonds the substrate and the second trace. After irradiating the second photosensitive adhesive layer with the second preset light, the substrate of the wiring mold is separated from the second photosensitive adhesive layer; Separate the second photosensitive adhesive layer from the first trace.
13. The preparation method according to claim 12, characterized in that, The first insulating layer has a plurality of spaced first grooves on its surface facing the first trace; the step of aligning and bonding the second trace on the trace mold with the first photosensitive adhesive layer in the trace area of the substrate to obtain the first trace includes: Align the second trace on the trace mold with the first groove; the first groove includes the first photosensitive adhesive layer; The second trace is heated to form a molten conductive material located within the first groove; The molten conductive material in the first groove is solidified to form a first trace; the first trace is bonded to the first photosensitive adhesive layer in the first groove.
Citation Information
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